Indium phosphide grinding device and indium phosphide

Abstract

The invention belongs to the technical field of indium phosphide semiconductors, and discloses an indium phosphide grinding device and indium phosphide, the indium phosphide grinding device comprises a machine base, a grinding part is arranged on the machine base, the grinding part comprises a piston cylinder, the piston cylinder is specifically composed of two cylinder bodies, the outer wall of the top end of the upper half cylinder body is fixedly connected with a device containing disc, and the outer wall of the top end of the lower half cylinder body is fixedly connected with the device containing disc. The inner wall of the device placing disc is specifically made of a natural rubber material, and indium phosphide devices can be discontinuously and tightly clamped in the inner wall of the device placing disc; the grinding surfaces with different diameter densities are adopted at the two ends of the grinding plate, 180-degree rotary switching is achieved through the rotary switching structure, multi-stage progressive grinding can be conducted, deep scratches on the indium phosphide device are reduced, the quality of the grinding surfaces is improved, the conduction assembly drives the grinding plate to do reciprocating translation, additional start-stop operation is not needed, the continuity of the grinding process is guaranteed, and the grinding efficiency is improved. And the negative pressure structure can be used for collecting and filtering the grinding fluid and then reusing the grinding fluid, so that the waste of the grinding fluid is reduced.

Description

Technical Field

[0001] This invention belongs to the field of indium phosphide semiconductor technology, specifically an indium phosphide grinding device and indium phosphide. Background Technology

[0002] Indium phosphide (InP) is an important III-V compound semiconductor material with high electron mobility (approximately 4600 cm² / V·s), a direct bandgap (1.34 eV), and excellent radiation resistance. It is widely used in optical communications, high-frequency devices, and aerospace applications. Its bandgap is moderate (1.35 eV), and its electron saturation drift velocity reaches 2.5 × 10⁻⁶. 7 With a speed of cm / s, it is suitable for manufacturing high-speed photodetectors, lasers and other devices. It has a radiation dose resistance one order of magnitude higher than gallium arsenide and can automatically anneal to restore its electrical properties during operation, making it a core material for optical fiber communication. In the grinding process of indium phosphide semiconductor devices, the coarse grinding stage generally uses large-particle abrasives (5-10μm), which easily leads to surface scratches. Subsequent fine polishing is required for repair, which increases the complexity of the process. In addition, although the high grinding pressure (>0.3MPa) in the existing technology improves the material removal rate, it is easy to cause thermal damage to the workpiece and wear of the grinding wheel. Summary of the Invention

[0003] To address the problems mentioned in the background art, the present invention provides an indium phosphide grinding apparatus.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an indium phosphide grinding device and indium phosphide, comprising a base, a grinding section on the base, a piston cylinder comprising a piston cylinder comprising two sections, a device plate fixedly connected to the outer wall of the top of the upper section, the inner wall of the device plate being made of natural rubber, an indium phosphide device being intermittently and tightly engaged in the inner wall of the device plate, a grinding plate being intermittently and slidably connected to the top of the indium phosphide device, the two ends of the grinding plate being composed of two grinding surfaces of different diameter densities, and the grinding plate being provided with a rotation switching structure for rotating the grinding plate 180 degrees to switch grinding surfaces; A negative pressure structure is provided between the piston cylinder and the machine base to collect and reuse the grinding fluid used in the grinding process. A transmission component is provided above the rotary switching structure and the negative pressure structure to synchronously drive the rotary switching structure and the grinding plate to move horizontally.

[0005] Preferably, the rotary switching structure includes a support plate frame fixedly connected to the transmission component. Each of the two plates of the support plate frame is fixedly connected to a guardrail frame. An ear plate is fixedly connected to the top outer wall of one of the guardrail frames. A motor is fixedly connected to one end of the ear plate. A double-ring sleeve rod is fixedly connected to the shaft of the motor.

[0006] Preferably, a shaft is movably sleeved through the other side of the double-ringed rod, and the shaft body is fixedly connected to one end sidewall of the grinding plate. T-shaped groove plates are also fixedly connected to the top sidewalls of the two railing frames. The T-shaped groove plate installed on one of the railing frames is specifically composed of two groove plates. The upper half of the groove plate has brackets fixedly connected to the outer walls at both ends, and the lower half of the groove plate has grooves on both sides of the plate.

[0007] Preferably, the bottom outer walls of both brackets are fixedly connected to the top of the lower half of the groove plate of the railing frame, and the shaft can be intermittently fitted and connected to the inner walls of the two grooves.

[0008] Preferably, an arc-shaped sliding groove is provided at the center of another T-shaped groove plate, and a square frame rod is fixedly connected to the center of the grinding plate. The two end blocks of the square frame rod are respectively fitted and slidably connected to the inner walls of the two T-shaped groove plates, and the two square blocks of the square frame rod are movably connected to the middle rod.

[0009] Preferably, the negative pressure structure includes a piston rod fixedly connected to the upper half of the piston cylinder, the piston rod also being slidably connected to the inner wall of the lower half of the piston cylinder, a spring being fixedly connected between the two sections of the piston cylinder, a plurality of guide rods being fixedly connected in a circumferential manner to the outer wall of the upper half of the piston cylinder, and a set of guide blocks being fixedly connected in a circumferential manner to the outer wall of the lower half of the piston cylinder, the set of guide blocks being able to slide through and connect with each of the guide rods.

[0010] Preferably, a cone is fixedly connected to the top outer wall of the machine base, a filter screen is fixedly connected to the lower half of the piston cylinder, and the bottom end of the filter screen is fixedly connected to the top outer wall of the machine base. A soft bristle plate is slidably connected to the filter screen, and multiple springs are fixedly connected between the bottom outer wall of the soft bristle plate and the top outer wall of the machine base.

[0011] Preferably, an angled guide plate is fixedly connected to one end of the filter screen plate, a liquid guide pipe is fixedly connected to the other end of the angled guide plate, a liquid hopper is fixedly connected to the other end of the liquid guide pipe, the outer wall of the liquid hopper is fixedly connected to the conductive assembly, an infusion pipe is fixedly connected to the bottom of the liquid hopper, the other end of the infusion pipe is fixedly connected to one end of the block frame rod, and the pipe body of the infusion pipe is also slidably connected to the inner wall of the arc-shaped sliding groove.

[0012] Preferably, a spray plate is fixedly connected between one side of the tube of the square frame rod and the plate of the grinding plate. An arc groove is opened through the connection between the spray plate and the rod of the square frame rod. The rod of the infusion tube is specifically composed of two sections of different materials. One section of the tube used to connect with the square frame rod is a flexible tube, while the other section is a rigid tube. Squeezing plates are slidably connected to the outer walls of the upper and lower ends of the flexible tube. A ball rod is movably connected between the two squeezing plates. Both of the two extrusion plates are intermittently fitted and slidably connected with inclined panel blocks, which are also fixedly connected to another T-shaped groove plate.

[0013] The present invention also provides indium phosphide, comprising the indium phosphide according to any one of claims 1-9.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention utilizes grinding surfaces of different diameters and densities at both ends of the grinding plate, achieving 180-degree rotation switching via a rotating switching structure. This enables multi-stage progressive grinding, reducing deep scratches on indium phosphide devices and improving the surface quality of the ground surface. The transmission component drives the grinding plate to reciprocate horizontally, while simultaneously achieving automatic spraying of the grinding slurry without additional start-stop operations, ensuring the continuity of the grinding process and improving processing efficiency. The negative pressure structure can collect, filter, and reuse the grinding slurry, reducing waste and lowering production costs, in line with energy conservation and environmental protection principles. The interconnected structures, such as the transmission component synchronously driving the rotating switching structure and the horizontal movement of the grinding plate, and the grinding plate flipping to activate the negative pressure structure, ensure coordinated and efficient operation of the entire device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall planar structure of the present invention; Figure 3 This is a partial cross-sectional structural diagram of the piston cylinder and filter screen of the present invention; Figure 4 This is a partial structural diagram of the grinding part of the present invention (one of the diagrams). Figure 5This is a partial structural diagram of the grinding part of the present invention (second part); Figure 6 For the present invention Figure 5 A magnified view of the structure at point A in the middle; Figure 7 This is a schematic diagram of the overall structure of the grinding plate of the present invention; Figure 8 For the present invention Figure 7 A magnified schematic diagram of the structure at point B in the middle; Figure 9 This is a partial cross-sectional planar structural diagram of the piston cylinder and filter screen of the present invention; Figure 10 This is a schematic diagram of the overall structure of the liquid hopper of the present invention.

[0016] In the picture: 1. Base of the machine; 2. Grinding section; 201. Piston cylinder; 202. Placer plate; 203. Indium phosphide device; 204. Support plate frame; 205. Parapet plate frame; 206. Ear plate; 207. Motor; 208. Double ring sleeve rod; 209. Shaft rod; 210. Grinding plate; 211. T-shaped groove plate; 212. Groove; 213. Bracket; 214. Arc-angle slide groove; 215. Square frame rod; 216. Piston rod; 217. Spring one; 218. Guide rod; 219. Cone; 220. Filter screen plate; 221. Soft bristle plate; 222. Spring two; 223. Angled guide plate; 224. Liquid guide tube; 225. Liquid hopper; 226. Infusion tube; 227. Spray plate; 228. Extrusion plate; 229. Ball rod; 230. Angled plate block; 3. Conductive components. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] like Figures 1 to 10As shown, the present invention provides an indium phosphide grinding device, including a base 1, a grinding section 2 on the base 1, and a piston cylinder 201 in the grinding section 2. The piston cylinder 201 is specifically composed of two sections of cylinder. A device plate 202 is fixedly connected to the outer wall of the top end of the upper section of cylinder. The inner wall of the device plate 202 is specifically made of natural rubber. An indium phosphide device 203 can be intermittently and tightly engaged in the inner wall of the device plate 202. A grinding plate 210 can be intermittently and slidably connected to the top end of the indium phosphide device 203. The two ends of the grinding plate 210 are respectively composed of two grinding surfaces with different diameter densities. The grinding plate 210 is provided with a rotation switching structure for rotating the grinding plate 210 180 degrees to switch the grinding surfaces. A negative pressure structure is provided between the piston cylinder 201 and the base 1 to collect and reuse the grinding fluid used in the grinding process. A transmission component 3 is provided above the rotary switching structure and the negative pressure structure to synchronously drive the rotary switching structure and the grinding plate 210 to move horizontally.

[0019] Using the above scheme: the transmission component 3 drives the support frame 204 in the grinding section 2 to move. The passively moving support frame 204 directly drives the two fixed railing frames 205 to move synchronously. This causes the grinding plate 210, which is installed between the two railing frames 205, to repeatedly contact the surface of the indium phosphide device 203 through reciprocating translation, thus grinding it. As mentioned above, the passive translation of the two railing frames 205 synchronously drives the translation of two T-shaped slot plates 211. The movement of one of the T-shaped slot plates 211 drives the connected inclined plate block 230 to move synchronously, thus reciprocating... The repeated sliding of the material against the two extrusion plates 228 causes the two extrusion plates 228 to tilt on the ball rod 229, creating an acute angle shape. This allows the soft material infusion tube 226 in the middle to be extruded. When the grinding liquid that has been naturally fed through the liquid hopper 225 is suddenly compressed, the liquid can passively generate a sudden impact force. Then, it is sprayed directly from the spray plate 227 through the arc groove, spraying the grinding liquid onto the indium phosphide device 203 and the grinding plate 210. This cools down the physical frictional heat and particulate matter generated on both devices, preventing thermal damage to the device and wear of the grinding wheel. The motor 207 installed on the starter plate 206 reciprocates to drive the double-ring sleeve rod 208 to rotate, thereby driving the shaft rod 209 connected to it to rotate synchronously by 180 degrees. The grinding plate 210 installed on the shaft rod 209 also rotates synchronously by 180 degrees, thus switching the grinding effect.

[0020] The rotary switching structure includes a support frame 204 fixedly connected to the transmission component 3. Each of the two sections of the support frame 204 has a guardrail frame 205 fixedly connected to it. An ear plate 206 is fixedly connected to the top outer wall of one guardrail frame 205. A motor 207 is fixedly connected to one end of the ear plate 206. A double-ringed sleeve rod 208 is fixedly connected to the shaft of the motor 207. A shaft rod 209 is movably sleeved through the other side of the double-ringed sleeve rod 208. The shaft rod 209 is fixedly connected to one side wall of the grinding plate 210. T-shaped groove plates 211 are also fixedly connected to the top side walls of both guardrail frames 205. The T-shaped groove plate 211 installed on one guardrail frame 205 specifically consists of two groove sections. The upper half of the groove plate is composed of plates, with brackets 213 fixedly connected to the outer walls of both ends. The lower half of the groove plate has grooves 212 on both sides. The bottom outer walls of the two brackets 213 are fixedly connected to the top of the lower half of the groove plate of a guardrail 205. The shaft 209 can intermittently fit and connect with the inner walls of the two grooves 212. The center of another T-shaped groove plate 211 has an arc-shaped sliding groove 214. The center of the grinding plate 210 is fixedly connected to a square frame rod 215. The two blocks of the square frame rod 215 are respectively fitted and slidably connected with the inner walls of the two T-shaped groove plates 211. The two blocks of the square frame rod 215 are movably connected to the middle rod.

[0021] Using the above solution: By fixing the indium phosphide device 203 within the mounting plate 202, the existing conductive component 3 can be activated to move the support frame 204 in the grinding section 2. The passively moving support frame 204 directly drives the two fixed mounting plates 205 to move synchronously. This causes the grinding plate 210, installed between the two mounting plates 205, to repeatedly contact the surface of the indium phosphide device 203 through reciprocating translation, thus polishing it. Figure 4 As shown, the double-ringed rod 208 can be rotated by the motor 207 installed on the starter plate 206, thereby causing the shaft 209 connected to it to rotate synchronously by 180 degrees. The grinding plate 210 installed on the shaft 209 also rotates synchronously by 180 degrees. During this process, the gap between the two sections of the T-shaped groove plate 211 will not affect the movement of the shaft 209. Thus, the shaft 209 will move into another groove 212 opened on the T-shaped groove plate 211. At the same time, during the passive flipping process of the grinding plate 210, the square support rod 215 set in the middle will be driven to slide and limit the corresponding movement in the inner wall of the two T-shaped groove plates 211, ensuring the stability of the grinding plate 210 during the flipping process. Thus, the grinding plate 210, which is flipped 180 degrees, can also directly perform a second layer of fine grinding on the indium phosphide device 203 through the drive of the conduction component 3. The multi-stage progressive grinding can reduce deep scratches on the indium phosphide device 203.

[0022] The negative pressure structure includes a piston rod 216 fixedly connected to the upper half of the piston cylinder 201. The piston rod 216 is also slidably connected to the inner wall of the lower half of the piston cylinder 201. A spring 217 is fixedly connected between the two sections of the piston cylinder 201. Multiple guide rods 218 are fixedly connected in a circumferential manner to the outer wall of the upper half of the piston cylinder 201, and a set of guide blocks is also fixedly connected in a circumferential manner to the outer wall of the lower half of the piston cylinder. The set of guide blocks can interact with each guide rod. 218 is connected in a through sliding connection. A cone 219 is fixedly connected to the top outer wall of the base 1. A filter screen 220 is fixedly connected to the lower half of the piston cylinder 201. The bottom end of the filter screen 220 is fixedly connected to the top outer wall of the base 1. A soft bristle plate 221 is slidably connected to the filter screen 220. Multiple springs 222 are fixedly connected between the bottom outer wall of the soft bristle plate 221 and the top outer wall of the base 1.

[0023] Using the above scheme: During the passive flipping process of the grinding plate 210, the indium phosphide device 203, the device plate 202, and the upper half of the piston cylinder 201 are pressed down. This directly drives the piston rod 216 to slide in the lower half of the cylinder, creating a negative pressure effect. At the same time, the compression spring 217 elastically contracts, and the compressed gas is ejected from the gap between the lower half of the piston cylinder 201 and the cone 219 due to the installation of the cone 219. This causes the soft bristle plate 221 to move upward with impact, and the spring 222 installed on the soft bristle plate 221 moves upward accordingly. The deformation of the springs 222 and 217 serves to help the connecting structure return to its original position when it is not under stress. The passively moving soft bristle plate 221 passes through the filter screen plate 220, acting as a through hole on its surface sieve section. When the piston rod 216 is passively squeezed, the resulting squeezing force will squeeze the filtered liquid between the soft bristle plate 221 and the machine base 1. The squeezed liquid will enter the liquid hopper 225 through the angled guide plate 223 and the liquid guide pipe 224, constantly replenishing the liquid hopper 225 and the liquid flowing through the liquid delivery pipe 226, thus ensuring continuous utilization of the liquid resources.

[0024] An angled guide plate 223 is fixedly connected to one end of the filter screen 220. A liquid guide pipe 224 is fixedly connected to the other end of the angled guide plate 223. A liquid hopper 225 is fixedly connected to the other end of the liquid guide pipe 224. The outer wall of the liquid hopper 225 is fixedly connected to the conductive assembly 3. An infusion pipe 226 is fixedly connected to the bottom of the liquid hopper 225. The other end of the infusion pipe 226 is fixedly connected to one end of the block support rod 215. The pipe body of the infusion pipe 226 is also slidably connected to the inner wall of the arc-shaped sliding groove 214. A spray plate 227 is fixedly connected between one side of the pipe body of the block support rod 215 and the plate body of the grinding plate 210. Both the connection points of the rods of 27 and the block frame rod 215 are provided with arc grooves. The rod of the infusion tube 226 is specifically composed of two sections of different materials. One section of the tube used to connect with the block frame rod 215 is a flexible tube, while the other section is a rigid tube. The upper and lower ends of the flexible tube are fitted with slidable compression plates 228. The two compression plates 228 are connected to a ball rod 229 by a joint movable shaft in the middle. The bottom end of the ball rod 229 is fixedly connected to the top outer wall of the corresponding guardrail frame 205. The two compression plates 228 are intermittently fitted with slidable inclined plate blocks 230 in the middle. The inclined plate blocks 230 are also fixedly connected to another T-shaped groove plate 211.

[0025] Indium phosphide, including the indium phosphide of any one of claims 1-9.

[0026] The above solution is adopted: such as Figure 5 and Figure 6 As shown above, the passive translation of the two guardrail frames 205 will synchronously drive the translation of the two T-shaped groove plates 211. The movement of one of the T-shaped groove plates 211 will drive the connected inclined plate block 230 to move synchronously. Thus, the reciprocating sliding contact with the two extrusion plates 228 will cause the two extrusion plates 228 to tilt on the ball rod 229, forming an acute angle. This will compress the soft infusion tube 226 that is in the middle, and will cause the grinding fluid that is naturally discharged through the liquid hopper 225 to be suddenly subjected to pressure on the tube. When pressed, the liquid is passively generated with a sudden impact force, and then sprayed directly from the spray plate 227 through the arc groove, spraying the polishing liquid onto the indium phosphide device 203 and the polishing plate 210. The physical friction heat and particulate matter generated on both are treated and cooled to avoid thermal damage to the device and wear of the polishing tool. After use, the polishing liquid will fall naturally onto the filter plate 220, and the liquid will be screened by the filter plate 220. Then, the soft bristle plate 221 will screen the liquid a second time to prevent the presence of particulate impurities in the polishing liquid.

[0027] The working principle and usage process of this invention: The transmission component 3 in the prior art is activated to move the support frame 204 in the grinding section 2. The passively moving support frame 204 directly drives the two fixed railing frames 205 to move synchronously. This causes the grinding plate 210, installed between the two railing frames 205, to repeatedly contact the surface of the indium phosphide device 203 through reciprocating translation, thus grinding it. As mentioned above, the passive translation of the two railing frames 205 synchronously drives the translation of two T-shaped slot plates 211. The movement of one of the T-shaped slot plates 211 drives the connected inclined plate block 230 to move synchronously. This reciprocating sliding contact with the two extrusion plates 228 results in the two extrusion plates being subjected to force. The pressure plate 228 will tilt on the ball rod 229 to create an acute angle, thereby squeezing the soft material infusion tube 226 that is attached in the middle. When the grinding liquid that is naturally fed through the liquid hopper 225 is suddenly pressed, the liquid will passively generate a sudden impact force. Then, it will be sprayed directly from the spray plate 227 through the arc groove, spraying the grinding liquid onto the indium phosphide device 203 and the grinding plate 210. This will cool down the physical friction heat and particulate matter generated by the two, avoiding thermal damage to the device and wear of the grinding wheel. After use, the grinding liquid will fall naturally onto the filter plate 220, where it will be sieved. Then, the soft bristle plate 221 will sieve the liquid a second time. At that time, the motor 207 installed on the ear plate 206 can be used to drive the double-ring sleeve rod 208 to rotate, thereby driving the shaft rod 209 connected to it to rotate synchronously by 180 degrees. The grinding plate 210 installed on the shaft rod 209 will also rotate synchronously by 180 degrees. During this process, the gap between the two sections of the T-shaped groove plate 211 will not affect the movement of the shaft rod 209. As a result, the shaft rod 209 will move into another groove 212 opened on the T-shaped groove plate 211. At the same time, after grinding... During the passive rotation of the grinding plate 210, the centrally located square support rod 215 slides within the inner walls of the two T-shaped slot plates 211, ensuring the stability of the grinding plate 210 during rotation. Thus, the grinding plate 210, rotated 180 degrees, can directly perform a second layer of fine grinding on the indium phosphide device 203 via the drive of the conduction component 3. During the passive rotation of the grinding plate 210, the indium phosphide device 203, the device plate 202, and the upper half of the piston cylinder 201 are subjected to further grinding. The pressure directly causes the piston rod 216 to slide in the lower half of the cylinder, creating a negative pressure effect. Simultaneously, the compression spring 217 contracts elastically, and the compressed gas, due to the installation of the cone 219, is ejected from the gap between the lower half of the piston cylinder 201 and the cone 219. This impact force causes the soft bristle plate 221 to move upwards, causing the spring 222 installed on the soft bristle plate 221 to deform accordingly. The functions of spring 222 and spring 217 are... Both are used to help the connecting structure reset when it is not under stress. The passively moving soft bristle plate 221 passes through the filter screen plate 220, acting as a through hole on its surface sieve section. When the piston rod 216 is passively squeezed, the resulting squeezing force will squeeze the filtered liquid between the soft bristle plate 221 and the machine base 1. The squeezed liquid will enter the liquid hopper 225 through the angled guide plate 223 and the liquid guide pipe 224, constantly replenishing the liquid hopper 225 and the liquid flowing down through the delivery pipe 226. It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An indium phosphide polishing apparatus comprising a machine base (1) characterised in that: The machine base (1) is provided with a grinding part (2), the grinding part (2) includes a piston cylinder (201), the piston cylinder (201) is specifically composed of two cylinder bodies, the top end outer wall of the upper half of the cylinder body is fixedly connected with a placer disc (202), the inner wall of the placer disc (202) is specifically made of natural rubber material, the inner wall of the placer disc (202) can be intermittently tightly connected with an indium phosphide device (203), the top end of the indium phosphide device (203) can be intermittently connected with a grinding plate (210) slidingly, the two end surfaces of the grinding plate (210) are respectively composed of two different diameter density grinding surfaces, and the grinding plate (210) is provided with a rotary switching structure for rotating and switching the grinding surface by 180 degrees. The piston cylinder (201) and the machine base (1) are jointly provided with a negative pressure structure for collecting and recycling the grinding liquid used in the grinding process, and a transmission assembly (3) is jointly arranged above the rotary switching structure and the negative pressure structure, the transmission assembly (3) is used for synchronously driving the rotary switching structure and the grinding plate (210) to move horizontally.

2. The indium phosphide polishing apparatus of claim 1, wherein: The rotary switching structure includes a support frame (204) fixedly connected to the transmission assembly (3), the two plate bodies of the support frame (204) are fixedly connected with a fence frame (205), the top end outer wall of one of the fence frames (205) is fixedly connected with an ear plate (206), one end plate body of the ear plate (206) is fixedly connected with a motor (207), and the shaft of the motor (207) is fixedly connected with a double loop snare rod (208).

3. The indium phosphide polishing apparatus of claim 2, wherein: The other side of the double loop snare rod (208) is through the active sleeve connected with a shaft rod (209), the rod body of the shaft rod (209) is fixedly connected with one end side wall of the grinding plate (210), and the top end side wall of each of the two fence frames (205) is also fixedly connected with a T-shaped groove plate (211), the T-shaped groove plate (211) installed on one of the fence frames (205) is specifically composed of two groove plates, the two end outer walls of the upper half of the groove plate are fixedly connected with a support (213), and the two side plate bodies of the lower half of the groove plate are provided with a groove (212).

4. The indium phosphide polishing apparatus of claim 3, wherein: The bottom end outer wall of each of the two supports (213) is fixedly connected with the top end of the lower half of the groove plate of one of the fence frames (205), and the rod body of the shaft rod (209) can be intermittently connected with the inner walls of the two grooves (212).

5. The indium phosphide polishing apparatus of claim 3, wherein: The center position of the other T-shaped groove plate (211) is provided with an arc angle sliding groove (214), the center position of the grinding plate (210) is fixedly connected with a square frame rod (215), the two end blocks of the square frame rod (215) are respectively connected with the inner walls of the two T-shaped groove plates (211) slidingly, and the two square blocks of the square frame rod (215) and the middle rod body are actively sleeved.

6. The indium phosphide polishing apparatus of claim 1, wherein: The negative pressure structure includes a piston rod (216) fixedly connected to the upper half of the piston cylinder (201), the piston rod (216) is also in close sliding connection with the inner wall of the lower half of the piston cylinder (201), a spring (217) is fixedly connected between the two cylinder bodies of the piston cylinder (201), a plurality of guide rods (218) are fixedly connected around the outer wall of the upper half of the piston cylinder (201), and a group of guide blocks are also fixedly connected around the outer wall of the lower half of the piston cylinder (201), and each guide block is in penetrating sliding connection with each guide rod (218).

7. The indium phosphide polishing apparatus of claim 6, wherein: The top end of the machine base (1) is fixedly connected with a conical body (219), the outer wall of the lower half of the piston cylinder (201) is fixedly connected with a filter screen (220), the bottom end of the filter screen (220) is fixedly connected with the top end of the machine base (1), the soft hair plate (221) is in close sliding connection with the plate body of the filter screen (220), and a plurality of springs (222) are fixedly connected between the bottom end of the outer wall of the soft hair plate (221) and the top end of the machine base (1).

8. The indium phosphide polishing apparatus of claim 7, wherein: One end of the filter screen (220) is penetratingly fixedly connected with an inclined angle guide plate (223), the other end of the inclined angle guide plate (223) is penetratingly fixedly connected with a liquid guide pipe (224), the other end of the liquid guide pipe (224) is penetratingly fixedly connected with a liquid hopper (225), the outer wall of the liquid hopper (225) is fixedly connected with the conducting assembly (3), the bottom end of the liquid hopper (225) is penetratingly fixedly connected with a transfusion pipe (226), the other end of the transfusion pipe (226) is penetratingly fixedly connected with one end of the square block frame rod (215), and the pipe body of the transfusion pipe (226) is also in sliding connection with the inner wall of the arc angle sliding groove (214).

9. The indium phosphide polishing apparatus of claim 8, wherein: The side pipe body of the square block frame rod (215) is fixedly connected with the plate body of the grinding plate (210), the rod body of the square block frame rod (215) is penetratingly provided with an arc groove, the rod body of the transfusion pipe (226) is composed of two pipe bodies made of different materials, one of which is a soft pipe body, and the other is a hard pipe body, the upper and lower ends of the soft pipe body are in close sliding connection with the extrusion plates (228), and the ball rod (229) is movably connected between the two extrusion plates (228); The middle of the two extrusion plates (228) is intermittently connected with the inclined plate (230), and the inclined plate (230) is also fixedly connected with the other T-shaped groove plate (211).

10. Indium phosphide, characterized in that: The phosphorus indium includes any one of claims 1-9.

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