Cutting equipment and method for indium phosphide processing

Abstract

The invention discloses cutting equipment and method for indium phosphide processing, and relates to the technical field of semiconductor material processing equipment.The cutting equipment comprises a workbench used for supporting indium phosphide to be cut; the flow guide powder assembly is arranged at the top of the workbench, a closed space is formed through a flow guide channel, dust carried by low-temperature airflow is limited inside and prevented from being diffused to the operation environment, a swing flow guide structure of the flow guide powder assembly is matched with a micro servo motor and a differential pressure and laser dust concentration sensor, and the flow guide direction can be monitored in real time and rapidly switched; when one dust storage box is full, the dust is guided to the other box, operation interruption is thoroughly avoided, meanwhile, the secondary treatment structure purifies dust in a grading mode through a miniature efficient cyclone separator and a nanometer film covering filter cylinder, emission meets the clean standard, a heat sealing strip is automatically sealed when a collection bag is full, secondary dust raising is prevented, and the environment is protected. Thermal stress control, dust whole process controllability and continuous operation are integrally realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor material processing equipment technology, specifically to a cutting device and method for indium phosphide processing. Background Technology

[0002] In the third-generation semiconductor material system, indium phosphide has become a core basic material in the fields of optoelectronics and microelectronics due to its excellent optoelectronic properties and high-frequency performance. Its bandgap is highly matched with the optical communication band, and its electron mobility is much higher than that of silicon and gallium arsenide. Therefore, it is widely used in key fields such as vertical cavity surface-emitting lasers, photodetectors, high-frequency transistors and quantum communication devices. It is one of the core materials supporting the upgrading of strategic industries such as 5G communication, data centers, new energy vehicles and quantum technology.

[0003] In the processing of indium phosphide, in order to transform wafer material into packageable chip units and meet the performance requirements of specific devices, it needs to be diced. Current technologies typically use diamond blades for dicing to control cost and ensure process compatibility. However, indium phosphide is a typical brittle material, and the thermal stress generated during continuous dicing will superimpose with the mechanical stress, which not only reduces the material's crack resistance but also accelerates the formation of microcracks in indium phosphide. To prevent this, current technologies usually employ a low-temperature airflow during indium phosphide dicing. The low-temperature airflow can force convection to quickly dissipate heat from the dicing area, reducing the superposition of thermal and mechanical stresses, thus reducing the risk of cracking from the source and ultimately ensuring dicing quality. However, this approach still has the following problems: Because indium phosphide itself contains the heavy metal indium and is toxic, the dust generated during its cutting is even more hazardous. In existing indium phosphide cutting processes, this toxic dust is carried by forced convection airflow, breaking through the constraints of the local cutting area and spreading into the surrounding operating environment. Specifically, the dust forms a suspended diffusion zone with the airflow and settles on the equipment surface, the ground, and the workbench, which not only leads to exposure to inhalation by operators but also causes environmental dust pollution.

[0004] Therefore, we propose a cutting device and method for indium phosphide processing to solve the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to provide a cutting device and method for indium phosphide processing, in order to solve the problems mentioned in the background art. Indium phosphide itself contains the heavy metal indium and is toxic, and the dust generated during its cutting is more harmful. In the existing indium phosphide cutting process, these toxic dusts are carried by the forced convection airflow, breaking through the constraints of the local cutting area and spreading into the surrounding operating environment. Specifically, the dust forms a suspended diffusion zone with the airflow and settles on the equipment surface, the ground, and the workbench, which not only leads to the exposure of operators by inhalation, but also causes environmental dust pollution.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a cutting device for indium phosphide processing, comprising: The worktable is used to support the indium phosphide to be cut. A powder guiding assembly is disposed on the top of the worktable, and the powder guiding assembly is used to guide the powder generated during the cutting of indium phosphide; The guiding powder assembly includes: The flow channel is used to enclose and transport the indium phosphide powder generated during cutting. A set of dust collection boxes, used to store indium phosphide powder; An oscillating flow guiding structure is installed inside the flow guiding channel to guide the indium phosphide powder that is being transported in a closed manner within the flow guiding channel to one of the preset dust collection boxes. When the preset dust collection box is full of indium phosphide powder, the oscillating flow guiding structure can adjust the direction of powder flow through its own oscillating motion to guide the subsequently transported indium phosphide powder to another dust collection box, so as to avoid the interruption of the cutting operation due to the fullness of a single dust collection box and to achieve the continuity of indium phosphide powder collection and cutting operations. A secondary processing structure is installed inside the dust collection box to perform secondary processing on the indium phosphide powder collected in the dust collection box. This secondary processing reduces the dustiness of the indium phosphide powder, thereby suppressing the secondary diffusion of indium phosphide powder caused by airflow during subsequent powder processing, such as the opening and closing of the dust collection box.

[0007] Preferably, the oscillating flow guiding structure includes a connecting rod, a set of flow guiding plates are symmetrically fixedly installed inside the flow guiding channel, a differential pressure sensor and a laser dust concentration sensor are fixedly installed on the inner top of the flow guiding channel, a fixing plate is fixedly installed on the inner top of the flow guiding channel, and a micro servo motor is fixedly installed at the bottom of the flow guiding channel.

[0008] Preferably, the output end of the micro servo motor slides through the bottom of the guide channel and extends upwards. A rotating rod is fixedly installed on the output end of the micro servo motor. The outer surface of the rotating rod is rotatably connected to the inner wall of the fixed plate. A guide plate is fixedly installed on the outer surface of the rotating rod. The bottom of the connecting rod is fixedly connected to the top of the guide channel.

[0009] Preferably, the secondary processing structure includes a set of arc-shaped channels, one outer surface of the set of arc-shaped channels is fixedly connected to the outer surface of the guide channel, the other outer surface of the set of arc-shaped channels is fixedly connected to the outer surface of the dust collection box, and a connecting pipe is fixedly installed inside the set of dust collection boxes, and the set of connecting pipes is connected to the arc-shaped channels.

[0010] Preferably, one end of each of the connecting pipes is fixedly connected to a miniature high-efficiency cyclone separator, the outer surface of each of the miniature high-efficiency cyclone separators is fixedly connected to an installation pipe, one end of each of the installation pipes is fixedly connected to a filter cartridge, one end of each of the filter cartridges is fixedly connected to a conveying pipe, and the outer surface of each of the filter cartridges is provided with a base.

[0011] Preferably, a connecting plate is fixedly installed on the inner wall of each of the dust collection boxes near the center, one end of each of the conveying pipes slides through the top of the connecting plate and extends downwards, the outer surface of each of the miniature high-efficiency cyclone separators is fixedly installed to the inner wall of the connecting plate, and a weighing sensor is fixedly installed on the inner bottom of each of the dust collection boxes.

[0012] Preferably, each of the weighing sensors is provided with a mounting plate on its top, a collection bag is movably mounted on the top of each of the mounting plates, a mounting groove is symmetrically opened on the inner surface of each of the dust collection boxes near the bottom, a heat sealing strip is slidably connected to the inner surface of each of the mounting grooves, and a sliding groove is symmetrically opened on the top of the workbench.

[0013] Preferably, the outer surface of the powder guiding assembly is provided with an auxiliary dustproof component, which is used to provide secondary protection against dust. The auxiliary dustproof component includes a dust cover, the top of which is slidably connected to the diamond cutting machine body. An air outlet is fixedly installed on the inner wall of the dust cover, and an air supply pipe is fixedly connected to the outer surface of the air outlet. One end of the air supply pipe slides through the inner wall of the dust cover and extends to one side.

[0014] Preferably, a baffle is fixedly installed at the top of the dust cover near the center, an air curtain device body is fixedly installed at the inner top of the dust cover near the edge, the inner surface of the dust cover is slidably connected to the outer surface of the guide channel, the bottom of the dust cover is slidably connected to the inner surface of the sliding groove, and the bottom of a set of dust collection boxes is slidably connected to the top of the workbench.

[0015] A method for using indium phosphide in processing, the specific steps of which are as follows: Step 1: Use external equipment to move the diamond cutting machine body horizontally, so that the dust cover slides in the sliding groove and covers the indium phosphide to be cut. At this time, use external equipment to drive the diamond cutting machine body to descend and cut. At the same time, the external elevator drives the connecting rod to descend and block the powder outlet. Then, the air curtain device is activated and sprays airflow at the only outlet of the dust cover to achieve complete sealing. Subsequently, the solenoid valve of the main air source of the equipment is opened to deliver the low temperature airflow to the air supply pipe and then spray it out through the air outlet to reduce thermal stress. Step 2: Indium phosphide powder generated during the cutting process is transported to the inside of the guide channel through the air outlet. The guide plate can accelerate the flow of powder, while the differential pressure sensor monitors the change in air resistance. The laser dust concentration sensor monitors the air quality at the outlet. Then, the micro servo motor is started by the external controller, which makes the guide plate start to rotate and block one side, so that the powder can only enter the dust collection box through an arc-shaped channel. Step 3: After the dust enters the dust collection box, it enters the micro high-efficiency cyclone separator through the connecting pipe. Most of the heavier dust is separated by centrifugal force here. The filter cartridge connected to the mounting pipe is used to capture fine dust. Then, the fine dust is discharged into the collection bag through the conveying pipe, while the larger dust is directly discharged into the collection bag along with the separation. At the same time, the weighing sensor will send a signal to the external controller after reaching the weight. Before switching, the controller will first check whether the current cutting state is in the idle stroke and select the best time to switch to avoid disturbing the cutting process. Subsequently, the controller controls the motor to rotate the guide plate to the other side. Finally, before the collection bag is removed, the electromagnetic drive component installed on the heat sealing strip is energized to generate driving force, which drives the heat sealing strip to move along the mounting groove. The moving heat sealing strip applies a squeezing force to the opening of the collection bag to achieve a seal, preventing the indium phosphide dust inside the bag from being disturbed by air when the collection bag is removed and thus preventing its diffusion.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, by retaining the low-temperature airflow heat dissipation design and reducing the superposition of thermal and mechanical stress through forced convection, microcracks in indium phosphide are reduced from the source, ensuring cutting quality and continuing the protective effect on the crack resistance of the material. On the other hand, the flow channel forms a closed space to confine the dust carried by the low-temperature airflow and prevent it from spreading to the operating environment. Its swing flow guiding structure, combined with a micro servo motor, differential pressure and laser dust concentration sensor, can monitor in real time and quickly switch the flow direction. When one dust collection box is full, it is immediately guided to another box, completely avoiding operation interruption. At the same time, the secondary treatment structure uses a micro high-efficiency cyclone separator and a nano-coated filter cartridge to purify dust in stages, and the emissions meet clean standards. When the collection bag is full, the heat seal strip automatically seals to prevent secondary dust. Overall, thermal stress control, dust controllability throughout the process and continuous operation are achieved.

[0017] 2. In this invention, a closed cutting space is constructed by using physical sealing of auxiliary dustproof components and coordinated airflow design. This effectively prevents a small amount of fine dust generated during the cutting process from breaking through the protection and spreading into the outside air, ensuring a clean working environment. While strengthening dust control, it also takes into account operational flexibility, further improving the dust management system. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main structure of a cutting device and method for indium phosphide processing according to the present invention; Figure 2 This is a schematic diagram of the oscillating flow guiding structure in a cutting device and method for indium phosphide processing according to the present invention; Figure 3 This is a planar sectional view of the oscillating flow guide structure in a cutting device and method for indium phosphide processing according to the present invention; Figure 4 This is a top view of the motion trajectory of the oscillating guide structure in a cutting device and method for indium phosphide processing according to the present invention. Figure 5 This is a cross-sectional schematic diagram of the oscillating flow guiding structure in a cutting device and method for indium phosphide processing according to the present invention; Figure 6 This is a planar sectional view of the secondary processing structure in a cutting device and method for indium phosphide processing according to the present invention. Figure 7 This is a schematic diagram of the secondary processing structure in a cutting device and method for indium phosphide processing according to the present invention. Figure 8 This is a cross-sectional view of the secondary processing structure in a cutting device and method for indium phosphide processing according to the present invention. Figure 9 This is a schematic diagram of the auxiliary dustproof component in a cutting device and method for indium phosphide processing according to the present invention; Figure 10 This is a schematic cross-sectional view of an auxiliary dustproof component in a cutting device and method for indium phosphide processing according to the present invention. Figure 11 This is a schematic planar cross-sectional view of a cutting device and method for processing indium phosphide according to the present invention.

[0019] In the diagram: 1. Workbench; 12. Sliding groove; 2. Powder guiding assembly; 201. Guiding channel; 202. Connecting rod; 203. Flow guide plate; 204. Differential pressure sensor; 205. Laser dust concentration sensor; 206. Fixing plate; 207. Miniature servo motor; 208. Rotating rod; 209. Flow guide plate; 210. Arc-shaped channel; 211. Dust collection box; 212. Connecting pipe; 213. Miniature high-efficiency cyclone separator 214. Mounting pipe; 215. Filter cartridge; 216. Conveying pipe; 217. Base; 218. Connecting plate; 219. Weighing sensor; 220. Mounting plate; 221. Collection bag; 222. Mounting groove; 223. Heat sealing strip; 3. Auxiliary dustproof components; 301. Dust cover; 302. Diamond cutting machine body; 303. Air outlet; 304. Air supply pipe; 305. Baffle; 306. Air curtain device body. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In embodiments of the present invention, such as Figure 1 - Figure 8 as well as Figure 11 As shown: A cutting device for indium phosphide processing, comprising: Workbench 1, which is used to support the indium phosphide to be cut; The powder guiding component 2 is set on the top of the worktable 1. The powder guiding component 2 is used to guide the powder generated during the cutting of indium phosphide. The powder guiding assembly 2 includes: The flow channel 201 is used for the closed transport of indium phosphide powder generated during cutting; A set of dust collection boxes 211, which are used to store indium phosphide powder; The oscillating flow guiding structure is installed inside the flow guiding channel 201. It is used to first guide the indium phosphide powder that is enclosed and transported in the flow guiding channel 201 to one of the preset dust collection boxes 211. When the preset dust collection box 211 is full of indium phosphide powder, the oscillating flow guiding structure can adjust the powder guiding direction by its own oscillating action, and guide the subsequently transported indium phosphide powder to another dust collection box 211, so as to avoid the interruption of the cutting operation due to the fullness of a single dust collection box 211, and realize the continuity of indium phosphide powder collection and cutting operation. A secondary processing structure, located inside the dust collection box 211, is used to perform secondary processing on the indium phosphide powder collected in the dust collection box 211. This secondary processing reduces the dustiness of the indium phosphide powder, thereby suppressing secondary diffusion of the indium phosphide powder due to airflow during subsequent powder processing, such as the opening and closing of the dust collection box 211. The oscillating guide structure includes a connecting rod 202. A set of guide plates 203 are symmetrically fixedly installed inside the guide channel 201. A differential pressure sensor 204 and a laser dust concentration sensor 205 are fixedly installed on the inner top of the guide channel 201. A fixing plate 206 is fixedly installed on the inner top of the guide channel 201. A micro servo motor 207 is fixedly installed at the bottom. The output end of the micro servo motor 207 slides through the bottom of the guide channel 201 and extends upwards. A rotating rod 208 is fixedly installed at the output end of the micro servo motor 207. The outer surface of the rotating rod 208 is rotatably connected to the inner surface wall of the fixed plate 206. A guide plate 209 is fixedly installed on the outer surface of the rotating rod 208. The bottom of the connecting rod 202 is fixedly connected to the top of the guide channel 201. The secondary processing structure includes a set of arc-shaped channels 210. One outer surface of the set of arc-shaped channels 210 is fixedly connected to the outer surface of the guide channel 201, and the other outer surface of the set of arc-shaped channels 210 is connected to the storage... The outer surface of the dust bin 211 is fixedly connected. A connecting pipe 212 is fixedly installed inside each dust bin 211. Each connecting pipe 212 is connected to an arc-shaped channel 210. One end of each connecting pipe 212 is fixedly connected to a miniature high-efficiency cyclone separator 213. An installation pipe 214 is fixedly connected to the outer surface of each miniature high-efficiency cyclone separator 213. One end of each installation pipe 214 is fixedly connected to a filter cartridge 215. One end of each filter cartridge 215 is fixedly connected to a conveying pipe 216. A base 217 is provided on the outer surface of each filter cartridge 215. A connecting plate 21 is fixedly installed near the center of the inner wall of each dust bin 211. 8. One end of each set of conveying pipes 216 slides through the top of the connecting plate 218 and extends downwards. The outer surface of each set of miniature high-efficiency cyclone separators 213 is fixedly installed with the inner wall of the connecting plate 218. Each set of dust collection boxes 211 has a weighing sensor 219 fixedly installed at the bottom. Each set of weighing sensors 219 has a mounting plate 220 on its top. Each set of mounting plates 220 has a collection bag 221 movably installed on its top. Each set of dust collection boxes 211 has a mounting groove 222 symmetrically opened near the bottom of its inner wall. Each set of mounting grooves 222 has a heat sealing strip 223 slidably connected to its inner wall. The top of the workbench 1 has a sliding groove 12 symmetrically opened.

[0022] The overall effect is that before starting the indium phosphide cutting operation, the connecting rod 202 is driven by an external lifting platform to descend at a constant speed to seal and position the indium phosphide material, laying the foundation for the subsequent cutting process. When the cutting equipment enters normal operation, the indium phosphide will generate fine dust during the cutting process. This dust is then introduced into the guide channel 201, officially starting the dust treatment process. Figure 2 and Figure 3 As shown, after the airflow containing indium phosphide dust enters the guide channel 201, it first comes into contact with two sets of symmetrically distributed guide plates 203 within the channel. These two sets of guide plates 203 further enhance the airflow velocity by reducing the effective diameter of the guide channel 201, thereby preventing dust from depositing in the channel. Simultaneously, the guide channel 201 is also equipped with a differential pressure sensor 204 and a laser dust concentration sensor 205, which are used to monitor changes in wind resistance and dust concentration in the airflow in real time, respectively, ensuring that the dust handling process is controllable. The guide plates 209 are initially in a single-sided blocking mode, with one guide plate 209 completely blocking one side of the channel, leaving only the arc-shaped channel 210 on the other side for airflow to pass through. Figure 5 As shown, this ensures that the dust-laden airflow can only flow directionally into the subsequent dust collection box 211 along the arc-shaped channel 210, such as... Figure 6 and Figure 7As shown, the connecting pipe 212 then conveys the dust-laden airflow to the miniature high-efficiency cyclone separator 213. This separator generates a centrifugal force field through high-speed rotation. Most of the heavier indium phosphide dust particles, typically larger than 5 μm, in the airflow are thrown against the inner wall of the separator by centrifugal force, then slide down the wall and finally fall into the collection bag 221 below the separator, completing the first-stage separation of heavy dust. After the first-stage separation, the remaining lighter, finer dust particles, smaller than 5 μm, are carried by the airflow into the mounting pipe 214 and conveyed through the mounting pipe 214 to the filter cartridge 215. The filter cartridge 215 is made of polytetrafluoroethylene nanofilm material with a pore size that can be precisely controlled within 0.1-0.3μm, enabling efficient capture of fine dust in the airflow. A metal base 217 is fixed to the bottom of the cartridge 215 to ensure its stability under airflow impact, preventing dust leakage due to displacement. The captured fine dust gradually accumulates on the inner wall of the cartridge 215 before entering the conveying pipe 216 and finally being transported to the collection bag 221 below, achieving complete dust collection. The collection bag 221 is positioned above the mounting plate 220, and a high-precision weighing sensor 21 is installed at the bottom of the mounting plate 220. 9. This sensor can accurately collect the weight of indium phosphide dust in the collection bag 221 in real time and transmit the weight data synchronously to the external controller. When the weighing sensor 219 detects that the weight of dust in the collection bag 221 reaches a preset threshold (usually set to 0.5 kg, which can be flexibly adjusted according to the capacity of the collection bag 221), the controller will activate dual control logic. On the one hand, the controller reads the operating parameters of the cutting equipment (such as the cutting head displacement, feed speed, etc.) to determine whether the current cutting state is in the idle stroke stage (i.e., the cutting head is not in contact with the indium phosphide material and is only moving in position), thereby avoiding This eliminates the need to switch dust channels during critical stages of the cutting operation, preventing disturbances to cutting accuracy. Furthermore, the controller simultaneously receives wind resistance data from the differential pressure sensor 204 and air quality data from the laser dust concentration sensor 205. Through a built-in algorithm, it adaptively adjusts the main fan's output power. If increased wind resistance or excessive dust concentration is detected, the fan power is increased to enhance negative pressure; if the operating conditions are stable, the power is reduced to save energy. This ensures optimal negative pressure collection under any cutting condition, achieving a balance between efficient dust collection and energy-saving operation. When the controller confirms that the cutting equipment is in an idle state, if... Figure 4As shown, the micro servo motor 207 will be activated immediately. The motor output will drive the rotating rod 208 to rotate around the axis. Since the rotating rod 208 and the guide plate 209 are fixedly installed, the rotating rod 208 will simultaneously drive the guide plate 209 to swing. At this time, the previously opened arc-shaped channel 210 will be blocked, and another set of previously closed arc-shaped channels 210 will open. The dust-laden airflow will then switch to this channel and enter the corresponding backup dust collection box 211, ensuring that dust collection is uninterrupted. At the same time, the fixing plate 206 will seal the gap when the channel switches to prevent dust from leaking from the gap. Subsequently, the heat sealing strip 223 assembly at the opening of the collection bag 221 will be activated, as shown. Figure 8 As shown, after the electromagnetic drive components on both sides of the heat-sealing strip 223 are energized, they generate a linear driving force, causing the heat-sealing strip 223 to move along the preset mounting groove 222, applying a uniform squeezing force to the opening of the collection bag 221, so that the bag opening is heat-sealed (the sealing temperature is controlled at 80-100℃ to avoid high temperature damage to the collection bag 221), effectively preventing the diffusion of indium phosphide dust inside the bag due to air disturbance when the collection bag 221 is subsequently removed. After the sealing is completed, as... Figure 1 As shown, the staff can open the side door of the original dust collection box 211 and take out the sealed collection bag 221 for replacement. The spare dust collection box 211 will continue to collect dust. The entire dust treatment and bag replacement process does not require interruption of the cutting operation, and fully maintains the continuity of equipment operation. This equipment can not only efficiently handle cutting dust, but also reduce the thermal stress generated when cutting indium phosphide, and comprehensively collect the dust blown by the low temperature airflow.

[0023] Preferably, following the technical solution described in Embodiment 1 above, to avoid the possibility that dust may still diffuse with the airflow, a solution is proposed, specifically, as follows: Figure 1 and Figure 9 - Figure 11 As shown: The outer surface of the powder guiding component 2 is provided with an auxiliary dustproof component 3, which is used to provide secondary protection against dust. The auxiliary dustproof component 3 includes a dust cover 301, with a diamond cutting machine body 302 slidably connected to the top of the dust cover 301. An air outlet 303 is fixedly installed on the inner wall of the dust cover 301, and an air supply pipe 304 is fixedly connected to the outer surface of the air outlet 303. One end of the air supply pipe 304 slidably passes through the inner wall of the dust cover 301 and extends to one side. A baffle 305 is fixedly installed near the center of the top of the dust cover 301. An air curtain device body 306 is fixedly installed near the edge of the inner top of the dust cover 301. The inner wall of the dust cover 301 is slidably connected to the outer surface of the guide channel 201. The bottom of the dust cover 301 is slidably connected to the inner wall of the sliding groove 12. The bottom of a set of dust collection boxes 211 is slidably connected to the top of the workbench 1.

[0024] The overall effect is that, before using this equipment to cut indium phosphide, preliminary preparations must be completed, such as... Figure 1 As shown, the indium phosphide workpiece to be cut is first placed on the worktable 1 of the equipment. Then, the external drive device is activated, causing the diamond cutting machine body 302 to move towards the indium phosphide workpiece. Since the dust cover 301 and the diamond cutting machine body 302 are linked, the movement of the cutting machine body simultaneously moves the dust cover 301 along the preset sliding groove 12 until the dust cover 301 completely covers the indium phosphide workpiece, forming initial dust protection. Subsequently, the position of the dust guiding component is adjusted, such as... Figure 11 As shown, the connecting rod 202 is driven by an external lifting mechanism, which in turn lifts the dust guiding component upwards, maintaining a safe distance between the dust guiding component 2 and the indium phosphide workpiece to prevent collisions that could damage the workpiece or deform the component. After the indium phosphide workpiece is positioned and calibrated, it reaches the preset cutting position. Then, the connecting rod 202 is driven in the opposite direction by the external lifting mechanism to slowly lower the dust guiding component, thus sealing the indium phosphide. During this process, the baffle 305 seals the guiding channel 201 (which is open when the component rises) to prevent residual indium phosphide powder in the guiding channel 201 from spreading into the working environment when it comes into contact with the outside air. Once all preparations are complete, the cutting operation is started. Figure 9 and Figure 10 As shown, during the cutting process, the equipment's main air source (an air tank) enters the working state. The main air source's air supply solenoid valve opens, and the low-temperature airflow stored in the air tank is delivered to the equipment's air outlet 303 through the air supply pipe 304. The air outlet 303 is aimed at the cutting area of ​​indium phosphide and continuously sprays low-temperature gas onto the cutting area. The low-temperature airflow carries away the heat generated during cutting, thereby reducing the thermal stress generated by high temperature during the indium phosphide cutting process and preventing the workpiece from being damaged by thermal stress such as cracks and chipping. At the same time, the equipment's air curtain device body 306 is activated simultaneously. The air curtain device body 306 sprays high-pressure airflow into the equipment's only entrance and exit (i.e., the channel for putting in the workpiece and taking out the finished product), forming an invisible air curtain barrier that completely blocks the entrance and exit. Through the synergistic effect of the air curtain, the dust cover 301, and the dust guiding component, a sealed cutting space is constructed, effectively preventing the small amount of fine dust generated during the cutting process from breaking through the protection and spreading into the outside air, ensuring a clean working environment.

[0025] The working principle of the entire equipment is as follows: Before the indium phosphide cutting operation, the workpiece to be cut is placed on the worktable 1. The external equipment drives the diamond cutting machine body 302 to move towards the workpiece. The dust cover 301 moves synchronously with the sliding groove 12 to cover the workpiece. The external elevator then drives the dust guiding component to rise to prevent collision. After the workpiece is positioned at the cutting position, the component is lowered to seal the workpiece. The baffle 305 simultaneously closes the guide channel 201 to prevent residual dust from leaking out. During cutting, the air supply solenoid valve of the main air source of the equipment is opened. The low-temperature airflow is sprayed from the air outlet 303 through the air supply pipe 304 to the cutting area to reduce thermal stress. At the same time, the air curtain device body 306 is activated to form an air curtain by spraying airflow at the inlet and outlet. Combined with the dust cover 301 and the guide component, it forms a complete air curtain. A sealed space prevents dust diffusion. Dust generated during cutting is drawn into the guide channel 201. Symmetrical guide plates 203 within the channel narrow the opening and accelerate the airflow. Differential pressure and laser dust concentration sensors 205 monitor air resistance and concentration in real time. Initially, the guide plate 209 only opens one side of the arc-shaped channel 210. The dust-laden airflow enters the miniature high-efficiency cyclone separator 213 through the connecting pipe 212, separating heavier dust into the collection bag 221. Lighter dust enters the filter cartridge 215 through the installation pipe 214 and is also transported to the collection bag 221. (That is, the dust-laden airflow first enters the miniature high-efficiency cyclone separator 213 through the connecting pipe 212, utilizing the miniature high-efficiency cyclone separator 213 to efficiently separate dust particles larger than, for example, 5μm.) Then, after pre-treatment... The treated airflow then enters the filter cartridge 215 through the mounting pipe 214. The filter cartridge 215 uses PTFE membrane filter material, which effectively captures remaining ultrafine dust, ensuring the dust concentration in the exhaust air is below, for example, 1 mg / m³. Finally, all collected dust falls into the collection bag 221 at the bottom. The load cell 219 at the bottom of the mounting plate 220 monitors the dust weight in real time. Once a threshold is reached, the controller reads the cutting parameters to determine if it is an empty stroke (i.e., when any load cell 219 detects that the weight of the collection bag 221 above it reaches a preset threshold (e.g., 0.5 kg), it sends a switching request signal to the external controller (PLC controller or logic controller). Upon receiving the request, the external controller immediately checks... The status signal of the cutting machine's motion control system is retrieved. Only when a signal indicating the cutting head is in an idle state is received will the external controller send a rotation command to the micro servo motor 207. At this time, data from the differential pressure sensor 204 and the laser dust concentration sensor 205 are used to adjust the main fan power in real time to maintain stable negative pressure in the system (but do not directly participate in channel switching decisions). Simultaneously, the main fan power is adaptively adjusted based on sensor data. After confirming the idle state, the micro servo motor 207 drives the rotating rod 208 and the guide plate 209 to swing, switching to the backup arc-shaped channel 210 and dust collection box 211. The heat-sealing strip 223 seals the opening of the original collection bag 221, allowing operators to replace the collection bag 221 without interrupting operations. The entire device can operate for extended periods without interrupting dust collection device replacement, improving overall equipment utilization.This effectively reduces the concentration of airborne dust in the work area, effectively protects the health of operators, and avoids the waste of precious metal indium and cross-contamination of the environment.

[0026] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cutting device for processing indium phosphide, characterized in that, include: The workbench (1) is used to support the indium phosphide to be cut; A powder guiding assembly (2) is disposed on the top of the worktable (1) and is used to guide the powder generated during the cutting of indium phosphide. The guiding powder assembly (2) includes: The flow channel (201) is used to enclose and transport the indium phosphide powder generated during cutting. A set of dust collection boxes (211) is used to store indium phosphide powder; The oscillating flow guide structure is installed inside the flow guide channel (201) to guide the indium phosphide powder that is enclosed and transported in the flow guide channel (201) to one of the preset dust collection boxes (211). When the preset dust collection box (211) is full of indium phosphide powder, the oscillating flow guide structure can adjust the powder flow direction by its own oscillating action to guide the subsequently transported indium phosphide powder to another dust collection box (211) to avoid the interruption of the cutting operation due to the fullness of a single dust collection box (211) and to achieve the continuity of indium phosphide powder collection and cutting operation. The secondary processing structure is located inside the dust collection box (211) and is used to perform secondary processing on the indium phosphide powder collected in the dust collection box (211). This secondary processing reduces the dustiness of the indium phosphide powder and suppresses the secondary diffusion of indium phosphide powder caused by air flow during subsequent powder processing.

2. The cutting equipment for indium phosphide processing according to claim 1, characterized in that: The swing flow guiding structure includes a connecting rod (202), a set of flow guiding plates (203) are symmetrically fixedly installed inside the flow guiding channel (201), a differential pressure sensor (204) and a laser dust concentration sensor (205) are fixedly installed on the inner top of the flow guiding channel (201), a fixing plate (206) is fixedly installed on the inner top of the flow guiding channel (201), and a micro servo motor (207) is fixedly installed on the bottom of the flow guiding channel (201).

3. A cutting device for indium phosphide processing according to claim 2, characterized in that: The output end of the micro servo motor (207) slides through the bottom of the guide channel (201) and extends upward. A rotating rod (208) is fixedly installed on the output end of the micro servo motor (207). The outer surface of the rotating rod (208) is rotatably connected to the inner wall of the fixed plate (206). A guide plate (209) is fixedly installed on the outer surface of the rotating rod (208). The bottom of the connecting rod (202) is fixedly connected to the top of the guide channel (201).

4. A cutting device for indium phosphide processing according to claim 1, characterized in that: The secondary processing structure includes a set of arc-shaped channels (210). One side of the outer surface of the set of arc-shaped channels (210) is fixedly connected to the outer surface of the guide channel (201). The other side of the outer surface of the set of arc-shaped channels (210) is fixedly connected to the outer surface of the dust collection box (211). A connecting pipe (212) is fixedly installed inside the set of dust collection boxes (211). The connecting pipe (212) is connected to the arc-shaped channels (210).

5. A cutting device for indium phosphide processing according to claim 4, characterized in that: One end of each of the connecting pipes (212) is fixedly connected to a miniature high-efficiency cyclone separator (213), and the outer surface of each of the miniature high-efficiency cyclone separators (213) is fixedly connected to an installation pipe (214). One end of each of the installation pipes (214) is fixedly connected to a filter cartridge (215), and one end of each of the filter cartridges (215) is fixedly connected to a conveying pipe (216). The outer surface of each of the filter cartridges (215) is provided with a base (217).

6. A cutting device for indium phosphide processing according to claim 5, characterized in that: A connecting plate (218) is fixedly installed on the inner wall of a set of dust collection boxes (211) near the center. One end of a set of conveying pipes (216) slides through the top of the connecting plate (218) and extends downward. The outer surface of a set of miniature high-efficiency cyclone separators (213) is fixedly installed on the inner wall of the connecting plate (218). A weighing sensor (219) is fixedly installed on the inner bottom of a set of dust collection boxes (211).

7. A cutting device for indium phosphide processing according to claim 6, characterized in that: A set of weighing sensors (219) are provided with a mounting plate (220) on the top. A set of mounting plates (220) are movably mounted with a collection bag (221) on the top. A set of dust collection boxes (211) are symmetrically provided with mounting grooves (222) near the bottom. A set of mounting grooves (222) are slidably connected with heat sealing strips (223) on the inner wall. A set of worktables (1) are symmetrically provided with sliding grooves (12) on the top.

8. A cutting device for indium phosphide processing according to claim 1, characterized in that: The outer surface of the powder guiding component (2) is provided with an auxiliary dustproof component (3), which is used to provide secondary protection against dust. The auxiliary dustproof component (3) includes a dust cover (301), the top of which is slidably connected to a diamond cutting machine body (302). An air outlet (303) is fixedly installed on the inner wall of the dust cover (301), and an air supply pipe (304) is fixedly connected to the outer surface of the air outlet (303). One end of the air supply pipe (304) slides through the inner wall of the dust cover (301) and extends to one side.

9. A cutting device for indium phosphide processing according to claim 8, characterized in that: A baffle (305) is fixedly installed at the top of the dust cover (301) near the center. An air curtain device body (306) is fixedly installed at the inner top of the dust cover (301) near the edge. The inner wall of the dust cover (301) is slidably connected to the outer surface of the guide channel (201). The bottom of the dust cover (301) is slidably connected to the inner wall of the sliding groove (12). The bottom of a set of dust storage boxes (211) is slidably connected to the top of the workbench (1).

10. A method of use for indium phosphide processing, applied to a cutting device for indium phosphide processing as described in claim 9, characterized in that, The specific usage steps are as follows: S1: Using an external device to drive the diamond cutting machine body (302) to move horizontally, the dust cover (301) slides in the sliding groove (12) to cover the indium phosphide to be cut. At this time, the external device drives the diamond cutting machine body (302) to descend for cutting. At the same time, the external elevator drives the connecting rod (202) to descend to block the powder outlet. Then, the air curtain device body (306) starts to spray airflow at the only outlet of the dust cover (301) to achieve complete sealing. Subsequently, the air supply solenoid valve of the total air source (one air tank) of the equipment is opened to deliver the low temperature airflow to the air supply pipe (304) and then spray it out through the air outlet (303) to reduce thermal stress. S2: Indium phosphide powder generated during the cutting process is transported to the inside of the guide channel (201) through the air outlet (303). The guide plate (203) can accelerate the flow of powder, while the differential pressure sensor (204) monitors the change in air resistance. The laser dust concentration sensor (205) monitors the air quality at the outlet. Then, the micro servo motor (207) is started by the external controller, so that the guide plate (209) starts to rotate to block one side, so that the powder can only enter the dust collection box (211) through an arc-shaped channel (210). S3: After the dust enters the dust collection box (211), it enters the miniature high-efficiency cyclone separator (213) through the connecting pipe (212). Most of the heavier dust is separated by centrifugal force here. The filter cartridge (215) connected by the mounting pipe (214) is used to capture fine dust. Then, the fine dust is discharged into the collection bag (221) through the conveying pipe (216), while the larger dust is directly discharged into the collection bag (221) along with the separation. At the same time, the weighing sensor (219) will send a signal to the external controller after reaching the weight. Before switching, the controller will first check the current switch. Whether the cutting state is in the idle stroke, select the best time to switch to avoid disturbing the cutting process. Then, the controller controls the motor to rotate the guide plate (209) to the other side. Finally, before taking out the collection bag (221), the electromagnetic drive component installed on the heat sealing strip (223) is energized to generate driving force, which drives the heat sealing strip (223) to move along the mounting groove (222). The moving heat sealing strip (223) applies a squeezing force to the opening of the collection bag (221) to achieve sealing, preventing the air disturbance inside the bag from causing the indium phosphide dust to spread when the collection bag (221) is taken out.

Images