Cantilever probe card for testing in low-temperature environment

Abstract

The invention discloses a cantilever probe card for testing in a low-temperature environment, and relates to the technical field of wafer testing, the cantilever probe card comprises a PCB and a plurality of probe clamping blocks, the plurality of probe clamping blocks are all located below the PCB and are arranged along the circumferential direction of the PCB, the probe clamping blocks are electrically connected with the PCB, a metal ring is fixedly arranged at the upper end part of the PCB, a rubber sealing gasket is fixedly arranged at the upper end part of the metal ring, and the probe clamping blocks are electrically connected with the PCB. The upper end part of the rubber sealing gasket is fixedly provided with a metal rear cover, an isolation layer is arranged between the metal ring and the PCB, the isolation layer is detachably connected with the PCB and the metal ring, the isolation layer is used for blocking an opening of the PCB, the lower end part of the PCB is provided with an adjusting piece, the plurality of probe clamping blocks are connected with the adjusting piece, the adjusting piece is used for adjusting the distance between the plurality of probe clamping blocks, and the adjusting piece is used for adjusting the distance between the plurality of probe clamping blocks. A plurality of locking pieces are arranged at the lower end part of the PCB, are in one-to-one correspondence with the probe clamping blocks, and are used for supporting and fixing the probe clamping blocks. The wafer testing method has the effect of improving the wafer testing stability.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, and in particular to a cantilever probe card for low-temperature environment testing. Background Technology

[0002] Currently, probe cards are precision interface cards that sit between automated testing systems and semiconductor wafers, used to test the functional parameters of semiconductor wafers before packaging. With the continuous development of semiconductor technology and the gradual improvement of standards, the introduction of low-temperature (-40℃) testing in the wafer probe testing stage has become a necessary issue.

[0003] Related technology can be found in Chinese patent application CN118731435A, which discloses a cantilever probe card, including: a circuit board with test contacts and grounding solder joints on both the top and bottom surfaces; a mounting base with its top fixed to the bottom surface of the circuit board and not in contact with the grounding solder joints; and a probe with its middle fixed to the bottom surface of the mounting base. The probe includes: a first conductor, a first insulating sleeve, and a second conductor. One end of the first conductor is electrically connected to the test contacts on the lower surface of the circuit board to transmit signals. The first insulating sleeve is fitted over the outer surface of the first conductor, and the second conductor is wrapped around the outer surface of the first insulating sleeve to isolate and insulate the first conductor and the second conductor. The second conductor is electrically connected to the mounting base and the grounding solder joint for grounding. The first conductor inside the probe transmits signals, while the second conductor on the outer layer is grounded, thus forming a grounding shield layer as early as possible to prevent external signals from affecting the signal transmission content of the probe and ensuring the integrity of the transmitted signal.

[0004] Regarding the aforementioned technologies, when the cantilever probe card is used under low temperature (-40℃) conditions, due to thermal expansion and contraction, gaps will gradually form between the components, resulting in air leakage. External cold air enters the cantilever probe card through the gaps, causing frost to form on the wafer surface, which prevents the test from being performed normally. Summary of the Invention

[0005] To improve the stability of wafer testing, this application provides a cantilever probe card for low-temperature environment testing.

[0006] This application provides a cantilever probe card for low-temperature environment testing, which adopts the following technical solution: A cantilever probe holder for low-temperature environment testing includes a PCB board and several probe holder blocks. The probe holder blocks are located below the PCB board and arranged circumferentially along the PCB board. The probe holder blocks are electrically connected to the PCB board. A metal ring is fixed to the upper end of the PCB board, a rubber sealing gasket is fixed to the upper end of the metal ring, and a metal back cover is fixed to the upper end of the rubber sealing gasket. An isolation layer is provided between the metal ring and the PCB board. The isolation layer is detachably connected to both the PCB board and the metal ring. The isolation layer is used to seal openings in the PCB board. An adjustment component is provided at the lower end of the PCB board, and the probe holder blocks are connected to the adjustment component. The adjustment component is used to adjust the spacing between the probe holder blocks. A number of locking components are provided at the lower end of the PCB board, each corresponding to a probe holder block. The locking components are used to support and fix the probe holder blocks.

[0007] By adopting the above technical solution, the PCB board and probe blocks work together to test the wafer. During the test, the metal ring is used to shield the surrounding electromagnetic field, and the rubber sealing gasket and metal back cover work together to prevent external air from entering the metal ring and the interior of the PCB board. Under low temperature conditions, due to thermal expansion and contraction, gaps may exist between components, leading to air leakage. The isolation layer seals the gaps between the metal ring and the PCB board, which helps to reduce the probability of cold air frosting on the wafer surface. The locking component supports and fixes the probe blocks, and the adjusting component is used to adjust the spacing between multiple probe blocks to adapt to wafers of different specifications, thereby improving the stability of wafer testing.

[0008] Optionally, a ceramic ring is provided at the lower end of the PCB board. The ceramic ring is slidably connected to the PCB board vertically. The side of the ceramic ring away from the PCB board is connected to several locking components. A buffer component is provided between the ceramic ring and the PCB board to buffer the movement of the ceramic ring.

[0009] By adopting the above technical solution, the ceramic ring and the probe block work together to form a controllable impedance environment, and the buffer buffers the movement of the ceramic ring, thereby improving signal integrity.

[0010] Optionally, the buffer includes a support ring and several first springs. The support ring is fixedly connected to the lower end of the PCB board and located directly above the ceramic ring. The several first springs are all fixedly connected to the lower end of the support ring, and the end of the first spring away from the support ring is fixedly connected to the ceramic ring.

[0011] By adopting the above technical solution, since some wafers may have an oxide layer, during testing, the probe card needs to penetrate the oxide layer to contact the wafer. When the probe card contacts the oxide layer, the PCB board moves the support ring downward and squeezes the first spring. When the probe card passes through the oxide layer and contacts the wafer, the first spring resets and pushes the ceramic ring downward, so that the probe card fits tightly with the wafer, improving the accuracy of the test results and reducing the probability of probe card damage.

[0012] Optionally, a movable cylinder is fitted on the outer side of the PCB board. The movable cylinder is slidably connected to the PCB board vertically. Several second springs are provided between the movable cylinder and the PCB board. The two ends of the second springs are fixedly connected to the PCB board and the movable cylinder, respectively. In the natural state, the second springs push the PCB board to move upward. An air inlet and an air outlet are opened on the outer side of the movable cylinder. An air source component is fixed on the outer side of the movable cylinder, and the air source component is directly opposite the air inlet.

[0013] By adopting the above technical solution, under low temperature conditions, the moving cylinder is used to block cold air from entering below the PCB board. During the downward movement of the PCB board, the moving cylinder first contacts the wafer. As the PCB board continues to move downward, it squeezes the second spring, which pushes the moving cylinder downward, making the moving cylinder fit tightly against the wafer. The air source delivers dry gas into the moving cylinder through the air inlet, and the air inside the moving cylinder is discharged through the air outlet, keeping the gas inside the moving cylinder dry at all times, thus improving the accuracy of the test results under low temperature conditions.

[0014] Optionally, the adjusting component includes a support plate, several movable blocks, several first connecting rods, several second connecting rods, and two electric telescopic rods. The support plate is fixedly connected to the lower end of the PCB board and is arranged circumferentially along the PCB board. The movable blocks are all located at the lower end of the support plate and are evenly arranged circumferentially along the support plate. The movable blocks are slidably connected to the support plate radially. The probe clips correspond one-to-one with the movable blocks and are hinged to the lower end of the movable blocks. The first connecting rods correspond one-to-one with the movable blocks and are hinged to one side of the movable block along its length. The second connecting rods correspond one-to-one with the movable blocks and are hinged to the side of the movable block away from the first connecting rod. The first and second connecting rods of any two adjacent movable blocks are hinged to each other. The two electric telescopic rods are fixedly connected to the lower end of the support plate and are located on both sides of the support plate radially. The output end of the electric telescopic rod is hinged to the connection point of the first and second connecting rods.

[0015] By adopting the above technical solution, the support plate supports the moving block, and the moving block supports the probe card block. When it is necessary to adjust the spacing between multiple probe card blocks, the electric telescopic rod pushes the first connecting rod and the second connecting rod to rotate. The multiple first connecting rods and the second connecting rod cooperate to move all the moving blocks away from each other, thereby making the multiple probe card blocks move away from each other, which improves the convenience of adjusting the spacing between the probe card blocks.

[0016] Optionally, the locking mechanism includes a first support block, a second support block, two positioning blocks, two locking blocks, two third springs, two connecting parts, and a pushing part. The first support block is fixedly connected to the lower end of the ceramic ring. The lower end of the first support block has storage grooves on both sides along its length. The locking blocks are located within the storage grooves and are slidably connected to the first support block along its length. Each third spring corresponds to one of the locking blocks and is located within a storage groove. The two ends of the third springs are fixedly connected to the first support block and the locking blocks, respectively. The lower end of each locking block is inclined from bottom to top along the direction from the third spring towards the locking block. In its natural state... The third spring pushes the locking block to move away from the first support block. The second support block is located below the first support block and is parallel to the first support block. Two positioning blocks are located on both sides of the second support block along its length. Both sides of the second support block along its length have a moving groove, which corresponds to a connecting piece. The connecting piece is located in the moving groove and connected to the positioning block. A locking groove is opened vertically on the side of the two positioning blocks that are close to each other. The length of the locking groove is greater than the length of the locking block. A positioning groove is opened at the lower end of the first support block. The pushing piece is located in the positioning groove and pushes the probe locking block closer to the second support block.

[0017] By adopting the above technical solution, when the probe block and locking component are spliced, the upper end face of the probe block is located in the positioning groove and fits against the pushing component. The connecting component is used to connect the second support block and the two positioning blocks. When the first support block and the second support block are spliced, the upper end of the positioning block contacts the lower end of the locking block. The positioning block pushes the locking block to move into the receiving groove and squeezes the third spring. When the locking block is aligned with the locking groove, the third spring pushes the locking block, so that the locking block is located in the locking groove, completing the splicing operation of the first support block and the second support block. When it is necessary to separate the first support block and the second support block, the second support block is moved upward, the connecting component moves in the moving groove, and the positioning block moves away from the second support block, thereby separating the locking block from the locking groove. During the process of multiple probe blocks moving away from each other, the probe blocks will rotate. The pushing component provides sufficient moving space for the probe blocks, improving the convenience of connecting and fixing the probe blocks.

[0018] Optionally, the pushing component includes a pushing plate and several fourth springs. The pushing plate is located in the positioning groove and is slidably connected to the first support block in the vertical direction. The several fourth springs are all located at the upper end of the pushing plate. The two ends of the fourth springs are fixedly connected to the pushing plate and the first support block, respectively. In the natural state, the fourth springs cause the pushing plate to move downward.

[0019] By adopting the above technical solution, when the probe blocks move away from each other, the probe blocks will rotate. In order to prevent the probe blocks from being damaged, the probe blocks drive the push plate to move upward and squeeze the fourth spring. The fourth spring resets and drives the push plate to move downward, so that the probe blocks are always in a stable state, which helps to reduce the probability of the probe blocks shaking.

[0020] Optionally, the connecting component includes a push block, a moving rod, a limiting block, an elastic element, and several spring telescopic rods. The push block is fixedly connected to the lower end of the first support block and faces the moving groove. The moving rod is located in the moving groove and is slidably connected to the second support block. The end of the moving rod near the positioning block is fixedly connected to the positioning block. The second support block has several limiting grooves that communicate with the moving groove. The limiting grooves are located above the moving groove. The limiting block is fixedly connected to the upper end of the moving rod and is located in the limiting groove. Several spring telescopic rods are all located in the moving groove and below the moving rod. The lower end of the spring telescopic rod is fixedly connected to the second support block, and the upper end of the spring telescopic rod abuts against the moving rod. The spring telescopic rod pushes the moving rod upward. The elastic element is located in the moving groove and is located on the side of the moving rod away from the positioning block. One end of the elastic element is fixedly connected to the second support block, and the other end of the elastic element abuts against the moving rod.

[0021] By adopting the above technical solution, when it is necessary to separate the first support block and the second support block, the second support block is moved upward, the locking block slides in the locking groove, the pushing block pushes the moving rod downward and squeezes the spring telescopic rod, the limiting block separates from the limiting groove, at this time the elastic element pushes the moving rod to slide in the moving groove and move away from the elastic element, the moving rod drives the positioning block to move, so that the locking block separates from the locking groove. When the limiting block is aligned with other limiting grooves, the spring telescopic rod resets and pushes the moving rod upward, so that the limiting block is located in the limiting groove, thereby realizing the positioning operation of the moving rod and improving the convenience of separating the first support block and the second support block.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. The PCB board and probe blocks work together to test the wafer. During the test, the metal ring is used to shield the surrounding electromagnetic field, and the rubber sealing gasket and metal back cover work together to prevent outside air from entering the metal ring and the interior of the PCB board. Under low temperature conditions, due to thermal expansion and contraction, gaps may exist between components, leading to air leakage. The isolation layer seals the gaps between the metal ring and the PCB board, which helps to reduce the probability of cold air frosting on the wafer surface. The locking component supports and fixes the probe blocks, and the adjusting component is used to adjust the spacing between multiple probe blocks to adapt to wafers of different specifications, thereby improving the stability of wafer testing. 2. The support plate supports the moving block, and the moving block supports the probe card block. When it is necessary to adjust the spacing between multiple probe card blocks, the electric telescopic rod pushes the first connecting rod and the second connecting rod to rotate. The multiple first connecting rods and the second connecting rod cooperate to move all the moving blocks away from each other, thereby making the multiple probe card blocks move away from each other, which improves the convenience of adjusting the spacing between the probe card blocks. 3. When the probe block and locking component are assembled, the upper surface of the probe block is located in the positioning groove and is in contact with the pushing component. The connecting component is used to connect the second support block and the two positioning blocks. When the first support block and the second support block are assembled, the upper end of the positioning block contacts the lower end of the locking block. The positioning block pushes the locking block into the receiving groove and compresses the third spring. When the locking block is aligned with the locking groove, the third spring pushes the locking block so that the locking block is located in the locking groove, completing the assembly operation of the first support block and the second support block. When it is necessary to separate the first support block and the second support block, the second support block is moved upward, the connecting component moves in the moving groove, and the positioning block moves away from the second support block, thereby separating the locking block from the locking groove. During the process of multiple probe blocks moving away from each other, the probe blocks will rotate. The pushing component provides sufficient moving space for the probe blocks, improving the convenience of connecting and fixing the probe blocks. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of a cantilever probe card for low-temperature environment testing.

[0024] Figure 2 This is a schematic diagram of the internal structure of the movable cylinder.

[0025] Figure 3 yes Figure 2 An enlarged schematic diagram of part A in the middle.

[0026] Figure 4 This is a schematic diagram of the adjusting component structure.

[0027] Figure 5 This is a schematic diagram showing the positional relationship between the probe block and the locking element.

[0028] Figure 6 This is a schematic diagram of the locking mechanism structure.

[0029] Explanation of reference numerals in the attached diagram: 1. PCB board; 11. Probe block; 12. Metal ring; 13. Rubber sealing gasket; 14. Metal back cover; 15. Ceramic ring; 16. Isolation layer; 17. Moving cylinder; 171. Second spring; 172. Air inlet; 173. Air outlet; 174. Air source component; 2. Adjusting component; 21. Support plate; 22. Moving block; 23. First connecting rod; 24. Second connecting rod; 25. Electric telescopic rod; 3. Locking component; 31. First support block; 3 11. Storage slot; 312. Positioning slot; 32. Second support block; 321. Moving slot; 33. Positioning block; 331. Snap-fit ​​slot; 34. Snap-fit ​​block; 35. Third spring; 36. Pushing component; 361. Pushing plate; 362. Fourth spring; 37. Connecting component; 371. Pushing block; 372. Moving rod; 373. Limiting block; 374. Elastic component; 375. Spring telescopic rod; 376. Limiting slot; 4. Buffer component; 41. Support ring; 42. First spring. Detailed Implementation

[0030] The present application will be further described in detail below with reference to all the accompanying drawings.

[0031] This application discloses a cantilever probe card for low-temperature environment testing. Example

[0032] Reference Figure 1 A cantilever probe card for low-temperature environment testing includes a PCB board 1 and multiple probe card blocks 11. The probe card blocks 11 are all located below the PCB board 1 and arranged circumferentially along the PCB board 1. The probe card blocks 11 are electrically connected to the PCB board 1, and the PCB board 1 and probe card blocks 11 cooperate to test a wafer. A metal ring 12 is fixed to the upper end of the PCB board 1, a rubber sealing gasket 13 is fixed to the upper end of the metal ring 12, and a metal back cover 14 is fixed to the upper end of the rubber sealing gasket 13. The metal ring 12 is used to shield against surrounding electromagnetic interference, and the rubber sealing gasket 13 and the metal back cover 14 cooperate to prevent external air from entering the metal ring 12 and the interior of the PCB board 1.

[0033] Reference Figure 1 and Figure 2 An isolation layer 16 is provided between the metal ring 12 and the PCB board 1. The isolation layer 16 is a film made of Mylar material (PET polyester film). The isolation layer 16 can be detachably connected to both the PCB board 1 and the metal ring 12. Under low temperature conditions, due to thermal expansion and contraction, gaps may exist between components, leading to air leakage. The isolation layer 16 seals the gaps between the metal ring 12 and the PCB board 1, which helps to reduce the probability of cold air frosting on the wafer surface.

[0034] Reference Figure 1 and Figure 2A movable cylinder 17 is fitted on the outer side of the PCB board 1. The movable cylinder 17 is slidably connected to the PCB board 1 vertically. Multiple second springs 171 are provided between the movable cylinder 17 and the PCB board 1. The two ends of the second springs 171 are fixedly connected to the PCB board 1 and the movable cylinder 17 respectively. Under normal conditions, the second springs 171 push the PCB board 1 to move upward. Under low temperature conditions, the movable cylinder 17 is used to block the cold air from entering the lower part of the PCB board 1. During the downward movement of the PCB board 1, the movable cylinder 17 first contacts the wafer. During the continued downward movement of the PCB board 1, the PCB board 1 squeezes the second springs 171. The second springs 171 push the movable cylinder 17 downward, so that the movable cylinder 17 is in close contact with the wafer.

[0035] Reference Figure 1 and Figure 2 The movable cylinder 17 has an air inlet 172 and an air outlet 173 on its outer side. An air source component 174 is fixed on the outer side of the movable cylinder 17. The air source component 174 can be a fan. The air source component 174 is directly opposite the air inlet 172. The air source component 174 delivers dry gas into the movable cylinder 17 through the air inlet 172. The air inside the movable cylinder 17 is discharged through the air outlet 173, so that the gas inside the movable cylinder 17 is always in a dry state.

[0036] Reference Figure 2 The lower end of the PCB board 1 is provided with an adjustment component 2, to which multiple probe clips 11 are connected. The adjustment component 2 is used to adjust the spacing between the multiple probe clips 11. The lower end of the PCB board 1 is provided with multiple locking components 3, which correspond one-to-one with the probe clips 11 and are used to support and fix the probe clips 11. The lower end of the PCB board 1 is provided with a ceramic ring 15, which is slidably connected to the PCB board 1 vertically. The side of the ceramic ring 15 away from the PCB board 1 is connected to the multiple locking components 3. The ceramic ring 15 and the probe clips 11 cooperate to form a controllable impedance environment, improving signal integrity.

[0037] Reference Figure 3A buffer 4 is provided between the ceramic ring 15 and the PCB board 1. The buffer 4 includes multiple first springs 42 of the support ring 41. The support ring 41 is fixedly connected to the lower end of the PCB board 1 and is located directly above the ceramic ring 15. The multiple first springs 42 are all fixedly connected to the lower end of the support ring 41. The end of the first spring 42 away from the support ring 41 is fixedly connected to the ceramic ring 15. Since some wafers may have an oxide layer, during testing, the probe card block 11 needs to penetrate the oxide layer to contact the wafer. When the probe card block 11 contacts the oxide layer, the PCB board 1 drives the support ring 41 to move downward and squeezes the first springs 42. When the probe card block 11 passes through the oxide layer and contacts the wafer, the first springs 42 reset and push the ceramic ring 15 downward, so that the probe card block 11 fits tightly with the wafer, which improves the accuracy of the test results and reduces the probability of damage to the probe card block 11.

[0038] Reference Figure 4 The adjusting component 2 includes a support plate 21, multiple moving blocks 22, multiple first connecting rods 23, multiple second connecting rods 24, and two electric telescopic rods 25. The support plate 21 is fixedly connected to the lower end of the PCB board 1 and is arranged around the circumference of the PCB board 1. The multiple moving blocks 22 are all located at the lower end of the support plate 21 and are evenly arranged around the circumference of the support plate 21. The moving blocks 22 are slidably connected to the support plate 21 along the radial direction of the support block. The support plate 21 supports and guides the moving blocks 22.

[0039] Reference Figure 4 The probe block 11 and the moving block 22 correspond one-to-one. The lower ends of the probe block 11 and the moving block 22 are hinged together, and the moving block 22 supports the probe block 11. The first connecting rod 23 corresponds to the moving block 22 one by one, and the first connecting rod 23 is hinged to one side of the moving block 22 along the length direction. The second connecting rod 24 corresponds to the moving block 22 one by one, and the second connecting rod 24 is hinged to the side of the moving block 22 away from the first connecting rod 23. The first connecting rod 23 and the second connecting rod 24 of any two adjacent moving blocks 22 are hinged to each other. The two electric telescopic rods 25 are fixedly connected to the lower end of the support plate 21. The two electric telescopic rods 25 are located on both sides of the support plate 21 along the radial direction. The output end of the electric telescopic rod 25 is hinged to the connection between the first connecting rod 23 and the second connecting rod 24. When it is necessary to adjust the spacing between multiple probe blocks 11, the electric telescopic rod 25 pushes the first connecting rod 23 and the second connecting rod 24 to rotate. The multiple first connecting rods 23 and the second connecting rod 24 cooperate to make all the moving blocks 22 move away from each other, thereby making the multiple probe blocks 11 move away from each other.

[0040] Reference Figure 5 and Figure 6The locking component 3 includes a first support block 31, a second support block 32, two positioning blocks 33, two snap-fit ​​blocks 34, two third springs 35, two connecting components 37, and a pushing component 36. The first support block 31 is fixedly connected to the lower end of the ceramic ring 15. The lower end of the first support block 31 has a positioning groove 312. The ceramic ring 15 supports the first support block 31. The probe snap-fit ​​block 11 is located in the positioning groove 312, and the positioning groove 312 limits the probe snap-fit ​​block 11.

[0041] Reference Figure 5 and Figure 6 The second support block 32 is located below the first support block 31 and is arranged parallel to the first support block 31. Two positioning blocks 33 are located on both sides of the second support block 32 along the length direction. The second support block 32 has a moving groove 321 on both sides along the length direction. The moving groove 321 corresponds to the connecting piece 37. The connecting piece 37 is located in the moving groove 321 and is connected to the positioning block 33. The second support block 32 and the connecting piece 37 cooperate to position the positioning block 33.

[0042] Reference Figure 5 and Figure 6 The first support block 31 has storage grooves 311 on both sides of its lower end along its length. A snap-fit ​​block 34 is located within the storage groove 311 and is slidably connected to the first support block 31 along its length. A third spring 35 corresponds to each snap-fit ​​block 34. The third spring 35 is located within the storage groove 311, and its two ends are fixedly connected to the first support block 31 and the snap-fit ​​block 34, respectively. The lower end of the snap-fit ​​block 34 is inclined from bottom to top along the direction from the third spring 35 to the snap-fit ​​block 34. A snap-fit ​​groove 331 is vertically formed on the side where the two positioning blocks 33 are close together. The length of the snap-fit ​​groove 331 is greater than the length of the snap-fit ​​block 34. When the first support block 31 and the second support block 32 are joined... The upper end of the positioning block 33 contacts the lower end of the snap-fit ​​block 34. The positioning block 33 pushes the snap-fit ​​block 34 into the receiving groove 311 and squeezes the third spring 35. When the snap-fit ​​block 34 is aligned with the snap-fit ​​groove 331, the third spring 35 pushes the snap-fit ​​block 34 so that the snap-fit ​​block 34 is located in the snap-fit ​​groove 331, completing the splicing operation of the first support block 31 and the second support block 32. When it is necessary to separate the first support block 31 and the second support block 32, the second support block 32 is moved upward, the snap-fit ​​block 34 slides in the snap-fit ​​groove 331, the connector 37 moves in the moving groove 321, and the positioning block 33 moves away from the second support block 32, thereby separating the snap-fit ​​block 34 from the snap-fit ​​groove 331.

[0043] Reference Figure 5 and Figure 6The pusher 36 is located within the positioning groove 312. As the multiple probe blocks 11 move away from each other, the probe blocks 11 rotate. The pusher 36 provides sufficient space for the probe blocks 11 to move. The pusher 36 includes a push plate 361 and multiple fourth springs 362. The push plate 361 is located within the positioning groove 312 and is slidably connected to the first support block 31 in a vertical direction. The multiple fourth springs 362 are all located at the upper end of the push plate 361. The two ends of the fourth springs 362 are fixedly connected to the push plate 361 and the first support block 31, respectively. In its natural state, the fourth springs 362 cause the push plate 361 to move downward. When the probe blocks 11 move away from each other, the probe blocks 11 rotate. To prevent damage to the probe blocks 11, the probe blocks 11 drive the push plate 361 to move upward and squeeze the fourth springs 362. The fourth springs 362 reset and drive the push plate 361 to move downward, so that the probe blocks 11 are always in a stable state.

[0044] Reference Figure 5 and Figure 6 The connecting member 37 includes a pushing block 371, a moving rod 372, a limiting block 373, an elastic element 374, and a plurality of spring telescopic rods 375. The moving rod 372 is located in the moving groove 321 and is slidably connected to the second support block 32. The plurality of spring telescopic rods 375 are all located in the moving groove 321 and below the moving rod 372. The lower end of the spring telescopic rod 375 is fixedly connected to the second support block 32, and the upper end of the spring telescopic rod 375 abuts against the moving rod 372. The spring telescopic rod 375 supports the moving rod 372 and pushes the moving rod 372 to move upward.

[0045] Reference Figure 5 and Figure 6The second support block 32 has multiple limiting grooves 376 that communicate with the moving groove 321. The limiting grooves 376 are located above the moving groove 321. A limiting block 373 is fixedly connected to the upper end of the moving rod 372 and is located within the limiting groove 376. An elastic element 374 is located within the moving groove 321 and on the side of the moving rod 372 away from the positioning block 33. The elastic element 374 is a spring. One end of the elastic element 374 is fixedly connected to the second support block 32, and the other end of the elastic element 374 abuts against the moving rod 372. The end of the moving rod 372 near the positioning block 33 is fixedly connected to the positioning block 33. A pushing block 371 is fixedly connected to the lower end of the first support block 31 and is located directly above the moving rod 372. When it is necessary to move the first support block 372... When the support block 31 and the second support block 32 separate, the second support block 32 moves upward, the locking block 34 slides in the locking groove 331, the pushing block 371 pushes the moving rod 372 downward and squeezes the spring telescopic rod 375, the limiting block 373 separates from the limiting groove 376, at this time the elastic element 374 pushes the moving rod 372 to slide in the moving groove 321 and move away from the elastic element 374, the moving rod 372 drives the positioning block 33 to move, so that the locking block 34 separates from the locking groove 331. When the limiting block 373 is aligned with other limiting grooves 376, the spring telescopic rod 375 resets, pushes the moving rod 372 upward, so that the limiting block 373 is located in the limiting groove 376, thereby realizing the positioning operation of the moving rod 372.

[0046] The implementation principle of a cantilever probe card for low-temperature environment testing according to an embodiment of this application is as follows: During the testing process, the metal ring 12 is used to shield the surrounding electromagnetic field. The rubber sealing gasket 13 and the metal back cover 14 work together to prevent external air from entering the interior of the metal ring 12 and the PCB board 1. The ceramic ring 15 works with the probe card block 11 to form a controllable resistance environment. Under low-temperature conditions, the moving cylinder 17 is used to prevent cold air from entering below the PCB board 1. During the downward movement of the PCB board 1, the moving cylinder 17 first contacts the wafer. As the PCB board 1 continues to move downward, the PCB board 1 compresses the second spring 171. The second spring 171 pushes the moving cylinder 17 downward, so that the moving cylinder 17 fits tightly with the wafer. The gas source 174 delivers dry gas into the moving cylinder 17 through the air inlet 172. The air inside the moving cylinder 17 is discharged through the air outlet 173, so that the gas inside the moving cylinder 17 is always in a dry state, which improves the accuracy of the test results under low-temperature conditions.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A cantilever probe card for low-temperature environment testing, comprising a PCB board (1) and a plurality of probe card blocks (11), wherein the plurality of probe card blocks (11) are all located below the PCB board (1) and arranged circumferentially along the PCB board (1), and the probe card blocks (11) are electrically connected to the PCB board (1), characterized in that: A metal ring (12) is fixed at the upper end of the PCB board (1), a rubber sealing gasket (13) is fixed at the upper end of the metal ring (12), a metal back cover (14) is fixed at the upper end of the rubber sealing gasket (13), an isolation layer (16) is provided between the metal ring (12) and the PCB board (1), the isolation layer (16) is detachably connected to both the PCB board (1) and the metal ring (12), the isolation layer (16) is used to seal the opening of the PCB board (1), an adjustment component (2) is provided at the lower end of the PCB board (1), a number of probe clips (11) are connected to the adjustment component (2), the adjustment component (2) is used to adjust the spacing between the number of probe clips (11), a number of locking components (3) are provided at the lower end of the PCB board (1), the locking components (3) correspond one-to-one with the probe clips (11), the locking components (3) are used to support and fix the probe clips (11).

2. The cantilever probe card for low-temperature environment testing according to claim 1, characterized in that: The lower end of the PCB board (1) is provided with a ceramic ring (15), which is slidably connected to the PCB board (1) in the vertical direction. The side of the ceramic ring (15) away from the PCB board (1) is connected to several locking parts (3). A buffer part (4) is provided between the ceramic ring (15) and the PCB board (1), which is used to buffer the movement of the ceramic ring (15).

3. The cantilever probe card for low-temperature environment testing according to claim 2, characterized in that: The buffer (4) includes a support ring (41) and a plurality of first springs (42). The support ring (41) is fixedly connected to the lower end of the PCB board (1) and located directly above the ceramic ring (15). The plurality of first springs (42) are all fixedly connected to the lower end of the support ring (41). The end of the first spring (42) away from the support ring (41) is fixedly connected to the ceramic ring (15).

4. The cantilever probe card for low-temperature environment testing according to claim 1, characterized in that: A movable cylinder (17) is sleeved on the outside of the PCB board (1). The movable cylinder (17) is slidably connected to the PCB board (1) in the vertical direction. Several second springs (171) are provided between the movable cylinder (17) and the PCB board (1). The two ends of the second springs (171) are fixedly connected to the PCB board (1) and the movable cylinder (17) respectively. In the natural state, the second springs (171) push the PCB board (1) to move upward. An air inlet (172) and an air outlet (173) are opened on the outside of the movable cylinder (17). An air source component (174) is fixed on the outside of the movable cylinder (17). The air source component (174) is directly opposite the air inlet (172).

5. A cantilever probe card for low-temperature environment testing according to claim 1, characterized in that: The adjusting component (2) includes a support plate (21), several movable blocks (22), several first connecting rods (23), several second connecting rods (24), and two electric telescopic rods (25). The support plate (21) is fixedly connected to the lower end of the PCB board (1) and is arranged circumferentially along the PCB board (1). Several movable blocks (22) are all located at the lower end of the support plate (21) and are evenly arranged circumferentially along the support plate (21). The movable blocks (22) are slidably connected to the support plate (21) radially. The probe clip (11) corresponds to the movable block (22) one by one. The lower end of the probe clip (11) is hinged to the lower end of the movable block (22). The first connecting rods (23) are connected to the movable blocks (24). 22) One-to-one correspondence, the first connecting rod (23) is hinged to one side of the moving block (22) along the length direction, the second connecting rod (24) corresponds one-to-one with the moving block (22), the second connecting rod (24) is hinged to the side of the moving block (22) away from the first connecting rod (23), the first connecting rod (23) and the second connecting rod (24) of any two adjacent moving blocks (22) are hinged to each other, the two electric telescopic rods (25) are fixedly connected to the lower end of the support plate (21), the two electric telescopic rods (25) are respectively located on both sides of the support plate (21) along the radial direction, and the output end of the electric telescopic rod (25) is hinged to the connection of the first connecting rod (23) and the second connecting rod (24).

6. The cantilever probe card for low-temperature environment testing according to claim 1, characterized in that: The locking component (3) includes a first support block (31), a second support block (32), two positioning blocks (33), two snap-fit ​​blocks (34), two third springs (35), two connecting components (37), and a pushing component (36). The first support block (31) is fixedly connected to the lower end of the ceramic ring (15). The lower end of the first support block (31) has a storage groove (311) on both sides along the length direction. The snap-fit ​​block (34) is located in the storage groove (311) and is slidably connected to the first support block (31) along the length direction of the first support block (31). The third springs (35) correspond one-to-one with the snap-fit ​​blocks (34). The third springs (35) are located in the storage grooves (311). The two ends of the third springs (35) are fixedly connected to the first support block (31) and the snap-fit ​​blocks (34) respectively. The lower end of the snap-fit ​​block (34) is inclined from bottom to top along the direction from the third spring (35) to the snap-fit ​​block (34). In its natural state, the third springs (35) are slidably connected to the first support block (31) and the snap-fit ​​blocks (34). Spring (35) pushes snap-fit ​​block (34) to move away from first support block (31). Second support block (32) is located below first support block (31) and is parallel to first support block (31). Two positioning blocks (33) are located on both sides of second support block (32) along its length. Movable grooves (321) are opened on both sides of second support block (32) along its length. Movable grooves (321) correspond one-to-one with connectors (37). The component (37) is located in the moving groove (321) and connected to the positioning block (33). The two positioning blocks (33) are provided with a vertically opening snap-fit ​​groove (331) on the side that is close to each other. The length of the snap-fit ​​groove (331) is greater than the length of the snap-fit ​​block (34). The lower end of the first support block (31) is provided with a positioning groove (312). The pusher (36) is located in the positioning groove (312). The pusher (36) pushes the probe snap-fit ​​block (11) closer to the second support block (32).

7. A cantilever probe card for low-temperature environment testing according to claim 6, characterized in that: The pusher (36) includes a push plate (361) and a plurality of fourth springs (362). The push plate (361) is located in the positioning groove (312) and is slidably connected to the first support block (31) in the vertical direction. The plurality of fourth springs (362) are all located at the upper end of the push plate (361). The two ends of the fourth springs (362) are fixedly connected to the push plate (361) and the first support block (31) respectively. In the natural state, the fourth springs (362) cause the push plate (361) to move downward.

8. A cantilever probe card for low-temperature environment testing according to claim 6, characterized in that: The connecting member (37) includes a pushing block (371), a moving rod (372), a limiting block (373), an elastic element (374), and several spring telescopic rods (375). The pushing block (371) is fixedly connected to the lower end of the first support block (31) and faces the moving groove (321). The moving rod (372) is located in the moving groove (321) and is slidably connected to the second support block (32). The end of the moving rod (372) near the positioning block (33) is fixedly connected to the positioning block (33). The second support block (32) has several limiting grooves (376) communicating with the moving groove (321). The limiting grooves (376) are located above the moving groove (321). The limiting block (373) is fixedly connected to the moving rod (375). At the upper end of 372, the limiting block (373) is located in the limiting groove (376), and several spring telescopic rods (375) are located in the moving groove (321) and below the moving rod (372). The lower end of the spring telescopic rod (375) is fixedly connected to the second support block (32), and the upper end of the spring telescopic rod (375) abuts against the moving rod (372). The spring telescopic rod (375) pushes the moving rod (372) to move upward. The elastic element (374) is located in the moving groove (321) and on the side of the moving rod (372) away from the positioning block (33). One end of the elastic element (374) is fixedly connected to the second support block (32), and the other end of the elastic element (374) abuts against the moving rod (372).

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