Bonding repair method

Abstract

In a bonding process in which two objects to be bonded are bonded to a bonding target portion set in the facing surfaces thereof, when an unbonded portion is generated in at least a portion of the bonding target portion, a bonding repair method repairs the bonded state of the unbonded portion by irradiating the unbonded portion with laser light.

Description

Technical Field

[0001] This invention relates to laser-based bonding techniques. Background Technology

[0002] As a semiconductor device manufacturing technology, there exists a process for bonding two semiconductor wafers (hereinafter referred to as "bonding process"). For example, Patent Document 1 describes a technique in which, with two semiconductor wafers overlapping, pressure is applied from the back side of one wafer using gas or liquid while pressure is applied from the back side of the other wafer, thereby clamping the two semiconductor wafers together, and in this state, laser light is irradiated onto their opposite surfaces, thereby bonding the semiconductor wafers together.

[0003] In recent years, this bonding process has been used in semiconductor device manufacturing technology to seal sensors (accelerometers or gyroscopes, etc.) or micromechanical devices (actuators, etc.) within devices, or to manufacture semiconductor devices with stacked chips in a three-dimensional structure.

[0004] Existing technical documents

[0005] Patent documents

[0006] [Patent Document 1] Japanese Patent Application No. 2022-92779 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] On the other hand, in the aforementioned bonding process, as described in Patent Document 1, when clamping semiconductor wafers in an overlapping state, a holding portion is sometimes required to hold the semiconductor wafer. In this case, even if the portion of the semiconductor wafer held by the holding portion needs to be bonded, it cannot be irradiated with a laser, and that portion becomes an unbonded portion. If such an unbonded portion occurs, it may result in the waste of that portion, or adverse effects on the processing or equipment in subsequent processes (such as dicing processes) (adverse effects caused by vibration or peeling of the semiconductor wafer, etc.).

[0009] Furthermore, even if a laser can be applied to the portion held by the holding part, if appropriate pressure cannot be applied to that portion during the preceding process (the process of clamping the semiconductor wafer), it may result in poor bonding and the portion becoming an unbonded part. This problem can also occur when bonding the semiconductor wafer by heating the entire assembly under clamping conditions. Specifically, where the aforementioned holding part is required, the same problem may arise in the portion held by the holding part, even if bonding is required, due to insufficient clamping pressure.

[0010] Therefore, the object of the present invention is to provide a technology that can form a good bonding state between bonding objects, even when unbonded portions may occur in the bonding process of bonding objects such as semiconductor wafers.

[0011] Methods for solving problems

[0012] The joint repair method of the present invention is a joint process in which two joint objects are joined at joint target portions set in their opposite surfaces. When at least a portion of the joint target portion has an unjoined portion, the joint state of the unjoined portion is repaired by irradiating the unjoined portion with a laser.

[0013] According to the above-described joint repair method, by using a laser, the heating position can be limited to the unjoined portion. As a result, while repairing the joint state of the unjoined portion, adverse effects caused by heat or light on the parts other than the unjoined portion can be prevented.

[0014] Invention Effects

[0015] According to the present invention, even if unjoined portions may occur during the joining process, a good joining state can be formed between the joining objects. Attached Figure Description

[0016] Figure 1 (A) is a cross-sectional view conceptually illustrating an example of two objects being joined in a joining process. Figure 1 (B) is a plan view showing the result after removing one of the two joining objects.

[0017] Figure 2 (A) and Figure 2 (B) is a conceptual diagram showing an example of a joining device used in a joining process. Figure 2 (A) shows the state where the second platform has been raised. Figure 2 (B) shows the state where the second platform has been lowered.

[0018] Figure 3 This is a conceptual diagram showing a state where an unjoined portion has been created at the joint target.

[0019] Figure 4 (A) is a conceptual diagram illustrating an example of a joint repair device used in the joint repair method of the embodiment. Figure 4 (B) is a plan view showing an example of the first support portion used in the embodiment.

[0020] Figure 5 (A) is a plan view conceptually showing the configuration of the joint object on the support mechanism of the joint repair device. Figure 5(B) is a plan view conceptually showing the configuration of the joint object when it is rotated in a circumferential direction.

[0021] Figure 6 (A) and Figure 6 (B) is a conceptual diagram showing the detour section and the linear section, which are redesigned as the engagement target section to avoid the clamping object. Detailed Implementation

[0022] [1] Joining process

[0023] [1-1] Joining objects

[0024] Figure 1 (A) and Figure 1 (B) is a cross-sectional and plan view conceptually illustrating an example of two bonding objects 101 and 102 being bonded in a bonding process. Bonding objects 101 and 102 are substrates made of a substrate such as a semiconductor wafer. Furthermore, Figure 1 (A) is Figure 1 (B) shows a cross-sectional view of line IA-IA. Furthermore, Figure 1 (B) is the plane shown after removing one of the two joining objects 101 and 102, joining object 102.

[0025] exist Figure 1 (A) and Figure 1 In example (B), the bonding object 101 includes multiple device regions Rd that are monolithically divided by cutting along the cutting line Ct. Each device region Rd becomes the base portion of the device by being monolithically divided. Furthermore, in each device region Rd, a recess 103 is provided to form an internal cavity of the device. Here, the cavity is a sealed space used to seal the component 104 that performs the function of the device. The component 104 is a sensor (accelerometer or gyroscope sensor, etc.), a micromachine (actuator, etc.), an electronic circuit, etc.

[0026] The joining object 102 is joined to the joining object 101 after the element 104 is disposed in the recess 103 of each device region Rd of the joining object 101, so as to cover all the recesses 103. This forms a cavity in each device region Rd, and simultaneously seals the element 104 within the cavity. Furthermore, the joining object 102 is cut into a single piece along the cutting line Ct along with the joining object 101, thereby becoming the cover portion of the device.

[0027] Furthermore, the engagement of the mating objects 101 and 102 at this time, such as Figure 1 As shown in (A), the joining target portion Pt is set within their opposing surfaces 101a and 102a. Figure 1In example (B), in order to join the entire circumference of the recess 103 in each device region Rd, a quadrilateral linear portion Pt1 is provided as the joining target portion Pt for joining around the recess 103 along the cutting line Ct. The joining at this linear portion Pt1 is necessary to maintain the cavity as a sealed space in each device obtained by the monolithization, even after monolithization by cutting along the cutting line Ct.

[0028] Furthermore, in Figure 1 In example (B), as the target part Pt, an annular linear part Pt2 is also provided on the peripheral part Re of the joint objects 101 and 102 for full circumferential jointing of the joint objects 101 and 102. The joint at the linear part Pt2 is necessary to suppress vibrations at the peripheral part Re of the joint objects 101 and 102 that may occur during the cutting process (cutting along the cutting line Ct).

[0029] Furthermore, in the bonding process, in order to bond the two bonding objects 101 and 102 at the bonding target portion Pt having the above-described pattern shape, laser irradiation is performed on the bonding target portion Pt. Specifically, the bonding process is performed using the bonding apparatus described below.

[0030] Furthermore, the shapes of the bonding objects 101 and 102 and the pattern shape of the bonding target portion Pt are not limited to those described above, and can be appropriately modified according to the shape or size of the manufactured device, the bonding position, lines, areas, etc. Moreover, the bonding of the bonding objects 101 and 102 is not limited to being performed by irradiating the bonding target portion Pt with a laser; it can also be appropriately modified to use the pressure area of ​​the bonding objects 101 and 102 as the bonding target portion Pt, and perform the bonding by heating the entire bonding objects 101 and 102.

[0031] [1-2] Connecting device

[0032] Figure 2 (A) is a conceptual diagram illustrating an example of a joining device used in a joining process. Figure 2 In example (A), the coupling device includes a chamber mechanism 1, a sealing mechanism 2, a pressurizing mechanism 3, a laser source 4, and a control unit 5. The composition of each part will be explained in detail below.

[0033] <Cavity Mechanism 1>

[0034] The chamber mechanism 1 has a first chamber component 11, a second chamber component 12, and a drive unit 13 that drives at least one of the two.

[0035] The first chamber component 11 and the second chamber component 12 are portions that constitute a sealed space (hereinafter referred to as "chamber 10") for performing the bonding process. They are configured to be relatively close or far apart in the vertical direction, thereby enabling the selective formation and opening of the chamber 10. More specifically, as described below.

[0036] The first chamber component 11 consists of a first cylindrical portion 111 and a first mounting stage 112 supported without gaps inside the first cylindrical portion 111. The first cylindrical portion 111 is arranged with its central axis aligned with the vertical direction, and the first mounting stage 112 is horizontally supported by the first cylindrical portion 111. Here, the first mounting stage 112 is a laser-transmitting stage, for example, made of quartz.

[0037] The second chamber component 12 comprises a second cylindrical portion 121 located above and coaxially arranged with the first cylindrical portion 111, a second mounting platform 122 supported without gap and movably vertically inside the second cylindrical portion 121, and a drive unit 123 for moving the second mounting platform 122 vertically. Furthermore, the upper end of the first cylindrical portion 111 is in seamless contact with the lower end of the second cylindrical portion 121, such as... Figure 2 (A) and Figure 2 As shown in (B), a chamber 10 is formed between the first stage 112 and the second stage 122. Furthermore, in Figure 2 In (A), the second platform 122 is shown in a raised state. Figure 2 (B) shows the state where the second platform 122 has been lowered.

[0038] And, as Figure 2 As shown in (B), by lowering the second mounting platform 122 to contact the back surface 102b of the mating object 102, when the pressurizing mechanism 3 (described later) moves from the side of the first mounting platform 112 ( Figure 2 (In example (B)) When pressure is applied to the back surface 101b of the mating object 101 (the lower side), it is possible to apply pressure to the back surface 102b side of the mating object 102 ( Figure 2 In example (B), the upper side bears the pressure. Thus, in this joining device, the second mounting platform 122 can function as a support that bears pressure on the back side 102b of the joining object 102.

[0039] The drive unit 13 moves at least one of the first chamber component 11 and the second chamber component 12 in the vertical direction, causing their components to move relatively closer or further apart.

[0040] <Sealing Mechanism 2>

[0041] The sealing mechanism 2 is a mechanism that divides the space within the chamber 10 into multiple regions (hereinafter referred to as "chamber regions") and seals the spaces between adjacent chamber regions (see reference). Figure 2 (B) Specifically, the sealing mechanism 2 divides the space within the chamber 10 into a first chamber region R1 opposite to the back surface 101b of the mating object 101 and a second chamber region R2 adjacent to the first chamber region R1, and seals the space between these chamber regions. More specifically, as described below.

[0042] The sealing mechanism 2 consists of a flange portion 21 and a retaining portion 22. Here, the flange portion 21 is an annular portion protruding from the inner surface of the first cylindrical portion 111 at a position higher than the first mounting platform 112 (i.e., near the second cylindrical portion 121) towards the central axis of the first cylindrical portion 111, and extends to a position where it can face the peripheral portions Re of the mating objects 101 and 102 when they are disposed within the chamber 10. Furthermore, the retaining portion 22 is composed of an annular sealing member (such as an O-ring) and is provided on the upper surface of the front end of the flange portion 21 so that it can support the peripheral portions Re of the mating objects 101 and 102 along their entire circumference when they are disposed within the chamber 10.

[0043] According to this sealing mechanism 2, when the second mounting platform 122 descends and contacts the back surface 102b of the mating object 102, the peripheral portions Re of the mating objects 101 and 102 will be clamped between the second mounting platform 122 and the retaining portion 22 around the entire circumference. As a result, as... Figure 2 As shown in (B), the space within chamber 10 is divided into a first chamber region R1 and a second chamber region R2, and the chamber region between them is sealed.

[0044] <Pressure Mechanism 3>

[0045] The pressurizing mechanism 3 applies pressure to the back surface 101b of the mating object 101 by increasing the internal pressure of the first chamber region R1. Specifically, the pressurizing mechanism 3 uses a gas or liquid as the pressure transmission medium 30, and applies pressure to the back surface 101b of the mating object 101 while the pressure transmission medium 30 is in contact with the back surface 101b of the mating object 101. More specifically, as described below.

[0046] The pressurizing mechanism 3 can adjust the internal pressure of each chamber region formed within the chamber 10 separated by the sealing mechanism 2, can depressurize each chamber region, and can pressurize the first chamber region R1 through the pressure transmission medium 30. Pressurization of the first chamber region R1 is achieved, for example, by supplying the pressure transmission medium 30 (gas or liquid) to the first chamber region R1 through a compression pump. Furthermore, the pressurizing mechanism 3 applies pressure to the back surface 101b of the mating object 101 by utilizing the pressure difference between the internal pressure of the first chamber region R1 and the internal pressure of the second chamber region R2.

[0047] <Laser Source 4>

[0048] The laser source 4 is the part that emits laser light and is disposed below the first mounting stage 112, which is transmissive to laser light. Furthermore, the laser source 4 can irradiate the bonding objects 101 and 102 with laser light via the first mounting stage 112, and can simultaneously scan the laser light along the pattern shape of the bonding target portion Pt in a horizontal plane. Moreover, the laser source 4 can focus the laser light at the bonding position (the position of the bonding target portion Pt) of the bonding objects 101 and 102.

[0049] <Control Unit 5>

[0050] The control unit 5 is composed of a processing device such as a CPU or microcomputer, which controls the various actuators (chamber mechanism 1, pressurizing mechanism 3, laser source 4, etc.) of the bonding device. Specifically, the bonding process is executed by controlling the bonding process along the following flow through the control unit 5.

[0051] The control unit 5 first brings the first chamber component 11 and the second chamber component 12 closer together and assembles them, thereby forming the chamber 10 (see reference). Figure 2 (A)). Here, the mating objects 101 and 102 are disposed on the retaining part 22 before the chamber 10 is formed.

[0052] Next, the control unit 5 reduces the overall internal pressure of the chamber 10 by controlling the pressurization mechanism 3 until a vacuum is reached inside the chamber 10. At this time, since the peripheral portions Re of the mating objects 101 and 102 are in an open state before being sandwiched between the second mounting stage 122 and the holding portion 22, they are open from the seal. Therefore, the gas present between the mating objects 101 and 102 can be discharged to the outside (inside the chamber 10) through the space between the mating objects 101 and 102. Thus, the internal pressure between the mating objects 101 and 102 can also be reduced.

[0053] Subsequently, the control unit 5 lowers the second mounting platform 122 and contacts the back surface 102b of the mating object 102, thereby clamping the peripheral portions Re of the mating objects 101 and 102 along the entire circumference between the second mounting platform 122 and the holding part 22 (see reference). Figure 2 (B) Thus, the first chamber region R1 and the second chamber region R2 are formed, and they are sealed together.

[0054] In this state, the control unit 5 controls the pressurization mechanism 3 to increase the internal pressure of the first chamber region R1 while maintaining the second chamber region R2 in a vacuum state. As a result, the internal pressure of the first chamber region R1 becomes higher than the internal pressure of the second chamber region R2, and a pressure corresponding to their pressure difference is applied to the back surface 101b of the mating object 101. Thus, the mating objects 101 and 102 are clamped by the pressure transmission medium 30 and the second mounting stage 122 (pressurization step). At this time, by changing the internal pressure of the first chamber region R1, the pressure applied to the back surface 101b of the mating object 101 can be changed to a desired value. Furthermore, the internal pressure of the first chamber region R1 can be set to a value lower than atmospheric pressure, a value equal to atmospheric pressure, or a value higher than atmospheric pressure, as long as it is higher than the internal pressure of the second chamber region R2.

[0055] After pressurizing the back surface 101b of the bonding object 101 by the pressurizing mechanism 3, the control unit 5 maintains this state while controlling the laser light source 4 to irradiate the bonding target portion Pt of the bonding objects 101 and 102 with a laser. At this time, the control unit 5 scans the laser in the horizontal plane along the pattern shape of the bonding target portion Pt. In this way, the bonding device performs the bonding process of bonding the two bonding objects 101 and 102.

[0056] Furthermore, the aforementioned joining device is not limited to irradiating a laser onto a joining target portion Pt with a patterned shape to join the joining objects 101 and 102. It can also be appropriately modified to use the pressure area of ​​the joining objects 101 and 102 as the joining target portion Pt, and join the joining objects 101 and 102 by heating the entire joining objects 101 and 102.

[0057] [1-3] Formation of unjointed parts

[0058] In the aforementioned joining device, during the joining process, the peripheral portions Re of the joining objects 101 and 102 will be clamped between the second mounting stage 122 and the holding portion 22 around the entire circumference (see reference). Figure 1 (B) Figure 2 (B)). Therefore, as Figure 3As shown, when laser light is irradiated onto the target portion Pt, due to the presence of the sealing mechanism 2, including the holding portion 22, laser light cannot be irradiated onto the portion (annular linear portion Pt2) located at the periphery Re of the target portion Pt. As a result, this portion becomes an unjoined portion Pu. If such an unjoined portion Pu is generated, it will be impossible to suppress the vibration at the periphery Re of the joint objects 101 and 102 that may occur during the cutting process (cutting along the cutting line Ct).

[0059] Furthermore, not limited to the case where the joining process is performed using the aforementioned joining device, when two joining objects 101 and 102 are clamped in an overlapping state, if a holding portion is required to hold the joining objects 101 and 102, the holding portion (and the mechanism including it) may sometimes block a portion of the joining target portion Pt. In this case, laser cannot be irradiated onto the portion of the joining target portion Pt that is blocked by the holding portion, and this portion becomes an unjoined portion Pu. If such an unjoined portion Pu is generated, not only will the aforementioned vibration problem occur, but the portion with the unjoined portion Pu may also be wasted, or it may have adverse effects on the processing or equipment in subsequent processes (such as peeling).

[0060] Furthermore, even if a laser can be applied to the portion of the mating target Pt that is shielded by the holding part (and the mechanism including it) through some method, if appropriate pressure cannot be applied to the portion held by the holding part in the previous process (the process of clamping the mating objects 101 and 102), the portion may become poorly mated and become an un-matted portion Pu. This problem may also occur if the mating objects 101 and 102 are joined by heating the entire assembly in a clamped state, and if the aforementioned holding part is required, the clamping pressure required for the portion held by the holding part will be insufficient.

[0061] Therefore, in order to achieve a good joint between the joining objects 101 and 102 even if unjoined portions Pu may occur during this joining process, the inventors propose a joining repair method that repairs the joint state of the unjoined portion Pu by irradiating it with a laser. The joining repair method will be described in detail below.

[0062] In addition to the reasons mentioned above, other possible causes for the formation of unjoined portions Pu include foreign objects trapped between the two joining objects 101 and 102, which hinder close contact between them, or insufficient laser power required for joining due to temporary insufficient output of the laser source 4. A method for repairing the joining state of unjoined portions Pu caused by these reasons will be described in the second variation described later.

[0063] [2] Joint repair method

[0064] The bonding repair method of the embodiment can be performed using the following bonding repair apparatus.

[0065] Figure 4 (A) is a conceptual diagram showing an example of a joint repair device. The joint repair device includes a support mechanism 6, a laser source 7, and a control unit 8.

[0066] The support mechanism 6 includes a first support portion 61 and a second support portion 62. It clamps and supports the joined objects 101 and 102 after the aforementioned joining steps from their back sides 101b and 102b using the first support portion 61 and the second support portion 62. The support mechanism 6 can support the joined objects 101 and 102 via the first support portion 61 and the second support portion 62, while also providing a pressure-applying function to clamp them.

[0067] In this embodiment, the first support portion 61 is configured to be located on the incident side of the laser relative to the bonding objects 101 and 102. Figure 4 (In example (A), the back side 101b of the joining object 101 is used). Furthermore, as the first support portion 61, a support portion with a window 61w for allowing laser light from the laser source 7 to pass through is used. Specifically, the first support portion 61 is configured such that when the joining objects 101 and 102 are clamped between it and the second support portion 62, at least a portion of the unjoined portion Pu can be exposed from the window 61w.

[0068] Figure 4 (B) is a plan view showing an example of the first support portion 61 used in the embodiment. Here, Figure 4 In (B), the first support 61 is shown as a component that can be used for repair. Figure 1 (B) Repairing the joining state of the unjoined portion Pu in the case where the annular linear portion Pt2 in the joining target portion Pt becomes the unjoined portion Pu (in other words, the unjoined portion Pu is generated in the peripheral portion Re of the two joining objects 101 and 102).

[0069] Specifically, the first support portion 61 is composed of a main body portion 611, an annular portion 612, and a beam portion 613. Here, the main body portion 611 is the portion that contacts the central region of the back surface 101b of the mating object 101, which is located inside the peripheral portion Re (see reference). Figure 4 (A)). The annular portion 612 is the portion that contacts the annular region on the back surface 101b of the mating object 101, which includes an outer periphery and is narrower than the periphery portion Re (see reference). Figure 4 (A)). Beam 613 is the part that connects the annular part 612 and the main body part 611 at at least one point (see reference). Figure 4(B)). Furthermore, the area surrounded by the main body 611, the annular portion 612, and the beam portion 613 becomes the window 61w of the first support portion 61. Figure 4 In example (B), the first support portion 61 is shown to have four beam portions 613 evenly spaced around its center point, which connect the annular portion 612 to the main body portion 611 at four locations, resulting in a structure with four windows 61w. Furthermore, the configuration of the first support portion 61 (the shape or number of windows 61w, etc.) is not limited to... Figure 4 As shown in (B), it is possible to make appropriate changes based on the shape of the unjoined portion Pu generated in the joining target portion Pt.

[0070] The laser source 7 is the part that emits laser light and can irradiate the mating objects 101 and 102 supported by the support mechanism 6 through the window 61w of the first support portion 61. Specifically, the laser source 7 can irradiate the unjoined portion Pu exposed through the window 61w of the first support portion 61. Furthermore, the laser source 7 can scan the laser in a horizontal plane along the pattern shape of the unjoined portion Pu (in this case, the pattern shape of the annular linear portion Pt2). Moreover, the laser source 7 can focus the laser light at the mating position (the position of the unjoined portion Pu) of the mating objects 101 and 102.

[0071] The control unit 8, consisting of a CPU or microcomputer or similar processing device, controls the various moving parts (support mechanism 6, laser light source 7, etc.) of the bonding and repair device. Specifically, the bonding and repair method is executed by controlling the process according to the following steps through the control unit 8.

[0072] The control unit 8 first supports the mating objects 101 and 102 via the support mechanism 6 (supporting step). See reference. Figure 4 (A)). At this time, the joining objects 101 and 102 are as follows: Figure 5 As shown in (A), the joint is configured such that at least a portion of the unjoined portion Pu is exposed through the window 61w of the first support portion 61. At this time, the control unit 8 can clamp the joint objects 101 and 102 using the first support portion 61 and the second support portion 62 by controlling the support mechanism 6.

[0073] Subsequently, the control unit 8 controls the laser light source 7 to irradiate the unjoined portion Pu exposed through the window 61w of the first support portion 61 with laser light (repair step). At this time, the control unit 8 scans the laser in a horizontal plane along the pattern shape of the unjoined portion Pu (in this case, the pattern shape of the annular linear portion Pt2). As a result, the joining state of the portion of the unjoined portion Pu exposed through the window 61w of the first support portion 61 is repaired. Thus, the joining repair method for repairing the joining state of the unjoined portion Pu is performed by the joining repair device.

[0074] According to this joint repair method, by using a laser, the heating position can be limited to the unjoined portion Pu. As a result, it is possible to repair the joint state of the unjoined portion Pu while preventing adverse effects caused by heat or light on parts other than the unjoined portion Pu.

[0075] Furthermore, according to the first support portion 61, the periphery of the unjoined portion Pu exposed from the window 61w can be supported by the edges of the window 61w (main body portion 611, annular portion 612, beam portion 613), thereby improving the tightness of contact between the two joined objects 101 and 102 at the unjoined portion Pu. Therefore, by irradiating the unjoined portion Pu exposed from the window 61w with a laser, the joining state of the unjoined portion Pu can be restored to a good state.

[0076] [3] Modified Examples

[0077] [3-1] First variation

[0078] In the repair steps of the above-described joint repair method, although laser light can be irradiated onto the portion of the unjoined portion Pu that is exposed from the window 61w of the first support portion 61, laser light cannot be irradiated onto the portion of the unjoined portion Pu that is blocked by the beam portion 613, and the joint state of that portion cannot be repaired (see reference). Figure 5 (A)).

[0079] Therefore, after performing the repair steps, such as Figure 5 As shown in (B), the joining objects 101 and 102 can be reconfigured by rotating them circumferentially so that the portion of the unjoined portion Pu previously obscured by the beam 613 is exposed from the window 61w. Furthermore, in Figure 5 In (B), the repaired portion of the unjoined portion Pu is indicated by a thick solid line. Furthermore, the above repair steps can be performed again on the portion of the unjoined portion Pu that was previously covered by the beam 613.

[0080] According to this joint repair method, even if the joint state of all parts of the unjoined portion Pu cannot be repaired in a single repair step, the joint state of all parts of the unjoined portion Pu can be repaired by reconfiguring the joint objects 101 and 102 and performing the repair step again. Furthermore, this repair step can be repeated, reconfiguring the joint objects 101 and 102 each time, until the joint state of all parts of the unjoined portion Pu can be repaired.

[0081] Furthermore, the joint repair method of this modified example can be appropriately changed to: instead of reconfiguring by rotating the joint objects 101 and 102 in the circumferential direction, by rotating the first support portion 61 of the joint repair device in the circumferential direction (in other words, by rotating the joint objects 101 and 102 relative to the first support portion 61 in the circumferential direction), thereby exposing the portion of the unjoined portion Pu that was previously covered by the beam portion 613 from the window 61w.

[0082] [3-2] Second variation

[0083] As described above, the causes of the unbonded portion Pu could also include foreign objects being trapped between the two bonding objects 101 and 102, which hinder the close contact between the bonding objects 101 and 102, or insufficient laser power required for bonding due to temporary insufficient output of the laser source 4. On the other hand, regarding the unbonded portion Pu that may be generated due to these reasons, unlike the case of the above embodiment (i.e., it is known that the portion of the bonding target portion Pt held by the holding portion will become the unbonded portion Pu), it is unclear whether the unbonded portion Pu has actually been generated when the bonding process is completed, and even if the unbonded portion Pu has been generated, it is unclear at what location the unbonded portion Pu is generated.

[0084] Therefore, in order to form a good joint state between the joint objects 101 and 102 even in the case where there may be unjoined portions Pu due to these reasons, the inventors further propose the following joint repair method.

[0085] First, by inspecting the bonding state at the bonding target Pt after the bonding process, the unbonded portion Pu generated in the bonding target Pt is determined (determination step). Next, the bonding state of the unbonded portion Pu determined in the determination step is repaired by irradiating it with a laser (repair step).

[0086] As a concrete example, consider using Figure 2 When the joining device shown in (A) is used for the joining process, an unjoined portion Pu is generated in the area that can be pressurized by the pressure transmission medium 30 (the area where laser irradiation can be performed. In other words, the area other than the area where laser irradiation is hindered by the presence of the sealing mechanism 2, including the retaining part 22).

[0087] First, consider the case where the unbonded portion Pu is caused by insufficient laser power. In this case, after identifying the unbonded portion Pu in the determination step, the bonding device used in the bonding process is used again (see [reference]). Figure 2(A)) to clamp the joint objects 101 and 102 (pressurization step), and then, in the repair step, to irradiate the unjoined portion Pu with a laser while eliminating the insufficient laser power, thereby repairing the joint state of the unjoined portion Pu.

[0088] Next, consider the case where the unbonded portion Pu is caused by a foreign object (insertion / interference) sandwiched between the bonding objects 101 and 102. In this case, after the bonding process is performed, a protrusion with the position of the insertion object as its apex will be generated on the back surface 102b of the bonding object 102. Furthermore, by observing the back surface 102b of the bonding object 102 with a camera, such a protrusion can be observed as interference fringes. Therefore, in the determination step, the portion of the bonding target portion Pt that coincides with the interference fringes observed by the camera can be identified as the unbonded portion Pu by observing the back surface 102b of the bonding object 102 with a camera. In addition, the center position of the interference fringes can be determined as the position of the insertion object.

[0089] In this case, the joining device used in the joining process can also be reused (see reference). Figure 2 (A)) to repair the bonding state of the unbonded portion Pu. On the other hand, since the unbonded portion Pu is caused by an embedded object, it cannot be removed, and therefore the protrusion with the embedded object as its vertex cannot be eliminated. Furthermore, when the embedded object is located on the unbonded portion Pu, it is difficult to improve the bonding state of the unbonded portion Pu even if a laser is directly irradiated onto the unbonded portion Pu caused by the embedded object.

[0090] Therefore, before performing the repair step, a pressure greater than the pressure applied to the back surface 101b of the joint object 101 during the clamping of the joint objects 101 and 102 in the jointing process is applied through the pressure transmission medium 30 (pressurization step). As a result, the protrusion can be contracted as much as possible, increasing the close contact area of ​​the joint objects 101 and 102 around the clamp.

[0091] Furthermore, in the repair step, while maintaining the state in which the protrusion has been shrunk as much as possible through the pressure step, the laser is irradiated while avoiding the position of the clamp determined in the determination step, thereby repairing the joint state of the unjoined part Pu.

[0092] Here, when the inserted object is located away from the unjoined portion Pu, by minimizing the protrusion as much as possible during the pressurization step to reduce the influence of the inserted object, the unjoined portion Pu can be directly irradiated with a laser to repair the joint state of the unjoined portion Pu.

[0093] On the other hand, when the insert is located on the unjoined portion Pu, the joining state of the unjoined portion Pu can be repaired by irradiating the laser at a position away from the unjoined portion Pu, avoiding the position of the insert. For example, as shown... Figure 6 As shown in (A), the detour portion Pt3 that bypasses the clamping object position can be reset as the joining target portion Pt, and the joining state of the unjoined portion Pu can be repaired by irradiating the detour portion Pt3 with a laser. Furthermore, in Figure 6 In (A), the part of the joint target Pt that has been joined is represented by a thick solid line. Figure 6 (The same applies in (B)). As another example, such as Figure 6 As shown in (B), another linear portion Pt4 can be redefined as the joining target portion Pt, which includes a portion of the unjoined portion Pu (including the portion that has already been joined). By irradiating this linear portion Pt4 with a laser, the joining state of the unjoined portion Pu can be repaired (see reference). Figure 6 (B)).

[0094] Furthermore, the laser irradiation of the unjoined portion Pu performed in the repair step includes not only cases where the laser is directly irradiated onto the unjoined portion Pu to repair its joining state, but also cases where the laser is irradiated at a position away from the unjoined portion Pu to supplement the repair of its joining state, if it is necessary to avoid the obstruction.

[0095] [3-3] Third variation

[0096] When the cause of the unjoined portion Pu is a foreign object (inserted object) sandwiched between the joint objects 101 and 102, as a method to repair the joint state of the unjoined portion Pu, in the second variation described above, a pressure step is performed before the repair step to shrink the protrusion caused by the inserted object as much as possible, thereby increasing the close contact area of ​​the joint objects 101 and 102 around the inserted object. However, the following pretreatment step can also be performed instead of the pressure step, or in parallel with the pressure step.

[0097] Specifically, before performing the repair step, a pretreatment laser is irradiated onto the insert located at the position determined in the determination step, thereby heating and deforming the insert, or sublimating the insert through phenomena such as ablation (pretreatment step). As a result, the height of the protrusion can be reduced, thereby increasing the close contact area of ​​the mating objects 101 and 102 around the insert.

[0098] Furthermore, in the pretreatment step, when the insert is deformed by laser heating, the heated insert can be compressed by pressure in parallel to deform it efficiently, thereby reducing the height of the protrusion.

[0099] Furthermore, if the inclusion is sublimated by laser in the pretreatment step, the gas generated by sublimation can be forced into the chamber by pressure through a parallel pressurization step, which may result in the disappearance of the protrusion. If the protrusion can be eliminated, it may be possible to directly irradiate the unbonded portion Pu with laser without avoiding the inclusion in the repair step.

[0100] The above description of the embodiments and modifications is illustrative in all respects and should not be considered limiting. The scope of the invention is not limited by the above embodiments or modifications, but is defined by the scope of the claims. Furthermore, the scope of the invention includes all modifications within the meaning and scope equivalent to the claims.

[0101] Furthermore, from the above embodiments or variations, each step constituting the joint repair method can be extracted individually as the object of the invention, as can the joint repair device for the joint repair method or each part of the joint repair device (such as the first support 61). Moreover, solutions combining them with a part of a joint process or joint device can also be extracted as the object of the invention.

[0102] Explanation of reference numerals in the attached figures

[0103] 1. Chamber structure

[0104] 2 Sealing mechanism

[0105] 3. Pressurization mechanism

[0106] 4. Laser source

[0107] 5. Control Department

[0108] 6 Support mechanism

[0109] 7. Laser source

[0110] 8. Control Department

[0111] 10 chambers

[0112] 11. First chamber composition

[0113] 12. Second Chamber Composition

[0114] 13 Drive Unit

[0115] 21. Flange portion

[0116] 22. Maintenance section

[0117] 30 Pressure transmission medium

[0118] 61 First Support

[0119] 61w window

[0120] 62 Second Support

[0121] Ct cutting line

[0122] Pt joint target part

[0123] Pu Unconnected part

[0124] R1 First Chamber Region

[0125] R2 Second Chamber Region

[0126] Rd device area

[0127] Re Periphery

[0128] 101, 102 Joint objects

[0129] 101a and 102a opposite surfaces

[0130] Back of 101b and 102b

[0131] 103 Depression

[0132] 104 components

[0133] 111 First cylindrical section

[0134] 112 First mounting platform

[0135] 121 Second cylindrical section

[0136] 122 Second mounting platform

[0137] 123 Drive Unit

[0138] 611 Main Body

[0139] 612 Annular portion

[0140] 613 Beam section

[0141] Pt1, Pt2, Pt4 linear portion

[0142] Pt3, the detour section.

Claims

1. A method for repairing a joint, wherein, In a joining process that joins two objects to a joining target portion set within their opposing surfaces, when at least a portion of the joining target portion produces an unjoined portion, the joining state of the unjoined portion is repaired by irradiating the unjoined portion with a laser.

2. The joint repair method as described in claim 1, comprising: In the supporting step, the two joined objects are clamped and supported from the back side using a first support portion and a second support portion. At this time, the first support portion is a support portion that exposes at least a portion of the unjoined portion through a window for laser transmission; and The repair step involves irradiating the unjoined portion with a laser through the window after the support step, thereby repairing the joint state of the unjoined portion.

3. The joint repair method as described in claim 2, wherein, In the case where the unjoined portion is generated at the periphery of the two joined objects, the first support portion is a support portion comprising the following parts: a main body portion that contacts the central region of the back surface that is more inward than the periphery; an annular portion that contacts the annular region of the back surface along the outer periphery; and a beam portion that connects the annular portion to the main body portion, the area surrounded by these parts becoming the window.

4. The joint repair method as described in claim 3, wherein, After performing the repair step, the two joined objects are rotated relative to the first support in a circumferential direction to expose the portion of the unjoined portion that was covered by the beam from the window, and then the repair step is performed again on that portion.

5. The joint repair method as described in claim 1, comprising: In the pressurization step, pressure is applied to the back of one of the two mating objects in a state where the gas or liquid serving as the pressure transmission medium is in direct contact, and the two mating objects are clamped by a support portion bearing the pressure on the back side of the other mating object. as well as The repair step involves clamping the two joined objects by applying pressure and irradiating the unjoined portion with a laser from the back side of one of the joined objects, thereby repairing the joint state of the unjoined portion.

6. The joint repair method as described in claim 5, wherein, The pressurization step is also used in the bonding process. In the pressurization step performed when repairing the unjoined portion, a pressure greater than that applied in the pressurization step performed before repair is applied to the back of the joint by means of a gas or liquid as a pressure transmission medium.

7. The joint repair method according to any one of claims 1 to 6, comprising: The determination step involves identifying the unjoined portion generated at the target joint by examining the joint state at the target joint after the joint process. as well as The repair step involves irradiating the unjoined portion, as determined in the determination step, with a laser to restore the joint state of the unjoined portion.

8. The joint repair method as described in claim 7, wherein, In the determining step, the unjoined portion is identified, and if the cause of the unjoined portion is an inserted object, the location of the inserted object is determined. In the repair step, the laser is irradiated while avoiding the position of the clamp determined in the determination step, thereby repairing the joint state of the unjoined portion.

9. The joint repair method according to any one of claims 1 to 6, comprising: The determination step involves checking the joining state at the joining target portion after the joining process to determine the unjoined portion generated in the joining target portion, and if the cause of the unjoined portion is an inserted object, determining the location of the inserted object. The pretreatment step involves irradiating the insert located at the position determined in the determining step with a laser to deform or sublimate the insert. as well as The repair step, following the pretreatment step, involves irradiating the unjoined portion, as determined in the determination step, with a laser to restore the joint state of the unjoined portion.

Images