Simulation test method for electronic packaging equipment

Abstract

The invention discloses a simulation test method for electronic packaging equipment, which comprises the following steps of: importing PCB (Printed Circuit Board) design data to form a unified intermediate format; multi-dimensional parameter mapping association is carried out on the geometric entity and an equipment execution module of packaging equipment in the digital twin model library, and multi-dimensional parameters comprise space coordinates, thermal characteristics and electrical characteristics; according to the correlation result, a dynamic rule engine is called to generate and update process rules in real time, and the process rules comprise the solder paste jet printing speed, the dispensing pressure, the surface mounting force threshold value and the backflow peak temperature curve; loading the updated process rule to a digital twin model of the electronic packaging equipment, and driving the model to generate an executable control program; and running the control program in a 3D simulation environment to obtain a virtual running track, a heat distribution field and a stress field. According to the method, the trajectory, the thermal field and the stress field are output in advance through 3D simulation, the collision, warping and overheating risks are eliminated in the virtual stage, the number of real object proofing rounds is reduced, and the overall introduction cost is saved.

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