Automatic precise assembly process analysis system of high-reliability liquid-cooled transformer board card

Abstract

The invention relates to the technical field of precise assembly, in particular to an automatic precise assembly process analysis system of a high-reliability liquid-cooled transformer board card. Assembling abnormity caused by abnormal shaking of machine operation in the assembling process is evaluated through an assembling abnormity analysis strategy, meanwhile, damage evaluation of all positions is carried out by integrating matching analysis of connection positions and the assembling abnormity caused by abnormal shaking, abnormity prediction of an assembling result is carried out before assembling, the assembling abnormity can be found in advance, and the assembling efficiency is improved. And the safety and the success rate of the assembly process are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of precision assembly protection, and in particular to an automatic precision assembly process analysis system for high-reliability liquid-cooled variable board cards. BACKGROUND

[0002] In the field of electronic device manufacturing, the assembly of high-reliability liquid-cooled variable board cards is a crucial and challenging link. With the continuous development of technology, electronic devices have increasingly high requirements for the performance and stability of board cards. The assembly quality of liquid-cooled variable board cards, as key components, directly affects the operation effect and service life of the entire device. Traditional board card assembly processes mostly rely on manual operation or simple automated equipment, which has many problems. In manual assembly, due to the subjectivity and instability of human operation, problems such as assembly position deviation and loose connection easily occur, leading to unstable signal transmission and poor contact during the use of the board card, and other faults. Moreover, manual assembly is low in efficiency and difficult to meet the needs of large-scale production. For simple automated assembly equipment, although the assembly efficiency is improved to some extent, there is a lack of precise control and comprehensive analysis of the assembly process. For example, during the assembly process, it is difficult to accurately obtain the image of the assembly position and the signal transmission situation in the future use of the corresponding installation position, making it difficult to perform effective assembly matching analysis and easily causing connection position mismatching problems, thereby affecting the performance and reliability of the board card. In terms of future use prediction of the board card, traditional methods are mainly based on experience or simple testing, which cannot accurately predict the performance and reliability of the board card in future use, making it difficult to discover potential problems in advance during the assembly process and take timely measures for adjustment and improvement, thereby increasing the risk of faults in the later use of the board card.

[0003] In summary, the existing board card assembly technology has problems such as low assembly precision, poor reliability, lack of comprehensive analysis and early warning mechanism, and cannot meet the assembly needs of high-reliability liquid-cooled variable board cards. Therefore, the applicant proposes an automatic precision assembly process analysis system for high-reliability liquid-cooled variable board cards. SUMMARY

[0004] In order to overcome the defects and deficiencies of the prior art, the present application provides an automatic precision assembly process analysis system for high-reliability liquid-cooled variable board cards.

[0005] In order to achieve the above-mentioned purposes, the present application adopts the following technical solutions: In a first aspect, the application provides an automatic precise assembly process analysis system for a high-reliability liquid-cooled variable board card, comprising the following specific modules: a data acquisition terminal, an assembly matching analysis module, an assembly robot evaluation module, a future use prediction module, and an assembly process early warning module, wherein the data acquisition terminal is used to acquire image conditions of an assembly position before assembly and signal transmission conditions in future use of a corresponding installation position, the assembly matching analysis module is used to perform matching analysis of a connection position in the assembly process through a matching analysis strategy, the assembly robot evaluation module is used to evaluate assembly abnormalities caused by abnormal shaking of a machine during the assembly process through an assembly abnormality analysis strategy, and meanwhile, damage evaluation of each position is performed by comprehensively analyzing the matching analysis of the connection position and the assembly abnormalities caused by abnormal shaking, the future use prediction module is used to perform future use prediction of a corresponding position through the damage evaluation results of each position and the signal transmission conditions in the future use, and the assembly process early warning module is used to perform assembly process early warning according to the future use prediction results of the corresponding position, prompting a worker to handle it.

[0006] In an implementation manner of the application, the data acquisition terminal comprises an image acquisition unit, a machine running data acquisition unit, and a board card use data acquisition unit, wherein the image acquisition unit is used to acquire three-dimensional image data of a corresponding board card assembly position before assembly, the three-dimensional image data of the assembly position before assembly can be acquired through a three-dimensional scanning instrument or a three-dimensional imaging instrument, the machine running data acquisition unit is used to acquire abnormal shaking frequency and shaking amplitude conditions of an output part of an assembly robot, corresponding shaking data is acquired through a shaking sensor, and the board card use data acquisition unit is used to acquire data transmission frequency and current transmission conditions of each position interface in a historical use process of a use scene of the board card; corresponding transmission data sensors are used for acquisition.

[0007] In an implementation manner of the application, the matching analysis strategy comprises the following specific steps: S21, three-dimensional image data of an assembly position before assembly for each position is acquired, and a difference in three-dimensional images is acquired based on the three-dimensional image data, wherein the difference in three-dimensional images comprises the following specific contents: three-dimensional images of the assembly position before assembly and three-dimensional images required by a to-be-assembled position are acquired, a volume of an intersection of the three-dimensional images of the assembly position before assembly and the three-dimensional images required by the to-be-assembled position at a corresponding installation angle is calculated, a volume of a union of the three-dimensional images of the assembly position before assembly and the three-dimensional images required by the to-be-assembled position at the corresponding installation angle is calculated, a similarity degree of the three-dimensional images of the assembly position is obtained by dividing the volume of the intersection by the volume of the union, and the difference in the three-dimensional images is obtained by subtracting the similarity degree of the three-dimensional images of the assembly position from 1; S22, obtain the hardness and elasticity of the material at the corresponding assembly position, wherein the hardness is Brinell hardness, and the corresponding elasticity can be represented by Young's modulus, wherein the hardness and elasticity can be obtained by experiment at the same time, for analyzing the damage of the assembly position caused by the abnormal stress in the assembly process, and the damage resistance of the assembly position is evaluated by the hardness and elasticity of the material at the corresponding assembly position, wherein the damage resistance evaluation method of the assembly position is: obtaining the hardness safety value by obtaining the ratio of the hardness of the corresponding position to the safety hardness, obtaining the elasticity safety value by obtaining the ratio of the elasticity of the corresponding position to the safety elasticity, and obtaining the damage resistance evaluation result of the assembly position by weighted summation of the hardness safety value and the elasticity safety value; S23, the matching analysis in the assembly process is carried out by the difference of the three-dimensional image of the corresponding assembly position and the damage resistance evaluation result of the assembly position, and the specific steps are: the matching analysis result of the corresponding assembly position is obtained by weighted summation of the reciprocal of the difference of the three-dimensional image of the corresponding assembly position and the damage resistance evaluation of the corresponding assembly position, and the geometric difference and the damage resistance evaluation are combined in this step.

[0008] In an implementation manner of the present application, the assembly abnormality analysis strategy comprises the following specific contents: S31, obtain the swing situation of the output end of the assembly robot in the running process of the corresponding assembly process, including the swing amplitude and the corresponding swing frequency situation; S32, carry out swing abnormality analysis by the swing amplitude and the corresponding swing frequency, and the specific content is: the swing amplitude abnormality is obtained by dividing the average swing amplitude by the safety swing amplitude in the corresponding assembly process, the swing frequency abnormality is obtained by dividing the average swing frequency by the safety frequency in the corresponding assembly process, and the swing abnormality of the assembly robot in the corresponding assembly process is obtained by multiplying the swing amplitude abnormality and the swing frequency abnormality, the swing abnormality degree is comprehensively evaluated by standardization processing and product operation, and the one-sidedness of a single index is avoided; S33, the stability analysis result of the assembly robot and the reciprocal of the matching analysis result of the corresponding assembly position are summed to obtain the assembly abnormality analysis result of the corresponding position, wherein the reciprocal process here adds a very small value in the denominator in advance to avoid the meaningless denominator of 0 when the reciprocal is calculated.

[0009] In an implementation manner of the present application, the future use prediction comprises the following specific contents: The data transmission frequency and current transmission of the interface corresponding to the assembly position are acquired, and the ratio of the data transmission frequency and current transmission of the interface corresponding to the assembly position to the corresponding safety value is multiplied to obtain an information transmission abnormal value, the information transmission abnormal value of the corresponding assembly position is summed with the assembly abnormal analysis result to obtain a future use abnormal prediction result of the corresponding assembly position, and the future use abnormal prediction result of each corresponding assembly position is compared with a future use abnormal prediction threshold value, if the future use abnormal prediction result of one or more corresponding assembly positions is greater than or equal to the future use abnormal prediction threshold value, it is indicated that the assembly process is abnormal, and pre-warning maintenance is needed, if the future use abnormal prediction result of the corresponding assembly position is less than the future use abnormal prediction threshold value, it is indicated that the assembly is normal, so that the abnormal prediction of the assembly result can be performed before the assembly, the assembly abnormality can be found in advance, and the safety and success rate of the assembly process are improved.

[0010] In a second aspect, the application further provides an automatic precise assembly process analysis method for a high-reliability liquid-cooled variable board card, including the following specific steps: First, the image condition of the assembly position before assembly and the signal transmission condition in the future use process of the corresponding installation position are acquired. Second, matching analysis of the connection position in the assembly process is performed through a matching analysis strategy. Then, the assembly abnormality caused by abnormal shaking of the machine in the assembly process is evaluated through an assembly abnormality analysis strategy, and the damage of each position is evaluated by comprehensively considering the matching analysis of the connection position and the assembly abnormality caused by abnormal shaking, and the future use of the corresponding position is predicted through the damage evaluation result of each position and the signal transmission condition in the future use process. Finally, the assembly process is warned according to the future use prediction result of the corresponding position, and the worker is reminded to handle.

[0011] In a third aspect, the application provides an electronic device, including a processor and a memory, wherein the memory stores a computer program that can be called by the processor, and the processor executes an automatic precise assembly process analysis method for a high-reliability liquid-cooled variable board card by calling the computer program stored in the memory.

[0012] In a fourth aspect, the application provides a computer readable storage medium storing instructions, when the instructions run on a computer, the computer executes an automatic precise assembly process analysis method for a high-reliability liquid-cooled variable board card.

[0013] Compared with the prior art, the application has the following advantages and beneficial effects: By employing a matching analysis strategy to analyze the connection positions during the assembly process, and an assembly anomaly analysis strategy to assess assembly anomalies caused by abnormal machine movement during assembly, and by combining the matching analysis of connection positions with the assembly anomalies caused by abnormal movement, damage assessment is performed at each position. This allows for the prediction of assembly anomalies before assembly, which helps to detect assembly anomalies in advance and improves the safety and success rate of the assembly process. Attached Figure Description

[0014] Other features, objects, and advantages of the invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Fig. 1 This is a schematic diagram of the module composition structure of an embodiment of the system of the present invention; Fig. 2 This is a schematic diagram of the data acquisition terminal structure according to an embodiment of the present invention; Fig. 3 This is a schematic diagram of the matching analysis process in an embodiment of the present invention. Detailed Implementation

[0015] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0016] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0017] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.

[0018] Example 1

[0019] like Figs. 1 to 3 As shown, this embodiment provides an automated precision assembly process analysis system for highly reliable liquid-cooled variable circuit boards, including the following specific modules: a data acquisition terminal, an assembly matching analysis module, an assembly robot evaluation module, a future use prediction module, and an assembly process early warning module. The data acquisition terminal is used to acquire images of the assembly position before assembly and signal transmission during future use of the corresponding installation position. The assembly matching analysis module is used to perform matching analysis of connection positions during the assembly process through matching analysis strategies. In the embodiment, the matching analysis strategy includes the following specific steps: S21, obtain the three-dimensional image data of the pre-assembly position of each position, and obtain the difference of the three-dimensional image of the mating position based on the three-dimensional image data, wherein the difference of the three-dimensional image includes the following specific contents: obtaining the three-dimensional image of the pre-assembly position and the three-dimensional image required by the to-be-assembled position, for example, during assembly, the card column is inserted into the card slot for clamping operation, the space inside the card slot should match the corresponding card column to perfectly clamp, and the space inside the card slot is the three-dimensional image required by the to-be-assembled position, and the card column is the three-dimensional image of the assembly position, the volume of the intersection of the three-dimensional image of the pre-assembly position corresponding to the installation angle and the three-dimensional image required by the to-be-assembled position is calculated, and the volume of the union of the three-dimensional image of the pre-assembly position corresponding to the installation angle and the three-dimensional image required by the to-be-assembled position is calculated, the similarity of the three-dimensional image of the assembly position is obtained by dividing the volume of the intersection by the volume of the union, the difference of the three-dimensional image is obtained by subtracting the similarity of the three-dimensional image of the assembly position from 1, the intersection-union ratio of the three-dimensional images before and after assembly is calculated to quantify the geometric matching degree, avoid assembly interference or gap problems caused by shape deviation, and the intersection-union ratio is a commonly used shape similarity index in computer vision; S22, obtain the hardness and elasticity of the material corresponding to the assembly position, wherein the hardness is Brinell hardness, and the corresponding elasticity can be represented by Young's modulus, wherein the hardness and elasticity can be obtained by experiment at the same time, which is used to analyze the damage of the assembly position caused by the abnormal stress of the assembly position caused by the mismatch of the assembly position and the assembly stress, and the hardness and elasticity of the material corresponding to the assembly position are used for assembly position damage resistance evaluation, wherein the assembly position damage resistance evaluation method is: obtaining the hardness safety value by obtaining the ratio of the hardness of the corresponding position to the safety hardness, obtaining the elasticity safety value by obtaining the ratio of the elasticity of the corresponding position to the safety elasticity, and obtaining the assembly position damage resistance evaluation result by weighted sum of the hardness safety value and the elasticity safety value, wherein the safety hardness and the safety elasticity are obtained by: the hardness and elasticity of the material under the standard stress state and the safety life of the corresponding position, the hardness (anti-plastic deformation ability) and the elastic modulus (anti-elastic deformation ability) are combined to evaluate the failure risk of the material under the assembly stress, and the cracks or deformation caused by the mismatch of the material performance are prevented, the safety hardness and the safety elasticity are derived from the material mechanical property standard or the working condition limit value, and the weighted sum integrates two types of failure modes, for example, high hardness and low elasticity material is easy to crack, and low hardness and high elasticity material is easy to deform excessively; S23, the matching analysis in the assembly process is performed by assembling the position three-dimensional image difference and the assembly position damage resistance evaluation result, and the specific steps are as follows: the matching analysis result of the corresponding assembly position is obtained by weighted sum of the inverse of the corresponding assembly position three-dimensional image difference and the corresponding assembly position damage resistance evaluation, the geometric difference and the damage resistance evaluation are combined, the assembly compatibility and the structural reliability are optimized at the same time, the inverse of the geometric difference is converted and the damage resistance evaluation is the same dimension, the weighted sum balances the shape fitting and the material safety, and the assembly failure caused by a single factor (such as perfect shape but high risk material) is avoided; The assembly robot evaluation module is used for evaluating the assembly abnormality caused by the machine running abnormal shaking in the assembly process through the assembly abnormality analysis strategy, and the damage evaluation of each position is performed by combining the matching analysis of the connection position and the assembly abnormality caused by the abnormal shaking. The future use prediction module is used for predicting the future use of the corresponding position through the damage evaluation result of each position and the signal transmission situation in the future use process. The assembly process warning module is used for warning the assembly process according to the future use prediction result of the corresponding position, and reminding the worker to process.

[0020] In the embodiment, the data acquisition terminal includes an image acquisition unit, a machine running data acquisition unit and a board card use data acquisition unit, wherein the image acquisition unit is used for acquiring three-dimensional image data of the assembly position before assembly of the corresponding board card, wherein the three-dimensional image data of the assembly position before assembly can be acquired by a three-dimensional scanning instrument or a three-dimensional imaging instrument, the machine running data acquisition unit is used for acquiring the abnormal shaking frequency and shaking amplitude of the output end of the assembly robot, wherein the corresponding shaking data is acquired by a shaking sensor, and the board card use data acquisition unit is used for acquiring the data transmission frequency and current transmission situation of each position interface in the historical use process of the board card in the use scene; the corresponding transmission data sensor is used for acquiring.

[0021] In the embodiment, the assembly abnormality analysis strategy includes the following specific contents: S31, the swinging situation of the output end of the assembly robot in the running process in the corresponding assembly process is acquired, including the swinging amplitude and the corresponding swinging frequency situation; S32, abnormality analysis of the swing range and the corresponding swing frequency, the specific content is: the swing range abnormality is obtained by dividing the average swing range by the safe swing range in the corresponding assembly process, the swing frequency abnormality is obtained by dividing the average swing frequency by the safe frequency in the corresponding assembly process, the swing range abnormality and the swing frequency abnormality are multiplied to obtain the swing abnormality of the assembly robot in the corresponding assembly process, the swing abnormality degree is comprehensively evaluated through standardization processing and product operation, the one-sidedness of a single index is avoided, the amplitude abnormality ratio>1 indicates that the limit is exceeded, which may cause assembly misplacement, the frequency abnormality (actual frequency / safe frequency): high frequency vibration is easy to cause part fatigue damage, the product operation highlights the synergistic effect of both (such as high frequency+large amplitude risk is higher), which is consistent with the mechanical system vibration theory; S33, the sum of the stability analysis result of the assembly robot and the reciprocal of the matching analysis result of the corresponding assembly position is obtained to obtain the assembly abnormality analysis result of the corresponding position, wherein the reciprocal process here adds a very small value in the denominator in advance to avoid the meaningless denominator 0 when taking the reciprocal, the swing abnormality (stability problem) is combined with the reciprocal of the matching analysis result (matching problem), the assembly abnormality risk is quantified comprehensively, and the robot motion state (dynamic) and the part adaptability (static) are covered at the same time, which is suitable for high-precision assembly scene.

[0022] In the embodiment, the future use prediction includes the following specific content: The data transmission frequency and current transmission of the interface of the corresponding assembly position are obtained, and the assembly abnormality analysis result of the corresponding assembly position is obtained, the ratio of the data transmission frequency and current transmission of the interface of the corresponding assembly position to the corresponding safe value is multiplied to obtain the information transmission abnormal value, the information transmission abnormal value of the corresponding assembly position is summed with the assembly abnormality analysis result to obtain the future use abnormality prediction result of the corresponding assembly position, the future use abnormality prediction result of each corresponding assembly position is compared with the future use abnormality prediction threshold value, if the future use abnormality prediction result of one or more corresponding assembly positions is greater than or equal to the future use abnormality prediction threshold value, it indicates that the assembly process is abnormal, and the pre-warning maintenance is needed, if the future use abnormality prediction result of the corresponding assembly position is less than the future use abnormality prediction threshold value, it indicates that the assembly is normal, so that the abnormality prediction of the assembly result can be carried out before the assembly, which is beneficial to the discovery of the assembly abnormality in advance, and the safety and success rate of the assembly process are improved; It should be noted that the weight and threshold value acquisition method in the embodiment of the application is obtained by fitting historical data, and the specific implementation manner is as follows: the image condition of the historical assembly position before assembly and the signal transmission condition in the future use of the corresponding installation position are acquired, and the judgment result of whether the assembled board card meets the operation requirement within the working life time is acquired; the historical data is introduced into the embodiment to obtain the final prediction result; and the prediction result and the judgment result are introduced into the matlab fitting software to continuously fit, and the value of the set parameter meeting the maximum judgment result accuracy is output. In one specific embodiment, the fitting process includes the following specific steps: during the historical assembly process, high-precision industrial cameras are used to image the assembly position. In order to ensure the accuracy and integrity of the image, the parameters of the camera need to be set reasonably, such as resolution, exposure time, focal length, etc. For example, the camera resolution is set to 4096x3072 pixels to obtain clear assembly position details. At the same time, a multi-angle shooting method is used to record the image situation of the assembly position from different directions, avoiding visual blind area. For the signal transmission situation in the future use process of the corresponding installation position, professional signal monitoring equipment is used for real-time monitoring. These devices can measure the strength, frequency, stability, etc. of the signal, and conduct long-time running test on the assembled board card to record whether the board card meets the running needs within the working life time. The working life time can be set according to the design requirements of the product and industry standards, for example, for high-reliability liquid-cooled board card, the working life time is set to 50000 hours. During the test process, real-time monitoring of various performance indicators of the board card is carried out, such as temperature, power, signal transmission quality, etc. When the board card fails or its performance decreases to a certain extent, it is judged that the board card does not meet the working life requirement; otherwise, it is considered to meet the requirement. The pre-processed historical image feature data before assembly, signal transmission data and working life judgment result after assembly are imported into the prediction model of the embodiment. When importing data, it is necessary to ensure that the format and structure of the data match the requirements of the prediction model. For example, if the prediction model is written in Python, use Pandas library to import data into DataFrame format. Use the prediction model of the embodiment to process historical data and obtain the final prediction result. The prediction result and working life judgment result are imported into the Matlab fitting software. When importing data, ensure the accuracy and consistency of the data. According to the characteristics of the data and the type of the prediction model, select the appropriate fitting method, for example, if the prediction model is a nonlinear model, you can choose nonlinear least squares method for fitting. Set the initial weight and threshold parameters for the fitting process. These initial parameters can be set according to experience or prior knowledge, for example, the weights and thresholds of the neural network model can be initialized as random values, but they must be within a reasonable range. In Matlab, use the fitting function to iterate and fit. In each iteration process, calculate the error between the prediction result and the actual judgment result, then adjust the parameters according to the error. When the fitting process meets the termination condition (such as reaching the maximum number of iterations or the error is less than the set tolerance), output the value of the set parameter that meets the maximum judgment result accuracy, i.e. the weight and threshold.

[0023] It should be noted that the embodiment has the following advantages and benefits: the matching analysis of the connection position in the assembly process is performed through the matching analysis strategy, the assembly abnormality caused by the abnormal shaking of the machine in the assembly process is evaluated through the assembly abnormality analysis strategy, and the damage of each position is evaluated by comprehensively analyzing the matching analysis of the connection position and the assembly abnormality caused by the abnormal shaking, so that the abnormal prediction of the assembly result is performed before the assembly, the assembly abnormality can be found in advance, and the safety and success rate of the assembly process are improved.

[0024] Embodiment 2

[0025] The embodiment provides an automatic precise assembly process analysis method of a high-reliability liquid cooling variable board card, and is implemented in the automatic precise assembly process analysis system of the high-reliability liquid cooling variable board card in embodiment 1, and includes the following specific steps. First, the image condition of the assembly position before assembly and the signal transmission condition in the future use process of the corresponding mounting position are obtained. Secondly, the matching analysis of the connection position in the assembly process is performed through the matching analysis strategy. Then, the assembly abnormality caused by the abnormal shaking of the machine in the assembly process is evaluated through the assembly abnormality analysis strategy, and the damage of each position is evaluated by comprehensively analyzing the matching analysis of the connection position and the assembly abnormality caused by the abnormal shaking, and the future use prediction of the corresponding position is performed through the damage evaluation result of each position and the signal transmission condition in the future use process. Finally, the assembly process warning is performed according to the future use prediction result of the corresponding position, and the staff is reminded to process. The specific steps of each module of the embodiment of the system are the same as the specific steps of the method embodiment of embodiment 1, and will not be repeated here.

[0026] Embodiment 3

[0027] The electronic device provided in the embodiment of the application includes a processor and a memory, wherein the memory stores a computer program that can be called by the processor, and the processor executes the automatic precise assembly process analysis system of the high-reliability liquid cooling variable board card by calling the computer program stored in the memory. It should be noted that all computer programs of the automatic precise assembly process analysis method of the high-reliability liquid cooling variable board card are implemented by using C language.

[0028] Embodiment 4

[0029] The embodiment provides a computer readable storage medium, which stores an erasable computer program. When the computer program runs on the computer device, the computer device executes the automatic precise assembly process analysis method of the high-reliability liquid cooling variable board card.

[0030] The above-described embodiments can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented by software, the above-described embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the processes or functions according to the embodiments of the present application are wholly or partially generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center through a wired network or / and a wireless network. The computer-readable storage medium can be any available medium accessible by a computer or a data storage device such as a server, data center, etc. containing one or more available medium collections. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium. The semiconductor medium can be a solid-state disk.

[0031] Those skilled in the art can understand that the units and algorithm steps of the examples described in combination with the embodiments disclosed in the present application can be implemented in electronic hardware or a combination of computer software and electronic hardware. Whether the functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0032] Those skilled in the art can clearly understand that, for the convenience and brevity of the description, the specific working processes of the above-described system, device, and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be described here.

[0033] In several embodiments provided by the present application, it should be understood that the disclosed system, device, and method can be implemented in other ways. For example, the above-described device embodiments are merely schematic, for example, the division of units is only one, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed units can be indirect coupling or communication connection through some interfaces, devices, or units, which can be electrical, mechanical, or other forms.

[0034] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, i.e. may be located in one place, or may be distributed to multiple network units. Part or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.

[0035] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.

[0036] In the description of the present specification, the description referring to the terms "one embodiment", "an example", "a specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The basic principles and main features of the present application and the advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only illustrative of the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. An automated precision assembly process analysis system for high-reliability liquid-cooled variable board card, characterized in that, The specific modules include a data acquisition terminal, an assembly matching analysis module, an assembly robot evaluation module, a future use prediction module, and an assembly process early warning module. The data acquisition terminal is used to acquire image conditions of assembly positions before assembly and signal transmission conditions in future use of corresponding installation positions. The assembly matching analysis module is used to perform matching analysis of connection positions in the assembly process through a matching analysis strategy. The assembly robot evaluation module is used to evaluate assembly abnormalities caused by abnormal shaking of the machine in operation in the assembly process through an assembly abnormality analysis strategy, and to perform damage evaluation of each position by comprehensively analyzing the matching analysis of the connection positions and the assembly abnormalities caused by abnormal shaking. The future use prediction module is used to perform future use prediction of the corresponding positions based on the damage evaluation results of each position and the signal transmission conditions in the future use process. The assembly process early warning module is used to perform assembly process early warning based on the future use prediction results of the corresponding positions, and to remind the staff to handle it.

2. The automated precision assembly process analysis system for high-reliability liquid-cooled variable board card of claim 1, wherein, The data acquisition terminal includes an image acquisition unit, a machine operation data acquisition unit, and a board card use data acquisition unit. The image acquisition unit is used to acquire three-dimensional image data of the assembly positions before assembly of the corresponding board card. The machine operation data acquisition unit is used to acquire abnormal shaking frequency and shaking amplitude conditions of the output part of the assembly robot, wherein the corresponding shaking data is acquired by a shaking sensor. The board card use data acquisition unit is used to acquire data transmission frequency and current transmission conditions of each position interface in the historical use scene of the board card in use.

3. The automated precision assembly process analysis system for high-reliability liquid-cooled variable board card of claim 1, wherein, The matching analysis strategy includes the following specific steps: S21, acquire three-dimensional image data of the assembly positions before assembly for each position, and acquire differences in three-dimensional images of the connection positions based on the three-dimensional image data; S22, acquire hardness and elasticity conditions of the materials of the corresponding assembly positions, which are used to analyze damage to the assembly positions caused by mismatching of the assembly positions and abnormal stress caused by assembly stress in the assembly process, and perform assembly position damage resistance evaluation based on the hardness and elasticity conditions of the materials of the corresponding assembly positions, wherein the assembly position damage resistance evaluation method is to obtain a hardness safety value by acquiring a ratio of the hardness of the corresponding position to a safety hardness, obtain an elasticity safety value by acquiring a ratio of the elasticity of the corresponding position to a safety elasticity, and obtain an assembly position damage resistance evaluation result by weighted summation of the hardness safety value and the elasticity safety value; S23, perform matching analysis in the assembly process by the differences in the three-dimensional images of the assembly positions and the assembly position damage resistance evaluation results, wherein the specific steps of the matching analysis in the assembly process are to obtain a matching analysis result of the corresponding assembly position by weighted summation of the inverse of the differences in the three-dimensional images of the corresponding assembly positions and the assembly position damage resistance evaluation.

4. The automated precision assembly process analysis system for high-reliability liquid-cooled variable board card of claim 3, wherein, The assembly abnormality analysis strategy includes the following specific contents: S31, acquire shaking conditions of the output end in the running process of the assembly robot in the corresponding assembly process, including shaking amplitude and corresponding shaking frequency conditions; S32, carry out swing abnormality analysis through the swing amplitude and the corresponding swing frequency, wherein the specific content of the swing abnormality analysis is: divide the average swing amplitude by the safe swing amplitude in the corresponding assembly process to obtain the swing amplitude abnormality, divide the average swing frequency by the safe frequency in the corresponding assembly process to obtain the swing frequency abnormality, and multiply the swing amplitude abnormality and the swing frequency abnormality to obtain the swing abnormality of the assembly robot in the corresponding assembly process; S33, sum the stability analysis result of the assembly robot and the reciprocal of the matching analysis result of the corresponding assembly position to obtain the assembly abnormality analysis result of the corresponding position.

5. The automated precision assembly process analysis system for high-reliability liquid-cooled variable board card of claim 1, wherein, The future use prediction includes the following specific content: Obtain the data transmission frequency and current transmission situation of the interface of the corresponding assembly position, and the assembly abnormality analysis result of the corresponding assembly position, multiply the ratio of the data transmission frequency and current transmission situation of the interface of the corresponding assembly position to the corresponding safe value to obtain the information transmission abnormality value, sum the information transmission abnormality value and the assembly abnormality analysis result of the corresponding assembly position to obtain the future use abnormality prediction result of the corresponding assembly position, compare the future use abnormality prediction result of each corresponding assembly position with the future use abnormality prediction threshold value, if the future use abnormality prediction result of one or more corresponding assembly positions is greater than or equal to the future use abnormality prediction threshold value, it indicates that the assembly process is abnormal, and pre-warning maintenance is needed, if the future use abnormality prediction result of the corresponding assembly position is less than the future use abnormality prediction threshold value, it indicates that the assembly is normal.

6. The automated precision assembly process analysis system for high-reliability liquid-cooled variable board card of claim 3, wherein, The difference of the three-dimensional image includes the following specific content: obtain the three-dimensional image of the pre-assembly position and the three-dimensional image required by the to-be-assembled position, calculate the volume of the intersection of the three-dimensional image of the pre-assembly position and the three-dimensional image required by the to-be-assembled position at the corresponding installation angle, and calculate the volume of the union of the three-dimensional image of the pre-assembly position and the three-dimensional image required by the to-be-assembled position at the corresponding installation angle, divide the volume of the intersection by the volume of the union to obtain the similarity of the assembly position three-dimensional image, and subtract the similarity of the assembly position three-dimensional image from 1 to obtain the difference of the three-dimensional image.

7. The method of claim 1-6, wherein the method is implemented by the system of claim 1-6. It includes the following specific steps: First, obtain the image situation of the pre-assembly position and the signal transmission situation in the future use process of the corresponding installation position; Secondly, carry out matching analysis of the connection position in the assembly process through the matching analysis strategy; Then, evaluate the assembly abnormality caused by the abnormal swing of the machine in the assembly process through the assembly abnormality analysis strategy, and comprehensively evaluate the damage of each position through the matching analysis of the connection position and the assembly abnormality caused by the abnormal swing; carry out future use prediction of the corresponding position through the position damage evaluation result and the signal transmission situation in the future use process; Finally, carry out assembly process warning according to the future use prediction result of the corresponding position, and remind the staff to handle it.

8. An electronic device comprising: A processor and a memory, wherein the memory has stored a computer program which can be invoked by the processor; characterized in that the processor, by invoking the computer program stored in the memory, executes the automatic precision assembly process analysis method of the high-reliability liquid-cooled variable board card as claimed in claim 7.

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