Device for processing and detecting photovoltaic module

Abstract

The invention discloses a device for processing and detecting a photovoltaic module, and relates to the technical field of semiconductor manufacturing. A plurality of Bernoulli suckers are mounted at the bottom of a frame, and by means of high-speed flowing airflow sprayed from the plurality of Bernoulli suckers, the device can perform suspended adsorption on a semiconductor wafer, so that the semiconductor wafer is prevented from being damaged; the conveying mechanism and the driving mechanism are arranged in a matched mode, so that the device can drive the semiconductor sheet to move from one side to the other side at the bottom of the frame in the process of carrying the semiconductor sheet to process the photovoltaic module, and the detection probe is arranged in the middle of the bottom of the frame, so that the detection probe can be accurately detected in the processing and carrying process. Visual inspection is performed on the outer surface of the semiconductor sheet step by step, invalid production can be avoided, an extra detection device is not needed, the production process is effectively integrated, and the processing and production efficiency of the photovoltaic module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a device for processing and detecting photovoltaic modules. BACKGROUND

[0002] When using semiconductor wafers to process and produce photovoltaic modules, the structural integrity of the semiconductor wafers directly determines the power generation performance and product quality of the photovoltaic modules, so the industry generally screens defective raw materials through incoming inspection to ensure good production yield.

[0003] Currently, to achieve incoming inspection of semiconductor wafers, a separate detection device is usually configured during processing of photovoltaic modules. In the actual production process, the semiconductor wafers need to be transported from the storage boat to the detection device to complete quality inspection, and then transported again to the subsequent processing station for production of photovoltaic modules after being determined to be qualified. This production process of "transportation-detection-transportation again" not only increases the residence of semiconductor wafers in the detection station, but also forms a secondary transportation process, which prolongs the overall turnover cycle of semiconductor wafers from storage to processing. Moreover, multiple transportation and station switching not only increase the complexity of equipment scheduling, but also significantly increase the risk of bumping during processing of semiconductor wafers due to the increase in operation links, ultimately causing problems of production process redundancy and significant reduction in overall production efficiency. SUMMARY

[0004] The purpose of the present application is to solve the problem in the prior art that incoming inspection of semiconductor wafers during processing and production of photovoltaic modules needs to be completed by a separate detection device, which leads to complex production process and affects production efficiency and production stability. A device for processing and detecting photovoltaic modules is proposed.

[0005] To solve the problems in the prior art, the present application adopts the following technical solutions: A device for processing and detecting photovoltaic modules, comprising a frame, a plurality of vertically arranged connecting rods are uniformly installed in the frame, and a Bernoulli chuck is fixedly connected to the bottom end of the connecting rod, the Bernoulli chuck is externally connected to an air pump through an air pipe, the Bernoulli chuck is used to adsorb semiconductor wafers, a support is fixedly installed at the middle position of the bottom of the frame, and a detection probe is fixedly installed at the bottom of the support and arranged above the semiconductor wafers, a conveying mechanism is installed at the bottom of the frame, and a driving mechanism cooperates with the conveying mechanism, the conveying mechanism is used to control the semiconductor wafers to move from right to left at the bottom of the frame.

[0006] Preferably, the support is fixedly installed longitudinally at the bottom of the frame, and a plurality of detection probes are arranged, and the plurality of detection probes are longitudinally and uniformly distributed at the bottom of the support.

[0007] Preferably, the bottom of the frame is fixedly installed with a light shield cover sleeved outside the support, and the top inner end wall and the circumferential inner end wall of the light shield cover are fixedly installed with uniformly distributed shadowless lamps.

[0008] Preferably, the conveying mechanism comprises a wire rail fixedly transversely on the bottom of the frame, and the bottom of the wire rail is slidingly connected with a sliding table, the bottom of the sliding table is fixedly installed with a clamping jaw, and the clamping jaw is arranged in a 'n' shaped structure.

[0009] Preferably, the left and right lengths of the clamping jaw are adapted to the size of the semiconductor wafer, and the left and right side end walls of the clamping jaw are arranged in a symmetrical bent structure.

[0010] Preferably, the driving mechanism comprises two rollers rotatably installed on the left and right sides of the bottom of the frame, a transmission belt arranged in parallel with the wire rail is sleeved and transmitted between the two rollers, a first servo motor is fixedly installed in the frame, the driving shaft of the first servo motor is in transmission connection with one of the rollers, and the sliding table is fixedly connected with the transmission belt.

[0011] Preferably, the connecting rods are slidingly connected with the frame, a lifting mechanism connected with the top ends of the plurality of connecting rods is installed in the frame, and the lifting mechanism is used to control the up-and-down lifting of the plurality of Bernoulli suction cups on the left and right sides of the bottom of the frame.

[0012] Preferably, the lifting mechanism comprises two connecting frames slidingly installed on the left and right sides in the frame, one of the connecting frames is fixedly connected with the top ends of the plurality of connecting rods on the right side, the other connecting frame is fixedly connected with the top ends of the plurality of connecting rods on the left side, a gear rotatably installed between the left and right connecting frames is installed at the middle position in the frame, a vertical toothed rod is fixedly installed on the connecting frame, the two toothed rods are respectively in meshing connection with the left and right sides of the gear, and a second servo motor for driving the gear to rotate is fixedly installed in the frame.

[0013] Preferably, the top of the frame is installed with a turnover mechanism, and the turnover mechanism comprises a shaft frame fixedly connected with the top of the frame, a connecting table is hingedly connected to the other end of the shaft frame, a shaft seat is fixedly installed on the top of the frame, and a pneumatic push rod is hingedly connected between the shaft seat and the connecting table.

[0014] Preferably, the front and rear side end walls of the light shield cover extend downward to form a baffle, and the bottom of the baffle is located below the semiconductor wafer.

[0015] Compared with the prior art, the present application has the following advantages: 1. In the present application, by installing a plurality of Bernoulli suction cups at the bottom of the frame, the high-speed airflow sprayed from the plurality of Bernoulli suction cups can suspend and adsorb the semiconductor wafer, and by cooperating with the conveying mechanism and driving mechanism, the device can drive the semiconductor wafer to move from one side to the other side at the bottom of the frame during the process of transporting the semiconductor wafer to process photovoltaic components, and by arranging the detection probe at the middle position of the bottom of the frame, the outer surface of the semiconductor wafer can be visually detected step by step during the processing and transportation process, which is beneficial to avoid invalid production and does not need to pass through the additional detection device, effectively integrating the production process and improving the efficiency of photovoltaic component processing and production. 2. In the present application, by uniformly distributing a plurality of detection probes longitudinally at the middle position of the bottom of the frame, the device can comprehensively detect the semiconductor wafer during the processing and transportation process, and by arranging a plurality of detection probes to simultaneously perform shooting detection, the shooting coverage range of adjacent two detection probes can be partially overlapped, which not only can shoot and detect the top of the semiconductor wafer from multiple angles, but also can perform multiple verifications, which is beneficial to improve the accuracy of the device in processing and detecting the semiconductor wafer. 3. In the present application, by sleeving the light shield on the outside of the support, a relatively independent space can be formed outside the plurality of detection probes, which is beneficial to reduce the interference of external environmental light on the detection probe when shooting and detecting the semiconductor wafer, and at the same time, by uniformly fixing the shadowless lamps on the front, rear, left and right four inner end walls and the top inner end wall of the light shield, a shadowless area can be formed within the cage range of the light shield on the top of the semiconductor wafer during detection, which avoids the interference of light shadow on the detection of semiconductor wafer cracks, and cooperates with each other to effectively improve the accuracy of overall detection. 4. In the present application, by arranging the lifting mechanism in the frame, the plurality of Bernoulli suction cups on the left and right sides can be synchronously moved, and during the processing and detection process, the plurality of Bernoulli suction cups on the left and right sides are in the same plane under the control of the lifting mechanism, which guarantees the stability of the movement and detection of the semiconductor wafer, and when adsorbing or releasing the semiconductor wafer, the plurality of Bernoulli suction cups on the corresponding side will be controlled to be greatly projected outward, which is beneficial to improve the control accuracy and convenience of the device in adsorbing and releasing the semiconductor wafer. 5. In the present application, by arranging the turnover mechanism, the frame can be turned up during the processing and detection process, and the semiconductor wafer originally suspended and adsorbed at the bottom of the frame is turned over to the upper position, forming the lifting operation of the device to the semiconductor wafer, which can avoid the semiconductor wafer from falling during the transportation and processing and detection process, and is beneficial to guarantee the stability of photovoltaic component processing and production. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings: Figure 1 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 2 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 3 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 4 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 5 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 6 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 7 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 1 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 8 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 7 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 9 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 7 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 10 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 11 isometric view of the semiconductor wafer processing and detecting device of the present application; Figure 12 isometric view of the semiconductor wafer processing and detecting device of the present application.

[0017] in the drawings: 1, frame; 11, connecting rod; 12, Bernoulli chuck; 2, support; 21, detecting probe; 22, light shield; 23, shadowless lamp; 24, baffle; 3, linear rail; 31, sliding table; 32, clamping jaw; 4, roller; 41, transmission belt; 42, first servo motor; 5, connecting frame; 51, gear; 52, toothed rod; 53, second servo motor; 6, shaft frame; 61, connecting table; 62, shaft seat; 63, pneumatic push rod. DETAILED DESCRIPTION

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0019] Embodiment: This embodiment provides a device for processing and detecting photovoltaic modules. Refer to Figure 1 - Figure 12 , specifically, it includes a frame 1. A plurality of vertically arranged connecting rods 11 are evenly installed in the frame 1, and a Bernoulli suction cup 12 is fixedly connected to the bottom end of the connecting rod 11. The Bernoulli suction cup 12 is externally connected to an air pump through an air pipe. The Bernoulli suction cup 12 is used to adsorb the semiconductor wafer. A support 2 is fixedly installed at the middle position of the bottom of the frame 1, and a detection probe 21 arranged above the semiconductor wafer is fixedly installed at the bottom of the support 2. A conveying mechanism and a driving mechanism cooperating with the conveying mechanism are installed at the bottom of the frame 1. The conveying mechanism is used to control the semiconductor wafer to move from right to left at the bottom of the frame 1.

[0020] The conveying mechanism includes a wire rail 3 horizontally fixed at the bottom of the frame 1, and a slide table 31 is slidably connected to the bottom of the wire rail 3. A claw 32 is fixedly installed at the bottom of the slide table 31, and the claw 32 is set in a "冂" - shaped structure. The driving mechanism includes rollers 4 rotatably installed on the left and right sides at the bottom of the frame 1. A transmission belt 41 parallel to the wire rail 3 is sleeved between the two rollers 4. A first servo motor 42 is fixedly installed in the frame 1, and the driving shaft of the first servo motor 42 is传动连接 with one of the rollers 4. The slide table 31 is fixedly connected to the transmission belt 41.

[0021] When processing and producing photovoltaic modules, this device is used to carry the semiconductor wafers in the photovoltaic modules. This device is connected to a robotic arm, and the robotic arm is used to control the movement of this device to carry the semiconductor wafers to the processing station of the photovoltaic module. When this device adsorbs the semiconductor wafer, the plurality of Bernoulli suction cups 12 on the right approach the top of the semiconductor wafer. Then, the air pump is powered on and started to supply air flow to all the Bernoulli suction cups 12. The high - speed flowing air flows out through the air holes opened at the bottom of the Bernoulli suction cup 12 and acts on the top of the semiconductor wafer, forming a high - speed flowing air layer between the Bernoulli suction cup 12 and the semiconductor wafer, making the flow speed of the air on the top of the semiconductor wafer much greater than the flow speed of the air at its bottom. Under the Bernoulli effect, the semiconductor wafer is connected to the bottom of the Bernoulli suction cup 悬空 without contact. Note: There is an error in the original text where "传动连接" is used inappropriately. It should be "drivably connected" or "transmission - connected" etc. for correct grammar. Also, "悬空" should be "suspended in the air" for better expression.

[0022] When the semiconductor wafer is attracted by the multiple Bernoulli suction cups 12 on the right, the semiconductor wafer is within the engagement range of the chuck 32. During the process of using the device to transport the semiconductor wafer to the photovoltaic module processing station, the drive mechanism is activated in conjunction with the conveyor mechanism. After the first servo motor 42 is powered on, it drives the roller 4, which is fixedly connected to its drive shaft, to rotate. This drives the transmission belt 41, which is connected between the left and right rollers 4, to rotate. Since the slide table 31 is fixedly connected to the transmission belt 41, the rotation of the transmission belt 41 allows the slide table 31 to drive the chuck 32 to move from right to left along the rail 3. The chuck 32 engages on the outside of the semiconductor wafer. Driven by the movement of the chuck 32, the semiconductor wafer, which is suspended and attracted at the bottom of the multiple Bernoulli suction cups 12 on the right, is moved to the left. During the movement, it is gradually attracted by the multiple Bernoulli suction cups 12 on the left without contact. During the transportation and processing, the semiconductor wafer completes the operation of moving from right to left at the bottom of the frame 1.

[0023] When the semiconductor wafer is suspended and adsorbed at the bottom of the frame 1 and moves from right to left, the top of the semiconductor wafer will pass through the bottom of the detection probe 21 in an orderly manner. During this process, the detection probe 21 at the bottom of the bracket 2, which is installed in the middle of the bottom of the frame 1, can be used to capture images of the semiconductor wafer, thereby achieving visual inspection of the semiconductor wafer. This avoids the presence of cracks on the surface of the semiconductor wafer when it is transported to the photovoltaic module processing station. The semiconductor wafer is inspected during the raw material handling process in photovoltaic module processing to avoid invalid production. The operation is convenient and efficient, without the need for additional detection devices. It effectively integrates the production process, which is conducive to improving the efficiency of photovoltaic module processing and production, and effectively improving the yield of photovoltaic modules.

[0024] During the semiconductor wafer handling process, the semiconductor wafer after visual inspection is located on the left side of the bottom of frame 1. Subsequently, the semiconductor wafer is released from the left side of the bottom of frame 1 to the photovoltaic module processing station. After the semiconductor wafer is released, the device quickly resets to the initial state. The above operation is repeated continuously to transport the semiconductor wafer to the photovoltaic module processing station for processing and production.

[0025] In the specific implementation process, such as Figure 2 , Figure 3 and Figure 9As shown, the bracket 2 is vertically fixed at the bottom of the frame 1. Multiple detection probes 21 are evenly distributed vertically at the bottom of the bracket 2. When the device is in use, as the semiconductor wafer moves from right to left at the bottom of the frame 1, the multiple evenly distributed detection probes 21 can fully cover the top of the semiconductor wafer passing below, ensuring comprehensive synchronous detection during the semiconductor wafer handling and processing. By setting multiple detection probes 21 to simultaneously capture images, the distance between the detection probes 21 and the top of the semiconductor wafer can be effectively reduced while ensuring full coverage of the top of the semiconductor wafer. This not only effectively improves the clarity and accuracy of the image capture but also effectively reduces the overall height of the device, making it more flexible to move during semiconductor wafer handling and processing. Furthermore, by setting multiple detection probes 21 to capture images simultaneously, the coverage areas of adjacent detection probes 21 can partially overlap. With mutual cooperation, the top of the semiconductor wafer can be captured and detected from multiple angles, allowing for multiple verifications, thereby effectively improving the accuracy of the device in processing and detecting semiconductor wafers.

[0026] In the specific implementation process, such as Figure 1 - Figure 3 and Figure 8 - Figure 9 As shown, a light shield 22 is fixedly installed at the bottom of the frame 1 and sleeved on the outside of the support 2. Evenly distributed shadowless lamps 23 are fixedly installed on the inner top wall and the inner walls around the light shield 22. When the device is in use, by sleeved on the outside of the support 2, under the cover of the light shield 22, and with the movement of the semiconductor wafer below, a relatively independent space can be formed outside the multiple detection probes 21. This helps to reduce the interference of ambient light on the detection probes 21 when they photograph and detect the semiconductor wafer. At the same time, by evenly fixing the shadowless lamps 23 on the inner walls around the front, back, left, right and the top of the light shield 22, the device can be illuminated by numerous evenly distributed shadowless lamps 23 in multiple directions. A shadowless area is formed within the coverage area of ​​the light shield 22 on the top of the semiconductor wafer, avoiding interference from light shadows on the detection of cracks in the semiconductor wafer. With the cooperation of these factors, the overall detection accuracy can be effectively improved.

[0027] In the specific implementation process, such as Figure 4 and Figure 8As shown, the left and right lengths of the claw 32 are adapted to the size of the semiconductor wafer. The left and right end walls of the claw 32 are set as symmetrically arranged bent structures. When the device is in use, after the semiconductor wafer is attracted and gripped by the multiple Bernoulli suction cups 12 on the right side, the left and right end walls of the claw 32 engage with the left and right sides of the semiconductor wafer. By setting the left and right sides of the claw 32 as bent structures, the semiconductor wafer can enter the engagement range of the claw 32 more smoothly, which helps to ensure the stability of the device during operation.

[0028] In the specific implementation process, such as Figure 1 , Figure 5 , Figure 10 and Figure 12 As shown, the connecting rod 11 is slidably connected to the frame 1. A lifting mechanism connected to the top of multiple connecting rods 11 is installed inside the frame 1. The lifting mechanism is used to control the up and down movement of multiple Bernoulli suction cups 12 on the left and right sides of the bottom of the frame 1. The lifting mechanism includes two connecting frames 5 slidably installed on the left and right sides inside the frame 1. One connecting frame 5 is fixedly connected to the top of multiple connecting rods 11 on the right side, and the other connecting frame 5 is fixedly connected to the top of multiple connecting rods 11 on the left side. A gear 51 is rotatably installed in the middle position inside the frame 1 between the two connecting frames 5. A vertically arranged toothed rod 52 is fixedly installed on the connecting frame 5. The two toothed rods 52 are respectively meshed with the left and right sides of the gear 51. A second servo motor 53 for driving the gear 51 to rotate is fixedly installed inside the frame 1.

[0029] In use, the device is slidably connected to the frame 1 by the connecting rod 11 and controlled by a lifting mechanism. This allows the multiple Bernoulli suction cups 12 on the left and right sides to be adjusted in height. When adsorbing and gripping the semiconductor wafer, the multiple Bernoulli suction cups 12 on the right side can be manipulated to move downwards synchronously, causing them to extend downwards and outwards, facilitating their approach to the semiconductor wafer. When visual inspection of the semiconductor wafer is performed during transport, the multiple Bernoulli suction cups 12 on the right side can be manipulated to move upwards and reset, aligning with the multiple Bernoulli suction cups on the left side. The 12 are aligned to ensure that the semiconductor wafer can move smoothly from right to left under the suspension and adsorption of multiple Bernoulli suction cups 12 on both sides, as well as with the cooperation of the conveying mechanism and the driving mechanism. When the semiconductor wafer is released to the processing station, it is located on the left side of the bottom of the frame 1 and is suspended and adsorbed by multiple Bernoulli suction cups 12 on the left side. Through the driving of the lifting mechanism, the multiple Bernoulli suction cups 12 on the left side can be controlled to move downward synchronously, so that the multiple Bernoulli suction cups 12 on the left side drive the semiconductor wafer downward and protrude to the outside. This can effectively improve the convenience of placing the semiconductor wafer on the processing station.

[0030] When the lifting mechanism is used to drive the multiple Bernoulli suction cups 12 on the left and right sides to adjust their height, the second servo motor 53 is powered on and starts, driving the gear 51, which is fixedly connected to its drive shaft, to rotate. When it is necessary to control the multiple Bernoulli suction cups 12 on the right side to move downward and extend, the gear 51 is driven to rotate clockwise. With the meshing of the gear 51 and the right rack 52, the right rack 52 is driven to drive the right connecting frame 5 to move downward. With the connection of the multiple connecting rods 11 on the right side, the multiple Bernoulli suction cups 12 on the right side are driven to move downward synchronously. Conversely, when it is necessary to control the multiple Bernoulli suction cups 12 on the right side to move upward, it is only necessary to control the gear 51 to rotate counterclockwise.

[0031] When it is necessary to manipulate the multiple Bernoulli suction cups 12 on the left to move downwards and extend, the gear 51 is driven to rotate counterclockwise. With the meshing of the gear 51 and the left rack 52, the left rack 52 drives the left connecting frame 5 to move downwards. With the connection of the multiple connecting rods 11 on the left, the multiple Bernoulli suction cups 12 on the left move downwards synchronously. Conversely, when it is necessary to manipulate the multiple Bernoulli suction cups 12 on the left to move upwards, it is only necessary to manipulate the gear 51 to rotate clockwise.

[0032] During the operation of the lifting mechanism, since the left and right racks 52 are respectively meshed and connected to the left and right sides of the gear 51, and the left and right racks 52 are symmetrically arranged around the central axis of the gear 51, when the multiple Bernoulli suction cups 12 on the right side move downward and extend, the multiple Bernoulli suction cups 12 on the left side will move upward synchronously. When the multiple Bernoulli suction cups 12 on the left side move downward and extend, the multiple Bernoulli suction cups 12 on the right side will move upward synchronously. This makes the multiple Bernoulli suction cups 12 on the right side extend downward to a greater extent than the multiple Bernoulli suction cups 12 on the left side when using the multiple Bernoulli suction cups 12 on the right side to adsorb semiconductor films. Similarly, when using the multiple Bernoulli suction cups 12 on the left side to release semiconductor films, the multiple Bernoulli suction cups 12 on the left side extend downward to a greater extent than the multiple Bernoulli suction cups 12 on the right side. This helps to improve the control accuracy and convenience of the device when adsorbing and releasing semiconductor films.

[0033] In the specific implementation process, such as Figure 1 , Figure 6 and Figure 11As shown, a tilting mechanism is installed on the top of frame 1, and the tilting mechanism includes a shaft bracket 6 fixedly connected to the top of frame 1. A connecting platform 61 is hinged to the other end of the shaft bracket 6. A bearing seat 62 is fixedly installed on the top of frame 1, and a pneumatic push rod 63 is hinged between the bearing seat 62 and the connecting platform 61. When in use, the device is connected to the end of the robotic arm via the connecting platform 61. Because the top of frame 1 is hinged to the connecting platform 61 via the shaft bracket 6, and a pneumatic push rod 63 is hinged between the connecting platform 61 and the bearing seat 62 fixed to the top of frame 1, this allows the device to... During use, the pneumatic push rod 63 can be extended and retracted to pull the frame 1, allowing the frame 1 to rotate around the hinge axis of the shaft frame 6 and the connecting platform 61 under control, thus realizing the flipping operation of the frame 1. Through the flipping adjustment, the semiconductor wafers that were originally suspended and adsorbed below the many Bernoulli suction cups 12 at the bottom of the frame 1 can be flipped to the upper position. During the transportation process, the device forms a lifting operation for the semiconductor wafers, which can prevent the semiconductor wafers from falling off during transportation and processing, and helps to ensure the stability of photovoltaic module processing and production.

[0034] In the specific implementation process, such as Figure 1 , Figure 8 , Figure 9 and Figure 11 As shown, the front and rear end walls of the light shield 22 extend downward to form baffles 24, and the bottom of the baffles 24 is located below the semiconductor wafer. When the device is in use, by extending the front and rear end walls of the light shield 22 downward to form baffles 24, the baffles 24 restrict the front and rear sides of the semiconductor wafer as it moves from right to left at the bottom of the multiple Bernoulli suction cups 12. Combined with the restriction of the left and right sides of the semiconductor wafer by the end walls of the claws 32, the semiconductor wafer can be precisely positioned and restricted when suspended and adsorbed. With this combined effect, it can also... To prevent the semiconductor wafer from slipping off the side during the flipping process of the frame 1, which helps ensure the stability of the device during the semiconductor wafer handling process, the flipping mechanism can be set horizontally so that the direction in which the frame 1 is driven to flip is on the same plane as the direction in which the semiconductor wafer moves from right to left at the bottom of the frame 1. With this setting, there is no need to extend the front and rear end walls of the light shield 22 downward to form a baffle 24. When the frame 1 is flipped upward, the semiconductor wafer will also maintain a stable adsorption connection state due to the restriction of the left and right end walls of the claw 32.

[0035] Specifically, the working principle of this invention is as follows: During the photovoltaic module manufacturing process, this device transports semiconductor wafers to the processing station. During transport, the semiconductor wafers are first suspended and adsorbed onto the bottom of multiple Bernoulli suction cups 12 on the right side, causing them to engage with the jaws 32. Then, through the cooperation of the conveying mechanism and the drive mechanism, the jaws 32, driven by the rotation of the transmission belt 41, can move along the guide rail 3 from right to left, synchronously moving the semiconductor wafers from right to left. During this process, multiple detection probes 21, arranged in an orderly fashion on the top of the semiconductor wafer from the bottom, pass through it, and the semiconductor wafers are monitored by the detection probes 21. The device captures images of the semiconductor wafers to achieve visual inspection, preventing cracks on the surface of the wafers when transported to the photovoltaic module processing station. During the process of transporting and processing semiconductor wafers and simultaneously inspecting them, the frame 1 can be pulled and adjusted by the extension and retraction of the pneumatic push rod 63. Under control, the frame 1 rotates around the hinge axis of the shaft 6 and the connecting table 61, thus flipping the frame 1. This flips the semiconductor wafers that were originally suspended and attached to the bottom of the frame 1 below the numerous Bernoulli suction cups 12 to the upper position, preventing the semiconductor wafers from falling off during the transport and processing.

[0036] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A device for processing and testing photovoltaic modules, comprising a frame (1), characterized in that: A plurality of vertically arranged connecting rods (11) are evenly installed inside the frame (1), and a Bernoulli suction cup (12) is fixedly connected to the bottom end of the connecting rod (11). The Bernoulli suction cup (12) is externally connected to an air pump through an air pipe. The Bernoulli suction cup (12) is used to adsorb the semiconductor wafer. A bracket (2) is fixedly installed at the middle position of the bottom of the frame (1), and a detection probe (21) arranged above the semiconductor wafer is fixedly installed at the bottom of the bracket (2). A conveying mechanism and a driving mechanism cooperating with the conveying mechanism are installed at the bottom of the frame (1). The conveying mechanism is used to control the semiconductor wafer to move from right to left at the bottom of the frame (1).

2. The device for processing and testing photovoltaic modules according to claim 1, characterized in that: The bracket (2) is longitudinally and fixedly installed at the bottom of the frame (1). A plurality of the detection probes (21) are provided, and the plurality of detection probes (21) are longitudinally and evenly distributed at the bottom of the bracket (2).

3. The apparatus for processing and testing photovoltaic modules according to claim 2, characterized in that: A light-shielding cover (22) sleeved outside the bracket (2) is fixedly installed at the bottom of the frame (1), and evenly distributed shadowless lamps (23) are fixedly installed on the inner end wall of the top and the inner end walls around the light-shielding cover (22).

4. The apparatus for processing and testing photovoltaic modules according to claim 3, characterized in that: The conveying mechanism includes a wire rail (3) horizontally fixed at the bottom of the frame (1), and a sliding table (31) is slidably connected to the bottom of the wire rail (3). A claw (32) is fixedly installed at the bottom of the sliding table (31), and the claw (32) is set in a "冂" - shaped structure.

5. The apparatus for processing and testing photovoltaic modules according to claim 4, characterized in that: The left - right length of the claw (32) is adapted to the size of the semiconductor wafer, and the left - right side end walls of the claw (32) are set in a symmetrically arranged bent - shaped structure.

6. The apparatus for processing and testing photovoltaic modules according to claim 4, characterized in that: The driving mechanism includes rollers (4) rotatably installed on the left and right sides at the bottom of the frame (1). A transmission belt (41) parallel to the wire rail (3) is sleeved and传动 connected between the two rollers (4). A first servo - motor (42) is fixedly installed inside the frame (1), and the driving shaft of the first servo - motor (42) is传动 connected to one of the rollers (4). The sliding table (31) is fixedly connected to the transmission belt (41).

7. The apparatus for processing and testing photovoltaic modules according to claim 1, characterized in that: The connecting rod (11) is slidably connected to the frame (1). A lifting mechanism connected to the top ends of the plurality of connecting rods (11) is installed inside the frame (1), and the lifting mechanism is used to control the up - and - down lifting of the plurality of Bernoulli suction cups (12) on the left and right sides at the bottom of the frame (1).

8. The apparatus for processing and testing photovoltaic modules according to claim 7, characterized in that: The lifting mechanism includes two connecting frames (5) slidably installed on the left and right sides inside the frame (1). One of the connecting frames (5) is fixedly connected to the top ends of the plurality of connecting rods (11) on the right side, and the other connecting frame (5) is fixedly connected to the top ends of the plurality of connecting rods (11) on the left side. A gear (51) arranged between the left and right connecting frames (5) is rotatably installed at the middle position inside the frame (1). A vertically arranged toothed rod (52) is fixedly installed on the connecting frame (5), and the two toothed rods (52) are respectively meshed with the left and right sides of the gear (51). A second servo - motor (53) for driving the gear (51) to rotate is fixedly installed inside the frame (1).

9. The apparatus for processing and testing photovoltaic modules according to claim 4, characterized in that: The top of the frame (1) is equipped with a flipping mechanism, and the flipping mechanism includes a shaft frame (6) fixedly connected to the top of the frame (1). The other end of the shaft frame (6) is hinged to a connecting table (61). The top of the frame (1) is fixedly equipped with a shaft seat (62), and a pneumatic push rod (63) is hinged between the shaft seat (62) and the connecting table (61).

10. The apparatus for processing and testing photovoltaic modules according to claim 9, characterized in that: The front and rear end walls of the light shield (22) extend downward to form baffles (24), and the bottom of the baffles (24) is located below the semiconductor wafer.

Images