Three-dimensional phase change radiator

Abstract

The invention provides a three-dimensional phase change radiator which comprises a substrate and radiating fins, the substrate comprises a substrate shell and a substrate cover plate, the substrate shell and the substrate cover plate are sealed and enclosed to form a heat absorption evaporation cavity, and the radiating fins are fixed on the substrate cover plate; the radiating fins are provided with multi-pipeline condensation pipes and single-pipeline condensation pipes which are communicated with each other, the multi-pipeline condensation pipes are positioned in the upper areas of the radiating fins, and the single-pipeline condensation pipes are positioned in the lower areas of the radiating fins; wherein a gas-phase heat transfer working medium flows into the multi-pipeline condensation pipe, the cooling phase is changed into a liquid phase, the single-pipeline condensation pipe guides a liquid-phase heat transfer working medium to flow back to a liquid storage area of the heat absorption evaporation cavity, and the heat dissipation efficiency and capacity of the whole radiator are improved through a differential pipeline structure. Furthermore, an enhanced evaporation heat absorption structure and / or a metal powder sintered porous liquid absorption core are / is arranged at the position, corresponding to a heat source, of the substrate, the evaporation heat exchange area can be increased, and the heat exchange rate is effectively increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of phase change heat sinks, in particular to a three-dimensional phase change heat sink. BACKGROUND

[0002] With the rapid development of semiconductor technology, the integration of high-power components is becoming higher and higher, and the power density is also becoming larger and larger. When working, the heat generated is getting larger and larger, and the heat flow density is getting higher and higher. The conventional heat sink is difficult to meet the heat dissipation demand of high heat flow density. If the heat generated by the power device cannot be quickly dissipated, the temperature of the chip in the power device will rise, which may cause the working efficiency to decrease and the service life to be shortened, or even cause the device to fail. Therefore, it is necessary to develop a high-efficiency heat sink to solve the problem of heat dissipation of high-power devices with high heat flow density and large heat.

[0003] In order to solve the problem of heat dissipation of multi-heat-source high-heat-flow chips, most manufacturers are currently developing three-dimensional (3D) phase change heat dissipation technology. That is, a sealed cavity is arranged in the heat sink substrate in contact with the chip (heat source) and the heat dissipation fin combined with the heat sink substrate. A certain amount of heat transfer working medium is filled in the sealed cavity. The heat transfer working medium absorbs heat and evaporates in the heat sink substrate to absorb heat from the heat source combination part, and becomes a gas. The gas enters the heat dissipation fin to condense and release heat, and conducts heat to the air flowing through the heat dissipation fin and carries away the heat. After the gas condenses, it returns to the heat sink substrate heat absorption and evaporation cavity by gravity to participate in the next evaporation and condensation heat conduction and heat dissipation cycle. This type of heat sink has fast heat conduction rate, high heat dissipation efficiency, and can meet the heat dissipation demand of the latest high-heat-flow chips in the 5G communication, power electronics and other industries. It is a new type of high-efficiency heat dissipation technology.

[0004] However, due to the limitation of circuit system layout, the position of the high-heat-flow chip is usually located in the middle and upper part of the heat sink. Especially for the multi-high-flow chip system of the 5G communication base station, the liquid level of the heat transfer working medium is usually set above the heat source position, so that the liquid level above the internal pipeline of the heat dissipation fin is a high-temperature condensation zone, and the liquid level below is a low-temperature zone, which greatly reduces the heat dissipation efficiency of the fin, thereby reducing the heat dissipation capacity and worsening the heat dissipation condition, limiting the application of the heat sink. SUMMARY

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a three-dimensional phase change heat sink to solve the problem of low heat dissipation efficiency of the heat sink in the prior art.

[0006] To achieve the above-mentioned purpose and other related purposes, the present application provides a three-dimensional phase change heat sink, which at least comprises:

[0007] The substrate includes a substrate shell and a substrate cover plate. The substrate shell and the substrate cover plate form a heat-absorbing evaporation cavity located inside the substrate. The upper region of the heat-absorbing evaporation cavity is a vapor region, and the lower region of the heat-absorbing evaporation cavity is a liquid storage region.

[0008] A heat source mounting part is located on the outside of the substrate housing corresponding to the liquid storage area;

[0009] The heat dissipation fins are fixed to the base plate cover. Each heat dissipation fin includes interconnected multi-channel condenser tubes and single-channel condenser tubes. The multi-channel condenser tubes are located in the upper region of the heat dissipation fins, and the single-channel condenser tubes are located in the lower region of the heat dissipation fins. A steam inlet is provided in the upper region of the heat dissipation fins, connected to the multi-channel condenser tubes, which are also connected to the steam zone through the steam inlet. A liquid return port is provided in the lower region of the heat dissipation fins, connected to the single-channel condenser tubes, which are also connected to the liquid storage zone through the liquid return port.

[0010] Preferably, the multi-pipe condenser includes a mesh-like multi-pipe structure.

[0011] Preferably, the single-pipe condenser includes a U-shaped zigzag single-pipe structure.

[0012] Preferably, the lower part of the multi-pipe condenser is inclined, and the side away from the substrate is lower than the side close to the substrate.

[0013] Preferably, an enhanced evaporation heat exchange structure is provided on the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source mounting part.

[0014] Preferably, a metal powder sintered porous liquid-absorbing core is also provided on the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source installation part.

[0015] Preferably, the heat dissipation fins include a composite plate structure, comprising a first plate and a second plate joined together, wherein the multi-pipe condenser tube and the single-pipe condenser tube are formed by a rolling and blowing process or a mold forming and brazing process.

[0016] Preferably, the heat dissipation fins have a single-sided bulging structure or a double-sided bulging structure.

[0017] Preferably, the heat-absorbing evaporation cavity is connected to the plurality of heat dissipation fins to form an integrated structure.

[0018] Preferably, a support column is also provided in the heat-absorbing evaporation chamber to form a microchannel in the heat-absorbing evaporation chamber.

[0019] As described above, the three-dimensional phase change heat sink of the present invention has the following beneficial effects:

[0020] 1. This invention employs a multi-pipe structure in the upper region of the heat dissipation fins, resulting in a large condensation heat exchange surface area, uniform temperature, and high heat exchange efficiency. The lower region of the heat dissipation fins adopts a single-pipe structure, which facilitates the flow of the condensed liquid heat transfer medium from top to bottom within the single pipe. This ensures uniform temperature in the lower part of the heat dissipation fins and avoids localized low-temperature zones caused by poor or stagnant flow of the liquid heat transfer medium in the lower part, thereby improving the overall heat dissipation efficiency and capacity of the radiator.

[0021] 2. The present invention increases the evaporation heat exchange area and improves the heat exchange rate by setting a reinforced evaporation heat absorption structure on the inner wall of the heat absorption evaporation cavity corresponding to the heat source installation part.

[0022] 3. By setting a metal powder sintered porous liquid-absorbing core on the inner wall of the heat-absorbing evaporation chamber corresponding to the heat source installation part, the present invention can further enhance boiling heat transfer and reduce evaporation temperature difference and thermal resistance.

[0023] 4. This invention integrates a heat-absorbing evaporation chamber with multiple heat dissipation fins to form a single structure. This allows the heat transfer medium to absorb heat in the heat-absorbing evaporation chamber, becoming a gaseous heat transfer medium. It then flows into the heat dissipation fins, releases heat, and condenses into a liquid heat transfer medium. The liquid heat transfer medium then flows back into the heat-absorbing evaporation chamber, completing a heat dissipation cycle. Based on the gas-liquid phase change heat transfer mechanism of the heat transfer medium, this invention achieves highly efficient heat transfer, ensuring the uniformity of the overall temperature field of the radiator while also possessing high thermal conductivity and excellent heat dissipation efficiency. Furthermore, its highly compact structure provides greater adaptability.

[0024] 5. The three-dimensional phase change heat sink of the present invention can effectively solve the temperature uniformity requirements and heat dissipation problems of high heat flux and multiple heat sources.

[0025] 6. The three-dimensional phase change heat sink of the present invention can be widely used in fields such as 5G communication, AI data centers and edge computing, high-power laser equipment, power electronics and new energy. Attached Figure Description

[0026] Figure 1 The diagram shown is a three-dimensional structural schematic of a three-dimensional phase change heat sink according to an embodiment of the present invention.

[0027] Figure 2 The diagram shown is an exploded view of the three-dimensional structure of a three-dimensional phase change heat sink according to an embodiment of the present invention.

[0028] Figure 3 The diagram shown is a cross-sectional view of a three-dimensional phase change heat sink according to an embodiment of the present invention.

[0029] Figure 4The diagram shown is a structural schematic of the heat dissipation fins of a three-dimensional phase change heat sink according to an embodiment of the present invention.

[0030] Figure 5 The diagram shows a cross-sectional view of the heat dissipation fins of a three-dimensional phase change heat sink according to an embodiment of the present invention.

[0031] Figure 6 The diagram shows a schematic of the substrate housing of a three-dimensional phase change heat sink according to an embodiment of the present invention.

[0032] Component designation explanation

[0033] 100 - Substrate; 110 - Substrate shell; 120 - Substrate cover plate; 130 - Enhanced evaporation heat exchange structure; 140 - Metal powder sintered porous liquid wick; 150 - Support column; 200 - Heat dissipation fins; 210 - Steam inlet; 220 - Multi-pipe condenser; 230 - Single-pipe condenser; 240 - Liquid reflux port; 250 - Double-sided bulging structure; 260 - First plate; 270 - Second plate; 300 - Heat transfer medium; 400 - Heat source. Detailed Implementation

[0034] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0035] Please see Figures 1 to 6 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0036] like Figures 1 to 3 As shown, this embodiment provides a three-dimensional phase change heat sink, which includes at least:

[0037] The substrate 100 includes a substrate shell 110 and a substrate cover plate 120. The substrate shell 110 and the substrate cover plate 120 constitute a heat-absorbing evaporation cavity located within the substrate 100. The upper region of the heat-absorbing evaporation cavity is a vapor region, and the lower region of the heat-absorbing evaporation cavity is a liquid storage region.

[0038] A heat source mounting part (not shown) is located on the outside of the substrate housing 110 corresponding to the liquid storage area;

[0039] A heat dissipation fin 200 is fixed to the substrate cover plate 120. The heat dissipation fin 200 includes interconnected multi-channel condenser tubes 220 and single-channel condenser tubes 230. The multi-channel condenser tubes 220 are located in the upper region of the heat dissipation fin 200, and the single-channel condenser tubes 230 are located in the lower region of the heat dissipation fin 200. The upper region of the heat dissipation fin 200 has a steam inlet 210 connected to the multi-channel condenser tubes 220, and the multi-channel condenser tubes 220 are connected to the steam zone through the steam inlet 210. The lower region of the heat dissipation fin 200 has a liquid return port 240 connected to the single-channel condenser tube 230, and the single-channel condenser tube 230 is connected to the liquid storage zone through the liquid return port 240.

[0040] Specifically, the three-dimensional phase change heat sink also includes a heat transfer medium 300, such as... Figure 3 As shown, the heat transfer medium 300 is filled in the heat absorption evaporation cavity and the heat dissipation fin 200 in the substrate 100. The heat dissipation fin cavity is composed of the multi-pipe condenser 220 and the single-pipe condenser 230. The heat absorption evaporation cavity and the heat dissipation fin cavity are connected sealed cavities. In the heat absorption evaporation cavity, the heat transfer medium 300 changes from a liquid phase heat transfer medium to a gas phase heat transfer medium. The gas phase heat transfer medium enters the multi-pipe condenser 220 and is cooled into a liquid phase heat transfer medium. The liquid phase heat transfer medium flows back to the heat absorption evaporation cavity through the single-pipe condenser 230.

[0041] Among them, such as Figure 3 As shown, the heat source mounting section is equipped with a heat source 400. The types of heat sources 400 may include high heat flux chips or modules used in fields such as 5G communication, AI data centers and edge computing, high-power laser equipment, power electronics and new energy. The number and installation method of the heat sources 400 are not described here.

[0042] Specifically, such as Figure 2 and Figure 3As shown, the steam inlet 210 and the liquid return port 240 within the heat dissipation fins 200 pass through the substrate cover plate 120 and are connected to the heat absorption evaporation chamber. The substrate cover plate 120 has mounting grooves corresponding to the steam inlet 210 and the liquid return port 240 respectively; the steam inlet 210 and the liquid return port 240 pass through their respective mounting grooves. The steam inlet 210 is used to introduce the gaseous heat transfer medium generated in the heat absorption evaporation chamber into the heat dissipation fins 200, and the liquid return port 240 is used to return the condensed liquid heat transfer medium in the heat dissipation fins 200 to the heat absorption evaporation chamber. Together, they form a circulating path for the heat transfer medium 300.

[0043] As an example, the multi-pipe condenser 220 may include a mesh-like multi-pipe structure, but is not limited thereto.

[0044] Specifically, the multi-channel condenser 220 can be an irregular mesh or a regular mesh. The multi-channel condenser 220 can be a circular mesh structure or a honeycomb structure, etc., but is not limited to these; it is only an example for illustration.

[0045] In this example, such as Figure 3 and Figure 4 As shown, the multi-pipe condenser 220 is preferably a honeycomb multi-pipe condenser structure, in which steam releases heat and condenses into a liquid heat transfer medium within the honeycomb pipes; the honeycomb multi-pipe structure has a large condensation heat exchange surface area, uniform temperature, and high heat exchange efficiency.

[0046] As an example, the single-pipe condenser 230 may include a U-shaped zigzag single-pipe structure, but is not limited thereto.

[0047] Specifically, the single-pipe condenser 230 can be a serpentine single-pipe structure, a zigzag single-pipe structure, a spiral single-pipe structure, etc., but is not limited to these; this is just an example.

[0048] In this embodiment, the single-pipe condenser 230 is preferably a U-shaped zigzag single-pipe structure. The liquid heat transfer medium condensed in the upper region flows from top to bottom along the multi-bend single pipe and flows into the heat absorption evaporation chamber at the outlet. Since the liquid heat transfer medium is in a flowing state, the uniformity of temperature distribution in the lower region of the heat dissipation fins 200 is effectively ensured.

[0049] In this embodiment, the multi-pipe condenser tube 220 is arranged in the upper region of the heat dissipation fins 200, which results in a large condensation heat exchange surface area, uniform temperature, and high heat exchange efficiency. The single-pipe condenser tube 230 is arranged in the lower region of the heat dissipation fins 200, which facilitates the flow of the condensed liquid heat transfer medium from top to bottom in the single pipe. This makes the temperature in the lower region of the heat dissipation fins 200 uniform and avoids local low temperature areas caused by poor flow or stagnation of the liquid heat transfer medium in the lower region, thereby improving the heat dissipation efficiency and heat dissipation capacity of the entire radiator.

[0050] As an example, the lower part of the multi-channel condenser 220 is inclined, and the side away from the substrate 100 is lower than the side close to the substrate 100.

[0051] Specifically, such as Figure 4 As shown, the lower part of the multi-pipe condenser 220 on the side away from the substrate 100 is connected to the single-pipe condenser 230. The heat transfer medium outlet of the multi-pipe condenser 220 is connected to the inlet of the single-pipe condenser 230. The lower part of the multi-pipe condenser 220 is designed with an inclined structure to promote the flow of the liquid phase heat transfer medium formed by condensation towards the single-pipe condenser 230.

[0052] As an example, the liquid level in the heat-absorbing evaporation chamber is at least higher than the height of the heat source mounting portion at the top.

[0053] Specifically, to ensure that each heat source mounting part can make sufficient contact with the heat transfer medium 300 in the heat absorption evaporation chamber to achieve efficient heat absorption, the liquid level of the heat transfer medium 300 in the heat absorption evaporation chamber is configured to be no less than the height of the highest end face of the heat source mounting part located at the uppermost position among all the heat source mounting parts; and the number of heat source mounting parts is set to at least one to meet the heat absorption requirements of one or more heat sources 400.

[0054] In this embodiment, as Figure 2 , Figure 3 and Figure 6 As shown, the heat source mounting part is disposed in the upper middle region of the substrate 100, and the height of each heat source mounting part does not exceed the liquid level of the heat transfer medium 300; at the same time, the center line or reference plane of all the heat source mounting parts is located on the same horizontal line to ensure that the contact state between each heat source mounting part and the heat transfer medium 300 is consistent, thus ensuring the uniformity of heat absorption efficiency.

[0055] As an example, an enhanced evaporative heat exchange structure 130 is also provided on the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source mounting part.

[0056] Specifically, such as Figure 2 ,Figure 3 and Figure 6 As shown, the enhanced evaporation heat transfer structure 130 is provided on the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source mounting part. The enhanced evaporation heat transfer structure 130 can be an array of protruding structures, which can be manufactured on the substrate shell 110 by subtractive processing. The enhanced evaporation heat transfer structure 130 increases the contact area with the liquid phase heat transfer medium, enabling faster heat absorption and transfer.

[0057] As an example, a metal powder sintered porous liquid-absorbing core 140 is also provided on the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source mounting part.

[0058] Specifically, such as Figure 3 and Figure 6 As shown, the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source installation part is lined with the metal powder sintered porous liquid-absorbing core 140. The metal powder sintered porous liquid-absorbing core 140 can further enhance boiling heat transfer and reduce evaporation temperature difference and thermal resistance.

[0059] Specifically, the material in the sintered porous liquid wick 140 may include, but is not limited to, aluminum powder, nickel powder, copper powder, etc. In this embodiment, the sintered porous liquid wick 140 is preferably made of aluminum powder.

[0060] Specifically, for the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source installation part, a technical solution can be adopted to simultaneously set the enhanced evaporation heat exchange structure 130 and the metal powder sintered porous liquid-absorbing core 140, so that the two structures work together in the inner wall area to improve the evaporation heat exchange efficiency of the heat transfer medium 300 near the heat source 400.

[0061] In this embodiment, as Figure 3 As shown, the enhanced evaporation heat exchange structure 130 and the metal powder sintered porous liquid absorption core 140 are simultaneously provided on the inner wall of the heat absorption evaporation cavity corresponding to the heat source mounting part. The enhanced evaporation heat exchange structure 130 is located on the inner wall of the heat absorption evaporation cavity and is provided on the side adjacent to the heat source mounting part, corresponding to the heat source mounting part, so as to effectively dissipate heat from the heat source 400 located in the heat source mounting part in a timely manner.

[0062] As an example, the heat dissipation fins 200 can be a composite plate structure, including a first plate 260 and a second plate 270 assembled together, and the multi-pipe condenser tube 220 and the single-pipe condenser tube 230 are formed by rolling and blowing process or mold forming and brazing process.

[0063] Specifically, the first plate 260 and the second plate 270 are both made of metal materials with good thermal conductivity, which may include, but are not limited to, copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy or any combination of one or more. The first plate 260 and the second plate 270 may be a single layer or multiple layers of materials, but the inner layer is preferably an aluminum material layer.

[0064] In this example, the first plate 260 and the second plate 270 can be copper-aluminum composite plates including copper and aluminum material layers, stainless steel-aluminum composite plates including stainless steel and aluminum material layers, or titanium-aluminum composite plates including titanium and aluminum material layers. The inner layers of the first plate 260 and the second plate 270 can be set to aluminum material layers and made in contact with each other. When the first plate 260 and the second plate 270 are aluminum-copper composite plates, it can be ensured that the copper material layer is located on the outer side, that is, the outer surface of the heat dissipation fins 200 is a copper layer, which can be directly welded and has excellent heat dissipation performance.

[0065] As an example, the heat dissipation fins 200 are in the form of a single-sided bulging structure or a double-sided bulging structure 250.

[0066] Specifically, the single-sided bulging structure has a protrusion on one surface of the heat dissipation fin 200 while the other surface remains flat. The double-sided bulging structure 250 has protrusions on both surfaces of the heat dissipation fin 200. The protrusions formed by the blowing process increase the contact area between the heat dissipation fin 200 and the cooling medium, thereby improving heat dissipation efficiency. The heat dissipation fin 200 can be either a single-sided bulging structure or a double-sided bulging structure 250, depending on the requirements. No particular limitation is made here to expand the application range of the heat dissipation fin combination phase change heat sink.

[0067] In this embodiment, as Figure 5 As shown, the heat dissipation fin 200 adopts a double-sided expansion structure 250. Both sides of the heat dissipation fin 200 are formed with two-sided protrusion structures through an expansion process. The protrusion structures extend along the length or width direction of the heat dissipation fin 200 to increase the contact area between the heat dissipation fin 200 and the external cooling medium (such as air). At the same time, a flow channel is formed between adjacent protrusion structures to facilitate the flow of the cooling medium, thereby improving the heat exchange efficiency of the heat dissipation fin 200.

[0068] As an example, the heat-absorbing evaporation cavity is connected to the plurality of heat dissipation fins 200 to form an integrated structure.

[0069] In this embodiment, as Figure 2 and Figure 6As shown, the heat-absorbing evaporation chamber has no partitions and is connected to the substrate cover plate 120, the substrate shell 110, and multiple heat dissipation fins 200 to form an integrated sealed structure. The heat transfer medium 300 absorbs heat within the heat-absorbing evaporation chamber and undergoes a phase change to become a gaseous heat transfer medium. This gaseous heat transfer medium flows into the heat dissipation fins, releases heat, condenses, and transforms into a liquid heat transfer medium. The liquid heat transfer medium then flows back into the heat-absorbing evaporation chamber, thus completing one heat dissipation cycle. Based on the gas-liquid phase change heat transfer mechanism of the heat transfer medium 300, the structure of this embodiment can achieve efficient heat transfer, ensuring the uniformity of the overall temperature field of the radiator while also possessing high thermal conductivity and excellent heat dissipation efficiency. Furthermore, the structure is highly compact and has stronger adaptability.

[0070] As an example, a support column 150 is also provided in the heat absorption evaporation chamber to form a microchannel in the heat absorption evaporation chamber.

[0071] Specifically, such as Figure 2 and Figure 6 As shown, the heat-absorbing evaporation cavity is further provided with a plurality of support columns 150. The support columns 150 are arranged in a predetermined pattern along the length and width directions of the heat-absorbing evaporation cavity, and a gap is formed between two adjacent support columns 150. The gap constitutes a microchannel in the heat-absorbing evaporation cavity. The microchannel is used to allow the heat transfer medium 300 in the heat-absorbing evaporation cavity to flow. The support columns 150 can support the inner wall of the heat-absorbing evaporation cavity, so as to prevent the heat-absorbing evaporation cavity from deforming due to the pressure difference between the inside and outside, which would cause the microchannel to become blocked.

[0072] In summary, this invention provides a three-dimensional phase change heat sink, comprising a substrate and heat dissipation fins. The substrate includes a substrate shell and a substrate cover plate, which are sealed together to form a heat-absorbing evaporation cavity. The heat dissipation fins are fixed to the substrate cover plate. The heat dissipation fins are provided with interconnected multi-channel condenser tubes and single-channel condenser tubes. The multi-channel condenser tubes are located in the upper region of the heat dissipation fins, and the single-channel condenser tubes are located in the lower region of the heat dissipation fins. The multi-channel condenser tubes supply the gaseous heat transfer medium, which is then cooled and transformed into a liquid phase. The single-channel condenser tubes guide the liquid phase heat transfer medium back to the liquid storage area of ​​the heat-absorbing evaporation cavity. This differentiated pipeline structure improves the overall heat dissipation efficiency and capacity of the heat sink. Furthermore, by providing a reinforced evaporation heat absorption structure and / or a porous liquid-absorbing core sintered from metal powder at the corresponding heat source location on the substrate, the evaporation heat transfer area can be increased, effectively improving the heat transfer rate.

[0073] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A three-dimensional phase change heat sink, characterized in that, The three-dimensional phase change heat sink includes at least: The substrate includes a substrate shell and a substrate cover plate. The substrate shell and the substrate cover plate form a heat-absorbing evaporation cavity located inside the substrate. The upper region of the heat-absorbing evaporation cavity is a vapor region, and the lower region of the heat-absorbing evaporation cavity is a liquid storage region. A heat source mounting part is located on the outside of the substrate housing corresponding to the liquid storage area; The heat dissipation fins are fixed to the base plate cover. Each heat dissipation fin includes interconnected multi-channel condenser tubes and single-channel condenser tubes. The multi-channel condenser tubes are located in the upper region of the heat dissipation fins, and the single-channel condenser tubes are located in the lower region of the heat dissipation fins. A steam inlet is provided in the upper region of the heat dissipation fins, connected to the multi-channel condenser tubes, which are also connected to the steam zone through the steam inlet. A liquid return port is provided in the lower region of the heat dissipation fins, connected to the single-channel condenser tubes, which are also connected to the liquid storage zone through the liquid return port.

2. The three-dimensional phase change heat sink according to claim 1, characterized in that: The multi-pipe condenser tube includes a mesh-like multi-pipe structure.

3. The three-dimensional phase change heat sink according to claim 1, characterized in that: The single-pipe condenser includes a U-shaped zigzag single-pipe structure.

4. The three-dimensional phase change heat sink according to claim 1, characterized in that: The lower part of the multi-pipe condenser is inclined, and the side away from the substrate is lower than the side close to the substrate.

5. The three-dimensional phase change heat sink according to claim 1, characterized in that: An enhanced evaporation heat exchange structure is also provided on the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source installation part.

6. The three-dimensional phase change heat sink according to claim 1 or 5, characterized in that: A metal powder sintered porous liquid-absorbing core is also provided on the inner wall of the heat-absorbing evaporation cavity corresponding to the heat source installation part.

7. The three-dimensional phase change heat sink according to claim 1, characterized in that: The heat dissipation fins include a composite plate structure, comprising a first plate and a second plate joined together, and the multi-pipe condenser tube and the single-pipe condenser tube are formed by a rolling and blowing process or a mold forming and brazing process.

8. The three-dimensional phase change heat sink according to claim 1, characterized in that: The heat dissipation fins have a single-sided bulging structure or a double-sided bulging structure.

9. The three-dimensional phase change heat sink according to claim 1, characterized in that: The heat-absorbing evaporation cavity is connected to the multiple heat dissipation fins to form an integrated structure.

10. The three-dimensional phase change heat sink according to claim 1, characterized in that: The heat absorption evaporation chamber is also provided with a support column to form a microchannel in the heat absorption evaporation chamber.

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