An optical transceiver assembly welding system of an SFP optical module

Abstract

The application discloses a kind of optical transceiver assembly welding systems of SFP optical module, belong to SFP optical module assembly and welding technical field, comprising: tray, conveying track, connecting pipe and welding torch.The front end of the top surface of tray is provided with rectangular slot, and the rear end of the top surface of tray is provided with two mutually parallel semicircular grooves.Conveying track is used to convey tray.Connecting pipe is arranged above conveying track, and connecting pipe is provided with two blanking holes, the upper end of blanking hole is used to connect material pipe, and the side wall of blanking hole is provided with material blocking mechanism;The inner wall of one end of blanking hole is provided with guide block, and the side wall of blanking hole has interval groove between one side of guide block and the side wall of blanking hole, the thickness of guide block is less than the length difference between positive and negative electrode pins of optical transceiver assembly, and the upper end of guide block has inclined surface;Welding torch is arranged on conveying track, and located behind connecting pipe.The scheme can automatically distinguish and adjust the position of positive electrode pin of optical transceiver assembly, so as to facilitate the automatic assembly work of optical transceiver assembly.

Description

Technical Field

[0001] This invention belongs to the field of SFP optical module assembly and welding technology, and particularly relates to an assembly and welding system for optical transceiver components of SFP optical modules. Background Technology

[0002] SFP-packaged optical modules mainly consist of a housing, circuit board, optical interface, and optical transceiver components. The optical transceiver components include optical receivers and optical transmitters. For example... Figure 9 As shown, optical transmitting and receiving components are mostly cylindrical in structure, with annular grooves on their outer walls for mounting and positioning. Positive and negative leads are located at their ends, and for ease of differentiation, the positive lead is typically made longer. The optical transmitting and receiving components are fixed to one end of the circuit board by soldering. During assembly, it is necessary to distinguish not only the positions of the optical transmitting and receiving components but also the positions of the positive and negative leads. Because the transceiver components are cylindrical, traditional mechanical methods are insufficient for distinguishing the positive and negative terminals, making automated assembly difficult; currently, manual installation is the primary method. Therefore, to improve the production efficiency of optical modules, it is necessary to design a device that can not only distinguish the positive and negative terminals of the transceiver components but also adjust their positions, thereby facilitating automated assembly and soldering. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides an assembly and welding system for optical transceiver components of SFP optical modules. This system can automatically distinguish and adjust the position of the positive pin of the optical transceiver component, thereby facilitating the automatic assembly of the optical transceiver component.

[0004] In order to achieve the objective of this invention, the following solution is proposed:

[0005] An assembly and welding system for optical transceiver components of an SFP optical module includes: a tray, a conveyor track, a connecting pipe, and a welding torch.

[0006] The front end of the top surface of the tray has a rectangular slot for placing the circuit board of the optical module, and the rear end of the top surface of the tray has two parallel semi-circular slots for placing the optical receiving component and the optical transmitting component, respectively.

[0007] The conveyor track is used to transport pallets, and the direction of the line connecting its front and rear ends is consistent with the conveyor track's trajectory.

[0008] Connecting tubes are spaced apart above the conveyor track. Each connecting tube has two drop holes perpendicular to the top surface of the conveyor track. The upper ends of the two drop holes are used to connect the material tubes for packaging the optical receiving component and the optical emitting component, respectively. The side walls of the drop holes are equipped with a baffle mechanism to control the timing of the optical transceiver component's descent. A guide block is provided on the inner wall of one end of the drop hole. There is a gap groove between one side of the guide block and the side wall of the drop hole. The thickness of the guide block is less than the length difference between the positive and negative leads of the optical transceiver component. The upper end of the guide block has an inclined surface. The lower edge of the inclined surface is adjacent to the gap groove. When the optical transceiver component enters the drop hole, the leads of the optical transceiver component face the guide block. The distance between the gap groove and the axis of the optical transceiver component is equal to the distance between the positive lead and the axis of the optical transceiver component.

[0009] The welding torch is positioned on the conveyor track and behind the connecting tube. The welding torch moves vertically and is used to weld the negative pin of the optical transceiver assembly onto the circuit board.

[0010] The beneficial effects of this invention are as follows: This solution utilizes a simple guide block to distinguish and adjust the positive pins of the optical transceiver component, which helps to realize the automated assembly and soldering of the optical transceiver component. Attached Figure Description

[0011] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of the invention.

[0012] Figure 1 A schematic diagram of the overall structure of the preferred embodiment of this application is shown.

[0013] Figure 2 It shows Figure 1 A magnified view of a portion of point A in the middle.

[0014] Figure 3 This diagram shows the state of the optical transceiver assembly inside the connector tube.

[0015] Figure 4 A schematic diagram of the overall structure of the preferred embodiment of this application is shown during operation.

[0016] Figure 5 A top view of the preferred embodiment of this application is shown.

[0017] Figure 6 It shows along Figure 5 Cross-sectional view along the BB direction.

[0018] Figure 7 It shows Figure 6 A magnified view of a section at point C.

[0019] Figure 8 A cross-sectional view of the connecting pipe of this application is shown.

[0020] Figure 9 A schematic diagram of the structure of the tray, circuit board and optical transceiver assembly of this application is shown.

[0021] The markings in the diagram are: tray-1, rectangular groove-11, semi-circular groove-12, semi-circular plate-13, boss-14, conveyor track-2, connecting pipe-3, material drop hole-31, spacer groove-311, guide block-32, inclined surface-321, convex strip-33, receiving cavity-34, through hole-341, welding torch-4, lifting device-41, position sensor-5, spring plate-61, top rod-62, material tube-8, light receiving component-91, light emitting component-92, circuit board-93. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0023] like Figures 1 to 6 and Figure 9 As shown, an assembly and welding system for optical transceiver components of an SFP optical module includes: a tray 1, a conveyor rail 2, a connecting pipe 3, and a welding torch 4.

[0024] Specifically, such as Figure 9 As shown, a rectangular groove 11 is provided at the front end of the top surface of the tray 1 for placing the circuit board 93 of the optical module. Two parallel semicircular grooves 12 are provided at the rear end of the top surface of the tray 1 for placing the optical receiving component 91 and the optical emitting component 92, respectively. When the circuit board 93, the optical receiving component 91 and the optical emitting component 92 are placed in the predetermined positions on the tray 1, the positive and negative pins of the optical receiving component 91 and the optical emitting component 92 are in contact with the predetermined pad positions of the circuit board 93. More specifically, a positioning block is provided on the side wall of the rectangular groove 11 to match the preset slot on the circuit board 93, thereby achieving the purpose of positioning between the circuit board 93 and the tray 1. The end of the semicircular groove 12 can be set as a closed structure to prevent the optical receiving component 91 and the optical emitting component 92 from moving along the axial direction.

[0025] Specifically, such as Figure 1 , Figure 4 As shown, the conveying track 2 is used to convey the pallet 1. The direction of the line connecting its front and rear ends is consistent with the conveying trajectory of the conveying track 2. In this embodiment, when the pallet 1 is conveyed on the conveying track 2, the front end of the pallet 1 is consistent with the conveying direction of the conveying track 2. The conveying track 2 is a conveyor belt structure or a conveying roller structure.

[0026] Specifically, such as Figures 1 to 4As shown, connecting pipes 3 are spaced apart above the conveyor track 2. The gap between the bottom of the connecting pipe 3 and the conveyor track 2 is used for the passage of the tray 1. The connecting pipe 3 has two drop holes 31 perpendicular to the top surface of the conveyor track 2. The upper ends of the two drop holes 31 are respectively used to connect to the material tubes 8 for packaging the optical receiving component 91 and the optical emitting component 92. That is, the optical receiving component 91 and the optical emitting component 92 are packaged using independent material tubes 8. Material tube packaging is a common packaging method for optical transceivers. When packaging, the optical receiving component 91 and the optical emitting component 92 are perpendicular to the length direction of the material tube 8. When the material tube 8 is set in the vertical direction, the optical receiving component 91 and the optical emitting component 92 are in a horizontal position. After the lower end of the material tube 8 is connected to the upper end of the drop hole 31, the optical receiving component 91 and the optical emitting component 92 can fall automatically under the action of gravity and be discharged from the lower end of the drop hole 31. Each drop hole 31 has a blocking mechanism on its sidewall to control the timing of the optical transceiver assembly's descent. Specifically, the blocking mechanism can be designed as a telescopic cylinder. The movable rod of the telescopic cylinder passes through the sidewall of the drop hole 31. When the movable rod extends into the drop hole 31, it blocks the optical transceiver assembly from falling. When the movable rod retracts, it releases the optical transceiver assembly, allowing it to fall automatically. More specifically, each drop hole 31 has a countersunk hole at its top for inserting the material tube 8, ensuring that the material tube 8 is aligned with the drop hole 31 and securing it in place.

[0027] Preferably, the length direction of the discharge hole 31 is consistent with the conveying direction of the conveying track 2. The length and width of the discharge hole 31 are matched with the length and width of the optical transceiver component, respectively. That is, the optical transceiver component can pass through the discharge hole 31 in a horizontal position. The length of the optical transceiver component mentioned here refers to the length between the front end face of the optical transceiver component and the end of the positive electrode pin, which is also the maximum length of the optical transceiver component. The matching of the width dimension can ensure that the optical transceiver component can pass through the discharge hole 31 smoothly, and at the same time, it can also ensure that the optical transceiver component can rotate around its own axis, and can also ensure the accuracy of the position of the optical transceiver component when it falls.

[0028] More specifically, such as Figure 2 , Figure 3 As shown, a guide block 32 is provided on the inner wall of one end of the material drop hole 31. There is a gap groove 311 between one side of the guide block 32 and the side wall of the material drop hole 31. The thickness of the guide block 32 is less than the length difference between the positive and negative pins of the optical transceiver assembly. The upper end of the guide block 32 has an inclined surface 321. The lower edge of the inclined surface 321 is adjacent to the gap groove 311. It can also be understood that the lower edge of the inclined surface 321 is located on one side of the gap groove 311, while the upper edge of the inclined surface 321 is located on the other side of the guide block 32.

[0029] Specifically, such as Figure 3As shown, when the optical transceiver component enters the discharge hole 31, the pins of the optical transceiver component face the guide block 32. At this time, the distance between the spacer groove 311 and the axis of the optical transceiver component is equal to the distance between the positive pin and the axis of the optical transceiver component. In this way, when the end of the positive pin of the optical transceiver component is in the spacer groove 311, the positive and negative pins of the optical transceiver component are on the same horizontal plane, so as to ensure that after the optical transceiver component is discharged from below the discharge hole 31, both the positive and negative pins can be attached to the top surface of the circuit board 93 on the tray 1. Because the length of the feeding hole 31 matches the length of the optical transceiver assembly, and the thickness of the guide block 32 is less than the length difference between the positive and negative pins of the optical transceiver assembly, the end of the positive pin is positioned above the inclined surface 321 or the spacer groove 311 before the optical transceiver assembly enters the feeding hole 31. If the end of the positive pin is above the inclined surface 321, the inclined surface 321 will limit the end of the positive pin during the descent of the optical transceiver assembly, allowing the positive pin to automatically enter the spacer groove 311. During this process, the optical transceiver assembly will rotate around its own axis to adapt to the change in the position of the positive pin. This scheme unifies the position of the positive pin when the optical transceiver assembly falls, ensuring that the positive and negative pins contact the predetermined positions on the circuit board 93, thereby achieving automated assembly and soldering.

[0030] Specifically, such as Figure 1 , Figure 4 As shown, the welding torch 4 is mounted on the conveying track 2 and located behind the connecting pipe 3. The tray 1 conveyed on the conveying track 2 passes through the connecting pipe 3 and then through the welding torch 4. The welding torch 4 is vertically oriented and is used to weld the negative electrode pin of the optical transceiver assembly onto the circuit board 93. The welding torch 4 is located at the movable end of a lifting device 41, which allows for precise control of the vertical movement of the welding torch 4.

[0031] The assembly and soldering method for the optical transceiver components of the SFP optical module using the above scheme is as follows:

[0032] The tray 1 containing the circuit board 93 is placed on the conveyor track 2, or the circuit board 93 is placed on the tray 1 at a predetermined position on the conveyor track 2 using a robot and automated equipment; and the tray 1 is moved and conveyed using the conveyor track 2; for example, the utility model patent with application number CN202421137652.5 discloses a finished circuit board loading and unloading device based on a tray carrier, which can be used to place the circuit board 93 on the tray 1; and the material tube 8, which is respectively equipped with a light receiving component 91 and a light emitting component 92, is inserted into the material dropping hole 31.

[0033] When the tray 1 moves to the predetermined position below the connecting tube 3, the two semi-circular grooves 12 on the top surface of the tray 1 are aligned with the two material dropping holes 31 above. By controlling the material blocking mechanism, the lower channel of the material dropping hole 31 is opened. Under the action of gravity, the light receiving component 91 and the light emitting component 92 in the material tube 8 will fall automatically. During the falling process, the guide block 32 is used to guide and adjust the position of the positive electrode pin of the light receiving component 91 and the light emitting component 92, and finally the positive electrode pin falls onto the circuit board 93 along the position of the spacer groove 311. With the above scheme, without the aid of any detection and automation equipment for position adjustment, not only can the positive electrode pin be automatically distinguished, but the position of the positive electrode pin can also be automatically adjusted by the guide block 32 during the falling process of the light transceiver component, so that the positive electrode pin and the negative electrode pin fall onto the circuit board 93 at the predetermined position.

[0034] After the light receiving component 91 and light emitting component 92 at the bottom of the material tube 8 fall, the lower end of the material drop hole 31 is blocked again by the blocking mechanism to prevent the light receiving component 91 and light emitting component 92 above from falling further. Then, the tray 1 containing the light receiving component 91, light emitting component 92 and circuit board 93 is moved to the bottom of the welding gun 4 by the conveying rail 2. The welding gun 4 is moved downward to weld and fix the positive and negative electrodes to the circuit board 93. After completion, the tray 1 is conveyed to the next process by the conveying rail 2.

[0035] Preferred, such as Figure 1 , Figure 4 As shown, position sensors 5 are provided on the conveying track 2 at the working positions of the connecting pipe 3 and the welding gun 4, which are used to detect the arrival signal of the tray 1, so that the system can accurately determine the stopping position of the tray 1, align the semi-circular groove 12 with the material drop hole 31, and accurately move the positive and negative pins below the welding gun 4.

[0036] Preferably, the conveyor track 2 has a segmented structure, and each segment is equipped with an independent drive device. The connecting pipe 3 and the welding gun 4 are each located on a segment of the conveyor track 2. This method allows for more flexible adjustment of the production rhythm of each workstation and eliminates the need for precise control of the interval distance between each pallet 1.

[0037] Preferred, such as Figure 2 , Figure 3 As shown, the inner walls on both sides of the discharge hole 31 are provided with protrusions 33 perpendicular to the top surface of the conveying track 2. The cross-sectional dimensions of the protrusions 33 match the annular grooves outside the light emitting component 92 and the light receiving component 91. The protrusions 33 can further restrict the position of the light emitting component 92 and the light receiving component 91 in the discharge hole 31 and improve the positional accuracy of the light emitting component 92 and the light receiving component 91 when they enter the semi-circular groove 12.

[0038] Preferred, such as Figure 9 , Figure 4As shown, the outer end of the semicircular groove 12 is provided with a semicircular plate 13 that matches the annular groove. The two sides of the semicircular plate 13 protrude from the top surface of the tray 1. When the semicircular groove 12 is aligned with the material drop hole 31, the part of the semicircular plate 13 that protrudes from the tray 1 is aligned with the protrusion 33, which further improves the accuracy of the light emitting component 92 and the light receiving component 91 falling into the semicircular groove 12. The cooperation between the semicircular plate 13 and the annular groove prevents the light emitting component 92 and the light receiving component 91 from moving along the axis on the tray 1. At the same time, this structure makes the front end of the light emitting component 92 and the light receiving component 91 protrude from the end of the tray 1, which facilitates the removal of the soldered circuit board 93 and the optical transceiver component.

[0039] Preferred, such as Figure 7 , Figure 8 As shown, the material blocking mechanism includes a spring plate 61 and a push rod 62 vertically disposed in the middle of the spring plate 61. A receiving cavity 34 is formed at the lower end of the connecting pipe 3 between the two material dropping holes 31. A through hole 341 communicating with the material dropping holes 31 on both sides is formed at the lower end of the receiving cavity 34. The spring plate 61 passes through the through hole 341. The lower end of the push rod 62 passes through the solid part below the receiving cavity 34, and the lower end of the push rod 62 protrudes downwards from the bottom surface of the connecting pipe 3. In its natural state, the spring plate 61 has a flat plate structure, with both ends protruding into the material dropping holes 31 on both sides to prevent the optical transceiver components from falling. When the push rod 62 moves upwards towards the receiving cavity 34, both ends of the spring plate 61 retract into the through hole 341 to release the optical transceiver components. At this time, the optical emitting component 92 and the optical receiving component 91 in the material tube 8 can fall automatically. The top surface of the tray 1 has a boss 14 corresponding to the position between the two semi-circular grooves 12, used to push the push rod 62 upwards. Specifically, as shown... Figure 7 As shown, when the semicircular groove 12 is aligned with the material drop hole 31, the top surface of the boss 14 abuts against the bottom of the push rod 62, and both ends of the spring plate 61 are located inside the through hole 341. In order to enable the boss 14 to move smoothly to the bottom of the push rod 62, the top surface of the boss 14 has an angled structure on the side facing the moving direction of the tray 1. When the tray 1 moves downward to the connecting pipe 3, the angled structure will first abut against the lower end of the push rod 62 and push the push rod 62 upward.

[0040] Preferably, the upper end of the push rod 62 is connected to the spring plate 61 via a screw structure, which facilitates assembly.

[0041] Further preferred, such as Figure 7 , Figure 8 As shown, the cross-section of the receiving cavity 34 is an inverted V-shaped structure, which allows the deformed spring plate 61 to recover its deformation more smoothly, and at the same time allows the two ends of the spring plate 61 to retract more symmetrically into the through hole 341.

[0042] The above description is merely a preferred embodiment of the present invention and is not intended to be the only or limiting of the invention. Those skilled in the art should understand that various changes or equivalent substitutions made to the present invention without departing from its scope are all within the protection scope of the present invention.

Claims

1. A welding system for assembling and soldering optical transceiver components of an SFP optical module, characterized in that, include: The tray (1) has a rectangular groove (11) at the front end of its top surface for placing the circuit board (93) of the optical module. The tray (1) has two parallel semi-circular grooves (12) at the rear end of its top surface for placing the optical receiving component (91) and the optical emitting component (92) respectively. The conveying track (2) is used to convey the pallet (1), and the direction of the line connecting its front and rear ends is consistent with the conveying trajectory of the conveying track (2); Connecting pipes (3) are spaced above the conveying track (2). The connecting pipes (3) have two drop holes (31) perpendicular to the top surface of the conveying track (2). The upper ends of the two drop holes (31) are used to connect the material pipes (8) of the packaging light receiving component (91) and the light emitting component (92), respectively. The side walls of the drop holes (31) are equipped with a baffle mechanism to control the timing of the descent of the light transceiver components. A guide block (32) is provided on the inner wall of one end of the drop hole (31), and one side of the guide block (32) is connected to the drop hole (31). 1) There is a spacer groove (311) between the side walls. The thickness of the guide block (32) is less than the length difference between the positive and negative pins of the optical transceiver component. The upper end of the guide block (32) has a slope (321). The lower edge of the slope (321) is adjacent to the spacer groove (311). When the optical transceiver component enters the feeding hole (31), the pins of the optical transceiver component face the guide block (32). The distance between the spacer groove (311) and the axis of the optical transceiver component is equal to the distance between the positive pin and the axis of the optical transceiver component. The welding torch (4) is located on the conveying track (2) and behind the connecting tube (3). The welding torch (4) is moved vertically and is used to weld the negative pin of the optical transceiver assembly onto the circuit board (93).

2. The optical transceiver assembly and welding system for an SFP optical module according to claim 1, characterized in that, Position sensors (5) are provided on the conveying track (2) at the working positions of the connecting pipe (3) and the welding gun (4) to detect the arrival signal of the tray (1).

3. The optical transceiver assembly and welding system for an SFP optical module according to claim 1, characterized in that, The conveying track (2) is a segmented structure, and each segment is equipped with an independent drive device. The connecting pipe (3) and the welding gun (4) are each located on a segment of the conveying track (2).

4. The optical transceiver assembly and welding system for an SFP optical module according to claim 1, characterized in that, The inner walls on both sides of the material discharge hole (31) are provided with protrusions (33) perpendicular to the top surface of the conveying track (2). The cross-sectional dimensions of the protrusions (33) match the annular grooves outside the light emitting component (92) and the light receiving component (91).

5. The optical transceiver assembly and welding system for an SFP optical module according to claim 4, characterized in that, The outer end of the semicircular groove (12) is provided with a semicircular plate (13) that matches the annular groove. The two sides of the semicircular plate (13) protrude from the top surface of the tray (1). When the semicircular groove (12) is aligned with the material drop hole (31), the part of the semicircular plate (13) that protrudes from the tray (1) is aligned with the convex strip (33).

6. The optical transceiver assembly and welding system for an SFP optical module according to claim 1, characterized in that, The material blocking mechanism includes a spring plate (61) and a top rod (62) vertically disposed in the middle of the spring plate (61). The lower end of the connecting pipe (3) is provided with a receiving cavity (34) between the two material dropping holes (31). The lower end of the receiving cavity (34) is provided with a through hole (341) communicating with the material dropping holes (31) on both sides. The spring plate (61) passes through the through hole (341). The lower end of the top rod (62) passes through the solid part below the receiving cavity (34), and the lower end of the top rod (62) protrudes downward from the bottom surface of the connecting pipe (3). When the spring plate (61) is in its natural state, it is a flat plate structure with its two ends protruding into the material dropping holes (31) on both sides respectively. When the top rod (62) moves upward to the receiving cavity (34), the two ends of the spring plate (61) retract into the through hole (341). The top surface of the tray (1) has a boss (14) corresponding to the position between the two semi-circular grooves (12) for pushing the top rod (62) upward.

7. The optical transceiver assembly and welding system for an SFP optical module according to claim 6, characterized in that, The upper end of the push rod (62) is connected to the spring plate (61) via a screw structure.

8. The optical transceiver assembly and welding system for an SFP optical module according to claim 6, characterized in that, The cross-section of the cavity (34) is an inverted V-shaped structure.

9. The optical transceiver assembly and welding system for an SFP optical module according to claim 1, characterized in that, The welding torch (4) is located at the movable end of a lifting device (41).

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