A plasma etching endpoint detection system and etching endpoint detection method

Abstract

The application relates to the technical field of integrated circuit manufacturing, and discloses a plasma etching endpoint detection system and an etching endpoint detection method, wherein the plasma etching endpoint detection system comprises a covering mechanism, a movable light source emitting mechanism, a data acquisition mechanism, and a plane moving mechanism; the covering mechanism is used for covering an observation window of a plasma etching machine; the data acquisition mechanism is used for acquiring a spectrum signal of light emitted by the movable light source emitting mechanism or a spectrum signal of superposition of a glow generated in a plasma etching process and the light emitted by the movable light source emitting mechanism; and the plane moving mechanism is used for moving the covering mechanism and the data acquisition mechanism synchronously with a radio frequency unit. The application can isolate external environmental light interference factors, can set the movable light source emitting mechanism and the data acquisition mechanism which can move synchronously with the radio frequency unit in and out of the plasma etching machine, can acquire full spectrum data of the plasma in a current state in real time, can assist in calibrating whether the current etching reaches an etching endpoint, can effectively improve the precision of etching endpoint detection data, and can improve a yield.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and more specifically, to a plasma etching endpoint detection system and method. Background Technology

[0002] Plasma etching machines, also known as plasma etching machines, plasma planar etching machines, plasma etching equipment, plasma surface treatment instruments, and plasma cleaning systems, are among the most common forms of dry etching. The principle involves gas exposed to electron regions forming plasma. The resulting ionized gas and the gas containing released high-energy electrons form plasma or ions. When ionized gas atoms are accelerated by an electric field, they release sufficient force and surface repulsion force to tightly adhere to the material or etch the surface.

[0003] EPD laser sensors are crucial components for etching endpoint detection in etching equipment. They detect changes in light intensity at a specific wavelength from the start to the end of etching and feed this change back to the control system. The control system then uses the received signal to determine whether the etching endpoint has been reached, thus achieving accurate endpoint determination. However, plasma light radiation is highly sensitive to changes in external lighting conditions. Therefore, the endpoint detection process of EPD sensors is easily affected by noise interference from ambient light, leading to misjudgments of the etching endpoint. When the glow during the reaction process is relatively weak, noise interference and endpoint misjudgments are particularly pronounced. Summary of the Invention

[0004] The purpose of this invention is to provide a plasma etching endpoint detection system and etching endpoint detection method to solve the above-mentioned problems.

[0005] This invention provides a plasma etching endpoint detection system for acquiring etching endpoint data of a plasma etching machine, including:

[0006] The shielding mechanism includes several adsorption-type limiting components and a flexible shielding sleeve connected between the several adsorption-type limiting components. The several adsorption-type limiting components are detachably connected to the plasma etching machine, and the flexible shielding sleeve is used to cover the observation window of the plasma etching machine.

[0007] A mobile light source emitting mechanism is connected inside the plasma etching machine. The mobile light source emitting mechanism is used to move synchronously with the radio frequency unit of the plasma etching machine in the YOZ plane and emit light with set wavelength parameters to the radio frequency unit.

[0008] A data acquisition mechanism is used to acquire the spectral signal of the light emitted by the mobile light source emitting mechanism or the spectral signal of the glow generated by the plasma etching process superimposed on the light emitted by the mobile light source emitting mechanism.

[0009] A planar moving mechanism is connected between the data acquisition mechanism and the covering mechanism. The planar moving mechanism is used to drive the data acquisition mechanism to move synchronously with the mobile light source emitting mechanism in the YOZ plane.

[0010] As a further optimization of the present invention, the adsorption limiting component includes a limiting post, a hinged plate fixedly connected to the outer wall of the limiting post, a cavity provided on the limiting post, a piston provided inside the cavity, a plastic adsorption component connected to the opening end of the cavity, a screw movably connected to the piston, and a turntable connected to one end of the screw moving through the limiting post. The limiting post is provided with a screw hole that mates with the screw moving.

[0011] As a further optimization of the present invention, the flexible cover includes a spliced ​​cover and a quick-release connector connecting the spliced ​​cover and the limiting post. The spliced ​​cover is detachably connected to the limiting post through the quick-release connector, and the spliced ​​cover covers the observation window of the plasma etching machine.

[0012] As a further optimization of the present invention, the planar moving mechanism includes several multi-stage electric telescopic rods, and a hinge frame one and a hinge frame two respectively connected to both ends of the multi-stage electric telescopic rods. The hinge frame one is hinged to the data acquisition mechanism, and the hinge frame two is hinged to the hinge plate one.

[0013] As a further optimization of the present invention, the data acquisition mechanism includes a housing, an adjustable light converging component disposed on the housing, and a photoelectric conversion component connected to the housing. The adjustable light converging component and the photoelectric conversion component are coaxially arranged. A plurality of hinge plates are connected to the outer wall of the housing, and the hinge plates are hinged to the hinge frame.

[0014] As a further optimization of the present invention, the adjustable light converging component includes several limiting grooves symmetrically arranged on the housing, a condensing lens and an aperture slidably connected to the housing, a slider one fixedly connected to the condensing lens, a slider two fixedly connected to the aperture, a motor one and a motor two fixedly connected to the outer wall of the housing, and a screw two and a screw three respectively connected to the output shaft ends of the motor one and motor two. The aperture is located between the condensing lens and the photoelectric conversion component. The slider one is threadedly connected to the screw two, and the slider two and the screw three are threadedly connected.

[0015] As a further optimization of the present invention, the photoelectric conversion component includes a photoelectric converter fixedly connected to the housing and a wire connected to the photoelectric converter. The photoelectric converter is used to acquire the spectral signal of the light emitted by the mobile light source emitting mechanism or the spectral signal of the glow generated by the plasma etching process superimposed on the light emitted by the mobile light source emitting mechanism.

[0016] As a further optimization of the present invention, the movable light source emitting mechanism includes a YOZ plane adjustment component and a light source emitter connected to the YOZ plane adjustment component. The light source emitter is used to emit light with a set wavelength parameter, and the YOZ plane adjustment component is used to drive the light source emitter to move within the YOZ plane.

[0017] As a further optimization of the present invention, the YOZ plane adjustment assembly includes a slide rail one, a motor three connected to the slide rail one, a slider three slidably connected to the slide rail one, a screw four connected to the output shaft end of the motor three, a slide rail two fixedly connected to the slider three, a motor four connected to the slide rail two, a slider four slidably connected to the slide rail two, and a screw five connected to the output shaft end of the motor four. The screw four is threadedly connected to the slider three, and the screw five is threadedly connected to the slider four. The light source emitter is mounted on the slider four.

[0018] A method for detecting the endpoint of plasma etching, employing the plasma etching endpoint detection system described above, includes the following steps:

[0019] Step 100: Install the mobile light source emitting mechanism inside the plasma etching machine, set the mobile light source emitting mechanism to move synchronously with the radio frequency unit of the plasma etching machine to move coordinate data, install the shielding mechanism with the planar moving mechanism and data acquisition mechanism on the outside of the plasma etching machine, and ensure that the flexible shielding sleeve completely covers the observation window of the plasma etching machine.

[0020] Step 200: Control the mobile light source emitting mechanism to traverse each coordinate point in the YOZ plane, and emit light of a set wavelength during the movement. Drive the data acquisition mechanism to move synchronously with the mobile light source emitting mechanism through the planar movement mechanism and acquire the spectral signal of the mobile light source emitting mechanism at each coordinate point.

[0021] Step 300: Perform the etching process, control the mobile light source emitting mechanism and the data acquisition mechanism to synchronously correspond to the position of the radio frequency unit of the plasma etching machine in the YOZ plane, and acquire the spectral signal of the superposition of the plasma glow generated during the etching process and the light emitted by the mobile light source emitting mechanism.

[0022] Step 400: The spectral signal of the plasma glow generated during the etching process and the light emitted by the mobile light source emitting mechanism is superimposed and transmitted in real time to the control system of the plasma etching machine through the data acquisition mechanism.

[0023] The beneficial effects of this invention are as follows: This invention isolates external ambient light interference factors, and sets up a mobile light source emitting mechanism and a data acquisition mechanism that can move synchronously with the radio frequency unit inside and outside the plasma etching machine, respectively. It can acquire the full spectrum data of the plasma in the current state in real time, thereby assisting in calibrating whether the current etching has reached the etching endpoint, which can effectively improve the accuracy of the etching endpoint detection data and improve the yield. Attached Figure Description

[0024] Figure 1 This is a view showing the cooperation between the shielding mechanism of the present invention and the plasma etching machine;

[0025] Figure 2 This is a view showing the interaction between the mobile light source emitting mechanism and the data acquisition mechanism of the present invention;

[0026] Figure 3 This is a view showing the interaction between the mobile light source emitting mechanism of the present invention and the plasma etching machine;

[0027] Figure 4 This is a view showing the cooperation between the planar movement mechanism and the data acquisition mechanism of the present invention;

[0028] Figure 5 This is the invention Figure 4 An enlarged view of point A in the image;

[0029] Figure 6 This is the invention Figure 4 A partial sectional view;

[0030] Figure 7 This is the invention Figure 6 Enlarged view at point B;

[0031] Figure 8 This is the invention Figure 6 A magnified view of point C in the middle.

[0032] In the diagram: 1. Covering mechanism; 11. Adsorption-type limiting component; 1101. Limiting post; 1102. Hinge plate one; 1103. Cavity; 1104. Plastic adsorption component; 1105. Piston; 1106. Screw one; 1107. Turntable; 12. Flexible covering sleeve; 2. Planar movement mechanism; 201. Multi-stage electric telescopic rod; 202. Hinge frame one; 203. Hinge frame two; 3. Data acquisition mechanism; 301. Housing; 302. Limiting groove; 303. Condensing lens; 30 4. Aperture; 305. Photoelectric converter; 306. Slider 1; 307. Slider 2; 308. Motor 1; 309. Screw 2; 310. Motor 2; 311. Screw 3; 312. Hinge plate 2; 4. Movable light source emitting mechanism; 401. Slide rail 1; 402. Motor 3; 403. Slider 3; 404. Screw 4; 405. Slide rail 2; 406. Motor 4; 407. Slider 4; 408. Screw 5; 409. Light source emitter; 5. Plasma etching machine. Detailed Implementation

[0033] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed merely to enable those skilled in the art to better understand and implement the subject matter described herein. Furthermore, features described in some examples may be combined in other examples.

[0034] like Figures 1 to 8 As shown, a plasma etching endpoint detection system is used to acquire etching endpoint data of a plasma etching machine 5, including:

[0035] The shielding mechanism 1 includes several adsorption-type limiting components 11 and a flexible shielding sleeve 12 connected between the several adsorption-type limiting components 11. The several adsorption-type limiting components 11 are detachably connected to the plasma etching machine 5, and the flexible shielding sleeve 12 is used to cover the observation window of the plasma etching machine 5.

[0036] The movable light source emitting mechanism 4 is connected inside the plasma etching machine 5. The movable light source emitting mechanism 4 is used to follow the radio frequency unit of the plasma etching machine 5 to move synchronously in the YOZ plane and emit light with set wavelength parameters to the radio frequency unit.

[0037] Data acquisition mechanism 3 is used to acquire the spectral signal of the light emitted by the mobile light source emitting mechanism 4 or the spectral signal of the glow generated by the plasma etching process superimposed on the light emitted by the mobile light source emitting mechanism 4.

[0038] Planar moving mechanism 2 is connected between data acquisition mechanism 3 and shielding mechanism 1. Planar moving mechanism 2 is used to drive data acquisition mechanism 3 to move synchronously with mobile light source emitting mechanism 4 in the YOZ plane.

[0039] It should be noted that when performing high-precision detection on the etching endpoint of the existing plasma etching machine 5, the movable light source emitting mechanism 4 is installed inside the plasma etching machine 5, and the movable light source emitting mechanism 4 is set to move the coordinate data synchronously with the radio frequency unit of the plasma etching machine 5. The shielding mechanism 1, which is equipped with the planar moving mechanism 2 and the data acquisition mechanism 3, is installed outside the plasma etching machine 5, and the flexible shielding sleeve 12 is ensured to completely cover the observation window of the plasma etching machine 5.

[0040] The mobile light source emitting mechanism 4 is controlled to traverse various coordinate points in the YOZ plane and emit light of a set wavelength during the movement. The planar moving mechanism 2 drives the data acquisition mechanism 3 to move synchronously with the mobile light source emitting mechanism 4 and acquire the spectral signal of the mobile light source emitting mechanism 4 at various coordinate points.

[0041] During the etching process, the mobile light source emitting mechanism 4 and the data acquisition mechanism 3 are controlled to synchronously correspond to the position of the radio frequency unit of the plasma etching machine 5 in the YOZ plane, and the spectral signal of the plasma glow generated during the etching process and the light emitted by the mobile light source emitting mechanism 4 is acquired.

[0042] The data acquisition mechanism 3 transmits the superimposed spectral signal of the plasma glow generated during the etching process and the light emitted by the mobile light source emitting mechanism 4 to the control system of the plasma etching machine 5 in real time.

[0043] In an optional embodiment of the invention, such as Figure 7 As shown, the adsorption-type limiting assembly 11 includes a limiting post 1101, a hinge plate 1102 fixedly connected to the outer wall of the limiting post 1101, a cavity 1103 provided on the limiting post 1101, a piston 1105 provided inside the cavity 1103, a plastic adsorption member 1104 connected to the opening end of the cavity 1103, a screw 1106 movably connected to the piston 1105, and a turntable 1107 connected to one end of the screw 1106 that passes through the limiting post 1101. The limiting post 1101 is provided with a screw hole that mates with the screw 1106.

[0044] It should be noted that when installing multiple adsorption-type limiting components 11 onto the outer wall of the plasma etching machine 5, by placing the limiting post 1101 at a set coordinate on the outer wall of the plasma etching machine 5, the plastic adsorption component 1104 is tightly attached to the outer wall of the plasma etching machine 5. Then, the turntable 1107 is rotated, which drives the screw 1106 to rotate. Because the screw 1106 is threadedly connected to the limiting post 1101, its rotation can drive the piston 1105 to move toward or away from the plastic adsorption component 1104. When the piston 1105 moves away from the plastic adsorption component 1104, the volume between the plastic adsorption component 1104 and the piston 1105 increases, thereby generating a negative pressure. This negative pressure can drive the plastic adsorption component 1104 to begin deforming towards the piston 1105, thereby increasing the contact space between the plastic adsorption component 1104 and the outer wall of the plasma etching machine 5 and generating a corresponding negative pressure, thus achieving a stable connection. This can effectively reduce the difficulty of installation, will not affect the internal vacuum performance of the plasma etching machine 5, and does not require modification of the plasma etching machine 5.

[0045] In another embodiment of the present invention, if there are expandable connecting parts such as expansion bolts on the outer wall of the plasma etching machine 5, they can be directly connected to the expansion connecting parts through the limiting post 1101. In this case, the plastic adsorption part 1104, piston 1105, screw 1106 and turntable 1107 do not need to be installed and combined with the limiting post 1101.

[0046] In an optional embodiment of the invention, such as Figure 4 As shown, the flexible cover 12 includes a spliced ​​cover and a quick-release connector connecting the spliced ​​cover and the limiting post 1101. The spliced ​​cover is detachably connected to the limiting post 1101 through the quick-release connector, and the spliced ​​cover covers the observation window of the plasma etching machine 5.

[0047] It should be noted that, as mentioned above, after the limiting post 1101 is fixed on the outer wall of the plasma etching machine 5, the spliced ​​cover is installed and connected to the corresponding limiting post 1101 through quick-release connectors. The quick-release connectors can be bolts, Velcro, or other connectors. When bolts are used, screw holes can be opened on the limiting post 1101 or the screw can be welded to the limiting post 1101. The spliced ​​cover can be equipped with corresponding screws or connecting nuts. The spliced ​​cover can also have through holes for power supply line arrangement, and the through holes are light-shielded.

[0048] In an optional embodiment of the invention, such as Figure 4As shown, the planar moving mechanism 2 includes several multi-stage electric telescopic rods 201, and hinge frame one 202 and hinge frame two 203 respectively connected to the two ends of the multi-stage electric telescopic rods 201. Hinge frame one 202 is hinged to the data acquisition mechanism 3, and hinge frame two 203 is hinged to hinge plate one 1102.

[0049] It should be noted that when the data acquisition mechanism 3 is driven by the planar moving mechanism 2 to move in the YOZ plane following the radio frequency unit of the plasma etching machine 5, the movement of the data acquisition mechanism 3 in the YOZ plane can be controlled by extending or shortening the multiple multi-stage electric telescopic rods 201 accordingly.

[0050] In an optional embodiment of the invention, such as Figure 8 As shown, the data acquisition mechanism 3 includes a housing 301, an adjustable light converging component disposed on the housing 301, and a photoelectric conversion component connected to the housing 301. The adjustable light converging component and the photoelectric conversion component are coaxially arranged. Several hinge plates 312 are connected to the outer wall of the housing 301. The hinge plates 312 are hinged to the hinge frame 202.

[0051] The adjustable light converging assembly includes several limiting grooves 302 symmetrically arranged on the housing 301, a condensing lens 303 and an aperture 304 slidably connected to the housing 301, a slider 306 fixedly connected to the condensing lens 303, a slider 307 fixedly connected to the aperture 304, a motor 308 and a motor 310 fixedly connected to the outer wall of the housing 301, and screws 309 and 311 respectively connected to the output shaft ends of motors 308 and 310. The aperture 304 is located between the condensing lens 303 and the photoelectric conversion assembly. Slider 306 is threadedly connected to screw 309, and slider 307 is threadedly connected to screw 311.

[0052] It should be noted that, due to the varying influencing factors on light propagation at different points in the glass material of the observation window of the plasma etching machine 5, before etching, the data acquisition mechanism 3 is driven to move along the movable light source emitting mechanism 4, and the influencing factors at each point are calibrated. During calibration, the motor 308 drives the screw 309 to rotate. When the screw 309 rotates, it drives the slider 306, which is threadedly connected to it, to move along the slide groove, thereby moving the condenser lens 303 closer to or further away from the aperture 304, thus controlling the condenser lens 303. Similarly, when the position of the condenser lens 303 needs to change, the housing 301 can be rotated by the motor 310. When the slider 307 rotates, it can be driven to move along the slide groove. When the slider 307 moves, it can drive the aperture 304 to move synchronously, thereby adapting to the position change of the condenser lens 303, so that the light finally obtained by the photoelectric converter 305 can always be kept in the best state. The aperture 304 can further filter out stray light from the light gathered by the condenser lens 303.

[0053] In an optional embodiment of the present invention, the photoelectric conversion component includes a photoelectric converter 305 fixedly connected to the housing 301 and a wire connected to the photoelectric converter 305. The photoelectric converter 305 is used to acquire the spectral signal of the light emitted by the mobile light source emitting mechanism 4 or the spectral signal of the glow generated by the plasma etching process superimposed on the light emitted by the mobile light source emitting mechanism 4.

[0054] It should be noted that the photoelectric converter 305 can acquire spectral data of the light source containing the intensity of each wavelength value in the full wavelength range of visible light. After the photoelectric converter 305 acquires the spectral signal filtered by the aperture 304, it can perform photoelectric signal conversion. The converted signal is transmitted to the control system of the plasma etching machine 5 through the wire. The control system can remove the light source signal emitted by the light source emitter 409, realize the accurate acquisition of the spectral data of the plasma emitted light, and thus provide a more accurate endpoint indication.

[0055] In an optional embodiment of the present invention, the movable light source emitting mechanism 4 includes a YOZ plane adjustment assembly and a light source emitter 409 connected to the YOZ plane adjustment assembly. The light source emitter 409 is used to emit light with set wavelength parameters, and the YOZ plane adjustment assembly is used to drive the light source emitter 409 to move within the YOZ plane.

[0056] The YOZ plane adjustment assembly includes a slide rail 401, a motor 402 connected to the slide rail 401, a slider 403 slidably connected to the slide rail 401, a screw 404 connected to the output shaft of the motor 402, a slide rail 405 fixedly connected to the slider 403, a motor 406 connected to the slide rail 405, a slider 407 slidably connected to the slide rail 405, and a screw 408 connected to the output shaft of the motor 406. The screw 404 is threadedly connected to the slider 403, and the screw 408 is threadedly connected to the slider 407. A light source emitter 409 is mounted on the slider 407.

[0057] It should be noted that the light source emitter 409 can emit light in different wavelength ranges, and the number of emitters can be one or more. It can also simulate the glow emitted by plasma. In this way, before etching, the actual parameters of the light emitted at the corresponding position are obtained and transmitted to the photoelectric converter 305. This can effectively reduce the influence of light parameters caused by the non-uniformity inside the observation window glass. When the light source emitter 409 is driven to move in the YOZ plane by the YOZ plane adjustment component, the screw 404 is driven to rotate by the motor 3 402, which in turn drives the slider 3 403 and the slide rail 2 405 to move along the Y axis. The screw 5 408 is driven to rotate by the motor 4 406, which in turn drives the slider 407 and the light source emitter 409 to move along the Z axis.

[0058] The above description of this embodiment is not limited to the specific implementation described above. The specific implementation described above is merely illustrative and not restrictive. Those skilled in the art can make many other forms based on the guidance of this embodiment, all of which are within the protection scope of this embodiment.

Claims

1. A plasma etching endpoint detection system for acquiring etching endpoint data of a plasma etching machine (5), characterized in that, include: The shielding mechanism (1) includes several adsorption limiting components (11) and a flexible shielding sleeve (12) connected between the several adsorption limiting components (11). The several adsorption limiting components (11) are detachably connected to the plasma etching machine (5), and the flexible shielding sleeve (12) is used to cover the observation window of the plasma etching machine (5). A mobile light source emitting mechanism (4) is connected inside the plasma etching machine (5). The mobile light source emitting mechanism (4) is used to follow the radio frequency unit of the plasma etching machine (5) to move synchronously in the YOZ plane and emit light with set wavelength parameters to the radio frequency unit. The data acquisition mechanism (3) is used to acquire the spectral signal of the light emitted by the mobile light source emitting mechanism (4) or the spectral signal of the glow generated by the plasma etching process superimposed on the light emitted by the mobile light source emitting mechanism (4). Planar moving mechanism (2) is connected between data acquisition mechanism (3) and covering mechanism (1). The planar moving mechanism (2) is used to drive data acquisition mechanism (3) to move synchronously with mobile light source emitting mechanism (4) in YOZ plane.

2. The plasma etching endpoint detection system according to claim 1, characterized in that, The adsorption-type limiting assembly (11) includes a limiting post (1101), a hinge plate (1102) fixedly connected to the outer wall of the limiting post (1101), a cavity (1103) provided on the limiting post (1101), a piston (1105) provided inside the cavity (1103), a plastic adsorption component (1104) connected to the opening end of the cavity (1103), a screw (1106) movably connected to the piston (1105), and a turntable (1107) connected to one end of the screw (1106) that passes through the limiting post (1101). The limiting post (1101) is provided with a screw hole that cooperates with the screw (1106).

3. The plasma etching endpoint detection system according to claim 2, characterized in that, The flexible cover (12) includes a spliced ​​cover and a quick-release connector connecting the spliced ​​cover and the limiting post (1101). The spliced ​​cover is detachably connected to the limiting post (1101) through the quick-release connector. The spliced ​​cover covers the observation window of the plasma etching machine (5).

4. The plasma etching endpoint detection system according to claim 3, characterized in that, The planar moving mechanism (2) includes several multi-stage electric telescopic rods (201), and hinge frame one (202) and hinge frame two (203) respectively connected to the two ends of the multi-stage electric telescopic rods (201). The hinge frame one (202) is hinged to the data acquisition mechanism (3), and the hinge frame two (203) is hinged to the hinge plate one (1102).

5. The plasma etching endpoint detection system according to claim 4, characterized in that, The data acquisition mechanism (3) includes a housing (301), an adjustable light converging component disposed on the housing (301), and a photoelectric conversion component connected to the housing (301). The adjustable light converging component and the photoelectric conversion component are coaxially arranged. Several hinge plates (312) are connected to the outer wall of the housing (301). The hinge plates (312) are hinged to the hinge frame (202).

6. The plasma etching endpoint detection system according to claim 5, characterized in that, The adjustable light converging assembly includes several limiting grooves (302) symmetrically arranged on the housing (301), a condensing lens (303) and an aperture (304) slidably connected to the housing (301), a slider one (306) fixedly connected to the condensing lens (303), a slider two (307) fixedly connected to the aperture (304), a motor one (308) and a motor two (310) fixedly connected to the outer wall of the housing (301), and a screw two (309) and a screw three (311) respectively connected to the output shaft ends of the motor one (308) and the motor two (310). The aperture (304) is located between the condensing lens (303) and the photoelectric conversion assembly. The slider one (306) is threadedly connected to the screw two (309), and the slider two (307) is threadedly connected to the screw three (311).

7. The plasma etching endpoint detection system according to claim 6, characterized in that, The photoelectric conversion component includes a photoelectric converter (305) fixedly connected to the housing (301) and a wire connected to the photoelectric converter (305). The photoelectric converter (305) is used to acquire the spectral signal of the light emitted by the mobile light source emitting mechanism (4) or the spectral signal of the glow generated by the plasma etching process superimposed on the light emitted by the mobile light source emitting mechanism (4).

8. The plasma etching endpoint detection system according to claim 7, characterized in that, The movable light source emitting mechanism (4) includes a YOZ plane adjustment component and a light source emitter (409) connected to the YOZ plane adjustment component. The light source emitter (409) is used to emit light with set wavelength parameters, and the YOZ plane adjustment component is used to drive the light source emitter (409) to move in the YOZ plane.

9. The plasma etching endpoint detection system according to claim 8, characterized in that, The YOZ plane adjustment assembly includes a slide rail 1 (401), a motor 3 (402) connected to the slide rail 1 (401), a slider 3 (403) slidably connected to the slide rail 1 (401), a screw 4 (404) connected to the output shaft end of the motor 3 (402), a slide rail 2 (405) fixedly connected to the slider 3 (403), a motor 4 (406) connected to the slide rail 2 (405), a slider 4 (407) slidably connected to the slide rail 2 (405), and a screw 5 (408) connected to the output shaft end of the motor 4 (406). The screw 4 (404) is threadedly connected to the slider 3 (403), and the screw 5 (408) is threadedly connected to the slider 4 (407). The light source emitter (409) is mounted on the slider 4 (407).

10. A method for detecting the endpoint of plasma etching, characterized in that, The plasma etching endpoint detection system according to any one of claims 1-9 includes the following steps: Step 100: Install the mobile light source emitting mechanism (4) inside the plasma etching machine (5), set the mobile light source emitting mechanism (4) to move coordinate data synchronously with the radio frequency unit of the plasma etching machine (5), install the shielding mechanism (1) with the planar moving mechanism (2) and the data acquisition mechanism (3) on the outside of the plasma etching machine (5), and ensure that the flexible shielding sleeve (12) completely covers the observation window of the plasma etching machine (5); Step 200: Control the mobile light source emitting mechanism (4) to traverse each coordinate point in the YOZ plane, and emit light of a set wavelength during the movement. Drive the data acquisition mechanism (3) to follow the mobile light source emitting mechanism (4) and move synchronously to acquire the spectral signal of the mobile light source emitting mechanism (4) at each coordinate point through the plane moving mechanism (2). Step 300: Perform the etching process, control the mobile light source emitting mechanism (4) and the data acquisition mechanism (3) to synchronously correspond to the position of the radio frequency unit of the plasma etching machine (5) in the YOZ plane, and acquire the spectral signal of the plasma glow generated during the etching process and the light emitted by the mobile light source emitting mechanism (4) superimposed. Step 400: The spectral signal of the superposition of the plasma glow generated by the etching process and the light emitted by the mobile light source emission mechanism (4) is transmitted in real time to the control system of the plasma etching machine (5) through the data acquisition mechanism (3).

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