Semiconductor part clamp and semiconductor part clamping method
By designing a semiconductor component fixture, the precise positioning of semiconductor components is achieved using groove and boss structures, which solves the problems of twisting deformation and multiple clamping in the processing of easily deformable material components, thereby improving production efficiency and quality.
Patent Information
- Application Number
- CN202511740303.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-25
- Publication Date
- 2025-12-30
AI Technical Summary
When processing semiconductor components, especially those made of easily deformable materials such as aluminum and stainless steel, there are problems such as the inability to meet standard requirements due to planar structural distortion and deformation, and the need for multiple clamping operations, which leads to cumbersome production steps, high costs, and large precision errors.
Design a semiconductor component fixture, including a first recessed groove on the fixture body and a circumferential second protrusion. The first protrusion is inserted into the inner cavity and the second protrusion is attached to the positioning hole on the bottom wall. With the help of positioning pins, multiple processing can be achieved by clamping once, reducing the use of the fixture and the number of clamping times.
It enables precise positioning of the outer periphery and inner cavity of semiconductor components, reducing production costs, improving production efficiency and quality, and reducing clamping errors.
Smart Images
Figure CN121237726A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor processing, and particularly relates to a semiconductor component clamp and a semiconductor component clamping method. BACKGROUND
[0002] When processing some semiconductor components, there is a high precision requirement for the flatness of the processing surface. In particular, the flat structure of components made of materials such as aluminum (AL6061) and stainless steel (SUS304) is prone to distortion and deformation during processing, making it difficult to meet standard requirements and increasing the difficulty of clamping. Furthermore, for semiconductor components with an internal cavity, the outer peripheral wall and the internal cavity wall of the semiconductor component usually need to be processed multiple times during processing, which requires the use of different clamps for clamping and positioning the semiconductor component, resulting in a cumbersome production process and high production cost of the clamp. At the same time, the precision error of the product is further increased during multiple clamping, resulting in a decrease in production quality.
[0003] Therefore, there is an urgent need to provide a new type of semiconductor component clamp and a semiconductor component clamping method to solve the above technical problems in the prior art. SUMMARY
[0004] An object of the present application is to provide a semiconductor component clamp that can reduce the number of clamps used and lower production costs, and has a simple clamping process, thereby improving production efficiency and quality.
[0005] To achieve this object, the present application adopts the following technical solutions:
[0006] The semiconductor component clamp comprises a clamp body. A first recess is recessed on one side of the clamp body, so that a first boss is formed at the center of the clamp body. A second boss is formed on the outer side of the first recess in the circumferential direction. The first boss is inserted into the internal cavity of the semiconductor component. The top wall of the second boss is attached to the bottom wall of the semiconductor component. The second boss is provided with a positioning hole. A positioning pin is inserted through the semiconductor component.
[0007] Optionally, the clamp body is coaxially fixed to a processing table. The first recess is annular and coaxially arranged with the processing table.
[0008] Optionally, a reference shaft hole is formed at the center axis of the clamp body. The reference shaft hole is used for reference positioning of external processing equipment.
[0009] Optionally, a plurality of first fixing holes are uniformly and intermittently arranged on the circumference of the reference shaft hole. The first fixing holes are used for inserting a first connecting member, so that the clamp body is fixed to the processing table.
[0010] Optionally, the first fixing holes are evenly spaced in multiple groups, and any group of the first fixing holes includes multiple first fixing holes spaced along a radial direction of the reference axial hole.
[0011] Optionally, the second bosses are circumferentially spaced along an outer side of the first groove, and at least two of the second bosses are provided with the positioning hole.
[0012] Optionally, the positioning hole is provided in two, and the two positioning holes are provided one-to-one on two second bosses on the same diagonal line.
[0013] Optionally, the second bosses are provided with second fixing holes, and the second fixing holes are used to pass through the second connecting member to fix the semiconductor component to the clamp body.
[0014] Optionally, any second boss is provided with a limiting portion extending outward along a radial direction of the first groove, and a limiting plane is arranged on a circumferential outer wall of the limiting portion.
[0015] Another object of the present application is to provide a semiconductor component clamping method using the semiconductor component clamp according to any one of the above-mentioned solutions to clamp a semiconductor component, including the steps of: S1, placing the first groove of the clamp body upward on a machining table, and fixing the clamp body and the machining table using the first connecting member; S2, placing the semiconductor component on the clamp body so that the bottom wall of the semiconductor component abuts against the second boss, and passing the positioning pin through the semiconductor component and the positioning hole; S3, machining the circumferential outer wall of the semiconductor component; S4, adjusting the position of the semiconductor component so that the first boss is inserted into the inner cavity of the semiconductor component; and S5, machining the circumferential inner wall of the inner cavity of the semiconductor component.
[0016] Advantages:
[0017] The semiconductor component fixture of this invention has a first groove recessed into the fixture body, forming a first boss at the center of the fixture body. A second boss is formed circumferentially around the outer side of the first groove. The first boss is inserted into the inner cavity of the semiconductor component, providing a reference positioning for the inner cavity. The top wall of the second boss is attached to the bottom wall of the semiconductor component. Positioning pins are inserted into positioning holes in the semiconductor component and the second boss, thereby positioning the outer peripheral wall of the semiconductor component. This semiconductor component fixture can achieve positioning of the outer periphery and inner cavity of the semiconductor component using only one fixture body. It allows for multiple processing operations with a single clamping operation, reducing the use of fixtures and the number of clamping operations, thereby reducing production costs, increasing production efficiency, reducing errors during clamping, and improving production quality. Attached Figure Description
[0018] Figure 1 This is an isometric view of a semiconductor component fixture provided in a specific embodiment of the present invention.
[0019] In the picture:
[0020] 100. Fixture body; 110. First groove; 120. First boss; 121. Reference shaft hole; 122. First fixing hole; 130. Second boss; 131. Positioning hole; 132. Second fixing hole; 140. Limiting part; 141. Limiting plane; 200. Machining table. Detailed Implementation
[0021] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.
[0022] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0023] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0024] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.
[0025] Please refer to Figure 1 The semiconductor component fixture includes a fixture body 100. A first groove 110 is recessed on one side of the fixture body 100 so that a first boss 120 is formed at the center of the fixture body 100. A second boss 130 is formed circumferentially on the outer side of the first groove 110. The first boss 120 is inserted into the inner cavity of the semiconductor component. The top wall of the second boss 130 is attached to the bottom wall of the semiconductor component. The second boss 130 is provided with a positioning hole 131, and a positioning pin that passes through the semiconductor component is inserted into the positioning hole 131.
[0026] In this embodiment, the semiconductor component fixture has a first groove 110 recessed in the fixture body 100, resulting in a first boss 120 at the center of the fixture body 100. A second boss 130 is formed circumferentially on the outer side of the first groove 110. The first boss 120 is inserted into the inner cavity of the semiconductor component, providing a reference positioning for the inner cavity. The top wall of the second boss 130 is attached to the bottom wall of the semiconductor component. A positioning pin is inserted into the positioning hole 131 of the semiconductor component and the second boss 130, thereby positioning the outer peripheral wall of the semiconductor component. This semiconductor component fixture can achieve positioning of the outer periphery and inner cavity of the semiconductor component using only one fixture body 100. It allows for multiple processing operations with a single clamping operation, reducing the use of fixtures and the number of clamping operations, thereby reducing production costs, increasing production efficiency, reducing errors during clamping, and improving production quality.
[0027] Furthermore, the fixture body 100 is coaxially fixed to the processing table 200, and the first groove 110 is annular and coaxially arranged with the processing table 200. Since the fixture body 100, the processing table 200 and the first groove 110 are coaxially arranged, the internal cavity of the semiconductor component can be processed during the rotation of the processing table 200, improving the processing accuracy and thus improving the production quality.
[0028] In this embodiment, a reference shaft hole 121 is provided at the central axis of the fixture body 100. The reference shaft hole 121 is used for reference positioning of external processing equipment. The reference shaft hole 121 can be used to position the processing tools of external equipment, and by using the reference shaft hole 121 to provide reference positioning for the rotation center of the processing tools, production quality is further improved. The reference shaft hole 121 can also be used to insert a positioning shaft, thereby realizing the positioning of the fixture body 100 and the processing table 200, which will not be described in detail here.
[0029] Optionally, along the circumference of the aforementioned reference shaft hole 121, the aforementioned first boss 120 is provided with a plurality of first fixing holes 122 at even intervals. The aforementioned first fixing holes 122 are used to pass through the first connecting member, so that the aforementioned fixture body 100 is fixed to the aforementioned processing table 200. In this embodiment, the first connecting member is a connecting bolt. The connecting bolt can be used to firmly fix the fixture body 100 to the processing table 200, and it is easy to disassemble and can be easily replaced with other suitable fixtures, thereby improving production efficiency.
[0030] Please continue to refer to this. Figure 1 The aforementioned first fixing holes 122 are evenly spaced in multiple groups, and any group of the aforementioned first fixing holes 122 includes multiple first fixing holes 122 radially spaced along the aforementioned reference shaft hole 121. In this embodiment, the first fixing holes 122 are arranged in 8 groups along the circumference, of which 4 groups are provided with two first fixing holes 122, and the other 4 groups are provided with one first fixing hole 122. The first fixing holes 122 in groups of two and groups of one are staggered along the circumference, with each group spaced at 45° apart. This will not be described in detail here.
[0031] Optionally, multiple second bosses 130 are distributed circumferentially along the outer side of the first groove 110, and at least two of the second bosses 130 are provided with the positioning holes 131. The provision of at least two positioning holes 131 can further improve the positioning accuracy, thereby further improving the processing quality.
[0032] In this embodiment, specifically, two positioning holes 131 are provided, and the two positioning holes 131 are respectively provided on the two second protrusions 130 located on the same diagonal. That is, the two positioning holes 131 are arranged along the diagonal, and together with the top wall of the second protrusion 130, the semiconductor component can be positioned in three directions, which makes the positioning of the semiconductor component more accurate and thus improves the processing quality.
[0033] It should be noted that each of the aforementioned second protrusions 130 is provided with a second fixing hole 132. The second fixing hole 132 is used to pass through a second connector to fix the semiconductor component to the fixture body 100. Each second protrusion 130 may have one or more second fixing holes 132. In this embodiment, the second protrusion 130 is provided with two second fixing holes 132. The second connector is a connecting bolt, which securely fixes the semiconductor component to the fixture body 100 and facilitates the removal of the processed semiconductor component, thereby improving production efficiency.
[0034] In this embodiment, any of the aforementioned second protrusions 130 extends radially outward along the first groove 110 and is provided with a limiting portion 140. The circumferential outer wall of the limiting portion 140 is provided with a limiting plane 141. The semiconductor component is an irregularly shaped part, which is provided with a flat plate extending in the vertical direction. The side wall of the flat plate can abut against the limiting plane 141, which can further limit the circumferential movement of the semiconductor component, improve the positioning accuracy, and thus further improve the processing quality.
[0035] This embodiment also provides a semiconductor component clamping method. The semiconductor component clamping method uses a semiconductor component fixture as described in any of the above schemes to clamp semiconductor components, including the following steps: S1, placing the first groove 110 of the fixture body 100 facing upward on the processing table 200, and fixing the fixture body 100 and the processing table 200 with a first connector; S2, placing the semiconductor component on the fixture body 100 such that the bottom wall of the semiconductor component abuts against the second protrusion 130, and passing the positioning pin through the semiconductor component and the positioning hole 131; S3, machining the circumferential outer wall of the semiconductor component; S4, adjusting the position of the semiconductor component such that the first protrusion 120 engages with the inner cavity of the semiconductor component; S5, machining the circumferential inner wall of the inner cavity of the semiconductor component.
[0036] This semiconductor component clamping method uses a semiconductor component fixture as described in any of the above-mentioned schemes to clamp semiconductor components, thereby achieving the beneficial effects of the semiconductor component fixtures described in any of the above-mentioned schemes. Specifically, the first boss 120 is inserted into the inner cavity of the semiconductor component to form a reference positioning for the inner cavity of the semiconductor component. The top wall of the second boss 130 is attached to the bottom wall of the semiconductor component. A positioning pin is inserted into the positioning hole 131 of the semiconductor component and the second boss 130 to form a positioning of the outer peripheral wall of the semiconductor component. That is, the positioning of the outer periphery and inner cavity of the semiconductor component can be achieved using a single fixture body 100. It can clamp once and process multiple times, reducing the use of fixtures and the number of clamping times, thereby reducing production costs, improving production efficiency, reducing errors in the clamping process, and improving production quality.
[0037] Obviously, the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.
[0038] Note that in the description of this specification, the references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
Claims
1. A semiconductor component holder characterized by, The semiconductor component clamp comprises a clamp body (100), a first recess (110) is formed on one side of the clamp body (100), a first boss (120) is formed at the center of the clamp body (100), a second boss (130) is formed on the outer side of the first recess (110) in a circumferential direction, the first boss (120) is matched and inserted into the inner cavity of a semiconductor component, the top wall of the second boss (130) is matched and attached to the bottom wall of the semiconductor component, the second boss (130) is provided with a positioning hole (131), and a positioning pin penetrating through the semiconductor component is inserted into the positioning hole (131).
2. The semiconductor component clamp according to claim 1, characterized by The clamp body (100) is coaxially fixed on a machining table (200), the first recess (110) is annular and coaxially arranged on the machining table (200).
3. The semiconductor component clamp according to claim 2, characterized by A reference shaft hole (121) is formed at the center axis of the clamp body (100), and is used for reference positioning of an external machining equipment.
4. The semiconductor component clamp according to claim 3, characterized by A plurality of first fixing holes (122) are uniformly and intermittently arranged on the first boss (120) in the circumferential direction of the reference shaft hole (121), and the first fixing holes (122) are used for penetrating a first connecting piece to fix the clamp body (100) on the machining table (200).
5. The semiconductor component clamp according to claim 4, characterized by The first fixing holes (122) are uniformly and intermittently arranged in multiple groups, and any group of the first fixing holes (122) comprises a plurality of first fixing holes (122) arranged in a radial direction of the reference shaft hole (121).
6. The semiconductor component clamp according to claim 1, characterized by A plurality of second bosses (130) are arranged in a circumferential direction of the first recess (110), and at least two second bosses (130) are provided with the positioning hole (131).
7. The semiconductor component clamp according to claim 6, characterized by The positioning hole (131) is provided with two positioning holes (131), and the two positioning holes (131) are arranged one by one on two second bosses (130) on the same diagonal line.
8. The semiconductor component clamp according to claim 6, characterized by The second fixing hole (132) is arranged on the second boss (130), and the second fixing hole (132) is used for penetrating a second connecting piece to fix the semiconductor component on the clamp body (100).
9. The semiconductor component clamp according to claim 6, characterized by The limiting part (140) is arranged on any second boss (130) in a radial direction of the first recess (110) and extends outward, and a limiting plane (141) is arranged on the circumferential outer wall of the limiting part (140).
10. A semiconductor component mounting method characterized by, The semiconductor component clamp is used to clamp a semiconductor component, and comprises the following steps: S1, placing the first recess (110) of the clamp body (100) upward on the machining table (200), and fixing the clamp body (100) and the machining table (200) by using a first connecting piece; S2, placing a semiconductor component on the clamp body (100) so that the bottom wall of the semiconductor component abuts against the second boss (130), and penetrating the positioning pin through the semiconductor component and the positioning hole (131); S3, machining the circumferential outer wall of the semiconductor component; S4, adjusting the position of the semiconductor component so that the first boss (120) is matched and plugged with the inner cavity of the semiconductor component; S5, processing the circumferential inner wall of the inner cavity of the semiconductor component.