Printed circuit board, electronic component, process method, electronic equipment and vehicle

Abstract

The embodiment of the invention provides a printed circuit board, an electronic component, a process method, electronic equipment and a vehicle. The printed circuit board comprises a substrate, wherein a plurality of copper-clad layers are arranged on the first surface of the substrate; the first bonding pad is arranged on the first surface of the substrate; and the first bonding pad and the at least one copper-clad layer are connected into a whole. The first bonding pad and the peripheral copper-clad layer are connected into a whole, so that the tensile force generated by the module welded on the first bonding pad can be shared, and the problem of substrate crater cracking can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit boards, and in particular to a printed circuit board, an electronic assembly, a process method of an electronic assembly, an electronic device, and a vehicle. BACKGROUND

[0002] With the development of automotive electronics technology, large-size modules (module size > 50mm x 50mm) with integrated multiple functions frequently appear. This type of module not only has high SMT (Surface Mounting Technology) soldering difficulty, but also introduces some product failure risks. For example, the problem of PCB (Printed Circuit Board) substrate cracking.

[0003] Specifically, as shown in FIG. 1, taking an LGA (Land Grid Array) package or a BGA (Ball Grid Array) package with a size greater than 50mm x 50mm as an example: Figure 1

[0004] The copper layer 2 on the PCB substrate 1 can be RF4 (Resin Fiberglass-4). The copper layer 2 is a carrier for realizing the connection of circuit principles, power supply, and signals. The copper layer 2 can be a signal trace, ground, power supply line, balanced copper, pad, etc.

[0005] Among them, the copper layer 2 will be covered by green oil 5 to avoid problems such as short circuit and PCB corrosion caused by exposed copper, and only the pad 3 needs to be connected with the chip pin and is exposed outside.

[0006] A solder resist window 4 is left around the pad 3, and the solder resist window 4 position can directly expose the PCB substrate 1. During soldering, there is a pulling action between the LGA or BGA packaged module and the PCB. Since the current lead-free solder has high hardness, it cannot alleviate the pulling force through the intermediate solder, and the PCB substrate 1 will crack along the outermost edge of the pad 3. SUMMARY

[0007] In view of the above problems, the present application provides a printed circuit board, an electronic assembly, a process method of an electronic assembly, an electronic device, and a vehicle, which overcome the above problems or at least partially solve the above problems, comprising:

[0008] A printed circuit board, comprising:

[0009] a substrate, a first surface of the substrate being provided with a plurality of copper layers; ​

[0010] a first pad disposed on the first surface of the substrate; the first pad is integrated with the at least one copper clad layer.

[0011] Optionally, a first surface of the first pad is attached to the first surface of the substrate, and a first surface of the at least one copper clad layer is attached to the first surface of the substrate; the printed circuit board further comprises:

[0012] a solder resist layer covering a second surface of the at least one copper clad layer;

[0013] wherein the first surface of the copper clad layer is opposite to the second surface of the copper clad layer.

[0014] Optionally, the solder resist layer further covers a partial area of the first surface of the first pad.

[0015] Optionally, the first pad is disposed at a top corner area of the first surface of the substrate; the top corner area is less than a preset distance value from a top corner of the first surface of the substrate.

[0016] Optionally, the at least one copper clad layer comprises a second pad.

[0017] the first pad is integrated with the at least one copper clad layer, comprising:

[0018] the first pad is integrated with the second pad.

[0019] Optionally, the first pad is integrated with the at least one copper clad layer, comprising:

[0020] a side surface of the first pad is integrated with the at least one copper clad layer through the copper connecting layer.

[0021] Embodiments of the present application also provide an electronic assembly, which comprises the printed circuit board and a module as described above.

[0022] wherein the module is connected with the first pad of the printed circuit board.

[0023] Embodiments of the present application also provide a process method of an electronic assembly, which comprises:

[0024] placing a module on a welding surface of a first pad of a printed circuit board as described above;

[0025] welding the module on the welding surface of the first pad.

[0026] Embodiments of the present application also provide an electronic device, which comprises the electronic assembly and a first other assembly as described above.

[0027] The embodiment of the present application also provides a vehicle comprising the electronic assembly and a second other assembly as described above.

[0028] The embodiment of the present application has the following advantages:

[0029] In the embodiment of the present application, the printed circuit board comprises a substrate, a first surface of the substrate is provided with a plurality of copper layers, and a first pad is arranged on the first surface of the substrate; the first pad is integrated with at least one copper layer. By integrating the first pad with the peripheral copper layer, the pulling force generated by the module welded on the first pad can be shared, thereby avoiding the occurrence of the substrate cracking problem. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0031] Figure 1 is a structural schematic diagram of a printed circuit board in the prior art;

[0032] Figure 2a is a structural schematic diagram of a printed circuit board in the embodiment of the present application;

[0033] Figure 2b is a structural schematic diagram of another printed circuit board in the embodiment of the present application;

[0034] Figure 3 is a schematic diagram of a first pad position layout in the embodiment of the present application;

[0035] Figure 4 is a schematic diagram of a first pad and a first pad periphery in the embodiment of the present application;

[0036] Figure 5a is a structural schematic diagram of another printed circuit board in the embodiment of the present application;

[0037] Figure 5b is a structural schematic diagram of another printed circuit board in the embodiment of the present application;

[0038] Figure 6 is a schematic diagram of a first surface and a second surface of a copper layer in the embodiment of the present application;

[0039] Figure 7a is a structural schematic diagram of another printed circuit board in the embodiment of the present application;

[0040] Figure 7bis another structure schematic diagram of a printed circuit board according to an embodiment of the present application;

[0041] Brief Description of the Drawings

[0042] The substrate 201, the copper clad layer 202, the first pad 203, the copper connection layer 204, and the solder resist layer 205.

[0043] The first surface of the copper clad layer 2021, and the second surface of the copper clad layer 2022. DETAILED DESCRIPTION

[0044] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0045] For the substrate cracking problem of the PCB, the present application can increase the copper clad of the PCB pad, thereby distributing the stress borne by the pad to the surrounding copper clad, and thereby avoiding the substrate cracking problem. Specifically, reference can be made to Figure 2a , Figure 2a A structure schematic diagram of a printed circuit board according to an embodiment of the present application is shown.

[0046] As shown in Figure 2a , the printed circuit board can include:

[0047] The substrate 201, the first surface of the substrate 201 is provided with a plurality of copper clad layers 202.

[0048] The first pad 203 is arranged on the first surface of the substrate 201; the first pad 203 is integrated with at least one copper clad layer 202.

[0049] In the embodiments of the present application, the printed circuit board can include the substrate 201 and the first pad 203, and the first pad 203 can refer to the pad of the printed circuit board which needs to avoid the substrate cracking problem; for example, the first pad 203 can be arranged at the positions of the four corners of the substrate. As shown in Figure 3 .

[0050] The first surface of the substrate 201 can be provided with a plurality of copper clad layers 202; the copper clad layer 202 can refer to the area on the first surface of the substrate 201 which is covered with a copper layer. The first surface of the substrate 201 can refer to the top layer of the substrate 201 which is used for welding with the pad and the like, or can refer to the bottom layer of the substrate 201 which is used for welding with the pad and the like.

[0051] The first surface of the first soldering pad 203 (i.e. the substrate surface of the first soldering pad 203) can be connected to the first surface of the substrate 201 by a manufacturing process such as chemical etching and electroplating. In actual applications, the first soldering pad 203 can be used for soldering with a module. After soldering with the module, the module and the substrate 201 can be pulled, which can cause the substrate 201 at the position of the first soldering pad 203 to crack. In order to avoid the cracking, the first soldering pad 203 and the at least one copper clad layer 202 can be connected as a whole, so that the stress borne by the first soldering pad 203 can be distributed to the surrounding copper clad layers 202, thereby avoiding the problem of substrate cracking.

[0052] As shown in FIG. 2, the first soldering pad 203 and the at least one copper clad layer 202 can be connected by a copper connecting layer 204. The copper connecting layer 204 can be a connecting layer made of copper material for connecting the first soldering pad 203 and the at least one copper clad layer 202 as a whole. The specific shape of the copper connecting layer 204 can be set according to the spacing between the first soldering pad 203 and the copper clad layer, and the embodiments of the present application do not limit the same. Figure 2b As shown in FIG. 2, the at least one copper clad layer 202 can include four copper clad layers 202 adjacent to the first soldering pad 203 as the center. As shown in FIG. 3, the at least one copper clad layer 202 can include two copper clad layers 202 adjacent to the first soldering pad 203 as the center. The embodiments of the present application do not limit the same.

[0053] Figure 4 As shown in FIG. 2, the at least one copper clad layer 202 can include four copper clad layers 202 adjacent to the first soldering pad 203 as the center. As shown in FIG. 3, the at least one copper clad layer 202 can include two copper clad layers 202 adjacent to the first soldering pad 203 as the center. The embodiments of the present application do not limit the same.

[0054] In the embodiments of the present application, the printed circuit board includes a substrate, a first surface of the substrate is provided with a plurality of copper clad layers, a first soldering pad is arranged on the first surface of the substrate, and the first soldering pad is connected as a whole with at least one copper clad layer. By connecting the first soldering pad and the surrounding copper clad layers as a whole, the pulling force generated by the module soldered on the first soldering pad can be distributed, thereby avoiding the problem of substrate cracking.

[0055] In an embodiment of the present application, the first surface of the first soldering pad 203 is attached to the first surface of the substrate 201, and the first surface 2021 of the at least one copper clad layer 202 is attached to the first surface of the substrate 201. The printed circuit board further includes:

[0056] a solder mask layer 205 covering the second surface 2022 of the at least one copper clad layer 202;

[0057] The first surface 2021 of the copper clad layer 202 is opposite to the second surface 2022 of the copper clad layer 202.

[0058] In some possible embodiments, as shown in FIG. 2, the at least one copper clad layer 202 can include four copper clad layers 202 adjacent to the first soldering pad 203 as the center. As shown in FIG. 3, the at least one copper clad layer 202 can include two copper clad layers 202 adjacent to the first soldering pad 203 as the center. The embodiments of the present application do not limit the same. Figure 5a ​As shown, the first surface of the first pad 203 can be bonded to the first surface of the substrate 201; the first surface 2021 (i.e., the substrate surface of the copper clad layer) of each copper clad layer 202 can be bonded to the first surface of the substrate 201; in order to protect the copper traces and pads on the PCB from oxidation and contamination, and to prevent unnecessary solder bridging during the soldering process, a solder resist layer 205 can be covered on the second surface 2022 of each copper clad layer 202. The solder resist layer 205 can be green solder mask.

[0059] like Figure 5b As shown, if the first pad 203 is integrally connected to at least one copper clad layer 202 via the copper interconnect layer 204, the solder mask layer 205 can cover the second surface 2022 of each copper clad layer 202, but not the first pad 203 and the copper interconnect layer 204.

[0060] For example, the solder mask 205 can cover all copper layers except for pads and vias, preventing the copper layers from being exposed to air and thus reducing the risk of oxidation and corrosion. The solder mask 205 can also prevent solder from flowing into areas that do not need soldering during the soldering process, thereby avoiding short circuits. Additionally, the solder mask 205 helps ensure that solder adheres only to designated pads, improving the accuracy and reliability of the soldering process.

[0061] In practical applications, the first surface 2021 and the second surface 2022 of the copper clad layer 202 can be opposing surfaces; for example... Figure 6 As shown.

[0062] In one embodiment of the present invention, the solder mask layer 205 also covers a portion of the first surface of the first pad 203.

[0063] In some feasible embodiments, such as Figure 7a As shown, in order to further distribute the pulling force exerted by the module on the first pad 203, the solder resist layer 205 can be covered on a portion of the first surface of the first pad 203, thereby enhancing the bonding strength between the pad and the substrate 201.

[0064] like Figure 7b As shown, when the first pad 203 and at least one copper cladding layer 202 are connected together by a copper interconnect layer, the solder joint layer 205 can completely cover the copper interconnect layer and partially cover the first surface of the first pad 203.

[0065] In one embodiment of the present invention, a first pad 203 is disposed on the apex corner region of the first surface of the substrate 201; the distance between the apex corner region and the apex corner of the first surface of the substrate is less than a preset distance value.

[0066] In practical applications, pitting typically occurs near the four vertices of the substrate 201. To address this issue, in this embodiment of the invention, the first pad 203 can be located in the area where the four vertices of the first surface of the substrate 201 are located (i.e., the vertices area, where any point in the vertices area is less than a preset distance from the vertices of the first surface of the substrate, which can be set according to actual conditions). The first pad 203 in the four vertices can be connected to at least one copper layer 202 around it, thereby preventing pitting from occurring in the area where the four vertices of the substrate 201 are located due to the soldering of modules.

[0067] In this embodiment of the invention, the edge of the first pad 203 is connected to the surrounding copper cladding layer 202 as one unit, and the solder mask layer 205 is no longer exposed on the substrate 201. The tension concentration point of the module is no longer in direct contact with the PCB substrate 201, which can fundamentally avoid the problem of pitting on the substrate 201.

[0068] In one embodiment of the present invention, at least one copper cladding layer 202 includes a second pad, and the first pad 203 is integrally connected with the second pad.

[0069] In practical applications, the copper layer 202 in the printed circuit board can be a signal trace, ground, power line, balance copper, or other pads; in the embodiments of the present invention, one of the copper layers 202 around the first pad 203 can be a second pad, and the first pad 203 can be integrated with the second pad.

[0070] It should be noted that whether the first pad 203 is connected to the non-pad copper layer 202 or to the second pad copper layer 202, the relationship between the first pad 203 and the connected copper layer 202 must be connectable; otherwise, short circuits and other problems will occur. The structural design mentioned in this invention is not applicable to pads that cannot be connected to the surrounding copper layers 202 or pads.

[0071] In one embodiment of the present invention, the side of the first pad 203 is integrally connected to at least one copper cladding layer 202 via a copper interconnect layer 204.

[0072] In some feasible embodiments, the side of the first pad 203 and the side of the copper cladding layer 202 can be integrated by a copper interconnect layer 204; for example, the side of the first pad 203 can refer to the surface perpendicular to the first surface of the substrate 201 and closest to the copper cladding layer 202 to be connected. The side of the copper cladding layer 202 can refer to the surface perpendicular to the first surface of the substrate 201 and closest to the first pad 203 to be connected.

[0073] Based on the printed circuit board described above, this embodiment of the invention also provides an electronic component, which may include the printed circuit board and module provided in any of the above embodiments.

[0074] The module is connected to the first pad on the printed circuit board.

[0075] In practical applications, a module can refer to a component that needs to be soldered onto the first pad of a printed circuit board, such as an integrated circuit module, a wireless communication module, a power supply module, a sensor module, an audio module, a display module, a storage module, an interface module, a modular system, a system-level module, etc. This embodiment of the invention does not limit this.

[0076] In view of the above-mentioned electronic components, embodiments of the present invention also provide a manufacturing method for the electronic components, which may include:

[0077] The module is placed on the soldering surface of the first pad of the printed circuit board provided in any of the above embodiments; the module is soldered to the soldering surface of the first pad.

[0078] In some feasible embodiments, the module to be soldered to the first pad can be placed on the soldering surface of the first pad on the printed circuit board; then, the module can be soldered onto the soldering surface of the first pad. Due to the special design of the printed circuit board, the tensile force exerted by the module on the substrate can be dispersed, thereby avoiding the problem of substrate pitting.

[0079] For example, during the SMT (Surface Mount Technology) process (where the module is soldered to the first pad), the module still deforms considerably as the temperature changes from room temperature to high temperature (around 240°C) and back to room temperature. However, the edge of the first pad is now integrated with the surrounding copper layer, the solder mask opening no longer exposes the substrate, and the stress concentration point no longer directly contacts the substrate, which can fundamentally avoid the problem of substrate pitting.

[0080] Based on the above-described electronic components, embodiments of the present invention also provide an electronic device, which may include the electronic components provided in any of the above embodiments and a first other component; the first other component may be other electronic components in the electronic device besides the electronic components.

[0081] Based on the above-described electronic components, embodiments of the present invention also provide a vehicle, which may include the electronic components provided in any of the above embodiments and a second other component; the second other component may be other electronic components in the vehicle besides the electronic components.

[0082] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0083] The foregoing has provided a detailed description of a printed circuit board, an electronic component, a manufacturing process for the electronic component, an electronic device, and a vehicle. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the present invention and its core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A printed circuit board, characterized in that, The printed circuit board includes: A substrate, wherein a plurality of copper-clad layers are disposed on the first surface of the substrate; A first pad is disposed on a first surface of the substrate; the first pad is integrally connected with at least one copper cladding layer.

2. The printed circuit board according to claim 1, characterized in that, The first surface of the first pad is bonded to the first surface of the substrate, and the first surface of the at least one copper-clad layer is bonded to the first surface of the substrate; the printed circuit board further includes: A solder resist layer covers the second surface of the at least one copper-clad layer; In this case, the first surface of the copper clad layer is opposite to the second surface of the copper clad layer.

3. The printed circuit board according to claim 2, characterized in that, The solder resist layer also covers a portion of the first surface of the first pad.

4. The printed circuit board according to claim 1, characterized in that, The first pad is disposed at the apex corner region of the first surface of the substrate; the distance between the apex corner region and the apex corner of the first surface of the substrate is less than a preset distance value.

5. The printed circuit board according to claim 1, characterized in that, The at least one copper cladding layer includes a second pad; The first pad is integrally connected to at least one copper cladding layer, including: The first pad and the second pad are connected as one unit.

6. The printed circuit board according to claim 1, characterized in that, The first pad is integrally connected to at least one copper cladding layer, including: The side of the first pad is integrally connected to the at least one copper cladding layer via a copper interconnect layer.

7. An electronic component, characterized in that, The electronic components include the printed circuit board and module as described in claims 1-6; The module is connected to the first pad of the printed circuit board.

8. A manufacturing method for an electronic component, characterized in that, The process includes: The module is placed on the soldering surface of the first pad of the printed circuit board as described in any one of claims 1-6; The module is soldered onto the soldering surface of the first solder pad.

9. An electronic device, characterized in that, The electronic device includes the electronic components as described in claim 7 and a first other component.

10. A vehicle, characterized in that, The vehicle includes the electronic components as described in claim 7 and a second other component.

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