Laser processing system and method for dental implant

Abstract

The invention discloses a dental implant laser processing system and method, the dental implant laser processing system is used for processing a microgroove structure on a dental implant, the dental implant laser processing system comprises a first light path assembly, a second light path assembly, a beam combining assembly and a processing head, the first light path assembly is used for outputting femtosecond laser; the second light path assembly is used for outputting nanosecond laser; the beam combining assembly is located on a transmission path of the femtosecond laser and the nanosecond laser so as to realize space coupling of the femtosecond laser and the nanosecond laser; the machining head is located on the light emitting path of the beam combining assembly and used for enabling the femtosecond laser and the nanosecond laser to act on the dental implant to be machined, and a microgroove structure is machined. The machining precision and the precision of the microgroove structure are improved, no subsequent machining procedure is needed, the machining cost is reduced, and the machining efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of medical device manufacturing technology, and in particular to a laser processing system and method for dental implants. Background Technology

[0002] Dental implants are an important means of restoring missing teeth, and the structural design of their transgingival segment is crucial for the long-term stability and biocompatibility of the restoration. The micron-level microgrooves in the transgingival segment serve two main purposes: first, to enhance mechanical retention, providing a locking space for the adhesive and preventing crown loosening; and second, to promote biocompatibility, providing an attachment scaffold for gingival fibroblasts, forming a soft tissue barrier, and preventing bacterial invasion.

[0003] In related technologies, the microgrooving structure of the transgingival segment of dental implants is typically machined using five-axis CNC milling technology. This technique uses ultra-hard diamond-coated or carbide micro-precision tools, under the control of computer-aided design (CAD / CAM), to perform high-speed, high-precision cutting on titanium alloy (or zirconium oxide) blanks using a five-axis CNC machine tool. The programmer generates the machining path based on a pre-designed 3D model, which includes the depth, width, shape, and helix angle of the microgrooving structure. The spindle drives the micro-tool to perform complex trajectory movements to precisely "carve" grooves onto the tapered surface of the transgingival segment.

[0004] However, five-axis CNC machine tools are expensive. To achieve micron-level precision on medical-grade titanium alloys (such as Ti-6Al-4V) or zirconium oxide, specialized micro-precision tools with diamond coatings or cemented carbide are required. These tools are costly and consumables, needing replacement after wear, further increasing production costs. Furthermore, tool wear can cause minute deviations in the dimensions of the microgroove structure, affecting product quality, while frequent tool replacements increase costs.

[0005] Furthermore, CNC milling is a severe plastic deformation process, and the cutting action of the tool introduces residual tensile stress on the surface and subsurface of the material. This stress concentration can become the initiation point for microcracks. For implant components subjected to cyclic biting forces (fatigue loads) over long periods, these microcracks may propagate under certain conditions, theoretically posing a risk of affecting the long-term fatigue strength of the component. These residual stresses are typically eliminated or transformed through subsequent heat treatment (stress-relief annealing) or sandblasting.

[0006] Implants or abutments milled by CNC are almost never used directly. The perforated segments are usually sandblasted and acid etched, which increases the number of production steps, time and cost. Summary of the Invention

[0007] This application provides a laser processing system and method for dental implants, which eliminates mechanical stress and requires no subsequent processing, thereby improving the processing efficiency of dental implants and reducing processing costs, thus at least partially solving the aforementioned technical problems.

[0008] To achieve the above objectives, according to a first aspect of this application, a laser processing system for dental implants is provided for processing microgroove structures on dental implants, comprising: The first optical path component is used to output femtosecond laser; The second optical path component is used to output nanosecond laser light; A beam combiner is located on the transmission paths of the femtosecond laser and the nanosecond laser to achieve spatial coupling between the femtosecond laser and the nanosecond laser; The processing head, located on the light output path of the beam combining assembly, is used to apply the femtosecond laser and the nanosecond laser to the dental implant to be processed, respectively, to process the microgroove structure.

[0009] Optionally, the first optical path assembly includes a femtosecond laser and a first beam expander, a first reflector, an acousto-optic modulator, a second reflector, and a spot shaper arranged sequentially along the output direction of the femtosecond laser. The femtosecond laser is used to output the femtosecond laser, and the femtosecond laser is output to the beam combining assembly sequentially through the first beam expander, the first reflector, the acousto-optic modulator, the second reflector, and the spot shaper.

[0010] Optionally, the second optical path assembly includes a nanosecond laser and a second beam expander, a third reflector, a fourth reflector, and an optoelectronic modulator arranged sequentially along the output direction of the nanosecond laser. The nanosecond laser is used to output the nanosecond laser, which is then output to the beam combining assembly via the second beam expander, the third reflector, the fourth reflector, and the optoelectronic modulator.

[0011] Optionally, the processing head includes a galvanometer scanning assembly, a field lens, and a focusing lens. The galvanometer scanning assembly is located on the light-emitting side of the beam combining assembly, the field lens is located on the light-emitting side of the galvanometer scanning assembly, and the focusing lens is located on the light-emitting side of the field lens.

[0012] Optionally, it also includes a four-dimensional motion platform for clamping and fixing the dental implant to be processed.

[0013] Optionally, it also includes a control system, wherein the first optical path component, the second optical path component, the processing head, and the four-dimensional motion platform are connected to the control system, and the control system is configured to: Control the opening or closing of the first optical path component and the second optical path component; The processing head is controlled to drive the femtosecond laser and the nanosecond laser to scan along a preset scanning path; The four-dimensional motion platform is controlled to drive the dental implant to be processed to move.

[0014] Optionally, the femtosecond laser has a wavelength of 1030 nm and a pulse width of 300 fs; And / or, the nanosecond laser has a wavelength of 1064 nm and a pulse width of 200 ns.

[0015] Optionally, the beam combiner includes a dichroic mirror.

[0016] According to a second aspect of this application, a laser processing method for dental implants is provided, using the laser processing system for dental implants described in any one of the above claims, comprising the following steps: S1, clamp and fix the implant to be processed, and perform initial focusing and positioning of the laser processing system; S2, control the processing head of the laser processing system to output femtosecond laser light to act on the implant to be processed; S3, control the processing head of the laser processing system to output nanosecond laser output to the area processed by the femtosecond laser; S4. Repeat steps S2 and S3 until a complete microgroove structure is formed on the implant.

[0017] Optionally, the laser processing system further includes a control system and a four-dimensional motion platform, and before S1, it further includes the following steps: S0, the three-dimensional model of the implant to be processed is imported into the control system. The control system generates the laser scanning path of the processing head and the motion trajectory of the four-dimensional motion platform according to the preset processing parameters of the microgroove structure. The processing parameters of the microgroove structure include at least one of width, depth, shape, spacing and helix angle.

[0018] In the laser processing system and method for dental implants according to the embodiments of this application, a femtosecond laser is generated by a first optical path component and a nanosecond laser is generated by a second optical path component. The femtosecond laser and the nanosecond laser act on the dental implant sequentially, producing a significant synergistic technical effect. This improves the processing accuracy and the accuracy of the microgroove structure, providing a strong guarantee for the long-term stable use of the implant. It effectively improves the fatigue resistance and mechanical strength of the implant, and there are no subsequent processing steps, reducing processing costs and improving processing efficiency.

[0019] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0021] Figure 1 This is an enlarged schematic diagram of a cross-section of a dental implant provided in an exemplary embodiment of this disclosure; Figure 2 This is a side view of a dental implant provided in an exemplary embodiment of this disclosure; Figure 3 This is a schematic diagram of the structure of a laser processing system provided in an exemplary embodiment of this disclosure.

[0022] Explanation of reference numerals in the attached figures: 100. Laser processing system; 110. First optical path assembly; 111. Femtosecond laser; 112. First beam expander; 113. Acousto-optic modulator; 114. Second mirror; 115. Beam shaper; 116. First mirror; 120. Second optical path assembly; 121. Nanosecond laser; 122. Second beam expander; 123. Third mirror; 124. Fourth mirror; 125. Optoelectronic modulator; 130. Beam combiner assembly; 140. Processing head; 150. Four-dimensional motion platform; 200. Implant; 210. Transgingival segment; 220. Microgroove structure. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0024] In related technologies, see Figure 1 and Figure 2 The dental implant 200 includes a transgingival segment 210 with a micron-level microgroove structure 220. The main purposes are twofold: first, to enhance mechanical retention, provide a locking space for the adhesive, and prevent the crown from loosening; second, to promote biological sealing, provide an attachment scaffold for gingival fibroblasts, form a soft tissue barrier, and prevent bacterial invasion.

[0025] During the final crown placement, the dentist uses cement (a dental adhesive) to bond the crown to the abutment. During bonding, excess cement needs to be removed; otherwise, it can compress the gums and cause inflammation. The microgroove structure 220 provides an extra space to accommodate and lock in a portion of the cement, significantly enhancing bond strength and preventing the crown from loosening or falling off under intraoral stress. In some cases, the dentist may use fine dental floss or sutures to temporarily fix the restoration; the microgroove structure 220 facilitates the wrapping and securing of these threads, ensuring the restoration is in the most precise position during bonding.

[0026] The microgroove structure 220 also serves to achieve a biological seal, crucial for long-term success. ① Guiding soft tissue attachment: The microgroove structure 220, or microtextured structure, of the transgingival segment 210 provides a scaffold for the attachment and growth of gingival fibroblasts (the main cells constituting gingival connective tissue). ② Forming a strong barrier: The gingival tissue of natural teeth attaches to the root via a strong fibrous barrier (periodontal ligament). Implant 200 lacks a periodontal ligament, requiring gingival soft tissue to attach directly to the implant 200 or abutment surface. The design of the microgroove structure 220 allows for: increased surface area: providing a larger area for cell attachment; mechanical interlocking: cell fibers can grow into the tiny grooves, creating a "mechanical interlocking" effect, much like ivy gripping a crack in a wall; and inhibition of epithelial migration: this strong connective tissue attachment effectively prevents gingival epithelium (a paper-thin tissue) from migrating downwards along the implant 200 surface. All these actions work together to create a deep, tight soft tissue cuff. This cuff acts like a "sealing ring," separating the oral environment (full of bacteria) from the alveolar bone below, effectively preventing bacterial invasion, protecting bone tissue, and thus achieving long-term health and stability.

[0027] Currently, the machining of the microgroove structure 220 of the transgingival segment 210 of this dental implant 200 mainly relies on five-axis CNC milling technology. Although this technology has high precision, it still has many inherent defects: five-axis CNC milling is currently the most core and common technology in the manufacturing of high-end implants 200 and abutments. Principle: Using micro-precision tools with superhard diamond coating or carbide, under the control of a computer program (CAD / CAM), a five-axis CNC machine tool performs high-speed, high-precision cutting on titanium alloy (or zirconium oxide) blanks. How to achieve the microgroove structure 220: The programmer generates the machining path based on the designed 3D model (including the depth, width, shape, and helix angle of the microgroove structure 220). The spindle drives the micro-tool to perform complex trajectory movements, thereby "carving" precise grooves on the conical surface of the transgingival segment 210. Advantages: Extremely high precision, excellent repeatability, capable of achieving complex three-dimensional shapes; high surface quality, with clear and sharp grooves after machining; very suitable for customized abutments or small-batch, multi-variety production.

[0028] While CNC milling is the mainstream high-precision technology for manufacturing dental implants with 200 transgingival segments and 210 vertebral bodies, it also presents some inherent drawbacks and challenges. Five-axis CNC machine tools are extremely expensive. Furthermore, to machine medical-grade titanium alloys (such as Ti-6Al-4V) or zirconium oxide with micron-level precision, specialized micro-precision tools with diamond coatings or carbide are required. These tools are costly and consumables, needing replacement after wear, further increasing production costs. Compared to mass production processes like injection molding (MIM) or casting, CNC milling is a "subtractive manufacturing" process, obtaining shape by gradually removing material. Machining a complex abutment requires a long machining time, limiting output per unit time and resulting in higher unit costs. When machining hard titanium alloys, tool tips wear. This wear can cause minute deviations in machining dimensions and potentially affect the quality of the machined surface. For medical products requiring absolute consistency, strict monitoring of tool life and frequent replacement are necessary, increasing costs and production complexity. The precision of the microgroove structure 220 is limited by the minimum diameter and rigidity of the tool. Theoretically, to achieve very sharp internal angles or extremely narrow grooves (e.g., less than tens of micrometers in width), finer tools are required. However, finer tools are more prone to wear, chattering, and even breakage, and the machining difficulty and risk increase exponentially.

[0029] CNC milling is a process of intense plastic deformation, and the cutting action of the tool on the workpiece introduces residual tensile stress on the material's surface and subsurface. This stress concentration can become the origin of microcracks. For implant components subjected to cyclic biting forces (fatigue loads) for extended periods, these microcracks may propagate under certain conditions, theoretically posing a risk of affecting the long-term fatigue strength of the component. These residual stresses are typically eliminated or transformed through subsequent heat treatment (stress-relieving annealing) or sandblasting.

[0030] CNC-machined surfaces leave very fine, regular tool marks. This anisotropic surface is not an ideal interface for bone or soft tissue integration. Surface treatment is necessary: ​​therefore, CNC-milled implants or abutments are almost never used directly. Transgingival segments typically undergo subsequent sandblasting and acid etching. Sandblasting involves bombarding the surface with particles such as alumina or titanium dioxide to mask tool marks, increase macroscopic roughness, and introduce compressive stress, which is beneficial for fatigue resistance. Acid etching involves corroding the metal surface with strong acids (such as mixtures of hydrofluoric acid, nitric acid, and hydrochloric acid) to form complex micron- to nanometer-scale porous structures, greatly increasing surface area, improving biocompatibility, and promoting soft tissue adhesion and closure. While these post-treatments are necessary, they also increase production steps, time, and cost. Five-axis CNC is very flexible, but for some extremely complex negative angles or internally hollow structures, there are still blind spots in tooling.

[0031] To solve the above problems, see [link to relevant documentation]. Figure 1 , Figure 2 and Figure 3 This application provides a laser processing system 100 for dental implants, used to process microgroove structures 220 on the transgingival segment 210 of a dental implant 200. The microgroove structure 220 is a groove spirally rising along the surface of the transgingival segment 210 in the axial direction of the implant 200. The processing parameters of the microgroove structure 220 include width, depth, shape, spacing, and spiral angle. The width of the microgroove structure 220 is D, 50μm≤D≤100μm. The depth of the microgroove structure 220 is H, 30μm≤H≤100μm. The shape of the microgroove structure 220 can be a U-shaped groove or a V-shaped groove. The spacing of the microgroove structure 220 refers to the distance between the spiral lines, and the spacing of the microgroove structure 220 is S, 50μm≤S≤100μm. The spiral angle of the microgroove structure 220 is α, 10°≤α≤15°.

[0032] The laser processing system 100 includes a first optical path assembly 110, a second optical path assembly 120, a beam combining assembly 130, and a processing head 140. The first optical path assembly 110 is used to output a femtosecond laser. The femtosecond laser has an extremely short pulse width, releasing energy in an ultra-short time, enabling precise material removal during processing. It can efficiently and accurately ablate the titanium alloy surface of the implant 200. When processing the dental implant 200, the femtosecond laser first acts on the surface of the implant 200 layer by layer and line by line, laying the foundation for subsequent processing, efficiently and accurately processing the macroscopic geometry of the microgroove structure 220 (such as U-shaped and V-shaped grooves), with an extremely small heat-affected zone.

[0033] The second optical path component 120 is used to output nanosecond laser light. Although nanosecond lasers have a longer pulse width than femtosecond lasers, they also play a unique role in processing. After the femtosecond laser completes the initial processing of a region or the entire microgroove structure 220, the second optical path component 120 begins to operate. It rapidly scans the surface of the groove processed by the femtosecond laser with a lower energy density and a higher repetition rate.

[0034] The beam combiner 130 is located on the transmission paths of the femtosecond and nanosecond lasers to achieve spatial coupling between them. In essence, the beam combiner 130 allows these two lasers, with their different characteristics, to overlap spatially and act on the same location of the implant 200 at different time intervals. By completing their respective tasks sequentially, they significantly improve processing efficiency and quality.

[0035] The processing head 140 is located on the light output path of the beam-combining assembly 130, and is used to apply femtosecond and nanosecond lasers to the dental implant 200 to be processed, respectively, to create the microgroove structure 220. The femtosecond and nanosecond lasers, coupled by the beam-combining assembly 130, act on the dental implant 200 to be processed. Through the precise guidance of the processing head 140, the laser can accurately irradiate specific areas of the implant 200, thereby creating the required microgroove structure 220.

[0036] When processing the dental implant 200 using the laser processing system 100, the femtosecond laser generated by the first optical path component 110 first ablates the titanium alloy surface of the implant 200 layer by layer and line by line. This process efficiently and precisely processes the macroscopic geometry (such as U-shaped or V-shaped grooves) of the microgroove structure 220 using a "cold processing" method, with a minimal heat-affected zone. After the femtosecond laser has processed a region or all of the microgroove structure 220, the first optical path component 110 is turned off, and the second optical path component 120 is turned on. The beam combining component 130 enables spatial coupling between the femtosecond laser and the nanosecond laser, allowing them to act on the same location of the implant 200 at different time intervals. The nanosecond laser generated by the second optical path component 120 rapidly scans the groove surface processed by the femtosecond laser with a lower power density and a higher repetition frequency, thereby processing the microgroove structure 220. The thermal effect of nanosecond lasers causes an extremely thin layer of material on the surface of the microgroove structure 220 to melt and solidify rapidly, thereby smoothing the microscopic undulations on the surface generated by femtosecond laser processing, resulting in a smoother, burr-free surface, while also introducing beneficial compressive stress.

[0037] A femtosecond laser is generated by the first optical path component 110, and a nanosecond laser is generated by the second optical path component 120. These femtosecond and nanosecond lasers act sequentially on the dental implant 200, producing a significant synergistic effect. Regarding processing precision, the "cold processing" characteristic of the femtosecond laser allows for precise shaping of the macroscopic geometry of the microgroove structure 220, providing a precise foundation for subsequent processing. The nanosecond laser, building upon femtosecond laser processing, further enhances processing precision through microscopic optimization of the surface of the microgroove structure 220.

[0038] The combination of these two technologies greatly ensures the dimensional, shape, and positional accuracy of the microgroove structure 220, meeting the stringent high-precision processing requirements of the dental implant 200. This not only improves the aesthetics of the implant 200 but, more importantly, reduces bacterial adhesion to its surface, lowering the risk of infection. In the oral environment, bacterial adhesion can easily lead to inflammation, affecting the stability and lifespan of the implant 200. The implant 200, processed using a combination of femtosecond and nanosecond lasers, has a smooth surface that effectively inhibits bacterial growth and reproduction, providing a strong guarantee for its long-term stable use. Optimization of stress state is another major advantage of the combined femtosecond and nanosecond laser processing. The nanosecond laser introduces beneficial compressive stress while smoothing the surface of the microgroove structure 220. This compressive stress effectively improves the fatigue resistance and mechanical strength of the implant 200. After implantation, the implant 200 is subjected to various external forces, such as chewing forces, and the surface compressive stress can offset some of these forces, thus extending the lifespan of the implant 200. Comparative experiments have shown that the implant 200 processed using the combined femtosecond and nanosecond lasers exhibits a significantly longer fatigue life in simulated oral environments compared to traditional processing methods, better meeting the needs of clinical use.

[0039] In this embodiment, the "cold" processing characteristic of femtosecond lasers avoids the introduction of mechanical stress, microcracks, and plastic deformation, significantly improving the fatigue performance and long-term reliability of the implant 200. The laser beam eliminates tool wear issues, enabling stable processing of extremely fine microgroove structures 220 with widths less than 50 μm and complex three-dimensional morphologies, overcoming the limitations of tool diameter. Nanosecond laser post-processing is completed in an integrated manner, replacing traditional chemical and mechanical post-processing steps such as sandblasting and acid etching, shortening the production process and making it more environmentally friendly. Composite laser processing can directly create composite bioactive surfaces with both micron-level grooves and nano-level textures, which is more conducive to cell adhesion and growth, enhancing the biological sealing effect. Laser processing is fast and has no consumable (tool) costs. Although the initial equipment investment may be high, the cost per unit is significantly reduced, making it particularly suitable for mass production. The "cold" processing characteristic of femtosecond lasers ensures that the microgroove structure 220 has a clear outline, no thermal damage, and no microcracks, with processing quality far exceeding that of CNC milling. Non-contact processing eliminates the need for any consumables and avoids the precision degradation caused by tool wear. It can easily process microgroove structures of any complex shape 220, including negative angle areas inaccessible to CNC tools, greatly liberating design constraints. It integrates the traditional three or more processes of "CNC milling + sandblasting + acid etching" into a single laser processing station, eliminating multiple clamping and chemical treatments, significantly shortening the production cycle, and reducing floor space and labor costs. Nanosecond laser modification directly prepares ideal micro-nano composite structures on the processed surface, with its ability to promote soft tissue adhesion and osseointegration superior to or equivalent to traditional sandblasting and acid etching surfaces, and achieving higher cleanliness. It avoids the use of strong acids and sandblasting abrasives, making the production process cleaner, more environmentally friendly, and safer.

[0040] In some implementations, see Figure 3The first optical path assembly 110 includes a femtosecond laser 111 and, sequentially arranged along the output direction of the femtosecond laser 111, a first beam expander 112, a first reflector 116, an acousto-optic modulator 113, a second reflector 114, and a beam shaper 115. The first beam expander 112 enlarges the laser diameter and corrects the divergence angle, ensuring that subsequent optical components can stably receive the beam. The first reflector 116 changes the beam transmission direction to adapt to the overall optical path layout of the system. The acousto-optic modulator 113 precisely controls the beam intensity and pulse frequency, enabling laser on / off switching or energy adjustment as needed to match the processing rhythm. The second reflector 114 further adjusts the beam direction, guiding it precisely into the beam shaper 115. The beam shaper 115 optimizes the beam energy distribution and beam shape, ultimately outputting a femtosecond laser that meets processing requirements to the beam combiner 130.

[0041] In this embodiment, a femtosecond laser 111 outputs a femtosecond laser beam, which is sequentially passed through a first beam expander 112, a first reflector 116, an acousto-optic modulator 113, a second reflector 114, and a beam shaper 115 before being output to a beam combiner 130. The synergistic effect of the beam expander and beam shaper 115 ensures uniform femtosecond laser energy and stable beam shape, providing a high-precision foundation for the fabrication of the microgroove structure 220. The acousto-optic modulator 113 can adjust laser pulse parameters (such as frequency and energy) in real time, adapting to the fabrication requirements of microgroove structures 220 with different depths and widths, and has a fast response speed (nanosecond level), facilitating timing coordination with subsequent nanosecond lasers. The reflector guides the beam directionally, reducing transmission loss and preventing optical path deviation, ensuring that the femtosecond laser always accurately acts on the fabrication area. The entire optical path design has no additional thermal interference, maximizing the advantages of the ultrashort femtosecond laser pulse, resulting in a small heat-affected zone and avoiding thermal damage to the titanium alloy implant 200 substrate during fabrication.

[0042] In some implementations, see Figure 3 The second optical path assembly 120 includes a nanosecond laser 121 and, sequentially arranged along the output direction of the nanosecond laser 121, a second beam expander 122, a third reflector 123, a fourth reflector 124, and an optoelectronic modulator 125. The second beam expander 122 adjusts the laser diameter and divergence angle to adapt the beam to the receiving aperture of subsequent optical components, ensuring stable energy transmission. Through two directional adjustments using the third reflector 123 and the fourth reflector 124, the beam is guided to align with the combining path of the femtosecond laser, ensuring that the two lasers can ultimately be spatially coupled. The optoelectronic modulator 125 is used to precisely control the pulse phase, intensity, or polarization state of the nanosecond laser, matching the surface treatment requirements after femtosecond laser processing as needed, and finally outputting the optimized nanosecond laser to the beam combining assembly 130.

[0043] In this embodiment, a nanosecond laser 121 outputs a nanosecond laser beam, which is sequentially transmitted through a second beam expander 122, a third reflector 123, a fourth reflector 124, and an optoelectronic modulator 125 to a beam combiner 130. Through the synergy of the beam expander and reflector, the size and transmission direction of the nanosecond laser are precisely matched with those of the femtosecond laser, providing a stable optical path for their spatial coupling and ensuring that the laser acts on the same processing position at different time intervals. The optoelectronic modulator 125 can rapidly adjust the energy density and pulse characteristics of the nanosecond laser, meeting the low-energy requirements for smoothing the surface of the microgroove structure 220 while achieving rapid scanning through a high repetition rate, thus improving processing efficiency. The optically optimized nanosecond laser can precisely act on the surface of the microgroove structure 220 processed by the femtosecond laser, achieving smoothing of micro-undulations through controllable thermal effects, while simultaneously introducing beneficial compressive stress to enhance the fatigue resistance of the implant 200 surface.

[0044] In some implementations, see Figure 3 The processing head 140 includes a galvanometer scanning assembly, a field lens, and a focusing lens. The galvanometer scanning assembly is located on the light-emitting side of the beam combining assembly 130, the field lens is located on the light-emitting side of the galvanometer scanning assembly, and the focusing lens is located on the light-emitting side of the field lens.

[0045] The femtosecond and nanosecond lasers output from the beam-combining assembly 130 are input into the processing head 140 in a time-segmented manner. First, they enter the galvanometer scanning assembly. Through the precise rotation of the X and Y axis galvanometers of the galvanometer scanning assembly, the propagation direction of the laser is controlled, and a scanning path is planned on the surface of the implant 200 according to the preset microgroove structure 220 trajectory. Then, the laser enters the field lens, which collimates and homogenizes the scanned beam, while simultaneously expanding the effective scanning range to ensure that the conical curved surface of the vertebral body at the transgingival segment 210 of the implant 200 is completely covered. Finally, the laser enters the focusing lens, which focuses the beam into an extremely small spot, precisely acting on the titanium alloy surface of the implant 200 to complete the shaping and surface optimization of the microgroove structure 220.

[0046] In this embodiment, the galvanometer scanning assembly of the processing head 140 has high positioning accuracy. Combined with the precise focusing of the focusing lens, it ensures that the groove width and depth errors of the microgroove structure 220 are small, meeting the stringent dimensional requirements of the transgingival segment 210 of the implant 200 for the microgroove structure 220. While the field lens expands the scanning range, the galvanometer can dynamically adjust the beam angle to conform to the conical curved surface of the implant 200 vertebra, avoiding processing blind spots caused by the curvature of the surface and ensuring that the microgroove structure 220 is uniform and consistent throughout the curved surface.

[0047] In some implementations, see Figure 3 It also includes a four-dimensional motion platform 150 for clamping and fixing the dental implant 200 to be processed.

[0048] In some examples, the four-dimensional motion platform 150 includes a base, a first drive assembly, a second drive assembly, a third drive assembly, a fourth drive assembly, and a clamp. The clamp is used to hold and fix the dental implant 200. The first drive assembly, the second drive assembly, the third drive assembly, and the fourth drive assembly are mounted on the base. The first drive assembly moves the clamp along the X-axis, the second drive assembly moves the clamp along the Y-axis, the third drive assembly moves the clamp along the Z-axis, and the fourth drive assembly rotates the clamp around the Z-axis.

[0049] The four-dimensional motion platform 150 securely clamps and fixes the dental implant 200 to be processed using a special clamp, ensuring that the implant 200 does not shift during processing. The four-dimensional motion platform 150 typically performs linear motion along the X, Y, and Z axes and rotational motion around the Z axis. The four-dimensional motion platform works in conjunction with the processing head 140 according to a preset program.

[0050] In this embodiment, the four-dimensional motion platform 150 precisely moves the area to be processed of the implant 200 into the focusing range of the processing head 140 via X-axis and Y-axis motion, and adjusts the distance between the implant 200 and the focusing lens via Z-axis motion to ensure that the focused spot always falls on the processing surface. Rotation around the Z-axis causes the implant 200 to rotate slowly, which, in conjunction with the scanning trajectory of the galvanometer of the processing head 140, ensures that all areas of the conical surface of the implant 200 are uniformly covered by the laser, achieving full-circumferential microgroove structure 220 processing. During different stages of femtosecond laser processing of the macroscopic shape of the microgroove structure 220 and nanosecond laser surface optimization, the four-dimensional motion platform 150 finely adjusts its position and angle in real time to ensure that the laser always accurately acts on the target processing area, avoiding processing errors caused by implant 200 posture deviations.

[0051] It is compatible with dental implants of different sizes 200, and the processing objects can be quickly switched by changing the clamps without adjusting the overall optical path, thus improving the versatility of the equipment. The precision of the four-dimensional motion platform 150 ensures batch processing, guaranteeing that the size and position of the microgroove structure 220 of each implant 200 are completely consistent, meeting the needs of industrial production.

[0052] In some implementations, see Figure 3 It also includes a control system. The first optical path assembly 110, the second optical path assembly 120, the processing head 140, and the four-dimensional motion platform 150 are connected to the control system. The control system is configured to: control the opening or closing of the first optical path assembly 110 and the second optical path assembly 120; control the processing head 140 to drive the femtosecond laser and the nanosecond laser to scan along a preset scanning path; and control the four-dimensional motion platform 150 to drive the dental implant 200 to be processed to move.

[0053] For example, the femtosecond laser 111 and acousto-optic modulator 113 of the first optical path assembly 110 are respectively connected to the control system, the nanosecond laser 121 and photoelectric modulator 125 of the second optical path assembly 120 are respectively connected to the control system, and the galvanometer scanning assembly of the processing head 140 is connected to the control system. The control system synchronously controls the output parameters (power, frequency, pulse width) of the femtosecond laser 111 and nanosecond laser 121, the switching and modulation of the acousto-optic modulator 113 and photoelectric modulator 125, the scanning path and speed of the galvanometer assembly, and the movement of the four-axis motion platform to achieve complex four-axis linkage processing.

[0054] In this embodiment, the control system can precisely control the start-stop sequence of the first and second optical path components 120, and simultaneously coordinate the scanning action of the processing head 140 and the movement of the four-dimensional motion platform 150, avoiding processing errors caused by delays or misalignments in the actions of each component, and ensuring a smooth and efficient processing flow. Through a preset program, the control system can solidify parameters such as laser energy, scanning speed, and platform movement accuracy. During batch processing, the processing conditions of the microgroove structure 220 of each implant 200 are completely consistent, avoiding parameter fluctuations caused by manual operation, and ensuring uniformity in indicators such as groove width, groove depth, and surface roughness of the microgroove structure 220, thus meeting the standardization requirements of industrial production of dental implants 200.

[0055] In some embodiments, the femtosecond laser 111 has a wavelength of 1030 nm and a pulse width of 300 fs. The implant 200 is made of titanium alloy, which has a high absorption rate for this wavelength of laser light, effectively converting laser energy into energy for material removal and avoiding energy waste. Simultaneously, this wavelength of laser light has a shallow penetration depth, acting only on the surface layer of the implant 200 and not causing deep thermal damage to the substrate. The 300 fs pulse width is much shorter than the energy transfer time of the electron-lattice in the titanium alloy, causing the laser energy to vaporize the surface material instantaneously with almost no heat conduction. The heat-affected zone is within a controllable range, enabling precise fabrication of macroscopic geometries such as U-shaped and V-shaped microgrooves 220, without a molten recast layer on the groove walls, thus avoiding increased difficulty in subsequent surface treatment.

[0056] In some embodiments, the nanosecond laser 121 has a wavelength of 1064 nm and a pulse width of 200 ns. The absorption rate of titanium alloy for 1064 nm wavelength laser is slightly lower than that for 1030 nm wavelength, reducing energy input per unit area and meeting the low-energy requirements of surface smoothing. The 200 ns pulse width is sufficient to allow the laser energy to melt an extremely thin layer of material on the surface of the microgroove structure 220 without causing overheating of the deeper material. The rapidly solidified molten layer can fill the micro-undulations generated by femtosecond processing, while the controllable thermal effect can introduce compressive stress on the surface, improving the fatigue resistance of the implant 200 and reducing the risk of cracking during long-term use.

[0057] The femtosecond laser 111 and the nanosecond laser 121 have similar wavelengths, which simplifies the optical design of the beam combining component 130 and reduces the difficulty of optical path debugging. Furthermore, the low thermal damage from the "cold processing" of the femtosecond laser and the surface optimization from the "controllable thermal effect" of the nanosecond laser complement each other, ensuring the dimensional accuracy of the microgroove structure 220 while improving surface quality and mechanical properties. This perfectly matches the comprehensive requirements of the dental implant 200 transgingival segment 210 and the microgroove structure 220 for "precision, biocompatibility, and durability".

[0058] In some embodiments, the beam combining assembly 130 includes a dichroic mirror. When the femtosecond laser operates alone, the dichroic mirror reflects the femtosecond laser to the processing head 140; when switching to nanosecond laser operation, the dichroic mirror reflects the nanosecond laser, achieving time-division transmission of the two lasers without adjusting the position of the dichroic mirror. This ensures that after the femtosecond laser completes processing of an area, the nanosecond laser can immediately follow up and optimize, improving overall processing efficiency.

[0059] Secondly, embodiments of this application also provide a laser processing method for dental implants, using a laser processing system 100 for dental implants according to any of the above-mentioned methods, comprising the following steps: S1, clamp and fix the implant 200 to be processed, and perform initial focusing and positioning of the laser processing system 100; S2, the processing head 140 of the laser processing system 100 outputs a femtosecond laser to act on the implant 200 to be processed; For example, the control system controls the coordinated movement of the four-dimensional motion platform 150 and the galvanometer system; the femtosecond laser 111 is activated, and the beam's energy and switching are precisely controlled by the acousto-optic modulator 113. Through high-speed scanning by the processing head 140, the titanium alloy surface is ablated layer by layer and line by line. This process efficiently and accurately processes the macroscopic geometry of the microgroove structure 220 using a "cold working" method, with an extremely small heat-affected zone.

[0060] S3, control the processing head 140 of the laser processing system 100 to output nanosecond laser output to the area processed by the femtosecond laser; For example, after a region is processed by a femtosecond laser, the control system switches the optical path to a nanosecond laser via an opto-modulator 125. The nanosecond laser rapidly scans the surface of the microgroove structure 220 with a lower energy density and a higher repetition rate. The thermal effect of the nanosecond laser causes an extremely thin layer of material on the surface of the microgroove structure 220 to melt instantly and solidify rapidly, thereby smoothing the microscopic undulations on the surface generated by femtosecond processing, obtaining a smoother, burr-free surface, and simultaneously introducing beneficial compressive stress.

[0061] S4. Repeat steps S2 and S3 until a complete microgroove structure 220 is fabricated on the implant 200.

[0062] The laser processing method for the dental implant 200 has all the beneficial effects of the laser processing system 100 for the dental implant 200 described above, which will not be repeated here.

[0063] In other embodiments, after the femtosecond laser in S2 acts on the implant 200 to process the macroscopic structure of the complete microgroove structure 220, the nanosecond laser output in S3 acts on the area processed by the femtosecond laser to process the complete microgroove structure 220.

[0064] In some embodiments, the laser processing system 100 also includes a control system, and the following steps are included before S1: S0, the three-dimensional model of the implant 200 to be processed is imported into the control system. The control system generates the laser scanning path of the processing head 140 and the motion trajectory of the four-dimensional motion platform 150 according to the preset processing parameters of the microgroove structure 220. The processing parameters of the microgroove structure 220 include at least one of width, depth, shape, spacing and helix angle.

[0065] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0066] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0067] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0068] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A laser processing system (100) of a dental implant for processing a microgroove structure (220) on a dental implant (200), characterized in that, The system comprises: a first optical path component (110) for outputting femtosecond laser; a second optical path component (120) for outputting nanosecond laser; a beam combination component (130) located on the transmission path of the femtosecond laser and the nanosecond laser to realize spatial coupling of the femtosecond laser and the nanosecond laser; a processing head (140) located on the light output path of the beam combination component (130) for applying the femtosecond laser and the nanosecond laser to the dental implant (200) to be processed to process the microgroove structure (220).

2. The laser machining system (100) of dental implants according to claim 1, characterized in that, The first optical path component (110) comprises a femtosecond laser (111) and a first expansion mirror (112), a first mirror (116), an acousto-optic modulator (113), a second mirror (114) and a spot shaper (115) arranged in sequence along the light output direction of the femtosecond laser (111), the femtosecond laser (111) is used for outputting the femtosecond laser, and the femtosecond laser is output to the beam combination component (130) in sequence through the first expansion mirror (112), the first mirror (116), the acousto-optic modulator (113), the second mirror (114) and the spot shaper (115).

3. The laser machining system (100) of dental implants according to claim 2, characterized in that, The second optical path component (120) comprises a nanosecond laser (121) and a second expansion mirror (122), a third mirror (123), a fourth mirror (124) and a photoelectric modulator (125) arranged in sequence along the light output direction of the nanosecond laser (121), the nanosecond laser (121) is used for outputting the nanosecond laser, and the nanosecond laser is output to the beam combination component (130) in sequence through the second expansion mirror (122), the third mirror (123), the fourth mirror (124) and the photoelectric modulator (125).

4. The laser machining system (100) of dental implants according to claim 3, characterized in that, The processing head (140) comprises a galvanometer scanning component, a field lens and a focusing lens, the galvanometer scanning component is located on the light output side of the beam combination component (130), the field lens is located on the light output side of the galvanometer scanning component, and the focusing lens is located on the light output side of the field lens.

5. The laser machining system (100) of dental implants according to claim 4, characterized in that, It also comprises a four-dimensional motion platform (150) for clamping and fixing the dental implant (200) to be processed.

6. The laser machining system (100) of dental implants according to claim 5, characterized in that It also comprises a control system, the first optical path component (110), the second optical path component (120), the processing head (140), the four-dimensional motion platform (150) and the control system are connected, and the control system is configured to: control the opening or closing of the first optical path component (110) and the second optical path component (120); control the processing head (140) to drive the femtosecond laser and the nanosecond laser to scan along a preset scanning path; control the four-dimensional motion platform (150) to drive the dental implant (200) to be processed to move.

7. The dental implant laser processing system (100) according to claim 6, wherein: the wavelength of the femtosecond laser (111) is 1030 nm, and the pulse width is 300 fs. And / or, the wavelength of the nanosecond laser (121) is 1064 nm, and the pulse width is 200 ns.

8. The laser machining system (100) of dental implants according to any one of claims 1 to 7, characterized in that The beam combining assembly (130) includes a dichroic mirror.

9. A laser processing method of a dental implant, using the laser processing system (100) of a dental implant according to any one of claims 1 to 8, characterized by, The method comprises the following steps: S1, clamping and fixing the implant (200) to be processed, and performing initial focusing and positioning of the laser processing system (100); S2, controlling the machining head (140) of the laser processing system (100) to output femtosecond laser to act on the implant (200) to be processed; S3, controlling the machining head (140) of the laser processing system (100) to output nanosecond laser to act on the region processed by the femtosecond laser; S4, repeating steps S2 and S3 until a complete microgroove structure (220) is processed on the implant (200).

10. The laser processing method of a dental implant according to claim 9, characterized in that, The laser processing system (100) further comprises a control system and a four-dimensional motion platform (150), and before S1, the following steps are further included: S0, importing a three-dimensional model of the implant (200) to be processed into the control system, and the control system generates a laser scanning path of the machining head (140) and a motion trajectory of the four-dimensional motion platform (150) according to preset processing parameters of the microgroove structure (220), wherein the processing parameters of the microgroove structure (220) include at least one of width, depth, shape, pitch and spiral angle.

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