Test socket

Abstract

The invention relates to a test socket. More specifically, the test socket includes: a body portion fixedly disposed under the test board; a cover portion disposed above the test plate and elastically supported by the body portion in a vertically movable manner; an adapter disposed above the test board between the body portion and the cover portion and configured to receive a test target device; and a latch member configured to move in an interactive relationship with a vertical movement of the cover portion, the latch member being rotatably connected to the body portion and the cover portion to press an upper portion of the test target device housed in the adapter toward the test plate, wherein at least a portion of the cover portion operates the latch member while passing through the test plate and moving vertically with respect to the body portion disposed below the test plate.

Description

[0001] This application is a divisional application of the patent application No. 201780081264.6, filed on November 2, 2017, entitled "Test Socket". TECHNICAL FIELD

[0002] The present application relates to a test socket, and more particularly, to a test socket having a simple structure and configured to improve test reliability. BACKGROUND

[0003] Generally, in a process of manufacturing semiconductor integrated circuit devices, for example, a plurality of integrated circuits are formed on a silicon wafer, and then a probe test is performed to detect basic electrical characteristics of each integrated circuit and find out defective integrated circuits. Next, the wafer is cut into semiconductor chips, and the semiconductor chips are placed in appropriate packages and sealed. In addition, an electrical test is performed to check electrical characteristics of each packaged semiconductor integrated circuit device and select semiconductor integrated circuit devices having potential defects.

[0004] An example of a test socket for such an electrical test is disclosed in Korean Patent No. 10-1245837.

[0005] In detail, referring to Figure 1 and Figure 2 , a related art socket for testing a semiconductor package includes a fixed body part 100, a cover part 200, an adapter 300, a latch 400, a contact pin 500, and an operation body part 600 to test a ball grid array (BGA) type semiconductor package having solder balls.

[0006] The fixed body part 100 has a rectangular frame structure in which components of the socket are assembled, and the fixed body part 100 fixedly supports the contact pin 500. The cover part 200, the adapter 300, and the operation body part 600 are assembled to an upper end portion of the fixed body part 100 in a vertically movable manner; and the latch 400 is rotatably coupled to an upper portion of the fixed body part 100.

[0007] In addition, the fixed body part 100 can have various shapes to fixedly support the contact pin 500. For example, as shown in Figure 2 , the fixed body part 100 can include a base 110 through which the contact pin 500 is inserted to be coupled with the base 110, a stopper 120 and a guide 130 assembled to a lower portion of the base 110 to fixedly support the contact pin 500.

[0008] The cover 200 has an open rectangular frame structure through which the semiconductor package can be assembled to the upper part of the fixed body 100 in such a way that the cover 200 can be elastically supported and vertically manipulated.

[0009] like Figure 2 As shown, first springs 201 are provided at the four corners between the cover portion 200 and the base portion 110, so that the cover portion 200 can be elastically supported above the fixed body portion 100 in a vertically movable manner. Here, the first springs 201 are fixed between the fixed body portion 100 and the cover portion 200.

[0010] The adapter 300 is elastically supported above the fixed body 100 in a vertically movable manner, and the semiconductor package 10A can be placed on the adapter 300.

[0011] A latch 400 is disposed above the fixed body portion 100 so that the upper portion of the semiconductor package 10A placed on the connector 300 can be pressed down by the latch 400, which interacts with the vertical movement of the cover portion 200.

[0012] like Figure 3 As shown, the lower end of the contact pin 500 is fixedly inserted into the fixing body 100, and the contact pin 500 makes electrical contact with the solder ball of the semiconductor package 10A depending on the vertical position of the operating body 600. The contact pin 500 is configured as a straight, thin line with overall elasticity.

[0013] The operating body 600 can move vertically between the fixed body 100 and the adapter 300, and a head hole 610 corresponding to the contact pin 500 in a one-to-one manner is formed in the operating body 600 so that the contact pin 500 can be inserted through the head hole 610 respectively.

[0014] This type of socket in the related technology is configured so that a semiconductor device can be connected to a test board via contact pins while the semiconductor device is placed on the adapter. Specifically, the mounting plane of the semiconductor device must be spaced a certain distance from the lower part of the test socket. Therefore, in the related technology, after the semiconductor device is placed on the adapter, contact pins 500 are arranged in the space between the semiconductor device and the test board, and then the test board and the semiconductor device are electrically connected to each other.

[0015] However, the test sockets of the related technology have the following problems.

[0016] First, when the semiconductor device directly contacts the contact pin, the ball terminal of the semiconductor device can be damaged. That is, the surface of the ball terminal of the semiconductor device can be damaged due to metal-to-metal contact.

[0017] Second, since the distance between the terminals of the semiconductor device becomes smaller due to a tendency toward a fine pitch, the contact pin that contacts the terminal of the semiconductor device needs to have a small distance from the terminal of the semiconductor device and have a thin thickness. In this case, since the contact pin has a small size, the yield of the contact pin production is low, and the production cost increases. In addition, the number of pin manufacturing processes and the probability of assembly error can also increase.

[0018] In addition, when the contact pin is plated, the plating process can not be easily performed, and the resistance of the contact pin can increase due to assembly deviation.

[0019] Third, since the contact pin is arranged between the test board and the semiconductor device spaced apart at a large distance from each other, the contact pin inevitably has high resistance, and thus the test reliability is low. SUMMARY

[0020] TECHNICAL PROBLEM

[0021] The present application has been made to solve the above problems, and more specifically, an object of the present application is to provide a test socket having a simple structure and improving test stability.

[0022] TECHNICAL SOLUTION

[0023] To achieve the above object, according to the present application, there is provided a test socket electrically connecting a test target device to a test board, the test socket including: a body portion fixedly disposed below the test board; a cover portion disposed above the test board and elastically supported by the body portion in a vertically movable manner; an adapter disposed above the test board between the body portion and the cover portion, configured to receive the test target device; and a latch member configured to move in an interactive relationship with the vertical movement of the cover portion, the latch member being rotatably connected to the body portion and the cover portion to press an upper portion of the test target device accommodated in the adapter toward the test board, wherein at least a portion of the cover portion operates the latch member while being vertically moved through the test board and with respect to the body portion disposed below the test board.

[0024] In the test socket, the cover portion can include a hinge coupling portion connected to the latch member, and the hinge coupling portion can be vertically movable through the test board.

[0025] In the test socket, the latch member can include a latch arm configured to press the test target device, an intermediate arm having an end portion connected to an intermediate portion of the latch arm with a link, and another end portion rotatably coupled to the body portion, and a first hinge pin provided on a rear end of the latch arm and rotatably coupled to the cover portion.

[0026] In the test socket, the cover portion can include a separation preventing portion configured to be snapped on the body portion to prevent the cover portion from being separated from the body portion, wherein the separation preventing portion can be vertically movable together with the cover portion while passing through a penetration hole formed in the test board, and a lower end of the separation preventing portion can be coupled to the body portion disposed below the test board.

[0027] In the test socket, an anisotropic conductive sheet in which an elastic insulating material and conductive particles are mixed can be provided on the test board, and the anisotropic conductive sheet can be disposed under the adapter.

[0028] In the test socket, the anisotropic conductive sheet can include a plurality of conductive sections each formed by arranging a plurality of conductive particles in the elastic insulating material in a thickness direction of the anisotropic conductive sheet, and an insulating section supporting each of the conductive sections spaced apart from each other in a surface direction of the anisotropic conductive sheet and insulating the conductive sections adjacent to each other.

[0029] In the test socket, the elastic insulating material can be silicone rubber.

[0030] To achieve the above object, according to the present application, there is provided a test socket electrically connecting a test target device to a test board, the test socket including a body portion fixed to a lower portion of the test board, a cover portion disposed above the test board and elastically supported by the body portion in a vertically movable manner, and a latch member configured to move in an interactive relationship with the vertical movement of the cover portion, the latch member connected to the body portion and the cover portion to press the test target device disposed above the test board toward the test board, wherein at least a portion of the cover portion operates the latch member while passing through the test board.

[0031] In the test socket, an adapter can be provided above the test board between the cover portion and the test board to accommodate the test target device in the adapter.

[0032] In the test socket, the adapter can be fixed to the test board.

[0033] In the test socket, an anisotropic conductive sheet in which an elastic insulating material and conductive particles are mixed can be provided above the test board.

[0034] In the test socket, the anisotropic conductive sheet in which the elastic insulating material and the conductive particles are mixed can be provided between the test board and the adapter.

[0035] In the test socket, the anisotropic conductive sheet can include a conductive section in which the conductive particles are arranged in the elastic insulating material in a thickness direction of the anisotropic conductive sheet, in which an upper surface of the conductive section can contact a terminal of the test target device, and a lower surface of the conductive section can contact a contact pad of the test board.

[0036] Inventive Effects

[0037] According to the test socket of the present application, since a distance between the test board and the test target device is short, various test structures can be used, and various objects can be tested. In particular, electrical connection can be made without using a contact pin of the related art, and thus electrical testing can be performed more reliably.

[0038] In addition, the test socket of the present application has an effect of increasing a pressing force in proportion to a lever action. That is, a greater pressing force than that obtainable by the structure of the related art can be obtained while minimizing a latch stroke.

[0039] In addition, according to the present application, a distance between the test board and the test target device can be shortened, thereby enabling low resistance measurement and improving test reliability.

[0040] In addition, electrical testing of a device having a fine pitch can be easily performed using the present application. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 FIG. 1 is a perspective view illustrating a test socket of the related art.

[0042] Figure 2 FIG. 2 is an exploded perspective view illustrating the test socket of the related art. Figure 1 FIG. 3 is an exploded perspective view illustrating the test socket of the related art.

[0043] Figure 3 FIG. 4 is a partial cross-sectional view illustrating the test socket of the related art. Figure 1

[0044] Figure 4 FIG. 5 is an exploded perspective view illustrating a test socket according to an embodiment of the present application.

[0045] Figure 5 ​is a view showing Figure 4 an assembled perspective view of the test socket shown.

[0046] Figure 6 is a view showing Figure 4 a plan view of the test socket shown.

[0047] Figure 7 is a view showing Figure 4 a side view of the test socket shown.

[0048] Figure 8 is a sectional view taken along Figure 6 the line VIII-VIII shown.

[0049] Figure 9 is a view showing Figure 4 operation of the test socket shown.

[0050] Figure 10 is a sectional view taken along Figure 9 the line X-X shown. DETAILED DESCRIPTION

[0051] Hereinafter, a test socket according to an embodiment of the present application will be explained in detail with reference to the accompanying drawings.

[0052] According to the present application, a test socket 1 includes a body portion 10, a cover portion 20, an adapter 30, a latch member 40, and an anisotropic conductive sheet 50. The test socket 1 is used to electrically connect a test target device 70 to a test board 60, particularly to electrically connect terminals of the test target device 70 to pads of the test board 60 in a one-to-one manner.

[0053] The body portion 10 is placed below the test board 60, which has pads at positions corresponding to the terminals of the test target device 70. The body portion 10 has a rectangular frame structure in which a pair of mutually facing first side walls 11 and a pair of mutually facing second side walls 12 are connected at right angles to each other. The corner portions of the body portion 10 are fixedly attached to the test board 60 using members such as bolts (not shown in the drawings).

[0054] Hinge connection portions 111 are provided on the pair of mutually facing first side walls 11, and the other end portions of the intermediate arms 42, which link the intermediate portions of the latch arms 41, are connected to the hinge connection portions 111. The hinge connection portions 111 are holes into which second hinge pins 421 provided on the other end portions of the intermediate arms 42 are inserted, and a pair of the hinge connection portions 111 are provided on each of the first side walls 11 so that the hinge connection portions 111 can face each other.

[0055] In the main body 10, a hook-shaped jaw 121 is provided on the second side wall 12, which is connected at a right angle to the first side wall 11, so that the anti-separation portion 221 of the cover 20 can engage and lock onto the hook-shaped jaw 121. Since the anti-separation portion 221 of the cover 20 is configured to engage and lock onto the hook-shaped jaw 121 when the cover 20 moves vertically, the cover 20 can remain in place without separating from the main body 10.

[0056] The cover 20 is positioned above the test plate 60 and can move vertically while being elastically supported by the body 10. Springs 23 are arranged between the cover 20 and the body 10 so that the cover 20 can be elastically biased in a direction away from the body 10.

[0057] Overall, the cover 20 has a rectangular frame structure formed by a pair of opposing first cover sidewalls 21 and a pair of second cover sidewalls 22 connected at right angles to the first cover sidewalls 21. The first cover sidewalls 21 of the cover 20 include a hinge coupling portion 211 extending downward to connect with the latch member 40. The hinge coupling portion 211 is configured to move vertically while passing through the test plate 60. A first hinge pin 43 disposed on the rear end of the latch arm 41 engages and snaps onto the lower portion of the hinge coupling portion 211, such that the latch arm 41 can rotate interactively with the vertical movement of the cover 20.

[0058] An anti-separation portion 221, configured to snap onto the body portion 10 to prevent the cover portion 20 from separating from the body portion 10, is provided on the second cover sidewall 22. The anti-separation portion 221 is configured such that it moves together with the cover portion 20 while passing through the through hole 61 formed in the test plate 60, and the lower end of the anti-separation portion 221 is coupled to the body portion 10, which is positioned below the test plate 60. Specifically, the anti-separation portion 221 is configured to snap onto the hook-shaped jaws 121 of the body portion 10.

[0059] The connector 30 has an approximately rectangular frame structure including a central opening 31 to receive the test target device 70. The connector 30 is disposed above the test plate 60 between the body portion 10 and the cover portion 20. The connector 30 is fixed to the test plate 60 from the upper side. An anisotropic conductive sheet 50 is placed on the upper surface of the test plate 60 below the connector 30, and the test target device 70, housed in the central area of ​​the connector 30, can contact the anisotropic conductive sheet 50.

[0060] The latching member 40 includes a latching arm 41, an intermediate arm 42, and a first hinge pin 43.

[0061] The latch arm 41 is used to press the test target device 70. Some sides of the latch arm 41 are configured to press the test target device 70, and the other side of the latch arm 41 is rotatably coupled to the cover 20 with the first hinge pin 43 inserted into the other side of the latch arm 41.

[0062] Some ends of the intermediate arm 42 are connected to the middle portion of the latch arm 41 by connecting rods, and the other ends of the intermediate arm 42 are rotatably coupled to the body portion 10. The other ends of the intermediate arm 42 are rotatably coupled to the hinge connection portion 111 of the body portion 10.

[0063] The first hinge pin 43 is disposed on the rear end of the latch arm 41 and rotatably coupled to the cover portion 20. When the cover portion 20 moves vertically, the latch arm 41 connected to the first hinge pin 43 can interact with the cover portion 20.

[0064] The anisotropic conductive sheet 50 includes: a plurality of conductive segments 51, each formed by arranging a plurality of conductive particles 511 in an elastic insulating material in the thickness direction of the anisotropic conductive sheet 50; and insulating segments 52 that support each of the spaced-apart conductive segments 51 in the surface direction of the anisotropic conductive sheet 50 and insulate adjacent conductive segments 51 from each other. The anisotropic conductive sheet 50 is placed between the connector 30 and the test plate 60. The upper portion of the conductive segment 51 is placed in the central opening 31 of the connector 30. The upper end of the conductive segment 51 can contact the terminal of the test target device 70, and the lower end of the conductive segment 51 contacts the pad of the test plate 60.

[0065] The conductive sections 51 of the anisotropic conductive sheet 50 are formed by densely arranging magnetic conductive particles 511 in an elastic insulating material and can extend in the thickness direction, and the insulating sections 52 insulate each conductive section 51 from each other.

[0066] Preferably, the elastic insulating material of the conductive section 51 may comprise an insulating polymer material having a crosslinked structure. Various curable polymer forming materials can be used to obtain said polymer material. Specific examples of the polymeric substances include: conjugated diene rubber, such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber, and their hydrogenated products; block copolymer rubber, such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer rubber, and their hydrogenated products; chloroprene rubber; urethane rubber; polyester rubber; epichlorohydrin rubber; silicone rubber; ethylene-propylene copolymer rubber; and ethylene-propylene-diene copolymer rubber. rubber).

[0067] If the anisotropic conductive sheet 50 requires weather resistance, it may be preferable to use any of the listed materials other than conjugated diene rubber. Specifically, silicone rubber may be superior in terms of formability and electrical properties.

[0068] Preferably, silicone rubber can be obtained from liquid silicone rubber through crosslinking or condensation. Liquid silicone rubber can be obtained at a ratio of 10... -1 The shear rate measured in seconds is preferably no higher than 10. 5The viscosity of a liquid silicone rubber is measured in poise. Liquid silicone rubber can be any of the following: condensation-curing liquid silicone rubber, addition-curing liquid silicone rubber, and liquid silicone rubber having vinyl or hydroxyl groups. Specific examples of liquid silicone rubber may include dimethyl silicone raw rubber, methylvinyl silicone raw rubber, and methyl phenyl vinylsilicon raw rubber.

[0069] Preferably, the conductive particles 511 contained in the elastic insulating material can be formed of a rigid material so that the conductive particles 511 will not deform when the conductive section 51 is pressed. Alternatively, the conductive particles 511 can be formed of a magnetic material to facilitate orientation. Specific examples of the conductive particles 511 may include: magnetic metal (e.g., iron, cobalt, or nickel) particles; metal alloy particles; particles containing any of the metals; particles formed by preparing such particles as core particles and coating the core particles with a highly conductive metal (e.g., gold, silver, palladium, or rhodium); and particles formed by preparing non-magnetic metal particles, inorganic material particles (e.g., glass beads), or polymer particles as core particles and coating the core particles with a conductive magnetic metal (e.g., nickel or cobalt).

[0070] Among the listed examples, particles containing nickel particles as core particles and coated with highly conductive gold are preferred.

[0071] There are no specific limitations on the method of coating the core particles with a conductive metal. However, methods such as chemical plating, electroplating, sputtering, or deposition can be used. When using particles prepared by coating the core particles with a conductive metal as conductive particles 511, the coating ratio of the conductive metal to the particle surface (the ratio of the area of ​​the conductive metal coating to the surface area of ​​the core particles) can be adjusted to preferably 40% or greater, more preferably 45% or greater, and particularly more preferably 47% to 95% to obtain high conductivity.

[0072] Furthermore, the amount of conductive metal coated is preferably 0.5% to 50% by weight of the core particles, more preferably 2% to 30% by weight of the core particles, particularly preferably 3% to 25% by weight of the core particles, and even more preferably 4% to 20% by weight of the core particles. If the conductive metal used as the coating material is gold, the amount of conductive metal coated is preferably 0.5% to 30% by weight of the core particles, more preferably 2% to 20% by weight of the core particles, and particularly preferably 3% to 15% by weight of the core particles.

[0073] In addition, the diameter of the conductive particles 511 is preferably from 1 micrometer to 100 micrometers, more preferably from 2 micrometers to 50 micrometers, especially more preferably from 3 micrometers to 30 micrometers, and even more preferably from 4 micrometers to 20 micrometers.

[0074] The insulating section 52 is formed of the same material as the elastic insulating material used to form the conductive section 51. Specifically, the insulating section 52 is preferably formed of silicone rubber. However, the insulating section 52 is not limited to this. For example, the insulating section 52 may be formed of a different material than the material used to form the conductive section 51. For example, the insulating section 52 may be formed of a material that is harder or softer than the elastic insulating material used to form the conductive section 51.

[0075] The test socket 1 of the present invention has the following operational effects.

[0076] First, when the cover 20 is pressed down during the test, the rear end of the latch arm 41 connected to the cover 20 moves downward. Next, the pairs of intermediate arms 42 move away from each other, and the front end portion of the latch arm 41 rotates upward. Therefore, as... Figure 9 As shown, the latch arm 41 is kept in the open state. That is, as the latch arm 41 rotates, the central opening 31 of the connector 30 is opened so that the test target device 70 can be accommodated in the connector 30.

[0077] Next, after lowering the test target device 70 and placing it in the connector 30, the cover 20 is moved upward so that the latch arm 41 can press against the upper surface of the test target device 70, as shown. Figure 5 As shown. Then, the self-test board 60 applies an electrical signal to the test target device 70 via the conductive section 51 of the anisotropic conductive sheet 50 to perform an electrical test.

[0078] After the test, in order to remove the test target device 70 from the test socket 1, the cover 20 is pressed down to operate the latching member 40 and release the test target device 70 pressed by the latching member 40.

[0079] In the test socket of the present invention, the mounting plane for placing the test target device is positioned close to the test plate without reducing the height of the mounting plane (without reducing the distance from the lower part of the test socket to the mounting plane). Therefore, contact pins of related technologies can be eliminated, and thus tests can be performed more reliably.

[0080] Specifically, due to the short distance between the test board and the target device, various test structures can be used, and a wide variety of objects can be tested. Furthermore, electrical connections can be made without the need for contact pins using related technologies, thus enabling more reliable electrical testing.

[0081] Furthermore, the test socket of the present invention has the effect of increasing the pressing force proportionally to the lever action. That is, a pressing force greater than that obtained by structures through related technologies can be obtained with a minimum latching stroke.

[0082] Furthermore, according to the present invention, the distance between the test board and the test target device can be shortened, thereby enabling low resistance measurement and improving test reliability.

[0083] Furthermore, this invention can be readily used when performing elasticity tests on devices with precise fine pitch.

[0084] Furthermore, because the test socket of the present invention is configured to shorten the distance between the test plate and the test target device, anisotropic conductive sheets can be used instead of contact pins of related technologies, and therefore the terminals of the test target device are not damaged. That is, in the structure of related technologies, it is difficult to use anisotropic conductive sheets formed of soft silicone rubber material because it is difficult to increase the thickness of the anisotropic conductive sheet to a certain value or greater. However, according to the present invention, because the distance between the test plate and the test target device is short, anisotropic conductive sheets can be used for soft contacts, and therefore the terminals of the test target device are minimized.

[0085] The test socket of the present invention can be modified in a non-limiting manner.

[0086] In the above embodiment, the anisotropic conductive sheet is placed under the connector. However, this is a non-limiting example. For instance, a test socket may be provided in which only the connector is used without the anisotropic conductive sheet.

[0087] Furthermore, in the above embodiment, the adapter is positioned between the test plate and the cover. However, this is a non-limiting example. For instance, a test socket that does not include the adapter may be provided.

[0088] Although the test socket of the present invention has been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments and drawings, and various modifications and variations can be made by those skilled in the art without departing from the scope of the present invention.

Claims

1. A test socket for electrically connecting a test target device to a test board, the test socket comprising: The main body is fixedly positioned below the test plate; The cover is positioned above the test plate and is elastically supported by the body in a manner that allows it to move vertically. A connector is disposed above the test plate between the body and the cover, and is configured to receive the test target device; as well as A latching member, configured to move in interaction with the vertical movement of the cover, is rotatably connected to the body and the cover to press the upper portion of the test target device housed in the connector toward the test plate. The latching member includes a latching arm configured to press the test target device; The intermediate arm has an end connected to the middle portion of the latch arm by a connecting rod, and another end rotatably coupled to the body portion; and a first hinge pin disposed on the rear end of the latch arm and rotatably coupled to the cover portion. The cover includes a hinge coupling portion connected to the latch member, the hinge coupling portion passing through the test plate, and moving vertically to operate the latch arm when the cover moves up and down relative to the body.

2. The test socket of claim 1, wherein the cover includes an anti-separation portion configured to snap onto the body portion to prevent the cover portion from separating from the body portion, wherein the anti-separation portion is capable of vertically moving together with the cover portion while passing through a through hole formed in the test plate, and the lower end of the anti-separation portion is coupled to the body portion placed below the test plate.

3. The test socket according to claim 1, wherein the connector is provided with an anisotropic conductive sheet disposed on the test plate, wherein the anisotropic conductive sheet is mixed with an elastic insulating material and conductive particles.

4. The test socket according to claim 3, wherein the anisotropic conductive sheet comprises: Multiple conductive sections are each formed by arranging multiple conductive particles in the elastic insulating material in the thickness direction of the anisotropic conductive sheet; And insulating sections, each of the conductive sections spaced apart from each other in the surface direction of the anisotropic conductive sheet, and insulating adjacent conductive sections.

5. The test socket according to claim 4, wherein the elastic insulating material is silicone rubber.

6. A test socket for electrically connecting a test target device to a test board, the test socket comprising: The main body is fixed to the lower part of the test plate; The cover is positioned above the test plate and is elastically supported by the body in a manner that allows it to move vertically. as well as A latching member, configured to move in interaction with the vertical movement of the cover, is connected to the body and the cover to press the test target device, placed above the test plate, toward the test plate. The latching member includes a latching arm configured to press the test target device; The intermediate arm has an end connected to the middle portion of the latch arm by a connecting rod, and another end rotatably coupled to the body portion; and a first hinge pin disposed on the rear end of the latch arm and rotatably coupled to the cover portion. The cover includes a hinge coupling portion connected to the latch member, the hinge coupling portion passing through the test plate, and moving vertically to operate the latch arm when the cover moves up and down relative to the body.

7. The test socket according to claim 6, wherein a connector is provided above the test board between the cover and the test board to accommodate the test target device in the connector.

8. The test socket of claim 7, wherein the adapter is fixed to the test board.

9. The test socket according to claim 6, wherein an anisotropic conductive sheet is provided on the test board, and an elastic insulating material and conductive particles are mixed in the anisotropic conductive sheet.

10. The test socket according to claim 9, wherein the anisotropic conductive sheet includes a conductive section, wherein the conductive particles are arranged in the elastic insulating material in the thickness direction of the anisotropic conductive sheet, wherein the upper surface of the conductive section can contact the terminal of the test target device, and the lower surface of the conductive section can contact the pad of the test board.

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