Efficient micro-channel heat dissipation cold plate

Abstract

The invention discloses an efficient micro-channel heat dissipation cold plate, and relates to the technical field of heat dissipation plates, the efficient micro-channel heat dissipation cold plate comprises a heat conduction plate, the bottom of the heat conduction plate is provided with a heat conduction mechanism, and the inner side of a side end shell is provided with an alternate shunting mechanism; the heat conduction mechanism comprises a frame rod, the frame rod is fixedly connected to the middle of the bottom face of a heat conduction plate, the outer surface of the frame rod is fixedly connected with a contact base, the bottom face of the heat conduction plate is slidably connected with a contact sliding block, the bottom face of the contact sliding block is fixedly connected with a heat source guide plate, and the edge of the bottom face of the heat conduction plate is provided with a fixing block. The side face of the fixed block is fixedly connected with an alloy wire, the side face of the touch sliding block is fixedly connected with a guiding folding strip, the end, away from the touch sliding block, of the guiding folding strip is fixedly connected with a column rod, and the end, away from the guiding folding strip, of the column rod is fixedly connected with a long connecting rod. And efficiency reduction caused by continuous work of a single heat dissipation channel is avoided.

Description

Technical Field

[0001] This invention relates to the field of heat sink technology, specifically to a high-efficiency microchannel heat sink. Background Technology

[0002] As the power density of electronic components continues to increase, traditional heat dissipation methods are no longer sufficient to meet the demand for efficient heat dissipation. Although microchannel heat dissipation technology achieves efficient heat exchange by the flow of liquid in microchannels, it is prone to channel blockage and reduced heat transfer efficiency due to the adhesion of impurities during long-term operation. In addition, a single heat dissipation path is prone to thermal saturation. Furthermore, fixed air-cooling systems cannot simultaneously achieve localized enhanced heat dissipation and overall temperature balance within the equipment. Therefore, there is an urgent need for an integrated heat dissipation solution with self-cleaning capabilities, multi-channel alternating heat dissipation, and adaptive air-cooling coordination to improve the continuity, reliability, and overall thermal management efficiency of the heat dissipation system.

[0003] Patent CN116884933A discloses an interlaced microchannel heat dissipation structure and a chip heat dissipation system. The heat dissipation structure includes an upper cover plate and a microchannel cold plate fixedly connected to the upper cover plate. A cooling cavity is formed between the upper cover plate and the microchannel cold plate. The upper cover plate and / or the microchannel cold plate are provided with a fluid inlet and a fluid outlet that communicate with the cooling cavity. The surface of the microchannel cold plate located in the cooling cavity is provided with a number of interlaced heat dissipation protrusions. This invention improves the existing structure to solve the problems of excessive single-chip temperature and uneven temperature of multi-chip heat sources. However, this patent also has the problem of efficiency reduction caused by continuous operation of a single heat dissipation channel. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a high-efficiency microchannel heat dissipation cold plate, which solves the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solution: a high-efficiency microchannel heat dissipation cold plate, including a heat-conducting plate, a heat-conducting mechanism is provided at the bottom of the heat-conducting plate, and an alternating flow-diverting mechanism is provided on the inner side of the side end shell; The heat-conducting mechanism includes a frame rod, which is fixedly connected to the middle of the bottom surface of the heat-conducting plate. A contact base is fixedly connected to the outer surface of the frame rod. A touch block is slidably connected to the bottom surface of the heat-conducting plate. A heat source guide plate is fixedly connected to the bottom surface of the touch block. A fixed block is provided at the edge of the bottom surface of the heat-conducting plate. An alloy wire is fixedly connected to the side of the fixed block. A guide strip is fixedly connected to the side of the touch block. A column rod is fixedly connected to the end of the guide strip away from the touch block. A long connecting rod is fixedly connected to the end of the column rod away from the guide strip. The alternating flow splitting mechanism includes two adjusting blocks, which are located on the left and right sides of the side end shell, respectively. Each adjusting block has an input port or an output port fixedly connected to its side. The end of the input port or output port away from the adjusting block is fixedly connected to a connecting pipe. A grooved plate is fixedly connected to the center of the top surface of the heat-conducting plate. A water tank is fixedly connected to the upper surface of the grooved plate. A microfluidic plate is provided on the inner side of the water tank.

[0006] According to the above technical solution, a side shell is fixedly connected to the top edge of the heat-conducting plate, a cover plate is fixedly connected to the top surface of the side shell, a cleaning mechanism is provided inside the alternating flow diversion mechanism, and a cooling mechanism is provided on the top of the cover plate.

[0007] According to the above technical solution, multiple short push rods and long push rods are fixedly connected to the side of the long connecting rod. An adjusting rod is slidably connected inside the adjusting block. The input port includes a one-way structure, and the one-way structure includes a rod frame. The rod frame is fixedly connected inside the input port. A stopper rod is slidably connected at the center of the rod frame. A rubber stopper is fixedly connected to one end of the stopper rod. A protrusion is fixedly connected to the side of the rubber stopper away from the stopper rod. A flow-limiting ring is provided on the side of the rubber stopper.

[0008] According to the above technical solution, the side of the adjusting rod is provided with a groove, and the groove is adapted to the shape of the protrusion. A return spring is provided on the outside of the plug rod, and the two ends of the return spring are fixedly connected to the rod frame and the rubber plug, respectively. The flow limiting ring is fixedly connected to the inner wall of the input port.

[0009] According to the above technical solution, the contact base is provided in two locations, the contact slider is provided in two locations, and both contact sliders are slidably connected to each other. The fixed blocks are provided in six locations, with three blocks per group slidably connected to the heat source guide plates on the front and rear sides respectively. The guide strip is slidably connected to the heat-conducting plate. The water tank is provided in two locations, with the two water tanks respectively placed on the front and rear sides of the top of the heat-conducting plate. The microfluidic plates are provided in multiple locations, and all microfluidic plates are fixedly connected to the grooved plate. The gap between the contact base and the bottom surface of the electronic component's heat source is filled by applying silicone grease, and the electronic component is secured with screws. The contact base is fixed in place. In the initial state, the contact base first contacts the heat source guide plate on one side. The heat generated on the bottom surface of the contact base is transferred to the slider through the front heat source guide plate, and then transferred upwards through the slider to the contact groove plate. When liquid is input into the water tank on the connected side through the input port on one side, the liquid drives the liquid in the water tank to flow through the microfluidic plate. The heat on the groove plate is conducted to the microfluidic plate and carried away by the flowing liquid. Through the cooperation of the microfluidic plate and the groove plate, the heat dissipation area is increased and the heat dissipation efficiency is improved. When the temperature of the heat source guide plate in contact with the contact base rises to 40 to 50 degrees Celsius, the heat source guide plate will simultaneously reduce the heat transfer. The heat is transferred to the connected alloy wire. The nickel-titanium alloy wire is a shape-memory metal. When the heat transferred to the alloy wire reaches the range of 40 to 50 degrees Celsius, the alloy wire will fully contract and pull the heat source guide plate away from the contact base. The heat source guide plate slides against the bottom surface of the grooved plate via a slider, driving the connected guide strip to push the column rod and long connecting rod to move. The movement of the long connecting rod pulls the adjusting rod. At this time, the adjusting rod slides along the adjusting block and pushes the long connecting rod connected to the other side closer to the edge of the side end shell. This long connecting rod, through the connected column rod and guide strip, drives the rear heat source guide plate to slide and touch the contact base. Simultaneously, the sliding of the adjusting rod inside the adjusting block will... The groove pushes the protrusion inside the groove to move. After the protrusion is under force, it pushes the rubber stopper, causing the stopper rod to slide along the rod frame and squeeze the return spring. The rubber stopper approaches the flow-limiting ring and blocks the input port to prevent liquid flow. As the adjusting rod slides, the groove on the adjusting rod aligns with the input port on the other side. When the groove on the adjusting rod is aligned with the protrusion, the rubber stopper will push the protrusion to fit into the groove under the action of the return spring, so that the rubber stopper moves away from the flow-limiting ring and connects the input port and the water tank. The operation of the front and rear water tanks is switched by the sliding of the adjusting block and adjusting rod. After the switching, the liquid in the water tank that stops working is in a cooling and heat dissipation state. The heat dissipation effect is improved by the alternating operation of the two water tanks.

[0010] According to the above technical solution, the cleaning mechanism includes a water channel frame, with inner channels opened on both the front and rear sides of the water channel frame. Multiple rotating shafts are arranged inside the water channel frame, and spring arc plates are rotatably connected to the outer side of the rotating shafts. A damping wheel is rotatably connected to the middle of the spring arc plates.

[0011] According to the above technical solution, the damping wheel is rotatably connected to the rotating shaft, and a water channel frame is provided on the side of each microfluidic plate. The water channel frame is slidably connected to the spring arc plate. When the long connecting rod moves, the long connecting rod drives the connected short push rod and long push rod to pass through the side wall of the water tank and slide with the water tank to push the water channel frame on the inner side of multiple microfluidic plates to move. The movement of the water channel frame drives the edges of the connected spring arc plates to fit together. At the same time, the spring arc plates face different directions and are staggered vertically, which can thoroughly clean the deposits on the side of the microfluidic plate and prevent floating objects in the liquid from adhering to the side of the microfluidic plate and affecting the heat conduction efficiency of the microfluidic plate. The staggered spring arc plates ensure smooth liquid flow in the inner channels on both sides of the water channel frame. In addition, when the spring arc plates slide against the side of the microfluidic plate through the damping wheel, the resistance encountered during sliding can be reduced, so that the elastic force of the spring arc plates is applied to the side of the microfluidic plate on the cleaning side.

[0012] According to the above technical solution, the cooling mechanism includes multiple hinge rods, with each pair of hinge rods hinged to the left and right sides of a long connecting rod. A flip plate is hinged to the end of each hinge rod away from the long connecting rod. A flip seat is rotatably connected to the bottom of the flip plate. Multiple fans are installed on the side of the flip plate, and air slots are formed on the side of the flip plate. Heat dissipation fins are fixedly connected between two flip seats. Two cavity ends are fixedly connected to the bottom surface of the heat dissipation fins. Multiple side slots are formed on the side of the side shell, and multiple top slots are formed on the top surface of the cover plate.

[0013] According to the above technical solution, the flipping seat is fixedly connected to the top surface of the cover plate. The flipping seats are symmetrically distributed about the left center line of the cover plate. The air duct corresponds to the position of the fan. The top duct is connected to the side duct. When the long connecting rod on one side moves closer to the side of the side shell, the long connecting rod drives the connected hinge rod to push the flipping plate upward around the flipping seat connection to flip. The flipping causes the fan to gradually approach the heat dissipation fins and come into contact with them. When the working fan comes into contact with the heat dissipation fins, it drives the air from below the flipping plate through the air duct and blows over the heat dissipation fins. The heat dissipation fins absorb the heat in the cavity end and dissipate heat outward through the part of the heat dissipation fins that contacts the airflow, so that the heat of the liquid inside the cavity end can be quickly dissipated. When the long connecting rod moves away from the side shell, the flipping plate flips to be parallel to the top surface of the cover plate and draws air in from the side duct, through the inside of the side shell, and out from the top duct, assisting in the dissipation of heat inside the side shell.

[0014] This invention provides a high-efficiency microchannel heat dissipation plate. It has the following beneficial effects: This invention, by incorporating a heat-conducting mechanism and an alternating flow-diverting mechanism, utilizes the thermal memory characteristics of alloy wires to achieve automatic switching of the heat source guide plate. The working state of the water tank is controlled synchronously through the linkage of an adjusting rod and an adjusting block. This allows the heat dissipation system to automatically switch to the rear heat source guide plate for heat dissipation when the temperature of the front heat source guide plate is too high. Simultaneously, it blocks the liquid flow in the original water tank and initiates the cooling cycle of the other water tank. By alternating the use of two sets of heat dissipation modules, it avoids the efficiency decrease caused by continuous operation of a single heat dissipation channel, ensuring that each heat dissipation component is adequately cooled during working intervals. This maintains the stability and continuity of the overall heat dissipation performance, improving the heat dissipation reliability of electronic components under long-term high-load operation. This invention incorporates a heat-conducting mechanism and a cleaning mechanism. Through the movement of a long connecting rod, a short push rod and a long push rod are linked together, driving the water channel frame and spring arc plates to slide on the side of the microfluidic plate. The spring arc plates, which are oriented in different directions and staggered vertically, thoroughly scrape away the deposits on the surface of the microfluidic plate, effectively preventing the accumulation of dirt from affecting heat dissipation. At the same time, the staggered design ensures smooth liquid flow in the inner channel. Combined with the damping wheel to reduce frictional resistance, the cleaning action is smoother and the spring force can be concentrated on the cleaning surface, thereby maintaining the long-term stable thermal conductivity of the microfluidic plate and improving the overall heat dissipation efficiency. This invention, by incorporating a heat-conducting mechanism and a cooling mechanism, uses the reciprocating motion of a long connecting rod to drive a hinged rod, controlling the flipping angle of the flipping plate. This enables the fan to automatically switch between two operating modes. When the fan is in contact with the heat dissipation fins, it concentrates airflow to efficiently dissipate heat from the receiving cavity. When the flipping plate returns to a horizontal position, it switches to overall air cooling of the side end shell, forming a dual-mode adaptive heat dissipation mechanism. This ensures efficient heat removal from the liquid cooling system while also taking into account the overall temperature control of the internal space of the equipment, significantly improving the system's comprehensive heat dissipation capacity and environmental adaptability. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the entire invention from a top-down perspective; Figure 2 This is a three-dimensional structural diagram of the bottom surface of the overall heat-conducting plate of the present invention; Figure 3 This is a schematic diagram showing the overall structural distribution of the present invention. Figure 4 This is a schematic diagram of the overall heat conduction mechanism of the present invention; Figure 5 This is a schematic diagram of the overall alternating flow diversion mechanism of the present invention; Figure 6 This invention as a whole Figure 5 A magnified structural diagram of A in the middle; Figure 7 This invention as a whole Figure 5 A magnified structural diagram of B in the diagram; Figure 8 This is a schematic diagram of the overall cleaning mechanism of the present invention; Figure 9 This invention as a whole Figure 8 A magnified structural diagram of C; Figure 10 This is a schematic diagram of the overall cooling mechanism of the present invention; Figure 11 This invention as a whole Figure 10 A magnified structural diagram of D in the diagram.

[0016] In the diagram: 1. Heat-conducting plate; 2. Side shell; 3. Cover plate; 4. Heat-conducting mechanism; 41. Frame rod; 42. Contact base; 43. Heat source guide plate; 44. Touch block; 45. Solid block; 46. Alloy wire; 47. Guide fold; 48. Column rod; 49. Long connecting rod; 410. Short push rod; 411. Long push rod; 5. Alternating flow splitting mechanism; 51. Input port; 52. Water tank; 53. Groove plate; 54. Microfluidic plate; 55. Output port; 56. Connecting pipe; 57. Adjusting block; 58. Adjusting rod; 59. Plug rod; 510. Rod frame; 511. Flow limiting ring; 512. Protrusion; 513. Rubber plug; 6. Cleaning mechanism; 61. Water channel frame; 62. Inner channel; 63. Spring arc plate; 64. Damping wheel; 65. Rotating shaft; 7. Cooling mechanism; 71. Hinge rod; 72. Flip plate; 73. Flip seat; 74. Fan; 75. Air duct; 76. Heat dissipation fins; 77. Cavity end; 78. Side slot; 79. Top slot. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0018] Please see Figure 1-11 One embodiment of the present invention is: a high-efficiency microchannel heat dissipation cold plate, including a heat-conducting plate 1, a heat-conducting mechanism 4 is provided at the bottom of the heat-conducting plate 1, and an alternating flow-diverting mechanism 5 is provided on the inner side of the side end shell 2. The heat conduction mechanism 4 includes a support rod 41, which is fixedly connected to the middle of the bottom surface of the heat conduction plate 1. A contact base 42 is fixedly connected to the outer surface of the support rod 41. A touch block 44 is slidably connected to the bottom surface of the heat conduction plate 1. A heat source guide plate 43 is fixedly connected to the bottom surface of the touch block 44. A fixed block 45 is provided at the edge of the bottom surface of the heat conduction plate 1. An alloy wire 46 is fixedly connected to the side of the fixed block 45. A guide folding strip 47 is fixedly connected to the side of the touch block 44. A column rod 48 is fixedly connected to the end of the guide folding strip 47 away from the touch block 44. A long connecting rod 49 is fixedly connected to the end of the column rod 48 away from the guide folding strip 47. The alternating flow splitting mechanism 5 includes two adjusting blocks 57, which are located on the left and right sides of the side shell 2 respectively. Each adjusting block 57 has an input port 51 or an output port 55 fixedly connected to its side. The end of the input port 51 or the output port 55 away from the adjusting block 57 is fixedly connected to a connecting pipe 56. A grooved plate 53 is fixedly connected to the center of the top surface of the heat-conducting plate 1. A water tank 52 is fixedly connected to the upper surface of the grooved plate 53. A microfluidic plate 54 is provided on the inner side of the water tank 52.

[0019] A side shell 2 is fixedly connected to the top edge of the heat-conducting plate 1, and a cover plate 3 is fixedly connected to the top surface of the side shell 2. A cleaning mechanism 6 is provided inside the alternating flow distribution mechanism 5, and a cooling mechanism 7 is provided on the top of the cover plate 3.

[0020] Multiple short push rods 410 and long push rods 411 are fixedly connected to the side of the long connecting rod 49. An adjusting rod 58 is slidably connected inside the adjusting block 57. The input port 51 includes a one-way structure, and the one-way structure includes a rod frame 510. The rod frame 510 is fixedly connected inside the input port 51. A stopper rod 59 is slidably connected at the center of the rod frame 510. A rubber stopper 513 is fixedly connected to one end of the stopper rod 59. A protrusion 512 is fixedly connected to the side of the rubber stopper 513 away from the stopper rod 59. A flow-limiting ring 511 is provided on the side of the rubber stopper 513.

[0021] The adjusting rod 58 has a groove on its side, and the groove is adapted to the shape of the protrusion 512. The plug rod 59 has a return spring on its outer side, and the two ends of the return spring are fixedly connected to the rod frame 510 and the rubber plug 513 respectively. The flow limiting ring 511 is fixedly connected to the inner wall of the input port 51.

[0022] Two contact bases 42 are provided, two contact sliders 44 are provided, and both contact sliders 44 are slidably connected to each other. Six fixed blocks 45 are provided, and three fixed blocks 45 are slidably connected to the heat source guide plates 43 on the front and rear sides respectively. The guide fold strip 47 is slidably connected to the heat conduction plate 1. Two water tanks 52 are provided, and the two water tanks 52 are respectively placed on the front and rear sides of the top of the heat conduction plate 1. Multiple microfluidic plates 54 are provided, and multiple microfluidic plates 54 are fixedly connected to the grooved plate 53. The contact base 42 and the heat source surface of the electronic component are filled with silicone grease to fill the gap between the electronic component and the bottom surface of the contact base 42. The electronic component and the contact base 42 are fixed with screws. In the initial state, the contact base 42 is first connected to one side. The heat source guide plate 43 contacts the bottom surface of the contact base 42. The heat generated is transferred to the touch slider 44 through the front heat source guide plate 43, and then upwards through the touch slider 44 to the contacting groove plate 53. When liquid is input into the water tank 52 connected to the side through the input port 51 on one side, the liquid drives the liquid in the water tank 52 to flow through the microfluidic plate 54. The heat on the groove plate 53 is conducted to the microfluidic plate 54 and carried away by the flowing liquid. Through the cooperation of the microfluidic plate 54 and the groove plate 53, the heat dissipation area is expanded and the heat dissipation efficiency is improved. When the temperature of the heat source guide plate 43 in contact with the contact base 42 rises to 40 to 50 degrees Celsius, the heat source guide plate 43 will simultaneously transfer some of the heat to the connected alloy wire 46. The alloy wire 46 is made of nickel-titanium alloy and is made of shape memory gold. When the heat transferred to the alloy wire 46 is in the range of 40 to 50 degrees Celsius, the alloy wire 46 will fully retract and pull the heat source guide plate 43 away from the contact base 42. The heat source guide plate 43 slides against the bottom surface of the groove plate 53 through the slider 44 and drives the connected guide strip 47 to push the column rod 48 and the long connecting rod 49 to move. The movement of the long connecting rod 49 pulls the adjusting rod 58. At this time, the adjusting rod 58 slides along the adjusting block 57 and pushes the long connecting rod 49 connected on the other side closer to the edge of the side end shell 2. The long connecting rod 49 then drives the rear heat source guide plate 43 to slide and touch the contact base 42 through the connected column rod 48 and guide strip 47. At the same time, the sliding of the adjusting rod 58 in the adjusting block 57 will push the protrusion 512 on the inner side of the groove to move through the groove. Upon application of force, the rubber stopper 513 is pushed, causing the stopper rod 59 to slide along the rod holder 510 and compress the return spring. The rubber stopper 513 approaches the flow-limiting ring 511, blocking the input port 51 and preventing liquid flow. As the adjusting rod 58 slides, the groove on the adjusting rod 58 aligns with the input port 51 on the other side. When the groove on the adjusting rod 58 aligns with the protrusion 512, the rubber stopper 513, under the action of the return spring, pushes the protrusion 512 to engage with the groove, moving the rubber stopper 513 away from the flow-limiting ring 511 and connecting the input port 51 and the water tank 52. The operation of the front and rear water tanks 52 is switched by the sliding of the adjusting block 57 and the adjusting rod 58, allowing the liquid in the water tank 52 that has stopped working after switching to be in a cooling and heat dissipation state. The alternating operation of the two water tanks 52 improves the heat dissipation effect.The heat source guide plate 43 is automatically switched using the thermal memory characteristics of the alloy wire 46. The working state of the water tank 52 is synchronously controlled by the linkage of the adjusting rod 58 and the adjusting block 57. This allows the heat dissipation system to automatically switch to the rear heat source guide plate 43 for heat dissipation when the temperature of the front heat source guide plate 43 is too high. Simultaneously, the liquid flow in the original water tank 52 is blocked, and the cooling cycle of the other water tank 52 is activated. By alternating the use of two sets of heat dissipation modules, the efficiency decrease caused by continuous operation of a single heat dissipation channel is avoided. This ensures that each heat dissipation component is adequately cooled during working intervals, thereby maintaining the stability and continuity of the overall heat dissipation performance and improving the heat dissipation reliability of electronic components under long-term high-load operation.

[0023] The cleaning mechanism 6 includes a waterway frame 61, with inner channels 62 on both the front and rear sides of the waterway frame 61. Multiple rotating shafts 65 are installed inside the waterway frame 61. Spring arc plates 63 are rotatably connected to the outer side of the rotating shafts 65, and damping wheels 64 are rotatably connected to the middle of the spring arc plates 63.

[0024] The damping wheel 64 is rotatably connected to the shaft 65. Each microfluidic plate 54 has a water channel frame 61 on its side. The water channel frame 61 is slidably connected to the spring arc plate 63. When the long connecting rod 49 moves, the long connecting rod 49 drives the connected short push rod 410 and long push rod 411 to pass through the side wall of the water tank 52 and slide against the water tank 52 to push the water channel frame 61 on the inner side of multiple microfluidic plates 54 to move. The movement of the water channel frame 61 drives the edges of the connected spring arc plates 63 to fit together. At the same time, the spring arc plates 63 face different directions and are staggered vertically, which can thoroughly clean the deposits on the side of the microfluidic plate 54 and prevent floating objects in the liquid from adhering to the side of the microfluidic plate 54 and affecting the heat conduction efficiency of the microfluidic plate 54. The staggered spring arc plates 63 ensure the flow of liquid in the inner channels 62 on both sides of the water channel frame 61. Furthermore, the spring arc plate 63 reduces the resistance encountered during sliding when it slides against the side of the microfluidic plate 54 via the damping wheel 64. This allows the elastic force of the spring arc plate 63 to be applied to the side of the microfluidic plate 54 on the cleaning side. The movement of the long connecting rod 49 links the short push rod 410 and the long push rod 411, driving the water channel frame 61 and the spring arc plate 63 to slide on the side of the microfluidic plate 54. The spring arc plates 63, which are oriented differently and staggered vertically, thoroughly scrape away the deposits on the surface of the microfluidic plate 54, effectively preventing the accumulation of dirt from affecting heat dissipation. At the same time, the staggered design ensures smooth liquid flow in the inner channel 62. Combined with the damping wheel 64, this reduces frictional resistance, making the cleaning action smoother and concentrating the spring force on the cleaning surface. This maintains the long-term stable thermal conductivity of the microfluidic plate 54 and improves the overall heat dissipation efficiency.

[0025] The cooling mechanism 7 includes multiple hinge rods 71, with each pair of hinge rods 71 ​​hinged to the left and right sides of the long connecting rod 49 respectively. The end of the hinge rod 71 away from the long connecting rod 49 is hinged to a flip plate 72. The bottom of the flip plate 72 is rotatably connected to a flip seat 73. Multiple fans 74 are installed on the side of the flip plate 72. Air slots 75 are opened on the side of the flip plate 72. Heat dissipation fins 76 are fixedly connected between the two flip seats 73. Two cavity ends 77 are fixedly connected to the bottom surface of the heat dissipation fins 76. Multiple side slots 78 are opened on the side of the side shell 2. Multiple top slots 79 are opened on the top surface of the cover plate 3.

[0026] The flip base 73 is fixedly connected to the top surface of the cover plate 3. The flip base 73 is symmetrically distributed about the left center line of the cover plate 3. The air duct 75 corresponds to the position of the fan 74. The top duct 79 is connected to the side duct 78. When the long connecting rod 49 on one side moves close to the side of the side end shell 2, the long connecting rod 49 drives the connected hinge rod 71 to push the flip plate 72 upward around the connection of the flip base 73 to flip. Through the flip, the fan 74 gradually approaches the heat dissipation fins 76 and comes into contact with them. When the working fan 74 comes into contact with the heat dissipation fins 76, it drives the air from below the flip plate 72 through the air duct 75 and blows it over the heat dissipation fins 76. The heat dissipation fins 76 absorb the heat in the cavity end 77 and dissipate the heat outward through the part of the heat dissipation fins 76 that contacts the airflow, so that the heat of the liquid inside the cavity end 77 is quickly dissipated. When the long connecting rod 49 moves away from the side end shell 2, the flip plate 72 flips to be parallel to the top surface of the cover plate 3, and draws air in from the side groove 78, passes through the inside of the side end shell 2, and is drawn out from the top groove 79, which helps to dissipate the heat inside the side end shell 2. The reciprocating motion of the long connecting rod 49 drives the hinge rod 71 to control the flip angle of the flip plate 72, so that the fan 74 can automatically switch between two working modes. When the fan 74 is in contact with the heat dissipation fins 76, it can concentrate the airflow to efficiently dissipate heat from the receiving cavity end 77. When the flip plate 72 returns to the horizontal position, it switches to overall air cooling for the inside of the side end shell 2, forming a dual-mode adaptive heat dissipation mechanism. This ensures efficient heat dissipation from the liquid cooling system and takes into account the overall temperature control of the internal space of the equipment, significantly improving the overall heat dissipation capacity and environmental adaptability of the system.

[0027] Working principle: In use, the contact base 42 and the heat source surface of the electronic component are filled with silicone grease to fill the gap between the electronic component and the bottom surface of the contact base 42. The electronic component and the contact base 42 are then fixed with screws. In the initial state, the contact base 42 first contacts the heat source guide plate 43 on one side. The heat generated on the bottom surface of the contact base 42 is transferred to the touch slider 44 through the front heat source guide plate 43, and then transferred upwards through the touch slider 44 to the contact groove plate 53. When liquid is input into the water tank 52 connected to the side through the input port 51 on one side, the liquid drives the liquid in the water tank 52 to flow through the microfluidic plate 5. 4. Heat on the grooved plate 53 is conducted to the microfluidic plate 54 and carried away by the flowing liquid. The microfluidic plate 54, in conjunction with the grooved plate 53, expands the heat dissipation area and improves heat dissipation efficiency. When the temperature of the heat source guide plate 43 in contact with the base 42 rises to 40-50 degrees Celsius, the heat source guide plate 43 simultaneously transfers some heat to the connected alloy wire 46. Since the nickel-titanium alloy wire 46 is a shape memory metal, when the heat transferred to the alloy wire 46 reaches the 40-50 degree Celsius range, the alloy wire 46 will completely retract and pull the heat source guide plate 43 away from the base 42. The heat source guide plate 43 then adheres to the bottom surface of the grooved plate 53 via the slider 44. The sliding action of the guide bar 47 pushes the column rod 48 and the long connecting rod 49 to move. The movement of the long connecting rod 49 pulls the adjusting rod 58. At this time, the adjusting rod 58 slides along the adjusting block 57 and pushes the long connecting rod 49 connected on the other side closer to the edge of the side end shell 2. The long connecting rod 49 then drives the rear heat source guide plate 43 to slide and touch the contact base 42 through the connected column rod 48 and guide bar 47. At the same time, the sliding of the adjusting rod 58 in the adjusting block 57 will push the protrusion 512 on the inner side of the groove to move through the groove. After the protrusion 512 is subjected to force, it pushes the rubber plug 513, causing the plug rod 59 to slide along the rod frame 510 and squeeze the return spring. 3. The flow-limiting ring 511 blocks the input port 51 to prevent liquid flow. As the adjusting rod 58 slides, the groove on the adjusting rod 58 aligns with the input port 51 on the other side. When the groove on the adjusting rod 58 is aligned with the protrusion 512, the rubber stopper 513 will push the protrusion 512 to fit with the groove under the action of the return spring, so that the rubber stopper 513 moves away from the flow-limiting ring 511 and connects the input port 51 and the water tank 52. The operation of the front and rear water tanks 52 is switched by the sliding of the adjusting block 57 and the adjusting rod 58, so that the liquid in the water tank 52 that stops working after switching is in a cooling and heat dissipation state. The heat dissipation effect is improved by the alternating operation of the two water tanks 52. When the long connecting rod 49 moves, it drives the connected short push rod 410 and long push rod 411 to pass through the side wall of the water tank 52 and slide with the water tank 52 to push the water channel frame 61 inside the multiple microfluidic plates 54 to move. The movement of the water channel frame 61 drives the connected spring arc plate 63 to fit together. At the same time, the spring arc plates 63 face different directions and are staggered vertically, which can thoroughly clean the deposits on the side of the microfluidic plate 54 and prevent floating objects in the liquid from adhering to the side of the microfluidic plate 54 and affecting the heat conduction efficiency of the microfluidic plate 54. The staggered part of the spring arc plate 63 ensures that the liquid flows smoothly in the inner channel 62 on both sides of the water channel frame 61. In addition, when the spring arc plate 63 slides against the side of the microfluidic plate 54 through the damping wheel 64, it can reduce the resistance encountered during sliding, so that the elastic force of the spring arc plate 63 is applied to the side of the microfluidic plate 54 on the cleaned side. When the long connecting rod 49 on one side moves closer to the side of the side shell 2, the long connecting rod 49 drives the connected hinge rod 71 to push the flip plate 72 upward around the connection of the flip seat 73 to flip. The flipping causes the fan 74 to gradually approach the heat dissipation fins 76 and come into contact with them. When the working fan 74 is in contact with the heat dissipation fins 76, it drives the air from below the flip plate 72 through the air groove 75 and blows it over the heat dissipation fins 76. The heat dissipation fins 76 will absorb the heat in the cavity end 77 and dissipate the heat outward through the part of the heat dissipation fins 76 that is in contact with the airflow, so that the heat of the liquid inside the cavity end 77 can be quickly dissipated. When the long connecting rod 49 moves away from the side shell 2, the flip plate 72 flips to be parallel to the top surface of the cover plate 3 and draws air in from the side groove 78, passes through the inside of the side shell 2 and is drawn out from the top groove 79, which helps to dissipate the heat inside the side shell 2.

[0028] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A high-efficiency micro-channel heat-dissipation cold plate comprising a heat-conducting plate (1), characterized in that: The bottom of the heat conduction plate (1) is provided with a heat conduction mechanism (4), and the inner side of the side end shell (2) is provided with an alternating shunt mechanism (5); The heat conduction mechanism (4) comprises a frame rod (41) fixedly connected to the middle part of the bottom surface of the heat conduction plate (1), the outer surface of the frame rod (41) is fixedly connected with a contact base (42), the bottom surface of the heat conduction plate (1) is slidably connected with a touch sliding block (44), the bottom surface of the touch sliding block (44) is fixedly connected with a heat source guide plate (43), the edge of the bottom surface of the heat conduction plate (1) is provided with a fixed block (45), the side surface of the fixed block (45) is fixedly connected with an alloy wire (46), the side surface of the touch sliding block (44) is fixedly connected with a guide folding strip (47), one end of the guide folding strip (47) away from the touch sliding block (44) is fixedly connected with a column rod (48), and one end of the column rod (48) away from the guide folding strip (47) is fixedly connected with a long connecting rod (49). The alternating shunt mechanism (5) comprises two adjusting blocks (57), and the two adjusting blocks (57) are respectively located on the left and right sides of the side end shell (2); the side surface of each adjusting block (57) is fixedly connected with an input port (51) or an output port (55); one end of the input port (51) or the output port (55) away from the adjusting block (57) is fixedly connected with a communication pipe (56); the middle part of the top surface of the heat conduction plate (1) is fixedly connected with a convex groove plate (53); the upper surface of the convex groove plate (53) is fixedly connected with a water tank (52); and the inner side of the water tank (52) is provided with a micro flow plate (54).

2. The high-efficiency micro-channel cooling cold plate of claim 1, wherein: The top edge of the heat conduction plate (1) is fixedly connected with the side end shell (2), the top surface of the side end shell (2) is fixedly connected with a cover plate (3), the inside of the alternating shunt mechanism (5) is provided with a cleaning mechanism (6), and the top of the cover plate (3) is provided with a cooling mechanism (7).

3. The high-efficiency micro-channel cooling cold plate of claim 2, wherein: The side surface of the long connecting rod (49) is fixedly connected with a plurality of short push rods (410) and a long push rod (411); the inside of the adjusting block (57) is slidably connected with an adjusting rod (58); the inside of the input port (51) comprises a one-way structure, and the one-way structure comprises a rod frame (510); the rod frame (510) is fixedly connected to the inside of the input port (51); the center of the rod frame (510) is slidably connected with a plug rod (59); one end of the plug rod (59) is fixedly connected with a rubber plug (513); one side of the rubber plug (513) away from the plug rod (59) is fixedly connected with a convex block (512); and the side surface of the rubber plug (513) is provided with a flow limiting ring (511).

4. The high-efficiency micro-channel cooling cold plate of claim 3, wherein: The side surface of the adjusting rod (58) is provided with a groove matched with the outer shape structure of the convex block (512); the outer side of the plug rod (59) is provided with a return spring, and the two ends of the return spring are fixedly connected with the rod frame (510) and the rubber plug (513) respectively; and the flow limiting ring (511) is fixedly connected with the inner wall of the input port (51).

5. The high-efficiency micro-channel cooling cold plate of claim 4, wherein: The contact base (42) is provided with two, the touch slider (44) is provided with two, and the two touch sliders (44) are in sliding connection with the touch slider (44), the solid block (45) is provided with six, and every three solid blocks (45) are in sliding connection with the heat source guide plate (43) on the front and back sides, the guide folding strip (47) is in sliding connection with the heat conduction plate (1), the water tank (52) is provided with two, and the two water tanks (52) are arranged on the front and back sides of the top surface of the heat conduction plate (1), and the micro flow plate (54) is provided with multiple, and the multiple micro flow plates (54) are in fixed connection with the convex groove plate (53).

6. The high-efficiency micro-channel cooling cold plate of claim 2, wherein: The cleaning mechanism (6) comprises a water channel frame (61), the front and back sides of the water channel frame (61) are provided with inner grooves (62), the inside of the water channel frame (61) is provided with a plurality of rotating shafts (65), the outer side of the rotating shaft (65) is rotatably connected with a spring arc piece (63), and the middle part of the spring arc piece (63) is rotatably connected with a damping wheel (64).

7. The high-efficiency micro-channel cooling cold plate of claim 6, wherein: The damping wheel (64) is rotatably connected with the rotating shaft (65), the side surface of each micro flow plate (54) is provided with a water channel frame (61), and the water channel frame (61) is in sliding connection with the spring arc piece (63).

8. The high-efficiency micro-channel cooling cold plate of claim 2, wherein: The cooling mechanism (7) comprises multiple hinged rods (71), every two hinged rods (71) are hingedly connected on the left and right sides of the long connecting rod (49), one end of the hinged rod (71) away from the long connecting rod (49) is hingedly connected with a turnover plate (72), the bottom of the turnover plate (72) is rotatably connected with a turnover seat (73), a plurality of fans (74) are installed on the side surface of the turnover plate (72), a wind groove (75) is formed in the side surface of the turnover plate (72), the two turnover seats (73) are fixedly connected with a heat dissipation fin (76), the bottom surface of the heat dissipation fin (76) is fixedly connected with two cavity ends (77), a plurality of side grooves (78) are formed in the side surface of the side end shell (2), and a plurality of top grooves (79) are formed in the top surface of the cover plate (3).

9. The high-efficiency micro-channel cooling cold plate of claim 8, wherein: The turnover seat (73) is fixedly connected with the top surface of the cover plate (3), the turnover seat (73) is symmetrically distributed about the left middle line of the cover plate (3), the wind groove (75) corresponds to the position of the fan (74), and the top groove (79) is in communication with the side groove (78).

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