Multi-temperature-zone heating equipment suitable for high-temperature baking of large-size panel

Abstract

The invention relates to the technical field of baking, in particular to multi-temperature-zone heating equipment suitable for high-temperature baking of a large-size panel. The device comprises a heating cavity which is provided with a product inlet and outlet; the gate valve is used for opening or closing the product inlet and outlet; and the heating platform is arranged in the heating cavity and is used for bearing and heating a product. The heating platform is installed in the heating cavity, the gate valve can open or close the product inlet and outlet in the heating cavity, a sealed heating environment can be formed when the gate valve is closed, and heat is prevented from being dissipated to the surrounding environment in the heating process. The sealing environment can guarantee the heating stability of the heating platform to the product, is especially suitable for the high-temperature baking requirement of a large-size panel, meets the technological requirements of high-temperature baking and curing film forming of each pixel groove in a substrate in the manufacturing of an ink-jet printing OLED display panel, avoids the problem of non-uniform baking caused by heat loss, and improves the production efficiency of the ink-jet printing OLED display panel. And thus, the conditions of short OLED service life caused by non-uniform deposition of ink droplets and rapid aging due to too high current in a thin region are reduced.

Description

Technical Field

[0001] This application relates to the field of baking technology, and mainly to a multi-temperature zone heating device suitable for high-temperature baking of large-size panels. Background Technology

[0002] Inkjet printing offers a promising method for manufacturing OLED display panels. However, the baking and curing process after ink droplets enter the pixel slots is crucial in inkjet printing. Each pixel slot on the substrate must be uniformly baked and cured at high temperatures. Uneven deposition of ink droplets can lead to short OLED lifespans, as thinner areas generate higher currents, resulting in faster aging.

[0003] Chinese invention CN202411872499.5 discloses a display panel baking plate, wherein the structure of the provided display panel baking plate uses multiple heating pipes embedded in the heating plate to raise the temperature of the heating plate through the heating pipes and bake the product. The baking structure has the following disadvantages: (1) Using multiple heating pipes embedded in the heating plate body is not conducive to making large-size heating plates. The larger the size of the heating plate, the more heating pipes are embedded in the same heating plate body, and the greater the processing and manufacturing difficulty; (2) It is not conducive to the maintenance of the heating plate: if multiple heating pipes are directly embedded in the same heating plate body, the failure of one of them will cause the entire heating plate to be scrapped; (3) The divided area is relatively small, which is not conducive to adjusting the temperature uniformity of the heating plate surface; (4) There is no heat protection structure, and the heat generated is easily lost to the surrounding environment.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a multi-temperature zone heating device suitable for high-temperature baking of large-size panels, which aims to solve the problem of the difficulty in maintaining existing baking equipment.

[0006] The technical solution of this application is as follows: This application provides a multi-temperature zone heating device suitable for high-temperature baking of large-size panels, comprising: A heating chamber, wherein a product inlet and outlet are provided; A valve is used to open or close the inlet / outlet of the product; A heating platform, located inside the heating chamber, is used to support and heat the product.

[0007] As a further improvement to the above technical solution, the heating platform includes: Heating plate body; The product limiting component is fixedly connected to the top surface of the heating plate body and is used to limit the product.

[0008] As a further improvement to the above technical solution, the heating platform also includes: The heating sub-modules are configured in multiples, and the multiple heating sub-modules are arranged in a flat arrangement on the bottom surface of the heating plate body.

[0009] As a further improvement to the above technical solution, both the heating submodule and the heating plate body are provided with PIN holes for PIN pins to pass through.

[0010] As a further improvement to the above technical solution, the heating submodule includes: The submodule body and the heating element, wherein the number of heating elements is set to multiple, and the multiple heating elements are arranged in a flat arrangement on the submodule body; The main body of the sub-module has multiple heating element mounting slots corresponding to the heating element; The heating element and the heating element mounting slot are provided with PIN holes and sensor mounting holes.

[0011] As a further improvement to the above technical solution, the heating element includes a cast body and heating rods distributed within the cast body.

[0012] As a further improvement to the above technical solution, the heating chamber includes: The main metal cavity has a mirrored reflector plate on its inner surface.

[0013] As a further improvement to the above technical solution, the outer surface of the main metal cavity is covered with a heat insulation plate.

[0014] As a further improvement to the above technical solution, the outer surface of the heat insulation plate is covered with a sheet metal shell.

[0015] As a further improvement to the above technical solution, the bottom of the heating chamber is provided with a heating cable through hole and a sensor cable through hole.

[0016] Beneficial Effects: In this application, the heating platform is installed inside the heating chamber. The valve can open or close the product inlet and outlet on the heating chamber. When the valve is closed, a sealed heating environment is formed, preventing heat loss to the surrounding environment during the heating process. The sealed environment ensures the stability of the heating platform's heating of the product, which is especially suitable for the high-temperature baking requirements of large-size panels. It meets the process requirements for high-temperature baking and curing of each pixel slot on the substrate in inkjet-printed OLED display panel manufacturing, avoiding uneven baking caused by heat loss, and thus reducing the problems of short OLED lifespan and rapid aging due to excessively high current in thinner areas caused by uneven ink droplet deposition. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the multi-temperature zone heating device applicable to high-temperature baking of large-size panels according to this application.

[0018] Figure 2 This is a schematic diagram of the structure of the heating plate body of this application.

[0019] Figure 3 This is a schematic diagram of the heating platform of this application.

[0020] Figure 4 This is a schematic diagram of the heating submodule of this application.

[0021] Figure 5 This is a schematic diagram of the heating element in this application.

[0022] Figure 6 This is a cross-sectional structural diagram of the heating element of this application.

[0023] Figure 7 This is a schematic diagram of the heating cavity structure of this application.

[0024] Figure 8 This is an exploded view of the heating chamber of this application.

[0025] Figure 9 This is an exploded view of the upper cavity cover of this application.

[0026] Labeling Explanation: 100, Heating Chamber; 110, Product Inlet / Outlet; 120, Valve; 130, Main Metal Chamber; 140, Mirror Reflector; 150, Heat Insulation Plate; 160, Sheet Metal Shell; 170, Upper Chamber Cover; 200, Heating Platform; 210, Heating Plate Body; 211, Product Limiting Component; 220, Heating Sub-module; 221, Sub-module Body; 222, Heating Element; 223, Heating Element Mounting Slot; 224, Casting Body; 225, Heating Rod; 300, PIN Hole; 400, Sensor Mounting Hole; 500, Heating Cable Through Hole; 600, Sensor Cable Through Hole. Detailed Implementation

[0027] This application provides a multi-temperature zone heating device suitable for high-temperature baking of large-size panels. To make the purpose, technical solution, and effects of this application clearer and more explicit, the following provides a more detailed description. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0028] Reference Figures 1-9 This application provides a multi-temperature zone heating device suitable for high-temperature baking of large-size panels, comprising: A heating chamber 100 is provided with a product inlet / outlet 110. Valve 120 is used to open or close the product inlet / outlet 110; A heating platform 200 is disposed within the heating chamber 100 and is used to support and heat the product.

[0029] In this application, the heating platform 200 is installed inside the heating chamber 100. The valve 120 can open or close the product inlet / outlet 110 on the heating chamber 100. When the valve 120 is closed, a sealed heating environment is formed, preventing heat loss to the surrounding environment during the heating process. The sealed environment ensures the stability of the heating platform 200 in heating the product, and is especially suitable for the high-temperature baking requirements of large-size panels. It meets the process requirements of high-temperature baking and curing of each pixel slot on the substrate in the inkjet-printed OLED display panel manufacturing process, avoiding uneven baking caused by heat loss, and thus reducing the short OLED lifespan and rapid aging due to excessive current in thinner areas caused by uneven ink droplet deposition.

[0030] In one specific embodiment of this application, the heating platform 200 includes: Heating plate body 210; Product limiting component 211 is fixedly connected to the top surface of the heating plate body 210 and is used to limit the product.

[0031] The heating plate body 210 may be provided with mounting holes in its circumferential direction for fixed installation with the heating cavity 100.

[0032] In this application, the top surface of the heating plate body 210 serves as a uniform heating surface, directly contacting the heated product. This ensures uniform heating of the product upon contact with the heating surface, preventing defects in film formation caused by uneven heating. By setting a product limiting component 211, the heated product can be precisely positioned, preventing large panels from being affected by positional shifts during baking and ensuring that each pixel slot of each panel is within the preset heating area, further improving the consistency of baking and curing. The heating plate body 210 is made of metal, possessing good structural strength and thermal conductivity, capable of supporting the weight of large panels. Furthermore, the thermal conductivity of the metal material, combined with the heating surface, achieves efficient heat transfer and uniform distribution.

[0033] In one specific embodiment of this application, the heating platform 200 further includes: The heating sub-modules 220 are configured in multiples, and the multiple heating sub-modules 220 are arranged in a flat arrangement on the bottom surface of the heating plate body 210.

[0034] In this application, a large-size heating platform 200 is formed by combining multiple heating sub-modules 220, eliminating the need to embed a large number of heating elements on a single heating plate, thus significantly reducing the manufacturing difficulty of the large-size heating platform 200. Furthermore, the multiple heating sub-modules 220 are structurally relatively independent. If heating is poor in a certain area of ​​the heating platform 200 or a heating element is damaged, only the corresponding faulty heating sub-module 220 needs to be disassembled for repair or replacement, without scrapping the entire heating plate, reducing equipment maintenance costs and downtime losses. Through independent control of the multiple heating sub-modules 220, the temperature requirements of different areas of the heating platform 200 can be precisely adjusted, which is particularly suitable for the requirement of uniform heating in different areas during the baking of large-size panels, and is beneficial for adjusting the temperature uniformity of the surface of the heating platform 200.

[0035] In one specific embodiment of this application, both the heating submodule 220 and the heating plate body 210 are provided with PIN holes 300 for PIN pins to pass through.

[0036] In this application, by providing a PIN hole 300 through which the PIN pin can pass, when a product needs to be placed, the PIN pin can be lifted through the PIN hole 300, allowing workers or robotic arms to easily place large panels onto the heating plate body 210 of the heating platform 200. After the product is baked, the PIN pin lifts the product again, facilitating its removal from the heating platform 200. This avoids inconvenience or damage to the panel caused by direct contact with the heated panel, improving the ease of operation and production efficiency of the equipment.

[0037] In one specific embodiment of this application, the heating submodule 220 includes: The submodule body 221 and the heating element 222 are provided. The number of heating elements 222 is set to be multiple. The multiple heating elements 222 are combined and laid flat on the submodule body 221. The sub-module body 221 is provided with a plurality of heating element mounting slots 223 corresponding to the heating element 222; The heating element 222 and the heating element mounting slot 223 are provided with a PIN hole 300 and a sensor mounting hole 400.

[0038] In this application, by opening multiple heating element mounting slots 223 corresponding to the heating elements 222 on the sub-module body 221, precise positioning and installation of the heating elements 222 can be achieved, ensuring that the multiple heating elements 222 are evenly distributed on the sub-module body 221, thereby ensuring uniform heat supply from the heating sub-module 220 to the heating plate body 210. The combined and flat arrangement of multiple heating elements 222 further refines the heating area. Combined with the overall layout of the multiple heating sub-modules 220, the entire heating platform 200 can be divided into more heating areas, significantly improving the flexibility and accuracy of temperature adjustment, and better meeting the baking temperature requirements of different areas of large-size panels. Temperature sensors can be installed through sensor mounting holes 400 to monitor the temperature of each heating element 222 area in real time. This allows operators to adjust the heating state of the heating elements 222 promptly based on sensor feedback data, ensuring that the heating temperature always meets process requirements, avoiding film formation quality problems caused by temperature deviations, and improving the intelligent control level of the equipment.

[0039] In one specific embodiment of this application, the heating element 222 includes a cast body 224 and heating rods 225 distributed within the cast body 224.

[0040] Specifically, the heating element 222 can be cast by pouring the heating rod 225 into the casting body 224. Specifically, the material of the casting body 224 can be aluminum alloy.

[0041] In this application, by casting the heating rod 225 into the casting body 224, the gap between the heating rod 225 and the casting body 224 (mounting part) can be completely eliminated, significantly improving thermal conductivity and efficiency. This ensures that the heat generated by the heating rod 225 can be quickly and evenly transferred to the heating platform 200, thereby guaranteeing the uniformity of product baking. The casting body 224 is made of aluminum alloy, which has good thermal conductivity, further enhancing the heat transfer effect. At the same time, aluminum alloy is lightweight and has moderate structural strength, facilitating the installation and assembly of the heating submodule 220, meeting the requirements of lightweight and efficient heat conduction for the large-size heating platform 200.

[0042] The heating rod 225 has cables connected to both ends for easy power supply and electric heating.

[0043] In one specific embodiment of this application, the heating cavity 100 includes: The main metal cavity 130 has a mirror reflector 140 disposed on its inner surface.

[0044] In this application, by setting a mirror reflector 140, the heat generated by the heating platform 200 can be reflected inside the cavity, forming a uniform heat field, reducing heat loss inside the cavity, and improving energy utilization. The uniform heat field ensures that all areas of the large-size panel are in the same temperature environment during the baking process, avoiding over- or under-baking of the panel due to uneven temperature inside the cavity, and ensuring the curing quality of each pixel slot.

[0045] In one specific embodiment of this application, the outer surface of the main metal cavity 130 is covered with a heat insulation plate 150.

[0046] In this application, by setting the heat insulation plate 150, external heat insulation can be achieved, reducing the heat exchange between the inside of the heating cavity 100 and the external environment, avoiding the interference of the external environment temperature on the heating environment inside the cavity, and preventing the heat inside the cavity from being transferred to the outside through the cavity wall. In conjunction with the mirror reflector plate 140 inside the cavity, heat loss can be further reduced, and the consistency of product baking quality can be improved.

[0047] In one specific embodiment of this application, the outer surface of the heat insulation plate 150 is covered with a sheet metal shell 160.

[0048] In this application, the heat insulation plate 150 is generally made of a non-wear-resistant material, which is prone to wear and dust generation after prolonged use. The sheet metal outer shell 160, however, possesses excellent wear resistance and protective properties. By installing the sheet metal outer shell 160, wear caused by collisions and friction during daily use and maintenance of the heat insulation plate 150 can be prevented, dust generation can be prevented, and the heat insulation plate 150 can maintain good heat insulation performance over a long period. The sheet metal outer shell 160 also improves the neatness and aesthetics of the equipment's appearance, making the overall structure of the equipment more regular and further strengthening the structural strength of the heating chamber 100. Combined with the main metal cavity 130, this gives the heating chamber 100 stronger resistance to deformation, especially in high-temperature baking environments, maintaining the stability of the cavity structure and ensuring long-term reliable operation of the equipment.

[0049] In one specific embodiment of this application, the bottom of the heating cavity 100 is provided with a heating cable through hole 500 and a sensor cable through hole 600.

[0050] In this application, by setting heating cable through holes 500 and sensor cable through holes 600, the heating cables pass through the heating cable through holes 500 in an orderly manner, which can avoid poor contact caused by pulling or bending the cables, ensuring a continuous and stable power supply to the heating platform 200 and ensuring that the baking process is not interrupted. The sensor cables pass through the sensor cable through holes 600, which can realize a stable connection between the temperature sensor and the external control system, transmit temperature data in real time, and allow the staff to keep abreast of the heating temperature in the cavity and adjust the heating parameters in a timely manner to ensure the baking quality of the product.

[0051] The working principle of the multi-temperature zone heating device for high-temperature baking of large-size panels in this application is as follows: When performing high-temperature baking on large-size panels (such as display panels of G6 generation and above), first operate the gate valve 120 to open the product inlet and outlet 110 on the heating chamber 100. At this time, the PIN pin passes through the heating sub-module 220 and the PIN hole 300 on the heating plate body 210 and is lifted up. The operator or robotic arm can use the lifted PIN pin to place the large-size panel to be baked stably on the top surface of the heating plate body 210 of the heating platform 200. During the process, the product limiting component 211 precisely limits the panel to prevent the panel position from shifting and ensures that each pixel slot on the panel is within the preset heating area.

[0052] After placement, the PIN pin retracts, and the panel directly contacts the top surface of the heating plate body 210. Then, the valve 120 is closed, creating a sealed heating environment in the heating chamber 100. Next, external power is supplied through the heating cable through-hole 500 at the bottom of the heating chamber 100, energizing the heating rod 225 inside the heating element 222, causing it to heat up. Because the heating element 222 uses a casting process to deposit the heating rod 225 into an aluminum alloy casting body 224, there is no gap between the heating rod 225 and the casting body 224. Heat can be quickly and evenly transferred to the casting body 224, and then through the heating element mounting slot 223 on the submodule body 221 to the entire heating submodule 220.

[0053] Multiple heating sub-modules 220 are arranged flat on the bottom surface of the heating plate body 210, further transferring heat to the metal heating plate body 210. The heating plate body 210, with its excellent thermal conductivity, evenly distributes heat to the panel, achieving high-temperature baking. Simultaneously, temperature sensors installed in the sensor mounting holes 400 are connected to an external control system via sensor cable through holes 600, monitoring the temperature of each heating element 222 area in real time and transmitting the temperature data to the external control system. Based on the data feedback, operators can independently control the heating elements 222 of each heating sub-module 220, precisely adjusting the temperature of different areas of the heating platform 200 to ensure uniform heating of all areas of the panel.

[0054] During the baking process, the mirrored reflector 140 on the inner surface of the main metal cavity 130 reflects the heat generated by the heating platform 200 within the cavity, forming a uniform heat field and reducing internal heat loss. The heat insulation plate 150 covering the outer surface of the main metal cavity 130 isolates the heat exchange between the inside and outside of the cavity, preventing external environmental interference with the internal heating environment. Together, they form a double heat protection system, maintaining a stable internal temperature. The sheet metal outer shell 160 on the outer surface of the heat insulation plate 150 protects the heat insulation plate 150 from impact and wear, prevents dust generation, and also enhances the structural stability of the heating cavity 100, ensuring reliable operation of the equipment in high-temperature environments.

[0055] Once the panel baking reaches the preset process requirements, the temperature sensor sends a signal, the heating rod 225 stops supplying power, and then the gate valve 120 is opened. The PIN pin passes through the PIN hole 300 again to lift the panel. The staff or robotic arm then removes the baked panel, completing a high-temperature baking operation for a large-size panel.

[0056] The multi-temperature zone heating device for high-temperature baking of large-size panels provided in this application can be applied to the high-temperature baking of large-size panels, especially display panels from G6 generation and above. It is designed with 36 heating elements 222 (the specific number can be set according to needs), dividing the heating platform 200 into 36 heating zones. Multi-temperature zone heating is beneficial for adjusting the temperature uniformity of the surface of the heating platform 200.

[0057] Specifically, this application can be configured with 9 heating sub-modules 220, each sub-module can be configured with 4 heating elements 222, and the 9 areas are relatively independent, which is beneficial for equipment maintenance. If the heating rod 225 in a certain area of ​​the heating platform 200 is damaged, only one heating sub-module 220 needs to be removed, and the other sub-modules will not be affected.

[0058] The heating element 222 in this application can be manufactured by casting. The heating rod 225 is cast into an aluminum alloy or copper part, with zero gap between the heating rod 225 and the cast body 224. This improves thermal conductivity and prevents the heating rod 225 from burning dry, thus extending its service life. There is no need to use thermal grease or deform the heating rod 225 to reduce gaps and improve heating efficiency.

[0059] In this application, the heating platform 200 is surrounded by a cavity. A mirrored reflector 140 is designed on the inner surface of the cavity, and a heat insulation structure is designed on the outer surface of the cavity to prevent internal heat loss and the influence of the external environment on the heating plate inside the cavity. This achieves two layers of heat protection. When the heating cavity 100 is designed as a cuboid, the first layer consists of mirrored reflectors 140 on all six internal surfaces, which reflect the heat generated by the heating plate within the cavity, forming a uniform heat field. The second layer is the heat insulation plate 150 on the outside of the cavity, which isolates the cavity from the influence of the external environment on the internal environment.

[0060] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of this application.

Claims

1. A multi-temperature zone heating device suitable for high-temperature baking of large-size panels, characterized in that, include: A heating chamber (100) is provided with a product inlet and outlet (110). A valve (120) is used to open or close the product inlet / outlet (110). A heating platform (200) is disposed within the heating chamber (100) for supporting and heating the product.

2. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 1, characterized in that, The heating platform (200) includes: Heating plate body (210); Product limiting component (211) is fixedly connected to the top surface of the heating plate body (210) for limiting the product.

3. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 2, characterized in that, The heating platform (200) also includes: The number of heating sub-modules (220) is set to multiple, and the multiple heating sub-modules (220) are arranged in a flat arrangement on the bottom surface of the heating plate body (210).

4. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 3, characterized in that, Both the heating submodule (220) and the heating plate body (210) are provided with PIN holes (300) for PIN pins to pass through.

5. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 4, characterized in that, The heating submodule (220) includes: The submodule body (221) and the heating element (222) are provided. The number of heating elements (222) is set to multiple, and the multiple heating elements (222) are arranged in a flat arrangement on the submodule body (221). The submodule body (221) has multiple heating element mounting slots (223) corresponding to the heating element (222). The heating element (222) and the heating element mounting groove (223) are provided with a PIN hole (300) and a sensor mounting hole (400).

6. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 5, characterized in that, The heating element (222) includes a cast body (224) and heating rods (225) distributed within the cast body (224).

7. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 6, characterized in that, The heating chamber (100) includes: The main metal cavity (130) has a mirror reflector plate (140) on its inner surface.

8. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 7, characterized in that, The outer surface of the main metal cavity (130) is covered with a heat insulation plate (150). The outer surface of the heat insulation panel (150) is covered with a sheet metal shell (160).

9. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 8, characterized in that, The bottom of the heating chamber (100) is provided with a heating cable through hole (500) and a sensor cable through hole (600).

10. The multi-temperature zone heating device for high-temperature baking of large-size panels according to claim 9, characterized in that, The heating chamber (100) also includes an upper cover (170) for participating in the formation of the body wall of the heating chamber (100).

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