Stress wave parameter analysis method, device, equipment, storage medium and product

Abstract

The application relates to a stress wave parameter analysis method, device, equipment, storage medium and product. The method comprises the following steps: acquiring candidate size change amounts of a measured component in at least one candidate direction; determining a stress wave propagation direction corresponding to the measured component according to the candidate size change amounts; and performing parameter analysis on the measured component according to a target size change amount of the measured component in the stress wave propagation direction, so as to obtain a stress wave parameter of the measured component. The application realizes accurate stress wave analysis on the measured component, ensures that subsequent operation and maintenance personnel can accurately analyze the mechanical integrity, fatigue life of the measured component and the reliability of the overall system according to the stress wave parameter, and ensures effective detection of the measured component.

Description

Technical Field

[0001] This application relates to the field of stress analysis technology, and in particular to a method, apparatus, device, storage medium and product for stress wave parameter analysis. Background Technology

[0002] In modern industry and scientific research, the performance and reliability requirements of equipment operating under high-speed and high-overload conditions, such as electromagnetic eddy current repulsion mechanisms, high-voltage switches, and aerospace actuation systems, are becoming increasingly stringent. When these mechanisms are in operation, their critical internal components often experience severe impact loads, which in turn trigger stress waves to propagate through the materials.

[0003] The amplitude (characterizing the magnitude of the force) and wave velocity (related to the material modulus and density) of stress waves directly determine the mechanical integrity, fatigue life, and overall system reliability of components. Therefore, a stress wave analysis method is urgently needed to achieve effective measurement of stress wave amplitude and wave velocity. Summary of the Invention

[0004] Therefore, it is necessary to provide a stress wave parameter analysis method, apparatus, equipment, storage medium, and product that can effectively measure stress wave amplitude and wave velocity, addressing the aforementioned technical problems.

[0005] Firstly, this application provides a method for stress wave parameter analysis. The method includes:

[0006] Obtain the candidate size change of the observed range of the component under test in at least one candidate direction;

[0007] Based on the changes in each of the candidate dimensions, the direction of stress wave propagation corresponding to the tested component is determined;

[0008] Based on the change in the target size of the tested component under the direction of stress wave propagation, parameter analysis is performed on the tested component to obtain the stress wave parameters of the tested component.

[0009] In one embodiment, determining the stress wave propagation direction corresponding to the tested component based on each of the candidate size changes includes:

[0010] Select the reference direction with the largest change in candidate size from all the candidate directions;

[0011] The stress wave propagation direction corresponding to the tested component is determined based on the candidate size change in the reference direction.

[0012] In one embodiment, determining the stress wave propagation direction corresponding to the tested component based on the candidate size change in the reference direction includes:

[0013] If the angle difference between two adjacent candidate directions is not less than a preset threshold, select the two comparison directions with the smallest angle difference from the reference direction from each candidate direction.

[0014] The stress wave propagation direction corresponding to the tested component is determined based on the comparison direction with the largest candidate size change among the comparison directions and the reference direction.

[0015] In one embodiment, the method further includes:

[0016] If the difference in directional angle between two adjacent candidate directions is less than a preset threshold, the reference direction is taken as the stress wave propagation direction corresponding to the tested component.

[0017] In one embodiment, the step of performing parameter analysis on the tested component based on the target size change of the tested component in the stress wave propagation direction to obtain the stress wave parameters of the tested component includes:

[0018] Determine the elastic modulus of the component under test;

[0019] Based on the target size change and the standard size of the measured component, the relative change of the measured component is obtained.

[0020] Based on the elastic modulus and the relative change, the measured component is subjected to parameter analysis to obtain the stress wave amplitude value in the stress wave parameters.

[0021] In one embodiment, the step of performing parameter analysis on the tested component based on the target size change of the tested component in the stress wave propagation direction to obtain the stress wave parameters of the tested component includes:

[0022] Obtain the trigger time corresponding to the change in the target size;

[0023] Based on the triggering time, the parameters of the tested component are analyzed to obtain the stress wave velocity in the stress wave parameters.

[0024] Secondly, this application also provides a stress wave parameter analysis device. The device includes:

[0025] The acquisition module is used to acquire the candidate size change of the observation range of the measured component in at least one candidate direction;

[0026] The determination module is used to determine the stress wave propagation direction corresponding to the tested component based on the change in each of the candidate dimensions;

[0027] The sub-module is used to perform parameter analysis on the tested component based on the target size change of the tested component in the direction of stress wave propagation, and to obtain the stress wave parameters of the tested component.

[0028] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the stress wave parameter analysis method of the first aspect described above.

[0029] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, implements the stress wave parameter analysis method of the first aspect described above.

[0030] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, implements the stress wave parameter analysis method of the first aspect described above.

[0031] The aforementioned stress wave parameter analysis method, apparatus, equipment, storage medium, and product, by acquiring the candidate dimensional changes of the observed range of the tested component in at least one candidate direction, determine the stress wave propagation direction corresponding to the tested component based on each candidate dimensional change. Furthermore, based on the target dimensional change of the tested component in the stress wave propagation direction, parameter analysis is performed on the tested component to obtain its stress wave parameters. As can be seen from the above, this application, in the process of stress wave parameter analysis, pre-acquires candidate dimensional changes in at least one candidate direction. Then, based on each candidate dimensional change, it determines the stress wave propagation direction corresponding to the tested component from each candidate direction, thereby ensuring the accuracy of subsequent parameter analysis of the tested component and providing a foundation for subsequent parameter analysis. Moreover, this application performs parameter analysis on the tested component based on the target dimensional change in the stress wave propagation direction, achieving accurate stress wave analysis of the tested component. This ensures that subsequent maintenance personnel can accurately analyze the mechanical integrity, fatigue life, and overall system reliability of the tested component based on the stress wave parameters, guaranteeing effective testing of the tested component. Attached Figure Description

[0032] Figure 1 An application environment diagram of a stress wave parameter analysis method provided in this application embodiment;

[0033] Figure 2 A flowchart illustrating the first stress wave parameter analysis method provided in this application embodiment;

[0034] Figure 3A flowchart illustrating the second stress wave parameter analysis method provided in this application embodiment;

[0035] Figure 4 A flowchart illustrating the third stress wave parameter analysis method provided in this application embodiment;

[0036] Figure 5 A flowchart illustrating the fourth stress wave parameter analysis method provided in this application embodiment;

[0037] Figure 6 A flowchart illustrating the fifth stress wave parameter analysis method provided in this application embodiment;

[0038] Figure 7 A structural block diagram of a stress wave parameter analysis device provided in this application embodiment;

[0039] Figure 8 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0041] The stress wave parameter analysis method provided in this application can be applied to, for example... Figure 1 In the application environment shown, terminal 102 communicates with server 104 via a network. A data storage system can store the data that server 104 needs to process. The data storage system can be integrated onto server 104 or placed in the cloud or on other network servers. By acquiring the candidate size changes of the observed range of the tested component in at least one candidate direction, the stress wave propagation direction corresponding to the tested component is determined based on each candidate size change. Furthermore, based on the target size change of the tested component in the stress wave propagation direction, parameter analysis is performed on the tested component to obtain the stress wave parameters. Terminal 102 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. IoT devices can be smart speakers, smart TVs, smart air conditioners, smart vehicle devices, etc. Portable wearable devices can be smartwatches, smart bracelets, head-mounted devices, etc. Server 104 can be implemented using a standalone server or a server cluster composed of multiple servers.

[0042] In one embodiment, such as Figure 2 As shown, a stress wave parameter analysis method is provided, which can be applied to... Figure 1Taking server 104 as an example, the following steps are included:

[0043] S201, obtain the candidate size change of the observation range of the measured component in at least one candidate direction.

[0044] It should be noted that when it is necessary to obtain the candidate size change of the observation range of the tested component in at least one candidate direction, the following may be included: for each candidate direction, at least one marker strip is pasted along the candidate direction, and a high-speed camera is used to take pictures of the tested area with the marker strip pasted; image recognition is performed on the captured image, and the change in length of the marker strip is taken as the candidate size change of the tested component in at least one candidate direction in the observation range.

[0045] The camera's frame rate must be much higher than the frequency of the stress wave to ensure that the transient process of the stress wave passing through each strip can be captured.

[0046] In one embodiment of this application, the marking strip is a rectangular strip, and its long side direction should be perpendicular to the candidate direction on the component being tested, so as to ensure that it is most sensitive to stress waves propagating along that direction.

[0047] The color of the marking strip should have a high contrast (i.e., inverse color) with the color of the surface of the part being measured. For example, if the part being measured is a bright metallic color, the marking strip should be black; if the part being measured is a dark color, the marking strip should be white or fluorescent.

[0048] Furthermore, the marking strip material should possess high toughness and low creep (such as polyimide film, specific types of polyester film, or special strain film) to ensure that it can withstand repeated impacts without becoming brittle, and that its deformation can be recovered.

[0049] When attaching the marking strip to the part being tested, a high-strength, high-modulus adhesive (such as epoxy resin or cyanoacrylate quick-drying adhesive) can be used to firmly bond the strip to the surface of the part. The adhesion must be strong enough to ensure that there is no relative slippage between the marking strip and the surface of the part being tested during stress wave transmission, achieving synchronous deformation. That is, the transverse strain (width change) of the marking strip truly reflects the longitudinal strain of the surface of the part being tested.

[0050] In another embodiment of this application, the high-speed camera is equipped with a high-brightness illumination source to overcome the short exposure time required for high-speed shooting and obtain a clear, motion-blur-free image sequence.

[0051] S202, determine the stress wave propagation direction corresponding to the tested component based on the change in each candidate dimension.

[0052] It should be noted that when it is necessary to determine the stress wave propagation direction of the tested component based on the changes in each candidate dimension, the following can be included: selecting the reference direction with the largest change in candidate dimension from each candidate direction; and determining the stress wave propagation direction of the tested component based on the changes in candidate dimension in the reference direction.

[0053] S203. Based on the change in the target size of the tested component under the direction of stress wave propagation, perform parameter analysis on the tested component to obtain the stress wave parameters of the tested component.

[0054] It should be noted that stress wave parameters may include, but are not limited to, stress wave amplitude and stress wave velocity. Therefore, when it is necessary to perform parameter analysis on the tested component, different stress wave parameter determination methods can be used for different types of stress wave parameters, thereby achieving the purpose of obtaining the stress wave parameters of the tested component.

[0055] The aforementioned stress wave parameter analysis method, by acquiring the candidate dimensional changes of the observed component under test in at least one candidate direction, determines the stress wave propagation direction of the component under test based on each candidate dimensional change. Then, based on the target dimensional change of the component under test in the stress wave propagation direction, parameter analysis is performed to obtain the stress wave parameters of the component under test. As can be seen from the above, this application, in the process of stress wave parameter analysis, pre-acquires candidate dimensional changes in at least one candidate direction. Then, based on each candidate dimensional change, it determines the stress wave propagation direction of the component under test from each candidate direction, thereby ensuring the accuracy of subsequent parameter analysis of the component under test and providing a foundation for subsequent parameter analysis. Furthermore, this application performs parameter analysis on the component under test based on the target dimensional change in the stress wave propagation direction, achieving accurate stress wave analysis of the component under test. This ensures that subsequent maintenance personnel can accurately analyze the mechanical integrity, fatigue life, and overall system reliability of the component under test based on the stress wave parameters, guaranteeing effective testing of the component under test.

[0056] In one embodiment, such as Figure 3 As shown, when it is necessary to determine the stress wave propagation direction of the tested component based on the changes in each candidate dimension, the following can be included:

[0057] S301, Select the reference direction with the largest change in candidate size from all candidate directions.

[0058] In one embodiment of this application, when it is necessary to select the reference direction with the largest change in candidate size from each candidate direction, the candidate directions can be sorted in descending order of the change in candidate size, and then the candidate direction ranked first can be used as the reference direction with the largest change in candidate size.

[0059] S302, determine the stress wave propagation direction of the tested component based on the candidate dimensional change in the reference direction.

[0060] It should be noted that when it is necessary to determine the stress wave propagation direction of the tested component based on the candidate size change in the reference direction, the following can be included: verifying the relationship between the difference in directional angles between two adjacent candidate directions and a preset threshold, and then, based on the relationship, determining the stress wave propagation direction of the tested component.

[0061] Specifically, if the difference in directional angle between two adjacent candidate directions is not less than a preset threshold, the two comparison directions with the smallest directional angle difference from the reference direction are selected from each candidate direction; based on the comparison direction with the largest candidate size change and the reference direction, the stress wave propagation direction corresponding to the tested component is determined.

[0062] If the difference in directional angle between two adjacent candidate directions is less than a preset threshold, the reference direction will be used as the stress wave propagation direction of the component under test.

[0063] In one embodiment of this application, when it is necessary to determine the stress wave propagation direction of the tested component based on the comparison direction and reference direction with the largest candidate size change among the comparison directions, the directional angles corresponding to the comparison direction and reference direction with the largest candidate size change among the comparison directions can be averaged. The average angle obtained is the directional angle corresponding to the stress wave propagation direction. Then, the aforementioned candidate size change determination method is used to determine the target size change of the tested component in the stress wave propagation direction.

[0064] That is, a set of specially made flexible visual marker strips are pasted at specific intervals on the surface of the component under test along the expected propagation direction of the stress wave; a high-speed camera is used to capture image sequences of the strip area during the movement of the mechanism; and an image processing algorithm is used to determine the target size change of the component under test in the direction of stress wave propagation.

[0065] The stress wave parameter analysis method described above selects the reference direction with the largest change in candidate size from among the candidate directions. This allows the determination of the stress wave propagation direction of the tested component based on the change in candidate size in the reference direction, providing a data foundation for subsequent parameter analysis of the tested component and ensuring the smooth progress of subsequent processes.

[0066] In one embodiment, such as Figure 4 As shown, when it is necessary to perform parameter analysis on the tested component based on the target size change of the tested component in the direction of stress wave propagation, and obtain the stress wave parameters of the tested component, the following can be included:

[0067] S401, determine the elastic modulus of the component being tested.

[0068] S402, based on the target size change and the standard size of the measured part, obtain the corresponding relative change of the measured part.

[0069] The target size change is the maximum size change of the tested component in the direction of stress wave propagation; the standard size is the size of the tested component when it is not affected by stress wave.

[0070] In one embodiment of this application, the formula for calculating the relative change of the measured component is as follows:

[0071] ε = ΔW / W0, where W0 is the standard dimension; ΔW is the change in the target dimension; and ε is the relative change of the measured component.

[0072] S403, based on the elastic modulus and relative change, performs parameter analysis on the tested component to obtain the stress wave amplitude value in the stress wave parameters.

[0073] In one embodiment of this application, when it is necessary to perform parameter analysis on the tested component based on the elastic modulus and relative change, the following calculation formula can be used:

[0074] σ = E * (ΔW / W0);

[0075] Where σ is the stress wave amplitude in the stress wave parameters; E refers to the elastic modulus of the measured component; W0 is the standard dimension; and ΔW is the change in the target dimension.

[0076] The stress wave parameter analysis method described above analyzes the parameters of the tested component based on the elastic modulus and relative change, effectively determining the stress wave amplitude. This ensures that subsequent maintenance personnel can accurately analyze the mechanical integrity, fatigue life, and overall system reliability of the tested component based on the stress wave parameters, thus guaranteeing effective testing of the tested component.

[0077] In one embodiment, such as Figure 5 As shown, when it is necessary to perform parameter analysis on the tested component based on the target size change of the tested component in the direction of stress wave propagation to obtain the stress wave parameters of the tested component, the following may also be included:

[0078] S501, obtain the trigger time corresponding to the target size change.

[0079] In one embodiment of this application, the change in the observation range of the measured component can be detected, and the moment when the change in the target size is triggered can be recorded, thereby obtaining the trigger moment corresponding to the triggering of the change in the target size.

[0080] S502, based on the triggering time, performs parameter analysis on the tested component to obtain the stress wave velocity in the stress wave parameters.

[0081] It should be noted that when it is necessary to determine the stress wave velocity in the stress wave parameters, the next observation range is selected along the stress wave transmission direction, and the triggering time corresponding to the size change of the next observation range is recorded. Then, based on the time difference between the triggering time corresponding to the determined observation range and the triggering time corresponding to the next observation range, as well as the interval distance between the observation range and the next observation range, the stress wave velocity in the stress wave parameters is determined.

[0082] Specifically, the formula for calculating the stress wave velocity in the stress wave parameters is as follows:

[0083] C = D_{ij} / ΔT_{ij};

[0084] Where C refers to the stress wave velocity; i refers to the observation range; j refers to the next observation range; D refers to the interval distance; and ΔT refers to the time difference.

[0085] The stress wave parameter analysis method described above analyzes the parameters of the tested component based on the triggering time to obtain the stress wave velocity in the stress wave parameters. This enables the effective determination of the stress wave velocity, ensuring that subsequent maintenance personnel can accurately analyze the mechanical integrity, fatigue life, and overall system reliability of the tested component based on the stress wave parameters, thus guaranteeing effective testing of the tested component.

[0086] In one embodiment, such as Figure 6 As shown, when it is necessary to obtain the stress wave parameters of the component under test, the following can be included:

[0087] S601, obtain the candidate size change of the observation range of the measured component in at least one candidate direction.

[0088] S602, select the reference direction with the largest change in candidate size from all candidate directions.

[0089] S603, if the difference in directional angle between two adjacent candidate directions is not less than a preset threshold, select the two comparison directions with the smallest directional angle difference from the reference direction from each candidate direction.

[0090] S604. Based on the comparison direction and reference direction with the largest candidate size change among the comparison directions, determine the stress wave propagation direction corresponding to the tested component.

[0091] S605, determine the elastic modulus of the component being tested.

[0092] S606: Based on the target size change and the standard size of the measured part, the relative change of the measured part is obtained.

[0093] S607, based on the elastic modulus and relative change, performs parameter analysis on the tested component to obtain the stress wave amplitude value in the stress wave parameters.

[0094] S608, obtain the trigger time corresponding to the target size change.

[0095] S609 performs parameter analysis on the tested component based on the triggering time to obtain the stress wave velocity in the stress wave parameters.

[0096] The aforementioned stress wave parameter analysis method, by acquiring the candidate dimensional changes of the observed component under test in at least one candidate direction, determines the stress wave propagation direction of the component under test based on each candidate dimensional change. Then, based on the target dimensional change of the component under test in the stress wave propagation direction, parameter analysis is performed to obtain the stress wave parameters of the component under test. As can be seen from the above, this application, in the process of stress wave parameter analysis, pre-acquires candidate dimensional changes in at least one candidate direction. Then, based on each candidate dimensional change, it determines the stress wave propagation direction of the component under test from each candidate direction, thereby ensuring the accuracy of subsequent parameter analysis of the component under test and providing a foundation for subsequent parameter analysis. Furthermore, this application performs parameter analysis on the component under test based on the target dimensional change in the stress wave propagation direction, achieving accurate stress wave analysis of the component under test. This ensures that subsequent maintenance personnel can accurately analyze the mechanical integrity, fatigue life, and overall system reliability of the component under test based on the stress wave parameters, guaranteeing effective testing of the component under test.

[0097] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0098] Based on the same inventive concept, this application also provides a stress wave parameter analysis device for implementing the stress wave parameter analysis method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations of one or more stress wave parameter analysis device embodiments provided below can be found in the limitations of the stress wave parameter analysis method described above, and will not be repeated here.

[0099] In one embodiment, such as Figure 7 As shown, a stress wave parameter analysis device is provided, comprising: an acquisition module 10, a determination module 20, and a breakdown module 30, wherein:

[0100] The acquisition module 10 is used to acquire the candidate size change of the observation range of the measured component in at least one candidate direction.

[0101] The determination module 20 is used to determine the stress wave propagation direction corresponding to the tested component based on the change in each candidate dimension.

[0102] Sub-module 30 is used to perform parameter analysis on the tested component based on the target size change of the tested component in the direction of stress wave propagation, and obtain the stress wave parameters of the tested component.

[0103] In one embodiment, the reference direction with the largest candidate size change is selected from all candidate directions;

[0104] The direction of stress wave propagation for the tested component is determined based on the candidate dimensional change in the reference direction.

[0105] In one embodiment, if the directional angle difference between two adjacent candidate directions is not less than a preset threshold, the two comparison directions with the smallest directional angle difference from the reference direction are selected from each candidate direction.

[0106] Based on the comparison direction and reference direction with the largest candidate size change among the comparison directions, the stress wave propagation direction corresponding to the tested component is determined.

[0107] In one embodiment, if the difference in directional angle between two adjacent candidate directions is less than a preset threshold, the reference direction is taken as the stress wave propagation direction corresponding to the component under test.

[0108] In one embodiment, the elastic modulus of the component under test is determined;

[0109] Based on the target size change and the standard size of the measured component, the corresponding relative change of the measured component is obtained;

[0110] Based on the elastic modulus and relative change, the parameters of the tested component are analyzed to obtain the stress wave amplitude value in the stress wave parameters.

[0111] In one embodiment, the triggering time corresponding to the target size change is obtained;

[0112] Based on the triggering time, the parameters of the tested component are analyzed to obtain the stress wave velocity in the stress wave parameters.

[0113] The aforementioned stress wave parameter analysis device, by acquiring the candidate dimensional changes of the observed component under test in at least one candidate direction, determines the stress wave propagation direction corresponding to the component under test based on each candidate dimensional change. Then, based on the target dimensional change of the component under test in the stress wave propagation direction, parameter analysis is performed to obtain the stress wave parameters of the component under test. As can be seen from the above, this application, in the process of stress wave parameter analysis, pre-acquires candidate dimensional changes in at least one candidate direction. Then, based on each candidate dimensional change, it determines the stress wave propagation direction corresponding to the component under test from each candidate direction, thereby ensuring the accuracy of subsequent parameter analysis of the component under test and providing a foundation for subsequent parameter analysis. Furthermore, this application performs parameter analysis on the component under test based on the target dimensional change in the stress wave propagation direction, achieving accurate stress wave analysis of the component under test. This ensures that subsequent maintenance personnel can accurately analyze the mechanical integrity, fatigue life, and overall system reliability of the component under test based on the stress wave parameters, guaranteeing effective testing of the component under test.

[0114] Each module in the aforementioned stress wave parameter analysis device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0115] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 8As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a stress wave parameter analysis method. The display unit is used to form a visually visible image and can be a display screen, projection device, or virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0116] Those skilled in the art will understand that Figure 8 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0117] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions.

[0118] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0119] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0120] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A stress wave parameter analysis method characterized by, The method comprises: obtaining a candidate size change amount of an observation range of a measured component in at least one candidate direction, comprising: for each candidate direction, pasting at least one mark strip along the candidate direction, and using a high-speed camera to capture a region to which the mark strip is pasted; performing image recognition on the captured image, and taking the length change of the mark strip as the candidate size change amount of the measured component in the observation range in the at least one candidate direction; determining a stress wave propagation direction corresponding to the measured component according to each candidate size change amount, comprising: selecting a reference direction with the maximum candidate size change amount from each candidate direction; and determining the stress wave propagation direction corresponding to the measured component according to the candidate size change amount of the reference direction; performing parameter analysis on the measured component according to a target size change amount of the measured component in the stress wave propagation direction, to obtain a stress wave parameter of the measured component, comprising: determining an elastic modulus of the measured component; obtaining a relative change amount corresponding to the measured component according to the target size change amount and a standard size of the measured component, according to the following calculation formula: ε = ΔW / W0; wherein W0 is the standard size, ΔW is the target size change amount, and ε is the relative change amount corresponding to the measured component; the target size change amount is the maximum size change amount of the measured component in the stress wave propagation direction; and the standard size is the size corresponding to the measured component when the measured component is not affected by the stress wave; performing parameter analysis on the measured component according to the elastic modulus and the relative change amount, to obtain a stress wave amplitude in the stress wave parameter, according to the following calculation formula: σ = E * (ΔW / W0); wherein σ is the stress wave amplitude in the stress wave parameter, and E is the elastic modulus of the measured component; selecting a next observation range along the stress wave transmission direction, and recording a trigger time corresponding to the next observation range when the target size change amount triggers; determining a stress wave velocity in the stress wave parameter according to a time difference between a trigger time corresponding to the observation range and a trigger time corresponding to the next observation range, and an interval distance between the observation range and the next observation range, according to the following calculation formula: C = Dij / ΔTij; wherein C is the stress wave velocity, i is the observation range, j is the next observation range, D is the interval distance between the observation range and the next observation range, and ΔT is the time difference between the trigger time corresponding to the observation range and the trigger time corresponding to the next observation range.

2. The method of claim 1, wherein, The method further comprises: in a case where a direction angle difference between two adjacent candidate directions is not less than a preset threshold, selecting two comparison directions with the minimum angle difference from each candidate direction; determining the stress wave propagation direction corresponding to the measured component according to a comparison direction with the maximum candidate size change amount in each comparison direction and the reference direction.

3. The method of claim 1, wherein, The method further comprises: In a case where a difference between direction angles of two adjacent candidate directions is less than a preset threshold, the reference direction is taken as the stress wave propagation direction corresponding to the measured component.

4. The method according to any one of claims 1 to 3, characterized in that, The reference direction with the maximum candidate size change is selected from the candidate directions, including: The candidate directions are sorted according to the candidate size changes from large to small; The candidate direction ranked first is taken as the reference direction with the maximum candidate size change.

5. A stress wave parameter analysis apparatus characterized by comprising: The device comprises: The acquisition module is configured to, for each candidate direction, paste at least one marking strip along the candidate direction, capture an image of the measured region with the marking strip by using a high-speed camera, and perform image recognition on the captured image, so as to take the length change of the marking strip as a candidate size change of the measured component in at least one candidate direction of the observation range. The determination module is configured to select a reference direction with the maximum candidate size change from the candidate directions, and determine the stress wave propagation direction corresponding to the measured component according to the candidate size change of the reference direction. The analysis module is configured to determine the elastic modulus of the measured component, obtain a relative change of the measured component according to a target size change and a standard size of the measured component according to the following calculation formula: ε = ΔW / W0, wherein W0 is the standard size, ΔW is the target size change, and ε is the relative change of the measured component; the target size change is the maximum size change of the measured component in the stress wave propagation direction, and the standard size is the size of the measured component when the measured component is not affected by the stress wave; perform parameter analysis on the measured component according to the elastic modulus and the relative change, and obtain a stress wave amplitude in the stress wave parameter according to the following calculation formula: σ = E*(ΔW / W0), wherein σ is the stress wave amplitude in the stress wave parameter, and E is the elastic modulus of the measured component; select a next observation range along the stress wave transmission direction, record a trigger time corresponding to the target size change of the next observation range, determine a stress wave velocity in the stress wave parameter according to a time difference between a trigger time corresponding to the observation range and a trigger time corresponding to the next observation range and an interval distance between the observation range and the next observation range according to the following calculation formula: C = D_{ij} / ΔT_{ij}, wherein C is the stress wave velocity, i is the observation range, j is the next observation range, D is the interval distance between the observation range and the next observation range, and ΔT is the time difference between the trigger time corresponding to the observation range and the trigger time corresponding to the next observation range.

6. The apparatus of claim 5, wherein, The determination module is specifically configured to, in a case where a difference between direction angles of two adjacent candidate directions is not less than a preset threshold, select two comparison directions with the minimum angle difference from the candidate directions, and determine the stress wave propagation direction corresponding to the measured component according to the comparison direction with the maximum candidate size change in the comparison directions and the reference direction.

7. The apparatus of claim 5, wherein, The device further comprises: The processing module is configured to, in a case where a difference between direction angles of two adjacent candidate directions is less than a preset threshold, take the reference direction as a stress wave propagation direction corresponding to the component under test.

8. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method of any one of claims 1 to 4.

9. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method of any one of claims 1 to 4.

10. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method of any one of claims 1 to 4. The computer program is executed by the processor to implement the steps of the method of any one of claims 1 to 4.

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