High-pressure grouting system and process thereof
By controlling the mold closing pressure and slurry pressure curves through a high-pressure grouting system, the problems of mold leakage and breakage were solved, improving production efficiency and product quality, extending mold life, and reducing manufacturing costs and energy consumption.
Patent Information
- Application Number
- CN202511512588.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-08-11
- Filing Date
- 2025-10-22
- Publication Date
- 2026-01-27
AI Technical Summary
Traditional constant pressure grouting mode leads to grout leakage and mold breakage, affecting production efficiency, product quality and mold life, while increasing manufacturing costs and power consumption.
A high-pressure grouting system is adopted. Through the mold closing pressure device and grouting pipeline, combined with pressure sensor and proportional valve, the mold closing pressure and mud pressure are controlled to increase or decrease according to the set curve, so as to avoid local high pressure and form sealant to fill and prevent grout leakage.
It reduces the risk of mold breakage, reduces slurry leakage, improves production efficiency and product quality, extends mold life, and reduces manufacturing costs and energy consumption.
Smart Images
Figure CN121403545A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of high-pressure grouting technology, and in particular to a high-pressure grouting system and its process. Background Technology
[0002] The existing process involves closing the mold, applying pressure directly to the maximum pressure, and then injecting grout.
[0003] The grouting process involves filling the mold with grout after it is closed. The grouting process is divided into low-pressure grouting (low injection) and high-pressure grouting (high injection). In the low injection stage, it takes time for the grout to flow into and fill the mold cavity, approximately 50-120 seconds. The grouting pressure in the low injection stage is 0.01-0.02 MPa. The mold closing pressure in the low injection stage is 1.6-1.8 MPa. In the high injection stage, the grout pressure is 0.5-0.8 MPa, increasing in a stepwise manner within this range. The mold closing pressure in the high injection stage remains within the 1.6-1.8 MPa range. When the closing pressure drops below 1.6 MPa, the pressure is increased; when it exceeds 1.8 MPa, the pressure is decreased to maintain the pressure within the 1.6-1.8 MPa range.
[0004] Traditional processes apply a pressure of 1.6-1.8 MPa to the mold immediately after mold closing. At this point, the mold cavity is empty, and the only contact surface between molds is the mating surface. This results in the mating surface bearing significant pressure. Damage to the mating surface can easily lead to grout leakage during the injection process. To prevent leakage, the pressure on the contact surface must be increased. While increasing the pressure prevents leakage, the resin cavity is prone to cracking under high pressure. Therefore, increasing the pressure increases the probability and risk of cracking in the mold cavity area, severely interfering with the grouting success rate and mold life. Furthermore, through force transmission, the mold surface in the cavity area also bears significant stress or shear stress. Since this stress is not supported in the cavity area, it creates a pressure on the mold surface in the cavity area that is much greater than that on the mold body itself. Because the mold material is resin and contains internal cavities, the resin mating surfaces and the resin cavity area are damaged under external forces, potentially leading to plastic deformation and fracture.
[0005] Therefore, in traditional constant-pressure grouting methods, grout leakage and mold breakage are common problems, severely impacting production efficiency, product quality, and mold lifespan. Furthermore, the mold closing pressure comes from hydraulic pressure. Higher pressure means larger hydraulic motors and cylinders, increasing manufacturing costs and wasting electrical energy during operation. Summary of the Invention
[0006] To address the issues of mold leakage and mold breakage caused by constant pressure grouting in existing processes, which severely impact production efficiency, product quality, and mold life, a high-pressure grouting system and process are proposed to solve these problems.
[0007] To achieve the above objectives, the present invention provides a high-pressure grouting system for mold grouting, including a mold closing pressure device and grouting pipeline; The mold clamping pressure device includes an oil tank, oil pipeline, hydraulic cylinder, power component, and directional control valve; the inlet of the oil pipeline is connected to the oil tank, and the outlet is connected to the inlet of the hydraulic cylinder; the power component and the directional control valve are respectively connected to the oil pipeline, the power component provides power to the mold clamping pressure device, and the directional control valve controls the direction of oil flow; Grouting pipelines are equipped with grouting nozzles and grouting valves. The grouting nozzles are connected to the grouting ports of the molds, and the grouting valves are used to control the flow of grout and regulate the pressure during the grouting process. The mold closing pressure device applies mold closing pressure to the mold by controlling the hydraulic cylinder, and the grouting pipeline is connected to the grouting port of the mold to inject grout into the mold; The mold clamping pressure device is equipped with a pressure sensor and a pressure regulating device. The pressure sensor and pressure regulating device are respectively connected to the oil pipeline; The pressure sensor is used to monitor the mold closing pressure, and the pressure regulating device is used to adjust the magnitude of the mold closing pressure; A mud pressure sensor is installed on the grouting pipeline to monitor the mud pressure inside the mold.
[0008] Preferably, the mold clamping pressure device is a hydraulic system, and the power components include a motor and a hydraulic pump; The pressure sensor is a hydraulic pressure sensor; the pressure regulating device is a proportional valve.
[0009] A high-pressure grouting process, wherein the high-pressure grouting process is applied to the high-pressure grouting system; The high-pressure grouting process includes the following steps: S1 presets the low-pressure grouting time, high-pressure grouting time, mud pressure, and mold closing pressure before grouting. S2 low-pressure grouting: Slurry is injected into the mold through the grouting pipeline. The grout pressure is first constant and then increases gradually in a curve. During low-pressure grouting, the mold closing pressure is initially constant and then gradually increases along a curve. S3 High-Pressure Grouting: After the preset low-pressure grouting time is completed, the grouting pipeline starts high-pressure grouting. During the high-pressure grouting process, the mud pressure first increases on a curve, then remains constant for multiple stages in the middle, and finally decreases on a curve. The mold clamping pressure initially increases on a curve, then experiences multiple stages of constant pressure in the middle, and finally decreases on a curve. The pre-set high-pressure grouting time for S4 has ended, and grouting is complete. Throughout the process, the slurry pressure inside the mold is monitored by a slurry pressure sensor, the mold closing pressure is monitored by a pressure sensor, and the mold closing pressure is adjusted by a pressure regulating device.
[0010] Preferably, in step S2, the slurry pressure during the low-pressure grouting process is in the range of 0.01-0.02 MPa; the mold closing pressure is 0.08-0.25 MPa.
[0011] Preferably, during low-pressure grouting, the pressure value when the mud pressure is constant is 0.01 MPa; The pressure value increases in the range of 0.01-0.02 MPa during the curve's increasing process.
[0012] Preferably, during low-pressure grouting, the constant pressure for mold closing is 0.08 MPa; The pressure value increases from 0.08 to 0.25 MPa during the curve's increasing process.
[0013] Preferably, in step S3, the mud pressure during the high-pressure grouting process is 0.02-0.6 MPa; The mold closing pressure is 0.25-1.3 MPa.
[0014] Preferably, the mud pressure increases in the range of 0.02-0.45 MPa during the curve increase process; The pressure value during the intermediate multi-stage constant pressure process is 0.45-0.6 MPa; Multi-stage constant pressure includes multiple constant pressure values, with adjacent constant pressure values gradually increasing or decreasing; The pressure value decreases in the range of 0.6-0.1 MPa during the curve's decline process.
[0015] Preferably, the clamping pressure increases in the range of 0.25-1.1 MPa during the curve increase process; The pressure value during the intermediate multi-stage constant pressure process is 1.1-1.3 MPa; Multi-level constant pressure includes multiple constant pressure values, with a gradual increase or decrease between two adjacent constant pressure values; The pressure value decreases in the range of 1.3-0.5 MPa during the curve's decreasing process.
[0016] The beneficial effects of this invention are: 1. In this invention, the slurry pressure inside the mold is monitored by a slurry pressure sensor, and the mold closing pressure is monitored by a pressure sensor, so as to effectively control the grouting pressure and mold closing pressure during low-pressure grouting and high-pressure grouting processes to increase or decrease according to the set pressure curve.
[0017] 2. During the grouting process, when the mold is hollow, a small closing pressure is applied to the mold. At this time, the pressure on the mold mating surface and the hollow part of the mold is very small, causing almost no damage to the mold. As the mold cavity is gradually filled with grout, the grout pressure inside the mold gradually increases, and then the closing pressure is gradually increased. At this point, because the mold is filled with grout and there is no hollow part, it can be considered as a whole. The mold is no longer subject to localized high pressure as in traditional grouting, reducing the risk of mold breakage.
[0018] 3. During the grouting process, when the grout is injected at a low pressure and no pressure is generated in the mold cavity, the mold closing pressure is relatively small. Some of the extremely fine particles in the grout will gradually penetrate into the small area inside the mold mating surface as the water pressure in the mold cavity increases. As the pressure increases, the water is gradually drained and compacted, forming a layer of filling material (sealant filling) on the inner and outer edge areas of the mating surface, effectively preventing grout leakage.
[0019] 4. This invention effectively reduces the risk and occurrence of mold breakage, increases mold lifespan, reduces grout leakage during the grouting process, improves production efficiency and quality, and extends the mold's service life. Simultaneously, the reduced high-pressure grouting pressure means the use of smaller hydraulic motors and cylinders, thereby lowering manufacturing costs and reducing energy waste. Attached Figure Description
[0020] Figure 1 The diagram shows the mud pressure curve and upper and lower limit parameters of the mold clamping pressure in the existing low-pressure grouting technology. Figure 2 The diagram shows the mud pressure curve and upper and lower limit parameters of the mold clamping pressure in the existing high-pressure grouting technology. Figure 3 This is a schematic diagram of the high-pressure grouting system of the present invention; Figure 4 This is a pressure curve diagram of the low-pressure grouting process in Embodiment 1 of the present invention; Figure 5 This is a pressure curve diagram of the high-pressure grouting process in Embodiment 1 of the present invention.
[0021] In the diagram: 1. Mold clamping pressure device; 2. Hydraulic pressure sensor; 3. Proportional valve; 4. Oil tank; 5. Power assembly; 5-1. Motor; 5-2. Hydraulic pump; 6. Directional control valve; 7. Oil pipe; 8. Hydraulic cylinder; 9. Grouting pipe; 10. Mud pressure sensor; 11. Grouting valve; 12. Grouting nozzle; 13. Grouting port; 14. Mold. Detailed Implementation
[0022] To better understand the technical solution of the present invention, the technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0023] like Figure 1-5 As shown, the present invention provides a high-pressure grouting system for mold grouting, including a mold closing pressure device 1 and a grouting pipeline 9; the mold closing pressure device 1 includes an oil tank 4, an oil pipeline 7, a hydraulic cylinder 8, a power component 5, and a directional control valve 6; the inlet of the oil pipeline 7 is connected to the oil tank 4, and the outlet is connected to the inlet of the hydraulic cylinder 8; the power component 5 and the directional control valve 6 are respectively connected to the oil pipeline 9, the power component 5 provides power to the mold closing pressure device 1, and the directional control valve 6 controls the direction of oil flow; the grouting pipeline 9 is equipped with a grouting nozzle 12 and a grouting valve 11, the grouting nozzle 12 being connected to the injection port of the mold 14. Grout inlet 13 and grouting valve 11 are used to control the flow and pressure regulation of grout during the grouting process; mold closing pressure device 1 applies mold closing pressure to mold 14 by controlling hydraulic cylinder 8, and grouting pipeline 9 connects to grout inlet 13 of mold 14 to grout mold 14; mold closing pressure device 1 is equipped with pressure sensor and pressure regulating device; pressure sensor and pressure regulating device are respectively connected to oil pipeline 7; pressure sensor is used to monitor mold closing pressure, and pressure regulating device is used to adjust the magnitude of mold closing pressure; mud pressure sensor 10 is installed on grouting pipeline 7 to monitor mud pressure inside mold 14. Mold closing pressure device 1 is a hydraulic system, power component 5 includes motor 5-1 and hydraulic pump 5-2; pressure sensor is hydraulic pressure sensor 2; pressure regulating device is proportional valve 3.
[0024] A high-pressure grouting process, wherein the high-pressure grouting process is applied to a high-pressure grouting system; The high-pressure grouting process includes the following steps: S1 presets the low-pressure grouting time, high-pressure grouting time, mud pressure, and mold closing pressure before grouting. S2 Low-pressure grouting: Grout is injected into mold 14 through grouting pipe 9. The grout pressure is first constant and then increases gradually in a curve. During low-pressure grouting, the mold closing pressure is initially constant and then gradually increases along a curve. S3 High-Pressure Grouting: After the preset low-pressure grouting time is completed, the grouting pipeline starts high-pressure grouting. During the high-pressure grouting process, the mud pressure first increases on a curve, then remains constant for multiple stages in the middle, and finally decreases on a curve. The mold clamping pressure initially increases on a curve, then experiences multiple stages of constant pressure in the middle, and finally decreases on a curve. The pre-set high-pressure grouting time for S4 has ended, and grouting is complete. Throughout the process, the slurry pressure inside the mold is monitored by a slurry pressure sensor, the mold closing pressure is monitored by a pressure sensor, and the mold closing pressure is adjusted by a pressure regulating device.
[0025] In step S2, the grout pressure during low-pressure grouting is in the range of 0.01-0.02 MPa; the mold closing pressure is 0.08-0.25 MPa. During low-pressure grouting, the constant grout pressure is 0.01 MPa; the pressure increases from 0.01 to 0.02 MPa during the curve increase process. During low-pressure grouting, the constant mold closing pressure is 0.08 MPa. The pressure value increases from 0.08 to 0.25 MPa during the curve's increasing process.
[0026] In step S3, the mud pressure during the high-pressure grouting process is 0.02-0.6 MPa; The mold clamping pressure is 0.25-1.3 MPa. The slurry pressure increases from 0.02-0.45 MPa during the increasing phase of the curve; the pressure during the intermediate multi-stage constant pressure phase is 0.45-0.6 MPa; the multi-stage constant pressure phase includes multiple constant pressure values, with a gradual increase or decrease between adjacent constant pressure values; the pressure during the decreasing phase of the curve decreases from 0.6-0.1 MPa. The mold clamping pressure increases from 0.25-1.1 MPa during the increasing phase of the curve; the pressure during the intermediate multi-stage constant pressure phase is 1.1-1.3 MPa; the multi-stage constant pressure phase includes multiple constant pressure values, with a gradual increase or decrease between adjacent constant pressure values; the pressure during the decreasing phase of the curve decreases from 1.3-0.5 MPa.
[0027] The present invention will now be described in conjunction with specific embodiments.
[0028] Example 1: The mold clamping pressure device 1 is a hydraulic system, including an oil tank 4, a power component 5, a directional control valve 6, a proportional valve 3, an oil pipe 7, a hydraulic cylinder 8, and a hydraulic pressure sensor 2; the power component 5 includes a motor and a hydraulic pump, and the oil pipe 7 includes oil pipe A and oil pipe B.
[0029] In this embodiment, a mud pressure sensor 10 for detecting mud is added during grouting, the digital pressure sensor of the hydraulic mold closing circuit is replaced with an analog pressure sensor, a proportional valve 3 is added to the mold closing hydraulic circuit, the motor is changed to an energy-saving variable frequency motor, and a vector frequency converter is used to control the pressure and flow of the mold closing circuit.
[0030] During the initial low-pressure grouting process, the mold closing pressure device 1 applies a small pressure to the mold 14, approximately 1 / 10 to 1 / 20 of the maximum pressure. After the grout is injected, the grout pressure sensor monitors the grout pressure inside the mold 14, and grouting proceeds according to the grout pressure curve of low-pressure grouting. Simultaneously, the mold closing pressure is gradually increased according to the preset low-pressure grouting mold closing pressure curve. After low-pressure grouting is completed, the grouting mode is switched to high-pressure grouting, and grouting proceeds according to the grout pressure curve of high-pressure grouting. Simultaneously, the mold closing pressure is gradually increased to the maximum mold closing pressure (at which point the maximum mold closing pressure is approximately 1.0-1.3 MPa) according to the preset mold closing pressure curve. After high-pressure grouting has been performed for a certain period of time, the mold closing pressure is gradually reduced to a smaller mold closing pressure.
[0031] In this embodiment, the low-pressure grouting process takes 50-60 seconds, and the high-pressure grouting process takes 610-630 seconds. During the low-pressure grouting process, after the constant pressure of the slurry is completed, the slurry pressure slowly increases from 0.01 MPa to 0.02 MPa. Similarly, after the constant pressure is completed, the mold closing pressure also slowly increases from 0.08 MPa to 0.25 MPa. During the high-pressure grouting process, the slurry pressure first slowly increases to 0.45 MPa, and then enters a multi-stage constant pressure phase. The constant pressure values for the multi-stage phases are 0.45 MPa and 0.5 MPa. The increase from 0.45 MPa to 0.5 MPa is not instantaneous, but rather a gradual increase to 0.5 MPa, followed by a gradual increase from 0.5 MPa to 0.55 MPa, and then a gradual decrease along a curve. During high-pressure grouting, the mold-closing pressure initially increases slowly to 1.1 MPa, then enters a multi-stage constant pressure phase with constant pressure values of 1.1 MPa, 11.5 MPa, and 1.0 MPa. The mold-closing pressure increases gradually from 1.1 MPa to 11.5 MPa, not instantaneously, and decreases gradually from 11.5 MPa to 1.0 MPa, also not instantaneously. The decrease in mold-closing pressure is also gradual. Maintaining constant pressure in both the slurry and the mold-closing pressure during high-pressure grouting improves the stability of the molding process and enhances product quality.
[0032] In this embodiment, the grouting pressure time and pressure parameters, as well as the mold closing pressure time and pressure parameters, are input into the PLC to preset the time and pressure parameters for the entire grouting process, ensuring control over the time and pressure throughout the grouting process. The specific settings for the grouting pressure parameters and mold closing pressure parameters are as follows:
[0033] In this invention, during the grouting process, when the cavity of mold 14 is empty, a small pressure is applied. At this time, the pressure on the mold mating surface and the empty part of mold 14 is very small, causing almost no damage to the mold. As the cavity of mold 14 is gradually filled with slurry, the slurry pressure inside mold 14 gradually increases, and then the mold closing pressure is gradually increased. At this point, because mold 14 is filled with slurry and there is no cavity, it can be considered as a whole. Mold 14 is no longer subject to localized high pressure as in traditional grouting. This reduces the risk of mold 14 breakage. At the same time, because the mold closing pressure is small when the slurry is low and no pressure is generated inside the cavity of mold 14, some extremely fine particles in the slurry will gradually penetrate into the small areas of the inner edge of the mold mating surface of mold 14 along with water during the grouting process as the pressure inside the mold cavity increases. As the pressure increases, the water is gradually drained and compacted, forming a layer of filler (sealant filling) at the inner and outer edge areas of the mating surface, effectively preventing slurry leakage.
[0034] This invention effectively reduces the risk and occurrence of mold 14 breakage, increases the service life of mold 14, reduces grout leakage during the grouting process, improves production efficiency and quality, and extends the service life of mold 14. At the same time, the reduction in high-pressure grouting also means the use of smaller hydraulic motors and cylinders, thereby reducing manufacturing costs and minimizing energy waste.
[0035] While specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and not intended to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope of protection of the claims of the present invention.
Claims
1. A high-pressure grouting system for mold grouting, comprising a mold closing pressure device and grouting pipelines; The mold clamping pressure device includes an oil tank, oil pipeline, hydraulic cylinder, power component, and directional control valve; the inlet of the oil pipeline is connected to the oil tank, and the outlet is connected to the inlet of the hydraulic cylinder; the power component and the directional control valve are respectively connected to the oil pipeline, the power component provides power to the mold clamping pressure device, and the directional control valve controls the direction of oil flow; Grouting pipelines are equipped with grouting nozzles and grouting valves. The grouting nozzles are connected to the grouting ports of the molds, and the grouting valves are used to control the flow of grout and regulate the pressure during the grouting process. The mold closing pressure device applies mold closing pressure to the mold by controlling the hydraulic cylinder, and the grouting pipeline is connected to the grouting port of the mold to inject grout into the mold; Its features are, The mold clamping pressure device is equipped with a pressure sensor and a pressure regulating device. The pressure sensor and pressure regulating device are respectively connected to the oil pipeline; The pressure sensor is used to monitor the mold closing pressure, and the pressure regulating device is used to adjust the magnitude of the mold closing pressure; A mud pressure sensor is installed on the grouting pipeline to monitor the mud pressure inside the mold.
2. The high-pressure grouting system according to claim 1, characterized in that, The mold clamping pressure device is a hydraulic system, and the power components include a motor and a hydraulic pump. The pressure sensor is a hydraulic pressure sensor; the pressure regulating device is a proportional valve.
3. A high-pressure grouting process, characterized in that, The high-pressure grouting process is applied to the high-pressure grouting system according to any one of claims 1-2; The high-pressure grouting process includes the following steps: S1 presets the low-pressure grouting time, high-pressure grouting time, mud pressure, and mold closing pressure before grouting. S2 low-pressure grouting: Slurry is injected into the mold through the grouting pipeline. The grout pressure is first constant and then increases gradually in a curve. During low-pressure grouting, the mold closing pressure is initially constant and then gradually increases along a curve. S3 High-Pressure Grouting: After the preset low-pressure grouting time is completed, the grouting pipeline starts high-pressure grouting. During the high-pressure grouting process, the mud pressure first increases on a curve, then remains constant for multiple stages in the middle, and finally decreases on a curve. The mold clamping pressure initially increases on a curve, then experiences multiple stages of constant pressure in the middle, and finally decreases on a curve. The pre-set high-pressure grouting time for S4 has ended, and grouting is complete. Throughout the process, the slurry pressure inside the mold is monitored by a slurry pressure sensor, the mold closing pressure is monitored by a pressure sensor, and the mold closing pressure is adjusted by a pressure regulating device.
4. The high-pressure grouting process according to claim 3, characterized in that, In step S2, the slurry pressure during the low-pressure grouting process is in the range of 0.01-0.02 MPa; the mold closing pressure is 0.08-0.25 MPa.
5. The high-pressure grouting process according to claim 4, characterized in that, During low-pressure grouting, the pressure value of the slurry under constant pressure is 0.01 MPa; The pressure value increases in the range of 0.01-0.02 MPa during the curve's increasing process.
6. The high-pressure grouting process according to claim 4, characterized in that, During low-pressure grouting, the constant pressure for mold closing is 0.08 MPa; The pressure value increases from 0.08 to 0.25 MPa during the curve's increasing process.
7. The high-pressure grouting process according to claim 3, characterized in that, In step S3, the mud pressure during the high-pressure grouting process is 0.02-0.6 MPa; The mold closing pressure is 0.25-1.3 MPa.
8. The high-pressure grouting process according to claim 7, characterized in that, The mud pressure increased in the range of 0.02-0.45 MPa during the curve's increasing process. The pressure value during the intermediate multi-stage constant pressure process is 0.45-0.6 MPa; Multi-stage constant pressure includes multiple constant pressure values, with adjacent constant pressure values gradually increasing or decreasing; The pressure value decreases in the range of 0.6-0.1 MPa during the curve's decline process.
9. The high-pressure grouting process according to claim 7, characterized in that, The clamping pressure increases in the range of 0.25-1.1 MPa during the curve's increasing process; The pressure value during the intermediate multi-stage constant pressure process is 1.1-1.3 MPa; Multi-level constant pressure includes multiple constant pressure values, with a gradual increase or decrease between two adjacent constant pressure values; The pressure value decreases in the range of 1.3-0.5 MPa during the curve's decreasing process.