Automatic cleaning equipment and cleaning process for wafers

Abstract

The application relates to the technical field of semiconductors, and particularly provides a wafer automatic cleaning device and a cleaning process. The wafer automatic cleaning device comprises a cleaning tank, a cassette and a spraying mechanism. The cassette is placed in the cleaning tank, a plurality of wafers and at least one rotating disc are placed in the cassette, and a plurality of water buckets are arranged on the end surface of the rotating disc; when the spraying rod of the spraying mechanism rotates to the upper side of the cassette, the spraying mechanism sprays cleaning liquid to the cassette; the bottom of the cassette is provided with a rotatable first rotating rod and a rotatable second rotating rod on the two sides, respectively; the side edges of each rotating disc and each wafer are frictionally connected with the first rotating rod and the second rotating rod; the rotating disc rotates under the impact of the cleaning liquid sprayed by the spraying mechanism, so as to drive the first rotating rod and the second rotating rod to rotate, and further drive the wafer to rotate. According to the scheme, the rotating disc is driven to rotate by the impact of the cleaning liquid on the water bucket, the wafer is driven to rotate by the first rotating rod and the second rotating rod, the cleaning blind area is eliminated, and the cleaning effect is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an automated wafer cleaning device and cleaning process. Background Technology

[0002] Wafers are the basic material for manufacturing semiconductor devices, typically thin, circular sheets made of high-purity single-crystal silicon. During wafer fabrication, wafer cleaning is a crucial step in ensuring chip manufacturing quality and performance.

[0003] In existing wafer cleaning technologies, tank cleaning or spray cleaning are commonly used. Tank cleaning uses a single solution to clean multiple wafers simultaneously, which improves cleaning efficiency. However, if any wafer exceeds the contamination limit during the cleaning process, the contaminant can spread laterally, causing contamination or even scrapping of the entire batch of wafers, resulting in significant losses. Furthermore, in tank immersion cleaning, wafers are removed from the liquid surface containing suspended particles, which can easily lead to secondary particle adhesion and contamination. Spray cleaning, due to gravity and surface tension, causes the cleaning solution to easily converge into fixed streams on the wafer, creating wetting blind spots between these streams. Moreover, the vertical gradient of the cleaning solution distribution makes it difficult to evenly cover the wafer. Additionally, during static rinsing, the cleaning solution can easily form a dead water layer on the wafer surface microstructure or contact points, causing cleaning solution stagnation and affecting the cleaning effect. Summary of the Invention

[0004] One objective of this invention is to eliminate blind spots in wafer cleaning and improve cleaning performance.

[0005] Another objective of this invention is to reduce the risk of secondary contamination of wafers during the cleaning process.

[0006] Specifically, the present invention provides an automated wafer cleaning device, comprising: a cleaning tank, a cassette, and a spraying mechanism; the cleaning tank is open at the top and has a liquid outlet at the bottom; the cassette is placed inside the cleaning tank, and multiple partition fins are spaced apart inside the cassette, forming multiple vertical slots for placing wafers or turntables; multiple wafers and at least one turntable are placed in the cassette, and multiple water buckets are provided on the end face of the turntable, arranged radially along the turntable and evenly distributed circumferentially; the spraying mechanism includes a pump body and a rotatable spraying rod connected to the pump body; when the spraying rod rotates to above the cassette, it sprays cleaning fluid onto the cassette; rotatable first and second rotating rods are respectively provided on both sides of the bottom of the cassette, and the sides of each turntable and each wafer are frictionally connected to the first and second rotating rods; the size of the turntable is the same as the size of the wafer, and the turntable rotates under the impact of the cleaning fluid sprayed by the spraying mechanism, thereby driving the first and second rotating rods to rotate, and in turn driving the wafer to rotate.

[0007] Furthermore, multiple fixed friction wheels and multiple rotatable driven wheels are alternately arranged on both the first and second rotating rods; and the multiple friction wheels on the first rotating rod and the multiple driven wheels on the second rotating rod are one-to-one opposite each other; each friction wheel and each driven wheel is opposite to a slot and abuts against a wafer or turntable placed in the opposite slot; the cassette contains at least two turntables, and the number of wafers between any two adjacent turntables is even.

[0008] Furthermore, the friction wheel has friction patterns on its surface, while the driven wheel has a smooth surface.

[0009] Furthermore, any two adjacent turntables rotate in opposite directions.

[0010] Furthermore, a support rod is provided at the bottom of the cartridge, located between the first rotating rod and the second rotating rod; the support rod is equipped with multiple rotatable support wheels for supporting the wafer or turntable.

[0011] Furthermore, a partition is provided above the turntable, and the bottom of the partition has an arc-shaped opening that matches the shape of the turntable; the partition is inserted into the slot where the turntable is located, and the width of the partition is greater than the diameter of the turntable.

[0012] Furthermore, the turntable has a slot on its side and a corresponding locking strip at the opening; the turntable has an annular groove on its end face, a connecting rod is fixedly mounted on the partition, and a sliding post is mounted at the end of the connecting rod, extending into the groove.

[0013] Furthermore, the automated wafer cleaning equipment also includes a clamping mechanism, including a support and grippers that can telescopically move relative to the support, for placing the cartridge into the cleaning tank or removing the cartridge from the cleaning tank.

[0014] Furthermore, the separating fins are wedge-shaped at the edge facing the inside of the cartridge.

[0015] The present invention also provides an automated wafer cleaning process, which uses any of the above-mentioned automated wafer cleaning equipment, including the following steps: controlling the spray bar of the spray mechanism to rotate to a position that avoids the cleaning tank; placing a cassette containing the wafer and a turntable into the cleaning tank; controlling the spray bar to rotate above the cassette and spraying cleaning fluid onto the cassette.

[0016] The beneficial effects of this invention are:

[0017] The automated wafer cleaning equipment of this invention utilizes a turntable equipped with a water tank placed in a slot. When cleaning fluid is sprayed from the spray bar, the fluid impacts the water tank, causing the turntable to rotate. The turntable's size is identical to the wafer's size. As the turntable rotates, it drives a first rotating rod and a second rotating rod in frictional contact with the turntable, thereby causing the wafer in frictional contact with the first and second rotating rods to rotate synchronously. After the cleaning fluid is sprayed onto the cartridge, it flows downwards along the wafer's wall. During this process, the wafer's rotation ensures more comprehensive cleaning, eliminating blind spots. After flowing through the cartridge, the cleaning fluid, carrying away rinsed dirt and impurities, is discharged directly from the outlet at the bottom of the cleaning tank, thus preventing the accumulation of dirty cleaning fluid at the bottom of the cartridge and causing secondary contamination of the wafer.

[0018] Furthermore, the automated wafer cleaning equipment of the present invention, by placing at least two turntables in the cassette, setting the number of wafers between any two adjacent turntables to be even, and setting the rotation directions of any two adjacent turntables to be opposite, makes the rotation directions of the first rotating rod and the second rotating rod opposite, thereby making the rotation directions of any two adjacent wafers opposite. The opposite rotation directions of the two adjacent wafers, on the one hand, prevent the cleaning fluid flowing between the wafers from being carried upwards by the rotation of the wafers, thereby reducing the risk of secondary contamination of the wafers; on the other hand, it generates shear stress in the cleaning fluid between the two adjacent wafers, thereby improving cleaning efficiency and cleaning effect.

[0019] The automated wafer cleaning process of the present invention, since it is applied to the aforementioned automated wafer cleaning equipment, also possesses the beneficial technical effects of the aforementioned automated wafer cleaning equipment. Attached Figure Description

[0020] The following sections will describe some specific embodiments of the invention in a detailed manner, by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. In the drawings:

[0021] Figure 1 This is a schematic diagram of an automated wafer cleaning device according to an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the structure of a wafer cassette according to an embodiment of the present invention;

[0023] Figure 3 yes Figure 2 A schematic enlarged view of region A in the middle;

[0024] Figure 4 This is a schematic diagram of the wafer cassette from another angle according to an embodiment of the present invention;

[0025] Figure 5It is along Figure 4 A schematic cross-sectional view taken by the cutting line BB in the diagram;

[0026] Figure 6 yes Figure 5 A schematic enlarged view of region C in the middle;

[0027] Figure 7 It is along Figure 5 A schematic cross-sectional view cut by the section line DD in the diagram;

[0028] Figure 8 yes Figure 7 A schematic enlarged view of region E in the middle;

[0029] Figure 9 yes Figure 7 A schematic enlarged view of the central region F;

[0030] Figure 10 This is a schematic diagram of the structure of the first rotating rod and the second rotating rod of a wafer according to an embodiment of the present invention;

[0031] Figure 11 This is a schematic diagram of the structure of the wafer turntable and separator according to an embodiment of the present invention;

[0032] Figure 12 This is a schematic diagram of the wafer's turntable and separator from another angle, according to an embodiment of the present invention.

[0033] Figure 13 This is a schematic diagram of the structure of a wafer separator according to an embodiment of the present invention;

[0034] Figure 14 This is a schematic flowchart of an automated wafer cleaning process according to an embodiment of the present invention.

[0035] in:

[0036] 100. Cleaning tank; 110. Liquid outlet; 200. Casing; 210. Separator fin; 211. Slot; 220. Wafer; 230. Turntable; 231. Water tank; 232. Slot; 233. Slide groove; 240. First rotating rod; 241. Friction wheel; 242. Driven wheel; 250. Second rotating rod; 260. Support rod; 261. Support wheel; 270. Partition plate; 271. Locking strip; 272. Connecting rod; 273. Sliding column; 280. Support plate; 281. Positioning groove; 300. Spraying mechanism; 310. Pump body; 320. Spraying rod; 400. Clamping mechanism; 410. Bracket; 420. Gripper. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0038] The terms "first" and "second" used herein are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0039] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0040] The following reference Figures 1 to 14 This invention describes an automated wafer cleaning device and cleaning process.

[0041] This embodiment first provides an automated wafer cleaning device. The automated wafer cleaning device generally includes: a cleaning tank 100, a cassette 200, and a spray mechanism 300.

[0042] The cleaning tank 100 is open at the top and has a liquid outlet 110 at the bottom. A cartridge 200 is placed inside the cleaning tank 100. Multiple partition fins 210 are spaced apart inside the cartridge 200, forming multiple vertical slots 211 for placing wafers 220 or turntables 230. The cartridge 200 holds multiple wafers 220 and at least one turntable 230. Multiple water buckets 231 are arranged radially along the turntable 230 and evenly distributed circumferentially. The spraying mechanism 300 includes a pump body 310 and a rotatable spray bar 320 connected to the pump body 310. When the spray bar 320 rotates above the cartridge 200, it sprays cleaning fluid onto the cartridge 200. The bottom of the cartridge 200 has a rotatable first rotating rod 240 and a second rotating rod 250 on both sides. The sides of each turntable 230 and each wafer 220 are frictionally connected to the first rotating rod 240 and the second rotating rod 250. The size of the turntable 230 is the same as that of the wafer 220. The turntable 230 rotates under the impact of the cleaning fluid sprayed by the spray mechanism 300, thereby driving the first rotating rod 240 and the second rotating rod 250 to rotate, and in turn driving the wafer 220 to rotate.

[0043] like Figure 1 As shown, the length, width, and height of the cleaning tank 100 are all larger than the dimensions of the cartridge 200 to prevent cleaning fluid leakage during spraying. Two rows of partition fins 210 are symmetrically arranged on both sides of the cartridge 200, forming two rows of symmetrical slots 211 on both sides of the cartridge 200. The symmetrical slots 211 together hold the wafer 220 or the turntable 230, resulting in better structural stability when the turntable 230 or the wafer 220 is placed in the cartridge 200. The pump body 310 of the spraying mechanism 300 is located on the side of the cleaning tank 100 and is used to deliver the cleaning fluid upwards. A rotatable spray rod 320 is connected to the top of the pump body 310, and the spray rod 320 is higher than the cleaning tank 100. When the spray rod 320 rotates above the cartridge 200, it sprays the cleaning fluid downwards. After flowing through the cartridge 200, the cleaning fluid flows to the bottom of the cleaning tank 100 and is then discharged through the outlet 110 at the bottom of the cleaning tank 100. Multiple spray nozzles (not shown in the figure) may be spaced apart on the spray bar 320, and the multiple spray nozzles spray cleaning liquid downward in a fan shape. In some embodiments, the liquid outlet 110 may be provided with a control valve, and the cleaning liquid discharged through the liquid outlet 110 can be treated and recycled.

[0044] In this embodiment, a turntable 230 with a water tank 231 is placed in the slot 211. When the spray bar 320 sprays cleaning fluid, the cleaning fluid impacts the water tank 231, causing the turntable 230 to rotate. The size of the turntable 230 is the same as that of the wafer 220. When the turntable 230 rotates, it drives the first rotating rod 240 and the second rotating rod 250, which are in frictional contact with it, to rotate, thereby causing the wafer 220, which is in frictional contact with the first rotating rod 240 and the second rotating rod 250, to rotate. After the cleaning fluid is sprayed onto the cartridge 200, it flows downward along the wall of the wafer 220. During this process, the rotation of the wafer 220 makes the cleaning fluid more thorough in cleaning the wafer 220, eliminating cleaning blind spots. After the cleaning fluid flows through the cartridge 200, the dirt and impurities washed away are directly discharged from the outlet 110 at the bottom of the cleaning tank 100, thereby avoiding the accumulation of dirty cleaning fluid at the bottom of the cartridge 200 and causing secondary contamination to the wafer 220.

[0045] Furthermore, in this embodiment, by setting up a turntable 230, the space within the cartridge 200 is isolated and partitioned, so that multiple wafers 220 in the cartridge 200 are located in different areas, thereby reducing the risk of lateral diffusion of contaminants and preventing all wafers 220 in the cartridge 200 from being contaminated or scrapped.

[0046] Cleaning solutions commonly used include SC-1 cleaning solution (APM), SC-2 cleaning solution (HPM), diluted hydrofluoric acid, organic solvents, and other reagents. If a motor or other drive unit is used to rotate the wafer 220, it not only increases production costs but also poses safety hazards. The solution in this embodiment utilizes the spraying of the cleaning solution to drive the rotation of the turntable 230, thereby rotating the wafer 220. This design is not only compact and cost-effective but also offers a higher safety factor, greater practicality, and easier adoption. The turntable 230 is made of a material resistant to cleaning solutions, such as the same material used for the wafer 220.

[0047] The number of turntables 230 can be set according to actual needs. More turntables 230 provide more power to rotate the first rotating rod 240 and the second rotating rod 250, resulting in more powerful rotation of the wafer 220. However, this also increases the number of slots 211 occupied by the turntables 230, reducing the number of wafers 220 that can be placed in the cassette 200, thus lowering cleaning efficiency. Conversely, fewer turntables 230 allow for more wafers 220 to be placed in the cassette 200, but this reduces the rotational power and speed of the wafers 220, potentially worsening the cleaning effect. Operators can adjust the number of turntables 230 and wafers 220 by comprehensively considering both cleaning efficiency and cleaning effect.

[0048] In some preferred embodiments, a support plate is provided at the bottom of the cleaning tank 100, and symmetrical support plates 280 can be provided at the bottom of the cartridge 200. The support plates 280 of the cartridge 200 are placed on the support plate, so that the lowest point of the wafer 220 in the cartridge 200 is higher than the bottom of the cleaning tank 100, thereby preventing secondary contamination of the wafer 220 by the cleaning fluid accumulating at the bottom of the cleaning tank 100 when the cleaning fluid is not discharged in time. A positioning groove 281 can be provided on the support plate 280, and a positioning protrusion corresponding to the positioning groove 281 can be provided on the top surface of the support plate, thereby improving the positioning accuracy of the cartridge 200 in the cleaning tank 100.

[0049] In some embodiments, the spraying mechanism 300 may include a plurality of spraying rods 320, which spray the cartridge 200 from above at multiple angles.

[0050] Multiple fixed friction wheels 241 and multiple rotatable driven wheels 242 are alternately arranged on both the first rotating rod 240 and the second rotating rod 250. The friction wheels 241 on the first rotating rod 240 and the driven wheels 242 on the second rotating rod 250 are one-to-one opposite each other. Each friction wheel 241 and each driven wheel 242 is opposite to a slot 211 and abuts against a wafer 220 or turntable 230 placed in the opposite slot 211. The cassette 200 contains at least two turntables 230, and the number of wafers 220 between any two adjacent turntables 230 is even.

[0051] In this embodiment, by setting alternating friction wheels 241 and driven wheels 242 on the first rotating rod 240 and the second rotating rod 250, and setting the order of the friction wheels 241 and driven wheels 242 on the first rotating rod 240 to be opposite to that on the second rotating rod 250, half of the wafers 220 in the cassette 200 are driven to rotate by the first rotating rod 240, and the other half of the wafers 220 are driven to rotate by the second rotating rod 250. The cassette 200 contains at least two turntables 230, and the number of wafers 220 between any two adjacent turntables 230 is even, ensuring that the first rotating rod 240 and the second rotating rod 250 are each frictionally connected to at least one turntable 230 (i.e., the first rotating rod 240 and the second rotating rod 250 are driven separately by different power sources), making the overall rotation of the wafers 220 more stable and powerful.

[0052] The friction wheel 241 has friction patterns on its surface, while the driven wheel 242 has a smooth surface.

[0053] In this embodiment, by setting friction patterns on the surface of the friction wheel 241, the coefficient of friction between the turntable 230 or wafer 220 and the friction wheel 241 is increased, thereby reducing the risk of slippage and ensuring power transmission efficiency. The surface of the driven wheel 242 is made smooth, reducing the coefficient of friction between the turntable 230 or wafer 220 and the driven wheel 242, thereby reducing friction loss and lowering noise and vibration.

[0054] Any two adjacent turntables 230 rotate in opposite directions.

[0055] like Figure 5 As shown, the water tanks 231 on any two adjacent turntables 230 face each other or are opposite to each other, so that the two adjacent turntables 230 rotate in opposite directions under the impact of the cleaning fluid.

[0056] In this embodiment, the rotation directions of any two adjacent turntables 230 are set to be opposite, making the rotation directions of the first rotating rod 240 and the second rotating rod 250 opposite, thereby making the rotation directions of any two adjacent wafers 220 opposite. The opposite rotation directions of the two adjacent wafers 220 have two advantages: firstly, it prevents the cleaning fluid flowing between the wafers 220 from being carried upwards by the rotation of the wafers 220, thus reducing the risk of secondary contamination of the wafers 220; secondly, it generates shear stress in the cleaning fluid between the two adjacent wafers 220, thereby improving cleaning efficiency and cleaning effect.

[0057] A support rod 260 is also provided at the bottom of the cartridge 200, and the support rod 260 is located between the first rotating rod 240 and the second rotating rod 250. The support rod 260 is provided with a plurality of rotatable support wheels 261 for supporting the wafer 220 or the turntable 230.

[0058] In this embodiment, a support rod 260 is provided at the bottom of the cartridge 200, and multiple rotatable support wheels 261 are provided on the support rod 260. The support wheels 261 support the wafer 220 or the turntable 230, so that the bottom of the wafer 220 and the turntable 230 form a three-point support, thereby improving the structural stability of the wafer 220 and the turntable 230 and making the rotation of the wafer 220 and the turntable 230 smoother.

[0059] Preferably, the surface of the support wheel 261 is smooth to reduce frictional losses when the turntable 230 and the wafer 220 rotate.

[0060] A partition 270 is provided above the turntable 230, and the bottom of the partition 270 has an arc-shaped opening adapted to the shape of the turntable 230. The partition 270 is inserted into the slot 211 where the turntable 230 is located, and the width of the partition 270 is greater than the diameter of the turntable 230.

[0061] In this embodiment, a partition 270 is provided above the turntable 230, and an arc-shaped opening adapted to the shape of the turntable 230 is provided at the bottom of the partition 270. This allows the partition 270 to better cooperate with the turntable 230 when it is inserted into the slot 211 where the turntable 230 is located, thus isolating and partitioning the space inside the cartridge 200. This prevents the cleaning fluid from splashing across the turntable 230 to the adjacent area and causing secondary pollution to the adjacent area.

[0062] Furthermore, in this embodiment, the width of the partition 270 is set to be greater than the diameter of the turntable 230, so that the isolation effect of the partition 270 is better.

[0063] The turntable 230 has a slot 232 on its side and a corresponding retaining strip 271 at its opening. The end face of the turntable 230 has an annular groove 233. A connecting rod 272 is fixedly mounted on the partition plate 270. A sliding post 273 is provided at the end of the connecting rod 272 and extends into the groove 233.

[0064] In this embodiment, by providing a slot 232 and a slide groove 233 on the turntable 230, and corresponding locking strips 271 and sliding posts 273 on the partition 270, the turntable 230 and the partition 270 are connected together. This not only improves the separation effect of the turntable 230 and the partition 270 on the cartridge 200, but also makes it easier to place and remove the turntable 230 and the partition 270 from the slot 211. Furthermore, the cooperation between the slot 232 and the locking strip 271, and the cooperation between the sliding post 273 and the slide groove 233, makes the rotation of the turntable 230 relative to the partition 270 smoother.

[0065] Automated wafer cleaning equipment may also generally include a gripping mechanism 400. The gripping mechanism 400 includes a support 410 and grippers 420 that are telescopically movable relative to the support 410 for placing the cartridge 200 into the cleaning tank 100 or removing the cartridge 200 from the cleaning tank 100.

[0066] In this embodiment, by setting up a clamping mechanism 400, the operator controls the operation of the clamping mechanism 400 and uses the retractable and movable gripper 420 to pick up and put the cartridge 200 in the cleaning tank 100. This not only makes the operation simple and stable, but also avoids secondary pollution caused by manual picking and putting, and reduces the safety risks to the operator.

[0067] The edge of the separator 210 facing the inside of the cartridge 200 is wedge-shaped.

[0068] In this embodiment, the edge of the separator 210 facing the inside of the cartridge 200 is set as a wedge shape, which makes it easier and less strenuous to pick up and put in the turntable 230, wafer 220 and partition 270 in the slot 211, and also improves the structural stability of the turntable 230, wafer 220 and partition 270 in the slot 232.

[0069] The specific working process of the automated wafer cleaning equipment provided by the present invention will be described in conjunction with the above embodiments:

[0070] First, place the wafer 220 and turntable 230 to be cleaned into the cassette 200, and then place the cassette 200 into the cleaning tank 100 by controlling the clamping mechanism 400.

[0071] Then, the shower rod of the control shower mechanism is rotated to the top of the cartridge 200, and then the cleaning fluid is sprayed into the cartridge 200.

[0072] The cleaning fluid flows from top to bottom into the cartridge 200. Under the impact of the cleaning fluid, the turntable 230 in the cartridge 200 rotates, and then, through friction, drives the first rotating rod 240 and the second rotating rod 250 to rotate, thereby causing the wafer 220 to rotate. After flowing through the turntable 230 and the wafer 220, the cleaning fluid flows to the bottom of the cleaning tank 100 and is discharged through the outlet 110.

[0073] After the spray bar 320 has been spraying for a preset time, the spray bar 320 stops spraying and rotates to a position to avoid the cleaning tank 100.

[0074] Finally, the clamping mechanism 400 is controlled to remove the cartridge 200 from the cleaning tank 100.

[0075] This embodiment also provides an automated wafer cleaning process, using any of the above-mentioned automated wafer cleaning equipment, including the following steps:

[0076] In step S100, the spray rod 320 of the spray mechanism 300 is rotated to a position that avoids the cleaning tank 100.

[0077] In step S200, the cassette 200 containing the wafer 220 and the turntable 230 is placed into the cleaning tank 100.

[0078] In step S300, control the spray bar 320 to rotate above the cartridge 200 and spray cleaning fluid onto the cartridge 200.

[0079] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. An automated wafer cleaning device, characterized in that, include: The cleaning tank has an open top and a liquid outlet at the bottom; A cartridge is placed in the cleaning tank. Multiple partition fins are spaced apart in the cartridge, forming multiple vertical slots for placing wafers or turntables. The cartridge contains multiple wafers and at least one turntable. Multiple water buckets are provided on the end face of the turntable, arranged radially along the turntable and evenly distributed circumferentially. The spraying mechanism includes a pump body and a rotatable spraying rod connected to the pump body; when the spraying rod rotates to above the cartridge, it sprays cleaning fluid onto the cartridge. The bottom of the cartridge is provided with a rotatable first rotating rod and a second rotating rod on both sides, and the side of each turntable and each wafer is frictionally connected to the first rotating rod and the second rotating rod. The size of the turntable is the same as the size of the wafer. The turntable rotates under the impact of the cleaning liquid sprayed by the spraying mechanism, thereby driving the first rotating rod and the second rotating rod to rotate, and in turn driving the wafer to rotate. Multiple fixed friction wheels and multiple rotatable driven wheels are alternately arranged on the first rotating rod and the second rotating rod; and the multiple friction wheels on the first rotating rod and the multiple driven wheels on the second rotating rod are one-to-one opposite each other. Each of the friction wheels and each of the driven wheels is opposite to one of the slots and abuts against the wafer or the turntable placed in the opposite slot; The cartridge contains at least two of the turntables, and the number of wafers between any two adjacent turntables is an even number.

2. The automated wafer cleaning equipment according to claim 1, characterized in that, The friction wheel has friction patterns on its surface, while the driven wheel has a smooth surface.

3. The automated wafer cleaning equipment according to claim 1, characterized in that, Any two adjacent turntables rotate in opposite directions.

4. The automated wafer cleaning equipment according to claim 1, characterized in that, The bottom of the cartridge is also provided with a support rod, which is located between the first rotating rod and the second rotating rod; the support rod is provided with a plurality of rotatable support wheels for supporting the wafer or the turntable.

5. The automated wafer cleaning equipment according to claim 1, characterized in that, A partition is provided above the turntable, and the bottom of the partition has an arc-shaped opening adapted to the shape of the turntable; The partition is inserted into the slot where the turntable is located, and the width of the partition is greater than the diameter of the turntable.

6. The automated wafer cleaning equipment according to claim 5, characterized in that, The turntable has a slot on its side and a corresponding locking strip at the opening; the turntable has an annular groove on its end face and a connecting rod is fixedly mounted on the partition. The end of the connecting rod has a sliding post that extends into the groove.

7. The automated wafer cleaning equipment according to claim 1, characterized in that, Also includes: The clamping mechanism includes a support and a gripper that is telescopically movable relative to the support for placing the cartridge into the cleaning tank or removing the cartridge from the cleaning tank.

8. The automated wafer cleaning equipment according to claim 1, characterized in that, The dividing fin is wedge-shaped at its edge facing the inside of the cartridge.

9. An automated cleaning process for wafers, characterized in that, The automated wafer cleaning equipment according to any one of claims 1 to 8 includes the following steps: Control the spray bar of the spraying mechanism to rotate to a position that avoids the cleaning tank; The cassette containing the wafer and the turntable is placed into the cleaning tank; Control the spray bar to rotate above the cartridge and spray cleaning fluid onto the cartridge.

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