A dual one-way valve based open structure MEMS actuated cooling chip

Abstract

The application provides a MEMS actuating cooling chip based on a double one-way valve open structure, and belongs to the technical field of micro-electro-mechanical systems. The cooling chip comprises a vibration assembly, a driving assembly and a sealing film. The vibration assembly comprises a vibration layer, the vibration layer comprises a central vibration piece and connecting pieces, and the connecting pieces are arranged on the outer circumferential side of the central vibration piece. The driving assembly is configured to drive the vibration assembly to vibrate, the driving assembly comprises a first substrate and a second substrate, the first substrate is configured in a ring shape, the connecting pieces are connected to the first side of the first substrate, the second substrate is arranged on the second side of the first substrate to enclose the first substrate and the second substrate to form a cooling cavity, the first substrate is provided with a first opening, and the second substrate is provided with a second opening. The sealing film can seal the gap between two adjacent connecting pieces. When the driving assembly drives the vibration layer to vibrate, the cooling cavity can suck in fluid through the first opening and spray out fluid through the second opening. The application has high heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of microelectromechanical systems (MEMS) technology, and in particular to an open-structure MEMS actuation and cooling chip based on dual one-way valves. Background Technology

[0002] As semiconductor devices evolve towards smaller size, higher integration, and greater power density, thermal management has become a core bottleneck restricting the performance improvement and reliability of electronic devices. For example, the power density of SoC (System-on-Chip) chips in high-end smartphones has exceeded 100W / cm², and traditional passive heat dissipation (such as heat sinks and thermal paste) is difficult to dissipate heat quickly, leading to risks of thermal throttling, performance degradation, or even burnout. Meanwhile, devices such as CPUs (Central Processing Units) and GPUs (Graphics Processing Units) in data center servers are exposed to high-temperature environments for extended periods, which not only increases energy consumption but also shortens their lifespan.

[0003] MEMS (Micro-Electro-Mechanical System) synthetic jet cooling technology has become a research hotspot in the field of active cooling due to its advantages such as "no moving parts wear, small size, and high heat transfer efficiency." Traditional MEMS cooling chips typically employ a fully enclosed actuator structure, which compresses gas within the cavity through reciprocating vibration of the actuator, generating pulsating airflow that impacts the hot surface. However, this type of technology faces key technical challenges in practical applications, including limited actuator displacement, insufficient heat dissipation efficiency, poor airflow directionality, high energy loss, and difficulties in process compatibility and integration.

[0004] Therefore, there is an urgent need to develop a MEMS cooling chip that combines "large displacement actuation structure, efficient directional airflow control, and CMOS process compatibility" to solve the problems of low heat dissipation efficiency, high integration difficulty, and high cost of related technologies, and promote the large-scale application of MEMS active heat dissipation technology in consumer electronics, data centers and other fields. Summary of the Invention

[0005] This invention provides an open-structure MEMS actuated cooling chip based on dual one-way valves, the purpose of which is to improve the heat dissipation efficiency of the cooling chip by the large displacement of the central vibrating element.

[0006] To achieve the above objectives, the present invention provides an open-structure MEMS actuation and cooling chip based on dual one-way valves, comprising:

[0007] A vibration assembly includes a vibration layer, the vibration layer including a central vibrating element and connecting elements, the number of connecting elements being multiple, and the multiple connecting elements being disposed on the outer periphery of the central vibrating element;

[0008] A driving component is configured to drive the vibration component to vibrate. The driving component includes a first substrate and a second substrate. The first substrate is configured as an annular shape. The side of the connector away from the central vibration component is connected to a first side of the first substrate. The second substrate covers a second side of the first substrate so that the first substrate and the second substrate enclose a cooling cavity. The first substrate has a first opening, and the second substrate has a second opening. The first opening, the cooling cavity, and the second opening are interconnected.

[0009] A sealing membrane is disposed on the side of the vibration assembly away from the first substrate so that the sealing membrane can seal the gap between two adjacent connectors. When the driving assembly drives the vibration layer to vibrate, the cooling chamber can draw in fluid through the first opening and eject the fluid through the second opening so that the fluid flows through the heat source.

[0010] In one embodiment, the cooling chip includes a first valve and a second valve. The first valve is disposed at the first opening and is configured to allow fluid to flow only from the outside to the cooling chamber. The second valve is disposed at the second opening and is configured to allow fluid to flow only from the cooling chamber to the outside.

[0011] In one embodiment, the first valve is located on the side of the first opening close to the cooling chamber, and the first valve is bent toward the cooling chamber; the second valve is located on the side of the second opening away from the cooling chamber, and the second valve is bent toward the outside.

[0012] In one embodiment, the second opening is located at the edge of the second substrate to maximize the distance between the second opening and the first opening.

[0013] In one embodiment, both the first opening and the second opening are configured to be rectangular.

[0014] In one embodiment, the vibration component includes a first driving layer and a second driving layer, the vibration layer being disposed between the first driving layer and the second driving layer, the second driving layer being connected to the first substrate, the second substrate having an integrated driving circuit, and the first substrate having interconnect vias to electrically connect the driving component to the vibration component to drive the central vibrating element to vibrate, wherein the projection of the interconnect vias on the second substrate is located at the edge of the projection of the connector on the second substrate.

[0015] In one embodiment, the first driving layer is configured in a comb-like shape, and the projection of the comb-like first driving layer onto the second substrate is located within the range of the projection of the connector onto the second substrate.

[0016] In one embodiment, the drive assembly includes a spacer ring made of borosilicate glass, the spacer ring being disposed between the first substrate and the second substrate, and the spacer ring also having the interconnect vias.

[0017] In one embodiment, the material of the first substrate is configured as a high-resistivity silicon material.

[0018] In one embodiment, the sealing membrane is configured as a PDMS membrane.

[0019] The above-described solution of the present invention has the following beneficial effects:

[0020] In this embodiment, multiple connectors are disposed on the outer periphery of the central vibrating element. The side of the connectors away from the central vibrating element is connected to the first substrate, making the vibrating layer and the first substrate form an open structure, breaking the vibration constraint of traditional fully enclosed actuators in related technologies. The relatively small vibration constraint of the vibrating layer itself allows for a larger vibration amplitude under the same driving voltage. When the driving voltage of the vibrating layer is 35V, the maximum axial displacement of the central vibrating element on the first substrate can be greater than or equal to 5μm, which is more than 60% higher than that of the traditional structure. The larger displacement of the vibrating layer increases the compression or expansion amplitude of the fluid in the cooling cavity, thereby increasing the flow velocity of the fluid ejected from the second opening. The flow velocity of the fluid ejected from the second opening can be greater than or equal to 3m / s, providing sufficient airflow power for efficient heat dissipation of the heat source, which is beneficial to improving the heat dissipation efficiency of the cooling chip. Furthermore, the first opening is far from the heat source, resulting in a lower temperature of the fluid entering the cooling chamber through the first opening. After entering the cooling chamber through the first opening, the fluid is ejected from the second opening, which is closer to the heat source. This allows the cooling chip to form a directional airflow to dissipate heat from the heat source, significantly improving heat dissipation efficiency.

[0021] Other beneficial effects of the present invention will be described in detail in the following detailed description section. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the cooling chip structure in one embodiment of the present invention, where the sealing film is not shown;

[0023] Figure 2 This is a schematic diagram of the structure of a vibration assembly in one embodiment of the present invention;

[0024] Figure 3 for Figure 2Enlarged structural diagram at point A;

[0025] Figure 4 This is a schematic diagram of the cooling chip structure in one embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram illustrating the heat dissipation process of the cooling chip on the heat source in one embodiment of the present invention, wherein, Figure 5 (a) shows the state of the cooling chip when fluid is ejected. Figure 5 (b) shows the state of the cooling chip when it is drawing in fluid.

[0027] [Explanation of Labels in the Attached Image]

[0028] 100. Cooling chip; 1. Vibration assembly; 11. Vibration layer; 111. Central vibrating element; 112. Connector; 12. First driving layer; 13. Second driving layer; 2. Driving assembly; 21. First substrate; 211. First opening; 22. Second substrate; 221. Second opening; 23. Spacer ring; 24. Cooling cavity; 3. Sealing film; 4. First valve; 5. Second valve; 6. Encapsulation layer; 200. Heat source. Detailed Implementation

[0029] To make the technical problems, solutions, and advantages of this invention clearer, a detailed description will be provided below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention. Furthermore, the technical features involved in the different embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0030] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a locking connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] In related technologies, the vibration boundary of traditional fully enclosed actuators is constrained by the overall structure, resulting in small vertical displacement. This limits the compression / expansion range of the gas within the cavity, making it difficult to increase the airflow velocity and effectively disturb the thermal boundary layer. This is particularly problematic for high-power-density devices, where heat dissipation is significantly insufficient. Furthermore, most MEMS cooling chips employ a single opening or non-directional airflow design, causing some airflow to flow back into the cavity, resulting in a low proportion of effective heat dissipation airflow and significant energy loss. The few designs using one-way valves also require an additional drive structure to control the switch because the valve material has the same thermal expansion coefficient as the substrate, increasing circuit complexity and power consumption.

[0033] In view of this, existing MEMS cooling chip actuators suffer from limited displacement and poor airflow directionality. This application provides a MEMS cooling chip based on an open-type fan-shaped actuator, achieving a synergistic design of "large displacement vibration - directional airflow circulation" through structural innovation and process optimization. The cooling chip of this application is suitable for efficient heat dissipation in compact electronic devices such as high-performance computing chips, 5G RF modules, and artificial intelligence accelerators.

[0034] Specifically, please refer to Figure 1 , Figure 2 and Figure 4 The cooling chip 100 includes a vibration component 1, a drive component 2, and a sealing membrane 3.

[0035] Vibration assembly 1 includes a vibration layer 11, which includes a central vibrating element 111 and a connecting element 112. (See also...) Figure 2 The central vibrating element 111 can be configured as circular, and the connecting element 112 can be configured as elongated strip. There can be multiple connecting elements 112, for example, three. Multiple connecting elements 112 are disposed on the outer periphery of the central vibrating element 111 so that the shape of the vibrating layer 11 is similar to that of a fan blade.

[0036] The driving component 2 is configured to drive the vibration component 1 to vibrate. The driving component 2 includes a first substrate 21 and a second substrate 22. (See also...) Figure 1 and Figure 4The first substrate 21 is configured as a ring. A connector 112, located away from the central vibrator 111, is connected to a first side of the first substrate 21 along its own axial direction, allowing the vibrating layer 11 to be connected to the first side of the first substrate 21. A second substrate 22 covers a second side of the first substrate 21 along its own axial direction, so that the first substrate 21 and the second substrate 22 enclose a cooling cavity 24. For example, the projection of the central vibrator 111 onto the second substrate 22 is within the area enclosed by the projections of the first substrate 21 onto the second substrate 22. The second substrate 22 is disposed on the side of the first substrate 21 closer to the heat source 200, i.e., the second substrate 22 is closer to the heat source 200. The heat source 200 can be an electronic component capable of generating significant heat under normal operating conditions. A first opening 211 is formed on the first substrate 21. The opening direction of the first opening 211 can be parallel to the second substrate 22. A second opening 221 is formed on the second substrate 22. The opening direction of the second opening 221 can be parallel to the axial direction of the first substrate 21. The first opening 211, the cooling cavity 24, and the second opening 221 are interconnected.

[0037] Please see Figure 4 The sealing film 3 is disposed on the side of the vibration assembly 1 away from the first substrate 21, so that the sealing film 3 can seal the gap between two adjacent connectors 112. For example, the sealing film 3 can seal the first side of the first substrate 21 to improve the sealing performance of the cooling cavity 24 near the vibration assembly 1. When the driving assembly 2 drives the vibration layer 11 to vibrate, the cooling cavity 24 can draw in fluid through the second opening 221 and eject fluid through the second opening 221, so that the fluid flows through the heat source 200 to dissipate heat from the heat source 200. For example, please refer to Figure 5 (b) When the driving assembly 2 drives the central vibrating element 111 of the vibrating layer 11 to bulge upward (the sealing membrane 3 can adaptively deform), the volume of the cooling chamber 24 expands, creating a negative pressure inside the cooling chamber 24. A fluid with a lower external temperature, such as air, can then enter the cooling chamber 24 from the first opening 211, which is farther from the heat source 200. (See also...) Figure 5 (a) When the drive assembly 2 drives the central vibrating element 111 of the vibration layer 11 to be recessed downward, the volume of the cooling chamber 24 is reduced, which causes positive pressure to be formed in the cooling chamber 24. The cooler fluid in the cooling chamber 24 can be sprayed from the second opening 221, which is closer to the heat source 200, to the heat source 200 to dissipate heat.

[0038] For example, please refer to Figure 1 and Figure 4 The cooling chip 100 may also include an encapsulation layer 6. The encapsulation layer 6 is disposed on the side of the second substrate 22 away from the vibration component 1, so that the vibration component 1 and the drive component 2 can be encapsulated in the heat source 200 through the encapsulation layer 6.

[0039] In this embodiment, multiple connectors 112 are disposed on the outer periphery of the central vibrating element 111. The side of the connector 112 away from the central vibrating element 111 is connected to the first substrate 21, so that the vibrating layer 11 and the first substrate 21 form an open structure, breaking the vibration constraint of the traditional fully enclosed actuator in related technologies. The relatively small vibration constraint of the vibrating layer 11 itself can obtain a larger vibration amplitude under the same driving voltage. When the driving voltage of the vibrating layer 11 is 35V, the maximum axial displacement of the central vibrating element 111 on the first substrate 21 can be greater than or equal to 5μm, which is more than 60% higher than that of the traditional structure. The large displacement of the vibrating layer 11 increases the compression or expansion amplitude of the fluid in the cooling cavity 24, thereby increasing the flow velocity of the fluid ejected from the second opening 221. The flow velocity of the fluid ejected from the second opening 221 can be greater than or equal to 3m / s, providing sufficient airflow power for the efficient heat dissipation of the heat source 200, which is beneficial to improving the heat dissipation efficiency of the cooling chip 100 to the heat source 200. Furthermore, the first opening 211 is far from the heat source 200, which results in a lower temperature of the fluid entering the cooling chamber 24 from the first opening 211. After the fluid enters the cooling chamber 24 from the first opening 211, it is ejected from the second opening 221, which is closer to the heat source 200. This allows the cooling chip 100 to form a directional airflow to dissipate heat from the heat source 200, significantly improving the heat dissipation efficiency.

[0040] In one embodiment, please refer to Figure 5 The cooling chip 100 includes a first valve 4 and a second valve 5. The first valve 4 is located at a first opening 211 and is configured to allow fluid to flow only from the outside into the cooling chamber 24. That is, the first valve 4 is a one-way valve. The second valve 5 is located at a second opening 221 and is configured to allow fluid to flow only from the cooling chamber 24 to the outside. That is, the second valve 5 is a one-way valve. (See also...) Figure 5 (b) When the driving assembly 2 drives the central vibrating element 111 of the vibrating layer 11 to bulge upwards, the volume of the cooling chamber 24 expands, creating a negative pressure inside the cooling chamber 24. Fluid with a lower external temperature can enter the cooling chamber 24 through the first valve 4 from the first opening 211, which is farther from the heat source 200, while fluid with a higher temperature near the heat source 200 cannot enter the cooling chamber 24 through the second valve 5 from the second opening 221, thus maintaining a lower temperature for the fluid inside the cooling chamber 24. (See also...) Figure 5(a) When the driving component 2 drives the central vibrating element 111 of the vibration layer 11 to be recessed downward, the volume of the cooling cavity 24 decreases, resulting in a positive pressure inside the cooling cavity 24. The fluid with a lower temperature inside the cooling cavity 24 can be sprayed from the second opening 221, which is closer to the heat source 200, to the heat source 200 through the second valve 5 to dissipate heat from the heat source 200. In addition, the fluid inside the cooling cavity 24 cannot enter the outside through the first opening 211 through the first valve 4, reducing the escape of the fluid inside the cooling cavity 24. This allows as much fluid as possible inside the cooling cavity 24 to be sprayed from the second opening 221 through the second valve 5 to the heat source 200, which is beneficial to improving the heat dissipation efficiency of the cooling chip 100.

[0041] In this embodiment, the first valve 4 and the second valve 5 enable the cooling chip 100 to generate a directional jet of fluid to dissipate heat from the heat source 200, and prevent the high-temperature fluid near the heat source 200 from flowing back into the cooling chamber 24. The effective airflow ratio in the "exhaust-intake" cycle of the cooling chip 100 of this application is increased to over 90%, reducing energy loss by more than 30% compared to traditional non-directional airflow designs, significantly improving heat dissipation efficiency. Furthermore, the directional fluid can adapt to different hot surface shapes, making it suitable for various scenarios such as smartphones, tablets, and server chips, demonstrating strong versatility.

[0042] In one embodiment, please refer to Figure 5 The first valve 4 is located on the side of the first opening 211 near the cooling chamber 24, and is bent towards the cooling chamber 24. The second valve 5 is located on the side of the second opening 221 away from the cooling chamber 24, and is bent towards the outside. It should be noted that the first valve 4 and the second valve 5 can be made of monocrystalline silicon. By adjusting the thermal expansion coefficient of monocrystalline silicon through processing, the first valve 4 and the second valve 5 can naturally be bent. Furthermore, since the first valve 4 can be attached to the side of the first opening 211 near the cooling chamber 24 after the first substrate 21 is formed, the bend of the first valve 4 can be artificially directed towards the inside of the cooling chamber 24. Similarly, the second valve 5 can be artificially bent towards the outside.

[0043] For example, please refer to Figure 5(b) When the driving assembly 2 drives the central vibrating element 111 of the vibrating layer 11 to bulge upwards, the volume of the cooling chamber 24 expands, creating a negative pressure inside the cooling chamber 24. The cooler external fluid can force open the first valve 4 located on the side of the first opening 211 near the cooling chamber 24. The first valve 4, which bends towards the inside of the cooling chamber 24, can have a larger opening angle when forced open by the fluid, facilitating smooth fluid entry into the cooling chamber 24. The warmer fluid near the heat source 200 cannot force open the second valve 5 located on the side of the second opening 221 near the outside, which helps prevent the warmer fluid from flowing back into the cooling chamber 24, thus maintaining a lower fluid temperature inside the cooling chamber 24. (See also...) Figure 5 (a) When the driving assembly 2 drives the central vibrating element 111 of the vibration layer 11 to be recessed downwards, the volume of the cooling cavity 24 decreases, creating a positive pressure inside the cooling cavity 24. The lower-temperature fluid inside the cooling cavity 24 can force open the second valve 5 located on the side of the second opening 221 near the outside and spray it onto the heat source 200 to dissipate heat from the heat source 200. The second valve 5, which bends outwards, has a larger opening angle when forced open by the fluid, allowing more fluid to be ejected. The fluid inside the cooling cavity 24 cannot force open the first valve 4 located on the side of the first opening 211 near the cooling cavity 24, reducing the escape of fluid from the cooling cavity 24. This allows as much fluid as possible inside the cooling cavity 24 to be sprayed from the second opening 221 through the second valve 5 onto the heat source 200, which is beneficial for improving the heat dissipation efficiency of the cooling chip 100.

[0044] In this embodiment, the first valve 4 is located on the side of the first opening 211 near the cooling chamber 24, and the second valve 5 is located on the side of the second opening 221 near the outside. This allows both the first valve 4 and the second valve 5 to automatically open and close using changes in the air pressure within the cooling chamber 24, thus saving internal space and power consumption of the cooling components. Furthermore, the first valve 4 is bent towards the cooling chamber 24, and the second valve 5 is bent towards the outside, allowing both valves to achieve a larger angle during opening, thereby improving heat dissipation efficiency.

[0045] In one embodiment, please refer to Figure 1 , Figure 4 and Figure 5 The second opening 221 is located at the edge of the second substrate 22 to maximize the distance between the second opening 221 and the first opening 211, so that the first opening 211 and the second opening 221 are diagonally distributed in space. This allows the fluid to be ejected more directly through the second opening 221 after entering the cooling chamber 24 from the first opening 211, reducing the loss of fluid kinetic energy and thus improving the flow rate of the fluid ejected from the second opening 221, thereby improving the heat dissipation efficiency of the cooling chip 100.

[0046] In one embodiment, both the first opening 211 and the second opening 221 are configured as rectangles. It should be noted that, compared to the circular first opening 211 and the second opening 221, the rectangular first opening 211 and the second opening 221 are more convenient and less difficult to form during the molding process, which is beneficial to improving the yield of the cooling chip 100.

[0047] In one embodiment, please refer to Figure 1 and Figure 2 The vibration component 1 includes a first driving layer 12 and a second driving layer 13, with a vibration layer 11 disposed between the first driving layer 12 and the second driving layer 13. For example, both the first driving layer 12 and the second driving layer 13 can be made of molybdenum, and both are electrode layers. The thickness of both the first driving layer 12 and the second driving layer 13 can be 100 nm. The vibration layer 11 can be made of aluminum nitride and is a piezoelectric layer. The thickness of the vibration layer 11 can be 1 μm, and the diameter of the central vibrating element 111 can be 4 mm, serving as the core region of vibration. The second driving layer 13 is connected to the first substrate 21. The second substrate 22 integrates the driving circuit. Interconnect vias are formed in the first substrate 21 to electrically connect the driving component 2 to the vibration component 1, thereby driving the central vibrating element 111 to vibrate. The interconnect vias can be titanium-tungsten alloy / gold vias. The projection of the interconnect vias on the second substrate 22 is located at the edge of the projection of the connector 112 on the second substrate 22. It should be noted that the vibration of the vibration layer 11 is strongest at the central vibrating element 111, and the projection of the interconnect via on the second substrate 22 is located at the edge of the projection of the connector 112 on the second substrate 22, which further reduces the impact of the vibration of the vibration layer 11 on the interconnect via.

[0048] In one embodiment, please refer to Figure 3 The first driving layer 12 is configured in a comb-like shape, and the projection of the comb-like first driving layer 12 on the second substrate 22 is within the range of the projection of the connector 112 on the second substrate 22. The comb-like shape of the first driving layer 12 enables more uniform contact between itself and the vibrating layer 11, which is made of aluminum nitride, and the gaps between the comb teeth allow the electric field to be distributed more regularly within the vibrating layer 11, avoiding the formation of piezoelectric deformation failure areas in the vibrating layer 11 due to local electric field concentration or uneven distribution; the uniform electric field can fully excite the longitudinal stretching deformation of the vibrating layer 11, directly increasing the vertical vibration amplitude of the vibrating layer 11. Furthermore, the comb-like first driving layer 12 is lighter in weight and will not add extra vibration load to the vibrating layer 11, ensuring that the vibrating layer 11 can flexibly respond to the piezoelectric deformation of aluminum nitride and reduce structural resistance during vibration.

[0049] In one embodiment, please refer to Figure 1 and Figure 4The drive assembly 2 includes a spacer ring 23 made of borosilicate glass. The spacer ring 23 is disposed between the first substrate 21 and the second substrate 22 to provide insulation and sealing. The thickness of the spacer ring 23 can be 20 μm. The spacer ring 23 also has interconnecting vias to allow electrical connection between the vibration assembly 1 and the drive assembly 2.

[0050] In one embodiment, the first substrate 21 is made of a high-resistivity silicon material. For example, the first substrate 21, made of high-resistivity silicon, may have a dimension of 400 μm along its own axis. This type of high-resistivity silicon material exhibits excellent mechanical stability, including high elastic modulus and tensile strength. It is not prone to plastic deformation under high-frequency vibration conditions, and can stably withstand the force transmitted by the vibration of the vibration component 1, preventing itself from breaking or deforming due to stress overload. Furthermore, its 400 μm thickness allows it to act as a stable support base, directly dispersing and absorbing the stress transmitted from the vibration of the vibration component 1 to the drive component 2, preventing stress concentration at the connection point between the vibration component 1 and the drive component 2, thereby preventing structural fatigue of the vibration component 1 due to long-term high-frequency stress. Exemplarily, the second substrate 22 may also be made of high-resistivity silicon, and its thickness may be 200 μm.

[0051] It should be noted that existing MEMS actuators mostly rely on non-CMOS (Complementary Metal-Oxide-Semiconductor) compatible processes (such as special piezoelectric material deposition and precision bonding technology), which cannot be monolithically integrated with CMOS driving circuits. They require a "discrete chip + system-in-package" approach, which not only increases packaging costs and size but also reduces driving efficiency due to interconnection losses, making it difficult to meet the integration requirements of compact electronic devices.

[0052] In this application, the first substrate 21, made of high-resistivity silicon, is bonded to the underside of the vibration component 1 using a CMOS-compatible low-temperature bonding process. The spacer ring 23, made of borosilicate glass, is positioned between the first substrate 21 and the second substrate 22 using a CMOS-compatible low-temperature bonding process. The second substrate 22 uses a CMOS standard wafer and integrates the driving circuit using standard processes. The output of the driving circuit is connected to the vibration component 1 via interconnect vias, achieving monolithic integration and reducing interconnect losses. The fabrication of all structures in the cooling chip 100 is based on CMOS standard processes, specifically including: the first driving layer 12 and the second driving layer 13 of the vibration component 1 are deposited using a CMOS-compatible magnetron sputtering process; the vibration layer 11 is fabricated using a low-temperature reactive sputtering process (≤300℃) to avoid damaging the underlying circuitry; the etching of the second substrate 22 uses the DRIE process; the differentiated fabrication of the first valve 4 and the second valve 5 is achieved by adjusting the etching depth and annealing temperature, requiring no special equipment; the bonding of the spacer ring 23 to the first substrate 21 and the second substrate 22 uses a CMOS standard low-temperature bonding process (≤250℃). Based on this, it can be mass-produced using existing CMOS foundry platforms without the need for additional dedicated equipment; the driving circuit is monolithically integrated with the second substrate 22, eliminating the complex process of "discrete chip + system-in-package", reducing interconnect loss by more than 25% and overall cost by 40%, while reducing the size to 5mm×5mm×0.6222mm to meet the application requirements of miniaturization, low cost and high heat dissipation efficiency, and adapting to compact electronic devices.

[0053] In one embodiment, the sealing membrane 3 is configured as a PDMS (Polydimethylsiloxane) membrane. The thickness of the PDMS membrane can be 1 μm, and it can be coated onto the upper surface of the vibration component 1 by spin coating. This seals the side of the cooling cavity 24 near the vibration component 1 while buffering the vibration impact of the vibration component 1. The elastic modulus of the PDMS membrane matches the vibration frequency of the vibration component 1 to avoid resonance interference.

[0054] The above are preferred embodiments of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An open-structure MEMS actuation and cooling chip based on dual one-way valves, characterized in that, include: A vibration assembly includes a vibration layer, the vibration layer including a central vibrating element and connecting elements, the number of connecting elements being multiple, and the multiple connecting elements being disposed on the outer periphery of the central vibrating element; A driving component is configured to drive the vibration component to vibrate. The driving component includes a first substrate and a second substrate. The first substrate is configured as an annular shape. The side of the connector away from the central vibration component is connected to a first side of the first substrate. The second substrate covers a second side of the first substrate so that the first substrate and the second substrate enclose a cooling cavity. The first substrate has a first opening, and the second substrate has a second opening. The first opening, the cooling cavity, and the second opening are interconnected. A sealing membrane is disposed on the side of the vibration assembly away from the first substrate so that the sealing membrane can seal the gap between two adjacent connectors. When the driving assembly drives the vibration layer to vibrate, the cooling chamber can draw in fluid through the first opening and eject the fluid through the second opening so that the fluid flows through the heat source. The cooling chip includes a first valve and a second valve. The first valve is disposed at the first opening and is configured to allow fluid to flow only from the outside to the cooling chamber. The second valve is disposed at the second opening and is configured to allow fluid to flow only from the cooling chamber to the outside. The vibration assembly includes a first driving layer and a second driving layer. The vibration layer is disposed between the first driving layer and the second driving layer. The second driving layer is connected to the first substrate. The second substrate integrates a driving circuit. The first substrate has interconnect vias to electrically connect the driving assembly to the vibration assembly so as to drive the central vibrating element to vibrate. The projection of the interconnect vias on the second substrate is located at the edge of the projection of the connector on the second substrate.

2. The open-structure MEMS actuation and cooling chip based on dual one-way valves according to claim 1, characterized in that, The first valve is located on the side of the first opening close to the cooling chamber, and the first valve is bent toward the cooling chamber. The second valve is located on the side of the second opening away from the cooling chamber, and the second valve is bent toward the outside.

3. The open-structure MEMS actuation and cooling chip based on dual one-way valves according to claim 1, characterized in that, The second opening is located at the edge of the second substrate to maximize the distance between the second opening and the first opening.

4. The open-structure MEMS actuation and cooling chip based on dual one-way valves according to claim 1, characterized in that, Both the first opening and the second opening are configured to be rectangular.

5. The open-structure MEMS actuation and cooling chip based on dual one-way valves according to claim 1, characterized in that, The first driving layer is configured in a comb-like shape, and the projection of the comb-like first driving layer onto the second substrate is within the range of the projection of the connector onto the second substrate.

6. The open-structure MEMS actuation and cooling chip based on dual one-way valves according to claim 1, characterized in that, The drive assembly includes a spacer ring made of borosilicate glass, which is disposed between the first substrate and the second substrate, and the spacer ring also has the interconnect via.

7. The open-structure MEMS actuation and cooling chip based on dual one-way valves according to any one of claims 1 to 6, characterized in that, The material of the first substrate is configured as a high-resistivity silicon material.

8. The open-structure MEMS actuation and cooling chip based on dual one-way valves according to any one of claims 1 to 6, characterized in that, The sealing membrane is configured as a PDMS membrane.

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