Middle frame and electronic equipment

Abstract

The embodiment of the invention provides a middle frame and electronic equipment, the middle frame comprises a frame, an inner frame and a conductive connecting piece, at least part of the frame serves as an antenna radiator, the frame is arranged on the peripheral side of the inner frame in a surrounding mode, the frame and the inner frame are made of different conductive materials, and the conductive connecting piece is fixedly connected with the frame and the inner frame. A conductive loop and an inductor are formed among the frame, the conductive connecting piece and the inner frame so as to filter an antenna signal and improve the antenna performance.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a mid-frame and an electronic device. Background Technology

[0002] With the continuous development of electronic device technology, 5G networks are becoming increasingly prevalent in mobile communication devices such as smartphones. This necessitates placing a greater number of antennas within the limited space of a phone to ensure effective communication. Currently, the increasing number and size of cameras on smartphones further compresses the antenna space at the top and bottom of the device. Simultaneously, the demand for long battery life leads to larger phone batteries, further reducing the antenna space on the sides. Therefore, how to improve antenna performance within a limited space by adjusting the mid-frame structure is a pressing issue that needs to be addressed. Summary of the Invention

[0003] To address the aforementioned technical problems, embodiments of this application provide a mid-frame and electronic device that can improve antenna performance.

[0004] In a first aspect, embodiments of this application provide a mid-frame, comprising: a frame, an inner frame, and a conductive connector, wherein at least a portion of the frame serves as an antenna radiator; the frame surrounds the periphery of the inner frame, wherein the frame and the inner frame are made of conductive materials of different materials; and the conductive connector is fixedly connected to the frame and the inner frame.

[0005] In this embodiment, the conductive connector is fixedly electrically connected to the frame and the inner frame to form a conductive circuit, which in turn forms an inductor. At least a portion of the frame can serve as an antenna radiator for signal transmission and reception. The inductor formed by the conductive circuit can filter the current in the circuit, thereby improving the antenna performance. At the same time, the metal conductive connector is provided between the frame and the inner frame, which can further improve the rigidity of the middle frame, thereby effectively reducing the degree of deformation when subjected to external forces.

[0006] In one embodiment, the frame includes a first side edge, and the inner frame includes a first inner side edge. The first side edge and the first inner side edge are arranged adjacent to each other. A conductive connector is connected to the first side edge and the first inner side edge. At least part of the first side edge and the first inner side edge are made of conductive material. Therefore, a conductive loop can be formed between the first side edge, the conductive connector, and the first inner side edge, thereby forming an inductor. Since at least part of the first side edge can serve as an antenna radiator for transmitting and receiving antenna signals, the inductor formed between the first side edge, the conductive connector, and the first inner side edge can filter the antenna signal, thereby effectively improving the antenna performance.

[0007] In one embodiment, the conductive connector includes a main body, a first connecting part, and a second connecting part. The main body is connected between the first connecting part and the second connecting part. The first connecting part is connected to the frame, and the second connecting part is connected to the inner frame.

[0008] In one embodiment, the main body includes a first sub-part and a second sub-part, the first sub-part being connected to the second sub-part, and the first sub-part and the second sub-part forming a preset angle between each other, the preset angle being between 30° and 150°. The first and second sub-parts are plate-like structures. When the first sub-part and the second sub-part form the preset angle, the first or second sub-part can be embedded within an insulating layer, thereby improving the strength and stability of the frame.

[0009] In one embodiment, the preset included angle is 90°.

[0010] In one embodiment, the first sub-part is parallel to the inner wall of the frame, and the second sub-part is perpendicular to the inner wall of the frame.

[0011] When the angle between the first sub-part and the second sub-part is 90°, that is, the first sub-part and the second sub-part are perpendicular to each other, it is equivalent to bending the main body to form two perpendicular parts. At this time, the first sub-part can be set to be parallel to the inner wall of the frame, and the second sub-part can be perpendicular to the inner wall of the frame, so that the first sub-part extends along the thickness direction of the middle frame, thereby improving the strength of the frame.

[0012] In one embodiment, the main body includes a third sub-part and a fourth sub-part, the third sub-part being connected to the first connecting part and the fourth sub-part being connected to the second connecting part; the third sub-part and the fourth sub-part are spaced apart in a first direction, and the projections of the third sub-part and the fourth sub-part along the first direction at least partially overlap, the first direction being parallel to the inner wall of the frame.

[0013] In one embodiment, the third sub-part is electrically coupled to the fourth sub-part.

[0014] In one embodiment, the distance between the third sub-part and the fourth sub-part along the first direction is between 0.5 mm and 1 mm.

[0015] The third and fourth sub-parts are plate-shaped structures. The third sub-part includes a first coupling part disposed adjacent to the fourth sub-part, and the fourth sub-part includes a second coupling part disposed adjacent to the third sub-part. The first and second coupling parts are spaced apart, and the projections of the first and second coupling parts along the first direction at least partially overlap, thereby enabling electrical coupling between the first and second coupling parts. When a conductive circuit is formed between the first side of the frame, the conductive connector, and the second side, a capacitor is formed between the first and second coupling parts, thereby achieving a filtering effect and improving antenna performance.

[0016] In one embodiment, the frame includes a first fixing part, the inner frame includes a second fixing part, the first connecting part is connected to the first fixing part, and the second connecting part is connected to the second fixing part. The first fixing part is located on a first side edge, the second fixing part is located on a first inner side edge, and the projections of the first fixing part and the second fixing part on the first side edge do not overlap. The first connecting part and the first fixing part are stacked and fixed along a first direction, and the second connecting part and the second fixing part are stacked and fixed along the first direction. That is, the first connecting part extends onto the first side edge, and the second connecting part extends onto the first inner side edge. This reduces the space occupied by the conductive connectors on the frame width, thus achieving a narrow frame.

[0017] In one embodiment, the conductive connector forms a cavity with the inner frame and the outer frame, and an insulating layer is disposed in the cavity.

[0018] In one embodiment, at least a portion of the main body is embedded in the insulating layer.

[0019] An insulating layer is formed by injection molding in the cavity between the conductive connector, the frame, and the inner frame to achieve the effect of sealing the frame. At least part of the main body is embedded in the insulating layer, which can improve the overall rigidity of the frame and the connection strength of the conductive connector, and prevent the conductive connector from breaking off from the frame or inner frame due to collision.

[0020] In one embodiment, the insulating layer includes a groove, and at least a portion of the main body is disposed in the groove and spaced apart from the inner wall of the groove. By providing a groove at the location where the main body is embedded, such that the main body is disposed within the groove and spaced apart from the inner wall of the groove, the heat generation problem caused when the main body forms a conductive circuit can be effectively isolated.

[0021] In one embodiment, the conductive connector is a plate-like structure, and the thickness of the conductive connector ranges from 0.2 mm to 0.3 mm.

[0022] By setting the conductive connector as a plate-like structure and placing it perpendicular to the inner wall of the frame, the space occupied by the conductive connector in the thickness direction can be controlled, thereby improving the antenna clearance.

[0023] In one embodiment, the hardness of the material of the frame is greater than that of the material of the inner frame.

[0024] By using different conductive materials for the frame and inner frame, and making the frame material harder than the inner frame material, the frame's drop resistance and wear resistance can be improved. Since the inner frame does not contact the external space, the inner frame material hardness can be reduced to lower costs.

[0025] In one embodiment, the material density of the border is greater than that of the inner frame.

[0026] By using different conductive materials for the outer frame and inner frame, and making the material density of the outer frame greater than that of the inner frame, or vice versa, the overall weight of the middle frame can be reduced while ensuring the rigidity of the outer frame, thereby reducing the weight of the entire device.

[0027] In one embodiment, the material of the frame includes at least one of profile aluminum and titanium alloy, and the material of the inner frame includes at least one of die-cast aluminum, profile aluminum, magnesium alloy, and zinc alloy.

[0028] Secondly, this application also provides an electronic device, including a display panel, a back cover and the aforementioned middle frame, wherein the display panel, the inner frame and the back cover are stacked sequentially.

[0029] In one embodiment, the frame includes at least one slit to form the antenna radiator.

[0030] In one embodiment, one end of the conductive connector is electrically connected to the frame portion that serves as the antenna radiator, and the other end of the conductive connector is electrically connected to the inner frame.

[0031] In one embodiment, the antenna radiator is used in the Sub6G band. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0034] Figure 2 for Figure 1 A schematic diagram of the middle frame structure in the diagram;

[0035] Figure 3 for Figure 2 A partial schematic diagram of the first side of the middle section;

[0036] Figure 4 This is a schematic diagram of a split structure of a mid-frame provided in an embodiment of this application;

[0037] Figure 5 for Figure 4 A schematic diagram showing the connection between the conductive connector and the frame and inner frame;

[0038] Figure 6 for Figure 4 A schematic diagram of the insulating layer in the middle frame;

[0039] Figure 7 for Figure 4 A schematic diagram of the cross-section along the AA direction;

[0040] Figure 8 for Figure 4 Schematic diagram of the structure of the conductive connector;

[0041] Figure 9 for Figure 4 Diagram showing the positional relationship between the conductive connector, the frame, and the inner frame;

[0042] Figure 10 A schematic diagram of the split structure of a mid-frame provided in the second embodiment of this application;

[0043] Figure 11 for Figure 10 A schematic diagram of the cross-sectional structure along the A1-A1 direction;

[0044] Figure 12 for Figure 10 Schematic diagram of the structure of the conductive connector;

[0045] Figure 13 for Figure 10 A schematic diagram of the cross-sectional structure of the conductive connector along the A1-A1 direction;

[0046] Figure 14 for Figure 10 Diagram showing the positional relationship between the conductive connector, the frame, and the inner frame;

[0047] Figure 15 This is a schematic diagram of a split structure of a mid-frame provided in the third embodiment of this application;

[0048] Figure 16 for Figure 15A schematic diagram of the cross-sectional structure along the A2-A2 interface;

[0049] Figure 17 for Figure 15 Schematic diagram of the structure of the conductive connector;

[0050] Figure 18 for Figure 15 A schematic diagram of the cross-sectional structure of the conductive connector along the A2-A2 interface;

[0051] Figure 19 for Figure 17 A side view of the conductive connector.

[0052] Figure 20 for Figure 16 Diagram showing the positional relationship between the conductive connector, the frame, and the inner frame. Detailed Implementation

[0053] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0054] References to "one embodiment" or "some embodiments" as described in this application specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this application specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0055] To enable those skilled in the art to better understand the solution of this application, the application scenario of the technical solution of this application will be described first below.

[0056] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application. The electronic device 1000 may be a mobile phone, tablet computer, e-reader, laptop computer, digital camera, in-vehicle equipment, or wearable device, etc. Figure 1 The illustrated embodiment uses a mobile phone as an example for explanation. Figure 1As shown, the electronic device 1000 includes a mid-frame 100, a display panel 200, and a rear cover 300. The display panel 200 and the rear cover 300 are arranged parallel to each other and spaced apart. The rear cover, display panel 200, and rear cover 300 are located on opposite sides of the mid-frame 100. In this application, the mid-frame 100 and the rear cover 300 can be two different components. By assembling the rear cover 300 and the mid-frame 100 together, the housing of the electronic device 1000 can be formed. The cavity formed between the mid-frame 100, the display panel 200, and the rear cover 300 can be used to place electronic components, circuit boards, and other parts. For example, a power supply 400 and a circuit board 500 can be placed within the cavity formed between the display panel 200, the mid-frame 100, and the rear cover 300.

[0057] The display panel 200 constitutes the display surface of the electronic device 1000, used to display images, text, video, and other information, and to provide information interaction. The display panel 200 can be a light-emitting diode display, a liquid crystal display, etc., but is not limited to these. The display panel 200 can be a flexible screen with bending characteristics, i.e., a foldable screen, or a rigid display screen. The back cover 300 constitutes the rear housing of the electronic device 1000. The back cover 300 serves to provide waterproof and dustproof protection for the electronic components inside the electronic device 1000 and ensures the cleanliness of the electronic device 1000's appearance. The back cover 300 can be made of conductive materials such as metal, or non-conductive materials such as glass or plastic. The power supply 400 is located in the battery compartment of the receiving cavity. The power supply 400 is an energy storage tool that provides power to the mobile terminal. The power supply 400 can be a lithium battery, a nickel-metal hydride battery, or a sodium-ion battery, etc. The circuit board 500 is an important component of the electronic device 1000, on which various components constituting the circuit system of the electronic device 1000 are installed, such as circuits, processors, chips, capacitors, resistors, inductors, interfaces, and plugs. Optionally, the circuit board 500 may be equipped with integrated circuit chips, power management unit chips, or radio frequency chips. In addition, the circuit board 500 is usually equipped with various processors such as central processing units, application processors, graphics processors, or image signal processors, but is not limited to these.

[0058] Please see Figure 2 ,in, Figure 2 for Figure 1 A schematic diagram of the middle frame structure.

[0059] like Figure 2As shown, the middle frame 100 includes a border 110 and an inner frame 120. The border 110 surrounds the periphery of the inner frame 120 and is attached to the edge of the back cover 300 to form the external structure of the electronic device 1000. The inner frame 120 is housed within the cavity between the display panel 200, the border 110, and the back cover 300. The border 110 includes a first side 111, a second side 112, a third side 113, and a fourth side 114 connected sequentially end to end. The first side 111 is parallel to the third side 113, and the second side 112 is parallel to the fourth side 114. The inner frame 120 includes a first inner side 121, a second inner side 122, a third inner side 123, a fourth inner side 124, and a base plate 125. The first inner side 121, second inner side 122, third inner side 123, and fourth inner side 124 are sequentially connected end-to-end and surround the edge of the base plate 125. The first inner side 121 is adjacent to the first side 111, the second inner side 122 is adjacent to the second side 112, the third inner side 123 is adjacent to the third side 113, and the fourth inner side 124 is adjacent to the fourth side 114. The base plate 125 includes multiple recesses for accommodating a power supply and a circuit board, such as a first recess 201 and a second recess 202. A power supply 400 is disposed in the first recess 201. Figure 1 A circuit board 500 is disposed in the second groove 202. Figure 1 The power supply 400 is electrically connected to the circuit board 500, so that the power supply 400 can supply power to the circuit board 500. Electronic components within the electronic device 1000 can be mounted on the circuit board.

[0060] Furthermore, at least a portion of the frame 110 can serve as an electronic component to perform some of the functions of an electronic component. For example, a portion of the first side 111 can serve as an antenna radiator of an antenna module to perform the function of transmitting or receiving signals. Figure 2As shown, the first side 111 includes a first part 101, a second part 102, a third part 103, a fourth part 104, and a fifth part 105. The first part 101, the third part 103, and the fifth part 105 are all made of conductive materials, while the second part 102 and the fourth part 104 are made of insulating materials. The second part 102 is adjacent to both the first part 101 and the third part 103 to block the electrical connection between them. Specifically, a gap is formed between the first part 101 and the third part 103, and the second part 102 is filled into the gap. Similarly, the fourth part 104 is adjacent to both the third part 103 and the fifth part 105 to block the electrical connection between them. Again, a gap is formed between the third part 103 and the fifth part 105, and the fourth part 104 is filled into the gap. Electrical connectors can be provided between circuit board 500 and the first part 101, between circuit board 500 and the third part 103, and between circuit board 500 and the fifth part 105, respectively. Circuit board 500 can supply power to the first part 101, the third part 103, and the fifth part 105 respectively. Thus, the first part 101 can serve as the first antenna radiator, the third part 103 can serve as the second antenna radiator, and the fifth part 105 can serve as the third antenna radiator. It is understood that in this embodiment, the second side 112, the third side 113, and the fourth side 114 can also be formed into antenna radiators by opening gaps, and this application does not limit this.

[0061] In this embodiment, the frame 110 can be a metal frame, and a portion of the first side 111 can directly serve as an antenna radiator. In another embodiment, the frame 110 can also be a non-metallic frame, and the first side 111 can serve as an antenna radiator by embedding at least one conductor.

[0062] It is understood that in this embodiment, the radiator refers to the device in the antenna used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly interpreted as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a certain polarization and radiated in the desired direction. The receiving radiator converts the electromagnetic wave energy of a certain polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0063] The radiator may include a conductor with a specific shape and size, such as a wire or sheet, and this application does not limit the specific shape. In one embodiment, the wire radiator may be simply referred to as a wire antenna. In one embodiment, the wire radiator may be implemented by a conductive frame, and may also be called a frame antenna. In one embodiment, the wire radiator may be implemented by a support conductor, and may also be called a support antenna. In one embodiment, the wire diameter (e.g., including thickness and width) of the wire radiator, or the radiator of the wire antenna, is much smaller than the wavelength (e.g., the wavelength of the medium) (e.g., less than 1 / 16 of the wavelength), and the length may be comparable to the wavelength (e.g., the wavelength of the medium) (e.g., the length is around 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). The main forms of wire antennas include dipole antennas, half-wave dipole antennas, monopole antennas, loop antennas, and inverted F antennas (also known as IFA, Inverted F Antenna). For example, in a dipole antenna, each dipole antenna typically includes two radiating stubs, each fed from the feed end of the radiating stub by a feed section. For example, an inverted-F antenna (IFA) can be considered as a monopole antenna with an added ground path. An IFA antenna has one feed point and one ground point, and is called an inverted-F antenna because its side view is inverted-F shaped. In one embodiment, the sheet radiator may include a microstrip antenna or a patch antenna, such as a planar inverted-F antenna (also known as a PIFA). In one embodiment, the sheet radiator may be implemented using a planar conductor (e.g., a conductive sheet or conductive coating). In one embodiment, the sheet radiator may include a conductive sheet, such as a copper sheet. In one embodiment, the sheet radiator may include a conductive coating, such as silver paste. The shape of the sheet radiator includes circular, rectangular, and annular shapes, and this application does not limit the specific shape. The structure of a microstrip antenna generally consists of a dielectric substrate, a radiator, and a ground plane, wherein the dielectric substrate is disposed between the radiator and the ground plane.

[0064] Radiators may also include slots or gaps formed on a conductor, for example, closed or semi-closed slots or gaps formed on a grounded conductor surface. In one embodiment, a slotted or slit radiator may be simply referred to as a slot antenna or a gap antenna. In one embodiment, the radial dimension (e.g., including width) of the slot or gap of the slot antenna / gap antenna is much smaller than the wavelength (e.g., the dielectric wavelength) (e.g., less than 1 / 16 of the wavelength), while the length dimension may be comparable to the wavelength (e.g., the dielectric wavelength) (e.g., a length of approximately 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). In one embodiment, a radiator with a closed slot or gap may be simply referred to as a closed slot antenna. In one embodiment, a radiator with a semi-closed slot or gap (e.g., an opening added to a closed slot or gap) may be simply referred to as an open slot antenna. In some embodiments, the gap shape is elongated. In some embodiments, the length of the gap is approximately half a wavelength (e.g., the dielectric wavelength). In some embodiments, the length of the gap is approximately an integer multiple of a wavelength (e.g., one dielectric wavelength). In some embodiments, the slot can be fed by transmission lines connected across one or both sides, thereby exciting a radio frequency electromagnetic field on the slot and radiating electromagnetic waves into space. In one embodiment, the radiator of the slot antenna or gap antenna can be implemented by a conductive frame grounded at both ends, also known as a frame antenna; in this embodiment, the slot antenna or gap antenna can be viewed as including a linear radiator, the linear radiator being spaced apart from the ground and grounded at both ends, thereby forming a closed or semi-closed slot or gap. In one embodiment, the radiator of the slot antenna or gap antenna can be implemented by a support conductor grounded at both ends, also known as a support antenna.

[0065] Please see Figure 3 ,in, Figure 3 for Figure 2 A partial schematic diagram of the first side 111.

[0066] like Figure 3 As shown, when the third part 103 of the first side 111 acts as an antenna radiator for transmitting and receiving antenna signals, the electronic device 1000 also provides a feed source or feeding circuit corresponding to the antenna radiator. For example, the electronic device 1000 also includes a first feed source 106, which is electrically connected to the third part 103. The third part 103 generates a radiating current i under the excitation of the first feed source 106. Specifically, the third part 103 includes a first end 3a and a second end 3b. The first feed source 106 is electrically connected to the first end 3a of the third part 103, and the third part 103 generates a current flowing from the first end 3a to the second end 3b under the excitation of the first feed source 106.

[0067] In some embodiments, the first end 3a and the second end 3b are open-circuit ends, and the third part 103 serves as the second radiator to form a monopole antenna; alternatively, the first end 3a is an open-circuit end, the second end 3b is a ground end, and the third part 103 serves as the second radiator to form a loop antenna. Both the monopole antenna and the loop antenna are quarter-wavelength resonant mode antennas. Therefore, when the equivalent electrical length of the second radiator is λ1 / 4, the second antenna radiator can resonate in the first resonant frequency band under the excitation of the first feed 106, thus supporting the transmission and reception of electromagnetic wave signals in the first resonant frequency band. Figure 3 The example in the middle is a monopole antenna, with part 103 in the third section.

[0068] The resonant frequency, also called the resonance frequency, can have a frequency range, that is, the range of frequencies where resonance occurs. The frequency corresponding to the strongest resonance point is the center frequency. The return loss characteristic of the center frequency can be less than -20dB. It should be understood that the antenna / radiator can generate one or more antenna modes according to the specific design, and each antenna mode can generate a fundamental mode resonance.

[0069] In this embodiment, the first resonant frequency band generated by the second antenna radiator can be the 2.4G WiFi band or the 5G WiFi band, or the 5G communication band, such as the N77 (3.3GHz–4.2GHz) band or the N79 (4.4GHz–5.0GHz) band, as well as the sub6G band.

[0070] When the third part 103 is a loop antenna, the current flows approximately from the first feed point X1 of the third part 103 to the second end 3b, which is the ground end, and from the second end 3b to ground, forming a current along the direction from the second end 3b to the first feed point X1 on the ground, thus forming a loop current distribution corresponding to the loop antenna. In this application, when the third part 103 is a loop antenna, the equivalent electrical length of the third part 103 specifically refers to the equivalent electrical length of the stub portion of the third part 103 located between the first feed point X1 and the second end 3b. In some embodiments, the first feed point X1 is located close to the first end 3a; therefore, the equivalent electrical length of the stub portion between the first feed point X1 and the second end 3b can be approximately regarded as the equivalent electrical length of the third part 103. When the third part 103 is a monopole antenna, the equivalent electrical length of the third part 103 refers to the equivalent electrical length of the entire radiator between the first end 3a and the second end 3b of the third part 103.

[0071] In this embodiment, when the second end 3b of the third part 103 is a ground end, the second end 3b being a ground end means that the second end 3b has a grounding point and is connected to ground GND, or that there is a grounding point near the second end 3b and it is connected to ground GND. That is, the second end 3b being a grounding point does not strictly refer to the end of the second end 3b being grounded, but includes the case of grounding near the second end 3b.

[0072] Wherein, "ground" (GND) can refer to at least a portion of any grounding layer, ground plane, or grounding metal layer within an electronic device (such as a mobile phone), or at least a portion of any combination of the aforementioned grounding layers, ground planes, or grounding components. "Ground" can be used for grounding components within an electronic device. In one embodiment, "ground" can be the grounding layer of the electronic device's circuit board, or a grounding metal layer formed by a ground plane formed within the frame of the electronic device or a metal film formed beneath the screen. Any of the aforementioned grounding layers, ground planes, or grounding metal layers is made of a conductive material. In one embodiment, the conductive material can be any of the following: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil on an insulating substrate, tin-plated copper, cloth impregnated with graphite powder, a graphite-coated substrate, a copper-plated substrate, a brass-plated substrate, and an aluminum-plated substrate. Those skilled in the art will understand that the grounding layer / grounding plate / grounding metal layer can also be made of other conductive materials.

[0073] Grounding: refers to coupling with the aforementioned ground / floor in any way. In one embodiment, grounding can be achieved through physical grounding, such as through a structural component of the mid-frame to achieve a physical ground at a specific location on the frame (or, physical ground). In another embodiment, grounding can be achieved through device grounding, such as through devices like capacitors / inductors / resistors connected in series or parallel (or, device ground).

[0074] In this embodiment, the feed circuit refers to the combination of all circuits used for receiving and transmitting radio frequency (RF) signals. The feed circuit may include a transceiver and an RF front-end. In some cases, the term "feed circuit" is narrowly interpreted as an RF chip (RFIC), which can be considered to include both the RF front-end chip and the transceiver. The feed circuit has the function of converting radio waves (e.g., RF signals) into electrical signals (e.g., digital signals). It is generally considered part of the RF component.

[0075] In some embodiments, the electronic device may also include a test socket (or, RF socket or RF test socket). This test socket can be used to insert a coaxial cable to test the characteristics of the RF front-end circuitry or the radiator of the antenna. The RF front-end circuitry can be considered as the circuitry coupled between the test socket and the transceiver.

[0076] In some embodiments, the radio frequency front-end circuit can be integrated into a radio frequency front-end chip in an electronic device, or the radio frequency front-end circuit and the transceiver can be integrated into a radio frequency chip in an electronic device.

[0077] In some embodiments, the electronic device may further include a matching circuit, which is a circuit for adjusting the radiation characteristics of the antenna. In one embodiment, the matching circuit is coupled between the feed circuit and the corresponding radiator. In another embodiment, the matching circuit is coupled between the test mount and the radiator. Typically, the matching circuit is a combination of circuits coupled between the radiator and the ground plane. In one embodiment, the matching circuit may include switches and / or electronic components, the switches being electronic components for switching the coupling connections of the radiator. The matching circuit has impedance matching and / or frequency tuning functions. Typically, it is considered part of the antenna.

[0078] In this embodiment, the "end / point" in the first end / second end / feed end / ground end / feed point / ground point / connection point of the antenna radiator should not be narrowly interpreted as necessarily being an endpoint or end physically disconnected from other radiators. It can also be considered as a point or segment on a continuous radiator. In one embodiment, "end / point" may include a connection / coupling region on the antenna radiator that is coupled to other conductive structures. For example, the feed end / feed point may be a coupling region on the antenna radiator that is coupled to a feed structure (e.g., a region facing a part of the feed structure). Similarly, the ground end / ground point may be a connection / coupling region on the antenna radiator that is coupled to a ground structure.

[0079] In this embodiment, the open terminal (open circuit terminal) and the closed terminal are, for example, relative to whether or not they are grounded; the closed terminal is grounded, and the open terminal is not grounded. In some embodiments, the open terminal and the closed terminal are, for example, relative to other conductors; the closed terminal is electrically connected to other conductors, and the open terminal is not electrically connected to other conductors. In one embodiment, the open terminal may also be referred to as a floating terminal, a free terminal, an open terminal, or an open circuit terminal. In some embodiments, the closed terminal may also be referred to as a ground terminal or a short circuit terminal. It should be understood that in some embodiments, other conductors can be coupled through the open terminal to transfer coupled energy (which can be understood as transferring current).

[0080] In some embodiments, the understanding of "closed end" can also be from the perspective of current distribution. A closed end or ground end can be understood as a point of high current or low electric field on a radiator. In one embodiment, coupling electronic devices (e.g., capacitors, inductors, etc.) through a closed end can maintain the current distribution characteristics of the point of high current / low electric field. In one embodiment, opening a slit at or near the closed end (e.g., filling the slit with insulating material) can maintain the current distribution characteristics of the point of high current / low electric field.

[0081] In some embodiments, the term "open terminal" can also be understood from the perspective of current distribution. An open terminal or a floating terminal can be understood as a point on the radiator where the current is small or the electric field is large. In one embodiment, coupling electronic devices (e.g., capacitors, inductors, etc.) through an open terminal can maintain the current distribution characteristics of the point where the current is small or the electric field is large. It is understood that coupling electronic devices (e.g., capacitors, inductors, etc.) at a radiator end in a gap (similar to the opening of an open or floating terminal in terms of radiator structure) can make that radiator end a point where the current is large and the electric field is small. In this case, the radiator end in the gap should be understood as actually a closed terminal or a grounded terminal, etc.

[0082] Please refer to the following: Figures 4-9 ,in, Figure 4 This is a schematic diagram of a split structure of a mid-frame provided in an embodiment of this application. Figure 5 for Figure 4 A schematic diagram showing the connection between the conductive connector and the frame and inner frame. Figure 6 for Figure 4 A schematic diagram of the insulating layer in the middle frame. Figure 7 for Figure 4 A schematic diagram of the cross-section along the AA direction. Figure 8 for Figure 4 A schematic diagram of the structure of the conductive connector. Figure 9 for Figure 4 Diagram showing the positional relationship between the conductive connector, the frame, and the inner frame.

[0083] like Figure 4 As shown, the middle frame 100 includes a frame 110, an inner frame 120, and a conductive connector 130. The inner frame 120 is stacked with the display panel 200 and the back cover 300. The display panel 200 and the back cover 300 are respectively disposed on opposite sides of the inner frame 120. The frame 110 surrounds the inner frame 120. The conductive connector 130 is fixedly connected to the frame 110 and the inner frame 120.

[0084] The frame 110 includes a first side edge 111, and the inner frame 120 includes a first inner side edge 121. The first side edge 111 is disposed adjacent to the first inner side edge 121. A conductive connector 130 is disposed between the first side edge 111 and the first inner side edge 121, and is connected to both the first side edge 111 and the first inner side edge 121. The metal conductive connector, disposed between the frame and the inner frame, can further enhance the rigidity of the middle frame, thereby effectively reducing the degree of deformation under external forces.

[0085] like Figure 5 As shown, the conductive connector 130 is connected to the third part 103 of the first side 111, which is the second antenna radiator on the first side 111 of the conductive connector 130. When the third part 103 generates a radiating current under the excitation of the first feed point X1, the third part 103 can transmit and receive antenna signals. At this time, the radiating current on the third part 103 flows from the first end 3a to the second end 3b. Since the conductive connector 130 is connected to the third part 103, the radiating current on the third part 103 can be transmitted to the first inner side 121 through the conductive connector 130. The first inner side 121 can be electrically connected to the third part 103 near the first end 3a of the third part 103, or grounded, thereby forming a conductive loop composed of the first feed point X1, the conductive connector 130 and the first inner side 121. This conductive loop can form an inductor, thereby filtering the radiating current on the third part 103, thereby improving the over-the-air (OTA) performance of the antenna. The aforementioned inductance refers to distributed inductance (or distributed inductance), which is the equivalent inductance formed through a conductive element of a certain length. The principle of inductor filtering is that when the input voltage increases, the current in the inductor increases, storing some energy. When the current decreases, the inductor releases energy, making the current smooth.

[0086] The frame 110 and the inner frame 120 can be made of the same metal material or two different metal materials.

[0087] In one embodiment, the frame 110 and the inner frame 120 are made of different metal materials, wherein the hardness of the material of the frame 110 is greater than that of the material of the inner frame.

[0088] For example, the frame 110 can be made of profile aluminum, and the inner frame 120 can be made of die-cast aluminum. Profile aluminum refers to aluminum ingots or other raw materials that are melted in a furnace and then extruded through an extruder into a mold. It has the characteristics of high hardness, wear resistance, and strength. When used as the material for the frame 110, it can ensure the strength and hardness of the frame 110 while controlling the overall weight of the machine. Die-cast aluminum refers to the manufacturing process of pressing molten metal raw materials such as aluminum ingots into a mold, and obtaining a metal product after cooling. It has the advantages of accurate dimensions, smooth surface, and small processing amount, which can effectively reduce the manufacturing time of the inner frame 120 and improve work efficiency. By differentiating the materials of the frame 110 and the inner frame 120, the weight of the middle frame 100 can be reduced while ensuring the overall strength of the middle frame 100, thereby reducing the overall weight of the machine.

[0089] In one embodiment, the frame 110 and the inner frame 120 are made of different metal materials, wherein the material density of the inner frame 120 is less than that of the frame 110. The metal material of the inner frame 120 may include one or more selected from magnesium alloys, zinc alloys, and copper alloys. Magnesium alloys, zinc alloys, and copper alloys are commonly used lightweight metals, which can effectively reduce the weight of the mid-frame assembly while ensuring sufficient mechanical strength and heat dissipation, and also ensure good electrical conductivity for use as an antenna, etc. In particular, the use of magnesium alloys further effectively reduces the weight of the mid-frame assembly while ensuring sufficient strength of the inner frame. However, the material of the first metal material of the inner frame 120 is not limited to the above-mentioned materials; any lightweight alloy with a lower density than the metal material of the frame 110 is acceptable.

[0090] For example, the frame 110 can be made of titanium alloy, and the inner frame 120 can be made of aluminum profile, or the frame 110 can be made of titanium alloy and the inner frame 120 can be made of die-cast aluminum. By making the frame 110 of titanium alloy, the overall strength of the middle frame 100 can be further improved, and the appearance's drop resistance and wear resistance can be enhanced. On the other hand, by making the inner frame 120 of aluminum profile or die-cast aluminum, the weight of the middle frame 100 can be reduced.

[0091] In some embodiments, the density of the metal material of the inner frame 120 is 50%-70% lower than or equal to the density of the metal material of the border 110, thereby effectively reducing the weight of the middle frame assembly. If the density of the metal material of the inner frame 120 is greater than 70% of the density of the metal material of the border 110, then the density difference between the metal material of the inner frame 120 and the metal material of the border 110 is not significant, and the weight of the middle frame 100 cannot be effectively reduced, making the use of two different metals meaningless.

[0092] like Figures 6-8As shown, the conductive connector 130 has a plate-like structure, forming a cavity 127 with the first side 111 and the first inner side 121. An insulating layer 128 is also filled within the cavity 127, and part or all of the conductive connector 130 is embedded within the insulating layer 128. By using the conductive connector 130 as a "rib" between the outer frame and the inner frame, the strength of the middle frame 100 can be enhanced.

[0093] It is understandable that the insulating layer 128 is also filled in other cavities or gaps between the frame 110 and the inner frame 120. The frame 110 and the inner frame 120 can be molded independently. Since the frame 110 and the inner frame 120 have irregular structures, the insulating layer 128 formed by injection molding can effectively bond and seal the frame 110 and the inner frame 120. Figure 6 The overall structure of the insulating layer 128 is shown. The insulating layer 128 is nested with the frame 110 and the inner frame 120. The insulating layer 128 can completely seal the gap between the frame 110 and the inner frame 120, thereby achieving a seal on the middle frame 100 and preventing the internal components of the electronic device 1000 from being corroded by moisture.

[0094] In this embodiment, the conductive connector 130 can be made of stainless steel or other metal materials, and its thickness can be set between 0.2mm and 0.3mm. By controlling the thickness of the conductive connector 130 within a smaller range, the size of the cavity can be effectively increased, thereby increasing the antenna clearance and consequently improving the strength and stability of the antenna signal.

[0095] In this embodiment, the insulating layer 128 can be manufactured using nano-injection molding technology. Nano-injection molding refers to nano-molding technology (NMT), which is a process that combines metal and plastic using nanotechnology. In this process, the metal surface is first nano-processed, and then plastic is directly injection molded onto the metal surface, allowing the metal and plastic to be integrally formed.

[0096] like Figure 9 As shown, the conductive connector 130 includes a first connecting portion 131, a second connecting portion 132, and a main body portion 133. The main body portion 133 is connected between the first connecting portion 131 and the second connecting portion 132. The frame 110 includes a first fixing portion 116 disposed on the first side 111, and the inner frame 120 includes a second fixing portion 126 disposed on the first inner side 121. The projections of the first fixing portion 116 and the second fixing portion 126 on the inner wall of the first side 111 do not coincide. In other words, the first fixing portion 116 and the second fixing portion 126 are spaced apart along the direction of extension of the first side 111.

[0097] The first connecting part 131 and the first fixing part 116 are stacked and fixedly connected along the first direction F1, and the second connecting part 132 and the second fixing part 126 are stacked and fixedly connected along the first direction F1. For example, the first connecting part 131 is welded to the first fixing part 116, and the second connecting part 132 is welded to the second fixing part 126. It can be understood that since the first fixing part 116 and the second fixing part 126 are respectively disposed on the first side 111 and the first inner side 121, the first connecting part 131 is equivalent to being stacked on the first side 111, and the second connecting part 132 is stacked on the first inner side 121. Therefore, the occupation of the conductive connector 130 on the frame width can be reduced to achieve a narrow frame effect.

[0098] Please refer to the following: Figures 10-14 ,in, Figure 10 This is a schematic diagram of a split structure of a mid-frame provided in the second embodiment of this application. Figure 11 for Figure 10 A schematic diagram of the cross-sectional structure along the A1-A1 direction. Figure 12 for Figure 10 A schematic diagram of the structure of the conductive connector. Figure 13 for Figure 10 A schematic diagram of the cross-sectional structure of the conductive connector along the A1-A1 direction. Figure 14 for Figure 10 Diagram showing the positional relationship between the conductive connector, the frame, and the inner frame.

[0099] like Figure 9 and Figure 10 As shown, the middle frame 100 includes a side frame 110, an inner frame 120, and a conductive connector 130. The side frame 110 includes a first side edge 111, and the inner frame 120 includes a first inner side edge 121. The first side edge 111 is disposed adjacent to the first inner side edge 121. The conductive connector 130 is disposed between the first side edge 111 and the first inner side edge 121, and is connected to both the first side edge 111 and the first inner side edge 121. The conductive connector 130, the first side edge 111, and the first inner side edge 121 form a cavity 127, which is filled with an insulating layer 128. Partial or complete embedding of the conductive connector 130 is disposed within the insulating layer 128. The metallic conductive connector, disposed between the side frame and the inner frame, further enhances the rigidity of the middle frame, thereby effectively reducing deformation under external forces.

[0100] It is understood that insulating layers 128 are also filled in other cavities or gaps between the frame 110 and the inner frame 120. The frame 110 and the inner frame 120 can be molded independently. Since the frame 110 and the inner frame 120 have irregular structures, forming the insulating layer 128 through injection molding can effectively bond and seal the frame 110 and the inner frame 120. The overall structure of the insulating layer 128 is the same as in the first embodiment. The insulating layer 128, the frame 110, and the inner frame 120 are nested together. The insulating layer 128 can completely seal the gaps between the frame 110 and the inner frame 120, thereby achieving a seal for the middle frame 100 and preventing corrosion of the internal components of the electronic device 1000 due to moisture ingress.

[0101] The conductive connector 130, together with the first side 111 and the first inner side 121, forms a conductive circuit to form an inductor and thus filters the radiated current on the first side, which is the same as in the first embodiment. This embodiment will not be described in detail here.

[0102] In one embodiment, the frame 110 and the inner frame 120 are made of different metal materials, wherein the hardness of the material of the frame 110 is greater than that of the material of the inner frame.

[0103] For example, the frame 110 can be made of profile aluminum, and the inner frame 120 can be made of die-cast aluminum. Profile aluminum refers to aluminum ingots or other raw materials that are melted in a furnace and then extruded through an extruder into a mold. It has the characteristics of high hardness, wear resistance, and strength. When used as the material for the frame 110, it can ensure the strength and hardness of the frame 110 while controlling the overall weight of the machine. Die-cast aluminum refers to the manufacturing process of pressing molten metal raw materials such as aluminum ingots into a mold, and obtaining a metal product after cooling. It has the advantages of accurate dimensions, smooth surface, and small processing amount, which can effectively reduce the manufacturing time of the inner frame 120 and improve work efficiency. By differentiating the materials of the frame 110 and the inner frame 120, the weight of the middle frame 100 can be reduced while ensuring the overall strength of the middle frame 100, thereby reducing the overall weight of the machine.

[0104] In one embodiment, the frame 110 and the inner frame 120 are made of different metal materials, wherein the material density of the inner frame 120 is less than that of the frame 110. The metal material of the inner frame 120 may include one or more selected from magnesium alloys, zinc alloys, and copper alloys. Magnesium alloys, zinc alloys, and copper alloys are commonly used lightweight metals, which can effectively reduce the weight of the mid-frame assembly while ensuring sufficient mechanical strength and heat dissipation, and also ensure good electrical conductivity for use as an antenna, etc. In particular, the use of magnesium alloys further effectively reduces the weight of the mid-frame assembly while ensuring sufficient strength of the inner frame. However, the material of the first metal material of the inner frame 120 is not limited to the above-mentioned materials; any lightweight alloy with a lower density than the metal material of the frame 110 is acceptable.

[0105] For example, the frame 110 can be made of titanium alloy, and the inner frame 120 can be made of aluminum profile, or the frame 110 can be made of titanium alloy and the inner frame 120 can be made of die-cast aluminum. By making the frame 110 of titanium alloy, the overall strength of the middle frame 100 can be further improved, and the appearance's drop resistance and wear resistance can be enhanced. On the other hand, by making the inner frame 120 of aluminum profile or die-cast aluminum, the weight of the middle frame 100 can be reduced.

[0106] In some embodiments, the density of the metal material of the inner frame 120 is 50%-70% lower than or equal to the density of the metal material of the border 110, thereby effectively reducing the weight of the middle frame assembly. If the density of the metal material of the inner frame 120 is greater than 70% of the density of the metal material of the border 110, then the density difference between the metal material of the inner frame 120 and the metal material of the border 110 is not significant, and the weight of the middle frame 100 cannot be effectively reduced, making the use of two different metals meaningless.

[0107] like Figure 11 and Figure 12As shown, the conductive connector includes a first connecting part 131, a second connecting part 132 and a main body part 133. The main body part 133 is connected between the first connecting part 131 and the second connecting part 132. The first connecting part 131 is connected to the first side 111 of the frame 110, and the second connecting part 132 is connected to the first inner side 121 of the inner frame 120. The main body 133 includes a first sub-part 1331 and a second sub-part 1332. The first sub-part 1331 is connected to the second sub-part 1332. Both the first sub-part 1331 and the second sub-part 1332 are plate-shaped structures and form a preset angle between them. In other words, the main body 133 is formed by bending to form the first sub-part 1331 and the second sub-part 1332 forming an angle between them. The preset angle ranges from 30 degrees to 150 degrees. In this embodiment, the first sub-part 1331 and the second sub-part 1332 form a 90-degree angle between them. Of course, other angles can be set according to specific needs, such as 60 degrees, 80 degrees, 120 degrees, etc. When the first sub-part 1331 and the second sub-part 1332 form a 90-degree angle with each other, the first sub-part 1331 extends along the first direction F1 and the second sub-part 1332 extends along the second direction F2. The first direction F1 is the thickness direction of the electronic device 1000, and the second direction F2 is perpendicular to the first direction F1. In other words, the first sub-part 1331 is parallel to the inner wall of the frame 110, and the second sub-part 1332 is perpendicular to the inner wall of the frame 110.

[0108] In this embodiment, the first sub-part 1331 of the conductive connector 130 is embedded in the insulating layer 128. The insulating layer 128 is provided with a groove 129, which is positioned directly opposite the first sub-part 1331 along the first direction F1. The first sub-part 1331 is disposed within the groove 129 and is spaced apart from the inner wall of the groove 129. In other words, the first sub-part 1331 is isolated within the groove 129.

[0109] In this embodiment, by setting the main body 133 as a first sub-part 1331 and a second sub-part 1332 at an angle to each other, the first sub-part 1331 is embedded in the insulating layer 128, which can effectively improve the frame strength. At the same time, a groove 129 is provided in the insulating layer 128, so that the first sub-part 1331 is isolated in the groove 129, which can effectively prevent the main body 133 from generating heat when transmitting current, and prevent heat from being transferred to the insulating layer 128 and the components in the inner frame 120.

[0110] like Figure 13As shown, the frame 110 includes a first fixing part 116 disposed on the first side 111, and the inner frame 120 includes a second fixing part 126 disposed on the first inner side 121. The projections of the first fixing part 116 and the second fixing part 126 on the inner wall of the first side 111 do not coincide. In other words, the first fixing part 116 and the second fixing part 126 are spaced apart along the direction of extension of the first side 111.

[0111] The first connecting part 131 and the first fixing part 116 are stacked and fixedly connected along the first direction F1, and the second connecting part 132 and the second fixing part 126 are stacked and fixedly connected along the first direction F1. For example, the first connecting part 131 is welded to the first fixing part 116, and the second connecting part 132 is welded to the second fixing part 126. It is understandable that, since the first fixing part 116 and the second fixing part 126 are respectively disposed on the first side 111 and the first inner side 121, the first connecting part 131 is equivalent to being stacked on the first side 111, and the second connecting part 132 is stacked on the first inner side 121. Therefore, the main body of the conductive connector 130 is disposed directly on the insulating layer 128. In this embodiment, since the main body 133 is set as the first sub-part 1331 and the second sub-part 1332 forming an angle with each other, it is equivalent to bending the main body 133, so that a part of the main body 133 (the first sub-part 1331) is embedded into the insulating layer 128 along the first direction F1. This reduces the area occupied by the second sub-part 1332, which is laid flat on the insulating layer 128, thereby reducing the area occupied by the frame width while ensuring the frame strength, so as to achieve a narrow frame effect.

[0112] Please refer to the following: Figures 15-20 ,in, Figure 15 This is a schematic diagram of a split structure of a mid-frame provided in the third embodiment of this application. Figure 16 for Figure 15 A schematic diagram of the cross-sectional structure along the A2-A2 interface. Figure 17 for Figure 15 A schematic diagram of the structure of the conductive connector. Figure 18 for Figure 15 A schematic diagram of the cross-sectional structure of the conductive connector along the A2-A2 interface. Figure 19 for Figure 17 A side view of the conductive connector. Figure 20 for Figure 16 Diagram showing the positional relationship between the conductive connector, the frame, and the inner frame.

[0113] like Figure 15 and Figure 16As shown, the middle frame 100 includes a side frame 110, an inner frame 120, and a conductive connector 130. The side frame 110 includes a first side edge 111, and the inner frame 120 includes a first inner side edge 121. The first side edge 111 is adjacent to the first inner side edge 121. The conductive connector 130 is disposed between the first side edge 111 and the first inner side edge 121, and is connected to both the first side edge 111 and the first inner side edge 121. The conductive connector 130, the first side edge 111, and the first inner side edge 121 form a cavity 127, which is filled with an insulating layer 128. The conductive connector 130 can be partially or entirely embedded within the insulating layer 128. The metallic conductive connector, disposed between the side frame and the inner frame, further enhances the rigidity of the middle frame, thereby effectively reducing deformation under external forces.

[0114] It is understood that insulating layers 128 are also filled in other cavities or gaps between the frame 110 and the inner frame 120. The frame 110 and the inner frame 120 can be molded independently. Since the frame 110 and the inner frame 120 have irregular structures, forming the insulating layer 128 through injection molding can effectively bond and seal the frame 110 and the inner frame 120. The overall structure of the insulating layer 128 is the same as in the first embodiment. The insulating layer 128, the frame 110, and the inner frame 120 are nested together. The insulating layer 128 can completely seal the gaps between the frame 110 and the inner frame 120, thereby achieving a seal for the middle frame 100 and preventing corrosion of the internal components of the electronic device 1000 due to moisture ingress.

[0115] In one embodiment, the frame 110 and the inner frame 120 are made of different metal materials, wherein the hardness of the material of the frame 110 is greater than that of the material of the inner frame.

[0116] For example, the frame 110 can be made of profile aluminum, and the inner frame 120 can be made of die-cast aluminum. Profile aluminum refers to aluminum ingots or other raw materials that are melted in a furnace and then extruded through an extruder into a mold. It has the characteristics of high hardness, wear resistance, and strength. When used as the material for the frame 110, it can ensure the strength and hardness of the frame 110 while controlling the overall weight of the machine. Die-cast aluminum refers to the manufacturing process of pressing molten metal raw materials such as aluminum ingots into a mold, and obtaining a metal product after cooling. It has the advantages of accurate dimensions, smooth surface, and small processing amount, which can effectively reduce the manufacturing time of the inner frame 120 and improve work efficiency. By differentiating the materials of the frame 110 and the inner frame 120, the weight of the middle frame 100 can be reduced while ensuring the overall strength of the middle frame 100, thereby reducing the overall weight of the machine.

[0117] In one embodiment, the frame 110 and the inner frame 120 are made of different metal materials, wherein the material density of the inner frame 120 is less than that of the frame 110. The metal material of the inner frame 120 may include one or more selected from magnesium alloys, zinc alloys, and copper alloys. Magnesium alloys, zinc alloys, and copper alloys are commonly used lightweight metals, which can effectively reduce the weight of the mid-frame assembly while ensuring sufficient mechanical strength and heat dissipation, and also ensure good electrical conductivity for use as an antenna, etc. In particular, the use of magnesium alloys further effectively reduces the weight of the mid-frame assembly while ensuring sufficient strength of the inner frame. However, the material of the first metal material of the inner frame 120 is not limited to the above-mentioned materials; any lightweight alloy with a lower density than the metal material of the frame 110 is acceptable.

[0118] For example, the frame 110 can be made of titanium alloy, and the inner frame 120 can be made of aluminum profile, or the frame 110 can be made of titanium alloy and the inner frame 120 can be made of die-cast aluminum. By making the frame 110 of titanium alloy, the overall strength of the middle frame 100 can be further improved, and the appearance's drop resistance and wear resistance can be enhanced. On the other hand, by making the inner frame 120 of aluminum profile or die-cast aluminum, the weight of the middle frame 100 can be reduced.

[0119] In some embodiments, the density of the metal material of the inner frame 120 is 50%-70% lower than or equal to the density of the metal material of the border 110, thereby effectively reducing the weight of the middle frame assembly. If the density of the metal material of the inner frame 120 is greater than 70% of the density of the metal material of the border 110, then the density difference between the metal material of the inner frame 120 and the metal material of the border 110 is not significant, and the weight of the middle frame 100 cannot be effectively reduced, making the use of two different metals meaningless.

[0120] like Figures 17-19 As shown, the conductive connector 130 includes a first connecting part 131, a second connecting part 132 and a main body part 133. The main body part 133 is connected between the first connecting part 131 and the second connecting part 132. The first connecting part 131 is connected to the first side 111 of the frame 110, and the second connecting part 132 is connected to the first inner side 121 of the inner frame 120.

[0121] The main body 133 includes a third sub-part 1333 and a fourth sub-part 1334. Both the third and fourth sub-parts are plate-like structures. The third sub-part 1333 is connected to the first connecting part 131, and the fourth sub-part 1334 is connected to the second connecting part 132. In this embodiment, the third and fourth sub-parts 1333 can be made of different metal materials. The third sub-part 1333 and the first connecting part 131 can be integrally formed, and the fourth sub-part 1334 and the second connecting part 132 can be integrally formed.

[0122] The third sub-part 1333 includes a first coupling portion 331 adjacent to the fourth sub-part 1334, and the fourth sub-part 1334 includes a second coupling portion 332 adjacent to the third sub-part. The first coupling portion 331 and the second coupling portion 332 are spaced apart by a predetermined distance. Preferably, the first coupling portion 331 is parallel to the second coupling portion 332, and the projections of the first coupling portion 331 and the second coupling portion 332 along the first direction F1 at least partially overlap. In this embodiment, the first coupling portion 331 and the second coupling portion 332 are perpendicular to the inner wall of the frame 110; in other words, the first coupling portion 331 and the second coupling portion 332 are perpendicular to the first side 111. Of course, the first coupling part 331, the second coupling part 332 and the first side 111 can be set at a certain angle according to specific needs. For example, the first coupling part 331, the second coupling part 332 and the first side 111 can be set at a 45-degree angle, or the first coupling part 331, the second coupling part 332 and the first side can be set parallel to each other.

[0123] When the first coupling part 331 and the second coupling part 332 are arranged perpendicular to the first side 111, the size of the cavity 127 can be maximized, thereby effectively improving the antenna clearance. When the first coupling part 331 and the second coupling part 332 are at a 45-degree angle to the first side 111, the first coupling part 331 and the second coupling part 332 can be embedded in the insulating layer 128, thereby improving the strength of the insulating layer 128. When the first coupling part 331 and the second coupling part 332 are arranged parallel to the first side 111, the frame width can be reduced, achieving a narrow frame effect.

[0124] The distance between the first coupling part 331 and the second coupling part 332 is the first distance d1. In this embodiment, the first distance can be set between 0.5mm and 1mm, such as 0.5mm, 0.6mm, 0.7mm, etc.

[0125] The third sub-part 1333 and the fourth sub-part 1334 are electrically coupled through the first coupling part 331 and the second coupling part 332. In other words, the third sub-part 1333 and the fourth sub-part 1334 can transmit current through the first coupling part 331 and the second coupling part 332. That is, when the antenna radiator on the first side 111 is in the first feed 106 ( Figure 3When a radiation current i is generated under the excitation of ), the radiation current i can be transmitted to the third sub-part 1333 of the conductive connector 130. Since the first coupling part 331 of the third sub-part 1333 is electrically coupled to the second coupling part 332 of the fourth sub-part 1334, there is a coupling capacitor C between the first coupling part 331 and the second coupling part 332. At this time, the radiation current is transmitted to the coupling capacitor C and charges the coupling capacitor C. Then the radiation current i is transmitted to the fourth sub-part 1334 and transmitted to the first inner side 121 of the inner frame 120 through the fourth sub-part 1334, thereby forming a conductive circuit.

[0126] In this context, coupling can be understood as direct coupling and / or indirect coupling, and "coupled connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection," which can be understood as physical contact and electrical conduction between components; it can also be understood as the form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Indirect coupling" can be understood as electrical conduction between two conductors in a non-contact manner; indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gaps between two conductive parts. In this embodiment, the electrical coupling between the first coupling part 331 and the second coupling part 332 is indirect coupling, or capacitive coupling.

[0127] In this embodiment, when the conductive connector 130, the first side 111, and the first inner side 121 form a conductive circuit, an inductor can be formed, thereby filtering the radiated current on the first side. Furthermore, since a coupling capacitor C is formed between the third sub-part 1333 and the fourth sub-part 1334, this embodiment can further filter the radiated current on the first side through the coupling capacitor C, thereby achieving a double filtering effect, further improving the current stability of the antenna radiator when transmitting and receiving signals, and improving the OTA performance of the antenna.

[0128] like Figure 20 As shown, the first connecting part 131 and the first fixing part 116 are stacked and fixedly connected along the first direction F1, and the second connecting part 132 and the second fixing part 126 are stacked and fixedly connected along the first direction F1. For example, the first connecting part 131 is welded to the first fixing part 116, and the second connecting part 132 is welded to the second fixing part 126. It can be understood that since the first fixing part 116 and the second fixing part 126 are respectively disposed on the first side 111 and the first inner side 121, the first connecting part 131 is equivalent to being stacked on the first side 111, and the second connecting part 132 is stacked on the first inner side 121. Therefore, the occupation of the conductive connector 130 on the frame width can be reduced to achieve a narrow frame effect.

[0129] The above-disclosed embodiments are merely some of the embodiments of this application, and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments, and equivalent changes made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. A middle frame, characterized in that, include: A frame, at least a portion of which serves as an antenna radiator; An inner frame, wherein the border surrounds the periphery of the inner frame, and the border and the inner frame are made of conductive materials of different materials; and A conductive connector is fixedly connected to the frame and the inner frame.

2. The middle frame as described in claim 1, characterized in that, The conductive connector includes a main body, a first connecting part, and a second connecting part. The main body is connected between the first connecting part and the second connecting part. The first connecting part is connected to the frame, and the second connecting part is connected to the inner frame.

3. The middle frame as described in claim 2, characterized in that, The main body includes a first sub-part and a second sub-part, the first sub-part is connected to the second sub-part, and the first sub-part and the second sub-part form a preset angle between each other, the preset angle being 30° to 150°.

4. The middle frame as described in claim 3, characterized in that, The preset included angle is 90°.

5. The middle frame as described in claim 4, characterized in that, The first sub-part is parallel to the inner wall of the frame, and the second sub-part is perpendicular to the inner wall of the frame.

6. The middle frame as described in claim 2, characterized in that, The main body includes a third sub-part and a fourth sub-part, the third sub-part being connected to the first connecting part, and the fourth sub-part being connected to the second connecting part; The third sub-part and the fourth sub-part are spaced apart in a first direction, and the projections of the third sub-part and the fourth sub-part along the first direction at least partially overlap, the first direction being parallel to the inner wall of the frame.

7. The middle frame as described in claim 6, characterized in that, The third sub-part is electrically coupled to the fourth sub-part.

8. The middle frame as described in claim 6 or 7, characterized in that, The distance between the third sub-part and the fourth sub-part along the first direction is 0.5mm to 1mm.

9. The middle frame as described in any one of claims 2-8, characterized in that, The frame includes a first fixing part, and the inner frame includes a second fixing part; The first connecting part is connected to the first fixing part, and the second connecting part is connected to the second fixing part.

10. The middle frame as described in claim 9, characterized in that, The conductive connector forms a cavity with the inner frame and the outer frame, and an insulating layer is disposed inside the cavity.

11. The middle frame as described in claim 10, characterized in that, At least a portion of the main body is embedded in the insulating layer.

12. The middle frame as described in claim 11, characterized in that, The insulating layer includes a groove, at least a portion of the main body is disposed in the groove and spaced apart from the inner wall of the groove.

13. The middle frame as described in any one of claims 1-12, characterized in that, The conductive connector has a plate-like structure, and the thickness of the conductive connector ranges from 0.2 mm to 0.3 mm.

14. The middle frame as described in any one of claims 1-13, characterized in that, The hardness of the frame material is greater than that of the inner frame material.

15. The middle frame as described in any one of claims 1-14, characterized in that, The material density of the border is greater than that of the inner frame.

16. The middle frame as described in any one of claims 1-15, characterized in that, The material of the frame includes at least one of profile aluminum and titanium alloy, and the material of the inner frame includes at least one of die-cast aluminum and profile aluminum.

17. The middle frame as described in any one of claims 1-16, characterized in that, One end of the conductive connector is electrically connected to the frame, which serves as the antenna radiator, and the other end of the conductive connector is electrically connected to the inner frame.

18. An electronic device, characterized in that, It includes a display panel, a back cover, and a middle frame as described in any one of claims 1-17, wherein the display panel, the inner frame, and the back cover are arranged sequentially.

19. The electronic device as claimed in claim 18, characterized in that, The frame includes at least one slit to form the antenna radiator.

20. The electronic device as claimed in claim 18 or 19, characterized in that, The antenna radiator is used in the Sub6G frequency band.

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