Electrical contact and electrical connection device

Abstract

The invention provides an electrical contact and an electrical connection device which have high hardness, wear resistance and excellent conductivity. This electrical contact is provided with: a main body part; a first contact part which is a tip part on one side of the main body part and which is in contact with a first contact object; and a second contact part which is a tip part on the other side of the main body part and which is in contact with a second contact object. The electrical contact is formed from a conductive ceramic material containing titanium. Furthermore, the electrical connection device according to the present invention is provided with a plurality of contacts, each of which has a first contact section that comes into contact with an electrode section of an object to be inspected housed in the housing, and a second contact section that comes into contact with a wiring formed on the substrate, and each of the contacts is the electrical contact according to the present invention.

Description

Technical Field

[0001] This invention relates to electrical contacts, for example, electrical contacts and electrical connection devices that can make electrical contact with the electrode terminals of a semiconductor device (also known as a "semiconductor device" or "semiconductor integrated circuit"). Background Technology

[0002] In inspecting the electrical characteristics of devices such as semiconductor integrated circuits mounted on packages, a probe device is used to electrically connect the device to the inspection apparatus. The probe device electrically connects the electrode terminals of the device to electrode pads disposed on a substrate such as a printed circuit board (PCB). The electrode pads are electrically connected to the inspection apparatus via wiring patterns or the like formed on the substrate.

[0003] Previously, electrical contacts such as probes and spring pins underwent processes such as wire drawing, bending, and cutting of metal materials, and repeatedly came into contact with electrode terminals and other contact objects, thus requiring high hardness. Therefore, electrical contacts are formed from metal materials such as palladium alloys (see Patent Document 1). Existing technical documents Patent documents

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2020-35866 Summary of the Invention The problem the invention aims to solve

[0005] However, if the electrode terminals of a semiconductor device repeatedly come into contact with electrical contacts, the electrical contacts will wear down, and metals such as tin and palladium alloys will adhere to the electrode terminals, resulting in a deterioration of contact.

[0006] In addition, to ensure good contact, metal may be mechanically removed using brushes, cleaning pads, etc. However, this cleaning process can sometimes cause wear and deformation of the electrical contacts, leading to a deterioration in contact performance. Furthermore, there is a problem of shortened contact lifespan.

[0007] Therefore, the present invention was made in view of the above-mentioned problems, and its object is to provide an electrical contact and electrical connection device with high hardness, wear resistance and excellent conductivity. Technical means to solve the problem

[0008] To solve this problem, the first electrical contact of the present invention includes: a main body portion, a first contact portion that is a top portion of one side of the main body portion and contacts a first contact object, and a second contact portion that is a top portion of the other side of the main body portion and contacts a second contact object. The electrical contact is characterized in that it is formed of a conductive ceramic material containing titanium.

[0009] The second electrical connection device of the present invention includes: a frame disposed on a substrate on which wiring is formed, and connected to an electrode portion and wiring of an object to be examined housed within the frame. The electrical connection device is characterized in that it has a plurality of contacts, each of which has a first contact portion that contacts the electrode portion of the object to be examined housed within the frame, and a second contact portion that contacts the wiring formed on the substrate. Each contact is an electrical contact of the first invention. The effects of the invention

[0010] According to the present invention, it is possible to provide electrical contacts with high hardness, wear resistance, and excellent conductivity, and the use of said electrical contacts can provide electrical connection devices with high contact performance. Attached Figure Description

[0011] Figure 1 This is a configuration diagram showing the structure of the electrical connection device in the embodiment. Figure 2 This is a configuration diagram showing the state of the probe when it is in contact with the electrical connection device in the embodiment. Figure 3 This is a diagram showing the characteristics of the conductive ceramic in the embodiment. Figure 4 This is a configuration diagram showing the structure of the probe in a modified implementation. Figure 5 This is a configuration diagram showing the structure of the connecting member in a modified embodiment. Detailed Implementation

[0012] (A) Main Implementation Method Hereinafter, embodiments of the electrical contacts and electrical connection devices of the present invention will be described in detail with reference to the accompanying drawings.

[0013] Here, "electrical contact" refers to a contact that has conductivity and can make contact with a first contact object and a second contact object. For example, probes (including vertical probes and cantilever probes) that contact the electrode terminals of the object being tested, spring pins connecting the wiring terminals of two substrates, and other connectors can be used as "electrical contacts". In this embodiment, a probe used in a test socket is shown as an example of the electrical contact of the present invention.

[0014] "First contact object" refers to the object that one end of the electrical contact contacts, and "second contact object" refers to the object that the other end of the electrical contact contacts. Therefore, it is acceptable as long as the objects contacted by the electrical contacts are different. For example, in the case of a probe, the first contact object is a wiring pattern (connection terminal) on the substrate, and the second contact object can be an electrode terminal of the object being inspected. Alternatively, for example, in the case of a spring pin, the first contact object can be a connection terminal (first connection terminal) on the first substrate, and the second contact object can be a connection terminal (second connection terminal) on the second surface (e.g., the lower surface) of the second substrate.

[0015] An "electrical connection device" is a device that makes an electrical connection between a semiconductor inspection device and the object being inspected. Examples include inspection tools such as probe cards and sockets. In this embodiment, a test socket is used as an example of an electrical connection device.

[0016] (A-1) Composition of electrical connection device Figure 1 This is a configuration diagram showing the structure of the electrical connection device in the embodiment. Figure 2 This is a configuration diagram showing the state of the probe when it is in contact with the electrical connection device in the embodiment.

[0017] Furthermore, while each figure illustrates the main constituent components, it is not limited to the illustrated components and may also include components not shown. In each figure, identical or corresponding constituent elements are labeled with the same or corresponding symbols. Each figure is a schematic diagram; note that the dimensions, thicknesses, etc., of each constituent element differ from the actual dimensions. Additionally, the dimensions and proportions of corresponding constituent elements may differ between the figures. The embodiments shown below illustrate apparatus and methods for implementing the technical concept of this disclosure, but are not intended to limit the materials, shapes, structures, arrangements, etc., of the constituent elements of this disclosure.

[0018] exist Figure 1 In this embodiment, the probe device 1 is a test socket used for checking the electrical characteristics of the inspected object 100.

[0019] The object to be inspected 100 may be a semiconductor device (semiconductor device) mounted on a package such as a semiconductor integrated circuit. The probe device 1 electrically connects the electrode terminals 101 of the object to be inspected 100 to the electrode pads 201 of the substrate 200. Figure 1 An exemplary case is shown where the electrode terminal 101 is a packaged lead electrode. The electrode pad 201 is electrically connected to the inspection device via wiring patterns (not shown) formed on the substrate 200.

[0020] The probe device 1 includes: a frame 10 having a first surface 11 and a second surface 12 opposite to the first surface 11; a probe 20 having a first contact portion 21 and a second contact portion 22 and being supported by the frame 10; and an elastic portion 30 disposed inside the frame 10.

[0021] The probe 20 functions as a contact that electrically connects the electrode terminal 101 and the electrode pad 201. Hereinafter, without limiting the first contact portion 21 and the second contact portion 22, it will also be referred to as a "contact portion".

[0022] In probe 20, the first contact portion 21 that contacts electrode terminal 101 and the second contact portion 22 that contacts electrode pad 201 are at least made of a high-hardness conductive ceramic material. The portions of probe 20 that are not made of conductive ceramic material are made of conductive materials such as metal.

[0023] For example, the probe 20 may also have a structure in which the material between the first contact portion 21 and the second contact portion 22 of the conductive ceramic material is made of a metallic material such as beryllium copper (Be-Cu) or palladium (Pd) alloy. Alternatively, not only the contact portion, but the entire probe 20 may be made of a high-hardness conductive ceramic material. In this embodiment, the case where the entire probe 20 is made of a high-hardness conductive ceramic material will be described as an example.

[0024] The elastic part 30 is disposed inside the frame 10, abutting against the frame 10 and the probe 20.

[0025] To facilitate understanding of the operation of probe device 1, as follows: Figure 1 As shown, the X, Y, and Z directions are defined. Figure 1 In this diagram, the X direction is the left-right direction of the paper, the Y direction is the depth direction of the paper, and the Z direction is the up-down direction of the paper. Furthermore, in the Z direction, the direction from which the probe device 1 observes the object 100 being inspected is designated as the up direction, and the direction from which the probe device 1 observes the object 100 being inspected is designated as the down direction.

[0026] In addition, Figure 1 Only one probe 20 of the probe device 1 is shown, but the probe device 1 may also have multiple probes 20. For example, the probe device (electrical connection device) 1 may also be configured to have multiple probes 20 arranged along the Y direction.

[0027] The thickness of the probe 20 in the Y direction (hereinafter also referred to as "thickness") is, for example, about 0.1 to 0.2 mm. In addition, the thickness of the probe is not limited to 0.1 to 0.2 mm, and can be arbitrarily set according to the size and spacing of the electrode terminals 101, the magnitude of the current flowing through the probe 20 when inspecting the object 100.

[0028] The probe 20 can also be formed by punching a predetermined shape using a sheet of conductive ceramic material, for example, through wire discharge machining or laser processing. Therefore, compared to forming the probe 20 from metal material, the machining accuracy of the probe 20's thickness can be improved. That is, machining deviations in the thickness of the probe 20 are less likely to occur in probes made of conductive ceramic material. On the other hand, since metal material is softer than conductive ceramic material, machining deviations in the thickness of probes 20 made of metal material are more likely to occur.

[0029] exist Figure 1 In the image, viewed from the Z direction, a probe device 1 is positioned below the object being inspected 100.

[0030] The first contact portion 21 of the probe 20 is exposed on the first surface 11 of the frame 10, and the second contact portion 22 of the probe 20 is exposed on the second surface 12 of the frame 10. The probe 20 is disposed on the frame 10 such that the first contact portion 21 contacts the electrode terminal 101 of the object under inspection 100 when the distance between the probe device 1 and the object under inspection 100 narrows in the Z direction. In addition, the probe 20 is disposed on the frame 10 such that the contact area 220 of the second contact portion 22 contacts the electrode pad 201 of the substrate 200.

[0031] When inspecting the object 100, due to the change in the Z-direction position of the first contact portion 21, the position of the contact area 220 in the second contact portion 22 that contacts the electrode pad 201 changes. A detailed explanation of the changes in the state of the probe 20 during inspection will be provided later. Figure 2 To be described later.

[0032] Viewed from the Y direction, probe 20 has a curved shape with an upward-facing recess. The end of the probe 20 opposite the recess (hereinafter referred to as the "curved portion") that is away from the recess is the first contact portion 21. The other end of the probe 20 closer to the recess is the second contact portion 22. A portion of the arcuate region of the outer edge of the curved portion is the contact region 220. When the XY plane defined by the X and Y directions is used as the projection plane, the projection line in the direction connecting the first contact portion 21 and the second contact portion 22 (hereinafter referred to as the "extension direction" of probe 20) extends in the X direction. In other words, viewed from the Z direction, probe 20 extends in the X direction.

[0033] The elastic portion 30 is a cylindrical shape that extends axially along the Y direction. That is, the axial direction of the elastic portion 30 is perpendicular to the displacement direction of the first contact portion 21 of the probe 20 and perpendicular to the extension direction of the probe 20. The elastic portion 30 abuts against the inner side of the recess of the probe 20. In other words, the elastic portion 30 is sandwiched between the surface of the recess of the probe 20 and the inner wall of the frame 10.

[0034] When examining the subject 100, if Figure 2 As shown, the electrode terminal 101 of the object under inspection 100 and the electrode pad 201 of the substrate 200 are electrically connected by a conductive probe 20.

[0035] That is, when inspecting the object 100, the object 100 is moved relative to the probe device 1 along the Z direction, and the first contact portion 21 of the probe 20 is pressed onto the electrode terminal 101 of the object 100. At this time, due to the pressing force applied to the first contact portion 21 between the first contact portion 21 and the electrode terminal 101, the probe 20 changes its posture inside the frame 10 while the second contact portion 22 is in contact with the surface of the electrode pad 201.

[0036] Specifically, corresponding to the Z-direction displacement of the first contact portion 21 caused by the pressure applied to it, the posture of the probe 20 changes inside the frame 10 while maintaining the contact between the second contact portion 22 and the electrode pad 201. As the posture of the probe 20 changes, the position of the contact area 220 in the second contact portion 22 that contacts the electrode pad 201 changes.

[0037] exist Figure 2 In the diagram, solid lines represent the posture of the probe 20 and the shape of the elastic portion 30 when the first contact portion 21 is in contact with the electrode terminal 101 (hereinafter also referred to as the "contact state"). Dashed lines represent the posture of the probe 20 and the shape of the elastic portion 30 when the first contact portion 21 and the electrode terminal 101 are not in contact (hereinafter also referred to as the "non-contact state").

[0038] In the contact state when inspecting the object 100, the posture of the probe 20 changes such that the position of the contact area 220 is closer to the first contact portion 21 than in the non-contact state.

[0039] The probe 20 needs to have conductivity for electrically connecting the electrode terminal 101 and the electrode pad 201, as well as mechanical strength that does not change shape in contact or non-contact states. The probe 20, made of a conductive ceramic material, possesses both conductivity and mechanical strength.

[0040] In the contact state, corresponding to the change in the posture of the probe 20 inside the frame 10, the elastic part 30 is clamped and compressed by the probe 20 and the frame 10. That is, in the contact state, the elastic part 30 elastically deforms. The elastically deformed elastic part 30 applies force to the probe 20 in the direction that returns the posture of the probe 20 to the non-contact state. In other words, the elastic part 30 applies force to the probe 20 in a manner that presses the first contact part 21 onto the electrode terminal 101.

[0041] During the inspection of the inspected object 100, the elastic force of the elastic portion 30 maintains the state in which the first contact portion 21 abuts against the electrode terminal 101 and the second contact portion 22 abuts against the electrode pad 201. Thus, during the inspection of the inspected object 100, the probe 20 ensures the electrical connection between the electrode terminal 101 of the inspected object 100 and the electrode pad 201 of the substrate 200.

[0042] In the probe device 1, a portion of the arc-shaped region on the outer edge of the curved portion of the probe 20 serves as a contact area 220, which contacts the electrode pad 201 via a line extending along the Y direction. Furthermore, as... Figure 2 As shown, the position of the contact area 220 in the contact state is closer to the first contact portion 21 than the position of the contact area 220 in the non-contact state. The position of the contact area 220 changes between the contact state and the non-contact state because the position of the contact area 220 changes along the outer edge of the curved portion according to the change of the probe 20's posture. Since the contact area 220 is contained within the arcuate region of the curved portion, the position of the contact area 220 in contact with the electrode pad 201 changes smoothly according to the change of the probe 20's posture. Therefore, even if the posture of the probe 20 changes, damage to the second contact portion 22 and the electrode pad 201 can be suppressed.

[0043] As described above, when inspecting the object 100, due to the change in the posture of the probe 20, the elastic portion 30 sandwiched between the probe 20 and the frame 10 undergoes elastic deformation. Then, the elastic portion 30 applies force to the probe 20, causing the first contact portion 21 to contact the electrode terminal 101 of the object 100 with a predetermined pressure.

[0044] That is, when the first contact portion 21 is pressed against the electrode terminal 101, the elastic portion 30 applies force to the probe 20 in a direction that counteracts the displacement of the first contact portion 21 caused by the pressing force applied to the first contact portion 21. During the inspection of the object to be inspected 100, that is, during the contact between the first contact portion 21 and the electrode terminal 101, the elastic portion 30 is in a state of compression deformation.

[0045] After the examination of the subject 100 is completed, the relative position of the subject 100 with respect to the probe device 1 in the Z direction is changed by increasing the distance between the subject 100 and the probe device 1. By separating the electrode terminal 101 of the subject 100 from the first contact portion 21 of the probe 20, the pressing pressure applied to the first contact portion 21 is eliminated. As a result, the shape of the elastic portion 30 returns to a non-contact state, and the elastic force of the elastic portion 30 restores the posture of the probe 20 to a non-contact state.

[0046] The probe 20 is supported by the frame 10 in a manner that allows its posture to change in relation to the Z-direction displacement of the first contact portion 21. The posture of the probe 20 changes within the frame 10 such that, corresponding to the Z-direction displacement of the first contact portion 21, the position of the contact area 220 in the second contact portion 22 that contacts the electrode pad 201 changes. For example, although not shown in the figure, a portion of the probe 20 may protrude and be embedded in a support hole provided in the frame 10. Alternatively, a portion of the probe 20 may be placed on a support portion of the frame 10 located below the probe 20.

[0047] As described above, the probe device 1 includes a probe 20 made of conductive ceramic material that is in contact with both the electrode terminal 101 and the electrode pad 201, and an elastic part 30 that applies force to the probe 20 by elastic force when the probe 20 is in contact with the electrode terminal 101.

[0048] The contact load applied to the probe 20 when it contacts the electrode terminal 101 is controlled by the elastic force of the elastic part 30. By increasing the elastic force of the elastic part 30, the contact load increases; by decreasing the elastic force of the elastic part 30, the contact load decreases.

[0049] Furthermore, in the probe device 1, the displacement (hereinafter also referred to as "stroke") of the first contact portion 21 through contact with the electrode terminal 101 is controlled by the elastic force of the elastic portion 30. That is, by increasing the elastic force of the elastic portion 30, the stroke decreases, and by decreasing the elastic force of the elastic portion 30, the stroke increases.

[0050] The elastic part 30 can be made of an elastomer, for example. Alternatively, the elastic part 30 can be made into a cylindrical shape with a hollow structure. By making the elastic part 30 into a cylindrical shape, it is easier to control the magnitude of the contact load and the stroke. That is, by increasing the thickness of the cylindrical elastic part 30, the contact load can be increased or the stroke can be reduced. On the other hand, by thinning the thickness of the cylindrical elastic part 30, the contact load can be reduced or the stroke can be increased.

[0051] The elastic part 30 can be a conductive material or an insulating material. However, the materials of the frame 10 and the elastic part 30, as well as the arrangement of the elastic part 30 inside the frame 10, are set in a way that makes the probes 20 electrically insulated from each other.

[0052] (A-2) Detailed description of probe 20 Conventionally, metallic materials are used in the contacts of the electrical connection electrode terminals 101 and electrode pads 201. These contacts correspond to probes 20 in the probe device 1. Through repeated inspection of the inspected object 100, metallic materials (such as tin or nickel-palladium (Ni-Pd)) adhere to the surfaces of the contacts of the electrode terminals 101 and electrode pads 201. To prevent a decrease in the contactability of the contacts between the electrode terminals 101 and electrode pads 201, the metallic material adhering to the contact surfaces needs to be removed through a cleaning process.

[0053] However, due to physical cleaning operations, the surface of the contacts may wear or break, and the probes may sometimes deform, reducing the contactability of the contacts. As a result, this can sometimes affect the accuracy of the inspection.

[0054] Here, in the probe device 1, by using a conductive ceramic material with high hardness and wear resistance compared to metal materials in the material of the probe 20, the reduction of the contact of the probe 20 can be suppressed.

[0055] For example, according to the probe device 1, wear of the probe 20 caused by cleaning operations that remove metal adhering to the surface of the probe 20 can be suppressed. In addition, according to the probe device 1, the probe 20 can be stably contacted with the electrode terminal 101 and the electrode pad 201.

[0056] (A-3) Detailed description of conductive ceramic Figure 3 This is a diagram showing the characteristics of the conductive ceramic in the embodiment.

[0057] exist Figure 3 In the text, the characteristics of beryllium copper (Be-Cu), a representative metallic material used as a conventional probe (labeled "Comparative Example 1"), and the characteristics of titanium carbonitride or materials containing titanium carbonitride illustrated in this embodiment (labeled "Examples 1-4") are shown, for example, hardness (Vickers hardness) and volume resistivity.

[0058] As high-hardness conductive ceramics, examples 1-4 illustrate conductive ceramics with titanium carbonitride as the main component.

[0059] Examples 1 and 2 are conductive ceramics containing titanium carbonitride, nickel, and chromium as main components, while Examples 3 and 4 are conductive ceramics containing titanium carbonitride as the main component.

[0060] From the viewpoint of good conductivity, the volume resistivity of probe 20 is, for example, about 100 [×10]. -6 The value below Ω·cm is good, and preferably 60 [×10] -6 Below 100 Ω·cm. In this way, by making the volume resistivity of probe 20 approximately 100 [×10⁻⁶]... -6With a current of [Ω·cm] or less, good conductivity can be ensured.

[0061] From the viewpoint of wear resistance, a hardness of 800 HV or higher for the probe 20 is good, preferably 1000 HV or higher, and more preferably 1380 HV or higher. By making the hardness of the probe 20, etc., higher than that of the metal material (e.g., 800 HV or higher), it is easier to generate metal shavings during contact and harder to cut during cleaning, thus suppressing deformation and improving contact performance.

[0062] As described above, titanium-based ceramics are good as conductive ceramics with high hardness and good conductivity. Furthermore, ceramics with titanium carbonitride as the main component and composite ceramics containing titanium carbonitride (hereinafter referred to as "titanium carbonitride ceramics") are preferred.

[0063] Furthermore, by making the probe 20 a titanium carbonitride ceramic, it is easy to perform tip processing (e.g., tip peaking). For example, by tip peaking, the contact surface of the probe 20 with the metal terminals such as electrode terminals of the object being inspected can be easily processed, thus enabling good contact.

[0064] Furthermore, by making the probe 20 a conductive ceramic, the maximum operating temperature is increased. This can suppress the deformation of the probe 20 and extend its lifespan.

[0065] (A-4) Effects of the implementation method As described above, according to this embodiment, by forming the electrical contacts from titanium carbonitride ceramics, hardness can be increased, thus suppressing wear during cleaning and improving contact performance. Furthermore, lifespan can be extended. Additionally, due to the low volume resistivity, conductivity can be maintained.

[0066] Furthermore, by using electrical contacts formed from titanium carbonitride ceramics to perform electrical inspections of the inspected object, the contact of probes and the like becomes excellent, thus enabling high-precision inspections.

[0067] (B) Other implementation methods The embodiments of the electrical contacts and electrical connection devices of the present invention have also been mentioned in the above embodiments, but the present invention can also be applied to the following modified embodiments.

[0068] (B-1) In the above embodiment, an electrical contact formed of titanium carbonitride ceramic is exemplified as a high-hardness conductive ceramic, but a portion of the electrical contact may also be coated with a metal plating or other coating process.

[0069] (B-2) Use Figure 4An example of a modified probe is shown. In this modified embodiment, a vertical probe is illustrated, but the structure of the vertical probe is not limited to this. Figure 4 .

[0070] like Figure 4 As shown, probe 20A has a first plunger 31, two second plungers 32 (32a, 32b) and a helical spring 33.

[0071] The first plunger 31 and the second plunger 32 (32a, 32b) are plate-shaped components, with the two second plungers 32 (32a, 32b) sandwiching the two sides of the first plunger 31. In addition, a helical spring 33 is provided in a manner that covers the outer periphery of the second plunger 32 (32a and 32b) overlapping with the first plunger 31.

[0072] The first plunger 31 has a coil support portion 311 that is wider than the end into which the coil spring 33 is inserted. Similarly, the second plunger 32 (32a, 32b) also has a coil support portion 321 that is wider than the end into which the coil spring 33 is inserted. Both ends of the coil spring 33 are supported by the coil support portions 311 and 321. Therefore, during inspection, when a contact load is applied to the first plunger 31 and the second plunger 32 (32a, 32b), the coil spring 33 is elastic in the Z-axis direction, making it possible for the probe 20A to move up and down (in the Z-axis direction).

[0073] Furthermore, the method of assembling the probe 20A using the first plunger 31, the second plungers 32 (32a, 32b), and the helical spring 33 includes, for example, inserting two second plungers 32 (32a, 32b) from one end of the helical spring 33. Then, the first plunger 31 is inserted from the other end of the helical spring 33, so that the first plunger 31 is housed between the two second plungers 32. However, the assembly method of the probe 20A is not limited to the method described above.

[0074] Figure 4 The probe 20A shown is also formed of a high-hardness conductive ceramic material, particularly a conductive ceramic with titanium carbonitride as the main component.

[0075] For example, all components (parts) of the first plunger 31, the second plunger 32 (32a, 32b), and the coil spring 33 may be formed of conductive ceramic. Alternatively, for example, some components of the first plunger 31, the second plunger 32 (32a, 32b), and the coil spring 33 may also be formed of conductive ceramic. For example, the first plunger 31 and the second plunger 32 may also be formed of conductive ceramic, and the coil spring 33 may be formed of metal, etc.

[0076] In addition, for example, the first plunger 31, the second plunger 32 (32a, 32b), and the helical spring 33 can be made entirely of conductive ceramic, or a portion of each component can be made of conductive ceramic.

[0077] When using the conductive ceramic processing probe 20A, the shape can be machined by cutting the sheet material formed of conductive ceramic through wire discharge machining or laser processing. This reduces the need for processes such as wire drawing and bending of metal materials, which are common in the past. While wire discharge machining produces burrs on the cut surface of metal sheets, burrs are less likely to form on conductive ceramic sheets, thus improving machining accuracy.

[0078] The probe 20A contacts the electrode terminal 101 of the object under inspection 100 and the connection terminal 85 of the substrate. However, due to the high frequency of contact, mechanical strength is required. That is, the conductive ceramic material must have high hardness. Furthermore, conductivity is also required.

[0079] (B-3) Next, for connectors such as spring pins, examples are also shown of those made of high-hardness conductive ceramics with titanium carbonitride as the main component.

[0080] exist Figure 5 In this process, the connector 16 can utilize existing spring pins, for example, having a third plunger 161, a fourth plunger 162, a cylinder 163, and a helical spring 164.

[0081] Furthermore, connector 16 is illustrated here. Figure 5 The case of the spring pin, but the structure of the connector 16 is not limited to... Figure 5 In addition, the connector 16 is not limited to a spring pin, but can also be a rod or the like.

[0082] Each of the third plunger 161 and the fourth plunger 162 is a generally pointed cylindrical or cylindrical member, and is a member protruding from the end of the cylindrical body 163. Inside the cylindrical body 163, a helical spring 164 is provided, which is fixed to the ends of the third plunger 161 and the fourth plunger 162. Thus, the connecting member 16 has elasticity in the Z-axis direction.

[0083] Here, connector 16 is connected to terminal 53 of wiring substrate (first substrate) and connection terminal 54 of wiring substrate (second substrate), but mechanical strength is required. Of course, electrical conductivity is also required.

[0084] Therefore, connector 16 can also be formed of a high-hardness conductive ceramic material, just like probe 20A.

[0085] For example, the third plunger 161 and the fourth plunger 162, two of the four constituent elements (components), are formed of conductive ceramic. Of course, all constituent elements, including the third plunger 161, the fourth plunger 162, the cylinder 163, and the helical spring 164, can be formed of conductive ceramic. Alternatively, for example, the third plunger 161 and the fourth plunger 162 can be entirely or partially formed of conductive ceramic.

[0086] (B-4) The structure of the vertical probe illustrated in the above embodiments is not limited to... Figure 4 The structure is illustrated in the example. Figure 4 The vertical probe is illustrated as a probe formed by four components, but the number of components is not limited; for example, it can also be formed by one component. Furthermore, the shape of the vertical probe is not limited.

[0087] (B-5) In the above embodiment, the case where the probe is a vertical probe is illustrated, but the probe may also be a cantilever probe.

[0088] In the case of cantilever probes, they can be formed entirely of titanium carbonitride ceramics, or partially of titanium carbonitride ceramics. Furthermore, since cantilever probes can be formed from titanium carbonitride ceramic sheets through electrical discharge machining (EDM), they are easier to process compared to conventional metallic materials.

[0089] (B-6) In the above embodiments, the cases in which the electrical contact of the present invention is a probe and the cases in which the electrical contact is a spring needle are illustrated, but the probe may be made of conductive ceramic material only, or the spring needle may be made of conductive ceramic material only.

[0090] In addition, conductive ceramics can be used to form conductive components, such as in electrical connection devices like probe cards. Symbol Explanation

[0091] 1: Probe device; 10: Frame; 11: First surface; 12: Second surface. 20: Probe; 20A: Probe; 21: First contact portion; 22: Second contact portion; 30: Elastic portion. 100: Subject being inspected; 101: Electrode terminal; 31: First plunger, 32: Second plunger, 33: Coil spring. 53: Terminal, 54: Connecting terminal, 62: Second plunger, 85: Connecting terminal 16: Connector; 161: Third plunger; 162: Fourth plunger; 163: Cylinder; 164: Helical spring. 200: Substrate, 201: Electrode pad, 220: Contact area, 311: Coil support, 321: Coil support.

Claims

1. An electrical contact, the electrical contact comprising: The electrical contact comprises a main body portion, a first contact portion which is a top portion of one side of the main body portion and contacts a first contact object, and a second contact portion which is a top portion of the other side of the main body portion and contacts a second contact object, wherein the electrical contact is formed of a conductive ceramic material containing titanium.

2. The electrical contact according to claim 1, characterized in that, The electrical contact is formed entirely of a conductive ceramic material with titanium carbonitride as the main component or a conductive ceramic material containing titanium carbonitride.

3. The electrical contact according to claim 2, characterized in that, The electrical contact has a Vickers hardness of approximately 800 HV or higher and a volume resistivity of approximately 60 × 10⁻⁶. -6 Below Ω·cm.

4. The electrical contact according to claim 2, characterized in that, The electrical contact has a Vickers hardness of approximately 1000 HV or higher and a volume resistivity of approximately 100 × 10⁻⁶ HV. -6 Below Ω·cm.

5. An electrical connection device comprising a frame disposed on a substrate having wiring formed thereon, and connected to an electrode portion of an object to be inspected and the wiring disposed within the frame, characterized in that it comprises: Multiple contacts, each having a first contact portion that contacts the electrode portion of the object being inspected, housed in the frame, and a second contact portion that contacts the wiring formed on the substrate. Each of the aforementioned contacts is an electrical contact as described in any one of claims 1 to 4.

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