System packaging module and electronic equipment

Abstract

The invention relates to a system packaging module and electronic equipment. The system packaging module comprises a substrate, a first device, a second device, a packaging module and a packaging layer. The first device and the second device are located on the same side of the substrate at intervals, and the distance between the surface, away from the substrate, of the first device and the substrate is larger than that between the surface, away from the substrate, of the second device and the substrate. The packaging module comprises an RDL, a conductive part, a third device and a fourth device, the RDL is located on the side, away from the substrate, of the second device, the third device and the fourth device are both located on the side, away from the second device, of the RDL, the third device and the fourth device are both arranged on the RDL in an inverted mode, the conductive part is electrically connected with the RDL, the packaging module is arranged on the substrate, the packaging module and the second device are arranged in a stacked mode, and the second device is arranged on the substrate. The conductive member is electrically connected with the substrate. A surface of the third device away from the RDL is exposed out of the encapsulation layer. The system packaging module provided by the embodiment of the invention is high in integration level and small in size.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of device packaging, and particularly relates to a system packaging module and an electronic device. BACKGROUND

[0002] In order to improve the performance of electronic devices, the integration of integrated circuits and the integration of circuit boards are constantly improved. The current devices use system-level packaging to improve the integration of integrated circuits, such as from single-sided devices to double-sided devices, and then to multi-layer device stacking, but the integration of the system packaging module formed by packaging is low, which is not conducive to the miniaturization of the system packaging module. SUMMARY

[0003] Embodiments of the present application provide a system packaging module and an electronic device. The present application improves the integration of the system packaging module by designing the structure of the system packaging module, which is conducive to reducing the volume of the system packaging module and realizing the miniaturization of the system packaging module.

[0004] In a first aspect, embodiments of the present application provide a system packaging module. The system packaging module comprises a substrate, a first device, a second device, a packaging module and a packaging layer. The first device and the second device are located on the same side of the substrate and are electrically connected to the substrate, the distance between the surface of the first device away from the substrate and the substrate is a first distance, and the distance between the surface of the second device away from the substrate and the substrate is a second distance; the first distance is greater than the second distance. It can be understood that if the substrate is taken as a reference, the surface of the first device away from the substrate is higher than the surface of the second device away from the substrate. The first device can be the device with the largest distance between the surface of the device away from the substrate and the substrate.

[0005] The packaging module comprises a redistribution layer (RDL), a conductive member, a third device and a fourth device. The RDL is located on a side of the second device away from the substrate. The third device and the fourth device are both located on a side of the RDL away from the second device and are both electrically connected to the RDL. The third device and the fourth device are both flip-chip mounted on the RDL. The conductive member is electrically connected to a side of the RDL close to the substrate. The packaging module is arranged on the substrate and is stacked with the second device. The conductive member is electrically connected to the substrate. The packaging layer covers part of the packaging module. A surface of the third device away from the RDL is exposed to the packaging layer. It can be understood that the packaging module is stacked and arranged correspondingly with the second device and is not arranged correspondingly with the first device. The packaging module can further comprise other devices in addition to the third device and the fourth device. In other words, the packaging module can comprise at least two devices, and the integration of the at least two devices is realized through the RDL. It can be understood that the third device and the fourth device are both flip-chip mounted on the RDL, that is, the active layer of the third device is closer to the RDL than the substrate of the third device, and the active layer of the fourth device is closer to the RDL than the substrate of the fourth device. The third device and the fourth device are both flip-chip mounted on the RDL, that is, the third device and the fourth device are both flip-chip mounted on the substrate.

[0006] In some embodiments, at least part of the projection of the second device on the plane where the RDL is located overlaps the RDL, and the projection of the first device on the plane where the RDL is located does not overlap the RDL, so that the packaging module is stacked with the second device.

[0007] The embodiments of the present application realize the integration of at least two devices through the RDL, which is beneficial to the thinning of the overall packaging module and can reduce the number of conductive members required by the at least two devices, thereby improving the integration of the system packaging module. The embodiments of the present application are arranged such that the third device and the fourth device are both flip-chip mounted on the RDL, that is, the third device and the fourth device are both flip-chip mounted on the substrate, so that the packaging method is compact, the area of the substrate occupied by the third device and the fourth device is reduced, and the substrate is miniaturized.

[0008] The embodiment of the present application sets the packaging module on the substrate, and stacks the second device. The integrated third device, fourth device and RDL are arranged on the side of the second device away from the substrate, so as to realize the stacking of the second device and the connecting piece (the connecting piece is arranged between the second device and the substrate for electrical connection) with a smaller sum of thicknesses. Since the distance between the surface of the first device away from the substrate and the substrate is greater than the distance between the surface of the second device away from the substrate and the substrate, the space on the upper part of the second device and the connecting piece with a smaller sum of thicknesses is fully utilized, which is conducive to controlling the thickness of the system packaging module, avoiding the thickness of the system packaging module being too large, and facilitating the miniaturization of the system packaging module. If the integrated third device, fourth device and RDL are stacked on the first device and the connecting piece (the connecting piece is arranged between the first device and the substrate for electrical connection) with a larger sum of thicknesses, the thickness of the system packaging module will be significantly increased. It should be noted that the thickness in the embodiment of the present application refers to the size in the first direction, and the first direction is the thickness direction of the system packaging module.

[0009] In a possible implementation, the size of the third device in the first direction is smaller than the size of the first device in the first direction, and the size of the fourth device in the first direction is smaller than the size of the first device in the first direction. The first direction is the thickness direction of the system packaging module. The embodiment of the present application can integrate some devices that need to transmit signals to each other and have a smaller thickness into a packaging module through an RDL, and stack the packaging module integrating the devices with a smaller thickness and the second device, which is conducive to the miniaturization of the system packaging module.

[0010] In a possible implementation, the third device includes a substrate and an active layer stacked together, the active layer is closer to the substrate than the substrate, and the size of the substrate in the first direction is greater than or equal to 40 um and less than or equal to 130 um. The active layer being closer to the substrate than the substrate can be understood as that the third device is flip-chip mounted on the substrate. The embodiment of the present application sets the size of the substrate in the first direction to be greater than or equal to 40 um and less than or equal to 130 um, which is conducive to preventing the substrate from being damaged and facilitating the thinning of the packaging module. If the size of the substrate of the third device in the first direction is less than 40 um, the substrate of the third device is prone to cracking or breaking, which damages the substrate of the third device. If the size of the substrate of the third device in the first direction is greater than 130 um, the substrate of the third device is too thick, which is not conducive to the thinning of the system packaging module.

[0011] It can be understood that the size of the substrate of the fourth device in the first direction is greater than or equal to 40 um and less than or equal to 130 um, which is conducive to preventing the substrate of the fourth device from being damaged and facilitating the thinning of the system packaging module.

[0012] In a possible implementation, the distance between the surface of the conductive member away from the substrate and the substrate is a third distance, and the third distance is greater than the second distance. In other words, the conductive member is higher than the surface of the second device, and a gap is provided between the RDL and the second device. The embodiments of the present application can be used to fix the integrated RDL, the third device, and the fourth device to the substrate through the conductive member, and electrically connect the integrated RDL, the third device, and the fourth device to the substrate through the conductive member. The first device, the second device, and the packaging module are encapsulated by the encapsulating glue. The distance between the surface of the conductive member away from the substrate and the substrate is greater than the distance between the surface of the second device away from the substrate and the substrate, so that the RDL is suspended, and the encapsulating glue is facilitated to enter the gap between the RDL and the second device.

[0013] In a possible implementation, the third distance is greater than or equal to 20 um. It can be understood that after the integrated RDL, the third device, and the fourth device are fixed and electrically connected to the substrate through the conductive member, the first device, the second device, and the packaging module need to be encapsulated by the encapsulating glue. If the distance between the surface of the conductive member away from the substrate and the substrate (the third distance) is less than 20 um, the conductive member is too short, the gap between the RDL and the second device is too small, the encapsulating glue is difficult to enter the gap between the RDL and the second device, and bubbles and other phenomena may occur, which affects the quality of the encapsulation, reduces the performance of the system packaging module, and affects the yield of the system packaging module.

[0014] It can be understood that the larger the area of the RDL is, the greater the distance between the surface of the conductive member away from the substrate and the substrate can be. The larger the area of the RDL is, the longer the path of the encapsulating glue to enter the gap between the RDL and the second device is, the more difficult the encapsulating glue to enter the gap between the RDL and the second device is, and the lower the yield is. Therefore, the distance between the surface of the conductive member away from the substrate and the substrate needs to be increased to facilitate the encapsulating glue to enter the gap between the RDL and the second device.

[0015] In a possible implementation, the conductive member is a copper pillar. The copper pillar can be formed by an electroplating process. The size of the copper pillar formed by the electroplating process can be small, and the distance between two adjacent copper pillars can be small, which is beneficial to reduce the area occupied by the conductive member.

[0016] In a possible implementation, the diameter of the conductive member is less than or equal to 0.15 mm. When the conductive member is a copper pillar, the conductive member is usually in a cylindrical shape. By setting the diameter of the conductive member to be less than or equal to 0.15 mm, the area occupied by the conductive member can be reduced. For example, the diameter of the conductive member can be 0.1 mm, 0.08 mm, 0.06 mm, or 0.05 mm, etc. In other embodiments, the diameter of the conductive member can also be greater than 0.15 mm.

[0017] In a possible implementation, the distance between the centers of two adjacent conductive members is less than or equal to 0.25 mm. When the conductive member is a copper pillar, the conductive member is generally in a cylindrical shape. The center of the conductive member is the geometric center of the conductive member. By setting the distance between the centers of two adjacent conductive members to be less than or equal to 0.25 mm, the area occupied by the conductive member is reduced. For example, the distance between the centers of two adjacent conductive members can be 0.2 mm, 0.15 mm, or 0.12 mm, etc. In other embodiments, the distance between the centers of two adjacent conductive members can also be greater than 0.25 mm. It can be understood that the conductive member can also be a cuboid, a cube, or a column structure with a triangular or pentagonal cross section, and the embodiments of the present application do not limit the shape of the conductive member.

[0018] In a possible implementation, the packaging layer covers the first device, and a surface of the third device away from the RDL is flush with the packaging layer on a side of the first device away from the substrate. It can be understood that the surface of the fourth device away from the RDL can be exposed to the packaging layer. The surface of the fourth device away from the RDL can also be flush with the packaging layer on the side of the first device away from the substrate. By setting the surface of the third device away from the RDL to be exposed to the packaging layer and flush with the packaging layer on the side of the first device away from the substrate, the embodiments of the present application can reduce the thickness of the system packaging module, and achieve thinning, miniaturization, and light weight of the system packaging module.

[0019] In a possible implementation, the first device is a filter or a power device, and the material of the power device includes gallium arsenide. When the first device is a filter, the first device cannot be ground, and the side of the first device away from the substrate is covered by the packaging layer. When the first device is a power device and the material of the power device includes gallium arsenide, the material of the first device is harmful, the first device cannot be ground, and the side of the first device away from the substrate needs to be covered by the packaging layer.

[0020] In a possible implementation, the packaging layer covers part of the first device, the surface of the first device away from the substrate is exposed to the packaging layer, and the surface of the third device away from the RDL is flush with the surface of the first device away from the substrate. The first device of the embodiments of the present application can be ground, and by setting the surface of the third device away from the RDL to be flush with the surface of the first device away from the substrate, the thickness of the system packaging module can be reduced, and thinning, miniaturization, and light weight of the system packaging module can be achieved.

[0021] In a possible implementation, the number of packaging modules is at least two, and at least two packaging modules are arranged on the side of the substrate facing the second device. The number of packaging modules of the embodiments of the present application can be multiple, and the integration of multiple devices can be achieved as needed, with high flexibility.

[0022] In a possible implementation, the third device is a chip or a passive element, and the fourth device is a chip or a passive element. The types of the third device and the fourth device can be flexibly selected according to requirements.

[0023] In a possible implementation, the system package module includes a fifth device, the fifth device is located on a side of the substrate away from the second device, among the devices on the side of the substrate away from the second device, the fifth device is a device with a largest size in a first direction, and the size of the fifth device in the first direction is smaller than the size of the first device in the first direction. It can be understood that, when the devices with large thicknesses are arranged on opposite sides of the substrate, the thickness of the system package module is increased. In the embodiment of the present application, the devices with large thicknesses are arranged on one side of the substrate, which is beneficial to miniaturization of the system package module.

[0024] In a second aspect, the present application provides an electronic device including a circuit board and the system package module according to any one of the foregoing embodiments, and the system package module is electrically connected to the circuit board. The electronic device can be a tablet computer, a notebook computer, a mobile phone, a vehicle-mounted device, a wearable device, a drone, or the like. The circuit board can be a printed circuit board or a ceramic circuit board, or the like. The system package module in the embodiment of the present application occupies a small space in the electronic device, and improves the space utilization of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0026] Figure 1 is a structural schematic diagram of an electronic device provided by the embodiment of the present application;

[0027] Figure 2 is Figure 1 is a structural schematic diagram of the system package module shown in FIG. 1;

[0028] Figure 3 is Figure 2 is a structural schematic diagram of the system package module from another perspective shown in FIG. 1;

[0029] Figure 4 is Figure 2 is a structural schematic diagram of the third device shown in FIG. 1;

[0030] Figure 5 is a structural schematic diagram of a system package module in the prior art;

[0031] Figure 6 is Figure 3A structural schematic diagram of a package module of the system package module shown in the figure;

[0032] Figure 7 is Figure 6 A structural schematic diagram of the package module from another perspective shown in the figure;

[0033] Figure 8 is Figure 3 A partial structural schematic diagram of the system package module shown in the figure;

[0034] Figure 9 is a structural schematic diagram of the system package module before being ground;

[0035] Figure 10 is a structural schematic diagram of another system package module provided by the embodiment of the present application;

[0036] Figure 11 is a structural schematic diagram of another system package module provided by the embodiment of the present application. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0038] It should be understood that the terms "first", "second", etc. used in the present application are only for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can it be understood as indicating or implying sequence.

[0039] In the description of the present application, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0040] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or can be in contact connection or integral connection; for those of ordinary skill in the art, the specific meaning of the above-mentioned term in the present application can be understood according to the specific circumstances.

[0041] As Figure 1 shown, Figure 1Fig. 1 is a structural schematic diagram of an electronic device 100. The electronic device 100 can be a tablet computer, a notebook computer, a mobile phone, a vehicle-mounted device, a wearable device, a drone, or the like. In the embodiments of the present application, the electronic device 100 is taken as an example of a mobile phone.

[0042] The electronic device 100 can include a circuit board 10 and a system packaging module 20. The system packaging module 20 is electrically connected to the circuit board 10 to realize the functions of the system packaging module 20.

[0043] The circuit board 10 can be a printed circuit board or a ceramic circuit board, and the like. The circuit board 10 can be a flexible circuit board, a rigid circuit board, or a rigid-flexible combined board, and the like. The type of the circuit board 10 is not limited in the embodiments of the present application.

[0044] The system packaging module 20 realizes the protection of the device, improves the reliability and stability of the device, and improves the integration of the integrated circuit, which is conducive to the miniaturization of the electronic device 100. The system packaging module 20 in the embodiments of the present application occupies a small space in the electronic device 100, which improves the space utilization of the electronic device 100.

[0045] In some embodiments, the electronic device 100 can include a housing 101 and a camera module 102. The circuit board 10, the system packaging module 20, and at least part of the camera module 102 are located in the housing 101. The camera module 102 has a camera function and can take pictures or videos. The housing 101 can be provided with an opening, and the camera module 102 collects light through the opening to realize picture or video shooting. The housing 101 can include a light-transmitting lens, which is installed on the opening of the housing 101 to allow light to pass through and can prevent dust and water. In other embodiments, the camera module 102 can also serve as a front camera of the electronic device 100.

[0046] In some embodiments, the electronic device 100 can include a battery 103. The battery 103 is located in the housing 101. The battery 103 is used to power the components inside the electronic device 100. The volume of the battery 103 is generally large, which occupies a large internal space of the electronic device 100. The battery 103 can be a lithium battery, a nickel-cadmium battery, a nickel-hydrogen battery, or the like. Figure 1 The battery 103 shown in the figure is rectangular, and can also be circular, square, or irregularly shaped, and the shape and position of the battery 103 are not specifically limited in the embodiments of the present application.

[0047] In some embodiments, the electronic device 100 can include a display module 104. The display module 104 is located in the housing 101. The display module 104 can be a liquid crystal display (LCD) module, an organic light-emitting diode (OLED) module, or the like. Figure 1The display module and the shell 101 jointly define a containing space for containing the circuit board 10, the system packaging module 20, the battery 103, and at least part of the camera module 102, and the like. The display module has a display function and can display pictures or images to meet the use requirements of users. The display module can include a display layer and a touch layer overlaid on the display layer. The touch layer can be transparent glass, plastic, or other materials with good light transmission. The display layer can be a liquid crystal display, an active matrix organic light-emitting diode display, a micro light-emitting diode, a micro organic light-emitting diode display, a quantum dot light-emitting diode display, or an organic light-emitting diode display, and the like.

[0048] Figure 1 The structure of the electronic device 100 is only schematically shown. The circuit board 10, the system packaging module 20, the camera module 102, and the battery 103 shown in the figure are only schematically shown, and the size, number, and position thereof can be adjusted as needed, which is not limited in the present application. Figure 1 The structure of the electronic device 100 is only schematically shown. The circuit board 10, the system packaging module 20, the camera module 102, and the battery 103 shown in the figure are only schematically shown, and the size, number, and position thereof can be adjusted as needed, which is not limited in the present application.

[0049] As shown in FIG. 1, Figure 2 and Figure 3 As shown in FIG. 1, Figure 2 As shown in FIG. 1, Figure 1 As shown in FIG. 1, Figure 3 As shown in FIG. 1, Figure 2 As shown in FIG. 1, the system packaging module 20 can include a substrate 21, a first device 22, a second device 23, a packaging module 24, and a packaging layer 27. The substrate 21 can be a resin substrate, a ceramic substrate, a glass substrate, a silicon substrate, or a printed circuit board, and the like.

[0050] The first device 22 can be a chip or other devices such as a passive element. The first device 22 is electrically connected to the substrate 21. For example, the first device 22 can be electrically connected to the substrate 21 through a tin ball 25, or the first device 22 can be electrically connected to the substrate 21 through a copper column or other connecting member. The surface 221 of the first device 22 close to the substrate 21 is oppositely arranged to the surface 222 of the first device 22 away from the substrate 21. The surface 221 of the first device 22 close to the substrate 21 is electrically connected to the substrate 21 through the tin ball 25, and the distance between the surface 222 of the first device 22 away from the substrate 21 and the substrate 21 is a first distance L1. It can be understood that Figure 2 The number of tin balls 25 is two, and the number of tin balls 25 between the first device 22 and the substrate 21 can be three, four, or five, and the like, which is not limited in the present application, and the positions of the plurality of tin balls 25 can be adjusted as needed.

[0051] The second device 23 can be a chip or other device such as a passive element. The second device 23 is located on the same side of the substrate 21 as the first device 22 and is spaced apart from the first device 22. The second device 23 is electrically connected to the substrate 21. For example, the second device 23 can be electrically connected to the substrate 21 by the copper pillar 26, or the second device 23 can be electrically connected to the substrate 21 by other connecting elements such as a solder ball. The surface 231 of the second device 23 that is close to the substrate 21 is arranged opposite the surface 232 of the second device 23 that is away from the substrate 21. The surface 231 of the second device 23 that is close to the substrate 21 is electrically connected to the substrate 21 by the copper pillar 26. The distance between the surface 232 of the second device 23 that is away from the substrate 21 and the substrate 21 is the second distance L2. It can be understood that Figure 2 Two copper pillars 26 are shown. The number of copper pillars 26 between the second device 23 and the substrate 21 can be three, four, or five, and the like. The number of copper pillars 26 is not limited in the embodiments of the present application. In addition, the positions of the plurality of copper pillars 26 can be adjusted as needed.

[0052] Figure 3 For example, the number of second devices 23 is three. It can be understood that the number of second devices 23 can also be one, two, four, or five, and the like. The number of second devices 23 is not limited in the embodiments of the present application. When the number of second devices 23 is two or more, the distances L2 between the surfaces 232 of the plurality of second devices 23 that are away from the substrate 21 and the substrate 21 can be the same or different. However, the distance L2 between the surface 232 of each second device 23 that is away from the substrate 21 and the substrate 21 is less than the distance L1 between the surface 222 of the first device 22 that is away from the substrate 21 and the substrate 21. The arrangement of the plurality of second devices 23 can be set as needed and is not limited to Figure 3 the arrangement shown.

[0053] In some embodiments, the first distance L1 is greater than the second distance L2. It can be understood that the sum of the thicknesses of the first device 22 and the solder ball 25 is greater than the sum of the thicknesses of the second device 23 and the copper pillar 26. It can be understood that the first device 22 is the device with the largest sum of the thicknesses of the device that is away from the substrate 21 and the solder ball or other connecting element on the side of the substrate 21, that is, the first device is the device with the largest distance between the surface of the device that is away from the substrate 21 and the substrate 21. In some embodiments, the thickness of the second device 23 can be less than the thickness of the first device 22.

[0054] It should be noted that the thickness in the embodiments of the present application refers to the size in the first direction A1, which is the direction from the RDL 241 to the second device 23.

[0055] The packaging module 24 can include an RDL 241, a conductive member 242, a third device 243, and a fourth device 244. The packaging module 24 can be spaced apart from the first device 22 and the second device 23. The third device 243 can be a chip or another device such as a passive element, and the fourth device 244 can be a chip or another device such as a passive element. The packaging module 24 can include two devices, such as the third device 243 and the fourth device 244, or more than two devices. In other words, the packaging module 24 can include devices other than the third device 243 and the fourth device 244, such as a seventh device 245 and an eighth device 246 in FIG. 2B. Figure 3 When the packaging module 24 includes two or more devices, the arrangement of the devices is not limited to the structure shown in FIG. 2B, and the arrangement of the devices can be set as needed so that the packaging module 24 has a small size. Figure 3

[0056] The RDL 241 is located on a side of the second device 23 away from the substrate 21, the third device 243 and the fourth device 244 are both located on a side of the RDL 241 away from the second device 23 and are both electrically connected to the RDL 241, and the third device 243 and the fourth device 244 can be spaced apart. The third device 243 and the fourth device 244 can communicate signals through the RDL 241. The RDL 241 is located between the third device 243 and the second device 23. Understandably, the RDL 241 is also located between the fourth device 244 and the second device 23. The RDL 241, the third device 243, and the fourth device 244 are all located on a side of the second device 23 away from the substrate 21.

[0057] In some embodiments, the third device 243 has a size in the first direction A1 smaller than a size of the first device 22 in the first direction A1, and the fourth device 244 has a size in the first direction A1 smaller than the size of the first device 22 in the first direction A1. The embodiments of the present application can integrate some devices that need to transmit signals to each other and have a small thickness into a packaging module 24 through an RDL. The packaging module 24 integrated with the devices having a small thickness is stacked with the second device 23, which is beneficial to miniaturization of the system packaging module 20.

[0058] The conductive member 242 is electrically connected to the RDL 241 and the substrate 21. Figure 2 Five conductive members 242 are shown, and the number of conductive members 242 between the RDL 241 and the substrate 21 can be six, seven, or eight, etc. The embodiments of the present application do not limit the number of conductive members 242, and the positions of the conductive members 242 can be adjusted as needed. Since the RDL can flexibly set the positions of the conductive members 242, the area space of the substrate 21 can be fully utilized.

[0059] Referring to​Figure 2 and Figure 4 , Figure 4 for Figure 2 The diagram shows the structure of the third device 243. Both the third device 243 and the fourth device 244 are flip-chip mounted on RDL 241, meaning both are flip-chip mounted on substrate 21. The third device 243 may include a substrate 247 and an active layer 248 stacked together. The active layer 248 is closer to RDL 241 than the substrate 247, thus enabling the third device 243 to be flip-chip mounted on RDL 241. It is understood that the active layer 248 is closer to substrate 21 than the substrate 247, enabling the third device 243 to be flip-chip mounted on substrate 21. The active layer 248 can be a functional layer of the third device 243. The substrate 247 is used to support the active layer 248, and the substrate 247 may be made of silicon or similar materials. It is understood that the fourth device 244 may include a substrate and an active layer. The active layer of the fourth device 244 is closer to substrate 21 than the substrate, enabling the fourth device 244 to be flip-chip mounted on substrate 21.

[0060] This embodiment of the application achieves compact packaging by flip-chip mounting the third device 243 and the fourth device 244 onto the substrate 21. This reduces the area of ​​the RDL 241 occupied by the third device 243 and the fourth device 244, as well as the area of ​​the substrate 21 occupied by the packaging module 24, thus miniaturizing the RDL 241 and the substrate 21. Furthermore, by flip-chip mounting the third device 243 and the fourth device 244 onto the substrate 21, the circuit length can be shortened, crosstalk and signal loss reduced, and the performance of the third device 243 and the fourth device 244 improved. The flip-chip mounting also ensures the third device 243 and the fourth device 244 are securely mounted, able to withstand certain impacts and vibrations, providing higher safety, and reducing the thermal resistance of the devices.

[0061] A packaging module 24 is disposed on a substrate 21 and stacked with the second device 23. At least a portion of the packaging module 24 is located on the side of the second device 23 away from the substrate 21. For example, at least a portion of the projection of the second device 23 onto the plane of RDL 241 overlaps with RDL 241, while the projection of the first device 22 onto the plane of RDL 241 does not overlap with RDL 241. In other words, the third device 243 and the fourth device 244 are packaged and integrated using RDL technology and stacked on the side of the second device 23 away from the substrate 21. The integrated third device 243, fourth device 244, and RDL 241 are stacked as a whole with the second device 23 along the first direction A1. The integrated third device 243, fourth device 244, and RDL 241 are stacked on top of the thinner second device 23, which helps to reduce the thickness of the system packaging module 20.

[0062] The encapsulation layer 27 encapsulates part of the package module 24, and the surface 2431 of the third device 243 away from the RDL is exposed to the encapsulation layer 27, which is conducive to the miniaturization of the system-in-package module 20.

[0063] The third device 243 and the fourth device 244 are integrated through the RDL, which is conducive to the thinness of the package module 24 as a whole, and can reduce the number of conductive members 242 required by the third device 243 and the fourth device 244, reduce the area of the substrate 21 occupied by the conductive members 242, and improve the integration of the system-in-package module 20. The third device 243 and the fourth device 244 are flip-chip mounted on the substrate 21, which can reduce the area of the substrate 21 occupied by the third device 243 and the fourth device 244, and realize the miniaturization of the substrate 21. Since the first distance L1 is greater than the second distance L2, the package module 24 is stacked with the second device 23, the integrated third device 243, fourth device 244, and RDL 241 are arranged on the side of the second device 23 away from the substrate 21, the stacked arrangement of the second device 23 and the copper pillar 26 with a smaller sum of thicknesses is realized, the space on the second device 23 and the upper part of the copper pillar 26 with a smaller sum of thicknesses is fully utilized, which is conducive to controlling the size of the system-in-package module 20 in the first direction A1, avoiding the thickness of the system-in-package module 20 being too large, and is conducive to the miniaturization of the system-in-package module 20, and improves the integration of the system-in-package module 20. If the integrated third device 243, fourth device 244, and RDL 241 are stacked on the first device 22 and the solder ball 25 with a larger sum of thicknesses, the size of the system-in-package module 20 in the first direction A1 will be significantly increased, which is not conducive to the thinness of the system-in-package module 20.

[0064] It can be understood that the process of RDL integration includes but is not limited to the following ways: first, the third device 243, the fourth device 244, the seventh device 245, and the eighth device 246 are first adhered to a carrier, the third device 243, the fourth device 244, the seventh device 245, and the eighth device 246 are encapsulated, then polished, and after polishing, RDL wiring is performed to form the RDL 241, and the third device 243, the fourth device 244, the seventh device 245, and the eighth device 246 are electrically connected to the RDL 241. Second, the RDL 241 is first made, and the third device 243, the fourth device 244, the seventh device 245, and the eighth device 246 are electrically connected to the RDL 241.

[0065] As shown in Figure 5 , the third device 243 and the fourth device 244 are integrated through the RDL, which is conducive to the thinness of the package module 24 as a whole, and can reduce the number of conductive members 242 required by the third device 243 and the fourth device 244, reduce the area of the substrate 21 occupied by the conductive members 242, and improve the integration of the system-in-package module 20. The third device 243 and the fourth device 244 are flip-chip mounted on the substrate 21, which can reduce the area of the substrate 21 occupied by the third device 243 and the fourth device 244, and realize the miniaturization of the substrate 21. Since the first distance L1 is greater than the second distance L2, the package module 24 is stacked with the second device 23, the integrated third device 243, fourth device 244, and RDL 241 are arranged on the side of the second device 23 away from the substrate 21, the stacked arrangement of the second device 23 and the copper pillar 26 with a smaller sum of thicknesses is realized, the space on the second device 23 and the upper part of the copper pillar 26 with a smaller sum of thicknesses is fully utilized, which is conducive to controlling the size of the system-in-package module 20 in the first direction A1, avoiding the thickness of the system-in-package module 20 being too large, and is conducive to the miniaturization of the system-in-package module 20, and improves the integration of the system-in-package module 20. If the integrated third device 243, fourth device 244, and RDL 241 are stacked on the first device 22 and the solder ball 25 with a larger sum of thicknesses, the size of the system-in-package module 20 in the first direction A1 will be significantly increased, which is not conducive to the thinness of the system-in-package module 20. Figure 5This is a schematic diagram of the structure of a system packaging module 30 in the prior art. The first device 32, the second device 33, the third device 343, the fourth device 344, the fifth device 345, and the sixth device 346 of the system packaging module 30 are spaced apart and disposed on the same layer as the substrate 31. These devices are not stacked on top of each other; they are all disposed on the substrate 31. This results in a large area occupied by the substrate 31, requiring a large substrate size, which is not conducive to the miniaturization of the system packaging module 30. If the first device 32, the second device 33, the third device 343, the fourth device 344, the fifth device 345, and the sixth device 346 are stacked in two layers, although the area of ​​the substrate 31 will be reduced, the thickness of the system packaging module 30 will increase significantly.

[0066] like Figure 6 and Figure 7 , Figure 6 for Figure 3 The diagram shows the structure of the packaging module 24 of the system packaging module 20. Figure 7 for Figure 6 The diagram shows another view of the package module 24. The third device 243, the fourth device 244, the seventh device 245, and the eighth device 246 are integrated using RDL to form the package module 24.

[0067] See Figure 3 , Figure 6 and Figure 8 , Figure 8 for Figure 3 The diagram shows a partial structural schematic of the system packaging module 20. The integrated packaging module 24 is correspondingly positioned with the second device 23, and is fixed and electrically connected to the substrate 21. The packaging module 24, the first device 22, the second device 23 and the substrate 21 are then packaged together. Figure 6 The encapsulation module 24 and Figure 8 The structure shown is connected to form Figure 3 The system packaging module 20 shown.

[0068] See Figure 3 , Figure 5 and Figure 8 Compared to Figure 5 The prior art system packaging module 30 shown is shown. Figure 3 The system packaging module 20 of this application, as shown, has a significantly reduced size and area in the second direction A2, without increasing its thickness. Therefore, the overall size of the system packaging module 20 in this embodiment is reduced. The second direction A2 is perpendicular to the first direction A1.

[0069] See Figure 2 and Figure 4The size of the substrate 247 of the third device 243 in the first direction A1 is greater than or equal to 40 um and less than or equal to 130 um. For example, the size of the substrate 247 of the third device 243 in the first direction A1 can be 45 um, 50 um, 55 um, 60 um, 65 um, 70 um, 75 um, 80 um, 85 um, 90 um, 100 um, 110 um or 120 um, etc. The embodiments of the present application set the size of the substrate 247 in the first direction A1 to be greater than or equal to 40 um and less than or equal to 130 um, which is advantageous for preventing the substrate 247 from being damaged and for thinning the system-in-package module 20. If the size of the substrate 247 of the third device 243 in the first direction A1 is less than 40 um, the substrate 247 of the third device 243 is prone to cracking or breaking, which damages the substrate 247 of the third device 243. If the size of the substrate 247 of the third device 243 in the first direction A1 is greater than 130 um, the substrate 247 of the third device 243 is too thick, which is not conducive to thinning the system-in-package module 20.

[0070] It can be understood that the size of the substrate of the fourth device 244 in the first direction A1 is greater than or equal to 40 um and less than or equal to 130 um, which is advantageous for preventing the substrate of the fourth device 244 from being damaged and for thinning the system-in-package module 20.

[0071] Referring to Figure 9 , Figure 9 is a structural schematic diagram of the system-in-package module 20 before polishing. The package module 24 is assembled to the substrate 21 to form the system-in-package module 20 shown in Figure 9 . The system-in-package module 20 shown in Figure 9 is polished, which reduces the thickness of the substrate 247 of the third device 243 and the thickness of the substrate of the fourth device 244, to form the system-in-package module 20 shown in Figure 2 . It can be understood that the thickness of the system-in-package module 20 shown in Figure 2 is less than the thickness of the system-in-package module 20 shown in Figure 9 .

[0072] The thickness of the substrate 247 of the third device 243 before grinding of the system-in-package module 20 is usually greater than 130 mm, which is beneficial to ensure the flatness of the third device 243 and avoid warping of the third device 243. It can be understood that if the thickness of the substrate 247 of the third device 243 before grinding is less than 130 mm, the third device 243 will warp during manufacturing, which reduces the manufacturing yield of the third device 243. The thickness of the substrate of the fourth device 244 before grinding of the system-in-package module 20 is usually greater than 130 mm, which is beneficial to ensure the flatness of the fourth device 244 and avoid warping of the fourth device 244. It can be understood that if the thickness of the substrate of the fourth device 244 before grinding is less than 130 mm, the fourth device 244 will warp during manufacturing, which reduces the manufacturing yield of the fourth device 244.

[0073] Referring to Figure 2 The surface 2421 of the conductive member 242 away from the substrate 21 is in contact with and electrically connected to the RDL 241, and the distance between the surface 2421 of the conductive member 242 away from the substrate 21 and the substrate 21 is a third distance L3, which is greater than the second distance L2. In other words, the conductive member 242 is higher than the surface 232 of the second device 23, and a gap is provided between the RDL 241 and the second device 23. By setting the distance L3 between the surface 2421 of the conductive member 242 away from the substrate 21 and the substrate 21 to be greater than the distance L2 between the surface 232 of the second device 23 away from the substrate 21 and the substrate 21, the RDL 241 is suspended, which is beneficial to the plastic encapsulation glue entering the gap between the RDL 241 and the second device 23.

[0074] In some embodiments, the third distance L3 is greater than or equal to 20 um. For example, the third distance L3 can be 25 um, 30 um, 35 um, 40 um, 45 um, or 50 um, etc. It can be understood that after the integrated RDL 241, third device 243 and fourth device 244 are fixed and electrically connected to the substrate 21 through the conductive member 242, the first device 22, the second device 23 and the package module 24 need to be packaged by the glue. If the distance L3 between the surface 2421 of the conductive member 242 away from the substrate 21 and the substrate 21 is less than 20 um, the conductive member 242 is too short, the gap between the RDL 241 and the second device 23 is small, which is not conducive to the plastic encapsulation glue entering the gap between the RDL 241 and the second device 23, and may cause bubbles and other phenomena, which affects the quality of plastic encapsulation and reduces the performance of the system-in-package module 20.

[0075] The larger the area of the RDL 241 is, the larger the distance L3 between the surface 2421 of the conductive member 242 away from the substrate 21 and the substrate 21 can be. The larger the area of the RDL 241 is, the longer the path for the encapsulation gel to enter the gap between the RDL 241 and the second device 23 is, and the more difficult it is for the encapsulation gel to enter the gap between the RDL 241 and the second device 23, thus the distance L3 between the surface 2421 of the conductive member 242 away from the substrate 21 and the substrate 21 needs to be increased to allow the encapsulation gel to enter the gap between the RDL 241 and the second device 23. The distance L3 between the surface 2421 of the conductive member 242 away from the substrate 21 and the substrate 21 can be set as needed to ensure the yield of the encapsulation and not to ensure the miniaturization of the system-in-package module.

[0076] In some embodiments, the conductive member 242 can be a copper pillar. The copper pillar can be formed by an electroplating process. The size of the copper pillar formed by the electroplating process can be small, and the distance between two adjacent copper pillars can be small, which is beneficial to reduce the area of the conductive member 242 on the substrate 21, increase the number of devices that can be placed on the substrate 21, and improve the utilization rate of the area of the substrate 21.

[0077] In some embodiments, the diameter of the conductive member 242 is less than or equal to 0.15 mm. When the conductive member 242 is formed by the electroplating process, the conductive member 242 can generally be in a cylindrical shape, and the diameter of the conductive member 242 can be small to reduce the area occupied by the conductive member 242. For example, the diameter of the conductive member 242 can be 0.1 mm, 0.08 mm, 0.06 mm, or 0.05 mm, etc. In other embodiments, the diameter of the conductive member 242 can also be greater than 0.15 mm.

[0078] In some embodiments, the distance between the centers of two adjacent conductive members is less than or equal to 0.25 mm. The center of the conductive member is generally the geometric center of the conductive member. For example, when the conductive member is in a cylindrical shape, the centers of two cylindrical conductive members refer to the distance between the center of one cylindrical conductive member and the center of another cylindrical conductive member. By setting the distance between the centers of two adjacent conductive members to be less than or equal to 0.25 mm, the area occupied by the conductive member can be reduced. For example, the distance between the centers of two adjacent conductive members can be 0.2 mm, 0.15 mm, or 0.12 mm, etc. In other embodiments, the distance between the centers of two adjacent conductive members 242 can also be greater than 0.25 mm. It can be understood that the conductive member 242 can also be a cuboid, a cube, or a column structure with a triangular, pentagonal, etc. cross section, and the shape of the conductive member 242 is not limited in the embodiments of the present application. It can be understood that in other embodiments, the conductive member 242 can also be a solder ball, etc.

[0079] Referring to Figure 2The encapsulation layer 27 encapsulates the first device 22, the second device 23, and part of the encapsulation module 24. The encapsulation of the encapsulation layer 27 on part of the encapsulation module 24 means that part of the encapsulation module 24 is encapsulated by the encapsulation layer 27, and another part of the encapsulation module 24 is exposed to the encapsulation layer 27. For example, the third device 243 is exposed to the encapsulation layer 27 away from the surface 2431 of the RDL 241, and the fourth device 244 can be exposed to the encapsulation layer 27 away from the surface 2441 of the RDL 241. The material of the encapsulation layer 27 can be epoxy resin, polyimide, polyamide, etc.

[0080] The surface 2431 of the third device 243 away from the RDL 241 is flush with the encapsulation layer 27 on the side of the first device 22 away from the substrate 21, and the surface 2441 of the fourth device 244 away from the RDL 241 can be flush with the encapsulation layer 27 on the side of the first device 22 away from the substrate 21. The first device 22 cannot be polished, and the surface 222 on the side of the first device 22 away from the substrate 21 is encapsulated by the encapsulation layer 27. By setting the surface 2431 of the third device 243 away from the RDL 241 to be exposed to the encapsulation layer 27 and flush with the encapsulation layer 27 on the side of the first device 22 away from the substrate 21, the thickness of the system encapsulation module 20 can be reduced, and the thinness, miniaturization, and lightness of the system encapsulation module 20 can be achieved.

[0081] The first device 22 can be a filter or a power device, and the material of the power device includes gallium arsenide. When the first device 22 is a filter, the first device 22 cannot be polished, and the side of the first device 22 away from the substrate 21 is encapsulated by the encapsulation layer 27. When the first device 22 is a power device and the material of the power device includes gallium arsenide, the material of the first device 22 is harmful, the first device 22 cannot be polished, and the side of the first device 22 away from the substrate 21 needs to be encapsulated by the encapsulation layer 27.

[0082] Referring to Figure 2 The system encapsulation module 20 includes a passive element 28, which can be a resistor, a capacitor, an inductor, etc. The number of passive elements 28 can be one, two, three, four, or five, etc. The number of passive elements 28 is not limited in the embodiments of the present application and can be set as needed. When the number of passive elements 28 is two or more, the number of passive elements 28 can be set as needed, which is not limited in the embodiments of the present application.

[0083] Referring to Figure 2The side of substrate 21 facing away from the second device 23 may have devices, such as a fifth device 291 and a sixth device 292. These devices can be packaged onto the side of substrate 21 facing away from the second device 23. The surface of the fifth device 291 facing away from substrate 21 may expose the encapsulation layer, and the surface of the sixth device 292 facing away from substrate 21 may also expose the encapsulation layer. The encapsulation layer can be exposed by grinding, which is beneficial for the thinning of the system packaging module 20. In other embodiments, the surface of the fifth device 291 facing away from substrate 21 and the surface of the sixth device 292 facing away from substrate 21 may be covered by the encapsulation layer. Substrate 21 can be electrically connected to the circuit board via solder balls or other electrical connectors. In other embodiments, the sixth device 292 may not be provided.

[0084] In some embodiments, among the devices on the side of the substrate 21 opposite to the second device 23, the fifth device 291 is the device with the largest size in the first direction A1, and the size of the fifth device 291 in the first direction A1 is smaller than the size of the first device 22 in the first direction A1. It should be noted that the size of the first device 22 in the first direction A1 does not include the size of the solder ball 25; the size of the first device 22 in the first direction A1 is the distance between surfaces 221 and 222 of the first device 22. Understandably, distributing thicker devices on opposite sides of the substrate 21 increases the thickness of the system package module 20. This embodiment of the application concentrates the thicker devices on one side of the substrate 21, which is beneficial for the miniaturization of the system package module 20.

[0085] The fabrication process of the system packaging module 20 in this embodiment can be as follows: some devices that need to transmit signals to each other and have a small thickness are integrated through RDL, and the integrated packaging module 24 is assembled on the substrate 21, then plastic-encapsulated, and then polished. The side of the packaging module 24 away from the substrate 21 and the encapsulation layer 27 are polished to reduce the thickness, forming a system packaging module 20 with high integration and small thickness. Other fabrication processes can also be used for the system packaging module 20, and this embodiment does not limit them.

[0086] like Figure 10 As shown, Figure 10FIG. 8 is a schematic view of another structure of a system-in-package module 20. The encapsulation layer 27 covers the second device 23, part of the first device 22, and part of the package module 24. The third device 243 is exposed to the encapsulation layer 27 away from the surface 2431 of the RDL 241, and the fourth device 244 can be exposed to the encapsulation layer 27 away from the surface 2441 of the RDL 241. The part of the first device 22 covered by the encapsulation layer 27 can be understood as that part of the first device 22 is covered by the encapsulation layer 27, and another part of the first device 22 is exposed to the encapsulation layer 27, Figure 10 The first device 22 shown can be polished. Exemplarily, the surface 222 of the first device 22 away from the substrate 21 is exposed to the encapsulation layer 27. The surface 2431 of the third device 243 away from the RDL 241 is flush with the surface 222 of the first device 22 away from the substrate 21, and the surface 2441 of the fourth device 244 away from the RDL 241 can be flush with the surface 222 of the first device 22 away from the substrate 21. By arranging the surface 2431 of the third device 243 away from the RDL 241 to be flush with the surface 222 of the first device 22 away from the substrate 21, the thickness of the system-in-package module 20 is reduced, and the system-in-package module 20 is thinned, miniaturized, and lightened.

[0087] As shown in FIG. 8, Figure 11 As shown in FIG. 8, Figure 11 FIG. 8 is a schematic view of another structure of a system-in-package module 20. The encapsulation layer 27 covers the second device 23, part of the first device 22, and part of the package module 24. The third device 243 is exposed to the encapsulation layer 27 away from the surface 2431 of the RDL 241, and the fourth device 244 can be exposed to the encapsulation layer 27 away from the surface 2441 of the RDL 241. The part of the first device 22 covered by the encapsulation layer 27 can be understood as that part of the first device 22 is covered by the encapsulation layer 27, and another part of the first device 22 is exposed to the encapsulation layer 27, Figure 11 For example, one of the package modules 24 includes the third device 243 and the fourth device 244, and is located above two of the second devices 23. The package module 24 can also include other devices in addition to the third device 243 and the fourth device 244, and the number of the corresponding second devices 23 is not limited. Another package module 24 includes the seventh device 245 and the eighth device 246, and is located above one of the second devices 23. The package module 24 can also include other devices in addition to the seventh device 245 and the eighth device 246, and the number of the corresponding second devices 23 is not limited. The number of the package modules 24 in the embodiment of the application can be multiple, and multiple devices can be integrated as needed, with high flexibility.

[0088] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A system packaging module, characterized in that, Includes a substrate, a first device, a second device, a packaging module, and a packaging layer. The first device and the second device are located on the same side of the substrate and are both electrically connected to the substrate. The distance between the surface of the first device away from the substrate and the substrate is a first distance, and the distance between the surface of the second device away from the substrate and the substrate is a second distance; the first distance is greater than the second distance. The packaging module includes a redistribution layer (RDL), a conductive element, a third device, and a fourth device. The RDL is located on the side of the second device away from the substrate. The third device and the fourth device are both located on the side of the RDL away from the second device and are both electrically connected to the RDL. The third device and the fourth device are flip-chip mounted on the RDL. The conductive element is electrically connected to the side of the RDL closest to the substrate. The packaging module is disposed on the substrate and stacked with the second device, and the conductive element is electrically connected to the substrate. The encapsulation layer covers a portion of the encapsulation module; the surface of the third device that is away from the RDL is exposed outside the encapsulation layer.

2. The system packaging module as described in claim 1, characterized in that, The third device has a smaller dimension in the first direction than the first device in the first direction, and the fourth device has a smaller dimension in the first direction than the first device in the first direction, wherein the first direction is the thickness direction of the system packaging module.

3. The system packaging module as described in claim 2, characterized in that, The third device includes a substrate and an active layer stacked together, the active layer being closer to the substrate relative to the substrate, and the substrate having a dimension in the first direction greater than or equal to 40 μm and less than or equal to 130 μm.

4. The system packaging module as described in any one of claims 1-3, characterized in that, The distance between the surface of the conductive element away from the substrate and the substrate is a third distance, which is greater than the second distance.

5. The system packaging module as described in claim 4, characterized in that, The third spacing is greater than or equal to 20 μm.

6. The system packaging module as described in claim 4 or 5, characterized in that, The conductive component is a copper pillar.

7. The system packaging module as described in claim 6, characterized in that, The diameter of the conductive element is less than or equal to 0.15 mm.

8. The system packaging module as described in claim 6 or 7, characterized in that, The distance between the centers of two adjacent conductive elements is less than or equal to 0.25 mm.

9. The system packaging module as described in any one of claims 1-8, characterized in that, The encapsulation layer covers the first device, and the surface of the third device away from the RDL is flush with the encapsulation layer on the side of the first device away from the substrate.

10. The system packaging module as described in claim 9, characterized in that, The first device is a filter or a power device, and the power device is made of gallium arsenide.

11. The system packaging module as described in any one of claims 1-8, characterized in that, The encapsulation layer covers a portion of the first device, the surface of the first device away from the substrate is exposed in the encapsulation layer, and the surface of the third device away from the RDL is flush with the surface of the first device away from the substrate.

12. The system packaging module as described in any one of claims 1-11, characterized in that, The number of the packaging modules is at least two, and the at least two packaging modules are spaced apart on the side of the substrate facing the second device.

13. The system packaging module as described in any one of claims 1-12, characterized in that, The third device is a chip or a passive component, and the fourth device is a chip or a passive component.

14. The system packaging module as described in claim 2, characterized in that, The system packaging module includes a fifth device located on the side of the substrate away from the second device. Among the devices on the side of the substrate away from the second device, the fifth device is the largest in size in the first direction, and the size of the fifth device in the first direction is smaller than the size of the first device in the first direction.

15. An electronic device, characterized in that, It includes a circuit board and a system package module as described in any one of claims 1-14, wherein the system package module is electrically connected to the circuit board.

Images