Method for improving deuterium retention resistance of tungsten material, tungsten material and application of tungsten material

Abstract

The invention relates to the technical field of plasma-oriented materials, and particularly discloses a method for improving the deuterium retention resistance of a tungsten material, the tungsten material and application of the tungsten material. The method for improving the deuterium retention resistance of the tungsten material comprises the following steps that the tungsten material is pretreated and then kept for a preset time under a preset pressure, and then rotary friction is conducted at a preset angular speed under the preset pressure. According to the method, pressure is applied to the tungsten material under the room temperature condition, rotary friction is conducted, the surface layer of the tungsten material is induced to be subjected to strong plastic deformation, the surface layer is induced to generate violent shear strain, surface layer grain orientation is changed, nanocrystallization reconstruction of material surface grains is directly achieved, and nanocrystallization of the surface of the tungsten material and reduction of deuterium retention amount are synchronously achieved; and meanwhile, the mechanical property of the material is enhanced through ultra-fine grain strengthening.

Description

Technical Field

[0001] This invention relates to the field of plasma materials technology, and in particular to a method for improving the deuterium retention resistance of tungsten materials, as well as tungsten materials and their applications. Background Technology

[0002] Achieving controlled nuclear fusion is one of the key pathways for humanity to solve future energy problems. In tokamak magnetic confinement fusion devices, plasma-facing materials constitute the first wall and divertors, among other core components, directly enduring extreme environments: including continuous bombardment from high-flux, high-energy hydrogen isotope plasmas, as well as intense thermal loads, neutron irradiation, and transient thermal shocks. Tungsten and its alloys are widely considered promising candidates for first wall materials due to their extremely high melting point (3410℃), low sputtering rate, good thermal conductivity, low coefficient of thermal expansion, and relatively low hydrogen isotope solubility. However, a critical and challenging issue is the retention of hydrogen isotopes (especially radioactive deuterium and tritium) in tungsten materials. Retained deuterium not only poses a radioactive risk, increasing the complexity and cost of the fuel cycle, but may also accelerate material damage and performance degradation through mechanisms such as blistering or spalling. Therefore, minimizing the amount of hydrogen isotope retention in tungsten materials is one of the core objectives for ensuring the safe, economical, and long-life operation of fusion devices.

[0003] To withstand the harsh environment of fusion reactors, tungsten materials for plasma applications must possess excellent mechanical properties, resistance to thermal fatigue, and resistance to radiation hardening and embrittlement. Numerous studies have shown that grain refinement is one of the most effective means of improving the mechanical properties of metallic materials. For tungsten alloys, grain refinement is typically achieved through plastic deformation processes (such as rolling, rotary forging, and equal-channel angular extrusion), which can reduce grain size to the micrometer level. This grain refinement strengthening mechanism significantly improves the strength and hardness of the material. However, this process inevitably introduces a large number of high-density microstructural defects such as dislocations, vacancy clusters, and grain boundaries. These defects are effective trapping sites for hydrogen isotopes in tungsten alloys, increasing hydrogen isotope retention. Therefore, the improvement in mechanical properties of tungsten alloys with refined grains obtained through traditional methods comes at the cost of sacrificing resistance to hydrogen isotope retention. This creates a contradiction between the goals of "grain refinement strengthening" and "low deuterium retention," becoming a key bottleneck restricting the development of plasma-oriented tungsten materials.

[0004] Existing technologies disclose several methods for improving the radiation resistance of tungsten alloys. For example, patent application number CN202210589685.2 discloses a method for preparing a high-quality radiation-resistant tungsten alloy coating. This method requires first preparing a nanostructured tungsten alloy coating using mechanical alloying, and then using a melt infiltration method to infiltrate a certain amount of molten metal under certain conditions to fill internal defects such as cracks and pores in the coating, thereby forming a complete tungsten alloy coating. Although the tungsten alloy coating prepared by the above method may improve the radiation resistance of tungsten alloys, the interfacial bonding strength between the coating and the substrate, thermal expansion mismatch, radiation stability, and resistance to spalling under strong particle bombardment are insufficient. Once the coating spalls off and fails, the substrate will be directly exposed to the irradiation environment, accelerating its failure and hindering the stable operation of the equipment.

[0005] To address the aforementioned contradictions, researchers both domestically and internationally have explored various technical approaches, but all have significant limitations. For example, A. Manhard et al. used high-temperature annealing to eliminate internal defects in tungsten materials, which showed a positive effect on reducing deuterium retention. However, the annealing process inevitably involves grain growth, leading to a significant degradation in mechanical properties, contradicting the initial goal of grain refinement. Similarly, Hong Zhang et al. added ZrC particles or the alloying element Re to tungsten to enhance material strength through second-phase strengthening or solid solution strengthening, reducing dependence on grain refinement. However, they found that after hydrogen isotope plasma injection at 800K, the addition of both ZrC particles and Re increased deuterium retention. Therefore, current mainstream technical approaches have failed to effectively reconcile this contradiction, failing to significantly reduce hydrogen isotope retention while maintaining fine grain size in tungsten materials. Developing an innovative material preparation or modification technique that can achieve a synergistic effect of "grain nanoscale" and "low hydrogen isotope retention" is a crucial technological need urgently requiring breakthroughs in the field of fusion materials. Summary of the Invention

[0006] Based on this, the purpose of this invention is to provide a method for improving the deuterium retention resistance of tungsten materials, as well as tungsten materials and their applications. This method simultaneously achieves the nano-sizing of the tungsten material surface and the reduction of deuterium retention.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: The present invention provides a method for improving the deuterium retention resistance of tungsten materials, which includes the following steps: after pretreating the tungsten material, holding it under a predetermined pressure for a predetermined time, and then subjecting it to rotational friction at a predetermined angular velocity under the predetermined pressure.

[0008] As a further improvement to the above-described solution of the present invention, the pretreatment method for the tungsten material is as follows: the surface of the tungsten material is polished until it reaches a mirror-like state, and then electrolyzed. A clear reflective image observed with the naked eye indicates that the surface has reached a mirror-like state.

[0009] As a further improvement to the above-mentioned solution of the present invention, the method of polishing the surface of the tungsten material until the surface of the tungsten material is as follows: the surface of the tungsten material is polished in sequence with silicon carbide sandpaper of 80 mesh, 400 mesh, 800 mesh, 2000 mesh and 3000 mesh, and then the tungsten material is mechanically polished with diamond suspension to make the surface of the tungsten material appear as a mirror.

[0010] As a further improvement to the above-mentioned solution of the present invention, the electrolysis is carried out using a sodium hydroxide solution as the electrolyte, the concentration of the sodium hydroxide solution is 1%-10%, and the voltage of the electrolysis is 5-30V.

[0011] As a further improvement to the above-mentioned solution of the present invention, the predetermined pressure range is 20-200N, the predetermined pressure is applied vertically to the surface of the tungsten material, the predetermined time is 1-5min, and the predetermined angular velocity range is 50-700r / min.

[0012] As a further improvement to the above-mentioned solution of the present invention, the rotational friction step is repeated 3-10 times, and the tungsten material needs to be cooled in air between two adjacent rotational friction steps.

[0013] As a further improvement to the above-mentioned solution of the present invention, the single cooling time of the tungsten material is 5-30 minutes, and the number of rotation passes of the tungsten material in a single rotational friction is 300-1000.

[0014] As a further improvement of the above-mentioned solution of the present invention, compared with the tungsten material before pretreatment, the tungsten material obtained by the method has a roughness increase of 2000%-5000%, a surface crystal size decrease of 85%-95%, and a deuterium retention decrease of 10%-25%.

[0015] The present invention also provides a tungsten material, which is prepared by the method described above for improving the deuterium retention resistance of tungsten materials.

[0016] The present invention also provides an application of the tungsten material as described above as a plasma-oriented material.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The method of this invention applies pressure and rotational friction to tungsten material at room temperature, thereby generating both vertical pressure and shear friction on the material surface. This induces strong plastic deformation of the tungsten material surface, resulting in severe shear strain and altering the surface grain orientation. This directly achieves nanoscale reconstruction of the material surface grains, reducing the grain size of tungsten material by 85%-95%, dynamically refining the grains to the nanoscale, and breaking the hydrogen trap network of the original grain boundaries. Simultaneously, the friction treatment introduces a large roughness into the material surface, increasing the roughness of the tungsten material by 2000%-5000%, thus changing the interface between plasma and material interaction. These unique structural features differ from traditional plastic deformation (such as rolling, rotary forging, etc.). The resulting rough surface can increase the reflectivity of deuterium plasma and reduce the amount of it entering the material. Furthermore, the nanogradient structure can accelerate the desorption of deuterium atoms through high-density short-path grain boundaries, giving the nanocrystalline surface a significant ability to suppress deuterium retention. This can reduce the amount of deuterium retention by 10%-25%, simultaneously achieving nano-scale formation of tungsten materials and reduction of deuterium retention. At the same time, the mechanical properties of the material are improved through ultrafine grain strengthening.

[0018] The method of this invention does not require high temperature or complex equipment, and simultaneously achieves the dual goals of grain refinement and deuterium retention resistance in a single process. The process is simple and highly compatible, breaking through the technical bottleneck that grain refinement and deuterium retention suppression are incompatible. It is applicable to the surface treatment of tungsten alloy first wall components in nuclear fusion devices, and has engineering advantages such as room temperature operation, precise and controllable parameters, and no need for a vacuum environment. It has important engineering application value. At the same time, the formed nanocrystalline layer and the substrate have a good interface bond, which can avoid the risk of nanocrystalline layer peeling off, which is conducive to the stable and safe operation of fusion devices. Attached Figure Description

[0019] Figure 1 The images show the AFM images of pure tungsten after friction treatment and untreated pure tungsten in Example 1 of this invention. Figure 2 These are EBSD images of pure tungsten after friction treatment and untreated pure tungsten in Example 1 of this invention; Figure 3 The images show SEM images and corresponding size distribution diagrams of the surface grains of pure tungsten after friction treatment and untreated pure tungsten in Example 1 of this invention. Figure 4 The images show the thermal desorption peaks of pure tungsten after triboelectric treatment and untreated pure tungsten after deuterium plasma injection, as shown in Example 1 of this invention. Figure 5 The diagram shows the deuterium retention of pure tungsten after triboelectric treatment and untreated pure tungsten after deuterium plasma injection in Example 1 of the present invention. Figure 6 The images show the AFM images of the tungsten alloy after friction treatment and the untreated tungsten alloy in Example 2 of this invention. Figure 7 The images show the EBSD images of the tungsten alloy after friction treatment and the untreated tungsten alloy in Example 2 of this invention. Figure 8 The images show SEM images and corresponding size distribution diagrams of the surface grains of the tungsten alloy after friction treatment and the untreated tungsten alloy in Example 2 of this invention. Figure 9 The images show the thermal desorption peaks of the tungsten alloy after friction treatment and the untreated tungsten alloy after deuterium plasma injection in Example 2 of this invention. Figure 10 This is a diagram showing the deuterium retention of the tungsten alloy after friction treatment and the untreated tungsten alloy after deuterium plasma injection in Example 2 of the present invention. Figure 11 These are AFM images of the tungsten alloy after friction treatment and the untreated tungsten alloy in Example 3 of this invention; Figure 12 These are EBSD images of the tungsten alloy after friction treatment and the untreated tungsten alloy in Example 3 of this invention; Figure 13 The images show SEM images and corresponding size distributions of the surface grains of the tungsten alloy after friction treatment and the untreated tungsten alloy in Example 3 of this invention. Figure 14 The images show the thermal desorption peaks of the tungsten alloy after friction treatment and the untreated tungsten alloy after deuterium plasma injection in Example 3 of this invention. Figure 15 The diagram shows the deuterium retention of the tungsten alloy after friction treatment and the untreated tungsten alloy after deuterium plasma injection in Example 3 of the present invention. Figure 16 The diagram shows the grain size changes of tungsten materials after friction treatment in Examples 1-3 of this invention and the corresponding deuterium retention. Detailed Implementation

[0020] To facilitate understanding of the present invention, a more comprehensive description will be given below with reference to specific embodiments. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0022] Example 1 This embodiment proposes a method to improve the deuterium retention resistance of pure tungsten, which includes the following steps: S1. Use silicon carbide sandpaper of 80 grit, 400 grit, 800 grit, 2000 grit and 3000 grit in sequence to polish the surface of pure tungsten, and then use diamond suspension to mechanically polish the surface of pure tungsten to make the surface of pure tungsten present a mirror state. S2. Electrolyze the mechanically polished pure tungsten using a 5% sodium hydroxide solution at a voltage of 30V. S3. Place the electrolyzed pure tungsten on the rotating disk of the tribological tester (Rtec MFT-5000) and apply a vertical pressure of 20N to the pure tungsten through the tribological tester for 1 minute; S4. Then repeat the following steps three times: rotate the pure tungsten at an angular velocity of 50 r / min for 300 cycles using the rotating disk of the friction and wear testing machine, and cool it in air for 5 minutes. This yields pure tungsten with excellent resistance to deuterium retention.

[0023] The pure tungsten after friction treatment in this embodiment was compared with that of untreated pure tungsten, and the results were as follows: Figure 1 The AFM diagram shown is as follows: Figure 2 The EBSD diagram shown and as follows Figure 3 The SEM image and grain size distribution diagram are shown.

[0024] from Figure 1 (a) It can be seen that the surface of untreated pure tungsten is relatively smooth, with a roughness of only 7 nm; from Figure 1 (b) It can be seen that after the friction treatment, the surface of pure tungsten is uneven, with a large number of protrusions and valleys, and the roughness increases to 177 nm, which is 2429%.

[0025] from Figure 2 (a) It can be seen that the grain orientation of the untreated pure tungsten surface is mainly in the {111} direction; from Figure 2 (b) It can be seen that after the friction treatment, the {111} oriented grains on the pure tungsten surface are no longer obvious; this indicates that the original orientation of the grains on the pure tungsten surface has changed.

[0026] from Figure 3 (a1) Figure 3 (a3) shows that the grains on the untreated pure tungsten surface are relatively coarse, with an average grain size of 1.8 μm; from Figure 3 (a2) Figure 3 (a4) It can be seen that the grains are significantly refined after the friction treatment, with an average grain size of only 90 nm and a reduction in crystal size of 95%.

[0027] Deuterium plasma was injected into both the friction-treated pure tungsten and the untreated pure tungsten in this embodiment using a linear plasma apparatus (irradiation conditions: 400K, 1×10⁻⁶).25 D / m 2 The deuterium retention after deuterium plasma injection was detected, and the results were as follows: Figure 4 Thermal desorption (TDS) curves and such Figure 5 The diagram showing the deuterium retention rate is shown.

[0028] from Figure 4 It can be seen that the deuterium release rate of pure tungsten after friction treatment in this embodiment is lower than that of pure tungsten without friction treatment.

[0029] from Figure 5 As can be seen, the friction treatment in this embodiment significantly reduces the deuterium retention in pure tungsten, decreasing it from 4.81 × 10⁻⁶ to 4.81 × 10⁻⁶. 20 D / m 2 Reduced to 4.17 × 10 after friction. 20 D / m 2 The amount of deuterium retained decreased by 13%.

[0030] Example 2 This embodiment proposes a method to improve the deuterium retention resistance of W-0.5 wt.%ZrC tungsten materials, which includes the following steps: S1. The surface of the tungsten alloy (W-0.5wt.%ZrC) is polished in sequence with silicon carbide sandpaper of 80 grit, 400 grit, 800 grit, 2000 grit and 3000 grit, and then the surface of the tungsten alloy is mechanically polished with diamond suspension to make the surface of the tungsten alloy appear as a mirror. S2. Electrolytic treatment of the mechanically polished tungsten alloy was carried out using a 10% sodium hydroxide solution at a voltage of 15V. S3. Place the electrolytically treated tungsten alloy onto the rotating disk of a friction and wear testing machine (Rtec MFT-5000) and apply a vertical pressure of 100N to the tungsten alloy using the friction and wear testing machine for 3 minutes; S4. Then repeat the following steps 6 times: rotate the tungsten alloy 500 times at an angular velocity of 400 r / min using the rotating disk of the friction and wear testing machine, and cool it in air for 20 minutes. Finally, a tungsten alloy with excellent resistance to deuterium retention is obtained.

[0031] The tungsten alloy (W-0.5 wt.%ZrC) after friction treatment in this embodiment was compared with the untreated tungsten alloy (W-0.5 wt.%ZrC), and the results were as follows: Figure 6 The AFM diagram shown is as follows: Figure 7 The EBSD diagram shown and as follows Figure 8 The SEM image and grain size distribution diagram are shown.

[0032] from Figure 6(a) It can be seen that the surface of the unfried tungsten alloy is relatively smooth, with a roughness of only 4 nm; from Figure 6 (b) It can be seen that after the friction treatment in this embodiment, the surface of the tungsten alloy is uneven, with a large number of protrusions and valleys, and the roughness increases to 185nm, which is 4542%.

[0033] from Figure 7 (a) It can be seen that the grain orientation of the unfried tungsten alloy surface is mainly in the {111} direction; from Figure 7 (b) It can be seen that after the friction treatment in this embodiment, the {111} oriented grains on the tungsten alloy surface are no longer obvious; this indicates that the original orientation of the grains on the tungsten alloy surface has changed.

[0034] from Figure 8 (a1) Figure 8 (a3) shows that the untreated tungsten alloy surface has relatively coarse grains, with an average grain size of 1.9 μm; from Figure 8 (a2) Figure 8 (a4) It can be seen that after the friction treatment in this embodiment, the grains are significantly refined, with an average grain size of only 105 nm and a crystal size reduction of 94.47%.

[0035] Deuterium plasma implantation was performed on the triboelectric-treated tungsten alloy (W-0.5 wt.% ZrC) and the untreated tungsten alloy (W-0.5 wt.% ZrC) in this embodiment using a linear plasma apparatus (irradiation conditions: 400K, 1×10⁻⁶). 25 D / m 2 The deuterium retention after deuterium plasma injection was detected, and the results were as follows: Figure 9 Thermal desorption (TDS) curves and such Figure 10 The diagram showing the deuterium retention rate is shown.

[0036] from Figure 9 It can be seen that the deuterium release rate of the tungsten alloy after friction treatment in this embodiment is lower than that of the tungsten alloy without friction treatment.

[0037] from Figure 10 As can be seen, the friction treatment in this embodiment significantly reduced the deuterium retention in the tungsten alloy, decreasing it from 11.91 × 10⁻⁶ to 11.91 × 10⁻⁶. 20 D / m 2 Reduced to 8.92×10 after friction 20 D / m 2 The amount of deuterium retained decreased by 25%.

[0038] Example 3 This embodiment proposes a method to improve the deuterium retention resistance of W-0.5 wt.%ZrC-1 wt.%Re tungsten materials, which includes the following steps: S1. The surface of the tungsten alloy (W-0.5wt.%ZrC-1 wt.%Re) is polished in sequence with silicon carbide sandpaper of 80 mesh, 400 mesh, 800 mesh, 2000 mesh and 3000 mesh. Then, the surface of the tungsten alloy is mechanically polished with diamond suspension to make the surface of the tungsten alloy appear as a mirror. S2. Electrolytic treatment of the mechanically polished tungsten alloy was carried out using a 1% sodium hydroxide solution at a voltage of 5V. S3. Place the electrolytically treated tungsten alloy onto the rotating disk of a friction and wear testing machine (Rtec MFT-5000) and apply a vertical pressure of 200N to the tungsten alloy using the friction and wear testing machine for 5 minutes; S4. Then repeat the following steps 10 times: rotate the tungsten alloy 1000 times at an angular velocity of 700 r / min using the rotating disk of the friction and wear testing machine, and cool it in air for 30 minutes. Finally, a tungsten alloy with excellent resistance to deuterium retention is obtained.

[0039] The tungsten alloy (W-0.5 wt.%ZrC-1 wt.%Re) after friction treatment in this embodiment was compared with the untreated tungsten alloy (W-0.5 wt.%ZrC-1 wt.%Re), and the results were as follows: Figure 11 The AFM diagram shown is as follows: Figure 12 The EBSD diagram shown and as follows Figure 13 The SEM image and grain size distribution diagram are shown.

[0040] from Figure 11 (a) It can be seen that the surface of the unfried tungsten alloy is relatively smooth, with a roughness of only 8 nm; from Figure 11 (b) It can be seen that after the friction treatment in this embodiment, the surface of the tungsten alloy is uneven, with a large number of protrusions and valleys, and the roughness increases to 168nm, which is 2000% higher.

[0041] from Figure 12 (a) It can be seen that the grain orientation of the unfried tungsten alloy surface is mainly in the {111} direction; from Figure 12 (b) It can be seen that after the friction treatment in this embodiment, the {111} oriented grains on the tungsten alloy surface are no longer obvious; this indicates that the original orientation of the grains on the tungsten alloy surface has changed.

[0042] from Figure 13 (a1) Figure 13 (a3) shows that the untreated tungsten alloy surface has relatively coarse grains, with an average grain size of 1.8 μm; from Figure 13 (a2) Figure 13 (a4) It can be seen that the grains in this embodiment are significantly refined after the friction treatment, with an average grain size of only 231 nm and a crystal size reduction of 87.17%.

[0043] Deuterium plasma was injected into both the triboelectric-treated tungsten alloy (W-0.5 wt.%ZrC-1 wt.%Re) and the untreated tungsten alloy (W-0.5 wt.%ZrC-1 wt.%Re) using a linear plasma apparatus (irradiation conditions: 400K, 1×10⁻⁶). 25 D / m 2 The deuterium retention after deuterium plasma injection was detected, and the results were as follows: Figure 14 Thermal desorption (TDS) curves and such Figure 15 The diagram showing the deuterium retention rate is shown.

[0044] from Figure 14 It can be seen that the deuterium release rate of the tungsten alloy after friction treatment in this embodiment is lower than that of the tungsten alloy without friction treatment.

[0045] from Figure 15 As can be seen, the friction treatment in this embodiment significantly reduces the deuterium retention in the tungsten alloy, decreasing it from 4.86 × 10⁻⁶ to 4.86 × 10⁻⁶. 20 D / m 2 Reduced to 4.23 × 10 after friction. 20 D / m 2 The amount of deuterium retained decreased by 12%.

[0046] Combination Figure 16 , Figure 16 (a) is pure tungsten. Figure 16 (b) is W-0.5 wt.%ZrC, Figure 16 (c) is W-0.5 wt.%ZrC-1 wt.%Re, from Figure 16 It can be seen that the method of the present invention reduces the grain size of tungsten alloy by 85%-95% and reduces the deuterium retention by 10%-25%, breaking through the inherent limitation that fine-grained materials inevitably have high deuterium retention.

[0047] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for improving the deuterium retention resistance of tungsten materials, characterized in that, It includes the following steps: After pretreatment, the tungsten material is held under a predetermined pressure for a predetermined time, and then subjected to rotational friction at a predetermined angular velocity under the same predetermined pressure.

2. The method for improving the deuterium retention resistance of tungsten materials according to claim 1, characterized in that, The pretreatment method for the tungsten material is as follows: polish the surface of the tungsten material until it has a mirror-like finish, and then electrolyze it.

3. The method for improving the deuterium retention resistance of tungsten materials according to claim 2, characterized in that, The method for polishing the surface of the tungsten material until it reaches a mirror finish is as follows: the surface of the tungsten material is polished sequentially using silicon carbide sandpaper of 80 grit, 400 grit, 800 grit, 2000 grit, and 3000 grit, and then the tungsten material is mechanically polished using diamond suspension to achieve a mirror finish.

4. The method for improving the deuterium retention resistance of tungsten materials according to claim 2, characterized in that, The electrolysis is performed using a sodium hydroxide solution as the electrolyte, the concentration of which is 1%-10%, and the voltage of the electrolysis is 5-30V.

5. The method for improving the deuterium retention resistance of tungsten materials according to claim 1, characterized in that, The predetermined pressure range is 20-200N, the predetermined pressure is applied vertically to the surface of the tungsten material, the predetermined time is 1-5min, and the predetermined angular velocity range is 50-700r / min.

6. The method for improving the deuterium retention resistance of tungsten materials according to claim 1, characterized in that, Repeat the rotational friction step 3-10 times, and the tungsten material needs to be cooled in air between two adjacent rotational friction steps.

7. The method for improving the deuterium retention resistance of tungsten materials according to claim 6, characterized in that, The cooling time for the tungsten material in a single cycle is 5-30 minutes, and the number of rotational passes for a single rotational friction of the tungsten material is 300-1000.

8. The method for improving the deuterium retention resistance of tungsten materials according to claim 1, characterized in that, Compared to the tungsten material before pretreatment, the tungsten material obtained by the method has a roughness increase of 2000%-5000%, a surface crystal size decrease of 85%-95%, and a deuterium retention decrease of 10%-25%.

9. A tungsten material, characterized in that, It is prepared by the method described in any one of claims 1-8 for improving the deuterium retention resistance of tungsten materials.

10. An application of the tungsten material as described in claim 9 as a plasma-oriented material.

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