Three-axis double-Fork manipulator structure for wafer processing

Abstract

The invention relates to the technical field of wafer processing devices, in particular to a three-axis double-Fork manipulator structure for wafer processing, which comprises a Z-axis lifting assembly, a Z-axis connecting assembly, a rotating mechanism and an X-axis wafer taking module, the rotating mechanism comprises two sets of Z-axis side connecting plates, a fourth servo motor fixed between the two Z-axis side connecting plates and a hollow rotating platform in transmission connection with the output end of the servo motor, and the top end of the hollow rotating platform is fixedly connected with the rotating base through bolts. The Z-axis lifting assembly comprises a Z-axis main connecting plate fixed to one side of the Z-axis side connecting plate, a linear motor fixed to the Z-axis main connecting plate and a first servo motor connected with the Z-axis main connecting plate, an X-axis wafer taking module is arranged at the top end of the X-axis base plate, the three-axis double-Fork design is adopted, two wafers can be carried at the same time, the transmission frequency is reduced, the production efficiency is improved, and the production cost is reduced. The three-axis movement is realized, the structure is simple, the action is direct, the compact semiconductor equipment layout is suitable, and the space utilization rate is high.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and more specifically to a three-axis dual-Fork robot structure for wafer processing. Background Technology

[0002] In the field of semiconductor wafer manufacturing and precision processing, robotic arms, as the core equipment of automated production, need to achieve high-precision grasping, handling, positioning and transfer operations of wafers;

[0003] The three-axis dual-Fork robot uses linear motors to move along the Z-axis and an X-axis module, which takes up some space, resulting in a less compact overall structure. Optimizing the overall structure requires the cooperation of highly precise integrated modules.

[0004] The dual-fork design has a lower load capacity, which may limit the weight of a single load (such as large-size wafers or heavy carriers). It requires sacrificing speed or accuracy and lacks a real-time monitoring and feedback mechanism, making it difficult to ensure the levelness and positional accuracy of wafers (especially large-size, thin wafers) during the handling process. The single-arm design is less efficient and cannot meet the needs of multiple stations to pick up and put down materials at the same time in high-capacity production lines.

[0005] In later maintenance, the synchronous calibration requirements of dual-fork are high, and deviations may occur after long-term use, requiring regular adjustment; for traditional single-fork robots, the high-precision guide rails, motors and clean materials of dual-fork result in higher manufacturing costs; in terms of applicable scenarios, dual-fork robots are more suitable for linear transmission scenarios (such as load port to process chamber), and efficiency may decrease in multi-device collaboration or complex path planning.

[0006] It is difficult to balance heat dissipation performance and structural strength. Under long-term high-speed operation, the motor heats up and can affect the transmission accuracy. On the other hand, excessive structural reinforcement will increase the overall weight and reduce the response speed. Summary of the Invention

[0007] Technical problems to be solved

[0008] In view of the above-mentioned shortcomings of the prior art, the present invention provides a three-axis dual-Fork robot structure for wafer processing, which can effectively solve the problems in the prior art.

[0009] Technical solution

[0010] This invention provides a three-axis dual-Fork robot structure for wafer processing, including a Z-axis lifting assembly, a Z-axis connecting assembly, a rotating mechanism, and an X-axis wafer picking module. The rotating mechanism includes two sets of Z-axis side connecting plates, a fourth servo motor fixed between them, and a hollow rotating platform whose output is connected to the servo motor. The top of the hollow rotating platform is fixedly connected to a rotating base by bolts. The Z-axis lifting assembly includes a Z-axis main connecting plate fixed to one side of the Z-axis side connecting plates, a linear motor fixed to the Z-axis main connecting plate, and a first servo motor connected to the Z-axis main connecting plate. The top of the rotating base is fixedly connected to the bottom of an X-axis base plate. An X-axis wafer picking module is mounted on the top of the X-axis base plate, and the X-axis wafer picking module includes a pressure gauge fixed to the bottom of the X-axis base plate, a second servo motor, a third servo motor, and a solenoid valve. A [missing information - likely a device or component] is fixed to each side of the X-axis base plate. The system comprises two sensor brackets, each with its middle section fixedly connected to an amplifier. The top ends of both brackets are respectively fixedly connected to a first laser sensor and a second laser sensor. The top sides of the X-axis base plate are fixedly connected to a synchronous pulley assembly and a linear guide rail. A belt is fitted between the two synchronous pulley assemblies, and a belt clamping block is fixed to each belt. The tail end of the belt clamping block is fixedly connected to an ARM bracket and a second ARM bracket. The front ends of both the ARM brackets and the second ARM bracket are fixedly connected to a ceramic ARM sensor. Both the ARM brackets and the second ARM bracket are fixedly connected to a sensing element, and the end of the sensing element is fixedly connected to a photoelectric switch. The photoelectric switches on both sides are at the same height as the amplifier. A first laser sensor and a second laser sensor are respectively fixed to one side of each of the ARM brackets and the second ARM bracket.

[0011] Furthermore, the bottom of the two sets of Z-axis side connecting plates is fixedly connected to the cooling fan, and a rotation limiting block is fixed at the top of one of the Z-axis side connecting plates. The Z-axis connecting assembly includes the rotating base and a protrusion structure provided on its outer side. The rotation limiting block and the protrusion are at the same height. Grooves are provided on both sides of the linear motor, and the Z-axis main connecting plate is engaged in the groove through a protrusion structure fixed on the inner side. The Z-axis main connecting plate is fixedly connected to the reinforcing connecting block, and the reinforcing connecting block is fixedly connected to the Z-axis side connecting plate through a pin.

[0012] Furthermore, each set of sensor brackets is an L-shaped structure, and the two sets of amplifiers are respectively fixed to the outside of the vertical and horizontal portions of the sensor bracket.

[0013] Furthermore, both sets of synchronous pulley assemblies are of the form of two sets of rollers, and the linear guide rails are located on both sides of the synchronous pulley assemblies.

[0014] Furthermore, both sets of belts are respectively connected to the output ends of the second servo motor and the third servo motor for transmission.

[0015] Furthermore, a three-way adapter is fixed at the bottom of the X-axis base plate, one of which is connected to a pressure gauge, and both sets of ceramic ARMs are connected to the three-way adapter via pneumatic adapters, with the solenoid valve fixed in the air passage.

[0016] Furthermore, both the ARM bracket and the second ARM bracket are fixedly connected to the ceramic ARM by bolts, and the top of the ceramic ARM is fixedly connected to the wafer by adsorption.

[0017] Furthermore, the bottom ends of both the ARM bracket and the second ARM bracket are fitted onto the top of the linear guide rail via sliders, and the sensing sheet is fixedly connected to the sliders.

[0018] Furthermore, the belt and the belt clamping block are fixed together by bolts passing through pre-set holes and fitting with nuts.

[0019] Beneficial effects

[0020] This invention utilizes a three-axis dual-fork design, which can simultaneously carry two wafers (e.g., one fork picks up a wafer, and the other fork places it), reducing the number of transfers and improving production efficiency. The three-axis motion is simple in structure and direct in action, making it suitable for compact semiconductor equipment layouts and maximizing space utilization. The mechanical structure is simple, and compared to multi-axis robotic arms, the three-axis design has fewer potential failure points and lower maintenance costs, making it suitable for high-intensity continuous operations. It is also cleanroom compatible, with a low-particle generation design that meets Class 1 or higher cleanliness requirements, preventing wafer contamination.

[0021] In this case, two independent ceramic ARMs and corresponding drive components (second and third servo motors, synchronous pulley components, etc.) can simultaneously complete the pick-and-place operations of two wafers, significantly improving production efficiency and adapting to the needs of high-capacity production lines. A combination of linear motors and servo motors (first, second, third, and fourth servo motors) is used for drive, along with a hollow rotary platform and linear guides, reducing mechanical transmission errors and improving the positioning accuracy of Z-axis lifting, horizontal rotation, and X-axis movement. The integration of first and second laser sensors, photoelectric switches, and amplifiers allows for real-time monitoring of wafer position and ARM operating status, achieving closed-loop control and preventing wafer misalignment or collisions. The ceramic ARMs pneumatically adsorb wafers, with pressure gauges and solenoid valves precisely controlling the adsorption force to prevent deformation or detachment of thin wafers. The modular design of each component (such as the snap-fit ​​structure between the Z-axis main connecting plate and side connecting plate, and the reinforced design of the connecting blocks) reduces redundant space, making it suitable for installation within confined wafer processing equipment. The rational layout of the L-shaped sensor bracket further optimizes the structural compactness while ensuring the sensor's monitoring range. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the rotating mechanism of the present invention;

[0025] Figure 3 This is a schematic diagram of the Z-axis lifting assembly in this invention;

[0026] Figure 4 This is one of the structural schematic diagrams of the X-axis wafer feeding module in this invention;

[0027] Figure 5 This is the second schematic diagram of the X-axis wafer feeding module in this invention;

[0028] Figure 6 In this invention Figure 5 Schematic diagram of the structure at point A;

[0029] Figure 7 In this invention Figure 5 A schematic diagram of the structure at point B.

[0030] The labels in the diagram represent: 1. Z-axis lifting assembly; 2. Z-axis connecting assembly; 3. Rotation mechanism; 4. X-axis wafer picking module; 5. Wafer; 6. Linear motor; 7. Z-axis main connecting plate; 8. First servo motor; 9. Rotating base; 10. X-axis base plate; 11. Linear guide rail; 12. Synchronous belt pulley assembly; 13. Ceramic ARM; 14. Belt clamping block; 15. ARM bracket; 16. Sensor bracket; 17. Second ARM bracket. ; 18. Sensor sheet; 19. Photoelectric switch; 20. Belt; 21. Amplifier; 22. T-connector; 23. Pressure gauge; 24. Second servo motor; 25. Solenoid valve; 26. Third servo motor; 27. Pneumatic adapter; 28. First laser sensor; 29. ​​Second laser sensor; 30. Z-axis side connecting plate; 31. Cooling fan; 32. Rotation limit block; 33. Fourth servo motor; 34. Hollow rotary platform; 35. Reinforcing connecting block. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0032] The present invention will be further described below with reference to embodiments.

[0033] Example: A three-axis dual-Fork robot structure for wafer fabrication, see attached figure. Figure 1 - Appendix Figure 7 It includes a Z-axis lifting assembly 1, a Z-axis connecting assembly 2, a rotation mechanism 3, and an X-axis wafer picking module 4.

[0034] The rotating mechanism 3 includes two sets of Z-axis side connecting plates 30, a fourth servo motor 33 fixed between them, and a hollow rotating platform 34 that is driven by the output end of the servo motor. The top of the hollow rotating platform 34 is fixedly connected to the rotating base 9 by bolts.

[0035] The Z-axis lifting assembly 1 includes a Z-axis main connecting plate 7 fixed to one side of the Z-axis side connecting plate 30, a linear motor 6 fixed to the Z-axis main connecting plate 7, and a first servo motor 8 connected to the Z-axis main connecting plate 7. The top of the rotating base 9 is fixedly connected to the bottom of the X-axis base plate 10.

[0036] The top of the X-axis base plate 10 is equipped with an X-axis wafer pick-up module 4, which includes a pressure gauge 23, a second servo motor 24, a third servo motor 26, and a solenoid valve 25 fixed to the bottom of the X-axis base plate 10. A set of sensor brackets 16 is fixed to both sides of the X-axis base plate 10. The middle of each set of sensor brackets 16 is fixedly connected to an amplifier 21, and the top of each set of sensor brackets 16 is fixedly connected to a first laser sensor 28 and a second laser sensor 29, respectively. The top sides of the X-axis base plate 10 are fixedly connected to a synchronous pulley assembly 12 and a linear guide rail 11. A belt 20 is fitted between 12, and a belt clamping block 14 is fixed on each of the two belts 20. The tail end of the belt clamping block 14 is fixedly connected to the ARM bracket 15 and the second ARM bracket 17. The front ends of the ARM bracket 15 and the second ARM bracket 17 are fixedly connected to the ceramic ARM 13. The ARM bracket 15 and the second ARM bracket 17 are both fixedly connected to the sensing sheet 18, and the end of the sensing sheet 18 is fixedly connected to the photoelectric switch 19. The photoelectric switches 19 on both sides are at the same height as the amplifier 21. A first laser sensor 28 and a second laser sensor 29 are fixed on one side of the ARM bracket 15 and the second ARM bracket 17, respectively.

[0037] In this case, by using two independent ceramic ARMs and corresponding drive components (second and third servo motors 26, synchronous belt pulley assembly 12, etc.), the pick-and-place operations of two wafers 5 can be completed simultaneously, significantly improving production efficiency and adapting to the needs of high-capacity production lines. A combination of linear motor 6 and servo motors (first, second, third, and fourth servo motors 33) is used for drive, along with a hollow rotary platform 34 and linear guide rails 11, reducing mechanical transmission errors and improving the positioning accuracy of Z-axis lifting, horizontal rotation, and X-axis movement. The system integrates first and second laser sensors 29, photoelectric switches 19, and amplifiers 21. It can monitor the position of wafer 5 and the operating status of ARM in real time, realize closed-loop control, and avoid wafer 5 offset or collision; the ceramic ARM uses pneumatic adsorption of wafer 5, and the pressure gauge 23 and solenoid valve 25 precisely control the adsorption force to prevent the thin wafer 5 from deforming or falling off. The components are integrated through modular design (such as the snap-fit ​​structure between the Z-axis main connecting plate and the side connecting plate, and the reinforcement design of the reinforcing connecting block 35), reducing redundant space and making it suitable for installation inside the narrow wafer 5 processing equipment; the reasonable layout of the L-shaped sensor bracket further optimizes the structural compactness while ensuring the sensor monitoring range.

[0038] The bottoms of the two Z-axis side connecting plates 30 are fixedly connected to the cooling fan 31, and a rotation limit block 32 is fixed to the top of one Z-axis side connecting plate 30. The Z-axis connecting assembly 2 includes a rotating base 9 and a protrusion structure on its outer side. The rotation limit block 32 and the protrusion are at the same height, so the fourth servo motor 33 at the bottom can drive the rotating base 9 at the top to rotate and rotate at a certain angle. When rotating one revolution, in order to avoid collision, the rotation limit block 32 and the protrusion structure on the rotating base 9 can contact each other to play a blocking role. The three-axis dual-Fork robot moves to the Load via three axes. Above the port, a laser sensor detects the wafer position and notch direction. One of the two forks extends under the carrier slot, slightly lowering along the Z-axis. The fork secures the wafer through vacuum adsorption or edge clamping. The fork carrying the wafer retracts, while the other fork prepares to remove a wafer. The robot moves along the X-axis to the target chamber position, repeating the Y-axis extension and Z-axis lifting and lowering motions to precisely place the wafer into the tray inside the chamber. The two forks work together, with the other fork simultaneously performing pick-and-place operations. The dual-fork design can carry two wafers at the same time, reducing the number of transfers and greatly improving production efficiency.

[0039] The linear motor 6 has grooves on both sides, and the Z-axis main connecting plate 7 is fixed in the groove by a protruding structure fixed on the inner side. The Z-axis main connecting plate 7 is fixedly connected to the reinforcing connecting block 35. The reinforcing connecting block 35 is fixedly connected to the Z-axis side connecting plate 30 by a pin. The Z-axis main connecting plate 7 is fixedly connected to the external reinforcing connecting block 35. Under the action of the output end of the external first servo motor 8, the Z-axis main connecting plate 7 can move on the linear motor 6, which can play the role of Z-axis height adjustment.

[0040] Each sensor bracket 16 has an L-shaped structure, and the two amplifiers 21 are respectively fixed to the outer side of the vertical and horizontal portions of the sensor bracket 16. After the ARM bracket 15 and the second ARM bracket 17 on one side are fixed to the wafer, they are connected by a slider-linear guide 11-belt clamping block 14-belt 20. Therefore, when the ARM bracket 15 and the second ARM bracket 17 move, they can be transmitted to the photoelectric switch 19 through the sensing sheet 18. Thus, the light emitted by the photoelectric switch 19 can be amplified by the two amplifiers 21 and then transmitted to the first laser sensor 28 and the second laser sensor. 29 receives and records data such as jitter frequency during movement, thereby enabling real-time monitoring of the wafer position and the operating status of the two sets of ARM supports, achieving closed-loop control, and avoiding wafer offset or collision; the belt 20 and belt clamping block 14 are fixed by bolts passing through preset holes and nuts; wafer position detection and alignment: two sets of laser sensors receive laser beam reflection signals to accurately identify the edge position of the wafer, ensuring that the robot arm Fork is aligned with the center of the wafer; real-time distance monitoring: the optical ranging function monitors the distance between the robot arm Fork and the chamber, carrier or other obstacles, triggering emergency stop to prevent collision.

[0041] Both sets of synchronous pulley assemblies 12 are two sets of roller structure, and linear guide rails 11 are set on both sides of the synchronous pulley assembly 12; both sets of belts 20 are respectively connected to the output end of the second servo motor 24 and the third servo motor 26 for transmission. The belt 20 and the belt clamping block 14 are fixed by bolts passing through preset holes and nuts. The design of bolt connection between ARM bracket 15 and ceramic ARM 13 improves the structural connection strength and long-term operation stability.

[0042] A three-way adapter 22 is fixed to the bottom of the X-axis base plate 10, with one of the three-way adapters connected to a pressure gauge 23. Both sets of ceramic ARMs 13 are connected to the three-way adapter 22 via pneumatic adapters 27. The ARM support 15 and the second ARM support 17 are fixedly connected to the ceramic ARMs 13 by bolts, and the top of the ceramic ARMs 13 is fixedly connected to the wafer 5 by adsorption. The three-axis dual-Fork design can carry two wafers 5 simultaneously (e.g., one fork picks up a wafer, and the other puts it in), reducing the number of transfers and improving production efficiency. The three-axis motion is simple in structure and direct in action, making it suitable for compact semiconductor equipment layouts with high space utilization. The mechanical structure is simple, and compared to multi-axis robotic arms, the three-axis design has fewer failure points and lower maintenance costs, making it suitable for high-intensity continuous operation. It is cleanroom compatible, with a low particle generation design that meets Class 1 or higher cleanliness requirements, avoiding contamination of the wafer 5.

[0043] The bottom ends of the ARM bracket 15 and the second ARM bracket 17 are both mounted on the top of the linear guide rail 11 via sliders, and the sensing plate 18 is fixedly connected to the sliders. In this device, the pressure gauge 23 can be connected to the pneumatic adapter 27 in the two sets of ceramic ARM13 via a three-way adapter 22, and can also be connected to an external air source via the three-way adapter 22. The pressure gauge 23 and the solenoid valve 25 work together to precisely control the adsorption force, prevent the thin wafer from deforming or falling off, and monitor the adsorption force through the data from the pressure gauge 23.

[0044] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A three-axis dual-Fork robot structure for wafer fabrication, characterized in that, The system includes a Z-axis lifting assembly (1), a Z-axis connecting assembly (2), a rotating mechanism (3), and an X-axis wafer picking module (4). The rotating mechanism (3) includes two sets of Z-axis side connecting plates (30), a fourth servo motor (33) fixed between them, and a hollow rotating platform (34) that is driven by the output end of the servo motor. The top of the hollow rotating platform (34) is fixedly connected to the rotating base (9) by bolts. The Z-axis lifting assembly (1) includes a Z-axis main connecting plate (7) fixed to one side of the Z-axis side connecting plate (30), a linear motor (6) fixed to the Z-axis main connecting plate (7), and a first servo motor (8) connected to the Z-axis main connecting plate (7). The top of the rotating base (9) is fixedly connected to the bottom of the X-axis base plate (10). The top of the X-axis base plate (10) is provided with an X-axis wafer picking module (4). The X-axis wafer picking module (4) includes a pressure gauge (23), a second servo motor (24), a third servo motor (26), and a solenoid valve (25) fixed to the bottom of the X-axis base plate (10). A set of sensor brackets (16) are fixed to both sides of the X-axis base plate (10). The middle of each set of sensor brackets (16) is fixedly connected to an amplifier (21), and the tops of each set of sensor brackets (16) are fixedly connected to a first laser sensor (28) and a second laser sensor (29), respectively. The top sides of the X-axis base plate (10) are fixedly connected to a synchronous pulley assembly (12) and a linear guide rail (11). A belt (20) is fitted between the two sets of synchronous pulley assemblies (12). Each belt (20) is fixed with a belt clamping block (14). The tail end of the belt clamping block (14) is fixedly connected to the ARM bracket (15) and the second ARM bracket (17). The front ends of the ARM bracket (15) and the second ARM bracket (17) are fixedly connected to the ceramic ARM (13). The ARM bracket (15) and the second ARM bracket (17) are fixedly connected to the sensing sheet (18). The end of the sensing sheet (18) is fixedly connected to the photoelectric switch (19). The photoelectric switches (19) on both sides are at the same height as the amplifier (21). A first laser sensor (28) and a second laser sensor (29) are fixedly fixed on one side of the ARM bracket (15) and the second ARM bracket (17).

2. The three-axis dual-Fork robot structure for wafer processing according to claim 1, characterized in that, The bottom of the two sets of Z-axis side connecting plates (30) is fixedly connected to the cooling fan (31), and a rotation limiting block (32) is fixed at the top of one of the Z-axis side connecting plates (30). The Z-axis connecting assembly (2) includes the rotating base (9) and a protrusion structure provided on its outer side. The rotation limiting block (32) and the protrusion are at the same height. The linear motor (6) has grooves on both sides. The Z-axis main connecting plate (7) is fixed in the groove by the protrusion structure fixed on the inner side. The Z-axis main connecting plate (7) is fixedly connected to the reinforcing connecting block (35). The reinforcing connecting block (35) is fixedly connected to the Z-axis side connecting plate (30) by a pin.

3. The three-axis dual-Fork robot structure for wafer processing according to claim 1, characterized in that, Each set of Sensor brackets (16) is an L-shaped structure, and the two sets of amplifiers (21) are respectively fixed to the outside of the vertical and horizontal portions of the Sensor brackets (16).

4. The three-axis dual-Fork robot structure for wafer processing according to claim 1, characterized in that, Both sets of synchronous pulley assemblies (12) are two sets of roller structure, and the linear guide rails (11) are arranged on both sides of the synchronous pulley assemblies (12).

5. A three-axis dual-Fork robot structure for wafer processing according to claim 4, characterized in that, Both sets of belts (20) are respectively connected to the output ends of the second servo motor (24) and the third servo motor (26).

6. The three-axis dual-Fork robot structure for wafer processing according to claim 1, characterized in that, The bottom end of the X-axis base plate (10) is fixed with a three-way adapter (22), one of which is connected to the pressure gauge (23), and both sets of ceramic ARM (13) are connected to the three-way adapter (22) through pneumatic adapters (27), and the solenoid valve (25) is fixed in the air passage.

7. A three-axis dual-Fork robot structure for wafer processing according to claim 1, characterized in that, The ARM bracket (15) and the second ARM bracket (17) are both fixedly connected to the ceramic ARM (13) by bolts, and the top of the ceramic ARM (13) is fixedly connected to the wafer (5) by adsorption.

8. The three-axis dual-Fork robot structure for wafer processing according to claim 1, characterized in that, The bottom ends of the ARM bracket (15) and the second ARM bracket (17) are both sleeved on the top of the linear guide rail (11) by a slider, and the sensing sheet (18) is fixedly connected to the slider.

9. A three-axis dual-Fork robot structure for wafer processing according to claim 1, characterized in that, The belt (20) and the belt clamping block (14) are fixed together by bolts passing through preset holes and being fitted with nuts.

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