Water-based functional fluid and application thereof

Abstract

The invention provides a water-based functional fluid and application thereof. The water-based functional fluid comprises the following components in parts by weight: 5-15 parts of a lubricant, 5-15 parts of a wetting agent, 1-10 parts of a pH regulator, 2-8 parts of a solubilizer and 1-5 parts of a settling agent. The water-based functional fluid provided by the invention can quickly and effectively wet the surfaces of different materials, wraps powder, brings the powder out of a cutting area, keeps the cutting area clean, reduces foam generation, prevents overflow, meets the cutting requirements of different materials and different wire diameters, and improves the cutting efficiency. And the diamond wire cutting development trend of finer wires, high speed, automation and intelligentization in the future can be met.

Description

Technical Field

[0001] This invention belongs to the field of diamond wire cutting technology, specifically relating to an aqueous functional fluid and its application. Background Technology

[0002] Diamond wire cutting is a high-precision machining method that uses a metal wire with electroplated or resin-bonded diamond particles as a cutting tool. It is mainly used to cut conductive and non-conductive hard and brittle materials with a Mohs hardness of less than 10, including semiconductors (silicon, silicon carbide), magnetic materials, marble, ceramics, glass, composite materials (PCB, carbon fiber), etc. It is especially suitable for precision cutting of high-value crystals and ultra-thin samples.

[0003] Diamond wire cutting additives on the market have shifted from traditional slurry to fully synthetic cutting fluids. Compared to traditional slurry cutting, fully synthetic cutting fluids offer higher efficiency, higher wafer yield, less environmental pollution, less product damage, and lower cutting costs. The cutting fluid must simultaneously fulfill three main functions: cooling (reducing cutting temperature), lubrication (reducing friction between the wire and the material), and chip removal (removing powder). During the cutting process, powder is generated, with particle sizes mostly ranging from 1-10 μm. If this powder cannot be removed in time, it will adhere to the surface of the diamond particles, forming a "drilling pad," reducing cutting efficiency. Furthermore, the pressure of the powder between the wire mesh and the material can cause secondary scratches. Therefore, if the cutting fluid viscosity is too high, the powder is prone to agglomeration and clogging of the wire mesh; if the viscosity is too low, lubrication is insufficient, exacerbating wire wear. In addition, the coolant requires extremely high cleanliness; even tiny impurities can scratch the silicon wafer surface.

[0004] Furthermore, traditional cutting fluids on the market typically employ different formulations to handle different wire diameters and materials. This means that traditional cutting fluids cannot quickly adapt to changes in the size, hardness, and wire diameter of the material being cut, leading to the following problems:

[0005] Insufficient powder cleanability: When faced with powders of different materials, it is impossible to clean the powder out of the processing area in a timely manner;

[0006] Insufficient lubrication: When cutting hard materials such as glass and silicon carbide, insufficient lubrication can easily lead to the breakage of the diamond wire.

[0007] Insufficient wettability: When switching materials, it is unable to wet the surfaces of different materials.

[0008] Therefore, how to provide a diamond wire cutting fluid that is compatible with different wire diameters and materials, and can demonstrate effective results when cutting different materials, has become an urgent problem to be solved. Summary of the Invention

[0009] To address the shortcomings of existing technologies, the present invention aims to provide an aqueous functional fluid and its applications. The aqueous functional fluid provided by this invention can rapidly and effectively wet surfaces of different materials, encapsulate and carry powder out of the cutting area, keeping the cutting area clean, reducing foam generation, and preventing overflow. This meets the cutting requirements for different materials and wire diameters, and also satisfies the future development trend of finer wire, higher speed, automation, and intelligent diamond wire cutting.

[0010] To achieve this objective, the present invention adopts the following technical solution:

[0011] On one hand, the present invention provides an aqueous functional fluid, which comprises, by weight, 5-15 parts of lubricant, 5-15 parts of wetting agent, 1-10 parts of pH adjuster, 2-8 parts of solubilizer and 1-5 parts of flocculant.

[0012] The lubricant can be in the following quantities: 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, or 15 parts; the wetting agent can be in the following quantities: 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, or 15 parts; the pH adjuster can be in the following quantities: 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 parts; the solubilizer can be in the following quantities: 2, 3, 4, 5, 6, 7, or 8 parts; and the settling agent can be in the following quantities: 1, 2, 3, 4, or 5 parts. However, these quantities are not limited to those listed above, and other unlisted values ​​within the above range are also applicable.

[0013] The aqueous functional fluid composed of the above-mentioned specific reagents can quickly and effectively wet the surfaces of different materials, and encapsulate and carry the powder out of the cutting area, keeping the cutting area clean, reducing foam generation, and preventing overflow. It meets the cutting needs of different materials and wire diameters, and can also meet the future development trend of diamond wire cutting with finer wires, higher speed, automation and intelligence.

[0014] Preferably, the lubricant includes any one or a combination of at least two of MARLOWET SC2000, MARLOWET SC3000, MARLOWET SC4000, Marlowet SD400, Pluronic RPE1740, or Pluronic 25R2.

[0015] The aforementioned lubricant is low-foaming, which prevents excessive foaming during product use and avoids overflowing. It also effectively protects the steel wire, reduces the risk of wire breakage and microcracks, minimizes wire marks, and improves product yield.

[0016] Preferably, the lubricant includes MARLOWET SC4000, Pluronic RPE1740, and Pluronic 25R2.

[0017] Preferably, the wetting agent includes any one or a combination of at least two of Dallex W111, SP-2137, TL-604, TL-607, TL 110D, GS-25 or Ethylan 1005.

[0018] The aforementioned wetting agent can quickly wet the surfaces of different materials, ensuring that the cutting fluid can enter the cutting area, maintaining sufficient fluid supply, and fully utilizing the cleaning and lubricating properties of the cutting fluid.

[0019] Preferably, the wetting agent includes GS-25 and Ethylan 1005.

[0020] Preferably, the pH adjuster comprises any one or a combination of at least two of the following: modified undecanoic acid, triethanolamine borate, or ammonium succinate.

[0021] Preferably, the solubilizer includes any one or a combination of at least two of isohexanediol, trimethylhexanol, SL-46, EASYTECH ST-5100, AG6206, PEG 400 or Genifol 1801G.

[0022] The aforementioned solubilizers enable the product to achieve cleaning capabilities even at extremely low concentrations. The resulting micelles effectively encapsulate the powder, promptly and efficiently removing the cut powder from the cutting area, keeping the cutting area clean, and reducing the TTV value (Total Thickness Variation, i.e., the difference between the maximum and minimum thickness at measurement points on the same piece of processed material; the smaller the difference, the more uniform the thickness of the finished product and the better the effect) and surface contamination.

[0023] Preferably, the settling agent includes any one or a combination of at least two of the following: a mixture of ethylene amines Poly-7 (abbreviated as Poly-7), a polyethylene polyamine Poly-8 (abbreviated as Poly-8), a polyquaternary ammonium salt Busan77 (abbreviated as Busan77), or Fentacare Td03 (abbreviated as Td03), with Fentacare Td03 and polyethylene polyamine Poly-8 being preferred.

[0024] The aforementioned settling agent can aggregate small powder particles into clumps. When the working fluid passes through the filtration system, it can filter out these large clumps of powder in a timely manner, maintaining the cleanliness of the working fluid and improving its performance.

[0025] Preferably, the aqueous functional fluid further includes water.

[0026] On the other hand, the present invention also provides the application of the aqueous functional fluid as described above in diamond wire cutting.

[0027] Preferably, in the diamond wire cutting, the cutting material includes any one of silicon carbide, glass, sapphire, magnetic material, monocrystalline silicon, polycrystalline silicon, marble, or ceramic.

[0028] Preferably, in the diamond wire cutting, the diameter of the diamond wire is 21-350μm, such as 21μm, 50μm, 100μm, 150μm, 200μm, 250μm, 300μm or 350μm, but not limited to the values ​​listed above. Other unlisted values ​​within the above range are also applicable.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] This invention provides an aqueous functional fluid that can quickly and effectively wet surfaces of different materials, encapsulate and carry powder out of the cutting area, keep the cutting area clean, reduce foam generation, prevent overflow, increase cutting speed, protect diamond wire from breakage, prevent workpiece from developing hidden cracks, and reduce wire marks. It can also quickly gather and settle powder in the liquid tank, ensuring the cleanliness of the cutting fluid and extending its service life. It meets the cutting needs of different materials and wire diameters, and can also meet the future development trend of diamond wire cutting with finer wires, higher speeds, automation, and intelligence. Attached Figure Description

[0031] Figure 1 This is a diagram showing the result of using the product from Example 1 for magnetic material cutting;

[0032] Figure 2 This is a picture showing the result of using a product sold in a certain market for cutting magnetic materials. Detailed Implementation

[0033] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0034] In the following examples, MARLOWET SC2000, MARLOWET SC3000, MARLOWET SC4000, and Marlowet SD400 were purchased from Sasol Chemicals.

[0035] Pluronic RPE1740 and Pluronic 25R2 were purchased from Dow Chemical.

[0036] Dallex W111 was purchased from Evonik Chemicals;

[0037] SP-2137 was purchased from Guangdong Sanpin Technology;

[0038] TL-604, TL-607, and TL 110D were purchased from Wuhan Jihechang New Materials.

[0039] GS-25 was purchased from Liansheng Chemical.

[0040] Ethylan 1005 and AG 6206 were purchased from Noryon;

[0041] Fentacare Td03 was purchased from Solvay Chemicals;

[0042] SL-46 was purchased from Longxinshengyuan;

[0043] EASYTECH ST-5100 was purchased from Sangjing Chemical.

[0044] Genifol 1801G was purchased from Nanjing Shangqin New Materials.

[0045] Poly-7 and Poly-8 were purchased from Tosoh Corporation.

[0046] The Busan77 was purchased from the Buckman Laboratories.

[0047] Example 1

[0048] This embodiment provides an aqueous functional fluid, prepared from the following raw materials (by mass percentage):

[0049] 3% MARLOWET SC4000, 4% Pluronic RPE1740, 5% Pluronic 25R2, 3% isohexyl glycol, 1% EASYTECH ST-5100, 2% PEG 400, 1% TdO3, 2% Poly-8, 2% GS-25, 10% Ethylan 1005, 1% triethanolamine borate, balance water.

[0050] The preparation method is as follows:

[0051] Water, MARLOWET SC4000, Pluronic RPE1740, Pluronic 25R2, isohexyl glycol, EASYTECHST-5100, and PEG 400 were added sequentially to a mixing device and stirred for 20 minutes. Then, TdO3, Poly-8, GS-25, and Ethylan 1005 were added and stirred for 15 minutes. The mixture was then filtered through a 75μm copper wire mesh to obtain the final product.

[0052] Example 2

[0053] This embodiment provides an aqueous functional fluid, prepared from the following raw materials (by mass percentage):

[0054] 1% MARLOWET SC4000, 2% Pluronic RPE1740, 2% Pluronic 25R2, 3% isohexyl glycol, 3% EASYTECH ST-5100, 2% PEG 400, 0.3% TdO3, 0.7% Poly-8, 5% GS-25, 10% Ethylan 1005, 1% triethanolamine borate, balance water.

[0055] The preparation method is the same as in Example 1.

[0056] Example 3

[0057] This embodiment provides an aqueous functional fluid, prepared from the following raw materials (by mass percentage):

[0058] 3% MARLOWET SC4000, 7% Pluronic RPE1740, 5% Pluronic 25R2, 1% isohexyl glycol, 0.5% EASYTECH ST-5100, 0.5% PEG 400, 2% TdO3, 3% Poly-8, 1% GS-25, 4% Ethylan 1005, 10% triethanolamine borate, balance water.

[0059] The preparation method is the same as in Example 1.

[0060] Example 4

[0061] This embodiment provides an aqueous functional fluid. The raw materials used in its preparation are the same as in Example 1, except that MARLOWET SC4000 is replaced with an equal amount of MARLOWET SC3000.

[0062] Example 5

[0063] This embodiment provides an aqueous functional fluid. The raw materials used in its preparation are the same as in Example 1, except that Pluronic RPE1740 is replaced with an equal amount of Marlowet SD400.

[0064] Example 6

[0065] This embodiment provides an aqueous functional fluid. The raw materials used in its preparation are the same as in Example 1, except that GS-25 is replaced with an equal amount of TL-604.

[0066] Example 7

[0067] This embodiment provides an aqueous functional fluid. The raw materials used in its preparation are the same as in Example 1, except that GS-25 is replaced with an equal amount of DallexW111.

[0068] Example 8

[0069] This embodiment provides an aqueous functional fluid. The raw materials used in its preparation are the same as in Example 1, except that TdO3 is replaced with an equal amount of Busan77.

[0070] Example 9

[0071] This embodiment provides an aqueous functional fluid. The raw materials used in its preparation are the same as in Example 1, except that Poly-8 is replaced with an equal amount of Poly-7.

[0072] Comparative Example 1

[0073] Silicon wafer cutting fluid sold in a certain market.

[0074] Comparative Example 2

[0075] Glass cutting fluid sold in a certain market.

[0076] Effect test:

[0077] The products provided in Examples 1-9 and Comparative Examples 1-2 were tested using the following methods and items:

[0078]

[0079] The results are as follows:

[0080]

[0081]

[0082] The data above shows that the product provided by this invention has good lubrication effect, rapid defoaming, faster wetting speed, stronger wetting and cleaning ability, lower COD, lower on-site subsequent water treatment cost, and is more environmentally friendly. Comparing Examples 1-9, it can be found that by selecting specific raw materials, this invention can further improve the product's effect.

[0083] In addition, the product of Example 1 and a commercially available cutting fluid were used to cut different materials, and the parameters and results are as follows:

[0084] Silicon wafers:

[0085] Process parameters

[0086]

[0087] Finished product data

[0088]

[0089] It can be found that the product of this invention can improve the yield of silicon wafers on site and has fewer defects, which can effectively improve the economic benefits for users.

[0090] Glass:

[0091] Process parameters

[0092]

[0093] Finished product data

[0094]

[0095] It can be seen that the cutting effect of the product of the present invention not only has a high yield, but also does not have the problem of additional cutting, which can help customers improve processing efficiency. The service life of the cutting fluid has been increased from the original 3-blade replacement to 4-blade replacement, and the amount of wastewater has been reduced.

[0096] Magnetic materials:

[0097] Process parameters

[0098]

[0099] Finished product results

[0100] Magnetic material cutting results as follows Figure 1-2 As shown, the surface of the product cut in Example 1 was less dirty and did not rust during the turnover period; while the surface of the product cut in the commercial product was obviously dirty.

[0101] In summary, the product of this invention is suitable for cutting diamond wire of different materials and can also meet the requirements of different diamond wire diameters.

[0102] The applicant declares that this invention illustrates the aqueous functional fluid and its application through the above embodiments, but the invention is not limited to the above embodiments, that is, it does not mean that the invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of the raw materials of the product, addition of auxiliary components, and selection of specific methods, etc., all fall within the protection scope and disclosure scope of this invention.

[0103] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0104] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not describe the various possible combinations separately.

Claims

1. An aqueous functional fluid, characterized in that, The aqueous functional fluid comprises, by weight parts, 5-15 parts of a lubricant, 5-15 parts of a wetting agent, 1-10 parts of a pH adjuster, 2-8 parts of a solubilizer, and 1-5 parts of a settling agent.

2. The aqueous functional fluid of claim 1, wherein, The lubricant comprises any one or a combination of at least two of MARLOWETS C2000, MARLOWET SC3000, MARLOWET SC4000, Marlowet SD400, Pluronic RPE1740, or Pluronic 25R2.

3. The aqueous functional fluid of claim 2, wherein, The lubricant comprises MARLOWET SC4000, Pluronic RPE1740, and Pluronic 25R2.

4. The aqueous functional fluid of any of claims 1-3, wherein, The wetting agent comprises any one or a combination of at least two of Dallex W111, SP-2137, TL-604, TL-607, TL 110D, GS-25, or Ethylan 1005.

5. The aqueous functional fluid of claim 4, wherein, The wetting agent comprises GS-25 and Ethylan 1005.

6. The aqueous functional fluid of any of claims 1-5, wherein, The pH adjuster comprises any one or a combination of at least two of modified undecanoic acid, triethanolamine borate, or ammonium succinate; Preferably, the solubilizer comprises any one or a combination of at least two of isohexide, trimethylhexanol, SL-46, EASYTECH ST-5100, AG 6206, PEG 400, or Genifol 1801G.

7. The aqueous functional fluid of any of claims 1-6, wherein, The settling agent comprises any one or a combination of at least two of ethylene amine mixture Poly-7, polyethylene polyamine Poly-8, polyquaternary ammonium salt Busan77, or Fentacare Td03, preferably Fentacare Td03 and polyethylene polyamine Poly-8.

8. The aqueous functional fluid of any of claims 1-7, wherein, The aqueous functional fluid further comprises water.

9. Use of the aqueous functional fluid according to any one of claims 1-8 in a diamond wire cutting.

10. Use according to claim 9, characterized in that, In the diamond wire cutting, the cutting material comprises any one of silicon carbide, glass, sapphire, magnetic material, monocrystalline silicon, polycrystalline silicon, marble, or ceramic. Preferably, in the diamond wire cutting, the diameter of the diamond wire is 21-350 μm.

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