Coil component

Abstract

In this coil component, the opposing surfaces of each of the plurality of second wiring sections can be recognized when viewed from the main surface side of the element body. Since the color of the colored layer provided on the opposing surface is different from the color of the body portion, a first region in which the colored layer is provided and a second region in which the body portion is exposed from the colored layer can be discriminated when viewed from the main surface side of the element body. In this way, the first region and the second region are combined to form a pattern of various features, thereby enabling various identification information to be given to the coil component, and enabling the coil component to be identifiable.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a coil component. BACKGROUND

[0002] A coil component disclosed in Japanese Patent Application Publication No. 2014-232815 has a body having a laminated structure composed of a plurality of insulating layers and a coil conductor provided in the body. SUMMARY

[0003] Problems to be Solved by the Invention

[0004] In the above-described conventional coil component, the appearance has no characteristic, and it is difficult to identify from the appearance. The inventors and others repeatedly studied identification of the coil component from the appearance, and as a result, found a technology capable of identifying the coil component from the appearance.

[0005] According to various aspects of the present disclosure, a coil component capable of being identified from the appearance is provided.

[0006] Technical Solution for Solving the Problem

[0007] An aspect of the present disclosure provides a coil component including: a body having a light-transmitting property and composed of a plurality of laminated insulating layers; and a coil conductor provided in the body, having a visible surface toward a surface side of the body and capable of being recognized from the surface, the coil conductor including a main body portion, a colored layer having a color different from that of the main body portion and provided at a portion of the visible surface, a first region in which the colored layer is provided, and a second region in which the main body portion is exposed from the colored layer, the first region and the second region being present in the visible surface.

[0008] In the coil component, the body has a light-transmitting property, and in the visible surface of the coil conductor capable of being recognized from the surface of the body, the first region in which the colored layer is provided and the second region in which the main body portion of the coil conductor is exposed from the colored layer are present. In this case, the first region and the second region of the visible surface of the coil conductor can be recognized from the appearance of the coil component, and the identification property is obtained by the combination of the first region and the second region in the visible surface. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 FIG. 1 is a perspective view of a coil component according to an embodiment.

[0010] Figure 2 FIG. 2 is a perspective view of a coil conductor of the coil component shown in FIG. 1. Figure 1

[0011] Figure 3 FIG. 3 is an exploded perspective view showing the structure of each layer of the coil component shown in FIG. 1. Figure 1

[0012] Figure 4 is a perspective view showing a coil component according to another embodiment.​​Figure 3 FIG. 1 is a plan view of a coil member according to the present embodiment.

[0013] Figure 5 Figure 4 FIG. 2 is a V-V line sectional view of the second wiring portion shown in FIG. 1.

[0014] Figure 6 Figure 3 FIG. 3 is a plan view of a structure of the wiring portion of the second bulk layer shown in FIG. 1.

[0015] Figure 7 Figure 3 FIG. 4 is a plan view of a structure of the wiring portion of the third bulk layer shown in FIG. 1.

[0016] Figure 8 Figure 3 FIG. 5 is a plan view of a structure of the wiring portion of the fourth bulk layer shown in FIG. 1.

[0017] Figure 9 Figure 3 FIG. 6 is a plan view of a structure of the wiring portion of the fifth bulk layer shown in FIG. 1.

[0018] Figure 10 Figure 1 FIG. 7 is a flowchart showing the order of the manufacturing method of the coil member shown in FIG. 1.

[0019] Figure 11 Figure 1 FIG. 8 is a side view of the coil member shown in FIG. 1.

[0020] Figure 12

[0021] Figure 13

[0022] Figure 14 DETAILED DESCRIPTION

[0023] Hereinafter, the embodiments of the present disclosure will be explained in detail with reference to the attached drawings. Also, in the explanation of the drawings, the same or equivalent elements are marked with the same reference numerals, and the repeated explanation will be omitted.

[0024] The coil member of the present embodiment will be explained with reference to FIG. 1. As shown in FIG. 1, the coil member 1 includes a first bulk layer 10, a second bulk layer 20, a third bulk layer 30, a fourth bulk layer 40, a fifth bulk layer 50, and a coil portion 60. Figure 1 The coil member of the present embodiment will be explained with reference to FIG. 1. As shown in FIG. 1, the coil member 1 includes a first bulk layer 10, a second bulk layer 20, a third bulk layer 30, a fourth bulk layer 40, a fifth bulk layer 50, and a coil portion 60. Figure 1 2 ​​​​​​​​​​​As shown, the coil component 1 of one embodiment is configured to include a base body 2, a pair of bottom electrodes 3, 4, and a coil conductor 5. The coil conductor 5 is provided in the base body 2 and is configured to include a plurality of second wiring portions 6, a plurality of pairs of leg portions 8, and a plurality of first wiring portions 7, as described later. Specifically, the coil conductor 5 includes five second wiring portions 6, five pairs of leg portions 8, and four first wiring portions 7. The coil conductor 5 has a coil axis in the second direction D2, which is described later, and rotates around the coil axis. The coil conductor 5 of this embodiment rotates around the coil axis by substantially 4.5 turns. The number of turns of the coil conductor 5 can be appropriately increased or decreased. Along with this, the number of pairs of leg portions 8, the number of first wiring portions 7, and the number of second wiring portions 6 can also be increased or decreased.

[0025] The base body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a shape of a rectangular parallelepiped in which the corner portions and the edge line portions are chamfered and a shape of a rectangular parallelepiped in which the corner portions and the edge line portions are rounded. The base body 2 has, as an outer surface, a pair of end surfaces 2a, 2b, a pair of major surfaces 2c, 2d, and a pair of side surfaces 2e, 2f. The end surfaces 2a, 2b face each other. The major surfaces 2c, 2d face each other. The side surfaces 2e, 2f face each other. Hereinafter, the facing direction of the end surfaces 2a, 2b is referred to as a first direction D1, the facing direction of the side surfaces 2e, 2f is referred to as a second direction D2, and the facing direction of the major surfaces 2c, 2d is referred to as a third direction D3. The first direction D1, the third direction D3, and the second direction D2 are substantially orthogonal to each other.

[0026] The end surfaces 2a, 2b extend in the third direction D3 so as to join the major surfaces 2c, 2d. The end surfaces 2a, 2b also extend in the second direction D2 so as to join the side surfaces 2e, 2f. The major surfaces 2c, 2d extend in the first direction D1 so as to join the end surfaces 2a, 2b. The major surfaces 2c, 2d also extend in the second direction D2 so as to join the side surfaces 2e, 2f. The side surfaces 2e, 2f extend in the first direction D1 so as to join the end surfaces 2a, 2b. The side surfaces 2e, 2f also extend in the third direction D3 so as to join the major surfaces 2c, 2d.

[0027] The major surface 2d is a mounting surface of the base body 2, which is a surface that faces another electronic device, such as a circuit substrate or a laminated electronic component, when the coil component 1 is mounted to the other electronic device, for example. The end surfaces 2a, 2b are surfaces that are continuous from the mounting surface (i.e., the major surface 2d).

[0028] The length of the base body 2 in the first direction D1 is longer than the length of the base body 2 in the third direction D3 and the length of the base body 2 in the second direction D2. The length of the base body 2 in the third direction D3 is shorter than the length of the base body 2 in the second direction D2. That is, in this embodiment, the end faces 2a, 2b, the main faces 2c, 2d, and the side faces 2e, 2f are rectangular. The length of the base body 2 in the third direction D3 can be equal to or longer than the length of the base body 2 in the second direction D2.

[0029] Furthermore, in this embodiment, "equal" can mean not only equal, but also values ​​that include minor differences or manufacturing errors within a predetermined range. For example, multiple values ​​are defined as equal as long as they are within ±5% of the average of the multiple values.

[0030] like Figure 3 As shown, the substrate 2 has a structure formed by stacking multiple substrate layers (insulating layers) on a third direction D3. In this embodiment, the substrate 2 is composed of nine substrate layers 21 to 29. That is, the stacking direction of the substrate 2 is consistent with the third direction D3. Wiring portions 6, 7, 8a to 8f constituting the coil conductor 5 are embedded in substrate layers 22 to 28. As explained by the manufacturing method described later, the substrate 2 can be manufactured by sequentially stacking substrate layers 22 to 29 on substrate layer 21. In the actual substrate 2, the multiple substrate layers 21 to 29 can be integrated to the point where the boundaries between the layers are indistinguishable, or they can be integrated to the point where the boundaries between the layers are distinguishable.

[0031] Each substrate layer 21-29 is primarily composed of an insulating material, which in this embodiment is a light-transmitting resin material. The resin material may include, for example, at least one selected from liquid crystal polymers, polyimide resins, crystalline polystyrene, epoxy resins, acrylic resins, bismaleimide resins, and fluorinated resins. The resin material may or may not contain fillers. Fillers may be inorganic fillers, for example. Examples of inorganic fillers include silica. Furthermore, each wiring portion 6, 7, 8a-8f is composed of a conductive material (e.g., Cu).

[0032] The substrate layer 21 is composed solely of the aforementioned insulating material. The substrate layer 21 is located at the bottom of the substrate 2 and forms the main surface 2c.

[0033] like Figure 3 and Figure 4As shown, a plurality of second wiring portions 6 (lower wiring portions) are embedded in the substrate layer 22. In this embodiment, the substrate layer 22 includes five second wiring portions 6. The plurality of second wiring portions 6 extend parallel to the first direction D1 and have the same length in the first direction D1. The plurality of second wiring portions 6 are arranged at equal intervals in the second direction D2. The plurality of second wiring portions 6 are disposed separately from the end faces 2a, 2b and the side faces 2e, 2f of the substrate 2. One end 6a of each second wiring portion 6 in its extension direction is located near the end face 2a, and the other end 6b is located near the end face 2b. Because the substrate layer 22 is stacked directly above the substrate layer 21 constituting the main face 2c, the plurality of second wiring portions 6 are located on the main face 2c side of the substrate 2. In the following description, the substrate layer 22 is also referred to as the first substrate layer.

[0034] like Figure 5 As shown, each second wiring portion 6 has a generally rectangular cross-section in a section orthogonal to its extension direction (i.e., the first direction D1). Furthermore, each second wiring portion 6 is configured to include a main body portion 9 and a coloring layer 10 in a section orthogonal to its extension direction. The main body portion 9 has a generally rectangular cross-section and is made of a metallic material. Specifically, the main body portion 9 is made of Cu, and more specifically, it is made by Cu plating. The coloring layer 10 is disposed at the interface between the main body portion 9 and the base layer 21. The coloring layer 10 has a thin, layered cross-section and is made of a metallic material. In this embodiment, the coloring layer 10 is made of Cr and has a color different from that of the main body portion 9, which is made of Cu. The coloring layer 10 can be made of a material with a higher adhesion force to the base layer 21 than the material constituting the main body portion 9. In this case, by disposing of the coloring layer 10 at the interface between the main body portion 9 and the base layer 21, the adhesion force of the second wiring portion 6 to the base layer 21 is increased compared to the case where the coloring layer 10 is not disposed. When the main body 9 is formed by electroplating, the coloring layer 10 can be used as a seed layer. At this time, if necessary, a coating layer covering the surface of the coloring layer 10 can also be formed by Cu sputtering.

[0035] Each of the plurality of second wiring sections 6 has a facing surface 6c (visible surface) facing the main surface 2c of the body 2. At least one facing surface 6c of the plurality of second wiring sections 6 has a first region R1 on which the coloring layer 10 is disposed and a second region R2 on which the main body 9 is exposed from the coloring layer 10. In this embodiment, the first region R1 is present on almost the entire surface of all of the plurality of second wiring sections 6, and the second region R2 is also present on a portion of all of the plurality of second wiring sections 6. Specifically, two slits 11, where the coloring layer 10 is absent near the end 6a, extend along the second direction D2 throughout the plurality of second wiring sections 6, and the area where the slits 11 are formed becomes the second region R2 on which the main body 9 is exposed from the coloring layer 10. On the facing surface 6c, the area other than the area where the slits 11 are formed (the remaining area) becomes the first region R1 on which the coloring layer 10 is disposed.

[0036] like Figure 3 and Figure 6 As shown, wiring portions 8a to 8d (support conductors) are embedded in the substrate layers 23 to 26, and the wiring portions 8a to 8d constitute a support portion 8 extending along the third direction D3. The wiring portions 8a to 8d are all provided at the same position in any of the substrate layers 23 to 26, and overlap each other in the third direction D3. In the following description, substrate layers 23 to 26 are all referred to as the second substrate layer.

[0037] Each wiring section 8a to 8d is composed of multiple pairs arranged in the first direction D1, and in this embodiment, it is composed of five pairs. Specifically, each wiring section 8a to 8d is neatly arranged in two columns along the second direction D2, and is arranged at equal intervals in the second direction D2. In the following description, the columns on the end face 2a side of the neatly arranged wiring sections 8a to 8d are referred to as the first column 8A, and the columns on the end face 2b side are referred to as the second column 8B. The wiring sections 8a to 8d of the first column 8A are positioned at positions corresponding to one end 6a of the second wiring section 6, and the wiring sections 8a to 8d of the second column 8B are positioned at positions corresponding to the other end 6b of the second wiring section 6. In this embodiment, when viewed from the third direction D3, each wiring section 8a to 8d is approximately rectangular (e.g., approximately square). When viewed from the third direction D3, each wiring section 8a to 8d may also be a polygon other than a circle, ellipse, or quadrilateral.

[0038] like Figure 3 and Figure 7As shown, the plurality of first wiring portions 7 are buried in the bulk layer 27, and in the present embodiment, the bulk layer 27 includes four first wiring portions 7. In the following description, the bulk layer 27 is referred to as a third bulk layer. Each first wiring portion 7 has a pair of end portions 7a, 7b and an inclined portion 7c interposed between the pair of end portions 7a, 7b. The pair of end portions 7a, 7b and the inclined portion 7c are continuous, and the pair of end portions 7a, 7b are located on both sides of the inclined portion 7c in the first direction Dl. The pair of end portions 7a, 7b is composed of the first end portion 7a located at a position close to the end surface 2a of the bulk 2 and the second end portion 7b located at a position close to the end surface 2b of the bulk 2. As viewed from the third direction D3, the pair of end portions 7a, 7b are offset from each other in the second direction D2. In the present embodiment, as viewed from the third direction D3, the first end portion 7a is located closer to the side surface 2f than the second end portion 7b. The inclined portion 7c extends in a direction inclined at a prescribed angle with respect to the first direction Dl, and connects the pair of end portions 7a, 7b offset from each other in the second direction D2. The angle of inclination with respect to the first direction Dl is the same for all the first wiring portions 7. That is, the inclined portions 7c of the first wiring portions 7 have a parallel relationship with each other. In the present embodiment, the four first wiring portions 7 are composed of the first wiring portion 7A, the first wiring portion 7B, the first wiring portion 7C, and the first wiring portion 7D arranged in this order from the side close to the side surface 2f.

[0039] The first end portion 7a of the first wiring portion 7 overlaps one of the wiring portions 8a to 8d and one end portion 6a of one of the second wiring portions 6 in the first column 8A, as viewed in the third direction D3. The second end portion 7b of the first wiring portion 7 overlaps one of the wiring portions 8a to 8d and one end portion 6b of one of the second wiring portions 6 in the second column 8B, as viewed in the third direction D3. In the present embodiment, the second end portion 7b of the first wiring portion 7A overlaps the first wiring portion 8a to 8d from the side 2f side and the end portion 6b of the first second wiring portion 6 from the side 2f side, and the first end portion 7a overlaps the second wiring portion 8a to 8d from the side 2f side and the end portion 6a of the second second wiring portion 6 from the side 2f side. The second end portion 7b of the first wiring portion 7B overlaps the second wiring portion 8a to 8d from the side 2f side and the end portion 6b of the second second wiring portion 6 from the side 2f side, and the first end portion 7a overlaps the third wiring portion 8a to 8d from the side 2f side and the end portion 6a of the third second wiring portion 6 from the side 2f side. The second end portion 7b of the first wiring portion 7C overlaps the third wiring portion 8a to 8d from the side 2f side and the end portion 6b of the third second wiring portion 6 from the side 2f side, and the first end portion 7a overlaps the fourth wiring portion 8a to 8d from the side 2f side and the end portion 6a of the fourth second wiring portion 6 from the side 2f side. The second end portion 7b of the first wiring portion 7C overlaps the fourth wiring portion 8a to 8d from the side 2f side and the end portion 6b of the fourth second wiring portion 6 from the side 2f side, and the first end portion 7a overlaps the fifth wiring portion 8a to 8d from the side 2f side and the end portion 6a of the fifth second wiring portion 6 from the side 2f side.

[0040] Additionally, a pair of wiring portions 8e (first lead-out wiring portions) are embedded in the substrate layer 27. One of the pair of wiring portions 8e is positioned to overlap with one of the wiring portions 8a-8d in the first column 8A, and the other of the pair of wiring portions 8e is positioned to overlap with one of the wiring portions 8a-8d in the second column 8B. In this embodiment, one of the pair of wiring portions 8e overlaps with the first wiring portion 8a-8d from the side 2f among the wiring portions 8a-8d in the first column 8A, and also overlaps with the end 6a of the first second wiring portion 6 from the side 2f, forming the end 5a of the coil conductor 5. The other of the pair of wiring portions 8e overlaps with the fifth wiring portion 8a-8d from the side 2f among the wiring portions 8a-8d in the second column 8B, and also overlaps with the end 6b of the fifth second wiring portion 6 from the side 2f, forming the end 5b of the coil conductor 5.

[0041] like Figure 3 and Figure 8 As shown, a pair of wiring portions 8f (second lead-out wiring portions) are embedded in the substrate layer 28. The pair of wiring portions 8f are positioned to overlap with the pair of wiring portions 8e of the substrate layer 27. Among the pair of wiring portions 8f, the wiring portions 8f on the end face 2a side and the side face 2f side constitute the end 5a of the coil conductor 5, and the wiring portions 8f on the end face 2b side and the side face 2e side constitute the end 5b of the coil conductor 5. In the following description, the substrate layer 28 is referred to as the fourth substrate layer.

[0042] like Figure 3 and Figure 9 As shown, a pair of bottom electrodes 3 and 4 (terminal electrodes) are provided on the substrate layer 29. From the viewpoint of manufacturing sequence, the substrate layer 29 is located at the top of the substrate 2, forming the main surface 2d. In other words, a pair of bottom electrodes 3 and 4 are provided on the main surface 2d of the substrate 2. In the following description, the substrate layer 29 is referred to as the fifth substrate layer. Viewed from the third direction D3, the pair of bottom electrodes 3 and 4 are both rectangular. The pair of bottom electrodes 3 and 4 may also be of the same shape and size. In this embodiment, the pair of bottom electrodes 3 and 4 are arranged along the first direction D1. The bottom electrode 3 located on the end face 2a side of the substrate 2 overlaps with the wiring portions 8f on the end face 2a side and the side face 2f side of the pair of wiring portions 8f of the substrate layer 28, and the bottom electrode 4 located on the end face 2b side of the substrate 2 overlaps with the wiring portions 8f on the end face 2b side and the side face 2e side of the pair of wiring portions 8f of the substrate layer 28. A pair of bottom electrodes 3 and 4 are embedded inside the substrate 2 (more specifically, inside the substrate layer 29) and exposed from the main surface 2d. The pair of bottom electrodes 3 and 4 may also be partially or entirely disposed on the main surface 2d of the substrate 2.

[0043] Coil component 1 can be passed through Figure 10 The manufacturing process is carried out according to the flowchart shown.

[0044] First, as a first step S1, the first bulk layer 22 is layered on the bulk layer 21. Specifically, a plurality of second wiring portions 6 are formed on the bulk layer 21, and then the second wiring portions 6 are buried by a resin material constituting the first bulk layer 22. More specifically, a prescribed resist partition wall is provided on the bulk layer 21, and after a main body portion 9 is formed between the partition walls by plating using the colored layer 10 as a seed layer, the resist partition wall is removed, thereby obtaining the second wiring portions 6.

[0045] Next, as a second step S2, the second bulk layers 23 to 26 are layered on the first bulk layer 22 in this order. In the present embodiment, the second step S2 is repeated a plurality of times in the case where the second bulk layers 23 to 26 are multilayered. That is, in the case where the number of layers of the second bulk layers is N, the second step S2 is repeated N times. In the case where the second bulk layers are single-layered, the second step S2 is performed only once, and does not need to be repeated.

[0046] Then, as a third step S3, the third bulk layer 27 is layered on the second bulk layers 23 to 26 (more specifically, on the uppermost second bulk layer 26). Then, as a fourth step S4, the fourth bulk layer 28 is layered on the third bulk layer 27. Finally, as a fifth step S5, the fifth bulk layer 29 is layered on the fourth bulk layer 28. The bottom electrodes 3, 4 can be provided to the fifth bulk layer 29 in advance before the fifth bulk layer 29 is layered, or can be provided to the fifth bulk layer 29 after the fifth bulk layer 29 is layered.

[0047] Next, the pillar portions 8 of the present embodiment will be described with reference to Figure 1 , 2 , 11.

[0048] In the present embodiment, the pillar portions 8 are formed by stacking the wiring portions 8a to 8d of the respective bulk layers 23 to 26. The pillar portions 8 are constituted by a plurality of pairs of pairs in the first direction Dl, and in the present embodiment, by five pairs. Like the wiring portions 8a to 8d, the five pairs of pillar portions 8 are aligned in the second direction D2 as the first column 8A and the second column 8B.

[0049] As shown in Figure 11 , the pillar portions 8 are connected to both end portions 6a, 6b of the second wiring portions 6, respectively. Specifically, the end portion 6a of the second wiring portion 6 is connected to one end portion (end portion on the main surface 2c side) of the pillar portion 8, and the end portion 6b of the second wiring portion 6 is also connected to one end portion of the pillar portion 8. The pillar portions 8 extend from both end portions 6a, 6b of the second wiring portions 6 toward the main surface 2d of the bulk 2, respectively. In other words, one second wiring portion 6 is erected on two pillar portions 8.

[0050] In the present embodiment, the first column 8A of the pillar portions 8, the first pillar portion 8 from the side 2f side is connected at one end portion to the end portion 6a of the first second wiring portion 6 from the side 2f side, and at the other end portion to the wiring portion 8e, 8f via the end portion 5a of the coil conductor 5 provided to the bottom surface electrode 3 of the main surface 2d. The second to fifth pillar portions 8 from the side 2f side of the first column 8A of the pillar portions 8 are connected at one end portion to the end portion 6a of the second to fifth second wiring portions 6 from the side 2f side, respectively, and at the other end portion to the first end portion 7a of the first to fourth first wiring portions 7 from the side 2f side, respectively.

[0051] In addition, in the present embodiment, the first to fourth pillar portions 8 from the side 2f side of the second column 8B of the pillar portions 8 are connected at one end portion to the end portion 6b of the first to fourth second wiring portions 6 from the side 2f side, respectively, and at the other end portion to the second end portion 7b of the first to fourth first wiring portions 7 from the side 2f side, respectively. The fifth pillar portion 8 from the side 2f side of the second column 8B of the pillar portions 8 is connected at one end portion to the end portion 6b of the fifth second wiring portion 6 from the side 2f side, and at the other end portion to the wiring portion 8e, 8f via the end portion 5b of the coil conductor 5 provided to the bottom surface electrode 4 of the main surface 2d.

[0052] Here, with reference to Figure 12 The appearance of the body 2 of the coil component 1 described above is described. The body 2 of the present embodiment is composed of a resin material having light transmittance, and thus the coil conductor 5 provided inside the body 2 can be recognized from the surface side of the body 2. Specifically, as shown in FIG. 6, when viewed from the main surface 2c side of the body 2, the plurality of second wiring portions 6 constituting a part of the coil conductor 5 can be recognized. Figure 12

[0053] Since the color of the colored layer 10 provided to the opposing surface 6c is different from the color of the main body portion 9, the first region R1 in which the colored layer 10 is provided and the second region R2 in which the main body portion 9 is exposed from the colored layer 10 can be discriminated from the main surface 2c side of the body 2. In the present embodiment, when viewed from the main surface 2c side of the body 2, two slit-shaped second regions R2 provided on the end portion 6a side of each of the plurality of second wiring portions 6 can be recognized.

[0054] Thus, by the combination of the first region R1 and the second region R2, a pattern of various features is constituted, and thus the coil component 1 can be given various recognition information (for example, information on component characteristics and information on component direction, etc.), and the recognition property of the coil component 1 can be obtained.

[0055] ​The pattern of the features formed by the combination of the first region R1 and the second region R2 is not limited to the above-described manner, and various modifications can be made. For example, the second region R2 can extend along the second direction D2 and cross the first region R1, or can terminate midway through the first region R1. In addition, the second region R2 can exist at a position corresponding to each of the plurality of opposing surfaces 6c throughout all of the plurality of opposing surfaces 6c, or can exist at the opposing surfaces 6c of a part of the plurality of second wiring portions 6. For example, as shown in FIG. 16, the second region R2 can exist only at the end portion 6a of one second wiring portion 6, and the other regions can all be the first region R1. In addition, the second region R2 need not necessarily extend in a direction intersecting the extension direction of the second wiring portion 6 (i.e., the first direction D1), and as shown in FIG. 17, the second region R2 can extend in parallel with the extension direction of the second wiring portion 6. In the manner shown in FIG. 18, the first region R1 in the opposing surface 6c is bisected by the second region R2 extending in parallel with the extension direction of the second wiring portion 6. Figure 13 Figure 14 Figure 14 In the manner shown in FIG. 18, the first region R1 in the opposing surface 6c is bisected by the second region R2 extending in parallel with the extension direction of the second wiring portion 6.​​

Claims

1. A coil component, wherein, have: The base material, which is translucent, is composed of multiple stacked insulating layers; and A coil conductor, disposed within the body, has a visible surface facing the surface of the body and identifiable from that surface. The coil conductor includes a main body, a coloring layer having a different color from the main body and disposed on a portion of the visible surface, a first region having the coloring layer, and a second region of the main body exposed from the coloring layer existing on the visible surface.

2. The coil component according to claim 1, wherein, The visible surface extends in one direction. On the visible surface, the first region extends along the extension direction of the visible surface, and the second region extends in a direction that intersects the extension direction of the visible surface and crosses the first region.

3. The coil component according to claim 1, wherein, The coil conductor has multiple visible surfaces that can be identified from the same surface of the body. In each of the plurality of visible surfaces, there exists a first region and a second region.

4. The coil component according to claim 3, wherein, The plurality of visible surfaces extend parallel to each other along one direction. In each of the plurality of visible surfaces, the first region extends along the extension direction of the visible surface. The second region extends across the plurality of visible surfaces and exists at the corresponding positions on each of the plurality of visible surfaces.

5. The coil component according to claim 1, wherein, The visible surface extends in one direction. On the visible surface, the first region extends along the extension direction of the visible surface, and the second region extends along the extension direction of the visible surface and interrupts the first region.

6. The coil component according to any one of claims 1 to 5, wherein, The insulating layer constituting the substrate is made of resin.

7. The coil component according to any one of claims 1 to 5, wherein, The coloring layer is composed of Cr.

8. The coil component according to any one of claims 1 to 5, wherein, The main body is made of Cu.

9. The coil component according to any one of claims 1 to 8, wherein, The coil conductor includes a wiring portion extending in a direction orthogonal to the stacking direction of the body. The wiring section has a visible surface that can be identified from the surface of the substrate, which is orthogonal to the stacking direction of the substrate.

10. The coil component according to claim 9, wherein, The substrate has a mounting surface orthogonal to the stacking direction. The coil conductor includes a plurality of first wiring portions extending parallel to the mounting surface, a plurality of second wiring portions extending parallel to the mounting surface at a distance farther from the mounting surface than the first wiring portions, and a plurality of pairs of support portions extending from both ends of each of the plurality of second wiring portions toward the mounting surface along the stacking direction. The wiring section is the second wiring section.

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