Golden finger pad processing method and device and computer readable storage medium

Abstract

The invention relates to a golden finger bonding pad processing method and device and a computer readable storage medium. The processing method comprises the steps that a dry film is attached to the surface of a to-be-processed golden finger bonding pad to obtain a film bonding pad, the to-be-processed golden finger bonding pad is manufactured on a circuit board based on a target design pattern, the target design pattern comprises a golden finger extension area, the golden finger extension area comprises a first edge base line and a second edge base line, and the first edge base line and the second edge base line are arranged on the circuit board; the first edge base line is an edge base line of a finished golden finger, and the second edge base line is formed by extending the first edge base line outwards by a target distance; according to the first edge base line, cutting off the golden finger extension area in the film bonding pad to obtain a semi-finished golden finger bonding pad; and carrying out film stripping treatment on the semi-finished golden finger bonding pad to obtain a finished golden finger bonding pad. According to the golden finger pad processing method, the processing precision of the golden finger pad can be improved, the reliability of the golden finger pad is improved, and the service life of the golden finger pad is prolonged.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and in particular to a method, equipment, and computer-readable storage medium for processing gold finger pads. Background Technology

[0002] In printed circuit boards (PCBs), gold fingers are a common type of solder pad design. Their core function is to enable pluggable electrical connections between boards or between boards and devices, while also possessing wear resistance and oxidation resistance. The manufacturing process and cutting method of gold fingers directly affect the reliability and lifespan of the product. This is especially true for products such as substrate-like boards and packaging substrates with fine and high-density wiring, where the manufacturing process and cutting methods of gold fingers need to be more precise and reliable.

[0003] In related technologies, V-cutting, laser cutting, and milling cutter cutting are commonly used for edge cutting of gold fingers. However, these cutting methods have many drawbacks. For example, V-cutting can easily lead to burrs or micro-cracks remaining on the edge of the gold fingers, laser cutting can easily lead to carbonization and short circuits in the board, and milling cutter cutting can easily cause the copper pads to curl up. Summary of the Invention

[0004] Therefore, it is necessary to provide a gold finger pad processing method, equipment, and computer-readable storage medium to address the numerous defects in the edge cutting of gold fingers in the existing technology.

[0005] A method for processing gold finger pads includes: A dry film is attached to the surface of the gold finger pad to be processed to obtain a film-attached pad. The gold finger pad to be processed is fabricated on the circuit board based on a target design pattern. The target design pattern includes a gold finger extension area. The gold finger extension area includes a first edge baseline and a second edge baseline. The first edge baseline is the edge baseline of the finished gold finger. The second edge baseline is formed by extending the first edge baseline outward by a target distance. Based on the first edge baseline, the gold finger extension area in the film-coated pad is cut off to obtain a semi-finished gold finger pad; The semi-finished gold finger pads are subjected to a stripping process to obtain finished gold finger pads.

[0006] In the above-mentioned gold finger pad processing method, the gold finger pad to be processed includes not only the original pad area corresponding to the finished gold finger pad, but also the gold finger extension area. The gold finger extension area is an extension of the original pad area and is copper-plated like the original pad area. Both the original pad area and the gold finger extension area in the film-coated pad are covered with dry film. When the gold finger extension area is cut along the first edge baseline, the two sides of the cutting line are the original pad area and the gold finger extension area, respectively. Since both the original pad area and the gold finger extension area are covered with dry film and are copper-plated, the pad can be protected, cutting space can be reserved, and cutting stress can be provided, thereby improving the cutting quality. This makes the edge of the finished gold finger pad flush with the edge of the circuit board, which can avoid the phenomenon of copper peeling / lifting and delamination of the finished gold finger pad, and also ensure that the edge of the finished gold finger pad is flat and burr-free, ensuring smooth connector insertion and removal and avoiding damage to the connector. This gold finger pad processing method can be widely used for edge cutting of gold finger pads in circuit boards, including but not limited to single-sided boards, double-sided boards, multilayer boards, HDI boards, carrier-like boards, IC carrier boards (packaging substrates), etc. With this gold finger pad processing method, gold finger pads can be processed without introducing high-end processing equipment, thus reducing equipment investment costs, saving material and labor costs, shortening the gold finger pad processing cycle, and improving the processing quality of gold finger pads.

[0007] In one embodiment, the step of cutting away the gold finger extension area in the film-coated pad according to the first edge baseline to obtain a semi-finished gold finger pad includes: The first edge baseline is defined as the cutting line of the film-attached pad; The film-coated pads are laser-pre-cut along the cutting line to obtain pre-cut pads. The pre-cut depth of the film-coated pads is less than the sum of the thickness of the circuit board material and the thickness of the dry film. The pre-cut pad is precision cut with a milling cutter along the cutting line to remove the gold finger extension area in the pre-cut pad, thereby obtaining the semi-finished gold finger pad.

[0008] In the aforementioned gold finger pad processing method, laser pre-cutting and milling precision cutting are combined. The pre-cut groove formed by laser pre-cutting provides visual positioning and physical guidance for milling precision cutting, thereby effectively improving the alignment accuracy and flatness of the cutting line. Compared with laser cutting or milling cutter cutting alone, the combination of laser pre-cutting and milling precision cutting can release most of the stress on the circuit board during the laser pre-cutting stage, avoiding the risk of internal circuit damage and copper foil curling that may be caused by direct milling cutter cutting, and also avoiding the substrate carbonization that may be caused by direct laser cutting, thus effectively improving the processing accuracy of the finished gold finger pads.

[0009] In one embodiment, the pre-cut depth of the film-coated pad is equal to the sum of the thickness of the dry film and the copper foil thickness of the gold finger pad to be processed.

[0010] In one embodiment, the laser pre-cutting of the film-coated pad along the cutting line includes: The laser cutting parameters are obtained, and the film bonding pad is pre-cut multiple times along the cutting line according to the laser cutting parameters. The laser cutting parameters include at least the cutting speed, cutting frequency, power coefficient and number of cuts.

[0011] In one embodiment, the step of attaching the dry film to the surface of the gold finger pad to be processed to obtain the film-coated pad includes: The dry film is attached to the surface of the circuit board; The circuit board is subjected to exposure and development processes in sequence to remove the dry film around the gold finger pads to be processed, thereby obtaining the film-coated pads.

[0012] In one embodiment, the sequential exposure and development processes performed on the circuit board to remove the dry film surrounding the gold finger pads to be processed include: The dry film directly above the gold finger pad to be processed is cured by irradiating it with an ultraviolet light source and a gold finger film. The developing solution is sprayed onto the surface of the circuit board to dissolve the dry film around the gold finger pads to be processed, and the surface of the circuit board is rinsed with water.

[0013] In one embodiment, the method further includes: Obtain the original design drawing, which corresponds to the actual processing size of the finished gold finger pad, and the original design drawing includes the first edge baseline; Obtain the processing parameters of the film-attached pads, and determine the target distance based on the processing parameters; Generate the target design graphic based on the original design graphic and the target distance; The gold finger pads to be processed are fabricated according to the target design pattern.

[0014] In one embodiment, the stripping process for the semi-finished gold finger pads includes: An organic stripping solution is sprayed onto the dry film on the surface of the semi-finished gold finger pads to remove the dry film. Rinse off the dried film with clean water.

[0015] A gold finger pad processing device includes a processor and a memory, wherein the memory is used to store a computer program, and the computer program, when executed by the processor, implements the above-described gold finger pad processing method.

[0016] A computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described gold finger pad processing method. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating the gold finger pad processing method of the present invention; Figure 2 This is a schematic diagram of the original design pattern in the gold finger pad processing method of the present invention; Figure 3 This is a schematic diagram of the target design pattern in the gold finger pad processing method of the present invention; Figure 4 This is a schematic diagram of the structure of the gold finger pad processing equipment of the present invention. Detailed Implementation

[0018] To make the above-mentioned objects, features, and advantages of the invention more apparent and understandable, specific embodiments of the invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the invention. However, the invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0019] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly on" another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] This invention discloses a method for processing gold finger pads.

[0022] like Figures 1 to 3 As shown, the gold finger pad processing method includes: Step S101: Apply dry film to the surface of the gold finger pad to be processed to obtain a film-coated pad. The gold finger pad to be processed is fabricated on the circuit board based on a target design pattern. The target design pattern includes a gold finger extension area. The gold finger extension area includes a first edge baseline and a second edge baseline. The first edge baseline is the edge baseline of the finished gold finger. The second edge baseline is formed by extending the first edge baseline outward by a target distance.

[0023] In this step, the circuit board needs to be dried before applying the dry film to the surface of the gold finger pads to be processed. Applying the dry film to the surface of the gold finger pads protects them. The film application temperature can be set according to the actual situation. Preferably, the film application temperature is 110±5℃.

[0024] In one embodiment, since the shape of the dry film does not match the shape of the gold finger pad to be processed, it is necessary to remove the dry film around the gold finger pad. Further, to obtain a film-coated pad by attaching the dry film to the surface of the gold finger pad, the dry film is first attached to the surface of the circuit board; then, the circuit board is sequentially exposed and developed to remove the dry film around the gold finger pad, resulting in a film-coated pad. Further, when sequentially exposing and developing the circuit board to remove the dry film around the gold finger pad, the dry film directly above the gold finger pad is first irradiated with an ultraviolet light source and gold finger film to cure it; then, developing solution is sprayed onto the surface of the circuit board to dissolve the dry film around the gold finger pad, and the surface of the circuit board is rinsed with water. Under ultraviolet light irradiation, the dry film can cure rapidly. The purpose of the gold finger film is to shield the dry film on the outer side of the gold finger pads to be processed, preventing the dry film around the gold finger from solidifying, thereby helping to dissolve the dry film around the gold finger. Preferably, the developing process can be performed using a developing machine. The developing pressure and speed of the developing machine can be set according to the actual situation. For example, the developing pressure is 1.5 kg, and the developing speed is 2.3-2.6 m / min.

[0025] In one embodiment, when fabricating the gold finger pad to be processed, firstly, an original design pattern is obtained, which corresponds to the actual processing dimensions of the finished gold finger pad. The original design pattern includes a first edge baseline. Then, the processing parameters of the film-coated pad are obtained, and the target distance for extending the first edge baseline outward is determined based on the processing parameters of the film-coated pad. Next, a target design pattern is generated based on the original design pattern and the target distance. Finally, the gold finger pad to be processed is fabricated based on the target design pattern. By using the processing parameters of the film-coated pad, the thickness, material, etc., of the film-coated pad can be evaluated, thereby assessing the internal stress of the film-coated pad, and then determining the target distance for extending the first edge baseline outward based on the magnitude of the internal stress. Preferably, the target distance ranges from 5mm to 10mm.

[0026] Step S102: Based on the first edge baseline, cut off the gold finger extension area in the film-coated pad to obtain a semi-finished gold finger pad.

[0027] In this step, since the surface of the film-coated pad is covered with a pad, the internal stress distribution of the circuit board needs to be fully considered during the cutting of the gold finger extension area. Preferably, the film-coated pad is cut multiple times along the first edge baseline to obtain a semi-finished gold finger pad. Compared with the finished gold finger pad, the surface of the semi-finished gold finger pad is covered with a dry film.

[0028] In one embodiment, when removing the gold finger extension area in the film-coated pad according to the first edge baseline to obtain a semi-finished gold finger pad, the first edge baseline is first determined as the cutting line of the film-coated pad; then, the film-coated pad is laser-pre-cut along the cutting line to obtain a pre-cut pad, wherein the pre-cut depth of the film-coated pad is less than the sum of the board thickness and the dry film thickness; finally, the pre-cut pad is milled along the cutting line to remove the gold finger extension area in the pre-cut pad to obtain a semi-finished gold finger pad.

[0029] Preferably, the pre-cut depth of the film-coated pad is equal to the sum of the dry film thickness and the copper foil thickness of the gold finger pad to be processed. The thickness of the dry film and the copper foil thickness can be set according to the actual situation. For example, the dry film thickness is 30 μm, and the copper foil thickness is 5 μm or 10 μm.

[0030] In one embodiment, when laser pre-cutting the film-coated pads along the cutting line, laser cutting parameters are first obtained. Based on these parameters, the film-coated pads are then pre-cut multiple times along the cutting line. The laser cutting parameters include at least the cutting speed, cutting frequency, power factor, and number of cuts. Preferably, a UV laser machine is used for laser pre-cutting. Laser cutting data is retrieved according to the part number in the production file. For conventional products, positioning is achieved using outer layer positioning holes. The laser pre-cutting parameters can be adjusted according to actual conditions. For example, a cutting speed of 1100 mm / s, a cutting frequency of 1200 kHz, a power factor of 36 W, and 4 cuts can be used. Energy testing is required before laser pre-cutting to prevent damage to the circuit board.

[0031] In one implementation, during precision milling, the milling profile data is retrieved according to the part number in the production file, and positioning pins are used for positioning according to the outer layer's positioning hole data. The cutter diameter is selected according to the file. Machining parameters are set based on the milling profile data, and a double-edged milling cutter is used for production. Operators wear gloves during operation, and for each part number, the outline dimension drawing in the production file must be checked and a first-piece confirmation is performed to ensure that the milled profile dimensions are within acceptable limits. The milling cutter machining parameters can be set with reference to the table below.

[0032] Table 1 Milling cutter machining parameters Milling cutter type Diameter (mm) File type Rotational speed (krpm) Cutting speed (m / min) Feed rate (m / min) Return speed (m / min) Compensation (mm) Lifespan (m) Double-edged end mill 1.0 G41 32-35 0.3-0.5 0.6-0.8 10 0.95-1.05 2-4 Double-edged end mill 1.6 G41 28-32 0.3-0.5 0.6-0.8 10 0.95-1.05 2-4 Step S103: Perform a stripping process on the semi-finished gold finger pads to obtain finished gold finger pads.

[0033] In this step, by performing a film removal process on the semi-finished gold finger pads, the dry film on top of the pads can be removed, exposing the copper surface of the pads, thus obtaining the finished gold finger pads. Further, after obtaining the finished gold finger pads, subsequent processing steps can be performed. For example, solder mask treatment can be applied to the gold finger pads.

[0034] In one embodiment, the semi-finished gold finger pads can be stripped using a chemical solution. Further, during the stripping process, an organic stripping solution is first sprayed onto the dry film on the surface of the semi-finished gold finger pads to remove the dry film; then, the removed dry film is rinsed off with clean water. Preferably, the temperature of the organic stripping solution is 55±5℃, and the stripping time is 60 seconds.

[0035] In the above-mentioned gold finger pad processing method, the gold finger pad to be processed includes not only the original pad area corresponding to the finished gold finger pad, but also the gold finger extension area. The gold finger extension area is an extension of the original pad area and is copper-plated like the original pad area. Both the original pad area and the gold finger extension area in the film-coated pad are covered with dry film. When the gold finger extension area is cut along the first edge baseline, the two sides of the cutting line are the original pad area and the gold finger extension area, respectively. Since both the original pad area and the gold finger extension area are covered with dry film and are copper-plated, the pad can be protected, cutting space can be reserved, and cutting stress can be provided, thereby improving the cutting quality. This makes the edge of the finished gold finger pad flush with the edge of the circuit board, which can avoid the phenomenon of copper peeling / lifting and delamination of the finished gold finger pad, and also ensure that the edge of the finished gold finger pad is flat and burr-free, ensuring smooth connector insertion and removal and avoiding damage to the connector. This gold finger pad processing method can be widely used for edge cutting of gold finger pads in circuit boards, including but not limited to single-sided boards, double-sided boards, multilayer boards, HDI boards, carrier-like boards, IC carrier boards (packaging substrates), etc. With this gold finger pad processing method, pad processing can be performed without introducing high-end processing equipment, thus reducing equipment investment costs, saving material and labor costs, shortening the processing cycle of finished gold finger pads, and improving the processing quality of finished gold finger pads.

[0036] By combining laser pre-cutting with milling precision cutting, the pre-cut grooves created by the laser pre-cutting provide visual positioning and physical guidance for the milling precision cutting, thereby effectively improving the alignment accuracy and flatness of the cutting line. Compared with laser cutting or milling cutter cutting alone, this combined approach releases most of the stress on the circuit board during the laser pre-cutting stage. This avoids the risk of internal circuit damage and copper foil curling that may occur with direct milling cutter cutting, and also avoids the substrate carbonization that may occur with direct laser cutting, thus effectively improving the processing accuracy of the finished gold finger pads.

[0037] Figure 4 This is a schematic diagram of the structure of a gold finger pad processing device provided in one embodiment of this application. Figure 4 As shown, the gold finger pad processing equipment 40 of this embodiment includes: at least one processor 41 ( Figure 4 Only one is shown in the diagram), memory 42, and computer program 43 stored in the memory 42 and executable on the at least one processor 41, wherein the processor 41 executes the computer program 43 to implement the steps in any of the above embodiments of the gold finger pad processing method.

[0038] The gold finger pad processing equipment may include, but is not limited to, processor 41 and memory 42. Those skilled in the art will understand that... Figure 4This is merely an example of the gold finger pad processing equipment 40 and does not constitute a limitation on the gold finger pad processing equipment 40. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, etc.

[0039] The processor 41 may be a Central Processing Unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0040] In some embodiments, the memory 42 may be an internal storage unit of the gold finger pad processing equipment 40, such as a hard disk or memory of the gold finger pad processing equipment 40. In other embodiments, the memory 42 may be an external storage device of the gold finger pad processing equipment 40, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the gold finger pad processing equipment 40. Further, the memory 42 may include both internal storage units and external storage devices of the gold finger pad processing equipment 40. The memory 42 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of computer programs. The memory 42 can also be used to temporarily store data that has been output or will be output.

[0041] In addition, this application embodiment also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above embodiments of the gold finger pad processing method.

[0042] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A method for processing gold finger pads, characterized in that, include: A dry film is attached to the surface of the gold finger pad to be processed to obtain a film-attached pad. The gold finger pad to be processed is fabricated on the circuit board based on a target design pattern. The target design pattern includes a gold finger extension area. The gold finger extension area includes a first edge baseline and a second edge baseline. The first edge baseline is the edge baseline of the finished gold finger. The second edge baseline is formed by extending the first edge baseline outward by a target distance. Based on the first edge baseline, the gold finger extension area in the film-coated pad is cut off to obtain a semi-finished gold finger pad; The semi-finished gold finger pads are subjected to a stripping process to obtain finished gold finger pads.

2. The gold finger pad processing method according to claim 1, characterized in that, The step of cutting away the extended region of the gold finger in the film-attached pad according to the first edge baseline to obtain a semi-finished gold finger pad includes: The first edge baseline is defined as the cutting line of the film-attached pad; The film-coated pads are laser-pre-cut along the cutting line to obtain pre-cut pads. The pre-cut depth of the film-coated pads is less than the sum of the thickness of the circuit board material and the thickness of the dry film. The pre-cut pad is precision cut with a milling cutter along the cutting line to remove the gold finger extension area in the pre-cut pad, thereby obtaining the semi-finished gold finger pad.

3. The gold finger pad processing method according to claim 2, characterized in that, The pre-cut depth of the film-coated pad is equal to the sum of the thickness of the dry film and the copper foil thickness of the gold finger pad to be processed.

4. The gold finger pad processing method according to claim 2, characterized in that, The laser pre-cutting of the film-attached pads along the cutting line includes: The laser cutting parameters are obtained, and the film bonding pad is pre-cut multiple times along the cutting line according to the laser cutting parameters. The laser cutting parameters include at least the cutting speed, cutting frequency, power coefficient and number of cuts.

5. The gold finger pad processing method according to claim 1, characterized in that, The process of attaching a dry film to the surface of the gold finger pad to be processed to obtain a film-coated pad includes: The dry film is attached to the surface of the circuit board; The circuit board is subjected to exposure and development processes in sequence to remove the dry film around the gold finger pads to be processed, thereby obtaining the film-coated pads.

6. The gold finger pad processing method according to claim 5, characterized in that, The step of sequentially exposing and developing the circuit board to remove the dry film around the gold finger pads to be processed includes: The dry film directly above the gold finger pad to be processed is cured by irradiating it with an ultraviolet light source and a gold finger film. The developing solution is sprayed onto the surface of the circuit board to dissolve the dry film around the gold finger pads to be processed, and the surface of the circuit board is rinsed with water.

7. The method for processing gold finger pads according to any one of claims 1 to 6, characterized in that, The method further includes: Obtain the original design drawing, which corresponds to the actual processing size of the finished gold finger pad, and the original design drawing includes the first edge baseline; Obtain the processing parameters of the film-attached pads, and determine the target distance based on the processing parameters; Generate the target design graphic based on the original design graphic and the target distance; The gold finger pads to be processed are fabricated according to the target design pattern.

8. The gold finger pad processing method according to claim 1, characterized in that, The process of removing the coating from the semi-finished gold finger pads includes: An organic stripping solution is sprayed onto the dry film on the surface of the semi-finished gold finger pads to remove the dry film. Rinse off the dried film with clean water.

9. A gold finger pad processing device, characterized in that, It includes a processor and a memory, the memory being used to store a computer program, which, when executed by the processor, implements the gold finger pad processing method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, It stores a computer program that, when executed by a processor, implements the gold finger pad processing method as described in any one of claims 1 to 8.

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