NTC and FPCA crimping connection method and FPCA product

Abstract

The invention relates to an NTC and FPCA crimping connection method and an FPCA product. The method comprises the following steps: preparing an FPCA main board, an NTC auxiliary board and a metal connecting board; a puncturing device is adopted to position the FPCA main board and the NTC auxiliary board, so that the two main connection bonding pads of the FPCA main board abut against the two auxiliary connection bonding pads of the NTC auxiliary board; pressing the metal connecting plate to the main connecting bonding pad of the FPCA main board and the auxiliary connecting bonding pad of the NTC auxiliary board by adopting a puncturing device, so that the connecting protruding part of the metal connecting plate penetrates through the main connecting bonding pad and the auxiliary connecting bonding pad; and a crimping device is adopted to bend the connecting spines, protruding out of the FPCA main board or the NTC auxiliary board, of the metal connecting board, so that the end parts of the connecting spines of the metal connecting board are bent and are close to or abut against the surface of the FPCA main board or the surface of the NTC auxiliary board. According to the invention, further SMT removal of the production of the FPCA product can be realized, and the cost can be further reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method for crimping NTC and FPCA and an FPCA product. Background Technology

[0002] With the rapid development of new energy vehicles, the demand for new energy battery packs is constantly increasing, and the demand for temperature acquisition and protection boards, as one of the important components of battery packs, is increasing significantly. As a type of FPCA (Flexible Printed Circuit Assembly) product, the temperature acquisition and protection board is traditionally produced using SMT (Surface Mount Technology), where NTC (Negative Temperature Coefficient thermistor) components are printed and mounted onto the FPCA mainboard. However, when using traditional reflow soldering methods in SMT, a large number of machines are used for line production, resulting in high costs. Therefore, some SMT-free solutions have emerged in the production of FPCA temperature acquisition and protection boards.

[0003] In traditional surface mount technology (SMT) elimination solutions, the connection between the NTC board and the FPCA mainboard still uses hot-melt soldering. This involves a production process that includes soldering, SPI (Solder Paste Inspection), surface mounting (sub-board), laser soldering, and AOI (Automatic Optical Inspection) to connect the NTC board and the FPCA mainboard. While this hot-melt soldering method can reduce costs to some extent, it doesn't completely eliminate SMT and cannot further reduce costs. Summary of the Invention

[0004] This invention provides a method for crimping NTC and FPCA and an FPCA product, which can further reduce the need for SMT in the production of FPCA products and further reduce costs.

[0005] To achieve the above objectives, the present invention provides a method for crimping an NTC and an FPCA, the method comprising:

[0006] Prepare an FPCA main board, an NTC sub-board, and a metal connection board; wherein, the FPCA main board includes a main board body, two main connection circuits and at least two main positioning holes disposed on the surface of the main board body, and main connection pads disposed on each of the main connection circuits; the NTC sub-board includes a sub-board body, two secondary connection circuits and at least two secondary positioning holes disposed on the surface of the sub-board body, and secondary connection pads disposed on each of the secondary connection circuits; the metal connection board includes a connection board and connection spikes protruding from the connection board.

[0007] A piercing device is used to position the FPCA main board and the NTC sub-board through the main positioning hole and the secondary positioning hole, so that the two main connection pads of the FPCA main board and the two secondary connection pads of the NTC sub-board are in contact with each other.

[0008] The metal connecting plate is pressed onto the main connecting pad of the FPCA motherboard and the secondary connecting pad of the NTC sub-board using the piercing device, so that the connecting protrusion of the metal connecting plate penetrates the main connecting pad and the secondary connecting pad, thereby achieving the initial connection between the FPCA motherboard and the NTC sub-board.

[0009] A crimping device is used to bend the connecting protrusions of the metal connecting plate that protrude from the FPCA main board or the NTC sub-board, so that the ends of the connecting protrusions of the metal connecting plate are bent and close to or pressed against the surface of the FPCA main board or the surface of the NTC sub-board.

[0010] In addition, the present invention also proposes an FPCA product, which is manufactured using the NTC and FPCA crimping connection method described above.

[0011] The beneficial effects of the technical solution provided by this invention include:

[0012] A metal connector plate with connecting spikes is pressed onto the stacked FPCA main board and NTC secondary board using a piercing device. The connecting spikes penetrate the main connection pads of the FPCA main board and the secondary connection pads of the NTC secondary board, ensuring one-to-one contact between the two main connection pads of the FPCA main board and the two secondary connection pads of the NTC secondary board, thus achieving electrical connection between the FPCA main board and the NTC secondary board. Furthermore, after the connecting spikes of the metal connector plate pierce and connect the FPCA main board and NTC secondary board, the connecting spikes can be further bent using a pressing device. The bent connecting spikes press against the FPCA main board and NTC secondary board from one side, and the metal connector plate's main board from the other side clamps the FPCA main board and NTC secondary board together, thus tightly connecting them. This method, compared to the traditional method of connecting the FPCA main board and NTC secondary board using hot-melt solder joints, further reduces surface-mount technology (SMT) and thus lowers costs. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a simplified schematic diagram illustrating the steps of the NTC and FPCA crimping connection method described in an embodiment of the present invention;

[0015] Figure 2 This is a simplified three-dimensional structural diagram of the FPCA motherboard involved in the NTC and FPCA crimping connection method described in this embodiment of the invention.

[0016] Figure 3 This is a simplified three-dimensional structural diagram of the NTC sub-board involved in the NTC and FPCA crimping connection method described in this embodiment of the invention;

[0017] Figure 4 This is a simplified cross-sectional diagram of the metal connecting plate involved in the NTC and FPCA crimping connection method described in this embodiment of the invention.

[0018] Figure 5 This is a simplified three-dimensional structural diagram of the metal connecting plate (after bending) involved in the NTC and FPCA crimping connection method described in the embodiments of the present invention;

[0019] Figure 6 This is a simplified three-dimensional structural diagram of the FPCA main board and NTC sub-board involved in the NTC and FPCA crimping connection method described in this embodiment of the invention. Figure 1 ;

[0020] Figure 7 This is a simplified three-dimensional structural diagram of the FPCA main board and NTC sub-board involved in the NTC and FPCA crimping connection method described in this embodiment of the invention. Figure 2 ;

[0021] Figure 8 This is a simplified structural diagram of the puncture device involved in the NTC and FPCA crimping connection method described in this embodiment of the invention;

[0022] Figure 9 This is a simplified schematic diagram of the structure involved in the positioning of the FPCA main board and NTC sub-board and the gripping of the metal connecting plate using a piercing device in the NTC and FPCA crimping connection method described in the embodiments of the present invention.

[0023] Figure 10 This is a simplified schematic diagram of the structure of the NTC and FPCA crimping connection method described in this embodiment of the invention, which involves using a piercing device to press the metal connecting plate down onto the FPCA main board and the NTC sub-board.

[0024] Figure 11 This is a simplified schematic diagram of the structure of the NTC and FPCA crimping connection method described in the embodiments of the present invention, in which a piercing device is used to pierce the FPCA main board and the NTC sub-board with a metal connecting plate;

[0025] Figure 12 This is a simplified structural diagram of the crimping device involved in the NTC and FPCA crimping connection method described in this embodiment of the invention;

[0026] Figure 13 This is a simplified schematic diagram illustrating the structure of the NTC and FPCA crimping connection method described in this embodiment of the invention, where a crimping device is used to position the punctured FPCA main board and NTC sub-board.

[0027] Figure 14 This is a simplified schematic diagram illustrating the structure of the NTC and FPCA crimping connection method described in this embodiment of the invention, where a crimping device is used to bend the connecting protrusions of the metal connecting plate that punctures the FPCA main board and the NTC sub-board. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] In traditional surface mount technology (SMT) elimination solutions, the connection between the NTC board and the FPCA mainboard still uses hot-melt soldering, employing methods such as spot soldering, SPI, surface mount (sub-board), laser soldering, and AOI to connect the NTC board and the FPCA mainboard. While this hot-melt soldering method can reduce costs to some extent, it doesn't completely eliminate SMT and cannot further reduce costs. To address these technical issues, this invention proposes a crimp connection method for NTC and FPCA.

[0030] Specifically, such as Figure 1 As shown, the method for crimping the NTC to FPCA may include the following steps:

[0031] S100, prepare FPCA main board 100, NTC sub-board 200, and metal connection board 300; wherein, FPCA main board 100 includes main board body 110, two main connection circuits 120 and at least two main positioning holes 140 disposed on the surface of main board body 110, and main connection pads 130 disposed on each main connection circuit 120 (e.g., Figure 2 (As shown); The NTC sub-board 200 includes a sub-board body 210, two sub-connection circuits 230 and at least two sub-positioning holes 250 disposed on the surface of the sub-board body 210, and sub-connection pads 240 disposed on each sub-connection circuit 230 (e.g., as shown); Figure 2 (As shown); the metal connecting plate 300 includes a connecting main plate 310 and connecting protrusions 320 protruding from the connecting main plate 310 (as shown); Figure 4 and Figure 5 (as shown);

[0032] S200, using a piercing device 400, positions the FPCA mainboard 100 and NTC secondary board 200 through the main positioning hole 140 and the secondary positioning hole 250, so that the two main connection pads 130 of the FPCA mainboard 100 and the two secondary connection pads 240 of the NTC secondary board 200 are in contact with each other (e.g., Figure 9 (as shown);

[0033] S300, using a piercing device 400, the metal connecting plate 300 is pressed onto the main connecting pad 130 of the FPCA main board 100 and the secondary connecting pad 240 of the NTC sub-board 200, so that the connecting protrusions 320 of the metal connecting plate 300 pass through the main connecting pad 130 and the secondary connecting pad 240, thus achieving the initial connection between the FPCA main board 100 and the NTC sub-board 200 (e.g., Figure 10 and Figure 11 (as shown);

[0034] S400, using a crimping device 500, the connecting protrusions 320 of the metal connecting plate 300 protruding from the FPCA main board 100 or NTC sub-board 200 are bent, causing the ends of the connecting protrusions 320 of the metal connecting plate 300 to bend and approach or press against the surface of the FPCA main board 100 or the surface of the NTC sub-board 200 (e.g., ...). Figure 13 and Figure 14 (As shown).

[0035] The metal connecting plate 300 with connecting spikes 320 is pressed onto the stacked FPCA main board 100 and NTC sub-board 200 by the piercing device 400, so that the connecting spikes 320 pass through the main connecting pads 130 of the FPCA main board 100 and the secondary connecting pads 240 of the NTC sub-board 200, so that the two main connecting pads 130 of the FPCA main board 100 and the two secondary connecting pads 240 of the NTC sub-board 200 abut one-to-one, thereby realizing the electrical connection between the FPCA main board 100 and the NTC sub-board 200. Furthermore, after the connecting spikes 320 of the metal connecting plate 300 pierce and connect the FPCA mainboard 100 and the NTC sub-board 200, the connecting spikes 320 can be further bent by the crimping device 500, so that the bent connecting spikes 320 press against the FPCA mainboard 100 and the NTC sub-board 200 from one side, and the connecting mainboard 310 of the metal connecting plate 300 clamps the FPCA mainboard 100 and the NTC sub-board 200 from the other side, thereby tightly connecting the FPCA mainboard 100 and the NTC sub-board 200 together (e.g., Figure 6 and Figure 7 As shown in the figure. In this way, compared with the traditional method of using hot melt solder to connect the FPCA main board 100 and the NTC sub-board 200, SMT can be further eliminated, thereby further reducing costs.

[0036] Further, in step S100, preparing the FPCA main board 100, the NTC sub-board 200, and the metal connection board 300 may include:

[0037] S110. Fabricate FPCA main board 100 and NTC sub-board 200 respectively according to conventional circuit board processing methods for later use;

[0038] S120, A metal connecting plate 300 with connecting protrusions 320 is prepared by punching.

[0039] Furthermore, such as Figure 2As shown, the FPCA mainboard 100 may include a main circuit disposed on the mainboard body 110, two main connection circuits 120 respectively connected to both ends of the main circuit, and two main connection pads 130 respectively disposed at the ends of the two main connection circuits 120. Each main connection pad 130 may have at least one main positioning hole 140 on its side. Furthermore, the two main connection circuits 120 may be arranged in parallel, and correspondingly, the two main connection pads 130 may also be arranged in parallel. Moreover, the distance between the two main connection circuits 120 is greater than or equal to twice the width of the mainboard 310 of the metal connection plate 300 to avoid interference and circuit damage during the crimping process. In addition, the two main connection circuits 120 may maintain a preset distance that can be arbitrarily set; the two main connection pads 130 may also be disposed in the middle of the two main connection circuits 120.

[0040] Moreover, such as Figure 3 As shown, the NTC sub-board 200 may include an NTC element 220 disposed on the sub-board body 210, and the NTC element 220 is electrically connected to two sub-connection circuits 230. The NTC element 220 is used for temperature detection, and the NTC element 220 may be disposed in the middle or on one side of the sub-board body 210. The two sub-connection circuits 230 may extend from the NTC element 220 to the other side of the sub-board body 210; and two sub-connection pads 240 may be disposed at the ends of the two sub-connection circuits 230 respectively. Furthermore, the two sub-connection circuits 230 may be arranged in parallel, and correspondingly, the two sub-connection pads 240 may also be arranged in parallel. Moreover, the spacing between the two sub-connection circuits 230 may be greater than or equal to twice the width of the connecting main board 310 of the metal connecting board 300. In addition, the two main connection circuits 120 may be arbitrarily set with a preset spacing; and the two main connection pads 130 may be disposed in the middle of the two main connection circuits 120 respectively.

[0041] like Figure 6 and Figure 7 As shown, when the NTC sub-board 200 and the FPCA mainboard 100 are connected via the metal connection board 300, the secondary connection circuit 230 of the NTC sub-board 200 can correspond to the main connection circuit 120 of the FPCA mainboard 100, and the secondary connection pad 240 of the NTC sub-board 200 can also correspond to the main connection pad 130 of the FPCA mainboard 100, making it easier to electrically connect the NTC sub-board 200 and the FPCA mainboard 100. Furthermore, the width of the secondary connection circuit 230 can be the same as the width of the main connection circuit 120, allowing for better correspondence.

[0042] Furthermore, the size and shape of the secondary connection pad 240 correspond one-to-one with the size and shape of the primary connection pad 130. That is, both the secondary connection pad 240 and the primary connection pad 130 can be rectangular pads, and the width of the secondary connection pad 240 can be the same as the width of the primary connection pad 130, and their lengths can also be the same, facilitating their corresponding connection. Moreover, the shape of the main board 310 of the metal connection plate 300 can correspond to the shapes of the primary connection pad 130 and the secondary connection pad 240, facilitating better cooperation between the main board 310 and both.

[0043] In this embodiment, the width of the main board 310 of the metal connection plate 300 can be greater than or equal to the width of the secondary connection pad 240 and the width of the main connection pad 130. That is, the width of the main board 310 is greater than or equal to the width of either the secondary connection pad 240 or the main connection pad 130, so that when the NTC sub-board 200 and the FPCA main board 100 are crimped by the metal connection plate 300, the connection pads of the two can be more completely covered and pressed.

[0044] In this embodiment, as Figure 6 and Figure 7 As shown, when the NTC sub-board 200 and the FPCA main board 100 are connected, the NTC component 220 is located on the outside of the FPCA main board 100. By placing the NTC component 220 on the NTC sub-board 200 on the outside of the FPCA main board 100, the space occupied by the NTC component 220 on the FPCA main board 100 can be reduced. Furthermore, the two main connection pads 130 can be offset at the end of the main board body 110, and the two main positioning holes 140 can be offset outside the two main connection pads 130; the two secondary connection pads 240 can be correspondingly offset at the end of the sub-board body 210, and the two secondary positioning holes 250 can correspondingly offset outside the two secondary connection pads 240. This allows for simple and convenient positioning of the NTC sub-board 200 and the FPCA main board 100 using two main positioning holes 140 and two secondary positioning holes 250. Furthermore, by staggering the two main connection pads 130 (and the two secondary connection pads 240) (which can be completely or partially staggered), it is not only easier to distinguish and crimp them, but also to avoid impacting the circuit board during the crimping process. Moreover, by placing the two main connection pads 130 (and the two secondary connection pads 240) at the ends of the circuit board, it is easier for the connected NTC secondary board 200 and its NTC components 220 to protrude beyond the outer side of the FPCA main board 100.

[0045] In addition, such as Figure 8As shown, the piercing device 400 may include a first carrier platform 420 having at least two first positioning protrusions 426, and a plate-retrieving and piercing carrier 410 that is raised and lowered above the first carrier platform 420. The first carrier platform 420 can be used to carry the FPCA main board 100 and the NTC sub-board 200, and the plate-retrieving and piercing carrier 410 is used to grab the metal connecting plate 300 and pierce the FPCA main board 100 and the NTC sub-board 200.

[0046] Therefore, as Figure 9 and Figure 10 As shown, in step S200, the piercing device 400 positions the FPCA main board 100 and the NTC sub-board 200 through the main positioning hole 140 and the secondary positioning hole 250, which may further include the following steps:

[0047] S210. In the initial state, the first plate platform 420 of the puncture device 400 is separated from the plate-removing and puncturing carrier 410.

[0048] Before piercing the FPCA main board 100 and NTC sub-board 200 through the metal connecting plate 300, the FPCA main board 100 and NTC sub-board 200 need to be positioned first. Before positioning them, the board removal and pressing carrier 410 is moved to separate it from the first board carrier 420, so that the FPCA main board 100 and NTC sub-board 200 can be placed on the first board carrier 420.

[0049] S220. Place the FPCA motherboard 100 on the first carrier platform 420 of the piercing device 400, and make the first positioning protrusion 426 pass through the main positioning hole 140, so that the surface of the main connection pad 130 of the FPCA motherboard 100 faces upward.

[0050] Generally, since the FPCA motherboard 100 is relatively large, when positioning the FPCA motherboard 100 and the NTC sub-board 200, the FPCA motherboard 100 can be placed and positioned first, so that the FPCA motherboard 100 is below the NTC sub-board 200, making the positioning of both more stable and facilitating subsequent piercing. Moreover, in order to facilitate the contact between the main connection pad 130 of the FPCA motherboard 100 and the secondary connection pad 240 of the NTC sub-board 200 to achieve electrical connection between the two, the main connection pad 130 and the main connection circuit 120 of the FPCA motherboard 100 can both face upwards (i.e., towards the bottom surface of the board removal and piercing carrier 410).

[0051] Moreover, such as Figure 8As shown, the first carrier stage 420 may include a first main stage body 422. The first main stage body 422 may be provided with a first positioning groove 424 corresponding to the FPCA motherboard 100, and a first positioning protrusion 426 may protrude from the bottom of the first positioning groove 424. Moreover, when there are two main positioning holes 140 on the FPCA motherboard 100, there may also be two corresponding first positioning protrusions 426, so that the two first positioning protrusions 426 pass through the two main positioning holes 140 respectively, and stably position the FPCA motherboard 100 on the first carrier stage 420. In addition, there may also be three or more main positioning holes 140 and first positioning protrusions 426.

[0052] S230. The NTC sub-board 200 is stacked on the FPCA main board 100, and the first positioning protrusion 426 passes through the sub-positioning hole 250. The sub-connection pad 240 of the NTC sub-board 200 is facing down so that the sub-connection pad 240 contacts the main connection pad 130.

[0053] After the FPCA mainboard 100 is placed and positioned, the NTC sub-board 200 can be moved onto the first carrier stage 420 and stacked on top of the FPCA mainboard 100. The NTC sub-board 200 is positioned using the first positioning protrusion 426 and the sub-positioning hole 250, thus stably stacking the FPCA mainboard 100 and the NTC sub-board 200 together. Furthermore, to ensure that the sub-connection pad 240 contacts the main connection pad 130, the two can be positioned correspondingly. During positioning, the sub-connection pad 240 is positioned downwards (i.e., towards the top surface of the first carrier stage 420), corresponding vertically to the upward-facing main connection pad 130.

[0054] Moreover, such as Figure 11 and Figure 12 As shown, in step S300, the metal connection plate 300 is pressed onto the main connection pad 130 of the FPCA main board 100 and the secondary connection pad 240 of the NTC sub-board 200 using the piercing device 400, so that the connection protrusions 320 of the metal connection plate 300 pass through the main connection pad 130 and the secondary connection pad 240. This may further include the following steps:

[0055] S310, the plate-removing and piercing carrier 410 using the piercing device 400 grabs the metal connecting plate 300 and makes the connecting spikes 320 of the metal connecting plate 300 face downward.

[0056] The plate-grabbing and piercing carrier 410 grabs the pre-prepared metal connecting plate 300, so that the ends of the connecting protrusions 320 of the metal connecting plate 300 face the FPCA main board 100 and NTC sub-board 200 positioned on the top surface of the first plate carrier 420, so that the FPCA main board 100 and NTC sub-board 200 can be pierced by the connecting protrusions 320.

[0057] S320, The metal connecting plate 300 is moved above the stacked FPCA main board 100 and NTC sub-board 200 by the plate-removing and pressing carrier 410, so that the connecting spikes 320 correspond vertically to the main connecting pads 130 of the FPCA main board 100 and the secondary connecting pads 240 of the NTC sub-board 200.

[0058] After the metal connecting plate 300 is picked up by the plate-removing and piercing carrier 410, it can be moved above the FPCA main board 100 and the NTC sub-board 200, so that the position of the metal connecting plate 300 corresponds to the position of the main connecting pad 130 of the FPCA main board 100 and the position of the secondary connecting pad 240 of the NTC sub-board 200, so that the connecting protrusions 320 of the metal connecting plate 300 can pierce the main connecting pad 130 and the secondary connecting pad 240.

[0059] S330, the metal connecting plate 300 is pressed down by the plate-removing and pressing carrier 410, so that the connecting spikes 320 pierce the FPCA main board 100 and NTC sub-board 200 and protrude outside the two, so that the connecting spikes 320 of the metal connecting plate 300 pass through the main connecting pad 130 and the sub-connecting pad 240.

[0060] After aligning the metal connection plate 300 with the main connection pad 130 and the secondary connection pad 240 vertically, the connecting spikes 320 of the metal connection plate 300 can be used by the board removal and pressing carrier 410 to press the FPCA main board 100 and NTC secondary board 200, so that the connecting spikes 320 pierce the main connection pad 130 and the secondary connection pad 240, thus achieving the initial connection between the FPCA main board 100 and the NTC secondary board 200.

[0061] Furthermore, the secondary connection pads 240 of the NTC sub-board 200 and the primary connection pads 130 of the FPCA mainboard 100 can be placed and positioned face-to-face (allowing the secondary connection pads 240 and primary connection pads 130 to directly contact each other for electrical connection), and the FPCA mainboard 100 and NTC sub-board 200 can be pierced and connected from the primary connection pads 130 and 240 via the metal connection plate 300. Alternatively, the FPCA mainboard 100 and NTC sub-board 200 can be pierced and connected from other locations. Furthermore, the secondary connection pads 240 of the NTC sub-board 200 and the primary connection pads 130 of the FPCA mainboard 100 can be placed and positioned back-to-back, and the FPCA mainboard 100 and NTC sub-board 200 can be pierced and connected from the primary connection pads 130 and 240 via the metal connection plate 300, thus achieving electrical connection between the primary connection pads 130 and 240.

[0062] Furthermore, the plate-removing and piercing carrier 410 may include a first carrier drive component, a first carrier main board 412 disposed on the first carrier drive component with a connecting plate positioning groove 416 on its bottom surface, and a magnetic adsorption component 414 disposed on the first carrier main board 412, the magnetic adsorption component 414 being correspondingly disposed with the connecting plate positioning groove 416. Therefore, in step S310, the plate-removing and piercing carrier 410 using the piercing device 400 to grasp the metal connecting plate 300 may further include the following steps:

[0063] S312. Place the metal connecting plate 300 in the connecting plate storage station in advance, and make the connecting protrusions 320 of the metal connecting plate 300 face downward.

[0064] The metal connecting plate 300 can be pre-positioned with the connecting spikes 320 facing downwards, so that the connecting spikes 320 can be kept facing downwards when gripping it later.

[0065] S314. The first carrier drive unit of the plate-picking and piercing carrier 410 drives the first carrier main board 412 to move to the plate-receiving storage station, and the magnetic adsorption unit 414 picks up and positions the metal connecting plate 300 from the plate-receiving storage station into the connecting plate positioning groove 416, thereby realizing the gripping of the metal connecting plate 300.

[0066] The first vehicle driving component may include a first translation driving mechanism and a first lifting driving mechanism, which can drive the first vehicle main board 412 to translate and lift, so that the first vehicle driving component can drive the first vehicle main board 412 to the connection plate storage position of the metal connection plate 300, so that the magnetic adsorption component 414 on the first vehicle main board 412 adsorbs the metal connection plate 300, and picks up and positions the metal connection plate 300 in the connection plate positioning groove 416.

[0067] Furthermore, the magnetic adsorption component 414 may include a permanent magnet embedded in the top of the first carrier main board 412. This permanent magnet is vertically aligned with the connecting plate positioning groove 416, facilitating the adsorption and positioning of the metal connecting plate 300 within the connecting plate positioning groove 416. Alternatively, the magnetic adsorption component 414 may be incorporated into an electromagnetic adsorption structure, where an electric field is generated to adsorb the metal connecting plate 300.

[0068] In addition, the metal connecting plate 300 can also be gripped by the gripper structure, or by the vacuum nozzle, or by both the gripper structure and the vacuum nozzle.

[0069] Furthermore, the first carrier plate 420 may be provided with a first positioning groove 424 and a spike avoidance groove 428 provided on the bottom surface of the first positioning groove 424, and the first positioning protrusion 426 may protrude from the bottom surface of the first positioning groove 424. Therefore, in step S330, the pressing of the metal connecting plate 300 by the plate-removing and piercing carrier 410, causing the connecting spike 320 to pierce the FPCA main board 100 and the NTC sub-board 200 and protrude beyond them, may further include the following steps:

[0070] S332, The first carrier drive unit of the plate-removing and pressing carrier 410 drives the first carrier main board 412 and the metal connecting plate 300 it grabs to press down on the FPCA main board 100 and NTC sub-board 200 stacked together; wherein, the FPCA main board 100 and NTC sub-board 200 are positioned in the first positioning groove 424.

[0071] By using the first positioning groove 424 provided on the first carrier stage 420, combined with the first positioning protrusion 426, the FPCA main board 100 and the NTC sub-board 200 can be stably positioned, preventing displacement during piercing by the metal connecting plate 300 and thus avoiding affecting the piercing effect. Moreover, in this embodiment, the shape and size of the first positioning groove 424 correspond to the shape and size of the FPCA main board 100. That is, the FPCA main board 100 is mainly positioned and positioned by the first positioning groove 424 (since the size of the FPCA main board 100 is usually much larger than that of the NTC sub-board 200, and the FPCA main board 100 is located below during positioning, positioning and positioning of the FPCA main board 100 can simultaneously achieve positioning and positioning of the NTC sub-board 200), thereby preventing displacement of the FPCA main board 100 and the NTC sub-board 200.

[0072] After the FPCA main board 100 and NTC sub-board 200 are positioned, the first carrier main board 412 can be driven by the first carrier drive unit to move the metal connecting plate 300 it has grabbed closer to the positioned FPCA main board 100 and NTC sub-board 200, so that the connecting protrusions 320 of the metal connecting plate 300 approach and press down on the main connecting pad 130 of the FPCA main board 100 and the secondary connecting pad 240 of the NTC sub-board 200.

[0073] S334. The connecting spikes 320 of the metal connecting plate 300 are pierced through the FPCA main board 100 and the NTC sub-board 200 by the first carrier main board 412, and the connecting spikes 320 are protruded into the spike relief groove 428.

[0074] The first carrier drive continuously applies pressure to the first carrier motherboard 412 and its metal connecting plate 300, causing the metal connecting plate 300 to pierce the secondary connecting pad 240 of the NTC sub-board 200 and the main connecting pad 130 of the FPCA motherboard 100 from top to bottom under pressure. The end of the connecting spike 320 protrudes beyond the bottom surface of the FPCA motherboard 100 and extends into the spike relief groove 428. At the same time, the connecting motherboard 310 of the metal connecting plate 300 is pressed against the surface of the NTC sub-board 200 (the side facing away from the secondary connecting pad 240), thereby achieving the initial piercing connection between the NTC sub-board 200 and the FPCA motherboard 100.

[0075] Moreover, such as Figure 5 As shown, in this embodiment, multiple connecting spikes 320 protrude from both sides of the connecting motherboard 310, and the multiple connecting spikes 320 on both sides are staggered. Specifically, the connecting spikes 320 can be bent and extended along the edges of both sides of the connecting motherboard 310 in a direction perpendicular to the surface of the connecting motherboard 310, so that the connecting spikes 320 are perpendicular to the surface of the connecting motherboard 310, making it more stable and reliable when piercing the NTC sub-board 200 and the FPCA motherboard 100. Moreover, by setting multiple connecting spikes 320 on both sides of the connecting motherboard 310, two rows of connecting spikes 320 can be formed to pierce the NTC sub-board 200 and the FPCA motherboard 100 from both sides, resulting in more balanced and stable force, and better coverage of the secondary connection pads 240 of the NTC sub-board 200 and the main connection pads 130 of the FPCA motherboard 100 (the two rows of connecting spikes 320 pierce the two sides of the secondary connection pads 240 and also pierce the two sides of the main connection pads 130 respectively). Furthermore, the connecting spikes 320 on both sides can be set in a relatively staggered manner (completely staggered), so that they are less likely to be interfered with when piercing the NTC sub-board 200 and the FPCA main board 100, and can also play a complementary role.

[0076] Furthermore, each connecting spike 320 can be designed as a triangular structure, with a chamfered structure on the outer surface of the apex of the triangular structure. This design, with the connecting spike 320 forming a triangular point at its end, makes it easier to pierce the NTC sub-board 200 and the FPCA main board 100. Moreover, a chamfered structure can be provided on the outer side of the end of the triangular connecting spike 320, resulting in a sharper spike. Furthermore, the outer side of the end of the connecting spike 320 refers to the side that will be subjected to pressure during subsequent crimping; by providing a chamfered structure on the outer side of its end, it is also easier to bend it from the chamfered area.

[0077] In addition, such as Figure 12As shown, the crimping device 500 may include a second carrier platform 520 having at least two second positioning protrusions 524, and a crimping carrier 510 raised and lowered above the second carrier platform 520. The second carrier platform 520 can support and position the pierced-connected NTC sub-board 200 and FPCA main board 100, while the crimping carrier 510 can bend the ends of the connecting protrusions 320 of the metal connectors on the second carrier platform 520, which protrude from the NTC sub-board 200 and FPCA main board 100. Therefore, as... Figure 13 and Figure 14 As shown, in step S400, the connecting protrusions 320 of the metal connecting plate 300 protruding from the FPCA main board 100 or NTC sub-board 200 are bent using the crimping device 500, which may further include the following steps:

[0078] S410. In the initial state, the second carrier plate 520 of the crimping device 500 is separated from the crimping carrier 510.

[0079] Similarly, before bending the connecting spikes 320 of the metal connecting plate 300, the FPCA main board 100 and NTC sub-board 200 that are pierced need to be positioned first. Before positioning them, the crimping carrier 510 is moved to separate it from the second carrier platform 520, so that the FPCA main board 100 and NTC sub-board 200 that are pierced can be placed on the second carrier platform 520.

[0080] S420: Place the FPCA main board 100 and NTC sub-board 200, which are pierced and connected by the metal connecting plate 300, on the second carrier stage 520, and make the second positioning protrusion 524 pass through the main positioning hole 140 and the sub-positioning hole 250 respectively, so that the end of the connecting protrusion 320 of the metal connecting plate 300 that pierces the FPCA main board 100 and NTC sub-board 200 faces upward.

[0081] At least two second positioning protrusions 524 on the second carrier platform 520 pass through at least two main positioning holes 140 and at least two secondary positioning holes 250 of the FPCA main board 100 and NTC sub-board 200, respectively, to position the FPCA main board 100 and NTC sub-board 200 on the second carrier platform 520. Furthermore, since the ends of the connecting protrusions 320 of the metal connecting plate 300 protrude beyond the FPCA main board 100, the NTC sub-board 200 needs to be positioned below the FPCA main board 100 so that the ends of the connecting protrusions 320 of the metal connecting plate 300 face the upward-facing crimping carrier 510, facilitating bending of the ends of the connecting protrusions 320 by the crimping carrier 510.

[0082] Furthermore, the second carrier stage 520 may include a second main stage 522, on which a second positioning groove 526 corresponding to the NTC sub-board 200 may be provided, and a second positioning protrusion 524 may also protrude from the bottom of the second positioning groove 526. In this way, by placing the NTC sub-board 200 in the second positioning groove 526, the NTC sub-board 200 and the FPCA main board 100 connected to it can be positioned. In addition, the second positioning groove 526 can also be used to position the connecting main board 310 of the metal connecting plate 300, preventing damage to the NTC sub-board 200 caused by the connecting main board 310 during bending. In this case, the second positioning protrusion 524 may be located on the outside of the second positioning groove 526.

[0083] S430, the crimping carrier 510 is moved downward toward the second carrier platform 520, and the crimping carrier 510 is used to bend the connecting spikes 320 protruding from the FPCA main board 100 and the NTC sub-board 200.

[0084] After the FPCA main board 100 and NTC sub-board 200 are placed and positioned, the lifting and pressing carrier 510 can be used to press down the connecting spikes 320 protruding from the FPCA main board 100, so that the protruding connecting spikes 320 bend onto the surface of the FPCA main board 100. This keeps the surface of the FPCA main board 100 flat and allows the bent connecting spikes 320 to be fastened to the FPCA main board 100, thereby making the FPCA main board 100 and NTC sub-board 200 tightly connected.

[0085] Furthermore, in this embodiment, multiple connecting spikes 320 can be provided on both sides of the connecting motherboard 310 to form two rows of connecting spikes 320. These two rows of connecting spikes 320 can bend and tighten the secondary connecting pads 240 of the NTC sub-board 200 and the main connecting pads 130 of the FPCA motherboard 100 from both sides. Moreover, the two rows of connecting spikes 320 can be bent relative to each other, thereby securing the secondary connecting pads 240 and the main connecting pads 130 from opposite sides.

[0086] Furthermore, the crimping carrier 510 may include a second carrier drive member and a second carrier main board 512 disposed on the second carrier drive member, the bottom surface of the second carrier main board 512 being provided with a concave arc-shaped crimping groove 514. Therefore, in step S430, moving the crimping carrier 510 downward toward the second carrier platform 520, and bending the connecting protrusions 320 protruding from the FPCA main board 100 and the NTC sub-board 200 by the crimping carrier 510, may further include the following steps:

[0087] S432, the second carrier main board 512 is driven downward toward the second carrier platform 520 by the second carrier drive component of the pressing carrier 510, so that the concave arc-shaped pressing groove 514 on the bottom surface of the second carrier main board 512 covers the FPCA main board 100 and NTC sub-board 200.

[0088] Similarly, the second carrier drive unit may include a second translation drive mechanism and a second lifting drive mechanism, which can drive the second carrier main board 512 to perform translation and lifting movements, facilitating the removal of the second carrier main board 512 to place and position the FPCA main board 100 and NTC sub-board 200 on the second carrier platform 520, and also facilitating the bending of the connecting spikes 320 protruding from the FPCA main board 100 and NTC sub-board 200. Moreover, by having the concave arc-shaped pressure groove 514 on the bottom surface of the second carrier main board 512 cover the top surface of the NTC sub-board 200, the concave arc-shaped pressure groove 514 can cover the connecting spikes 320 protruding from the NTC sub-board 200, facilitating the subsequent bending of the protruding ends of the connecting spikes 320 through the concave arc-shaped pressure groove 514.

[0089] S434. The second carrier main board 512 is driven by the second carrier drive unit to apply pressure to the end of the connecting spike 320 of the metal connecting plate 300 that protrudes from the FPCA main board 100 and the NTC sub-board 200, so that the concave arc-shaped wall of the concave arc-shaped pressure groove 514 on the bottom surface of the second carrier main board 512 applies pressure to the end of the connecting spike 320, and bends the end of the connecting spike 320 toward the length centerline of the main connecting pad 130.

[0090] After the concave arc-shaped pressure groove 514 on the second carrier main board 512 is driven by the second carrier drive component to align with the connecting spike 320 of the metal connecting plate 300 protruding from the NTC sub-board 200, the second carrier main board 512 can be driven by the second carrier drive component to apply pressure to the end of the connecting spike 320, so that the concave arc-shaped wall of the concave arc-shaped pressure groove 514 applies pressure to the end of the connecting spike 320. When the concave arc-shaped wall of the concave arc-shaped pressure groove 514 applies pressure to the end of the connecting spike 320, the end of the connecting spike 320 can be naturally bent towards the center line of the concave arc-shaped wall. The center line of the concave arc-shaped wall corresponds to the length center line of the main connecting pad 130 of the FPCA main board 100 (or the length center line of the secondary connecting pad 240 of the NTC sub-board 200), so that the end of the connecting spike 320 bends towards the length center line of the main connecting pad 130.

[0091] Furthermore, when a row of connecting spikes 320 is provided on each side of the metal connecting plate 300, the concave arc-shaped walls on both sides of the concave arc-shaped pressure groove 514 can be used to apply pressure to the ends of the two rows of connecting spikes 320, causing the two rows of connecting spikes 320 to bend relative to each other and fasten to the surface of the NTC sub-plate 200. Moreover, a pressure groove protrusion 5144 can be provided at the center of the concave arc-shaped pressure groove 514 to separate the two sides of the concave arc-shaped wall, thus limiting the connecting spikes 320 on both sides of the metal connecting plate 300 and preventing slippage when bending the connecting spikes 320 on both sides using the concave arc-shaped wall, which would affect the bending effect of the connecting spikes 320. Furthermore, when a chamfer structure is provided on the outer surface of the end of the connecting spike 320, a chamfer surface can be formed at the end of the connecting spike 320, which can better adapt to the concave arc-shaped wall of the concave arc-shaped pressure groove 514, making it more conducive to bending the connecting spikes 320.

[0092] Furthermore, in step S400, after bending the end of the connecting protrusion 320 of the metal connecting plate 300 and bringing it close to or abutting against the surface of the FPCA main board 100 or the NTC sub-board 200, the following steps may also be included:

[0093] S500 uses connecting rivets to rivet the FPCA main board 100, NTC sub-board 200, and metal connecting board 300 to connect the main board 310.

[0094] After the FPCA main board 100 and NTC secondary board 200 are pierced and connected via the metal connecting plate 300, they can be further reinforced with connecting rivets to make the connection more secure. Furthermore, multiple connecting rivets can be riveted to the center line of the main connecting pad 130 of the FPCA main board 100 (and the center line of the secondary connecting pad 240 of the NTC secondary board 200) to firmly connect them from the center. Moreover, the connecting rivets can be metal rivets, which not only makes the connection more secure but also strengthens the electrical connection between the main connecting pad 130 and the secondary connecting pad 240.

[0095] In addition, the present invention also proposes an FPCA product, which is manufactured using the NTC and FPCA crimping connection method described above.

[0096] This invention provides a solution for connecting an NTC sub-board 200 and an FPC mainboard 100 via a piercing and crimping process. This method effectively reduces equipment requirements; the original production line required more than 6 units, while the new line only requires 3. It also effectively reduces space requirements; the original production line length was over 30m, while the new line length is approximately 6m. Furthermore, it effectively reduces power consumption; the original production line power consumption was over 100KW, while the new line power consumption is only around 15KW.

[0097] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0098] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0099] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the invention herein.

Claims

1. A method of crimping coupling of NTC and FPCA, characterized in that, The method comprises: Preparation of FPCA main plate, NTC auxiliary plate and metal connecting plate; wherein the FPCA main plate comprises a main plate body, two main connecting circuits and at least two main positioning holes provided on the surface of the main plate body, and main connecting pads provided on each of the main connecting circuits; the NTC auxiliary plate comprises an auxiliary plate body, two auxiliary connecting circuits and at least two auxiliary positioning holes provided on the surface of the auxiliary plate body, and auxiliary connecting pads provided on each of the auxiliary connecting circuits; the metal connecting plate comprises a connecting main plate and a connecting protrusion provided on the connecting main plate; Positioning the FPCA main plate and the NTC auxiliary plate through the main positioning holes and the auxiliary positioning holes by using a piercing device, so that the two main connecting pads of the FPCA main plate and the two auxiliary connecting pads of the NTC auxiliary plate are in opposite abutment; Pressing the metal connecting plate on the main connecting pads of the FPCA main plate and the auxiliary connecting pads of the NTC auxiliary plate by using the piercing device, so that the connecting protrusion of the metal connecting plate penetrates through the main connecting pads and the auxiliary connecting pads, and the preliminary connection of the FPCA main plate and the NTC auxiliary plate is realized; Bending the connecting protrusion of the metal connecting plate protruding outside the FPCA main plate or the NTC auxiliary plate by using a pressing device, so that the end of the connecting protrusion of the metal connecting plate is bent and close to or abuts against the surface of the FPCA main plate or the surface of the NTC auxiliary plate.

2. The method of claim 1, wherein, The piercing device comprises a first carrier board with at least two first positioning protrusions, and a plate taking and pressing device arranged above the first carrier board; The positioning of the FPCA main plate and the NTC auxiliary plate through the main positioning holes and the auxiliary positioning holes by using the piercing device comprises: In the initial state, the first carrier board of the piercing device and the plate taking and pressing device are in a separated state; Placing the FPCA main plate on the first carrier board of the piercing device, and making the first positioning protrusions correspondingly penetrate through the main positioning holes, so that the surface where the main connecting pads of the FPCA main plate are located faces upward; Stacking the NTC auxiliary plate on the FPCA main plate, and making the first positioning protrusions correspondingly penetrate through the auxiliary positioning holes, and making the surface where the auxiliary connecting pads of the NTC auxiliary plate are located face downward, so that the auxiliary connecting pads contact the main connecting pads.

3. The method of claim 2, wherein, The pressing of the metal connecting plate on the main connecting pads of the FPCA main plate and the auxiliary connecting pads of the NTC auxiliary plate by using the piercing device, so that the connecting protrusion of the metal connecting plate penetrates through the main connecting pads and the auxiliary connecting pads, comprises: Grabbing the metal connecting plate by using the plate taking and pressing device of the piercing device, and making the connecting protrusion of the metal connecting plate face downward; Moving the metal connecting plate to above the FPCA main plate and the NTC auxiliary plate stacked together by using the plate taking and pressing device, so that the connecting protrusion corresponds to the main connecting pads of the FPCA main plate and the auxiliary connecting pads of the NTC auxiliary plate in an up-down manner. The metal connecting plate is pressed down by the plate taking and pressing device, so that the connecting protrusions of the metal connecting plate pierce the FPCA main plate and the NTC auxiliary plate and protrude out of the two plates, and the connecting protrusions of the metal connecting plate pass through the main connecting pads and the auxiliary connecting pads.

4. The method of claim 3, wherein, The plate taking and pressing device comprises a first carrier driving element, a first carrier main plate provided on the first carrier driving element and having a connecting plate positioning groove on the bottom surface, and a magnetic attraction element provided on the first carrier main plate and corresponding to the connecting plate positioning groove; The plate taking and pressing device using the piercing device to grab the metal connecting plate comprises: The metal connecting plate is placed at a connecting plate storage station in advance, and the connecting protrusions of the metal connecting plate are in a downward state; The first carrier main plate is moved to the connecting plate storage station by the first carrier driving element of the plate taking and pressing device, and the metal connecting plate is attracted and positioned in the connecting plate positioning groove by the magnetic attraction element, so that the metal connecting plate is grabbed.

5. The method of claim 4, wherein, The first positioning groove is provided on the first carrier platform, and the protrusion avoiding groove is provided on the groove bottom surface of the first positioning groove, and the first positioning protrusions protrude from the groove bottom surface of the first positioning groove; The metal connecting plate is pressed down by the plate taking and pressing device, so that the connecting protrusions of the metal connecting plate pierce the FPCA main plate and the NTC auxiliary plate and protrude out of the two plates, and the connecting protrusions of the metal connecting plate pass through the main connecting pads and the auxiliary connecting pads. The first carrier main plate and the metal connecting plate grabbed thereby are pressed down to the FPCA main plate and the NTC auxiliary plate stacked together by the first carrier driving element of the plate taking and pressing device, and the FPCA main plate and the NTC auxiliary plate are positioned in the first positioning groove; The connecting protrusions of the metal connecting plate pierce the FPCA main plate and the NTC auxiliary plate by the first carrier main plate, and the connecting protrusions protrude into the protrusion avoiding groove.

6. The method of crimping a NTC and FPCA of claim 1, wherein, The pressing device comprises a second carrier platform having at least two second positioning protrusions, and a pressing carrier which is lifted above the second carrier platform; The protruding connecting protrusions of the metal connecting plate out of the FPCA main plate or the NTC auxiliary plate are pressed and bent by the pressing device, which comprises: In the initial state, the second carrier platform of the pressing device and the pressing carrier are in a separated state; The FPCA main plate and the NTC auxiliary plate pierced by the metal connecting plate are placed on the second carrier platform, and the second positioning protrusions correspondingly pass through the main positioning hole and the auxiliary positioning hole, so that the end of the connecting protrusions of the metal connecting plate piercing the FPCA main plate and the NTC auxiliary plate faces upward; The pressing carrier is lowered in the direction of the second carrier platform, so that the pressing carrier presses and bends the connecting protrusions protruding out of the FPCA main plate and the NTC auxiliary plate.

7. The method of claim 6, wherein, The crimping carrier comprises a second carrier driving element and a second carrier main plate arranged on the second carrier driving element, and the bottom surface of the second carrier main plate is provided with a concave arc-shaped crimping groove; The downward movement of the crimping carrier towards the second carrier board table, the bending of the connection protrusions protruding from the FPCA main plate and the NTC auxiliary plate, and the bending of the end of the connection protrusion of the metal connecting plate towards the length center line of the main connecting pad, comprise: The second carrier driving element of the crimping carrier drives the second carrier main plate to move downward towards the second carrier board table, so that the concave arc-shaped crimping groove on the bottom surface of the second carrier main plate covers the FPCA main plate and the NTC auxiliary plate. The second carrier driving element drives the second carrier main plate to press the end of the connection protrusion of the metal connecting plate protruding from the FPCA main plate and the NTC auxiliary plate, so that the concave arc-shaped wall surface of the concave arc-shaped crimping groove on the bottom surface of the second carrier main plate presses the end of the connection protrusion, and the end of the connection protrusion is bent towards the length center line of the main connecting pad.

8. The method of claim 1, wherein, The shape of the connection main plate corresponds to the shape of the main connecting pad and the auxiliary connecting pad; The two sides of the connection main plate are respectively provided with a plurality of connection protrusions, and the plurality of connection protrusions on the two sides are oppositely arranged.

9. The method of claim 8, wherein, The connection protrusion is in a triangular structure, and the outer side of the top end of the triangular structure is provided with a chamfer structure.

10. The method of crimping a NTC and FPCA of claim 1, wherein, Two main connecting pads are oppositely arranged on the end side of the main plate body, and two main positioning holes are oppositely arranged on the outer side of the two main connecting pads. Two auxiliary connecting pads are oppositely arranged on the end side of the auxiliary plate body, and two auxiliary positioning holes are oppositely arranged on the outer side of the two auxiliary connecting pads. The NTC auxiliary plate comprises an NTC element arranged on the auxiliary plate body, and the NTC element is electrically connected with two auxiliary connecting circuits; when the NTC auxiliary plate is connected with the FPCA main plate, the NTC element is located on the outer side of the FPCA main plate.

11. The method of crimping a NTC and FPCA of claim 1, wherein, The size and shape of the auxiliary connecting pad correspond to the size and shape of the main connecting pad one by one, and the width value of the connection main plate is greater than or equal to the width value of the auxiliary connecting pad and the width value of the main connecting pad.

12. The method of crimping a NTC and FPCA of claim 1, wherein, After the end of the connection protrusion of the metal connecting plate is bent and close to or tightly abuts against the surface of the FPCA main plate or the surface of the NTC auxiliary plate, the method further comprises: The FPCA main plate, the NTC auxiliary plate, and the connection main plate of the metal connecting plate are riveted by a rivet.

13. An FPCA product, characterized by The FPCA product is made by the NTC and FPCA crimping connection method of any one of claims 1-12.

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