Pressing method and device of printed circuit board and printed circuit board

Abstract

The invention discloses a pressing method and device of a printed circuit board and the printed circuit board. The press fit method of the printed circuit board comprises the steps that a plurality of first pin holes are formed in a first area of a bottom plate, first pins are arranged in the first pin holes, a plurality of second pin hole areas are arranged in a second area of the bottom plate, and a plurality of positioning points are arranged in a third area of the bottom plate; a partition plate covering the second area and part of the first area is placed on the bottom plate through first pins; at least one fusion core plate is placed on the side, away from the bottom plate, of the partition plate according to the positioning points, a plurality of second pin holes penetrating through the fusion core plate, the partition plate and the bottom plate are drilled according to the positioning points, and vertical projections of the second pin holes on the bottom plate are all located in the second pin hole area; and a second pin is inserted into the second pin hole, and pressing operation is carried out. According to the invention, the alignment process automation of the printed circuit board can be realized, the requirement of manual operation is reduced, and the production efficiency and the stability of the product quality are improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of printed circuit board manufacturing, and particularly relate to a pressing method and device for printed circuit board and a printed circuit board. BACKGROUND

[0002] The pressing of a printed circuit board (PCB) refers to the pressing of multiple inner layer core boards together by means of high temperature and high pressure under the premise of accurate alignment with adhesive sheets.

[0003] PinLam plate arrangement is a way of accurate alignment of multiple core boards. The traditional method is to punch holes on each core board with a puncher, place the required adhesive sheets between the core boards, and string the core boards together with pins when arranging the plates. However, in order to achieve high-precision alignment between the core boards, the pin is usually only 0-1 mil smaller than the hole on the core board, which requires accurate alignment when the core board is fitted onto the pin, otherwise the core board is easily damaged or cannot be fitted, and manual operation is required for alignment, which is very difficult to achieve automation. SUMMARY

[0004] The present application provides a pressing method and device for a printed circuit board and a printed circuit board, which can realize the automation of the pinLam plate arrangement and pressing alignment process of the printed circuit board, reduce the requirement and workload of manual operation, and improve the production efficiency and stability of product quality.

[0005] In a first aspect, the embodiments of the present application provide a pressing method for a printed circuit board, which comprises:

[0006] A plurality of first pin holes are arranged in a first area of a bottom plate, and a first pin is arranged in each first pin hole. A plurality of second pin hole regions are arranged in a second area of the bottom plate. A plurality of positioning points are arranged in a third area of the bottom plate. The first area surrounds the second area, and the third area surrounds the first area.

[0007] A partition plate covering the second area and part of the first area is placed on the bottom plate by the first pin.

[0008] At least one fused core board is placed on the side of the partition plate away from the bottom plate according to the positioning points, and the vertical projection of the fused core board on the bottom plate is located in the second area. The fused core board comprises a plurality of unholed core boards.

[0009] A plurality of second pin holes penetrating the fused core board, the partition plate and the bottom plate are drilled according to the positioning points, and the vertical projection of the second pin holes on the bottom plate is located in the second pin hole region.

[0010] inserting a second pin into the second pin hole and performing a press-fit operation.

[0011] Optionally, before the step of arranging a plurality of first pin holes in the first region of the bottom plate, the method further comprises:

[0012] forming a circuit pattern on each of the core plates;

[0013] aligning and fusing each of the core plates to form at least one fused core plate.

[0014] Optionally, according to the positioning points, a plurality of second pin holes are drilled through the fused core plate, the partition plate and the bottom plate, and the vertical projections of the second pin holes on the bottom plate are located within the second pin hole region, and the method comprises:

[0015] placing a first kraft paper and a cover plate on the side of the fused core plate away from the bottom plate in sequence, the vertical projections of the first kraft paper on the bottom plate are located within the second region, and the first pin hole is inserted into the positioning hole of the cover plate; wherein the cover plate is provided with a cover plate hollow region, and the vertical projection of the cover plate hollow region on the bottom plate is located within the second pin hole region;

[0016] According to the positioning points, a plurality of second pin holes are drilled through the cover plate, the fused core plate, the partition plate and the bottom plate, and the vertical projections of the second pin holes on the bottom plate are located within the second pin hole region.

[0017] Optionally, the bottom plate is provided with a bottom plate hollow region, and the vertical projection of the bottom plate hollow region on the bottom plate is located within the second pin hole region; according to the positioning points, a plurality of second pin holes are drilled through the cover plate, the fused core plate, the partition plate and the bottom plate, and the method comprises:

[0018] According to the positioning points, a plurality of second pin holes are drilled through the cover plate, the fused core plate, the partition plate and the bottom plate.

[0019] Optionally, the partition plate comprises a second kraft paper and a steel plate; by means of the first pin, the partition plate covering the second region and part of the first region is placed on the bottom plate, and the method comprises:

[0020] placing the second kraft paper in the second region of the bottom plate;

[0021] placing the steel plate on the side of the second kraft paper away from the bottom plate, the first pin is inserted into the steel plate positioning hole of the steel plate, and the vertical projection of the steel plate on the bottom plate covers the second region and part of the first region.

[0022] Optionally, the fusing core plate is one, and the fusing core plate is placed on the side of the separator plate away from the bottom plate according to the positioning point, and a vertical projection of the fusing core plate on the bottom plate is located in the second area, comprising:

[0023] A copper foil and an adhesive sheet are placed on the side of the adhesive sheet away from the bottom plate according to the positioning point, and a vertical projection of the copper foil and the adhesive sheet on the bottom plate is located in the second area;

[0024] The fusing core plate is placed on the side of the adhesive sheet away from the bottom plate according to the positioning point, and a vertical projection of the fusing core plate on the bottom plate is located in the second area.

[0025] Optionally, the fusing core plate is n, and n>1; the fusing core plate is placed on the side of the separator plate away from the bottom plate according to the positioning point, and a vertical projection of the fusing core plate on the bottom plate is located in the second area, comprising:

[0026] The copper foil and the adhesive sheet are repeatedly placed on the side of the adhesive sheet away from the bottom plate according to the positioning point, and the fusing core plate is placed on the side of the adhesive sheet away from the bottom plate, until the arrangement of n fusing core plates is completed; wherein a vertical projection of each copper foil and adhesive sheet on the bottom plate is located in the second area, and a vertical projection of each fusing core plate on the bottom plate is located in the second area.

[0027] Optionally, a second pin is inserted into the second pin hole, and a pressing operation is performed, comprising:

[0028] A plurality of second pins are inserted into each second pin hole to form a to-be-pressed printed circuit board;

[0029] The to-be-pressed printed circuit board is transferred to a pressing machine for pressing operation to form a printed circuit board.

[0030] In a second aspect, an embodiment of the present application also provides a pressing device for a printed circuit board, which is used to execute the pressing method for a printed circuit board in any embodiment of the present application, and the pressing device for a printed circuit board comprises a control module and an execution module, and the control module and the execution module are connected;

[0031] The control module is used to control the execution module to set a plurality of first pin holes in a first area of a bottom plate, set a first pin in each first pin hole, set a plurality of second pin hole regions in a second area of the bottom plate, and set a plurality of positioning points in a third area of the bottom plate; wherein the first area surrounds the second area, and the third area surrounds the first area.

[0032] The control module is also used to control the execution module to place a partition covering the second area and part of the first area on the base plate via the first pin;

[0033] The control module is further configured to control the execution module to place at least one fusion core plate on the side of the partition away from the base plate according to the positioning point, wherein the vertical projection of the fusion core plate on the base plate is located in the second region; wherein the fusion core plate includes multiple core plates without openings;

[0034] The control module is also used to control the execution module to drill multiple second pin holes through the fusion core plate, the partition plate and the base plate according to the positioning point. The vertical projection of the second pin holes on the base plate is located within the second pin hole area.

[0035] The control module is also used to control the execution module to insert the second pin into the second pin hole for pressing operation.

[0036] Thirdly, embodiments of the present invention also provide a printed circuit board, which is formed by the lamination method of the printed circuit board described in any embodiment of the present invention.

[0037] This invention provides a method, apparatus, and printed circuit board (PCB) lamination method. The PCB lamination method includes: providing multiple first pin holes in a first region of a base plate and placing first pins in each first pin hole to allow for the placement of a partition; providing multiple second pin hole areas in a second region of the base plate to allow for drilling and pin placement after the fusion core board is placed; providing multiple positioning points in a third region of the base plate to allow a robotic arm to accurately place the partition and fusion core board; and placing a partition covering the second region and part of the first region on the base plate using the first pins to allow for precise placement. A partition is placed, and at least one fusion core plate is placed on the side of the partition away from the base plate according to the positioning point. The vertical projection of the fusion core plate on the base plate is located within a second area, preventing large deviations in the position of the fusion core plate and facilitating automatic placement of the fusion core plate by a robotic arm. Multiple second pin holes are drilled through the fusion core plate, partition, and base plate according to the positioning point. The vertical projection of the second pin holes on the base plate is all located within the second pin hole area. The second pins are inserted into the second pin holes for pressing. Thus, after layout, the entire printed circuit board can be drilled and pins set by a robotic arm without manual alignment. This invention helps to automate the pin-based layout and pressing process of printed circuit boards, reducing the requirements and workload of manual operation, eliminating the uncertainty and error of manual operation, and improving production efficiency and product quality stability. Attached Figure Description

[0038] Figure 1A flow chart of a pressing method of a printed circuit board provided by an embodiment of the present application is shown in the figure; Figure 2 A schematic diagram of a bottom plate of a printed circuit board provided by an embodiment of the present application is shown in the figure; Figure 3 A flow chart of another pressing method of a printed circuit board provided by an embodiment of the present application is shown in the figure; Figure 4 A schematic diagram of placing a partition plate on a bottom plate provided by an embodiment of the present application is shown in the figure; Figure 5 A schematic diagram of placing a fusion core plate on a bottom plate provided by an embodiment of the present application is shown in the figure; Figure 6 A schematic diagram of placing a first kraft paper and a cover plate on a fusion core plate provided by an embodiment of the present application is shown in the figure; Figure 7 A schematic diagram of forming a second pin hole provided by an embodiment of the present application is shown in the figure; Figure 8 A schematic diagram of inserting a second pin into a second pin hole provided by an embodiment of the present application is shown in the figure; Figure 9 A structural schematic diagram of a pressing device of a printed circuit board provided by an embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0046] The present application will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are intended to serve only as an example of the present application and are not intended to limit the present application. In addition, it should be noted that only the parts related to the present application are shown in the accompanying drawings for the convenience of description.

[0047] The pressing method of a printed circuit board provided by an embodiment of the present application realizes the automation of the pin layout pressing process of the printed circuit board, reduces the requirement and workload of manual operation, eliminates the uncertainty and error of manual operation, improves the production efficiency and the stability of product quality, and the pressing method of the printed circuit board can be executed by a pressing device of the printed circuit board. Figure 1 A flow chart of a pressing method of a printed circuit board provided by an embodiment of the present application is shown in the figure; Figure 1 As shown in the figure, the pressing method of the printed circuit board includes:

[0048] S110, a plurality of first pin holes are arranged in a first area of the bottom plate, and a first pin is arranged in each first pin hole, a plurality of second pin hole areas are arranged in a second area of the bottom plate, and a plurality of positioning points are arranged in a third area of the bottom plate; wherein the first area surrounds the second area, and the third area surrounds the first area.

[0049] wherein, Figure 2 A schematic diagram of a bottom plate of a printed circuit board according to an embodiment of the present application is shown in FIG. 1. Figure 2 As shown in FIG. 1, the bottom plate A can be divided into a first area A1, a second area A2 and a third area A3, the first area A1 surrounds the second area A2, the third area A3 surrounds the first area A1, and the first area A1, the second area A2 and the third area A3 achieve different functions. The second area A2 is a layout area of core boards in the printed circuit board, and in the prior art, an opening and a pin need to be arranged in the second area A2 in advance, the pin is only 0-1 mil smaller than the hole on the core board, so as to fix the core board. In the present application, the second pin hole area A21 is a hole area to be drilled, and the second area A2 does not need to be arranged with an opening and a pin in advance. After all the core boards are laid out, a hole is drilled along the position of the second pin hole area A21 in the second area A2, and the pin is inserted after penetrating all the core boards, so as to fix the core boards during the pressing process, thereby avoiding the need for accurate alignment when the core board is sleeved on the pin, and avoiding the problem of core board damage or failure to be sleeved. A plurality of first pin holes A11 are arranged in the first area A1, and a first pin A12 is arranged in each first pin hole A11, so that the partition plate with the opening can be aligned with the first pin A12, the partition plate can pass through the first pin A12, and the first pin A12 does not affect the layout and arrangement of the core board. A plurality of positioning points A31 are arranged in the third area A3, and the positioning points A31 can be used for positioning when the robot places the partition plate or the core board, so as to automatically and accurately place the partition plate or the core board.

[0050] In addition, the shapes of the first area A1, the second area A2 and the third area A3 can be rectangular, circular or other images, and are not limited to the shapes shown in FIG. 1. Figure 2 The positions of the first pin hole A11, the positioning point A31 and the second pin hole area A21 can be located at the four corners of the bottom plate A, can be located near the center of each side of the bottom plate A, or can be located at the four corners and near the center of the side of the bottom plate A, and the present application is not limited in this regard. The shapes of the first pin hole A11, the positioning point A31 and the second pin hole area A21 can be circular, square or other shapes, and the present application is not limited in this regard.

[0051] S120, a partition plate covering the second area and part of the first area is placed on the bottom plate by the first pin.

[0052] Specifically, the mechanical hand can place the baffle with the opening, so that the opening of the baffle passes through the first pin A12, and the baffle covers the second area A2 and part of the first area A1, so as to realize the isolation between the core plate and the bottom plate A. In addition, the opening for isolation can be accurately positioned with the first pin A12, and the mechanical hand can be positioned by the positioning point A31 when placing the baffle, so as to realize automatic and accurate placement of the baffle.

[0053] S130, placing at least one fusing core plate on the side of the baffle away from the bottom plate according to the positioning point, the vertical projection of the fusing core plate on the bottom plate being located in the second area; wherein the fusing core plate comprises a plurality of unopened core plates.

[0054] Specifically, the fusing core plate is composed of a plurality of unopened core plates, and the core plate is provided with a circuit pattern. The mechanical hand can place at least one fusing core plate on the side of the baffle away from the bottom plate A, and accurately control the placement position of the fusing core plate according to the positioning point A31, so that the vertical projection of the fusing core plate on the bottom plate A is located in the second area A2, so as to ensure that the fusing core plate is located in the second area A2 of the printed circuit board after the core plate layout is completed.

[0055] S140, drilling a plurality of second pin holes penetrating the fusing core plate, the baffle and the bottom plate according to the positioning point, the vertical projection of the second pin hole on the bottom plate being located in the second pin hole area.

[0056] Specifically, the second pin hole area A21 is the area to be drilled, and the second area A2 does not need to be provided with an opening and a pin in advance. After all the core plates are laid out, the mechanical hand can control the whole PIN hole drilling process and the PIN pinning process of the whole printed circuit board. The mechanical hand can be positioned according to the positioning point A31, a plurality of second pin holes penetrating the fusing core plate, the baffle and the bottom plate A are drilled, so that the vertical projection of the second pin hole on the bottom plate A is located in the second pin hole area A21, so as to prevent the position of the fusing core plate from deviating greatly, and to facilitate the automatic placement of the fusing core plate by the mechanical hand, and to facilitate the fixation of each core plate during the pressing process, so as to avoid the problems of core plate damage or failure to be sleeved.

[0057] S150, inserting the second pin into the second pin hole and performing the pressing operation.

[0058] Specifically, the second pin is inserted into the second pin hole, so that the fused core plate, the partition plate and the bottom plate form an integral whole, which is equivalent to drilling PIN holes and operating the entire set of PCB PIN pins after the core plate is arranged in an integral whole, realizing the automation of the pin arrangement and pressing process of the printed circuit board, reducing the requirements and workload of manual operation, eliminating the uncertainty and errors of manual operation, and improving the production efficiency and stability of product quality. After the second pin is inserted into the second pin hole, the fused core plate, the partition plate and the bottom plate can be connected together, and after the fused core plate, the partition plate and the bottom plate are pressed, the fused core plate, the partition plate and the bottom plate can be fixed together, realizing the pressing process of the printed circuit board.

[0059] In the related art, the PinLam plate arrangement process includes: a. planting Pin pins on the bottom plate with Pin holes corresponding to the hole position; b. putting the pin with a hole in the leather paper and the steel plate on the pin; c. according to the layer design, the copper foil with a hole is put on the pin, and then the PP is put on the pin; d. repeat step c according to the layer design; e. put the PP, copper foil and steel plate with holes on the pin; f. repeat steps c, d and e to arrange the next plate; g. finally, put the leather paper with holes on the pin and the cover plate; h. end of plate arrangement, enter the press for pressing. And the embodiment of the present application realizes the drilling and pin setting of the printed circuit board as a whole by the mechanical hand, realizes the insertion of the second pin into the second pin hole, and does not need manual alignment operation, which helps to realize the automation of the pin arrangement and pressing process of the printed circuit board, reduces the requirements and workload of manual operation, eliminates the uncertainty and errors of manual operation, and improves the production efficiency and stability of product quality.

[0060] The embodiment of the present application provides a printed circuit board pressing method, which comprises the following steps: arranging a plurality of first pin holes in a first area of a base plate, arranging first pins in the first pin holes, so that a partition plate can be placed, arranging a plurality of second pin hole areas in a second area of the base plate, so that drilling and pin setting can be performed after the fusion core plate is placed, and arranging a plurality of positioning points in a third area of the base plate, so that a manipulator can accurately place the partition plate and the fusion core plate; placing the partition plate covering the second area and part of the first area on the base plate through the first pins, so that the partition plate can be accurately placed; placing at least one fusion core plate on the side of the partition plate away from the base plate according to the positioning points, and the vertical projection of the fusion core plate on the base plate is located in the second area, so that the position of the fusion core plate is prevented from deviating greatly, and the manipulator can automatically place the fusion core plate; drilling a plurality of second pin holes penetrating the fusion core plate, the partition plate and the base plate according to the positioning points, the vertical projection of the second pin holes on the base plate is located in the second pin hole area, and the second pins are inserted into the second pin holes, so that the pressing operation is performed, thereby the drilling and pin setting of the printed circuit board can be performed by the manipulator after layout, manual alignment operation is not needed, the automation of the printed circuit board pin layout and pressing process is realized, the requirement and workload of manual operation are reduced, the uncertainty and error of manual operation are eliminated, and the production efficiency and product quality stability are improved.

[0061] The embodiment of the present application also provides another printed circuit board pressing method, so that the PCB pressing PINLAM layout alignment automation is further realized, the requirement and workload of manual operation are reduced, the production efficiency is improved, the uncertainty and error of manual operation are eliminated, and the quality stability is improved. Figure 3 The flow chart of another printed circuit board pressing method provided by the embodiment of the present application is shown in Figure 3 The printed circuit board pressing method comprises the following steps:

[0062] S210, forming a circuit pattern on a plurality of core plates.

[0063] Specifically, the required conductive circuit is made on each core plate constituting the inner layer of the PCB through a pattern transfer, etching and other processes to form a circuit pattern.

[0064] S220, aligning and fusing the core plates to form at least one fusion core plate.

[0065] Specifically, a plurality of core plates with inner layer circuits are preliminarily aligned and fixed through a pre-fusion process to form a subunit, i.e., a fusion core plate, for preparing for subsequent overall pressing.

[0066] S230, a plurality of first pin holes are arranged in the first area of the bottom plate, and a first pin is arranged in each first pin hole, a plurality of second pin hole regions are arranged in the second area of the bottom plate, and a plurality of positioning points are arranged in the third area of the bottom plate; wherein the first area surrounds the second area, and the third area surrounds the first area.

[0067] S240, a partition plate is placed on the bottom plate by the first pin, covering the second area and part of the first area.

[0068] Specifically, referring to Figure 2 , a partition plate with an opening can be fixed on the bottom plate A using the first pin A12, and the position of the partition plate is fixed, so that the opening on the partition plate passes through the first pin A12, the partition plate covers the second area A2 and part of the first area A1, so as to realize the isolation between the core plate and the bottom plate A.

[0069] Figure 4 The schematic diagram of placing a partition plate on the bottom plate provided by the embodiment of the application is shown in Figure 4 , the partition plate B covers the second area A2 and part of the first area A1, the partition plate B is provided with an opening, and a partition plate with an opening can be fixed on the bottom plate A using the first pin A12, and the position of the partition plate is fixed.

[0070] S250, at least one fused core plate is placed on the side of the partition plate away from the bottom plate according to the positioning points, and the vertical projection of the fused core plate on the bottom plate is located in the second area; wherein the fused core plate comprises a plurality of core plates without openings.

[0071] Specifically, Figure 5 The schematic diagram of placing a fused core plate on the bottom plate provided by the embodiment of the application is shown in Figure 5 , the fused core plate C is located in the second area A2, and no opening is arranged on the fused core plate C, a mechanical hand can place at least one fused core plate on the side of the partition plate away from the bottom plate A, and the placement position of the fused core plate is accurately controlled according to the positioning point A31, so that the vertical projection of the fused core plate on the bottom plate A is located in the second area A2, so as to ensure that the fused core plate is located in the second area A2 of the printed circuit board after the core plate layout is completed.

[0072] S260, a first kraft paper and a cover plate are placed in sequence on the side of the fused core plate away from the bottom plate, the vertical projection of the first kraft paper on the bottom plate is located in the second area, and the first pin is inserted into the positioning hole of the cover plate; wherein the cover plate is provided with a cover plate hollow region, and the vertical projection of the cover plate hollow region on the bottom plate is located in the second pin hole region.

[0073] Specifically, Figure 6 The schematic diagram of placing a first kraft paper and a cover plate on the fused core plate provided by the embodiment of the application is shown in Figure 6As shown, before drilling the second pin holes through the fused core plate C, the baffle B and the bottom plate A according to the positioning points A31 after placing all the fused core plates C in the layout completion, a first kraft paper and a cover plate C1 are sequentially placed on the side of the fused core plate C away from the bottom plate A, the first kraft paper is a non-porous structure, placed in the second area on the inner side of each first pin A12, so that the vertical projection of the first kraft paper on the bottom plate A is located in the second area A2, the cover plate C1 is provided with a positioning hole and a cover plate hollow area, the positioning hole of the cover plate C1 corresponds to the position of the first pin A12, so that the first pin A12 is inserted into the positioning hole of the cover plate C1, and the cover plate hollow area corresponds to the position of the second pin hole area A21, so that the second pin hole is formed by drilling a hole in the cover plate hollow area of the cover plate C1.

[0074] S270, drilling a plurality of second pin holes through the cover plate, the fused core plate, the baffle and the bottom plate according to the positioning points on the cover plate, the vertical projection of the second pin hole on the bottom plate is located in the second pin hole area.

[0075] Among them, the second pin hole area A21 of the bottom plate A is provided with a hollow area, and the hollow area is filled and flattened with the same thickness of bakelite plate, so as to drill holes in the bottom plate A, and the cover plate hollow area of the cover plate C1 can also be filled and flattened with the same thickness of bakelite plate, so as to drill holes in the cover plate C1.

[0076] Specifically, Figure 7 The schematic diagram for forming the second pin hole provided by the embodiment of the present application is as shown in Figure 7 As shown, the second pin hole area A21 is the area to be drilled, and the second area A2 does not need to be provided with an opening and a pin in advance, and the PIN hole drilling process and the PIN pinning process of the whole printed circuit board can be carried out through the mechanical hand after the layout of all the fused core plates, the mechanical hand can be positioned according to the positioning points A31, a plurality of second pin holes X through the fused core plate, the baffle and the bottom plate A are drilled, so that the vertical projection of the second pin hole X on the bottom plate A is located in the second pin hole area A21, preventing the position of the fused core plate from deviating greatly, and facilitating the automatic placement of the fused core plate by the mechanical hand, and facilitating the fixation of each core plate in the pressing process, thereby eliminating the precise alignment process when the core plate sleeve is sleeved on the pin in the prior art, and avoiding the problem of core plate damage or failure to sleeve.

[0077] S280, inserting the second pin into the second pin hole and performing the pressing operation.

[0078] Figure 8 The schematic diagram for inserting the second pin into the second pin hole provided by the embodiment of the present application is as shown in Figure 8As shown, the second pin X1 is inserted into the second pin hole X, so that the fused core plate C, the partition plate B and the bottom plate A form an integral whole, which is equivalent to PIN hole drilling and the whole set of PCB PIN pin operation after the whole layout of the fused core plate C, realizes the automatic of the printing circuit board with pin layout and pressing process, reduces the requirement and workload of manual operation, eliminates the uncertainty and error of manual operation, and improves the production efficiency and stability of product quality. After the second pin is inserted into the second pin hole, the fused core plate, the partition plate and the bottom plate can be connected together, and after the fused core plate, the partition plate and the bottom plate are pressed, the fused core plate, the partition plate and the bottom plate can be fixed together, realizing the pressing process of the printing circuit board.

[0079] In some embodiments of the application, the partition plate comprises a second kraft paper and a steel plate, and the partition plate covering the second area and part of the first area is placed on the bottom plate by the first pin, comprising:

[0080] The second kraft paper is placed in the second area of the bottom plate; the steel plate is placed on the side of the second kraft paper away from the bottom plate, the first pin is inserted into the steel plate positioning hole of the steel plate, and the vertical projection of the steel plate on the bottom plate covers the second area and part of the first area.

[0081] Specifically, as shown in the figure, Figure 4 The partition plate B comprises a second kraft paper and a steel plate, the second kraft paper can be placed in the second area A2 of the bottom plate A, the steel plate is placed on the side of the second kraft paper away from the bottom plate, the first pin A2 is inserted into the steel plate positioning hole of the steel plate, and the vertical projection of the steel plate on the bottom plate A covers the second area A2 and part of the first area A1, realizing the fixation of the position of the second kraft paper and the steel plate. The manipulator can realize accurate placement of the second kraft paper and the steel plate through the positioning point A31.

[0082] In some embodiments of the application, the fused core plate C is one, and at least one fused core plate is placed on the side of the partition plate away from the bottom plate according to the positioning point, and the vertical projection of the fused core plate on the bottom plate is located in the second area, comprising:

[0083] The copper foil and the adhesive sheet are placed on the side of the partition plate away from the bottom plate according to the positioning point, and the vertical projection of the copper foil and the adhesive sheet on the bottom plate is located in the second area; the fused core plate is placed on the side of the adhesive sheet away from the bottom plate according to the positioning point, and the vertical projection of the fused core plate on the bottom plate is located in the second area.

[0084] Specifically, referring to Figure 5, the mechanical arm can place the copper foil and the adhesive sheet on the side of the partition plate B away from the bottom plate A according to the positioning point A31, and then place the fusing core plate C, specifically, the mechanical arm can place the copper foil and the adhesive sheet on the side of the partition plate B away from the bottom plate A according to the positioning point A31, and the vertical projection of the copper foil and the adhesive sheet on the bottom plate A is located in the second area A2, and then place the fusing core plate C on the side of the adhesive sheet away from the bottom plate A according to the positioning point A31, and the vertical projection of the fusing core plate C on the bottom plate A is located in the second area A2. The mechanical arm places the fusing core plate C by grabbing the positioning point A31 on the bottom plate A, thereby improving the alignment degree when arranging multiple sets of PCBs.

[0085] In some embodiments of the present application, the fusing core plate is n, n>1, at least one fusing core plate is placed on the side of the partition plate away from the bottom plate according to the positioning point, and the vertical projection of the fusing core plate on the bottom plate is located in the second area, comprising:

[0086] Repeat the steps of placing the copper foil and the adhesive sheet on the side of the partition plate away from the bottom plate according to the positioning point, and placing the fusing core plate on the side of the adhesive sheet away from the bottom plate until the arrangement of n fusing core plates is completed; wherein the vertical projection of each copper foil and adhesive sheet on the bottom plate is located in the second area, and the vertical projection of each fusing core plate on the bottom plate is located in the second area.

[0087] Specifically, when the fusing core plate is n, refer to the reference Figure 5 , the mechanical arm can repeat the following steps: a, placing the copper foil and the adhesive sheet on the side of the partition plate B away from the bottom plate A according to the positioning point A31, b, placing the fusing core plate C, c, continuing to place the adhesive sheet, copper foil, steel plate until the arrangement of n fusing core plates C is completed according to the arrangement height requirement, by repeating steps a-c, the arrangement of n fusing core plates C can be realized, the PINLAM arrangement process of PCB is realized automatically, the requirement and workload of manual operation are reduced, the production efficiency is improved, on the other hand, the uncertainty and error of manual operation are eliminated, and the quality stability is improved.

[0088] Specifically, the mechanical arm can place the copper foil and the adhesive sheet on the side of the partition plate B away from the bottom plate A according to the positioning point A31, and the vertical projection of the copper foil and the adhesive sheet on the bottom plate A is located in the second area A2, and then place the fusing core plate C on the side of the adhesive sheet away from the bottom plate A according to the positioning point A31, and the vertical projection of the fusing core plate C on the bottom plate A is located in the second area A2.

[0089] In some embodiments of the present application, the second pin is inserted into the second pin hole, and the pressing operation is performed, comprising:

[0090] Inserting a plurality of second pins into each second pin hole to form a to-be-pressed printed circuit board; transferring the to-be-pressed printed circuit board to a pressing machine to perform a pressing operation to form a printed circuit board.

[0091] Specifically, referring to Figure 8 Inserting multiple second pins X1 into the second pin holes X, so that the core plate C, the partition plate B and the bottom plate A form an integral whole, a to-be-pressed printed circuit board is formed, and then the to-be-pressed printed circuit board is transferred to a pressing machine for pressing operation, heating and pressing are performed, so that the layers of the to-be-pressed printed circuit board are firmly combined into a complete multilayer PCB, the pin layout and pressing process of the printed circuit board is realized automatically, the requirement and workload of manual operation are reduced, the uncertainty and error of manual operation are eliminated, and the production efficiency and product quality stability are improved.

[0092] In the related art, the PinLam layout process needs to be drilled and pinned first. In order to realize high-precision alignment between core plates, the pin is usually only 0-1 mil smaller than the hole on the core plate. When the core plate is sleeved on the pin, accurate alignment is required, otherwise the core plate is easy to be damaged or not sleeved. It is very difficult to realize automation. In the embodiment of the present application, the second pin hole area A21 is the area to be drilled, and no hole and pin need to be set in advance in the second area A2. After the layout of all the core plates is completed, drilling is performed along the position of the second pin hole area A21 in the second area A2, and the pin is inserted after penetrating all the core plates, so that the fixation of each core plate is realized during the pressing process, the process of accurate alignment when the core plate is sleeved on the pin is omitted, and the problems of core plate damage or not sleeving are avoided.

[0093] The embodiment of the present application provides a pressing method of a printed circuit board. After layout, the printed circuit board is drilled and pinned as a whole by a mechanical hand, without manual alignment operation, which helps to realize the pin layout and pressing process of the printed circuit board automatically, reduces the requirement and workload of manual operation, eliminates the uncertainty and error of manual operation, and improves the production efficiency and product quality stability.

[0094] The embodiment of the present application also provides a pressing device of a printed circuit board, which is used to execute the pressing method of the printed circuit board of the embodiment of the present application, and realizes the functions and technical effects of the pressing method of the printed circuit board, Figure 9 The structure diagram of the pressing device of the printed circuit board provided by the embodiment of the present application is shown in Figure 9 As shown in the figure, the pressing device of the printed circuit board comprises a control module 110 and an execution module 120, and the control module 110 and the execution module 120 are connected.

[0095] The control module 110 is configured to control the execution module 120 to set a plurality of first pin holes in a first area of the base plate, set a first pin in each first pin hole, set a plurality of second pin hole regions in a second area of the base plate, and set a plurality of positioning points in a third area of the base plate; the first area surrounds the second area, and the third area surrounds the first area; the control module 110 is further configured to control the execution module 120 to place a partition plate covering the second area and part of the first area on the base plate through the first pin; the control module 110 is further configured to control the execution module 120 to place at least one fusion core plate on a side of the partition plate away from the base plate according to the positioning points, and a vertical projection of the fusion core plate on the base plate is located in the second area; the fusion core plate includes a plurality of unperforated core plates; the control module 110 is further configured to control the execution module 120 to drill a plurality of second pin holes through the fusion core plate, the partition plate and the base plate according to the positioning points, and vertical projections of the second pin holes on the base plate are all located in the second pin hole region; the control module 110 is further configured to control the execution module 120 to insert a second pin into the second pin hole and perform a pressing operation, so as to realize automation of a pin layout pressing process of a printed circuit board, reduce the requirement and workload of manual operation, eliminate the uncertainty and error of manual operation, and improve the production efficiency and stability of product quality. After the second pin is inserted into the second pin hole, the fusion core plate, the partition plate and the base plate can be connected together, and after the fusion core plate, the partition plate and the base plate are subjected to the pressing operation, the fusion core plate, the partition plate and the base plate can be fixed together, so as to realize a pressing process of the printed circuit board.

[0096] The execution module 120 can be composed of a mechanical hand, a drilling machine, a camera and the like, and can realize grabbing and placing each structure by the mechanical hand, drilling by the drilling machine, and accurate alignment by the camera.

[0097] Specifically, the control module 110 is configured to control the execution module 120 to set a plurality of first pin holes A11 in the first area A1 of the bottom plate A, and set a first pin A12 in each first pin hole, so that the gasket with the opening can be aligned with the first pin A12, the gasket can pass through the first pin A12, the first pin A12 does not affect the layout of the core plate, and a plurality of positioning points A31 are arranged in the third area A3. When the manipulator places the gasket or the core plate, the positioning points A31 can be used for positioning, so that the gasket or the core plate can be placed automatically and accurately. The control module 110 is further configured to control the execution module 120 to place the gasket with the opening, so that the opening of the gasket passes through the first pin A12, and the gasket covers the second area A2 and part of the first area A1, so as to realize the isolation between the core plate and the bottom plate A. The control module 110 is further configured to control the execution module 120 to place at least one fritted core plate on the side of the gasket away from the bottom plate A, and accurately control the placement position of the fritted core plate according to the positioning points A31, so that the vertical projection of the fritted core plate on the bottom plate A is located in the second area A2, so as to ensure that the fritted core plate is located in the second area A2 of the printed circuit board when drilling is performed after the layout of the core plate is completed. The control module 110 is further configured to control the execution module 120 to drill a plurality of second pin holes penetrating the fritted core plate, the gasket and the bottom plate according to the positioning points, and the vertical projection of the second pin hole on the bottom plate is located in the second pin hole area. The control module 110 is further configured to control the execution module 120 to insert a second pin into the second pin hole and perform a pressing operation.

[0098] The control module 110 in the embodiment of the present application is not limited to performing the above control process, and can also adaptively increase the control function according to the fritting method of the printed circuit board in the embodiment of the present application, so as to realize the same effects and technical effects of the fritting method of the printed circuit board.

[0099] The fritting device of the printed circuit board in the embodiment of the present application can realize the automatic fritting process of the printed circuit board with the pin layout by controlling the control module and the execution module to drill holes and set pins on the printed circuit board as a whole, without manual alignment operation, which helps to realize the automatic fritting process of the printed circuit board with the pin layout, reduces the requirement and workload of manual operation, eliminates the uncertainty and error of manual operation, and improves the production efficiency and stability of product quality.

[0100] The embodiment of the present application further provides a printed circuit board formed by the fritting method of the printed circuit board in the embodiment of the present application.

[0101] Specifically, the printed circuit board is composed of film layers such as a bottom plate, a partition plate, a core plate and a cover plate, and the printed circuit board is drilled and provided with pins as a whole in the manufacturing process, so that the alignment operation is realized without manual operation, the pin-equipped layout and pressing process of the printed circuit board is automated, the requirement and workload of manual operation are reduced, the uncertainty and error of manual operation are eliminated, and the production efficiency and the stability of product quality are improved.

[0102] It should be noted that the above only describes the preferred embodiments of the present application and the principles of the applied technology. Those skilled in the art will understand that the present application is not limited to the specific embodiments herein, and those skilled in the art can make various obvious changes, readjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A press bonding method of a printed circuit board, characterized by, The press method of the printed circuit board comprises: a plurality of first pin holes are arranged in a first area of the bottom plate, and first pins are arranged in the first pin holes, a plurality of second pin hole regions are arranged in a second area of the bottom plate, and a plurality of positioning points are arranged in a third area of the bottom plate; the first area surrounds the second area, and the third area surrounds the first area; a partition plate covering the second area and part of the first area is placed on the bottom plate through the first pins; at least one fusion core plate is placed on a side of the partition plate away from the bottom plate according to the positioning points, and a vertical projection of the fusion core plate on the bottom plate is located in the second area; the fusion core plate comprises a plurality of unperforated core plates; a plurality of second pin holes penetrating through the fusion core plate, the partition plate and the bottom plate are drilled according to the positioning points, and vertical projections of the second pin holes on the bottom plate are all located in the second pin hole region; second pins are inserted into the second pin holes, and press operation is performed.

2. The press bonding method of a printed circuit board according to claim 1, characterized by, Before the plurality of first pin holes are arranged in the first area of the bottom plate, the method further comprises: a circuit pattern is formed on the plurality of core plates; the core plates are aligned and fused to form at least one fusion core plate.

3. The press bonding method of a printed circuit board according to claim 1, characterized by, The plurality of second pin holes penetrating through the fusion core plate, the partition plate and the bottom plate drilled according to the positioning points, and vertical projections of the second pin holes on the bottom plate are all located in the second pin hole region, comprise: a first kraft paper and a cover plate are sequentially placed on a side of the fusion core plate away from the bottom plate, vertical projections of the first kraft paper on the bottom plate are all located in the second area, and the first pins are inserted into positioning holes of the cover plate; the cover plate is provided with a cover plate hollow region, and a vertical projection of the cover plate hollow region on the bottom plate is located in the second pin hole region; a plurality of second pin holes penetrating through the cover plate, the fusion core plate, the partition plate and the bottom plate are drilled on the cover plate according to the positioning points, and vertical projections of the second pin holes on the bottom plate are all located in the second pin hole region.

4. The press bonding method of a printed circuit board according to claim 3, characterized by, the bottom plate is provided with a bottom plate hollow region, and a vertical projection of the bottom plate hollow region on the bottom plate is located in the second pin hole region; the plurality of second pin holes penetrating through the cover plate, the fusion core plate, the partition plate and the bottom plate drilled on the cover plate according to the positioning points comprise: the plurality of second pin holes penetrating through the cover plate hollow region, the fusion core plate, the partition plate and the bottom plate hollow region drilled on the cover plate according to the positioning points.

5. The press bonding method of a printed circuit board according to claim 1, characterized by, the partition plate comprises a second kraft paper and a steel plate; the partition plate covering the second area and part of the first area is placed on the bottom plate through the first pins, and comprises: the second kraft paper is placed in the second area of the bottom plate; the steel plate is placed on a side of the second kraft paper away from the bottom plate, the first pins are inserted into steel plate positioning holes of the steel plate, and a vertical projection of the steel plate on the bottom plate covers the second area and part of the first area.

6. The press bonding method of a printed circuit board according to Claim 1, characterized by, The at least one fritted core plate is placed on the side of the spacer plate away from the base plate according to the positioning points, and the vertical projection of the fritted core plate on the base plate is located in the second area, comprising: The copper foil and the adhesive sheet are placed on the side of the spacer plate away from the base plate according to the positioning points, and the vertical projection of the copper foil and the adhesive sheet on the base plate is located in the second area; The fritted core plate is placed on the side of the adhesive sheet away from the base plate according to the positioning points, and the vertical projection of the fritted core plate on the base plate is located in the second area.

7. The press bonding method of a printed circuit board according to Claim 1, wherein The n fritted core plates are placed on the side of the spacer plate away from the base plate according to the positioning points, and the vertical projection of each fritted core plate on the base plate is located in the second area, comprising: The copper foil and the adhesive sheet are placed on the side of the spacer plate away from the base plate according to the positioning points, and the vertical projection of the copper foil and the adhesive sheet on the base plate is located in the second area; the fritted core plate is placed on the side of the adhesive sheet away from the base plate according to the positioning points, and the vertical projection of the fritted core plate on the base plate is located in the second area; and the process is repeated until the arrangement of the n fritted core plates is completed; wherein the vertical projection of each copper foil and adhesive sheet on the base plate is located in the second area, and the vertical projection of each fritted core plate on the base plate is located in the second area.

8. The press bonding method of a printed circuit board according to Claim 1, characterized by, The second pin is inserted into the second pin hole, and the pressing operation is performed, comprising: A plurality of second pins are inserted into the second pin holes to form a to-be-pressed printed circuit board; The to-be-pressed printed circuit board is transferred to a pressing machine for pressing operation to form a printed circuit board.

9. A press bonding apparatus for a printed circuit board, characterized by comprising: The pressing device for the printed circuit board is used to perform the pressing method for the printed circuit board according to any one of claims 1-8, and the pressing device for the printed circuit board comprises a control module and an execution module, and the control module and the execution module are connected; The control module is used to control the execution module to set a plurality of first pin holes in a first area of a base plate, set first pins in the first pin holes, set a plurality of second pin hole regions in a second area of the base plate, and set a plurality of positioning points in a third area of the base plate; wherein the first area surrounds the second area, and the third area surrounds the first area; The control module is further used to control the execution module to place a spacer plate covering the second area and part of the first area on the base plate through the first pins; The control module is further used to control the execution module to place at least one fritted core plate on the side of the spacer plate away from the base plate according to the positioning points, and the vertical projection of the fritted core plate on the base plate is located in the second area; wherein the fritted core plate comprises a plurality of unperforated core plates; The control module is further used to control the execution module to drill a plurality of second pin holes through the fritted core plate, the spacer plate and the base plate according to the positioning points, and the vertical projection of the second pin holes on the base plate is located in the second pin hole region; The control module is further used to control the execution module to insert a second pin into the second pin hole and perform a pressing operation.

10. A printed circuit board, characterized by The printed circuit board is formed by the lamination method of any one of claims 1-8.

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