Heat exchange module and heat exchange device
The modular design of the heat exchange module solves the problem of low compatibility of the controller heat exchange structure in the existing technology, and achieves flexible assembly and resource-saving heat dissipation effect, adapting to the diverse needs of vehicle controllers.
Patent Information
- Application Number
- CN202411111741.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2026-02-13
AI Technical Summary
In existing technologies, the heat exchange structure and chip configuration of electronic device controllers are highly tied, resulting in low compatibility, poor flexibility, difficulty in adapting to the diverse needs of vehicle controllers and online upgrades, and serious waste of resources.
The modular heat exchange module, with its detachable heat exchange plates and connecting structure, allows for flexible assembly and expansion, independent of the controller housing, and adapts to different heat dissipation requirements.
It improves the flexibility and compatibility of heat exchange modules, supports rapid switching and online upgrades of vehicle controllers, saves resources, and reduces production costs.
Smart Images
Figure CN121531636A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present application relate to the field of electronic equipment, and in particular to a heat exchange module and a heat exchange device. BACKGROUND
[0002] The controller of the electronic equipment has a heat problem in work, and a heat exchange component needs to be arranged to perform heat management.
[0003] Taking the controller of a vehicle as an example, in the related art, a water cooling cavity is usually formed on the shell of the controller, and the cooling liquid flows from the water cooling cavity to carry away the heat generated by the chip. This heat exchange structure is formed in an integrated structure with the shell of the controller, and it is difficult to adjust according to the actual use demand, and the flexibility is low. Moreover, this heat exchange structure is highly bound with the setting mode of the chip in the controller, and if the setting mode of the chip changes, it needs to be redeveloped, and the compatibility is low. SUMMARY
[0004] Therefore, embodiments of the present application aim to provide a heat exchange module and a heat exchange device which have good use flexibility, compatibility and expandability.
[0005] A first aspect of embodiments of the present application provides a heat exchange module, comprising: at least one heat exchange plate, the heat exchange plate having a flow channel, a first connecting structure and a second connecting structure, wherein, in the case where the number of heat exchange plates is multiple, the first connecting structure of one of each two adjacent heat exchange plates is detachably connected with the second connecting structure of the other heat exchange plate, and the flow channels of the two adjacent heat exchange plates are in communication with each other.
[0006] A second aspect of embodiments of the present application provides a heat exchange device, comprising: a shell; at least one heat exchange module according to the first aspect of embodiments of the present application, which is detachably connected with the shell; and a heat exchange medium pipeline, which is in communication with the flow channel.
[0007] The heat exchange module and the heat exchange device according to embodiments of the present application adopt a modularized setting, the heat exchange plate has a first connecting structure and a second connecting structure, the connection of two heat exchange plates can be realized through the detachable connection of the first connecting structure and the second connecting structure, and thus a proper number of heat exchange plates can be assembled to form a heat exchange module to meet the relevant heat dissipation demand according to the actual use demand, and the use flexibility, compatibility and expandability are good. BRIEF DESCRIPTION OF DRAWINGS
[0008] Figure 1 FIG. 1 is a structural schematic diagram of a heat exchange module according to an embodiment of the present application;
[0009] Figure 2 FIG. 2 is a structural schematic diagram of a heat exchange device according to an embodiment of the present application; Figure 1An exploded view of the heat exchange module;
[0010] Figure 3 An exploded view of the heat exchange module;
[0011] Figure 4 An exploded view of the heat exchange module; Figure 3 An exploded view of the heat exchange module;
[0012] Figure 5 An exploded view of the heat exchange module; Figure 1 An exploded view of the heat exchange module;
[0013] Figure 6 An exploded view of the heat exchange module;
[0014] Figure 7 An exploded view of the heat exchange module; Figure 6 An exploded view of the heat exchange module;
[0015] Figure 8 An exploded view of the heat exchange module;
[0016] Figure 9 An exploded view of the heat exchange module;
[0017] Figure 10 An exploded view of the heat exchange module;
[0018] Figure 11 An exploded view of the heat exchange module; Figure 10 An exploded view of the heat exchange module.
[0019] BRIEF DESCRIPTION OF DRAWINGS
[0020] 1. heat exchange plate; 11. flow channel; 111. first flow channel; 112. second flow channel; 12. plate-shaped body; 12a. hollowed-out portion; 13. turbulence structure; 131. turbulence sheet; 14. cover plate; 2. interface plate; 21. heat exchange medium interface; 211. first interface; 212. second interface; 3. return flow plate; 4. first connecting structure; 41. first plate body; 42. first recess; 43. sealing strip; 44. positioning block; 5. second connecting structure; 51. second plate body; 52. second recess; 53. sealing groove; 54. positioning groove; 6. connecting channel; 6a. first channel; 6b. second channel; 7. partition; 71. first partition structure; 711. first protrusion; 72. second partition structure; 721. second protrusion; 100. housing; 100a. mounting groove; 200. heat exchange module; 300. heat exchange medium pipeline. DETAILED DESCRIPTION
[0021] In order to make the objectives, technical solutions and advantages of the present application clearer, further detailed description will be given below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.
[0022] In the specific embodiments, various specific technical features described can be combined in any suitable manner without contradiction, for example, different embodiments and technical solutions can be formed by combining different specific technical features. In order to avoid unnecessary repetition, various possible combinations of various specific technical features in the present application are not described again.
[0023] In the following description, the terms "first", "second", "third" and the like are only used to distinguish different objects, and do not mean that there is the same or relationship between the objects. It should be understood that the orientation description "upper", "lower", "outer", "inner" is the orientation in the normal use state, and the "left" and "right" directions represent the left and right directions shown in the specific corresponding schematic diagram, which can be the left and right directions in the normal use state or not.
[0024] It should be noted that the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitation, the element defined by the sentence "including one" does not exclude the presence of another identical element in the process, method, article or device including the element. "Multiple" means greater than or equal to two.
[0025] In the description of the present application, the "first direction", "second direction", "third direction" orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, wherein the "first direction" is the direction indicated by the arrow L1 in the drawings, the "second direction" is the direction indicated by the arrow L2 in the drawings, and the "third direction" is the direction indicated by the arrow L3 in the drawings. It should be understood that these orientation terms are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0026] Embodiments of the present application provide a heat exchange module, which is suitable for dissipating heat from any suitable structure, especially for dissipating heat from a controller of an electronic device and / or other semiconductor components. In the present application, the heat exchange module will be mainly described by taking the application of the heat exchange module to the controller of a vehicle as an example, but those skilled in the art can understand that this does not constitute a limitation on the use scenario of the heat exchange module.
[0027] With the evolution of the whole vehicle electronic and electrical architecture (EE architecture) from a distributed EE architecture to a centralized EE architecture, the same controller needs to integrate more functions, and therefore the computing power requirements of the master chip and SOC chip on the circuit board are higher and higher. The higher the computing power of the chip, the greater the heat dissipation requirement. Therefore, in the heat dissipation design, water cooling is generally introduced to meet the heat dissipation requirement of the high-power chip in operation.
[0028] In the related art, the mainstream solution is to use die casting + stirring grinding mill welding or stamping plate + brazing process to make a water cooling cavity on the whole structure shell of the controller, that is, to form an integrated water cooling shell for the shell of the controller, and the cooling liquid flows in the water cooling cavity to take away the heat generated by the chip. However, this design solution is highly bound to the controller architecture design (such as the position, number, power consumption of the chip in the controller), and different manufacturers have different controller architectures, resulting in different sizes and features of the controllers of different manufacturers, and the design solutions of the integrated water cooling shell are also different. This causes the following four problems.
[0029] (1) The different integrated water cooling shell design solutions are difficult to form a unified industry standard interface, resulting in a large number of non-standard parts with small total quantity made by manufacturers, and it is difficult to optimize the production process and cost.
[0030] (2) The integrated water cooling plate solution highly bound to the controller architecture has almost zero expandability, and any change in the position, power consumption, etc. of the chip will cause the entire integrated water cooling shell to be redeveloped, and the compatibility is low.
[0031] (3) With the popularity of online upgrade technology for vehicles, online upgrade and expansion of vehicle controller hardware will also become a future trend. However, the integrated water cooling plate shell and the architecture of the vehicle controller are highly bound at present, and it is basically impossible to realize online upgrade and replacement on the whole vehicle, which cannot adapt to the future development trend of the vehicle controller.
[0032] (4) From the power consumption analysis of the vehicle chip, the SOC chip and some master control chip MCU for calculation are the only chips with high power consumption that need water cooling. Other power supply chips and storage class DDR chips have low power consumption, and ordinary metal passive heat sinks can meet their heat dissipation requirements. However, this integrated water cooling shell concentrates the heat dissipation of all chips into a unified shell and process, resulting in a great waste of resources.
[0033] Based on the above problems, the heat exchange module of the embodiments of the present application is proposed.
[0034] Reference Figures 1-5The heat exchange module of the embodiment of the present application comprises at least one heat exchange plate 1.
[0035] The specific structure of the heat exchange plate 1 is not limited, which may, for example, be a rectangular plate structure made of injection molding material, metal material, etc.
[0036] The heat exchange plate 1 has a flow channel 11 for the flow of a heat exchange medium, a first connecting structure 4, and a second connecting structure 5. The heat exchange medium herein includes, but is not limited to, a gaseous medium, a liquid medium, a gas-liquid mixed medium, etc.
[0037] In actual use, at least one surface of the heat exchange plate 1 can be in contact with a component to be heat exchanged (such as a chip of a vehicle controller), so that the heat exchange medium flows and exchanges heat with the component to be heat exchanged.
[0038] The number of heat exchange plates 1 can be one or multiple. For reference Figure 4 In the case where the number of heat exchange plates 1 is multiple, the first connecting structure 4 of one of the adjacent two heat exchange plates 1 is detachably connected with the second connecting structure 5 of the other heat exchange plate 1, and the flow channels 11 of the adjacent two heat exchange plates 1 are in communication with each other.
[0039] The specific structure of the first connecting structure 4 and the second connecting structure 5 is not limited, as long as they can cooperate with each other, such as one of the first connecting structure 4 and the second connecting structure 5 comprising a latch and the other comprising a slot, or both the first connecting structure 4 and the second connecting structure 5 comprising threaded holes, or one comprising a threaded hole and the other comprising a through hole, etc.
[0040] It can be understood that the flow channels 11 of the adjacent heat exchange plates 1 need to be in communication. In some embodiments, the communication of the flow channels 11 of the adjacent two heat exchange plates 1 can be achieved via the cooperative connection of the first connecting structure 4 and the second connecting structure 5, in other words, the first connecting structure 4 and the second connecting structure 5 can form a connecting channel for the communication of the flow channels 11 of the adjacent two heat exchange plates 1 when they are cooperatively connected.
[0041] In some other embodiments, the communication of the flow channels 11 of the adjacent two heat exchange plates 1 can be achieved by other components, or the flow channels 11 of the adjacent two heat exchange plates 1 can be directly connected to achieve communication, in other words, in these embodiments, the first connecting structure 4 and the second connecting structure 5 only serve to connect the two heat exchange plates 1, and do not form a connecting channel, which can be specifically determined by a person skilled in the art according to actual use requirements.
[0042] The heat exchange module in this embodiment adopts a modular design. Specifically, the heat exchange plate 1 is provided with a first connecting structure 4 and a second connecting structure 5. The two heat exchange plates 1 can be connected by the detachable connection of the first connecting structure 4 and the second connecting structure 5. In this way, those skilled in the art can assemble an appropriate number of heat exchange plates 1 to form a heat exchange module to meet the relevant heat dissipation requirements according to actual use needs. It has good flexibility, compatibility and scalability.
[0043] Taking the heat exchange module of this embodiment as an example applied to a vehicle controller, the heat exchange module of this embodiment has the following advantages.
[0044] (1) The detachable connection between the heat exchange plates 1 makes the heat exchange module expandable. It can meet the heat dissipation requirements of different vehicle controllers through different combinations without changing the structure of the heat exchange plates 1 to meet different heat dissipation requirements. Therefore, in the actual production process, the heat exchange plates 1 can be produced as standard parts, which is conducive to standardization and cost reduction.
[0045] (2) The heat exchange module is independent of the vehicle controller housing, and its spatial arrangement is highly flexible. It can be set only at the high power consumption chip, while other passive heat dissipation methods (such as metal fins) can be used at the low power consumption chip, saving resources.
[0046] (3) The heat exchange module is independent of the vehicle controller housing. When the heat dissipation requirements change, such as when the chip is upgraded, the heat exchange plate 1 can be removed and installed to meet the changed heat dissipation requirements, which provides high flexibility. Moreover, the housing structure does not need to be changed during the above process, thus enabling rapid switching and online upgrades of the vehicle controller hardware.
[0047] For ease of description, in the relevant embodiments below, the two heat exchange plates located in the multiple heat exchange plate arrangement directions are respectively referred to as the head heat exchange plate and the tail heat exchange plate. In the case where there is only one heat exchange plate, the head heat exchange plate and the tail heat exchange plate both refer to that heat exchange plate.
[0048] In some embodiments, still refer to Figures 1-5 The heat exchange module also includes at least one interface plate 2, which has a heat exchange medium interface 21 and a second connection structure 5. The second connection structure of the interface plate is detachably connected to the first connection structure of a heat exchange plate, and the heat exchange medium interface is connected to the flow channel of the heat exchange plate.
[0049] The heat exchange module of the embodiment is additionally provided with an interface plate, the interface plate is provided with a second connecting structure, in this way, through detachable connection of the first connecting structure and the second connecting structure, the connection of the interface plate and any one heat exchange plate can be realized, thereby, the heat exchange plates can be increased or reduced without changing the structure of the external heat exchange medium pipeline, and the use flexibility and expandability of the heat exchange module are further improved.
[0050] Similarly, in the embodiment, the communication of the heat exchange medium interface and the flow channel of the heat exchange plate can be realized through the matching connection of the first connecting structure 4 and the second connecting structure 5, can be realized through other components, and can also be realized through direct docking of the heat exchange medium interface and the flow channel.
[0051] In some other embodiments, the interface plate 2 can also not be provided, and the flow channel of the heat exchange plate can be directly connected with the external heat exchange medium pipeline.
[0052] In some embodiments, still referring to Figures 1-5 , the flow channel 11 includes a first flow channel 111 and a second flow channel 112, in the case where the number of heat exchange plates 1 is multiple, the first flow channels 111 of the adjacent two heat exchange plates 1 are communicated with each other, and the second flow channels 112 are also communicated with each other.
[0053] The heat exchange medium interface 21 includes a first interface 211 and a second interface 212, the first interface 211 is communicated with the first flow channel 111, and the second interface 212 is communicated with the second flow channel 112.
[0054] In the embodiment, the structures of the first flow channel 111 and the second flow channel 112 can be completely the same, of course, the structures of the first flow channel 111 and the second flow channel 112 can also be different. By providing the first flow channel 111 and the second flow channel 112, the flowability of the heat exchange medium in the heat exchange plate 1 can be improved, and the heat exchange effect of the heat exchange module is further improved.
[0055] Of course, in some other embodiments, each heat exchange plate 1 can also include only one flow channel 11.
[0056] In some embodiments, still referring to Figures 1-5 , the heat exchange module further includes a return plate 3, the return plate 3 has a first connecting structure 4, the first connecting structure 4 of the return plate 3 is detachably connected with the second connecting structure 5 of one heat exchange plate 1, and forms a passage that communicates the first flow channel 111 and the second flow channel 112 of the heat exchange plate 1.
[0057] The above passage can be a return passage formed in the return plate 3, or can be a passage formed by the first connecting structure 4 of the return plate 3 and the second connecting structure 5 of the heat exchange plate 1, and no limitation is made thereto.
[0058] In this embodiment, by setting the reflux plate 3, the heat exchange medium in the first flow channel 111 of the heat exchange plate 1 can be refluxed to the second flow channel 112. In this way, the flow direction of the heat exchange medium in the first flow channel 111 and the second flow channel 112 will be opposite, which further improves the heat exchange efficiency of the heat exchange module. On the other hand, in this embodiment, the interface plate 3 can be set only on one side, which makes it easier to simplify the structure of the external heat exchange medium pipeline.
[0059] In an embodiment with only one heat exchange plate 1, both the interface plate 2 and the return plate 3 can be connected to the heat exchange plate 1. Specifically, refer to... Figure 1 and Figure 2 , Figure 1 and Figure 2 In the illustrated embodiment, the heat exchange module includes an interface plate 2a, a heat exchange plate 1b, and a reflux plate 3c. The interface plate 2a has a second connection structure 5a, the heat exchange plate 1b has a first connection structure 4b and a second connection structure 5b, and the reflux plate 3c has a first connection structure 4c. The second connection structure 5a of the interface plate 2a is connected to the first connection structure 4b of the reflux plate 3b, and the second connection structure 5b of the heat exchange plate 1b is connected to the first connection structure 4c of the reflux plate 3c.
[0060] In embodiments with multiple heat exchange plates 1, the interface plate 2 and the return plate 3 can be connected to the heat exchange plate 1 at the head and the heat exchange plate 1 at the tail, respectively. Specifically, refer to... Figure 3 and Figure 4 , Figure 3 and Figure 4 In the illustrated embodiment, the heat exchange module includes an interface plate 2d, two heat exchange plates 1e and 1f, and a reflux plate 3g. The interface plate 2d has a second connection structure 5d, the head heat exchange plate 1e has a first connection structure 4e and a second connection structure 5e, the tail heat exchange plate 1f has a first connection structure 4f and a second connection structure 5f, and the reflux plate 3g has a first connection structure 4g. The second connection structure 5d of the interface plate 2d is connected to the first connection structure 4e of the head heat exchange plate 1e, the second connection structure 5e of the head heat exchange plate 1e is connected to the first connection structure 4f of the tail heat exchange plate 1f, and the second connection structure 5f of the tail heat exchange plate 1f is connected to the first connection structure 4g of the reflux plate 3g.
[0061] In the above embodiments, reference is made to Figure 5 , Figure 5 The middle arrow indicates the flow direction of the heat exchange medium. The heat exchange medium enters the head heat exchange plate 1 through the first interface 211 of the interface plate 2, flows sequentially through each heat exchange plate 1 along the first flow channel 111, until it flows out of the tail heat exchange plate 1. Figure 5The head return plate 3 and the tail return plate 3 are the same heat exchange plate 1. Then, the heat exchange medium flows back to the second flow channel 112 of the tail heat exchange plate 1 through the return plate 3, and sequentially flows through each heat exchange plate 1 along the second flow channel 112 until it flows out from the head heat exchange plate 1 to the second interface 212 of the interface plate 2, completing the cycle.
[0062] It should be noted that in some other embodiments, the return plate 3 can not be provided, and two interface plates 2 can be provided, respectively connected with the head heat exchange plate 1 and the tail heat exchange plate 1.
[0063] In some embodiments, referring to Figures 5-7 , the heat exchange plate 1 comprises a plate-shaped body 12, the first flow channel 111 and the direction flow channel 11 are formed in the plate-shaped body 12, the first flow channel 111 and the second flow channel 112 extend along the first direction and are arranged side by side along the second direction, the thickness direction of the plate-shaped body 12 is parallel to the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.
[0064] In this embodiment, the first flow channel 111 and the second flow channel 112 extend in a straight line, so that the manufacturing cost can be reduced. In addition, since the first flow channel 111 and the second flow channel 112 extend in a straight line, the heat exchange plate 1, the interface plate 2 and the return plate 3 also arrange in a straight line in general, and the connection mode is relatively simple.
[0065] As an example, one of the first direction and the second direction is the length direction of the plate-shaped body 12, and the other is the width direction of the plate-shaped body 12.
[0066] In some other embodiments, the first flow channel 111 and the second flow channel 112 can also extend along a curve, extend along a broken line, etc. This helps to further improve the flexibility of the heat exchange module splicing.
[0067] In some embodiments, still referring to Figures 6-9 , the first connecting structure 4 comprises a first plate body 41, the second connecting structure 5 comprises a second plate body 51, and in the same heat exchange plate, the first plate body 41 and the second plate body 51 are arranged on opposite sides of the plate-shaped body 12 along the first direction, and when the first connecting structure and the second connecting structure are connected, the first plate body and the second plate body are butted along the third direction.
[0068] This arrangement can increase the contact area when the first connecting structure 4 and the second connecting structure 5 are connected, thereby increasing the stability of the connection and improving the service life of the heat exchange module. In addition, in the embodiment in which the first connecting structure 4 and the second connecting structure 5 form a connection channel when they are connected, this arrangement can also improve the sealing performance of the connection channel and reduce the risk of leakage of the heat exchange medium.
[0069] Further, in the embodiment, the first plate body 41, the second plate body 51 and the plate-shaped body 12 of the heat exchange plate 1 can be of an integrated structure, thereby further improving the service life and reducing the cost. Of course, the first plate body 41 and the second plate body 51 of the same heat exchange plate 1 can be connected with the plate-shaped body 12 by bonding, welding or other suitable connecting methods. Similarly, referring to Figure 8 , the second plate body 51 of the interface plate 2 can be of an integrated structure with the body of the interface plate 2, referring to Figure 9 , the first plate body 41 of the return plate 3 can be of an integrated structure with the body of the return plate 3.
[0070] In some embodiments, still referring to Figure 6 and Figure 7 , the plate-shaped body 12 has a first face and a second face along the third direction, one side surface of the first plate body 41 is coplanar with the first face along the third direction, and the other side surface is formed as an abutting face, one side surface of the second plate body 51 is coplanar with the second face along the third direction, and the other side surface is formed as an abutting face, and the first plate body 41 and the second plate body 51 in one heat exchange plate 1 form a stepped structure with the plate-shaped body 12.
[0071] In the embodiment, referring to Figures 1-6 , since the first plate body 41 and the second plate body 51 form a stepped structure with the plate-shaped body, and each of the first plate body 41 and the second plate body 51 has one side surface coplanar with the surface of the plate-shaped body along the third direction, both side surfaces of the entire heat exchange module after assembly are substantially planar along the third direction, which helps the heat exchange module to be more closely attached to the component to be heat exchanged, and a better heat exchange effect is obtained.
[0072] In some embodiments, referring to Figures 5-9 , the abutting face of the first plate body 41 is recessed to form a first recess 42, the abutting face of the second plate body 51 is recessed to form a second recess 52, the first recess 42 and the second recess 52 are abutted along the height direction to jointly form a connecting channel 6, and the connecting channel 6 is in communication with the first flow channel 111 and the second flow channel 112. The heat exchange module further comprises a partition 7 arranged in at least part of the connecting channel 6 to separate the connecting channel 6 into a first channel 6a and a second channel 6b independent of each other, the first channel 6a is in communication with the first flow channel 111, and the second channel 6b is in communication with the second flow channel 112.
[0073] Here, independent of each other means that the first channel 6a and the second channel 6b are not in communication with each other within the respective extension ranges of the first channel 6a and the second channel 6b.
[0074] In the embodiment, the first groove 42 and the second groove 52 are butted to form the connecting channel 6, so that the flow channel 11 of the heat exchange plate 1 is communicated with the flow channel 11 of another heat exchange plate 1, the heat exchange medium interface 21 and the return flow plate 3 without additional communication structure (such as a pipeline), thereby reducing the cost.
[0075] In the embodiment, only a part of the connecting channels 6 can be provided with the partition 7. For example, the partition 7 can be provided in the connecting channel 6 formed by the connection of the second connecting structure 5 of the interface plate 2 and the first connecting structure 4 of the heat exchange plate 1, and the connecting channel 6 formed by the connection of the first connecting structure 4 and the second connecting structure 5 of the adjacent heat exchange plate 1, so as to divide the connecting channel 6 into the first channel 6a and the second channel 6b. The connecting channel 6 formed by the connection of the second connecting structure 5 of the heat exchange plate 1 and the first connecting structure 4 of the return flow plate 3 does not need to be divided into the first channel 6a and the second channel 6b. Since the connecting channel 6 is communicated with the first flow channel 111 and the second flow channel 112, the return flow can be directly realized by the connecting channel 6, without additional return flow channel on the return flow plate 3, thereby reducing the cost and the difficulty of manufacturing the return flow plate 3. Of course, in some other embodiments, the partition 7 can be provided in all the connecting channels 6, and the return flow channel can be provided on the return flow plate 3 to realize the communication of the first flow channel 111 and the second flow channel 112.
[0076] In some embodiments, referring to Figure 5 , the partition 7 includes a first partition structure 71 and a second partition structure 72. The first partition structure 71 is arranged in the first groove 42 of the heat exchange plate 1, and the second partition structure 72 is arranged in the second groove 52 of the heat exchange plate 1 and the interface plate 2. When the first plate body 41 and the second plate body 51 are butted in the third direction, the first partition structure 71 and the second partition structure 72 abut in the first direction, so as to divide the connecting channel 6 into the first channel 6a and the second channel 6b which are independent of each other. The first channel 6a is communicated with the first flow channel 111, and the second channel 6b is communicated with the second flow channel 112.
[0077] In the embodiment, the connecting channel 6 is divided by the cooperation of the first partition structure 71 and the second partition structure 72. The connection mode is relatively low in requirement for the butting precision, can simplify the assembly operation, and can improve the yield of the heat exchange module (the requirement for the tolerance can be reduced).
[0078] On the other hand, in the embodiment, the first partition structure 71 is not arranged on the first plate body 41 of the return flow plate 3, so that referring to Figure 5The first groove 42 of the first plate body 41 of the return flow plate 3 and the connecting channel 6 formed by the abutment of the second groove 52 of the second plate body 51 of the heat exchange plate 1 are not divided into the first channel 6a and the second channel 6b, thereby achieving the return flow. The advantage of achieving the return flow in this way is that no additional return flow channel needs to be provided on the return flow plate 3, and the arrangement of the partition 7 on part of the heat exchange plate 1 does not need to be changed to make the connecting channel 6 not be divided (in this way, each heat exchange plate 1 can have the same structure).
[0079] In some embodiments, with reference to Figures 6-8 The first partition structure 71 includes at least one first protrusion 711, and the second partition structure 72 includes at least one second protrusion 721 corresponding to the first protrusion 711. The first protrusion 711 and the second protrusion 721 are recessed to form a stepped surface on at least one side in the first direction. When the first plate body 41 and the second plate body 51 abut in the third direction, the stepped surfaces of the first protrusion 711 and the second protrusion 721 abut each other.
[0080] In this embodiment, the stepped surfaces of the first protrusion 711 and the second protrusion 721 abut each other, which can improve the sealing performance of the first partition structure 71 and the second partition structure 72 after abutting each other, and reduce the probability of the heat exchange medium flowing to the other side through the joint of the first partition structure 71 and the second partition structure 72.
[0081] The first protrusion 711 and the second protrusion 721 can have a stepped surface on only one side, or can have a stepped surface on both sides (i.e., the whole is in the shape of a "convex" character), which is not limited.
[0082] In some embodiments, with reference to Figures 6-9 At least one of the first connecting structure 4 and the second connecting structure 5 includes a sealing strip 43, and at least the other forms a sealing groove 53. When the first connecting structure 4 and the second connecting structure 5 are connected, the sealing strip 43 is located in the sealing groove 53. In this way, the sealing performance of the first connecting structure 4 and the second connecting structure 5 when they are connected can be further improved, and the risk of leakage of the heat exchange medium through the connecting channel 6 can be reduced.
[0083] As an example, the first connecting structure 4 can include the sealing groove 53, and the second connecting structure 5 can include the sealing strip 43. Alternatively, the first connecting structure 4 can include the sealing strip 43, and the second connecting structure 5 can include the sealing groove 53. Alternatively, the first connecting structure 4 can include the sealing groove 53 and the sealing strip 43, and the second connecting structure 5 can also include the sealing groove 53 and the sealing strip 43. The sealing strip 43 of the first connecting structure 4 is located at a position corresponding to the sealing groove 53 of the second connecting structure 5, and the sealing groove 53 of the first connecting structure 4 is located at a position corresponding to the sealing strip 43 of the second connecting structure 5. Those skilled in the art can choose according to actual use requirements, which is not limited.
[0084] The sealing strip 43 can be a strip structure made of rubber material or other flexible material, which forms an interference fit with the corresponding sealing groove 53 to achieve a better sealing effect.
[0085] In some embodiments, still referring to Figure 6 and Figure 9 , the first flow channel 111 and the second flow channel 112 form openings on the opposite side surfaces of the plate-shaped body 12 along the first direction, the sealing strip 43 includes a first section extending along the outer edge of the opening, a second section extending along the abutting surface of the first plate body 41 and the second plate body 51, and a third section extending along the end surface of the first plate body 41 and the second plate body 51 along the first direction, and the first connecting structure 4 and the second connecting structure 5 are connected to form a ring-shaped closed structure.
[0086] In this embodiment, the extension range of the sealing strip 43 covers almost all the gaps around the connecting channel 6, so that the sealing effect can be further improved.
[0087] In some embodiments, referring to Figures 6-9 , one of the first plate body 41 and the second plate body 51 is formed with a plurality of threaded holes, and the other is formed with a plurality of through holes corresponding to the plurality of threaded holes one by one, and the through holes and the threaded holes are also abutted and penetrate the first plate body 41 and the second plate body 51 along the third direction when the first plate body and the second plate body are abutted along the third direction, so that the connecting bolts can be screwed through the through holes and the threaded holes during actual use to achieve the fixed connection of the corresponding first plate body 41 and the second plate body 51. Of course, the first plate body 41 and the second plate body 51 can also be fixedly connected by using, for example, a buckle structure, a mortise and tenon structure, etc., which is not limited.
[0088] The specific number and position of the threaded holes and the through holes are not limited, as long as they can relatively stably fix the first plate body 41 and the second plate body 51.
[0089] In some embodiments, one of the first connecting structure 4 and the second connecting structure 5 includes a positioning block 44, and the other includes a positioning groove 54, and the positioning block 44 is clamped into the positioning groove 54 when the first connecting structure 4 and the second connecting structure 5 are connected. The cooperation of the positioning block 44 and the positioning groove 54 can achieve the effect of positioning, thereby simplifying the assembly operation.
[0090] As an example, the positioning block 44 and the positioning groove 54 can be configured to abut the corresponding first plate body 41 and the second plate body 51, abut the corresponding first groove 42 and the second groove 52, and abut the corresponding first separation structure 71 and the second separation structure 72 when the corresponding positioning block 44 is clamped into the positioning groove 54.
[0091] In some embodiments, the positioning groove 54 has an opening portion and an expansion portion connected to the opening portion along the first direction, the projection area of the opening portion on a projection plane perpendicular to the first direction is smaller than the projection area of the expansion portion, the positioning groove 54 is open along one side of the third direction, the positioning block 44 is clamped into the corresponding positioning groove 54 along the third direction, and is constrained in the positioning groove 54 along the first direction. In this way, the positioning block 44 and the positioning groove 54 can not only play a positioning role, but also limit the relative movement between the corresponding first plate body 41 and the second plate body 51, so that they are fixed after being butted, and then they are fixed and connected by means of, for example, the connecting bolts mentioned above.
[0092] As an example, the positioning block 44 and / or the positioning groove 54 can be dovetail-shaped, trapezoidal, spherical, etc., without limitation.
[0093] One of the positioning block 44 and the positioning groove 54 can be formed on the side surface of the plate-shaped body, the body of the interface plate 2, or the body of the return plate 3 along the first direction, and the other can be formed on the side surface of the first plate body 41 or the second plate body 51 along the first direction.
[0094] In some embodiments, referring to Figure 5 and Figure 6 , the heat exchange plate 1 includes a flow disturbance structure 13 connected to the flow channel 11. The flow disturbance structure 13 can increase the flowability of the heat exchange medium, and thus improve the heat exchange effect.
[0095] In the embodiments in which the flow channel 11 includes the first flow channel 111 and the second flow channel 112, only one of the first flow channel 111 and the second flow channel 112 can be connected to the flow disturbance structure 13, or both of them can be connected to the flow disturbance structure 13, without limitation.
[0096] In some embodiments, referring to Figure 5 , the flow disturbance structure 13 includes a plurality of flow disturbance pieces 131, and the plurality of flow disturbance pieces 131 are distributed in a labyrinth shape. In this way, the flow disturbance effect can be improved, and thus the heat exchange effect can be improved.
[0097] As an example, the flow disturbance piece 131 can be an arc-shaped piece structure, and the plurality of flow disturbance pieces 131 can be distributed in a substantially concentric circular shape, thereby forming a substantially annular labyrinth structure. Obviously, the arrangement of the flow disturbance structure 13 is not limited to this, and the flow disturbance structure 13 can also be an integral structure and have a plurality of flow disturbance surfaces intersecting the extension direction of the flow channel 11.
[0098] In the above embodiments, referring to Figure 6The heat exchange plate 1 includes a plate body 12 and a cover plate 14. The flow channel 11 is arranged on the plate body 12 and extends in a direction perpendicular to the thickness direction of the plate body 12, such as extending along the first direction. At least one side surface of the plate body 12 along the thickness direction has a hollowed-out portion 12a. In a projection plane perpendicular to the thickness direction of the plate body 12, the projection of the hollowed-out portion 12a covers the projection of the turbulence structure 13. The cover plate 14 is detachably connected with the plate body 12 and covers the hollowed-out portion 12a.
[0099] In this way, in the actual manufacturing process, the turbulence structure 13 can be placed into the flow channel 11 through the hollowed-out portion 12a, and then the cover plate 14 is connected with the plate body 12 to enclose the turbulence structure 13, thereby reducing the manufacturing difficulty. The plate body 12 can have the hollowed-out portion 12a on only one side along the thickness direction, or can have the hollowed-out portion 12a on both sides, which is not limited.
[0100] In this embodiment, the cover plate 14 can be sealingly connected with the plate body 12, thereby reducing the risk of leakage of the heat exchange medium through the connection between the plate body 12 and the cover plate 14.
[0101] In some embodiments, the cover plate 14 has a higher thermal conductivity than the plate body 12. In this way, on the one hand, the cover plate 14 cooperates with the turbulence structure 13 to further improve the heat exchange effect. On the other hand, the plate body 12 can be made of a material with relatively poor thermal conductivity but lower cost, thereby reducing the cost.
[0102] For example, the cover plate 14 can be made of a metal material, and the plate body 12 can be made of an injection molding material.
[0103] In some embodiments, the surface of the cover plate 14 protrudes from the surface of the plate body 12, thereby enabling the surface of the cover plate 14 to be in closer contact with the component to be heat exchanged, thereby improving the heat exchange effect. On the other hand, since the cover plate 14 is detachably connected with the plate body 12, different thicknesses of the cover plate 14 can be replaced according to the specific structure of the component to be heat exchanged, thereby further improving the use flexibility of the heat exchange module.
[0104] Embodiments of the present application also provide a heat exchange device, which refers to Figure 10 and Figure 11 The heat exchange device includes a housing 100, at least one heat exchange module 200 as described in any of the above embodiments, and a heat exchange medium pipeline 300. The heat exchange module 200 is detachably connected with the housing 100, and the heat exchange medium pipeline 300 is in communication with the flow channel 11.
[0105] The heat exchange device of the embodiments of the present application has all the advantages of the heat exchange module as described in any of the above embodiments, which will not be repeated here.
[0106] The specific structure of the shell 100 is not limited. The number of the heat exchange modules 200 can be one or multiple. In the case of multiple heat exchange modules, the number of the heat exchange plates 1 in the multiple heat exchange modules can be the same or different, which is not limited, and a person skilled in the art can set it according to the actual use demand.
[0107] In some embodiments, the shell 100 can have a mounting groove 100a, and the outer surface of the shell 100 has a heat dissipation fin (not shown in the figure). The heat exchange module can be embedded in the mounting groove 100a. In this way, in actual use, not only the heat exchange module can be attached to the component to be heat exchanged, but also the shell 100 can be attached to the component to be heat exchanged. Since the outer surface of the shell 100 has a heat dissipation fin, the shell 100 can passively dissipate heat to the component to be heat dissipated. In this way, the heat exchange effect can be improved, and for the parts with low heat dissipation demand, only the shell 100 can be used for heat dissipation, thereby saving resources.
[0108] Taking the application of the heat exchange device to the vehicle controller as an example, the heat exchange module can be arranged at the position corresponding to the high-power chip, thereby actively dissipating heat to the high-power chip, and the shell 100 is in contact with the position corresponding to the low-power chip, thereby passively dissipating heat to the low-power chip.
[0109] Further, in the present embodiment, the mounting groove 100a can be a structure open on both sides in the thickness direction, so that the heat exchange module and the shell 100 can be in contact with the component to be heat exchanged on both sides in the thickness direction for heat exchange.
[0110] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, a person skilled in the art can combine different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.
[0111] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A heat exchange module, characterized in that, The heat exchange module includes: At least one heat exchange plate, the heat exchange plate having a flow channel, a first connecting structure and a second connecting structure, wherein, when there are multiple heat exchange plates, in two adjacent heat exchange plates, the first connecting structure of one heat exchange plate is detachably connected to the second connecting structure of the other heat exchange plate, and the flow channels of the two adjacent heat exchange plates are in communication with each other.
2. The heat exchange module according to claim 1, characterized in that, The heat exchange module also includes: At least one interface plate, the interface plate having a heat exchange medium interface and a second connection structure, the second connection structure of the interface plate being detachably connected to the first connection structure of a heat exchange plate, and the heat exchange medium interface communicating with the flow channel of the heat exchange plate.
3. The heat exchange module according to claim 2, characterized in that, The flow channel includes a first flow channel and a second flow channel. When there are multiple heat exchange plates, the first flow channels of two adjacent heat exchange plates are connected to each other, and the second flow channels are also connected to each other. The heat exchange medium interface includes a first interface and a second interface. The first interface is connected to the first flow channel, and the second interface is connected to the second flow channel.
4. The heat exchange module according to claim 3, characterized in that, The heat exchange module also includes: A reflux plate has the first connecting structure, wherein the first connecting structure of the reflux plate is detachably connected to the second connecting structure of a heat exchange plate, and forms a channel connecting the first flow channel and the second flow channel of the heat exchange plate.
5. The heat exchange module according to claim 3 or 4, characterized in that, The heat exchange plate includes a plate-shaped body, and the first flow channel and the second flow channel are formed on the plate-shaped body. The first flow channel and the second flow channel extend along a first direction and are arranged side by side along a second direction. The thickness direction of the plate-shaped body is parallel to a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.
6. The heat exchange module according to claim 5, characterized in that, The first connecting structure includes a first plate, and the second connecting structure includes a second plate. In one heat exchange plate, the first plate and the second plate are located on opposite sides of the plate-shaped body along the first direction. When the first connecting structure and the second connecting structure are connected, the first plate and the second plate are mated along the third direction.
7. The heat exchange module according to claim 6, characterized in that, The plate-shaped body has a first surface and a second surface along the third direction. One side surface of the first plate along the third direction is coplanar with the first surface, and the other side surface is formed as a mating surface. One side surface of the second plate along the third direction is coplanar with the second surface, and the other side surface is formed as a mating surface. In one heat exchange plate, the first plate and the second plate both form a stepped structure with the plate-shaped body.
8. The heat exchange module according to claim 7, characterized in that, The mating surface of the first plate is recessed to form a first groove, and the mating surface of the second plate is recessed to form a second groove. When the mating surfaces of the first plate and the second plate are mated along the third direction, the first groove and the second groove together form a connecting channel. The connecting channel is connected to both the first flow channel and the second flow channel. The heat exchange module further includes: A separator is disposed within at least a portion of the connecting channel to divide the connecting channel into a first channel and a second channel that are independent of each other, the first channel being in communication with the first flow channel and the second channel being in communication with the second flow channel.
9. The heat exchange module according to claim 8, characterized in that, The separator includes a first separator structure and a second separator structure. The first separator structure is disposed in the first groove of the heat exchange plate, and the second separator structure is disposed in the second groove of the heat exchange plate and the interface plate. When the mating surfaces of the first plate and the second plate are mated along the third direction, the first separator structure and the second separator structure abut against each other in the first direction, thereby separating the connection channel into the first channel and the second channel.
10. The heat exchange module according to claim 9, characterized in that, The first partition structure includes at least one first protrusion, and the second partition structure includes at least one second protrusion corresponding to the first protrusion. The first protrusion and the second protrusion are recessed on at least one side along the first direction to form a stepped surface. When the first plate and the second plate are connected along the third direction, the stepped surfaces of the first protrusion and the second protrusion abut against each other.
11. The heat exchange module according to any one of claims 6-10, characterized in that, At least one of the first connecting structure and the second connecting structure includes a sealing strip, and at least the other has a sealing groove. When the first connecting structure and the second connecting structure are connected, the sealing strip is located in the sealing groove.
12. The heat exchange module according to claim 11, characterized in that, The first flow channel and the second flow channel form openings on opposite sides of the plate-shaped body along the first direction. The sealing strip includes a first segment extending along the outer edge of the opening, a second segment extending along the mating surface of the first plate and the second plate, and a third segment extending along the end face of the first plate and the second plate along the first direction. When the first connecting structure and the second connecting structure are connected, the first segment, the second segment and the third segment are connected to form a ring-shaped closed structure.
13. The heat exchange module according to any one of claims 6-10, characterized in that, One of the first plate and the second plate has a plurality of threaded holes, and the other has a plurality of through holes corresponding to the plurality of threaded holes. When the first plate and the second plate are connected along the third direction, the through holes and the threaded holes are connected along the third direction and penetrate the first plate and the second plate.
14. The heat exchange module according to any one of claims 6-10, characterized in that, One of the first connecting structure and the second connecting structure includes a positioning block, and the other includes a positioning groove. When the first connecting structure and the second connecting structure are connected, the positioning block is engaged in the positioning groove.
15. The heat exchange module according to claim 14, characterized in that, The positioning groove has an opening and an expansion portion connected to the opening along the first direction. On a projection plane perpendicular to the first direction, the projected area of the opening is smaller than the projected area of the expansion portion. The positioning groove is open on one side along the third direction. The positioning block is inserted into the positioning groove along the third direction and is constrained within the positioning groove along the first direction.
16. The heat exchange module according to claim 1, characterized in that, The heat exchange plate includes a turbulence structure that communicates with the flow channel.
17. The heat exchange module according to claim 16, characterized in that, The turbulence structure includes multiple turbulence vanes, which are arranged in a labyrinthine pattern.
18. The heat exchange module according to claim 17, characterized in that, The heat exchange plate includes a plate-shaped body and a cover plate. The flow channel is disposed on the plate-shaped body and extends in a direction perpendicular to the thickness direction of the plate-shaped body. At least one side surface of the plate-shaped body along the thickness direction has a hollow portion. On a projection plane perpendicular to the thickness direction of the plate-shaped body, the projection of the hollow portion covers the projection of the turbulence structure. The cover plate is detachably connected to the plate-shaped body and covers the hollow portion.
19. The heat exchange module according to claim 18, characterized in that, The thermal conductivity of the cover plate is higher than that of the plate-shaped body.
20. The heat exchange module according to claim 19, characterized in that, The surface of the cover plate protrudes from the surface of the plate-shaped body.
21. A heat exchange device, characterized in that, The heat exchange device includes: case; At least one heat exchange module according to any one of claims 1-20 is detachably connected to the housing; and The heat exchange medium pipeline is connected to the flow channel.