Circuit board and electronic control device

Abstract

The circuit board includes a substrate main body, a first electronic component, a contact prevention component, and a cover-equipped electronic component. The protruding height of the first electronic component and the contact prevention component from the mounting surface is set to be higher than the protruding height of the cover-equipped electronic component. A first upper end portion on a first electronic component side of the electronic component with the cover is accommodated in a space formed by a wire connecting a mounting end portion on a mounting surface side of the contact prevention component from the upper end portion of the first electronic component and the mounting surface. A second upper end portion of the cover-equipped electronic component on the contact prevention component side is accommodated in a space formed by a wire connecting the mounting end portion of the mounting surface side of the first electronic component from the upper end portion of the contact prevention component and the mounting surface.

Description

TECHNICAL FIELD

[0001] The present application relates to a circuit board and an electronic control device. BACKGROUND

[0002] An electronic control device having electronic components that control a vehicle is provided in a vehicle. In recent years, in order to realize a high-performance driving assist system such as a brake system that can avoid a collision, automatic driving, and the like, it is required that an electronic control device mounted on a vehicle has high computing performance. Therefore, a quartz crystal resonator or a quartz crystal oscillator that can achieve high-speed and stable signal synchronization is built in the electronic control device. Such a ceramic package product such as a quartz crystal resonator has a lid provided on an upper portion. Hereinafter, such an electronic component is referred to as a lid-equipped electronic component. Furthermore, in order to prevent the lid provided on the upper portion from falling off due to contact at the time of an inspection process, it is necessary to prevent stress from the outside with respect to the lid-equipped electronic component.

[0003] As such a technology, for example, there is the technology described in Patent Literature 1. In Patent Literature 1, a technology is described in which, in a circuit board on which a plurality of electronic components are mounted, an electronic component to be protected is arranged in the vicinity of an electronic component that is higher in height than these electronic components. At this time, the electronic component to be protected is arranged so as to be completely housed in a space formed by a point of the electronic component on the electronic component side, a mounting surface of the circuit board, and a plane that passes through an end portion of the circuit board and contacts the electronic component on an upper portion thereof.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 2002-43715 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] However, in the technology described in Patent Literature 1, although the electronic component can be protected with respect to stress from an upper portion orthogonal to the plane of the substrate, the electronic component cannot be protected with respect to stress from a side surface parallel to the plane of the substrate. As a result, in the technology described in Patent Literature 1, there is a possibility that the lid of the electronic component falls off due to stress at the time of an inspection process or the like.

[0009] An object of the present application is to provide a circuit board and an electronic control device that can protect a lid-equipped electronic component with respect to stress from the outside, in consideration of the above-described problems.

[0010] MEANS FOR SOLVING THE PROBLEMS

[0011] To solve the above problems and achieve the object, the circuit board is provided with: a substrate main body; a first electronic component mounted on a mounting surface of the substrate main body; a contact prevention component; and a cover-equipped electronic component. The contact prevention component is mounted on the mounting surface of the substrate main body and is disposed closer to an end portion of the substrate main body than the first electronic component. The cover-equipped electronic component is mounted on the mounting surface of the substrate main body and is disposed between the first electronic component and the contact prevention component. The protrusion height of the first electronic component and the contact prevention component from the mounting surface is set to be higher than the protrusion height of the cover-equipped electronic component.

[0012] Further, a first upper end portion of the first electronic component side of the cover-equipped electronic component is housed in a space formed by a line connecting a mounting end portion on the mounting surface side of the first electronic component from an upper end portion of the first electronic component and the mounting surface. Also, a second upper end portion of the contact prevention component side of the cover-equipped electronic component is housed in a space formed by a line connecting a mounting end portion on the mounting surface side of the contact prevention component from an upper end portion of the contact prevention component and the mounting surface.

[0013] In addition, the electronic control device is provided with a circuit board and a connector. As the circuit board, the above-described circuit board is employed.

[0014] Effects of the Invention

[0015] According to the circuit board and the electronic control device configured as described above, the cover-equipped electronic component can be protected with respect to stress from the outside. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is an external view of a circuit board of an electronic control device of a first embodiment.

[0017] Figure 2 is a cross-sectional view of the circuit board of the first embodiment.

[0018] Figure 3 is a cross-sectional view of a conventional circuit board.

[0019] Figure 4 is a plan view of the circuit board of the first embodiment.

[0020] Fig. 5 shows a state in which a connector is mounted on the circuit board of the first embodiment, Figure 5A is a front view, Figure 5B is a rear view.

[0021] Figure 6 is a cross-sectional view of a circuit board of a second embodiment. DETAILED DESCRIPTION

[0022] Hereinafter, with reference to Figures 1-6 Embodiments of an electronic control device and a circuit board will be described. In each drawing, the same reference numerals are assigned to common components.

[0023] 1. First Implementation Method

[0024] First, refer to Figures 1 to 5B The structure of the electronic control device and circuit board involved in the first embodiment (hereinafter referred to as "this example") will be described.

[0025] Figure 1 This is a top view showing the substrate of the electronic control device. Figure 2 This is a cross-sectional view of the electronic control device.

[0026] Figure 1 and Figure 2 The device shown is a circuit board for the electronic control system mounted on a car and controlling the vehicle. For example... Figure 1 and Figure 2 As shown, the circuit board 100 includes a flat substrate body 10, a first electronic component 1, a second electronic component 2, and a third electronic component 3.

[0027] First electronic component 1, second electronic component 2, and third electronic component 3 are mounted on the mounting surface 10b of the substrate body 10. First electronic component 1 and second electronic component 2 are electronic components with a lower failure rate relative to external stress than the third electronic component 3, which will be described later. For example, capacitors, SOCs (System on a Chip), etc., are used as first electronic component 1 and second electronic component 2. In this example, an SOC is used as first electronic component 1, and a capacitor or a dummy capacitor is used as second electronic component 2.

[0028] The second electronic component 2, representing the contact prevention component, is positioned closer to the end 10a of the substrate body 10 than the first electronic component 1 and the third electronic component 3. Furthermore, the third electronic component 3 is positioned closer to the end 10a of the substrate body 10 than the first electronic component 1. Additionally, the third electronic component 3 is positioned near the first electronic component 1 and the second electronic component 2. Specifically, the third electronic component 3 is positioned between the first electronic component 1 and the second electronic component 2. That is, the third electronic component 3 is positioned such that it is sandwiched between the first electronic component 1 and the second electronic component 2.

[0029] The third electronic component 3 is a covered electronic component, and it has a higher failure rate relative to external stress than the first electronic component 1 and the second electronic component 2. The third electronic component 3 uses a ceramic package such as a gyroscope sensor or a quartz crystal resonator. In this example, a quartz crystal resonator is used as the third electronic component 3.

[0030] The height at which the first electronic component 1 and the second electronic component 2 protrude from the mounting surface 10b is set to be higher than that of the third electronic component 3. Therefore, asFigure 2 As shown, the third electronic component 3 is housed in the space formed by the upper end line P1 connecting the upper end 1a of the first electronic component 1 and the upper end 2a of the second electronic component 2 and the mounting surface 10b.

[0031] Figure 3 It is a cross-sectional view of an existing circuit board.

[0032] like Figure 3 As shown, the existing circuit board 200 has a first electronic component 1, a second electronic component 21, and a third electronic component 3 (which is a covered electronic component) mounted on a substrate body 10. The third electronic component 3 is disposed between the first electronic component 1 and the second electronic component 21. Furthermore, the height at which the second electronic component 21, mounted on the end 10a side of the substrate body 10, protrudes from the mounting surface 10b is lower than that of the third electronic component 3. Therefore, the third electronic component 3 extends beyond the upper end 21a of the second electronic component 21 in the direction protruding from the mounting surface 10b.

[0033] Therefore, in the existing circuit board 200, during inspection processes, fingers, inspection fixtures, etc., can come into contact with the third electronic component 3 from the end 10a side of the substrate body 10. As a result, the cover of the third electronic component 3 may detach due to external stress, causing the third electronic component 3 to malfunction.

[0034] In contrast, in the circuit board 100, the height of the first electronic component 1 and the second electronic component 2 is greater than that of the third electronic component 3. The third electronic component 3 is housed within the space formed by the upper end line P1 connecting the upper end 1a of the first electronic component 1 and the upper end 2a of the second electronic component 2, and the mounting surface 10b. Therefore, it is possible to prevent fingers, inspection fixtures, etc., from contacting the third electronic component from the end 10a side of the substrate body 10. Thus, the third electronic component, as a covered electronic component, can be protected against external stress.

[0035] Furthermore, the first upper end portion 3a of the third electronic component 3 on the side of the first electronic component 1 is accommodated within the space formed by the line P2 connecting the upper end portion 1a of the first electronic component 1 to the mounting end portion 2b on the side of the mounting surface 10b of the second electronic component 2 and the mounting surface 10b. This prevents fingers or examination fixtures from contacting the first upper end portion 3a of the third electronic component 3 from the side of the first electronic component 1.

[0036] Furthermore, the second upper end portion 3b of the third electronic component 3 on the side of the second electronic component 2 is accommodated within the space formed by the line P3 connecting the upper end portion 2a of the second electronic component 2 to the mounting end portion 1b on the mounting surface 10b side of the first electronic component 1 and the mounting surface 10b. This prevents fingers, inspection fixtures, and the like from contacting the second upper end portion 3b of the third electronic component 3 from the side of the second electronic component 2.

[0037] Figure 4 is a plan view of the circuit board 100 of the present example.

[0038] As shown in Figure 4 , the circuit board 100 of the present example has a plurality of second electronic components 2, 2 mounted on the substrate main body 10. The plurality of second electronic components 2 are arranged with a sufficiently narrow interval so that a finger, an inspection jig, or the like cannot enter. The length of the width direction of the first electronic component 1 in the direction parallel to the mounting surface 10b of the substrate main body 10 is set to be longer than the length of the width direction of the third electronic component 3. In addition, the length of the width direction of the plurality of second electronic components 2, 2 from one end portion 2c to the other end portion 2d is set to be longer than the length of the width direction of the third electronic component 3.

[0039] Here, a line extending in parallel to the mounting surface 10b from the one end portion 2c of the plurality of second electronic components 2, 2 toward the first electronic component 1 is taken as a first line Q1. In addition, a line extending in parallel to the mounting surface 10b from the other end portion 2d of the plurality of second electronic components 2, 2 toward the first electronic component 1 is taken as a second line Q2. At this time, the third electronic component 3 is arranged between the first line Q1 and the second line Q2. That is, when the first electronic component 1 and the second electronic components 2, the third electronic component 3 are viewed from the end portion 10a of the substrate main body 10 in the direction parallel to the mounting surface 10b, the third electronic component 3 is covered by the second electronic components 2. Therefore, the third electronic component 3 is housed in a space formed by the upper end line P1 and the first line Q1 and the second line Q2 and the mounting surface 10b as shown in Figure 2

[0040] In this way, the third electronic component 3 is arranged surrounded by the first electronic component 1 and the second electronic components 2, 2. Thus, according to the circuit board 100 of the present example, it is possible to prevent a finger, an inspection jig, or the like from contacting the third electronic component 3, and it is possible to protect the third electronic component as a cover electronic component with respect to stress from the outside.

[0041] In addition, in the present example, an example in which a plurality of second electronic components 2 are mounted in parallel is described, but it is not limited thereto, and the number of second electronic components 2 as contact prevention components can be only one. In this case, the length of the width direction of one second electronic component 2 from the one end portion 2c to the other end portion 2d is set to be longer than the length of the width direction of the third electronic component 3.

[0042] Figure 5A and Figure 5B indicates a state in which a connector is mounted on the circuit board 100 of the present example, Figure 5A is a front view, Figure 5B is a rear view.

[0043] ​In this case, the third electronic component 3 is likely to become a noise source when a quartz crystal resonator is used as the third electronic component 3 with a cover. Therefore, in a case where the analog component, i.e., the connector 4, which is likely to be affected by noise, is mounted on the substrate main body 10, the connector 4 is mounted on the back surface on the opposite side from the mounting surface 10b on which the third electronic component 3 is mounted. That is, the connector 4 and the third electronic component 3 are arranged in a direction perpendicular to the mounting surface 10b of the substrate main body 10 with respect to each other. Thus, it is possible to suppress the influence of noise from the third electronic component 3 on the connector 4. As a result, it is not necessary to provide an EMC countermeasure component, and it is possible to reduce costs.

[0044] In addition, the electronic control device is configured by mounting the connector 4 on the circuit board 100.

[0045] 2. Second Embodiment

[0046] Next, the circuit board of the second embodiment will be described with reference to Figure 6 The circuit board of the second embodiment will be described.

[0047] Figure 6 is a cross-sectional view showing the circuit board of the second embodiment.

[0048] The circuit board 100B of the second embodiment differs from the circuit board 100 of the first embodiment in that a ground is mounted. Therefore, the protective member will be described here, and the same reference numerals are assigned to portions common to the circuit board 100 of the first embodiment, and repeated descriptions will be omitted.

[0049] As shown in Figure 6 , the circuit board 100B includes the substrate main body 10, the first electronic component 1, the second electronic component 2, the third electronic component 3, the signal ground 5, and the frame ground 6. Like the first electronic component 1, the second electronic component 2, and the third electronic component 3, the signal ground 5 and the frame ground 6 are mounted on the mounting surface 10b of the substrate main body 10. The signal ground 5 and the frame ground 6 are arranged closer to the end portion 10a side of the substrate main body 10 than the second electronic component 2.

[0050] In addition, the second electronic component 2 is connected to the signal ground 5 and the frame ground 6. Thus, by connecting the second electronic component 2 as a contact prevention component to various grounds mounted on the substrate main body 10, it is possible to improve noise resistance to electromagnetic noise, and it is possible to implement an EMC countermeasure. In addition, the second electronic component 2 as a contact prevention component functions as a component of the EMC countermeasure, and thus it is possible to prevent an increase in the number of components, and it is possible to reduce costs when the circuit board 100B is manufactured.

[0051] The other configurations are the same as those of the circuit board 100 of the first embodiment, and thus the description thereof is omitted. The same effects as those of the circuit board 100 of the first embodiment can also be obtained by the circuit board 100B of the second embodiment.

[0052] In addition, the embodiments described above and shown in the drawings are merely illustrative and do not limit the present application, and various modifications can be made without departing from the scope of the present application described in the claims. In addition, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, or the configuration of one embodiment can be added with the configuration of another embodiment. Furthermore, a part of the configuration of another embodiment can be added, deleted, or replaced with another configuration.

[0053] In addition, in the present specification, the words "parallel" and "orthogonal" are used, but these mean not only strict "parallel" and "orthogonal", but also "substantially parallel" or "substantially orthogonal" within a range in which the functions thereof can be exerted.

[0054] Explanation of Symbols

[0055] 1... first electronic component, 1a... upper end portion, 1b... mounting end portion, 2... second electronic component (contact prevention component), 2a... upper end portion, 2b... mounting end portion, 2c... one end portion, 2d... other end portion, 3... third electronic component (tape-automated bonding electronic component), 3a... first upper end portion, 3b... second upper end portion, 4... connector, 5... signal ground, 6... frame ground, 10... substrate main body, 10a... end portion, 10b... mounting surface, 100, 100B... circuit board, P1... upper end line, P2, P3... line, Q1... first line, Q2... second line.

Claims

1. A circuit board, characterized in that, have: substrate body; A first electronic component is mounted on the mounting surface of the substrate body; A contact prevention component is mounted on the mounting surface of the substrate body and is positioned closer to the end of the substrate body than the first electronic component. as well as A covered electronic component is mounted on the mounting surface of the substrate body and disposed between the first electronic component and the contact prevention component. The protrusion height of the first electronic component and the contact prevention component from the mounting surface is set to be higher than the protrusion height of the covered electronic component. The first upper end portion of the covered electronic component on the first electronic component side is housed within the space formed by the line connecting the upper end portion of the first electronic component to the mounting end portion on the mounting surface side of the contact prevention component and the mounting surface. The second upper end of the contact prevention component side of the covered electronic component is housed within the space formed by the line connecting the upper end of the contact prevention component to the mounting end of the first electronic component on the mounting surface side and the mounting surface.

2. The circuit board according to claim 1, characterized in that, The covered electronic component is disposed between the first line and the second line. The first line extends from one end of the contact prevention component in the width direction parallel to the mounting surface toward the first electronic component, and the second line extends from the other end of the contact prevention component in the width direction toward the first electronic component.

3. The circuit board according to claim 1, characterized in that, A grounding device connected to the contact prevention component is installed on the substrate body.

4. The circuit board according to claim 1, characterized in that, A connector is mounted on the substrate body. The connector is mounted on the back side, opposite to the mounting surface on which the covered electronic component is mounted.

5. The circuit board according to claim 1, characterized in that, The contact prevention component is a virtual capacitor.

6. An electronic control device, characterized in that, have: Circuit boards; and Connectors, which are mounted on the circuit board, The circuit board includes: substrate body; A first electronic component is mounted on the mounting surface of the substrate body; A contact prevention component is mounted on the mounting surface of the substrate body and is positioned closer to the end of the substrate body than the first electronic component. as well as A covered electronic component is mounted on the mounting surface of the substrate body and disposed between the first electronic component and the contact prevention component. The protrusion height of the first electronic component and the contact prevention component from the mounting surface is set to be higher than the protrusion height of the covered electronic component. The first upper end portion of the covered electronic component on the first electronic component side is housed within the space formed by the line connecting the upper end portion of the first electronic component to the mounting end portion on the mounting surface side of the contact prevention component and the mounting surface. The second upper end of the contact prevention component side of the covered electronic component is housed within the space formed by the line connecting the upper end of the contact prevention component to the mounting end of the first electronic component on the mounting surface side and the mounting surface.

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