Automatic wire welding machine and automatic wire welding process

Abstract

The invention discloses an automatic wire bonding machine and an automatic wire bonding process, and particularly relates to the technical field of automatic wire bonding machines, the device comprises a wire bonding machine body and a chip bonding pad, a wire feeding mechanism used for providing a welding material and a welding mechanism used for welding the chip bonding pad are arranged on the surface of a fixing frame, a metal wire is fed out through the wire feeding mechanism, and the welding mechanism is used for welding the chip bonding pad. A metal wire is fed into a welding head, a wire end is melted into a ball through an ignition rod, a lifting frame is started to drive a supporting frame to move, the welding head and a chopper are driven to move to a first bonding pad on the surface of a chip bonding pad through a fixing frame, spherical welding spots are completed through the welding head, and then the welding head conducts wire drawing and arc forming according to a track and moves to a second bonding pad to complete wedge-shaped welding spots. According to the automatic welding device, the first bonding pad and the second bonding pad are subjected to wire bonding, the chip bonding pads can be automatically welded, the welding efficiency is effectively improved, the process is automatically operated, manual intervention is reduced, and the welding quality consistency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automatic wire bonding machines, and more particularly to an automatic wire bonding machine and an automatic wire bonding process. BACKGROUND

[0002] With the rapid development of consumer electronics, new energy, Internet of Things and other fields, the market's performance requirements for LED and power devices are constantly improving, and devices are evolving towards high-density integration, high-current carrying and long-term stable operation. As a key link between internal chips and external circuits of the device, the wire bonding process (usually referred to as wire bonding) is directly related to the electrical performance, mechanical reliability and long-term stability of the device, and its technical importance is increasingly prominent.

[0003] However, on the one hand, traditional wire bonding equipment generally has a bottleneck in production efficiency. Material loading and unloading, solder joint alignment, soldering parameter adjustment and other links still rely on more manual intervention or semi-automatic operation, and the process cycle is long, which is difficult to meet the requirements of large-scale production for capacity climbing. On the other hand, the consistency and stability of the soldering quality cannot be guaranteed, and the solder joint alignment accuracy is highly dependent on the experience and visual judgment of the operator. Manual or semi-automatic positioning methods are easily affected by fatigue and subjectivity, resulting in large fluctuations in the alignment error between the chip pads and the lead frame, especially in advanced packaging with small pad size and dense pin pitch, which can easily cause short circuit, virtual welding and other defects.

[0004] Therefore, an automatic wire bonding machine and an automatic wire bonding process are proposed to solve the above problems. SUMMARY

[0005] The purpose of the present application is to provide an automatic wire bonding machine and an automatic wire bonding process.

[0006] The automatic wire bonding machine and the automatic wire bonding process provided by the present application adopt the following technical solutions:

[0007] An automatic wire bonding machine, comprising a wire bonding machine body and a chip pad, the surface of the wire bonding machine body is fixedly connected with a processing table, the inside of the wire bonding machine body is connected with two groups of lifting frames through linear guides, the top of the two groups of lifting frames is fixedly connected with a support frame, the surface of the support frame is connected with a fixed frame through a linear guide, the inside of the wire bonding machine body is provided with a transfer mechanism for transferring the chip pad to a welding position, the surface of the transfer mechanism is provided with a fixing mechanism for fixing the chip pad, the surface of the fixed frame is provided with a wire feeding mechanism for providing welding material and a welding mechanism for welding the chip pad, and the surface of the wire bonding machine body is provided with a positioning mechanism for visual positioning of the chip pad.

[0008] Preferably, the transferring mechanism comprises fixing blocks, driving motors, threaded rods, sliding blocks and connecting frames, two groups of the fixing blocks are fixedly connected inside the wire bonding machine body, driving motors are fixedly connected inside the two groups of fixing blocks, threaded rods are fixedly connected to one end of the two groups of driving motors, and the wire bonding machine body is rotationally connected to one end of the threaded rods.

[0009] Preferably, the surfaces of the two groups of threaded rods are threadedly connected with sliding blocks, and the surfaces of the two groups of sliding blocks are fixedly connected with connecting frames.

[0010] By adopting the above technical scheme, when the threaded rod rotates, it can drive the threadedly connected sliding block to move, so that the sliding block moves left and right inside the wire bonding machine body.

[0011] Preferably, the fixing mechanism comprises electric push rods, first clamping plates and second clamping plates, the surfaces of the two groups of sliding blocks are fixedly connected with electric push rods, one end of the electric push rods is fixedly connected with the first clamping plates, and the surface of the connecting frame is fixedly connected with the second clamping plates.

[0012] By adopting the above technical scheme, the chip pad is placed between the first clamping plate and the second clamping plate, and the electric push rod is started to drive the first clamping plate to move downward, so that a clamping is formed between the first clamping plate and the second clamping plate, so as to fix the chip pad.

[0013] Preferably, the surfaces of the first clamping plate and the second clamping plate are fixedly connected with sponge pads.

[0014] By adopting the above technical scheme, the first clamping plate and the second clamping plate will not damage the chip pad when clamping it.

[0015] Preferably, the welding mechanism comprises a welding head, a wedge and a cutter, the surface of the fixing frame is fixedly connected with the welding head, one end of the welding head is provided with the wedge, and one end of the welding head is provided with the cutter.

[0016] Preferably, the wire feeding mechanism comprises a wire feeding wheel, a wire spool and a striking rod, the surface of the fixing frame is provided with the wire feeding wheel, the surface of the wire feeding wheel is wound with the wire spool, one end of the wire spool is matched with the welding head, and one end of the welding head is provided with the striking rod.

[0017] Preferably, the positioning mechanism comprises a fixing rod and an identification camera, the surface of the wire bonding machine body is fixedly connected with the fixing rod, and the surface of the fixing rod is fixedly connected with the identification camera.

[0018] Preferably, the surface of the wire bonding machine body is provided with an operation panel, and the top surface of the wire bonding machine body is provided with a display.

[0019] Preferably, the automatic wire bonding process comprises the following steps:

[0020] Step one: open the wire bonding machine body, the internal control system automatically detects the state of each component;

[0021] Step two: place the chip pad between the first and second clamping plates through the external mechanical arm, then start the electric push rod to fix the chip pad through the first and second clamping plates;

[0022] Step three: move the chip pad to the welding position through the transfer mechanism, identify the position of the chip pad through the positioning mechanism, and feed back the accurate coordinates to the control system to ensure that the welding point alignment error meets the requirements;

[0023] Step four: send out the metal wire through the wire feeding mechanism, melt the wire end into a ball through the ignition rod, start the lifting frame to drive the support frame to move, and drive the welding head and the wedge to move to the first pad on the surface of the chip pad, complete the spherical welding point through the welding head, then the welding head pulls the wire into an arc according to the trajectory, moves to the second pad to complete the wedge-shaped welding point, so that the welding between the first pad and the second pad is completed, and then the wire is clamped and cut through the cutter;

[0024] Step five: after completing a group of welding points, move the chip pad to the next welding position through the transfer mechanism, repeat the above steps, and after all welding is completed, the chip pad is moved to the discharging position, and the equipment automatically starts the welding operation of the next batch of chip pads.

[0025] Technical effects and advantages of the present application:

[0026] Compared with the prior art, the automatic wire bonding machine and the automatic wire bonding process can identify the position of the chip pad through the recognition camera, feed back the accurate coordinates to the control system to ensure that the welding point alignment error meets the requirements, send out the metal wire through the wire feeding mechanism, melt the wire end into a ball through the ignition rod, start the lifting frame to drive the support frame to move, and drive the welding head and the wedge to move to the first pad on the surface of the chip pad, complete the spherical welding point through the welding head, then the welding head pulls the wire into an arc according to the trajectory, moves to the second pad to complete the wedge-shaped welding point, so that the welding between the first pad and the second pad is completed, and then the wire is clamped and cut through the cutter, after completing a group of welding points, move the chip pad to the next welding position through the transfer mechanism, repeat the above steps, and after all welding is completed, the chip pad is moved to the discharging position, and the equipment automatically starts the welding operation of the next batch of chip pads, so that it can automatically weld the chip pad, effectively improve the welding efficiency, realize automatic process operation, reduce manual intervention, and improve the consistency of the welding quality. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0028] Figure 2The schematic view of the cooperation structure between the wire bonder body and the operation panel of the present application;

[0029] Figure 3 The schematic view of the cooperation structure between the wire bonder body and the operation panel of the present application;

[0030] Figure 4 The schematic view of the cooperation structure between the wire bonder body and the operation panel of the present application;

[0031] Figure 5 The schematic view of the cooperation structure between the wire bonder body and the operation panel of the present application;

[0032] Figure 6 The schematic view of the cooperation structure between the wire bonder body and the operation panel of the present application;

[0033] Figure 7 The schematic view of the cooperation structure between the wire bonder body and the operation panel of the present application.

[0034] The figure marks are as follows: 1, the wire bonder body; 2, the processing table; 3, the lifting frame; 4, the support frame; 5, the transfer mechanism; 501, the fixed block; 502, the driving motor; 503, the threaded rod; 504, the sliding block; 505, the connecting frame; 6, the fixing mechanism; 601, the electric push rod; 602, the first clamping plate; 603, the second clamping plate; 7, the sponge pad; 8, the chip pad; 9, the fixing frame; 10, the welding head; 11, the wire feeding wheel; 12, the wire reel; 13, the ignition rod; 14, the fixed rod; 15, the identification camera; 16, the operation panel; 17, the display; 18, the cleaver; 19, the cutter. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0036] Embodiment 1

[0037] As Figures 1 to 7The automatic wire bonding machine shown includes a wire bonding machine body 1 and a chip pad 8, the surface of the wire bonding machine body 1 is fixedly connected with a processing table 2, the inside of the wire bonding machine body 1 is connected with two groups of lifting frames 3 through linear guides, so that the lifting frames 3 can move in the wire bonding machine body 1, the top of the two groups of lifting frames 3 is fixedly connected with a support frame 4, the lifting frames 3 can drive the support frame 4 to move up and down, the surface of the support frame 4 is connected with a fixed frame 9 through a linear guide, so that the fixed frame 9 can move left and right on the surface of the support frame 4, the inside of the wire bonding machine body 1 is provided with a transfer mechanism 5 for moving the chip pad 8 to a welding position, so that the chip pad 8 can be moved to the welding position for subsequent wire bonding, the surface of the transfer mechanism 5 is provided with a fixing mechanism 6 for fixing the chip pad 8, for clamping and fixing the chip pad 8, the surface of the fixed frame 9 is provided with a wire feeding mechanism for providing welding material and a welding mechanism for welding the chip pad 8, the surface of the wire bonding machine body 1 is provided with a positioning mechanism for visual positioning of the chip pad 8, which can identify the position of the chip pad 8 and feed back accurate coordinates to the control system to ensure that the welding point alignment error meets the requirements.

[0038] As a preferred implementation, the transfer mechanism 5 includes a fixed block 501, a drive motor 502, a threaded rod 503, a sliding block 504 and a connecting frame 505, the inside of the wire bonding machine body 1 is fixedly connected with two groups of fixed blocks 501, the inside of the two groups of fixed blocks 501 is fixedly connected with drive motors 502, one end of the two groups of drive motors 502 is fixedly connected with threaded rods 503, one end of the threaded rods 503 is rotatably connected with the wire bonding machine body 1, and the drive motor 502 can drive the threaded rod 503 to rotate.

[0039] As a preferred implementation, the surface of the two groups of threaded rods 503 is threadedly connected with the sliding blocks 504, the surface of the two groups of sliding blocks 504 is fixedly connected with the connecting frames 505, when the threaded rods 503 rotate, the threadedly connected sliding blocks 504 can be moved, so that the sliding blocks 504 move left and right in the inside of the wire bonding machine body 1.

[0040] As a preferred implementation, the fixing mechanism 6 includes an electric push rod 601, a first clamping plate 602 and a second clamping plate 603, the surface of the two groups of sliding blocks 504 is fixedly connected with the electric push rod 601, one end of the electric push rod 601 is fixedly connected with the first clamping plate 602, the surface of the connecting frame 505 is fixedly connected with the second clamping plate 603, the chip pad 8 is placed between the first clamping plate 602 and the second clamping plate 603, the electric push rod 601 is started to drive the first clamping plate 602 to move downward, so that a clamping is formed between the first clamping plate 602 and the second clamping plate 603, in order to fix the chip pad 8.

[0041] As a preferred implementation, the surface of the first and second clamping plates 602 and 603 is fixedly connected with a sponge pad 7, so that the first and second clamping plates 602 and 603 will not cause damage to the chip pad 8 when clamping the chip pad 8.

[0042] As a preferred implementation, the welding mechanism includes a welding head 10, a splitting knife 18, and a cutter 19, the surface of the fixed frame 9 is fixedly connected with the welding head 10, one end of the welding head 10 is provided with the splitting knife 18 for guiding the metal wire to complete the welding point connection, and one end of the welding head 10 is provided with the cutter 19 for cutting the wire.

[0043] As a preferred implementation, the wire feeding mechanism includes a wire feeding wheel 11, a wire shaft 12, and a firing rod 13, the surface of the fixed frame 9 is provided with the wire feeding wheel 11, the surface of the wire feeding wheel 11 is wound with the wire shaft 12, one end of the wire shaft 12 cooperates with the welding head 10, the wire shaft 12 is used to provide the metal wire, the wire feeding wheel 11 controls the wire conveying speed so as to feed the metal wire into the welding head 10, and one end of the welding head 10 is provided with the firing rod 13 for melting the wire end into a ball through the firing rod 13.

[0044] As a preferred implementation, the positioning mechanism includes a fixed rod 14 and an identification camera 15, the surface of the wire bonding machine body 1 is fixedly connected with the fixed rod 14, the surface of the fixed rod 14 is fixedly connected with the identification camera 15, the position of the chip pad 8 can be identified through the identification camera 15, and accurate coordinates are fed back to the control system to ensure that the welding point alignment error meets the requirements.

[0045] As a preferred implementation, the surface of the wire bonding machine body 1 is provided with an operation panel 16 for controlling the wire bonding machine body 1, and the top surface of the wire bonding machine body 1 is provided with a display 17 for displaying the welding process of the chip pad 8.

[0046] As a preferred implementation, the automatic wire bonding process includes the following steps:

[0047] Step one: turn on the wire bonding machine body 1, and the internal control system automatically detects the state of each component;

[0048] Step two: place the chip pad 8 between the first and second clamping plates 602 and 603 through the external mechanical arm, and then start the electric push rod 601 to fix the chip pad 8 through the first and second clamping plates 602 and 603;

[0049] Step three: move the chip pad 8 to the welding position through the transfer mechanism 5, identify the position of the chip pad 8 through the positioning mechanism, and feed back accurate coordinates to the control system to ensure that the welding point alignment error meets the requirements;

[0050] Step four: send out the metal wire through the wire feeding mechanism, send the metal wire into the welding head 10, melt the wire end into a ball through the striking rod 13, start the lifting frame 3 to drive the support frame 4 to move, and drive the welding head 10 and the wedge knife 18 to move to the first pad on the surface of the chip pad 8 through the fixing frame 9, complete the spherical solder joint through the welding head 10, then the welding head 10 pulls the wire into an arc according to the trajectory, moves to the second pad to complete the wedge-shaped solder joint, and completes the wire bonding between the first pad and the second pad, and then clamps the wire through the cutter 19 and cuts the wire;

[0051] Step five: after completing a group of solder joints, move the chip pad 8 to the next welding position through the moving mechanism 5, repeat the above steps, and after all welding is completed, the chip pad 8 is moved to the discharging position, and the equipment automatically starts the welding work of the next batch of chip pads 8.

[0052] The working process of the present application is as follows: turn on the wire bonding machine body 1 through the operation panel 16, the internal control system automatically detects the state of each component, place the chip pad 8 between the first clamp plate 602 and the second clamp plate 603 through the external mechanical arm, then start the electric push rod 601 to fix the chip pad 8 through the first clamp plate 602 and the second clamp plate 603, start the driving motor 502 to drive the threaded rod 503 to rotate, so that the sliding block 504 moves left and right in the inside of the wire bonding machine body 1, so as to move the chip pad 8 to the welding position, then the recognition camera 15 can recognize the position of the chip pad 8 and feed back the accurate coordinates to the control system, so as to ensure that the solder joint alignment error meets the requirements, then send out the metal wire through the wire feeding mechanism, send the metal wire into the welding head 10, melt the wire end into a ball through the striking rod 13, start the lifting frame 3 to drive the support frame 4 to move, and drive the welding head 10 and the wedge knife 18 to move to the first pad on the surface of the chip pad 8 through the fixing frame 9, complete the spherical solder joint through the welding head 10, then the welding head 10 pulls the wire into an arc according to the trajectory, moves to the second pad to complete the wedge-shaped solder joint, and completes the wire bonding between the first pad and the second pad, and then clamps the wire through the cutter 19 and cuts the wire, after completing a group of solder joints, move the chip pad 8 to the next welding position through the moving mechanism 5, repeat the above steps, and after all welding is completed, the chip pad 8 is moved to the discharging position, and the equipment automatically starts the welding work of the next batch of chip pads 8, and the above is the working principle of the automatic wire bonding machine and the automatic wire bonding process.

Claims

1. An automatic wire bonding machine, comprising a wire bonding machine body (1) and chip pads (8), wherein a processing table (2) is fixedly connected to the surface of the wire bonding machine body (1), and two sets of lifting frames (3) are connected inside the wire bonding machine body (1) via linear guide rails, and a support frame (4) is fixedly connected to the top of the two sets of lifting frames (3), and a fixing frame (9) is connected to the surface of the support frame (4) via linear guide rails, characterized in that: The inside of the wire bonding machine body (1) is provided with a transfer mechanism (5) for moving the chip pad (8) to the welding position, the surface of the transfer mechanism (5) is provided with a fixing mechanism (6) for fixing the chip pad (8), the surface of the fixing frame (9) is provided with a wire feeding mechanism for providing welding material and a welding mechanism for welding the chip pad (8), and the surface of the wire bonding machine body (1) is provided with a positioning mechanism for visual positioning of the chip pad (8).

2. The automatic wire bonding machine according to claim 1, wherein: The transfer mechanism (5) comprises a fixed block (501), a drive motor (502), a threaded rod (503), a sliding block (504) and a connecting frame (505), the inside of the wire bonding machine body (1) is fixedly connected with two groups of fixed blocks (501), the inside of each group of fixed blocks (501) is fixedly connected with a drive motor (502), one end of each group of drive motors (502) is fixedly connected with a threaded rod (503), and one end of the threaded rod (503) is rotatably connected with the wire bonding machine body (1).

3. The automatic wire bonding machine according to claim 2, wherein: The surface of each group of threaded rods (503) is threadedly connected with a sliding block (504), and the surface of each group of sliding blocks (504) is fixedly connected with a connecting frame (505).

4. The automatic wire bonding machine according to claim 3, wherein: The fixing mechanism (6) comprises an electric push rod (601), a first clamping plate (602) and a second clamping plate (603), the surface of each group of sliding blocks (504) is fixedly connected with an electric push rod (601), one end of the electric push rod (601) is fixedly connected with a first clamping plate (602), and the surface of the connecting frame (505) is fixedly connected with a second clamping plate (603).

5. An automatic wire bonding machine according to claim 4, wherein: The surface of the first clamping plate (602) and the second clamping plate (603) is fixedly connected with a sponge pad (7).

6. The automatic wire bonding machine according to claim 1, wherein: The welding mechanism comprises a welding head (10), a wedge (18) and a cutter (19), the surface of the fixing frame (9) is fixedly connected with a welding head (10), one end of the welding head (10) is provided with a wedge (18), and one end of the welding head (10) is provided with a cutter (19).

7. An automatic wire bonding machine according to claim 6, wherein: The wire feeding mechanism comprises a wire feeding wheel (11), a wire spool (12) and a striking rod (13), the surface of the fixing frame (9) is provided with a wire feeding wheel (11), the surface of the wire feeding wheel (11) is wound with a wire spool (12), one end of the wire spool (12) is matched with the welding head (10), and one end of the welding head (10) is provided with a striking rod (13).

8. The automatic wire bonding machine according to claim 1, wherein: The positioning mechanism comprises a fixed rod (14) and an identification camera (15), the surface of the wire bonding machine body (1) is fixedly connected with a fixed rod (14), and the surface of the fixed rod (14) is fixedly connected with an identification camera (15).

9. The automatic wire bonding machine of claim 1, wherein: The surface of the wire bonding machine body (1) is provided with an operation panel (16), and the top surface of the wire bonding machine body (1) is provided with a display (17).

10. An automatic wire bonding process for an automatic wire bonder as claimed in any one of claims 1 to 9, characterized in that: The automatic wire bonding process comprises the following steps: Step one: turn on the wire bonding machine body (1), the internal control system automatically detects the state of each component; Step two: Place the chip pad (8) between the first clamp plate (602) and the second clamp plate (603) through the external mechanical arm, and then start the electric push rod (601) to fix the chip pad (8) through the first clamp plate (602) and the second clamp plate (603); Step three: Move the chip pad (8) to the welding position through the transfer mechanism (5), identify the position of the chip pad (8) through the positioning mechanism, and feed back the accurate coordinates to the control system to ensure that the welding point alignment error meets the requirements; Step four: Send out the metal wire through the wire feeding mechanism, send the metal wire into the welding head (10), melt the wire end into a ball through the ignition rod (13), start the lifting frame (3) to drive the support frame (4) to move, and drive the welding head (10) and the wedge (18) to move to the surface of the first pad of the chip pad (8) through the fixing frame (9), complete the spherical welding point through the welding head (10), then the welding head (10) pulls the wire into an arc according to the trajectory, moves to the second pad to complete the wedge-shaped welding point, and makes the welding wire between the first pad and the second pad, then clamps the wire through the cutter (19) and cuts off the wire; Step five: After completing a group of welding points, move the chip pad (8) to the next welding position through the transfer mechanism (5), repeat the above steps, and after all the welding is completed, the chip pad (8) is moved to the discharging position, and the equipment automatically starts the welding operation of the next batch of chip pads (8).

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