A PCB electroplating control method and system, and a storage medium

Abstract

Embodiments of the present application provide a PCB electroplating control method and system and a storage medium, the method comprising: obtaining target electroplating parameters and electroplating operation data of a PCB to be electroplated by scanning a target code of the PCB to be electroplated through a handheld terminal; generating a visual electroplating operation interface on the handheld terminal according to the electroplating operation data; generating electroplating confirmation information in response to a first operation; and controlling an electroplating flying target to electroplate the PCB to be electroplated according to the electroplating confirmation information to obtain a target PCB. The electroplating parameters can be automatically entered by scanning the target code through the handheld terminal, and the corresponding electroplating flying target can be automatically selected for electroplating, so that the electroplating efficiency is high, manual input of the electroplating parameters is not required, electroplating errors are reduced, and the electroplating cost is low.

Description

Technical Field

[0001] This invention relates to, but is not limited to, the field of electroplating control technology, and particularly to an electroplating control method, system, and storage medium for PCB boards. Background Technology

[0002] In the traditional PCB electroplating production process, production data needs to be established manually and electroplating parameters need to be calculated manually. This can easily lead to parameter input errors, resulting in product rework or scrap, high electroplating costs, and low electroplating efficiency. Summary of the Invention

[0003] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0004] The main objective of this invention is to provide a method, system, and storage medium for controlling the electroplating of PCB boards, which can improve the electroplating efficiency of PCBs and reduce electroplating costs.

[0005] In a first aspect, embodiments of the present invention provide a method for controlling the electroplating of a PCB board, comprising:

[0006] After scanning the target code of the PCB board to be electroplated by the handheld terminal, the target electroplating parameters and electroplating operation data of the PCB board to be electroplated are obtained. The target code is printed on the process card of the PCB board to be electroplated.

[0007] A visual electroplating operation interface is generated on the handheld terminal based on the electroplating operation data. The electroplating operation interface generated by different operators is different.

[0008] Electroplating confirmation information is generated in response to a first operation on the electroplating operation interface. The first operation is characterized as an operation to confirm that the target electroplating parameters on the electroplating operation interface are consistent with the production electroplating parameters of the electroplating target.

[0009] Based on the electroplating confirmation information, the electroplating target is controlled to perform electroplating on the PCB board to be electroplated to obtain the target PCB board.

[0010] In some optional embodiments, the step of obtaining the target electroplating parameters and electroplating operation data of the PCB board to be electroplated after scanning the target code of the PCB board to be electroplated via a handheld terminal includes:

[0011] After scanning the target code of the PCB board to be electroplated using the handheld terminal:

[0012] Obtain production operator information, which indicates the operator's proficiency, operation type, and operation level.

[0013] The electroplating operation data is generated based on the production operator information and preset generation rules;

[0014] Obtain the production priority and workshop production information of the PCB board to be electroplated, wherein the workshop production information indicates the real-time production capacity and equipment operation information of the production workshop;

[0015] The target electroplating parameters are generated based on the production priority and the workshop production information. The target electroplating parameters are used to indicate the electroplating sequence information, electroplating target information, electroplating current information, electroplating time information, and electroplating area information of the PCB board to be electroplated.

[0016] In some optional embodiments, obtaining the production priority and workshop production information of the PCB board to be electroplated includes:

[0017] Obtain real-time and historical production data from the workshop;

[0018] The real-time production capacity is determined based on real-time production data;

[0019] The production equipment operation information is determined based on the historical production duration, historical production frequency, historical product production type and historical operating parameters represented by the historical production data. The production equipment operation information is used to indicate the aging degree of the production equipment and the corresponding optimal operating parameters.

[0020] The first priority score is determined based on the delivery deadline of the PCB board to be electroplated, the customer type, and the first weighting coefficient.

[0021] The second priority score is determined based on the profit of the PCB board to be electroplated and the second weighting coefficient.

[0022] The third priority score is determined based on the process complexity, production risk coefficient, and third weighting coefficient of the electroplated PCB board.

[0023] The fourth priority score is determined based on the degree of matching between the process parameters of the electroplated PCB board and the operating information of the production equipment, and the fourth weighting coefficient.

[0024] The production priority is determined based on the first priority score, the second priority score, the third priority score, and the fourth priority score.

[0025] In some optional embodiments, generating the target electroplating parameters based on the production priority and the workshop production information includes:

[0026] A production sequence table is determined based on the production priority of each of the PCB boards to be electroplated, and the production sequence table is used to indicate the electroplating sequence information;

[0027] The electroplating target information, electroplating current information, electroplating time information, and electroplating area information are determined based on the process parameters of the electroplated PCB board and the workshop production information.

[0028] In some optional embodiments, determining the electroplating target information, the electroplating current information, the electroplating time information, and the electroplating area information based on the process parameters of the electroplated PCB board and the workshop production information includes:

[0029] The electroplating target information is determined based on the electroplating precision indicated by the process parameters of the electroplated PCB board, the electroplating target aging information indicated by the workshop production information, and the workshop idle equipment information. The electroplating target indicated by the electroplating target information is used to electroplat the electroplated PCB board.

[0030] The electroplating current information is determined based on the standard electroplating current indicated by the process parameters of the electroplated PCB board, the maximum electroplating current and aging degree indicated by the electroplating target information, and the real-time production capacity.

[0031] The electroplating time information is determined based on the electroplating area information and the electroplating current information indicated by the process parameters of the electroplated PCB board.

[0032] In some optional embodiments, determining the electroplating target information, the electroplating current information, the electroplating time information, and the electroplating area information based on the process parameters of the electroplated PCB board and the workshop production information includes:

[0033] Construct a multi-objective optimization model for calculating electroplating parameters;

[0034] The process parameters of the electroplated PCB board and the workshop production information are input into the electroplating parameter calculation model;

[0035] The optimization objectives of the electroplating parameter calculation model are configured as maximizing production efficiency, minimizing electroplating time, maximizing electroplating compliance rate, and minimizing electroplating target aging.

[0036] Construct the objective function corresponding to the optimization objective;

[0037] The design variables of the electroplating parameter calculation model are configured as the model of the electroplating target, the current of the electroplating target, and the electroplating time of the electroplating target.

[0038] The constraints of the electroplating parameter calculation model are configured as the process parameter constraints of the electroplating PCB board, the maximum current constraint of the electroplating target, and the maximum production quantity constraint of the electroplating target.

[0039] Based on the constraints, the objective function, and the optimization objective, the Pareto optimal solution set is obtained by iterating the design variables.

[0040] Based on production efficiency, a target solution is selected from the Pareto optimal solution set to indicate the electroplating target information, the electroplating current information, the electroplating time information, and the electroplating area information.

[0041] In some optional embodiments, generating electroplating confirmation information after a first operation in response to the electroplating operation interface includes:

[0042] In response to the first operation, the production model of the electroplating target is obtained, the production model indicating the production electroplating parameters;

[0043] When the production model includes the target electroplating model, the electroplating confirmation information is configured to allow production, and the target electroplating model indicates the target electroplating parameters;

[0044] If the target electroplating model is not included in the production model, the electroplating confirmation information will be configured to disallow production.

[0045] In some optional embodiments, generating a visual electroplating operation interface on the handheld terminal based on the electroplating operation data includes:

[0046] The operator's skill level, operation type, and operation level are determined based on the electroplating operation data.

[0047] A template is selected based on the user's proficiency level, and different templates correspond to different user proficiency levels.

[0048] Generate the corresponding operation module on the generation template according to the operation type;

[0049] The electroplating operation interface is obtained by setting the operation permissions of the operation module according to the operation level.

[0050] In a second aspect, embodiments of the present invention provide an electroplating control system for a PCB board, including a controller. The controller includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the electroplating control method for the PCB board described in the first aspect.

[0051] Thirdly, embodiments of the present invention provide a computer storage medium storing computer-executable instructions for executing the electroplating control method for the PCB board described in the first aspect.

[0052] The beneficial effects of this invention include: obtaining target electroplating parameters and electroplating operation data of the PCB board to be electroplated by scanning the target code on the PCB board using a handheld terminal; the target code is imprinted on the process card of the PCB board; generating a visual electroplating operation interface on the handheld terminal based on the electroplating operation data; generating electroplating confirmation information in response to a first operation on the electroplating operation interface, the first operation representing an operation to confirm the consistency between the target electroplating parameters on the electroplating operation interface and the production electroplating parameters of the electroplating target; and controlling the electroplating target to electroplat the PCB board to be electroplated based on the electroplating confirmation information to obtain the target PCB board. By scanning the target code on the handheld terminal, the electroplating parameters can be automatically entered, and the corresponding electroplating target can be automatically selected for electroplating, resulting in high electroplating efficiency, eliminating the need for manual input of electroplating parameters, reducing electroplating errors, and lowering electroplating costs.

[0053] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0054] Figure 1 This is a flowchart illustrating the steps of an electroplating control method for a PCB board provided in an embodiment of the present invention.

[0055] Figure 2 This is a schematic diagram of a controller provided in one embodiment of the present invention.

[0056] Reference numerals: Controller 1000, Processor 1100, Memory 1200. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0058] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, or the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0059] This application provides a method, system, and storage medium for controlling the electroplating of a PCB board, which will be described in detail in the following embodiments.

[0060] like Figure 1 As shown, this embodiment of the invention provides a method for controlling the electroplating of a PCB board, including steps S100, S200, S300, and S400:

[0061] Step S100: After scanning the target code of the PCB board to be electroplated through the handheld terminal, the target electroplating parameters and electroplating operation data of the PCB board to be electroplated are obtained. The target code is engraved on the process card of the PCB board to be electroplated.

[0062] Specifically, the target electroplating parameters (including the plating area of ​​the C-side / S-side, the current density of copper plating / tin plating, the plating time, the number of single flying targets, etc.) and electroplating operation data (including material loading verification steps, equipment operating status requirements, quality inspection nodes, and abnormal handling procedures, etc.) of each PCB model are pre-entered into the background database.

[0063] A unique target code, uniquely bound to the PCB board, is printed on the process card. This target code can be in barcode or QR code format and contains basic information such as part number, model, and production batch. Operators scan the target code on the process card using a handheld terminal. The terminal automatically uploads the scanned information to the backend database. The database matches the target code with the corresponding electroplating parameters and electroplating operation data, and then sends this data to the handheld terminal's local storage. The electroplating operation data also needs to be generated by considering the operator's proficiency, operation type, and operation level. Details will be provided in the following steps and will not be elaborated upon here.

[0064] In some optional embodiments, the handheld terminal is a handheld PAD, and the handheld PAD includes:

[0065] The process card scanning and recognition module is used to scan process cards and read product models and basic parameters from the MSE database;

[0066] The multi-model current data accumulation module connects to the electroplating target of the production equipment and supports independent accumulation of current data for at least 5 models of products, that is, the electroplating current is collected and accumulated independently according to the product model.

[0067] The automatic process parameter matching module automatically generates process parameters by calling backend templates based on product identifiers;

[0068] The data interaction module enables real-time data communication between the handheld device PAD, the MSE database, and production equipment, and uploads process parameters and current statistics to the MSE database in real time.

[0069] The process card scanning and recognition module supports QR code / barcode scanning, with a parsing time of ≤2 seconds, and data transmission uses HTTP / HTTPS protocol.

[0070] In some optional embodiments, the step of obtaining the target electroplating parameters and electroplating operation data of the PCB board to be electroplated after scanning the target code of the PCB board to be electroplated via a handheld terminal includes:

[0071] After scanning the target code of the PCB board to be electroplated using the handheld terminal:

[0072] S110. Obtain production operator information, wherein the production operator information indicates the operator's proficiency, operation type, and operation level.

[0073] Specifically, the operator uses a handheld terminal to scan the target code on the process card of the PCB board to be electroplated. After parsing the target code, the basic information of the PCB board (part number, model, production batch, standard process baseline value) is output. The handheld terminal automatically triggers a data retrieval command, and through the employee account bound to the handheld terminal, it retrieves the operator's operation proficiency (e.g., novice, proficient, senior), operation type (e.g., dedicated to electroplating, multi-process position), and operation level (e.g., beginner, intermediate, advanced, with corresponding parameter adjustment permissions) from the personnel management module of the MES system.

[0074] S120. Generate the electroplating operation data according to the production operator information and preset generation rules;

[0075] Specifically, matching rules for operators and operational data are pre-defined in the MES system. For example, novice operators generate a simplified operation process (retaining only core steps: scanning for confirmation, material loading verification, starting electroplating, and ending unloading), and add real-time pop-up guidance (such as "Please confirm that the target model matches the process card"), while disabling the function of mixing multiple models; skilled or experienced operators generate a complete operation process (including advanced steps such as parameter fine-tuning, anomaly handling, and quality spot checks), and enable manual parameter adjustment within their corresponding permissions. The generated electroplating operation data is synchronized to the handheld terminal and presented through a visual interface.

[0076] S130. Obtain the production priority and workshop production information of the PCB board to be electroplated, wherein the workshop production information indicates the real-time production capacity and production equipment operation information of the production workshop;

[0077] Specifically, production priority information is obtained by retrieving the overall priority score and priority level of the PCB board; workshop production information is obtained by retrieving real-time production capacity (current work-in-process quantity in the electroplating process, flow efficiency of upstream and downstream processes, number of idle equipment) and production equipment operation information (aging level of each electroplating target, real-time operating status, current load rate, current output stability).

[0078] S140. Generate the target electroplating parameters according to the production priority and the workshop production information. The target electroplating parameters are used to indicate the electroplating sequence information, electroplating target information, electroplating current information, electroplating time information and electroplating area information of the PCB board to be electroplated.

[0079] Specifically, based on the overall priority score of the orders, the PCB boards with the highest scores are given priority to be put into the production queue; for orders of the same priority, adjustments are made in combination with the workshop's capacity balancing needs: if there is a serious backlog of work-in-process in the previous process, the electroplating sequence of the corresponding orders is advanced; if the capacity of the subsequent process is tight, small-batch, fast-turnover orders are given priority.

[0080] Urgent / Express Priority Orders: These orders will be assigned to electroplating targets with low aging levels (new / lightly aged) and stable current output, prioritizing idle targets to reduce waiting time. Normal / Regular Priority Orders: These orders will be allocated based on target load rate, allowing for up to 5 similar models. Medium / heavily aged targets will only be assigned to mature, standard models, with a limit of 3 models per target. The target electroplating parameters for different PCBs on a single target must be the same or similar.

[0081] Electroplating current information generation: Based on the standard current density benchmark value of the PCB board, the electroplating current is calibrated in combination with the aging degree of the target; if the current fluctuation of the target operation current exceeds the threshold, it is reduced by 3% to 5% on the basis of the calibration value to avoid plating defects; for urgent orders, the upper limit of current density can be appropriately increased within the quality allowable range to shorten the production cycle.

[0082] Electroplating time information generation: The corresponding electroplating time is calculated based on the electroplating current information and target electroplating parameters, and fine-tuned in combination with equipment status: when the plating solution temperature is higher than the standard value, the time is shortened by 5% to 10%; when the current fluctuates greatly, the time is extended by 5% to 8%.

[0083] Electroplating area information generation: Retrieve the standard C-side / S-side plating area reference value of the PCB board to be electroplated from the background database; Combined with target fixture type calibration: If a non-standard fixture is used, adjust the plating area according to the fixture shading situation (e.g., if the shading rate is 5%, then the actual plating area = standard area × 95%) to ensure that the current density is adapted to the actual plating area.

[0084] In some optional embodiments, obtaining the production priority and workshop production information of the PCB board to be electroplated includes:

[0085] S131. Obtain real-time and historical production data from the workshop;

[0086] Specifically, real-time production data includes: the operating status of each electroplating target (standby, running, fault, maintenance, etc.), current load rate (number of PCBs already mounted, maximum number of targets per target), and idle time; the number of work-in-process batches in the electroplating process, the material arrival speed of the preceding process (drilling, film application), and the capacity idle rate of the subsequent process (etching, solder resist); the composition of the plating solution (copper ion concentration, tin ion concentration, pH value), the remaining life of the anode plate, and the number of fixtures, etc. Specific production data is collected according to demand and is not limited here.

[0087] Extract the following from the historical database: equipment manufacturing date, cumulative runtime, historical maintenance records, number of times key components (rectifier, drive chain) have been replaced; historical production duration, historical production count, historical product type (high precision / ordinary PCB board), historical operating parameters (current density, electroplating time, plating solution temperature), etc. Specific details are not limited here.

[0088] S132. Determine the real-time production capacity based on real-time production data;

[0089] Specifically, real-time production capacity is measured by the number of electroplating batches that can be completed per unit of time, and the calculation formula is as follows:

[0090]

[0091] The maximum number of batches that can be processed per hour by a single flying target is determined by the flying target transmission speed and electroplating time; the more batches that are backlogged, the greater the current work-in-process backlog coefficient.

[0092] S133. Determine the production equipment operation information based on the historical production duration, historical production frequency, historical product production type and historical operating parameters represented by the historical production data. The production equipment operation information is used to indicate the aging degree of the production equipment and the corresponding optimal operating parameters.

[0093] Specifically, the historical production duration and number of production runs of the equipment are statistically analyzed. Combined with the process requirements of historical product types and the stability of historical operating parameters, the performance degradation of the equipment is assessed (specifically, this can be obtained through a preset aging assessment model), and the aging level of the equipment is classified. At the same time, the process parameter range with the highest product qualification rate under different aging levels is selected to determine the optimal operating parameters for each piece of equipment, and finally, the complete production equipment operation information is integrated.

[0094] S134. Determine the first priority score based on the delivery deadline, customer type, and first weighting coefficient of the PCB board to be electroplated;

[0095] Specifically, the urgency coefficient is calculated based on the delivery deadline, and a base score is assigned accordingly. Additional points are then added based on the customer type. Finally, the base score and additional points are added together, and the first priority score is calculated based on the first weighting coefficient.

[0096] S135. Determine the second priority score based on the profit and second weighting coefficient of the PCB board to be electroplated;

[0097] Specifically, a base score is assigned based on the gross profit margin of the PCB board to be electroplated; additional scores are added based on the quantity per batch; finally, the base score and additional scores are added together and the second priority score is calculated according to the second weighting coefficient.

[0098] S136. Determine the third priority score based on the process complexity, production risk coefficient, and third weight coefficient of the electroplated PCB board.

[0099] Specifically, process complexity is scored according to product type (e.g., 5 points for ordinary double-sided boards, 3 points for multilayer boards, and 1 point for high-precision fine circuit boards); production risk coefficient is calculated based on the historical defect rate of similar products (defect rate × 100) and scored accordingly (e.g., 5 points for risk coefficient ≤ 1%, 3 points for 1%-3%, and 1 point for > 3%); the process complexity score and production risk score are added together and the third priority score is calculated according to the third weighting coefficient.

[0100] S137. Determine the fourth priority score based on the degree of matching between the process parameters of the electroplated PCB board and the operating information of the production equipment and the fourth weighting coefficient;

[0101] Specifically, the number of process parameters (current density, electroplating time, and plating solution temperature) of the PCB board to be electroplated that fall within the optimal operating parameter range of the equipment is counted, and the parameter matching degree is obtained by dividing it by the total number of parameter items; then, a score is assigned according to the matching degree, and the fourth priority score is calculated according to the fourth weighting coefficient.

[0102] S138. Determine the production priority based on the first priority score, the second priority score, the third priority score, and the fourth priority score.

[0103] Specifically, the first priority score, the second priority score, the third priority score, and the fourth priority score are added together to obtain a comprehensive priority score; the priority level is divided according to the comprehensive score, thereby determining the production priority of the PCB board to be electroplated.

[0104] In some optional embodiments, generating the target electroplating parameters based on the production priority and the workshop production information includes:

[0105] S141. Determine a production sequence table based on the production priority of each of the PCB boards to be electroplated, wherein the production sequence table is used to indicate the electroplating sequence information;

[0106] Specifically, the overall priority scores of each PCB board to be electroplated are sorted in descending order to obtain a production sequence table, which indicates the electroplating sequence information for each batch of PCB boards. The generated production sequence table marks the part number, model, priority level, and planned start time of electroplating for each batch of PCB boards, and is simultaneously sent to the MES system and handheld terminal.

[0107] S142. Determine the electroplating target information, electroplating current information, electroplating time information, and electroplating area information based on the process parameters of the electroplated PCB board and the workshop production information.

[0108] Specifically, based on the production sequence list, and combined with the process parameters of each batch of PCB boards to be electroplated (target plating thickness, standard plating area, process accuracy requirements, etc.) and workshop production information (real-time production capacity, production equipment operation information), the electroplating target information, electroplating current information, electroplating time information and electroplating area information are determined one by one.

[0109] In some optional embodiments, determining the electroplating target information, the electroplating current information, the electroplating time information, and the electroplating area information based on the process parameters of the electroplated PCB board and the workshop production information includes:

[0110] S1421. The electroplating target information is determined based on the electroplating precision indicated by the process parameters of the electroplated PCB board, the electroplating target aging information indicated by the workshop production information, and the workshop idle equipment information. The electroplating target indicated by the electroplating target information is used to electroplat the electroplated PCB board.

[0111] Specifically, based on production equipment operation information, space plating targets that are in normal operating condition and whose optimal working parameters cover the current PCB board process parameter range (including specific plating precision, plating area, plating current, tin plating thickness, copper plating thickness, etc.) are selected. Then, targets with corresponding aging levels are assigned according to the priority level of the PCB board to be plating. For urgent and high-precision orders, brand new or lightly aged targets are prioritized, and the number of models mounted on a single target is limited to ensure parameter stability. For ordinary and low-priority orders, moderately aged targets are assigned, allowing multiple models on a single target to improve equipment utilization. For low-priority and simple process orders, heavily aged targets can be assigned, but only one model is allowed for production, while triggering equipment maintenance warnings. Finally, based on real-time production capacity adjustments in the workshop, if current capacity is overloaded, idle targets are prioritized to ensure rapid startup of high-priority orders; if capacity is idle, targets with higher aging levels can be prioritized to reduce ineffective wear and tear on high-quality equipment.

[0112] S1422. Determine the electroplating current information based on the standard electroplating current indicated by the process parameters of the electroplated PCB board, the maximum electroplating current and aging degree indicated by the electroplating target information, and the real-time production capacity.

[0113] Specifically, the standard current density baseline value (standard electroplating current) of the PCB board to be electroplated is extracted, and then calibrated in conjunction with the aging degree of the target. For brand new targets, the baseline value is used directly; for lightly aged targets, the baseline value is increased by 3%–5%; for moderately aged targets, it is increased by 8%–10%; and for heavily aged targets, it is increased by 10%–15%. The calibrated current value must strictly fall within the optimal operating current range of the target (not exceeding the maximum electroplating current). Simultaneously, fine-tuning is performed based on the real-time production capacity of the workshop: when production is overloaded and expedited, the current density is moderately increased within the optimal operating current range (not exceeding the preset range); when production is idle, the current density is reduced to 85%–90% of the calibrated value, balancing plating quality and equipment wear. If the real-time current fluctuation of the target exceeds the threshold, the current value must be immediately reduced by 3%–5%, triggering a handheld device error message.

[0114] S1423. Determine the electroplating time information based on the electroplating area information and electroplating current information indicated by the process parameters of the electroplated PCB board.

[0115] Specifically, the formula for calculating the electroplating time included in the electroplating time information is as follows:

[0116]

[0117] in, For the target coating thickness, This represents the electroplating area (obtained from electroplating area information). For the density of electroplated metal, For current efficiency, The electroplating current is characterized by electroplating current information. This refers to the electroplating time.

[0118] The calculated electroplating time is then fine-tuned based on the optimal operating parameters of the electroplating target. If the plating bath temperature is higher than the standard value, the time is shortened by 5% to 10%; if the transmission speed is lower than the standard value, the time is extended by 5% to 8%. For heavily aged targets, the time is extended by an additional 10% to compensate for equipment performance degradation. Finally, adjustments are made based on workshop capacity: for urgent orders, the time is reduced by 10% to 15% within the allowable range of coating thickness error; for regular orders, the time is extended by 5% to 10%, thereby improving the uniformity of the coating.

[0119] In some optional embodiments, determining the electroplating target information, the electroplating current information, the electroplating time information, and the electroplating area information based on the process parameters of the electroplated PCB board and the workshop production information includes:

[0120] S1424. Construct a multi-objective optimization calculation model for electroplating parameters;

[0121] Specifically, a multi-objective optimization model framework is pre-built, focusing on production efficiency, electroplating quality, and equipment wear and tear. The core logic of the model is to balance multiple mutually restrictive optimization objectives and output the optimal parameter combination while satisfying process and equipment constraints. The model consists of four parts: optimization objectives, objective function, design variables, and constraints.

[0122] S1425. Input the process parameters of the electroplated PCB board and the workshop production information into the electroplating parameter calculation model;

[0123] Specifically, the electroplating PCB board process parameters and workshop production information are input into the electroplating parameter calculation model. The electroplating PCB board process parameters include: the model of the PCB board to be electroplated, the target plating thickness, the standard C-side / S-side plating area, process accuracy requirements (such as plating thickness error threshold ±5%), and the allowable current density range. The workshop production information includes: the aging degree of each electroplating target, the optimal operating parameter range, real-time operating status, the maximum number of targets that can be mounted per target, the workshop's real-time capacity load rate, and the work-in-process inventory status.

[0124] S1426. Configure the optimization objectives of the electroplating parameter calculation model as maximizing production efficiency, minimizing electroplating time, maximizing electroplating compliance rate, and minimizing electroplating target aging.

[0125] Specifically, maximizing production efficiency means completing the largest number of electroplating batches per unit time, reducing order waiting time. Minimizing electroplating time means shortening the electroplating time for a single batch of PCB boards while ensuring plating quality, thus improving equipment turnaround efficiency. Maximizing electroplating compliance rate means maximizing the proportion of final produced PCB boards whose plating thickness, uniformity, and other indicators meet process requirements, reducing rework and scrap rates. Minimizing electroplating target aging means avoiding prolonged overload operation of equipment, reducing accelerated performance degradation caused by unreasonable parameters.

[0126] S1427. Construct the objective function corresponding to the optimization objective;

[0127] Specifically, for each of the four optimization objectives, a quantifiable and computable objective function is established:

[0128] The objective function for maximizing production efficiency is: ,in, This refers to the batch quantity of PCB boards that can be carried by a single flying target in a single operation. For the first Electroplating time of batch PCB boards This represents the total number of batches. The larger the size, the higher the production efficiency.

[0129] The objective function for minimizing electroplating time is: ,in, For coating thickness, For the plated area, For metal density, For current efficiency, This is the electroplating current.

[0130] The objective function for maximizing the electroplating compliance rate is: ,in, For the first The actual plating thickness of the PCB board. Standard coating thickness To detect the number of samples, the closer the function value is to 1, the higher the pass rate.

[0131] The objective function for minimizing the aging of electroplated targets is: ,in, The optimal electroplating time corresponds to the best operating parameters for the electroplated target. The electroplating current corresponding to the optimal operating parameters of the electroplating target. The electroplating time was adjusted for the electroplating target. The electroplating current adjusted for the electroplating target. , These are the weighting coefficients. The smaller the function value, the smaller the deviation of the current and time parameters from the optimal operating range of the equipment, and the slower the aging rate of the equipment.

[0132] S1428. Configure the design variables of the electroplating parameter calculation model as the model of the electroplating target, the current of the electroplating target, and the electroplating time of the electroplating target.

[0133] Specifically, the design variables are dynamically adjustable parameters in the model. Variables related to the electroplating target include: target model (corresponding to different aging levels and optimal operating parameters), and the number of PCB models for each target; variables related to electroplating current include: copper plating current density and tin plating current density; and variables related to electroplating time include: copper plating time and tin plating time.

[0134] S1429. Configure the constraints of the electroplating parameter calculation model as the process parameter constraints of the electroplating PCB board, the maximum current constraint of the electroplating target, and the maximum production quantity constraint of the electroplating target.

[0135] Specifically, the constraints are the boundary conditions for the model solution, ensuring that the output parameters meet the process requirements and equipment operating capabilities. PCB board process parameter constraints: actual plating thickness error less than or equal to ±5%; actual plating area must match the fixture type (considering the shading rate); current density must be within the process allowable range. Electroplating target maximum current constraint: actual output current density less than or equal to the target's rated maximum current density × (1 - aging attenuation coefficient), to avoid equipment overload. Electroplating target maximum production quantity constraint: the number of PCB boards mounted on a single target is less than or equal to the equipment's rated maximum load capacity; the number of models produced simultaneously by a single target is less than or equal to the limit quantity for the corresponding aging level (e.g., lightly aged targets ≤ 5 types, heavily aged targets ≤ 1 type).

[0136] S1430. Based on the constraints, the objective function, and the optimization objective, the Pareto optimal solution set is obtained by iterating the design variables.

[0137] Specifically, based on the set constraints, objective function, and optimization objective, multi-objective optimization algorithms (such as NSGA-Ⅲ algorithm and MOEA / D algorithm) are used to iteratively optimize the design variables.

[0138] The algorithm initially generates a set of design variable combinations, substitutes them into the objective function to calculate the objective values, and determines whether the constraints are met. For variable combinations that meet the constraints, crossover and mutation operations are performed to generate new variable combinations, and the calculation and selection are repeated. After multiple iterations, a set of solutions that cannot simultaneously optimize all objectives is obtained, i.e., the Pareto optimal solution set. Any solution in the solution set, while improving one optimization objective, will inevitably lead to a decrease in the performance of at least one other objective. All solutions are globally optimal candidate solutions. This solution set contains multiple corresponding parameter combinations, each corresponding to a specific electroplating target model, current density, electroplating time, and the optimal plating area calculated based on current and time.

[0139] S1431. Select a target solution from the Pareto optimal solution set based on production efficiency to indicate the electroplating target information, the electroplating current information, the electroplating time information, and the electroplating area information.

[0140] Specifically, the optimal target solution is selected from the Pareto optimal solution set, taking into account the priority of workshop production efficiency. The specific selection rules can be adjusted according to the current production strategy of the workshop.

[0141] If the workshop currently needs to prioritize order delivery (capacity overload): select the solution with the highest weight for "maximizing production efficiency", with corresponding parameters of high current density, short electroplating time, and high-load flying target configuration.

[0142] If the workshop currently needs to prioritize product quality (high-end order production): select the solution with the highest weight for "maximizing electroplating compliance rate", and the corresponding parameters are current density that matches the optimal working range of the equipment, moderate electroplating time, and low-aging target configuration.

[0143] If the workshop currently prioritizes reducing equipment wear and tear (equipment maintenance cycle is approaching): select the solution with the highest weight for "minimizing electroplating target aging," corresponding to parameters of low current density, long electroplating time, and light-load target configuration. The final selected target solution corresponds to the parameters of electroplating target information, electroplating current information, electroplating time information, and electroplating area information, which are simultaneously sent to the handheld terminal and the electroplating equipment control system.

[0144] Step S200: Generate a visual electroplating operation interface on the handheld terminal based on the electroplating operation data. The electroplating operation interface generated by different operators is different.

[0145] Specifically, the handheld terminal automatically generates a visual electroplating operation interface based on the received electroplating operation data and the corresponding operator. This facilitates the display and modification of specific target electroplating parameters, as well as the control of electroplating production. It also displays the specific production status and equipment operating status in real time. The specific content displayed is not limited here.

[0146] In some optional embodiments, generating a visual electroplating operation interface on the handheld terminal based on the electroplating operation data includes:

[0147] S210. Determine the operator's skill level, operation type, and operation level based on the electroplating operation data.

[0148] Specifically, the electroplating operation data contains the corresponding production operator's skill information. After the interface generates an instruction, the operator's skill level and operation level are first parsed from this data.

[0149] S220. Select a generation template based on the operation proficiency level, and different generation templates correspond to different operation proficiency levels;

[0150] Specifically, the system pre-sets multiple basic interface generation templates, each corresponding to an operator's proficiency level. For example, the beginner template breaks down the entire electroplating process into six independent sub-interfaces: "Scanning and Verification → Board Confirmation → Parameter Verification → Start Electroplating → Anomaly Reporting → Material Unloading Record." Each sub-interface only displays the core operations of the current step, accompanied by graphic / animated guidance, and hides all unnecessary function buttons. The proficient template integrates the electroplating process into four core sub-interfaces: "Material Loading Verification → Parameter Verification → Electroplating Control → Material Unloading Archiving," retaining key guidance prompts and enabling basic function buttons.

[0151] S230. Generate a corresponding operation module on the generation template according to the operation type;

[0152] Specifically, using the selected basic template as a framework, the corresponding core operation modules are loaded according to the operator's operation type to ensure that the interface functions match the operator's job responsibilities.

[0153] S240. After setting the operation permissions of the operation module according to the operation level, the electroplating operation interface is obtained.

[0154] Specifically, after loading the corresponding operation modules, differentiated operation permissions are set for each module according to the operator's operation level, ultimately generating a complete electroplating operation interface.

[0155] Step S300: In response to the first operation of the electroplating operation interface, generate electroplating confirmation information. The first operation represents an operation used to confirm the consistency between the target electroplating parameters on the electroplating operation interface and the production electroplating parameters of the electroplating target.

[0156] Specifically, once the operator has verified the target electroplating parameters on the handheld terminal's visual electroplating operation interface, they can perform the first operation. This operation confirms that the target electroplating parameters displayed on the interface are consistent with the production electroplating parameters currently loaded on the electroplating target. This can be done by clicking the parameter consistency confirmation button on the interface, or by using the handheld terminal's fingerprint, barcode scanning, or other authentication methods (to prevent accidental operation); or by scanning the QR code on the electroplating target to determine if the PCB board model that the electroplating target can perform electroplating on is consistent with the PCB board model corresponding to the target electroplating parameters, thus completing the confirmation.

[0157] In some optional embodiments, generating electroplating confirmation information after a first operation in response to the electroplating operation interface includes:

[0158] S310. In response to the first operation, obtain the production model of the electroplating target, wherein the production model indicates the production electroplating parameters;

[0159] Specifically, after the operator performs the first operation (i.e., confirming the consistency between the target electroplating parameters and the electroplating parameters produced by the electroplating target) on the visual electroplating operation interface of the handheld terminal, the handheld terminal immediately sends a model retrieval command to the control system of the electroplating target. After receiving the command, the electroplating target control system provides feedback on the currently loaded production models and the corresponding set of production electroplating parameters. The production models here are the list of PCB board models currently preset by the target that can perform electroplating processes. Each production model is bound to a set of exclusive production electroplating parameters (such as current density, electroplating time, and plating area). The production model directly indicates the range of production electroplating parameters that the target can currently adapt to.

[0160] S320. If the production model includes the target electroplating model, configure the electroplating confirmation information to allow production, wherein the target electroplating model indicates the target electroplating parameters;

[0161] Specifically, the handheld terminal will retrieve the production model number and compare it with the target electroplating model number corresponding to the target electroplating parameters. The target electroplating model number is a unique model number of the PCB board to be electroplated, serving as an identifier to determine whether the electroplating target has the capability to produce that PCB board. The system checks whether the production model list returned by the electroplating target contains a target electroplating model number that is completely identical to the PCB board to be electroplated.

[0162] If the verification result shows that the target electroplating model exists in the current production model list of the electroplating target, it means that the electroplating target has loaded the production electroplating parameters corresponding to that model, and the core identifier is consistent with the target electroplating parameters. At this time, the system will configure the electroplating confirmation information to allow production, and add key information to the information: target electroplating model, details of the matching production electroplating parameters, electroplating target number, operation timestamp, and operator information. At the same time, it will simultaneously verify whether the numerical deviation between the production electroplating parameters and the target electroplating parameters is within the threshold range, ensuring that the parameters not only match the model, but also meet the process requirements.

[0163] S330. If the target electroplating model is not included in the production model, configure the electroplating confirmation information to disallow production.

[0164] Specifically, if the verification result shows that the target electroplating model is not in the current production model list of the electroplating target, it means that the electroplating target has not preset the production process parameters of the PCB board to be electroplated and cannot be adapted for production. At this time, the system will configure the electroplating confirmation information to not allow production, clearly indicate the reason for the abnormality in the information, and prompt the operator with a pop-up window.

[0165] Step S400: Based on the electroplating confirmation information, control the electroplating target to electroplat the PCB board to be electroplated to obtain the target PCB board.

[0166] Specifically, after receiving the electroplating confirmation information uploaded by the handheld terminal, the control system of the electroplating target first initiates a legality verification of the information. This verification includes: whether the target number in the confirmation information matches the machine, whether the parameter verification record is complete, whether the operator has the corresponding permissions, and whether the instruction code is valid. If the verification passes, the target control system automatically generates an electroplating execution instruction, which includes the core parameters for this electroplating: the operating mode of the electroplating target, the current density for copper / tin plating, the plating time, the actual plating area on the C / S side, and the parameter monitoring thresholds during the electroplating process (such as the allowable range of current fluctuations and the temperature range of the plating solution). If the verification fails (e.g., the target number does not match, or the instruction code is invalid), the system immediately sends an error message to the handheld terminal while remaining in standby mode until the operator investigates the problem and resends the confirmation information.

[0167] After the operator confirms that the board loading is complete, the electroplating control system starts the electroplating process, and the target PCB board is obtained after electroplating. The electroplating control system uploads all execution data of this electroplating (electroplating confirmation information copy, parameter monitoring record, anomaly handling record, operator information) to the MES system for archiving; at the same time, the handheld terminal generates a unique traceability code for this batch of target PCB boards. The traceability code is associated with all parameter information of this electroplating, which facilitates data retrieval during subsequent quality inspection and problem investigation.

[0168] The beneficial effects of this invention include: obtaining target electroplating parameters and electroplating operation data of the PCB board to be electroplated by scanning the target code on the PCB board using a handheld terminal; the target code is imprinted on the process card of the PCB board; generating a visual electroplating operation interface on the handheld terminal based on the electroplating operation data; generating electroplating confirmation information in response to a first operation on the electroplating operation interface, the first operation representing an operation to confirm the consistency between the target electroplating parameters on the electroplating operation interface and the production electroplating parameters of the electroplating target; and controlling the electroplating target to electroplat the PCB board to be electroplated based on the electroplating confirmation information to obtain the target PCB board. By scanning the target code on the handheld terminal, the electroplating parameters can be automatically entered, and the corresponding electroplating target can be automatically selected for electroplating, resulting in high electroplating efficiency, eliminating the need for manual input of electroplating parameters, reducing electroplating errors, and lowering electroplating costs.

[0169] like Figure 2 As shown, Figure 2 A structural block diagram of a controller 1000 according to an embodiment of this application is shown. The components of the controller 1000 include, but are not limited to, a memory 1200 and a processor 1100. The processor 1100 is connected to the memory 1200 via a bus, and the memory 1200 is used to store data.

[0170] The controller 1000 also includes an access device that enables the controller 1000 to communicate via one or more networks. Examples of such networks include a Public Switched Telephone Network (PSTN), a Local Area Network (LAN), a Wide Area Network (WAN), a Personal Area Network (PAN), or a combination of communication networks such as the Internet. The access device may include one or more of any type of wired or wireless network interface (e.g., a Network Interface Card (NIC)), such as an IEEE 802.11 Wireless Local Area Network (WLAN) wireless interface, a Global System for Microwave Access (GSM) interface, or a Wi-Fi interface. MAX interface, Ethernet interface, Universal Serial Bus (USB) interface, Cellular network interface, Bluetooth interface, Near Field Communication (NFC) interface, etc.

[0171] The controller 1000 can be any type of stationary or mobile electronic device, including mobile computers or mobile electronic devices (e.g., tablet computers, personal digital assistants, laptop computers, notebook computers, netbooks, etc.), mobile phones (e.g., smartphones), wearable electronic devices (e.g., smartwatches, smart glasses, etc.) or other types of mobile devices, or stationary electronic devices such as desktop computers or PCs. The controller 1000 can also be a mobile or stationary server.

[0172] The processor 1100 is used to execute computer-executable instructions for the electroplating control method of the PCB board.

[0173] The above is a schematic diagram of a controller according to this embodiment. It should be noted that the technical solution of this controller belongs to the same concept as the technical solution of the PCB board electroplating control method described above. For details not described in detail in the technical solution of the controller, please refer to the description of the technical solution of the PCB board electroplating control method described above.

[0174] According to an embodiment of this application, a PCB board electroplating control system is also provided. The PCB board electroplating control system includes a controller 1000, which realizes the automatic completion of PCB board electroplating. It should be noted that the technical solution of this PCB board electroplating control system and the technical solution of the above-described PCB board electroplating control method belong to the same concept. For details not described in detail in the technical solution of the computing device, please refer to the description of the technical solution of the above-described PCB board electroplating control method.

[0175] This application embodiment also provides a storage medium, which is a computer-readable storage medium, storing a computer program that, when executed by a processor, implements the above-described electroplating control method for the PCB board.

[0176] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0177] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as processors, such as central processing units, digital signal processors, or microprocessors executing software, or as hardware, or as integrated circuits, such as application-specific integrated circuits. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0178] The above provides a detailed description of the preferred embodiments of this application. However, this application is not limited to the above-described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this application. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A method for controlling the electroplating of a PCB board, characterized in that, include: After scanning the target code of the PCB board to be electroplated by the handheld terminal, the target electroplating parameters and electroplating operation data of the PCB board to be electroplated are obtained. The target code is printed on the process card of the PCB board to be electroplated. The step of obtaining the target electroplating parameters and electroplating operation data of the PCB board to be electroplated by scanning the target code of the PCB board to be electroplated through the handheld terminal includes: after scanning the target code of the PCB board to be electroplated through the handheld terminal: obtaining production operator information, which indicates the operator's proficiency, operation type, and operation level; generating the electroplating operation data according to the production operator information and preset generation rules; obtaining the production priority and workshop production information of the PCB board to be electroplated, which indicates the real-time production capacity and production equipment operation information of the production workshop; and generating the target electroplating parameters according to the production priority and workshop production information, which indicate the electroplating sequence information, electroplating target information, electroplating current information, electroplating time information, and electroplating area information of the PCB board to be electroplated. A visual electroplating operation interface is generated on the handheld terminal based on the electroplating operation data. The electroplating operation interface generated by different operators is different. Electroplating confirmation information is generated in response to a first operation on the electroplating operation interface. The first operation represents an operation to confirm the consistency between the target electroplating parameters on the electroplating operation interface and the production electroplating parameters of the electroplating target. Generating the electroplating confirmation information in response to the first operation on the electroplating operation interface includes: in response to the first operation, obtaining the production model at the electroplating target, the production model indicating the production electroplating parameters; if the production model includes the target electroplating model, configuring the electroplating confirmation information to allow production, the target electroplating model indicating the target electroplating parameters; if the production model does not include the target electroplating model, configuring the electroplating confirmation information to disallow production. Based on the electroplating confirmation information, the electroplating target is controlled to perform electroplating on the PCB board to be electroplated to obtain the target PCB board.

2. The electroplating control method for PCB boards according to claim 1, characterized in that, The process of obtaining the production priority and workshop production information of the PCB board to be electroplated includes: Obtain real-time and historical production data from the workshop; The real-time production capacity is determined based on real-time production data; The production equipment operation information is determined based on the historical production duration, historical production frequency, historical product production type and historical operating parameters represented by the historical production data. The production equipment operation information is used to indicate the aging degree of the production equipment and the corresponding optimal operating parameters. The first priority score is determined based on the delivery deadline of the PCB board to be electroplated, the customer type, and the first weighting coefficient. The second priority score is determined based on the profit of the PCB board to be electroplated and the second weighting coefficient. The third priority score is determined based on the process complexity, production risk coefficient, and third weighting coefficient of the electroplated PCB board. The fourth priority score is determined based on the degree of matching between the process parameters of the electroplated PCB board and the operating information of the production equipment, and the fourth weighting coefficient. The production priority is determined based on the first priority score, the second priority score, the third priority score, and the fourth priority score.

3. The electroplating control method for PCB boards according to claim 1, characterized in that, The step of generating the target electroplating parameters based on the production priority and the workshop production information includes: A production sequence table is determined based on the production priority of each of the PCB boards to be electroplated, and the production sequence table is used to indicate the electroplating sequence information; The electroplating target information, electroplating current information, electroplating time information, and electroplating area information are determined based on the process parameters of the electroplated PCB board and the workshop production information.

4. The electroplating control method for PCB boards according to claim 3, characterized in that, The process of determining the electroplating target information, electroplating current information, electroplating time information, and electroplating area information based on the process parameters of the electroplated PCB board and the workshop production information includes: The electroplating target information is determined based on the electroplating precision indicated by the process parameters of the electroplated PCB board, the electroplating target aging information indicated by the workshop production information, and the workshop idle equipment information. The electroplating target indicated by the electroplating target information is used to electroplat the electroplated PCB board. The electroplating current information is determined based on the standard electroplating current indicated by the process parameters of the electroplated PCB board, the maximum electroplating current and aging degree indicated by the electroplating target information, and the real-time production capacity. The electroplating time information is determined based on the electroplating area information and the electroplating current information indicated by the process parameters of the electroplated PCB board.

5. The electroplating control method for PCB boards according to claim 3, characterized in that, The process of determining the electroplating target information, electroplating current information, electroplating time information, and electroplating area information based on the process parameters of the electroplated PCB board and the workshop production information includes: Construct a multi-objective optimization model for calculating electroplating parameters; The process parameters of the electroplated PCB board and the workshop production information are input into the electroplating parameter calculation model; The optimization objectives of the electroplating parameter calculation model are configured as maximizing production efficiency, minimizing electroplating time, maximizing electroplating compliance rate, and minimizing electroplating target aging. Construct the objective function corresponding to the optimization objective; The design variables of the electroplating parameter calculation model are configured as the model of the electroplating target, the current of the electroplating target, and the electroplating time of the electroplating target. The constraints of the electroplating parameter calculation model are configured as the process parameter constraints of the electroplating PCB board, the maximum current constraint of the electroplating target, and the maximum production quantity constraint of the electroplating target. Based on the constraints, the objective function, and the optimization objective, the Pareto optimal solution set is obtained by iterating the design variables. Based on production efficiency, a target solution is selected from the Pareto optimal solution set to indicate the electroplating target information, the electroplating current information, the electroplating time information, and the electroplating area information.

6. The electroplating control method for PCB boards according to claim 1, characterized in that, The step of generating a visual electroplating operation interface on the handheld terminal based on the electroplating operation data includes: The operator's skill level, operation type, and operation level are determined based on the electroplating operation data. A template is selected based on the user's proficiency level, and different templates correspond to different user proficiency levels. Generate the corresponding operation module on the generation template according to the operation type; The electroplating operation interface is obtained by setting the operation permissions of the operation module according to the operation level.

7. An electroplating control system for a PCB board, characterized in that, The system includes a controller, which comprises a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the electroplating control method for the PCB board according to any one of claims 1-6.

8. A computer storage medium, characterized in that, The computer storage medium stores computer-executable instructions, which are used to execute the electroplating control method for the PCB board according to any one of claims 1-6.

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