Wafer detection device and method

Abstract

The invention provides a wafer detection device and method. The wafer detection device comprises an interface device used for placing a wafer to be detected; the rotary positioning device is used for executing alignment operation of the wafer and is provided with a wafer drying device, and the wafer drying device is used for drying the wafer; comprising a first carrying table, a front surface detection device and a back surface detection device, the first carrying table is used for fixing a wafer, the front surface detection device is used for detecting front surface defects of the wafer on the first carrying table, and the back surface detection device is used for detecting back surface defects of the wafer; the feeding manipulator is used for transferring the wafer in the interface device to the rotary positioning device, transferring the wafer in the rotary positioning device to the wafer detection equipment and transferring the wafer in the wafer drying device to the interface device; and the unloading manipulator is arranged independent of the loading manipulator and is used for transferring the wafer in the wafer detection equipment to the wafer drying device. The wafer detection device is used in the wafer detection method.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor production equipment, and in particular to a wafer detection device and method. BACKGROUND

[0002] In the post-cut wafer membrane detection technology, the industry generally adopts a water-added membrane detection method, which allows the membrane to form a clear image in the field of view of the detection lens group by contacting the membrane with water, thereby achieving effective detection of the defects on the back of the wafer. However, the existing water-added membrane detection technology still has many technical difficulties to be solved: Firstly, the wafer back membrane needs to be in full contact with water during the detection process, resulting in residual water on the surface of the back membrane after detection, and water protection treatment becomes a prominent problem. Secondly, in the existing technology, the wafer feeding and discharging share one robot, and the robot inevitably contacts the water on the surface of the back membrane when taking out the wafer, which further causes the wafer product to be wet during subsequent discharging, affecting the normal progress of the subsequent processing procedure. Thirdly, in order to achieve back detection, the existing technology often needs to set a wafer flipping action, but there is a risk of wafer loss during the flipping process, causing product loss. SUMMARY

[0003] The present disclosure provides a wafer detection device and method.

[0004] According to one aspect of the present disclosure, a wafer detection device is provided, comprising: an interface device for placing a wafer to be detected; a rotating positioning device for performing alignment operation of the wafer and provided with a wafer drying device for drying the wafer; a wafer detection apparatus comprising a first stage, a front detection device and a back detection device, the first stage being used for fixing a wafer, the front detection device being arranged above the first stage and being used for detecting front defects of the wafer on the first stage, and the back detection device being arranged below the first stage and being used for detecting back defects of the wafer; a feeding robot for transferring the wafer in the interface device to the rotating positioning device, transferring the wafer in the rotating positioning device to the wafer detection apparatus, and transferring the wafer in the wafer drying device to the interface device; and a discharging robot independently arranged with the feeding robot and used for transferring the wafer in the wafer detection apparatus to the wafer drying device.

[0005] According to the technical scheme of one aspect of the present disclosure, the wafer detection device works in the following way: the wafer to be detected is placed on the interface device, the wafer is transferred to the rotary positioning device by the loading manipulator to perform alignment operation, and then the wafer is transferred to the wafer detection equipment; in the wafer detection equipment, the first stage fixes the wafer, the front detection device detects the front defects of the wafer, and at the same time, the back detection device accommodates the transparent liquid in the cavity in the support part to soak the outer surface of the blue film on the back of the wafer, so as to detect the back defects of the wafer; then, the wafer is transferred to the wafer drying device by the unloading manipulator for drying; and the dried wafer is transferred back to the interface device by the loading manipulator. The technical scheme solves the problems in the background art: the wafer drying device removes the residual moisture on the surface of the wafer back film, avoiding the water protection problem; the unloading manipulator and the loading manipulator are independently arranged, realizing the dry and wet separation of the manipulator, preventing the product from being wetted due to the water on the manipulator; the back detection device is arranged below the first stage, without the need to flip the wafer to detect the back defects, thereby eliminating the risk of wafer falling off.

[0006] According to the wafer detection device of at least one embodiment of the present disclosure, the wafer drying device comprises: a base provided with a air-drying chamber; a stage assembly comprising a second stage rotatably arranged on the base, the second stage being used for carrying a wafer and being provided with a microporous structure for adsorbing moisture on the back of the wafer; a clamping mechanism comprising clamping components and a clamping driving mechanism, the number of the clamping components is at least two, and the clamping components are movably arranged outside the second stage assembly, the clamping driving mechanism is arranged on the base and is used for driving the clamping components to approach each other to clamp the wafer; a jacking mechanism arranged on the base and used for receiving the wafer and then lowering the wafer to place the wafer on the second stage; and a rotating mechanism arranged on the base and connected with the second stage and used for driving the second stage to rotate; the wafer drying device comprises an air-drying mechanism arranged in the air-drying chamber of the base and used for air-drying the back of the wafer located in the air-drying chamber.

[0007] In the technical scheme of the present embodiment, the working principle of the wafer drying device is as follows: the wafer detection equipment is transferred to the air-drying chamber by the unloading manipulator, the jacking mechanism receives the wafer and then lowers the wafer to place the wafer on the second stage; the clamping driving mechanism of the clamping mechanism drives the clamping components to approach each other to clamp the edge of the wafer; the microporous structure of the second stage adsorbs the moisture on the back of the wafer, and at the same time, the rotating mechanism drives the second stage to rotate, and the air-drying mechanism air-dries the back of the wafer. Through the synergistic effect of the microporous structure and the air-drying mechanism, the residual moisture on the surface of the wafer back film is efficiently removed, avoiding the water protection problem; combined with the dry and wet separation design of the unloading manipulator and the loading manipulator, it is ensured that there is no residual moisture when the dried wafer is transferred to the interface device, preventing the product from being wetted and affecting the subsequent processing process.

[0008] The wafer detection device according to at least one embodiment of the present disclosure is characterized in that a plurality of vacuum suction cups are arranged in the air drying chamber, and the vacuum suction cups are used to support and adsorb the wafer, so that the wafer is fixed in the air drying chamber.

[0009] The wafer detection device according to at least one embodiment of the present disclosure is characterized in that the air drying mechanism comprises an air knife arranged in the air drying chamber in a slidable manner, and an air knife driving mechanism arranged on the base and connected with the air knife, and the air knife driving mechanism is used to drive the air knife to move, so that the air outlet path of the air knife covers the back surface of the wafer.

[0010] In the technical scheme of the present embodiment, the vacuum suction cups support and adsorb the wafer, so that the wafer is stably fixed in the air drying chamber; the air knife driving mechanism drives the air knife to move, so that the air outlet path of the air knife covers the back surface of the wafer, and at the same time, the rotating mechanism drives the second carrier to rotate, so as to ensure that the air flow uniformly acts on the back surface of the wafer. The vacuum suction cups prevent the wafer from moving during the air drying process, and the movable air outlet path of the air knife realizes the overall air drying of the back surface of the wafer, thereby significantly improving the drying efficiency and uniformity.

[0011] The wafer detection device according to at least one embodiment of the present disclosure is characterized in that the clamping driving mechanism comprises a plurality of synchronous wheels, a synchronous belt and clamping cylinders, the number of the synchronous wheels is at least two, the synchronous wheels are rotatably arranged on the base, the synchronous belt is connected with the synchronous wheels and forms two connection sections parallel to each other, the two connection sections are respectively connected with two clamping components, and the clamping cylinders are arranged on the base and connected with the clamping components, and the clamping cylinders are used to drive the clamping components to move along the extension direction of the connection sections.

[0012] The wafer detection device according to at least one embodiment of the present disclosure is characterized in that the clamping mechanism further comprises a roller rotatably arranged on the clamping component, the clamping component is provided with a recess on the side close to the second carrier, the shape of the recess is matched with the shape of the wafer or the carrier of the wafer, and the roller is located at the edge of the recess.

[0013] The wafer detection device according to at least one embodiment of the present disclosure is characterized in that the jacking mechanism comprises a jacking driving mechanism, a connecting ring, a jacking rod and a linear guide rail assembly, the connecting ring is connected with the base in a liftable and lowerable manner through the linear guide rail assembly, the jacking rod is arranged on the top of the connecting ring and used to support the wafer, and the jacking driving mechanism is connected with the connecting ring and used to drive the connecting ring to move up and down.

[0014] The wafer detection device according to at least one embodiment of the present disclosure is characterized in that a position detection device is arranged between the second carrier and the base, and the position detection device is used to detect the rotating position of the second carrier.

[0015] In the technical solution of the above embodiment, the clamping cylinder drives the clamping components to move along the extension direction of the connecting section of the synchronous belt, so that the clamping components are close to each other. The concave part of the clamping component is adapted to the shape of the wafer or wafer carrier. The roller reduces friction during the clamping process and avoids clamping damage. The lifting drive mechanism drives the top rod to rise and fall through the connecting ring and linear guide rail assembly. After receiving the wafer, it descends to the second platform. That is, the coordinated work of the lifting mechanism and the position detection device ensures the accurate positioning and efficient transfer of the wafer during the drying process. The position detection device detects the rotation position of the second platform in real time to ensure that the rotating mechanism accurately controls the rotation angle and alignment accuracy.

[0016] According to one aspect of this disclosure, a wafer inspection method is provided, using the wafer inspection apparatus described in any one of the preceding claims, comprising: placing a wafer to be inspected on an interface device; transferring the wafer from the interface device to a rotary positioning device using a loading robot; performing a wafer alignment operation in the rotary positioning device; transferring the wafer from the rotary positioning device to a first stage of a wafer inspection device using the loading robot; detecting front defects of the wafer using a front inspection device disposed above the first stage, and detecting back defects of the wafer using a back inspection device disposed below the first stage; transferring the wafer from the wafer inspection device to a wafer drying device using an unloading robot; drying the wafer in the wafer drying device; and transferring the dried wafer in the wafer drying device to the interface device using the loading robot.

[0017] According to one aspect of the technical solution of this disclosure, the wafer inspection method achieves dry and wet separation of the unloading robot and the loading robot by setting them independently, thus avoiding the product getting wet due to water getting on the robot during the unloading process; by setting the back inspection device below the first stage, back defects can be detected without flipping the wafer, thus completely eliminating the risk of wafer falling off; and by removing residual moisture on the surface of the wafer back film by the wafer drying device, the water protection problem is effectively solved.

[0018] According to at least one embodiment of the wafer inspection method of this disclosure, the wafer alignment operation performed in the rotary positioning device includes: a lifting mechanism receiving the wafer and lowering it to place the wafer on a second stage, so that the back side of the wafer contacts the microporous structure of the second stage, and the microporous structure adsorbs moisture on the back side of the wafer; determining the angle of the wafer, and when the wafer angle is different from a preset angle, driving the second stage to rotate through a rotating mechanism to make the two the same; and a clamping mechanism driving each clamping component to clamp the wafer through a clamping drive mechanism to fix the wafer position.

[0019] In the technical solution of this embodiment, the moisture on the back side of the wafer is actively adsorbed by the microporous structure, which significantly reduces the amount of residual moisture on the surface of the back film before detection; the precise fixation of the clamping mechanism ensures the stability of the alignment operation. Attached Figure Description

[0020] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0021] Figure 1 This is a schematic diagram of a wafer inspection apparatus according to one embodiment of the present disclosure.

[0022] Figure 2 This is a schematic diagram of a wafer inspection apparatus according to one embodiment of the present disclosure.

[0023] Figure 3 This is a schematic diagram of the structure of a rotary positioning device and a wafer drying device according to one embodiment of the present disclosure.

[0024] Figure 4 This is a perspective view of a rotary positioning device and a wafer drying device according to one embodiment of the present disclosure.

[0025] Figure 5 This is a side view of a rotary positioning device and a wafer drying device according to one embodiment of the present disclosure.

[0026] Figure 6 This is a front view of a rotary positioning device and a wafer drying device according to one embodiment of the present disclosure.

[0027] Figure 7 This is a structural schematic diagram of a lifting mechanism according to one embodiment of the present disclosure.

[0028] Figure 8 This is a schematic diagram of the clamping mechanism according to one embodiment of the present disclosure.

[0029] Figure 9 This is a flowchart of a wafer drying method according to one embodiment of the present disclosure.

[0030] Figure 10 This is a flowchart of a wafer inspection method according to one embodiment of the present disclosure.

[0031] Explanation of reference numerals in the attached figures: 100. Interface device 200. Rotary positioning device 210. Base 211. Drying Room 212. Vacuum suction cup 220. Second platform 230. Clamping mechanism 231. Clamping components 2311. concave part 232. Clamping drive mechanism 2321, Synchronous Pulley 2322, Synchronous Belt 2323, Clamping Cylinder 233. Roller 240. Lifting Mechanism 241. Lifting drive mechanism 242. Connecting ring 243. Top rod 244. Linear guide rail assembly 250. Rotating mechanism 260. Air drying mechanism 261. Wind Knife 262. Air knife drive mechanism 270. Position detection device 271. Photoelectric sensor 272. Sensor sheet 300. Wafer Inspection Equipment 310. Backside detection device 320. Front detection device 330. First Platform 400. Loading robot 500. Unloading robot 600, wafer. Detailed Implementation

[0032] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present disclosure are shown in the accompanying drawings.

[0033] It should be noted that, where there is no conflict, the embodiments and features described in this disclosure can be combined with each other. The technical solutions of this disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0034] Unless otherwise stated, the exemplary implementations / embodiments shown are to be understood as providing exemplary features of various details that provide ways in which the technical concepts of this disclosure can be implemented in practice. Therefore, unless otherwise stated, the features of various implementations / embodiments may be additionally combined, separated, interchanged and / or rearranged without departing from the technical concepts of this disclosure.

[0035] To facilitate description and make the technical solutions of this disclosure easier to understand, the terminology of this disclosure will be explained before describing the technical solutions of this disclosure.

[0036] Interface device: refers to the loading port component used to place the wafer to be tested, usually a standard wafer transfer box or cassette interface, to realize the initial loading and temporary storage of the wafer.

[0037] First platform: refers to the main carrier platform used to fix the wafer in the wafer inspection equipment.

[0038] Support section: refers to the annular boss structure in the back-side inspection device that directly supports the wafer. It is located at the top of the support head and is used to support the outer surface of the blue film on the back side of the wafer, while also forming the upper boundary of the cavity.

[0039] Cavity: refers to the annular sealed cavity formed within the support section, which is enclosed by a transparent plate and the inner wall of the through hole. It is specifically used to contain transparent liquid (such as deionized water) to wet the outer surface of the blue membrane and achieve transmembrane imaging.

[0040] Blue film: refers to the blue protective film adhered to the back of the wafer after dicing. It is made of polyurethane material and is used to support the wafer fragments after dicing. In transillumination inspection, it needs to be wetted with a transparent liquid to improve the image clarity.

[0041] In existing technologies, post-dicing wafer transillumination inspection generally employs a water-based transillumination method. By allowing the blue film to come into contact with water, a clear image is formed in the field of view of the inspection lens group, thereby enabling back-side defect detection. However, this technology has three major problems: First, residual moisture on the surface of the blue film after inspection makes water protection difficult during the unloading stage; second, the shared robotic arm for unloading and loading causes the robotic arm to become wet, resulting in product wetting and affecting subsequent processes; third, back-side inspection requires flipping the wafer 600 degrees, posing a risk of wafer drop.

[0042] This disclosure provides a wafer inspection apparatus, including an interface device 100, a rotary positioning device 200, a wafer inspection equipment 300, a loading robot 400, a wafer drying device, and an unloading robot 500.

[0043] The interface device 100 is used to place the wafer 600 to be tested.

[0044] The rotary positioning device 200 is used to perform the alignment operation of the wafer 600 and is provided with a wafer drying device for drying the wafer 600.

[0045] The wafer inspection equipment 300 includes a first stage 330, a front inspection device 320, and a back inspection device 310. The first stage 330 is used to fix the wafer 600. The front inspection device 320 is disposed above the first stage 330 and is used to inspect the front defects of the wafer 600. The back inspection device 310 is disposed below the first stage 330 and is used to inspect the back defects of the wafer 600.

[0046] The loading robot 400 is used to transfer the wafer 600 in the interface device 100 to the rotary positioning device 200, transfer the wafer 600 in the rotary positioning device 200 to the wafer inspection device 300, and transfer the wafer 600 in the wafer drying device to the interface device 100.

[0047] The unloading robot 500 and the loading robot 400 are set up independently and are used to transfer the wafer 600 in the wafer inspection equipment 300 to the wafer drying device.

[0048] The loading robot 400 and the unloading robot 500 can be existing robots used to grip and move the wafer 600.

[0049] In the wafer inspection device described above, the wafer 600 to be inspected is transferred from the interface device 100 to the rotary positioning device 200 via the loading robot 400 for alignment, and then transferred to the wafer inspection equipment 300. The first stage 330 fixes the wafer 600, and the front inspection device 320 inspects for defects on the front side. After inspection, the unloading robot 500 independently transfers the wafer 600 to the wafer drying device for drying, and the loading robot 400 then transfers the dried wafer 600 back to the interface device 100.

[0050] The wafer inspection device of the above technical solution can solve the above-mentioned technical problems in the prior art: through the dry and wet separation design of the unloading robot 500 and the loading robot 400, the loading robot 400 is prevented from getting wet and causing the product to become wet; through the back inspection device 310 being set below the first stage 330, back defects can be detected without flipping the wafer 600, eliminating the risk of wafer drop and ensuring the normal operation of subsequent processing steps.

[0051] Currently, the wafer drying process faces three major technical challenges: First, the product is easily damaged: conventional methods (such as brushing to absorb water) may damage the fragile 600 wafers through physical contact, destroying critical structures such as dicing channels and affecting yield. Second, incomplete drying: residual moisture leads to problems such as water stains and poor adhesion, reducing product quality and stability. Finally, the equipment is inadequate: existing equipment lacks positioning and angle adjustment functions, making it incompatible with the alignment requirements of the 600 wafers before inspection.

[0052] Figure 3This is a schematic diagram of the structure of a rotary positioning device 200 and a wafer drying apparatus according to one embodiment of the present disclosure. Figure 4 This is a perspective view of a rotary positioning device 200 and a wafer drying apparatus according to one embodiment of the present disclosure. Figure 5 This is a side view of a rotary positioning device 200 and a wafer drying apparatus according to one embodiment of the present disclosure. Figure 6 This is a front view of a rotary positioning device 200 and a wafer drying apparatus according to one embodiment of the present disclosure.

[0053] See Figures 3 to 6 As shown, in some embodiments of this disclosure, the rotary positioning device 200 includes: a base 210, a second stage 220 assembly, a clamping mechanism 230, a lifting mechanism 240, and a rotating mechanism 250, and the wafer drying device includes a drying mechanism 260.

[0054] The base 210 serves as the basic support structure for the entire device, and a drying chamber 211 is installed inside it. The drying chamber 211 is a closed or semi-closed space used to accommodate the wafer 600 for drying operations.

[0055] The second stage 220 is rotatably mounted on the base 210. The surface of the second stage 220 integrates a microporous structure composed of tiny through-holes penetrating the surface of the second stage 220. These through-holes are used to directly absorb moisture from the back side of the wafer 600 when it is placed on the second stage 220. The distribution of the microporous structure covers the central region of the second stage 220 to ensure sufficient contact with the back side of the wafer 600. Exemplarily, the second stage 220 is made of ceramic, and the microporous structure is a ceramic microporous structure.

[0056] Figure 8 This is a schematic diagram of the clamping mechanism 230 according to one embodiment of the present disclosure.

[0057] like Figure 8 As shown, the clamping mechanism 230 includes clamping components 231 and clamping drive mechanism 232. The number of clamping components 231 is at least two and is movably disposed on the outside of the second stage 220 assembly. The clamping drive mechanism 232 is disposed on the base 210 and is used to drive each clamping component 231 to move closer to each other to clamp the wafer 600.

[0058] The lifting mechanism 240 is located on the base 210 and is used to receive the wafer 600 and lower it to place the wafer 600 on the second stage 220.

[0059] The rotating mechanism 250 is disposed on the base 210 and connected to the second platform 220, and is used to drive the second platform 220 to rotate.

[0060] The drying mechanism 260 is disposed in the drying chamber 211 of the base 210 and is used to dry the back side of the wafer 600 located in the drying chamber 211.

[0061] The above technical solution's rotary positioning device 200 directly adsorbs moisture from the back side of the wafer 600 through the microporous structure of the second stage 220, achieving preliminary moisture removal and avoiding water stains or adhesion problems caused by residual moisture; the rotary mechanism 250 drives the second stage 220 to rotate, adjusting the angle of the wafer 600 to meet the alignment requirements before AOI inspection (achieved by existing wafer inspection equipment 300, such as...). Figure 3 and Figure 5 (As shown); the clamping mechanism 230 gently clamps the edge of the wafer 600 through the clamping component 231, fixing its position and preventing the wafer 600 from moving or being impacted by external forces during the drying process, thus protecting the fragile dicing structure; the lifting mechanism 240 smoothly receives and lowers the wafer 600, reducing vibration and impact during placement; the drying mechanism 260 performs secondary drying on the back side of the wafer 600 in the drying chamber 211 to ensure thorough drying. The rotary positioning device 200 and the wafer drying device in the above technical solutions effectively solve the problems of incomplete drying of the wafer 600 (such as residual moisture on the back of the film), easy damage to the product (such as dicing damage caused by conventional brushes), and lack of positioning and angle adjustment functions (requiring multiple transfers to extend the cycle), thus improving the reliability and efficiency of the drying process.

[0062] like Figure 5 and Figure 6 As shown, to facilitate fixing the wafer 600 within the drying chamber 211, several vacuum suction cups 212 are installed inside the drying chamber 211. These vacuum suction cups 212 are evenly distributed at the bottom or side walls of the drying chamber 211 to support and adsorb the wafer 600, ensuring that the wafer 600 remains in a fixed position during the drying process. The vacuum suction cups 212 stably support the wafer 600 through negative pressure adsorption, ensuring it remains in a fixed position during drying and preventing displacement caused by airflow disturbances or mechanical vibrations. This design ensures that the wafer 600 is subjected to uniform force, reducing localized pressure concentration and thus preventing damage to the edges or surface of the wafer 600. It also improves the uniformity of drying, avoids drying dead zones, and further ensures thorough drying.

[0063] like Figure 5 and Figure 6As shown, in one embodiment of the aforementioned drying mechanism 260, the drying mechanism 260 includes an air knife 261 slidably disposed within the drying chamber 211, and an air knife driving mechanism 262 disposed on the base 210. The air knife 261 is mounted on a slide rail of the base 210 via a slider and can move linearly along the slide rail. The air knife driving mechanism 262 is connected to the air knife 261 and is used to drive the air knife 261 to move so that the air outlet path of the air knife 261 covers the back side of the wafer 600. The air knife driving mechanism 262 can be an existing linear motion module, such as a ball screw module, and is mounted on the base 210, with its linear motion component connected to the air knife 261. Through the precise sliding control of the air knife driving mechanism 262, the air knife 261 dynamically adjusts its air outlet position to ensure that the airflow path completely covers the entire back side of the wafer 600, avoiding the uneven coverage problem caused by fixing the air knife 261, achieving efficient and uniform removal of moisture, and reducing the risk of local residue.

[0064] like Figure 4 and Figure 8 As shown, in one embodiment of the clamping mechanism 230, the clamping component 231 is a gripper, and the clamping drive mechanism 232 includes a synchronous pulley 2321, a synchronous belt 2322, and a clamping cylinder 2323. There are at least two synchronous pulleys 2321, which are rotatably mounted on the base 210, such as by means of a rotating shaft. The synchronous belt 2322 is connected to each synchronous pulley 2321, forming two parallel connecting sections. Exemplarily, there are two synchronous pulleys 2321 with the same outer diameter. The synchronous belt 2322 is connected to the two synchronous pulleys 2321, forming two connecting sections on both sides of each synchronous pulley 2321. Each connecting section is connected to one of the two clamping components 231. The clamping cylinder 2323 is mounted on the base 210, and its piston rod is connected to the clamping component 231, used to drive the clamping component 231 to move along the extension direction of the connecting section. During operation, the clamping cylinder 2323 drives one of the clamping components 231 to move, which in turn drives another clamping component 231 to move in the opposite direction, thereby realizing the opening and closing action of the clamping components 231. The cooperation of the synchronous pulley 2321 and the synchronous belt 2322 ensures that multiple clamping components 231 move synchronously, achieving a uniform distribution of clamping force. The clamping cylinder 2323 provides controllable driving force, making the clamping process smooth and shock-free, effectively avoiding uneven clamping that could cause the wafer 600 to tilt or be subjected to localized pressure, reducing the risk of breakage of the fragile wafer 600, while also simplifying the complexity of the mechanism and improving operational reliability.

[0065] Furthermore, the clamping mechanism 230 also includes a roller 233 rotatably disposed on the clamping member 231. The clamping member 231 has a recess 2311 on the side near the second stage 220. The shape of the recess 2311 is adapted to the shape of the wafer 600 or its carrier. The roller 233 is located at the edge of the recess 2311. Exemplarily, the recess 2311 includes a bottom surface and symmetrically arranged inclined surfaces on both sides of the bottom surface. The roller 233 protrudes from the bottom surface and the inclined surfaces. In this embodiment, the recess 2311 is designed according to the contour of the wafer 600, providing precise positioning and support. The roller 233 rolls in contact with the edge of the wafer 600 during clamping, reducing sliding friction and avoiding surface damage caused by direct scraping. This structure allows the wafer 600 to be finely adjusted in position during clamping, ensuring stable clamping without generating excessive squeezing force, further protecting the integrity of the wafer 600's edge.

[0066] Figure 7 This is a structural schematic diagram of a lifting mechanism 240 according to one embodiment of the present disclosure.

[0067] like Figure 7 As shown, in one embodiment of the lifting mechanism 240, the lifting mechanism 240 includes a lifting drive mechanism 241, a connecting ring 242, a push rod 243, and a linear guide assembly 244. The connecting ring 242 is movably connected to the base 210 via the linear guide assembly 244, and is used to connect the push rods 243. The push rods 243 are disposed on the top of the connecting ring 242 and are used to support the wafer 600. The lifting drive mechanism 241 is connected to the connecting ring 242 and is used to drive the connecting ring 242 to move up and down. The linear guide assembly 244 constrains the lifting trajectory, ensuring vertical and stable lifting and reducing swaying; the push rods 243 evenly distribute support for the wafer 600, dispersing the load pressure; the lifting drive mechanism 241 precisely controls the moving speed and position, making the wafer 600 receiving and placing action smooth; this lifting mechanism 240 significantly reduces vibration and impact during the lifting process, preventing damage to the wafer 600 due to bumps during transfer.

[0068] For example, a flexible component such as a rubber head may be provided on the top of the push rod 243, which contacts the wafer 600 to reduce wear on the wafer 600.

[0069] For example, the lifting drive mechanism 241 can be a cylinder, the main body of which is mounted on the bracket of the base 210, and its piston rod is connected to the connecting ring 242. In order to improve the stability of the lifting action, the number of lifting drive mechanisms 241 can be two or more, and they are evenly distributed on the connecting ring 242.

[0070] like Figure 6 and Figure 7As shown, to facilitate determining whether the wafer 600 has rotated to the preset angle, a position detection device 270 is provided between the second stage 220 and the base 210. The position detection device 270 is used to detect the rotation position of the second stage 220. The position detection device 270 provides real-time feedback on the rotation angle of the second stage 220, and works in conjunction with the rotation mechanism 250 to achieve closed-loop control. This design ensures that the wafer 600 angle is accurately adjusted to the preset position, meeting the requirements of the AOI inspection process, avoiding AOI inspection failures due to angle deviations, and improving the repeatability and stability of angle adjustment, while reducing the need for manual calibration.

[0071] For example, the position detection device 270 is a photoelectric sensor 271 and its sensing plate 272, which are respectively installed on the bottom of the second stage 220 and the support of the base 210. When the wafer 600 rotates to a preset angle, the photoelectric sensor 271 and its sensing plate 272 are in relative positions, generate an electrical signal, and feed the electrical signal back to the control system. The control system controls the rotating mechanism 250 to stop rotating according to the electrical signal, so as to fix the wafer 600.

[0072] Based on the aforementioned rotary positioning device 200 and wafer drying device, the specific operation procedures of the rotary positioning device 200 and wafer drying device are as follows: The unloading robot 500 places the wafer 600 (which has undergone backside inspection and has residual moisture) to be dried onto the push rod 243 of the lifting mechanism 240. The lifting mechanism 240 is activated, receiving the wafer 600 and slowly descending, smoothly placing the wafer 600 onto the second stage 220. At this time, the backside of the wafer 600 contacts the microporous structure of the second stage 220. The microporous structure removes the moisture on the backside of the wafer 600 through negative pressure adsorption, achieving preliminary drying. The position detection device 270 monitors the angular position of the wafer 600 in real time. If the detected angle of the wafer 600 does not match the preset angle (for example, due to offset caused by the transfer process), the rotation mechanism 250 drives the second stage 220 to rotate until the angle of the wafer 600 matches the preset angle. This step ensures that the wafer 600 is in the correct orientation to meet the requirements of subsequent inspection or drying. The clamping drive mechanism 232 is activated, and the clamping cylinder 2323 pushes the synchronous belt 2322 to move, causing each clamping component 231 to move synchronously along the connecting section of the synchronous belt 2322, bringing them closer together to clamp the edge of the wafer 600. During clamping, the roller 233 rolls along the edge of the recess 2311, gently contacting the wafer 600 to avoid sliding friction. After clamping, the position of the wafer 600 is fixed to prevent movement in subsequent operations. After the microporous structure has completed moisture adsorption and angle adjustment, the unloading robot 500 picks up the wafer 600 from the second stage 220 and transfers it into the drying chamber 211. The wafer 600 is placed on the vacuum suction cup 212 in the drying chamber 211, and the vacuum suction cup 212 immediately activates adsorption to firmly fix the wafer 600. The drying mechanism 260 is activated, and the air knife drive mechanism 262 drives the air knife 261 to slide within the drying chamber 211, dynamically covering the entire back side of the wafer 600 with the airflow path of the air knife 261. The airflow evenly blows across the back side of the wafer 600, removing residual moisture and achieving thorough drying. The drying process continues until all moisture has evaporated, leaving no water stains.

[0073] Figure 9 This is a flowchart of a wafer drying method according to one embodiment of the present disclosure.

[0074] like Figure 9 As shown, this embodiment provides a wafer drying method using the aforementioned rotary positioning device 200 and wafer drying device. The wafer drying method includes: S310: After the lifting mechanism 240 receives the wafer 600, it descends and places the wafer 600 on the second stage 220, so that the back side of the wafer 600 contacts the microporous structure of the second stage 220, and the moisture on the back side of the wafer 600 is adsorbed through the microporous structure. S320: Determine the angle of wafer 600. When the angle of wafer 600 differs from the preset angle, drive the second stage 220 to rotate via the rotation mechanism 250 to make them the same; and S330: The clamping mechanism 230 drives each clamping component 231 to clamp the wafer 600 through the clamping drive mechanism 232 to fix the position of the wafer 600.

[0075] The wafer drying method described above first utilizes a lifting mechanism 240 to stably support the wafer 600 and place it on a second stage 220. The backside moisture is directly adsorbed through a microporous structure, achieving initial and efficient moisture removal and preventing residual moisture from affecting subsequent processes. Then, based on the position detection device 270, the wafer 600's angle is determined, and a rotation mechanism 250 precisely adjusts it to a preset position to meet AOI inspection requirements, eliminating the additional transfer step before drying in traditional methods. A clamping mechanism 230 fixes the wafer 600's position, ensuring stability during adsorption and inspection. Finally, the wafer 600 is moved to a drying chamber 211 for thorough drying. This method integrates adsorption, angle adjustment, and drying processes, reducing the number of wafer 600 transfers and significantly lowering the risk of damage to the fragile wafer 600 during transfer. The microporous structure adsorption combined with the drying mechanism 260 ensures complete moisture removal, avoiding water stains or film adhesion problems. The angle adjustment function directly supports the AOI inspection process, solving the problems of incomplete drying, product damage, and long production cycles in the background technology, thus improving overall process efficiency and product yield.

[0076] Furthermore, after the microporous structure adsorbs moisture on the back side of wafer 600 and AOI inspection of wafer 600 is completed, the unloading robot 500 moves wafer 600 from the second stage 220 into the drying chamber 211. Vacuum suction cups 212 then hold and adsorb wafer 600, fixing it within the drying chamber 211. The unloading robot 500 automates the movement of wafer 600, combined with the adsorption effect of the vacuum suction cups 212, achieving stable transfer and fixation before drying. The vacuum suction cups 212 provide uniformly distributed adsorption force, preventing wafer 600 from shifting due to airflow within the drying chamber 211, while also reducing potential damage to the wafer 600 surface from localized pressure. This design ensures a stable and efficient drying process, promotes uniform moisture evaporation, further improves drying quality, and eliminates the need for manual intervention, reducing operational risks.

[0077] The working principle of the rotary positioning device 200 and the wafer drying device in the above embodiments is as follows: The lifting mechanism 240 is set on the base 210. When it is necessary to receive the wafer 600, the top rod 243 of the lifting mechanism 240 rises to receive the wafer 600 that has completed the dicing process and has been exposed to water on the back side. After receiving, the lifting mechanism 240 descends and places the wafer 600 stably on the second stage 220 of the second stage 220 assembly. The clamping mechanism 230 includes at least two clamping components 231 that are movably disposed on the outside of the second stage 220 assembly and a clamping drive mechanism 232 disposed on the base 210. After the wafer 600 is placed on the second stage 220, the clamping drive mechanism 232 drives each clamping component 231 to move closer to each other, mechanically clamping and positioning the wafer 600 to ensure the positional accuracy of the wafer 600 in subsequent processing and to prevent the wafer 600 from moving and affecting the drying and inspection results. A rotating mechanism 250 is mounted on the base 210 and connected to the second stage 220. When the incoming direction of the wafer 600 is perpendicular to the AOI inspection lens group, requiring adjustment of the wafer 600 angle for better inspection, the rotating mechanism 250 drives the second stage 220 to rotate, thereby rotating the wafer 600 to the appropriate angle. The second stage 220 has a microporous structure. When the wafer 600 is placed on the microporous structure of the second stage 220, a vacuum suction operation is performed. Utilizing the adsorption effect of the microporous structure, moisture on the back film of the wafer 600 is absorbed, achieving preliminary water absorption and drying. A drying chamber 211 is provided on the base 210, and a drying mechanism 260 is located inside the drying chamber 211. After the preliminary water absorption is completed, the wafer 600 is placed in the drying chamber 211, and the drying mechanism 260 is activated to dry the back of the wafer 600, further removing residual moisture and ensuring the back of the wafer 600 is dry.

[0078] As an example, the wafer inspection device 300 can use the structure disclosed in CN120741510A (CN120741510B).

[0079] Figure 10 This is a flowchart of a wafer inspection method according to one embodiment of the present disclosure.

[0080] As shown in Figure 10, this disclosure also provides a wafer inspection method, using the wafer inspection apparatus of any one of the above, comprising: Step S100: Place the wafer 600 to be tested into the interface device 100; In step S200, the wafer 600 is transferred from the interface device 100 to the rotary positioning device 200 by the loading robot 400; Step S300: The alignment operation of the wafer 600 is performed in the rotary positioning device 200; In step S400, the wafer 600 is transferred from the rotary positioning device 200 to the first stage 330 of the wafer inspection equipment 300 by the loading robot 400; In step S500, the front inspection device 320 disposed above the first stage 330 is used to inspect the front defects of the wafer 600, and the back inspection device 310 disposed below the first stage 330 is used to inspect the back defects of the wafer 600. In step S600, the wafer 600 is transferred from the wafer inspection equipment 300 to the wafer drying device by the unloading robot 500; Step S700: Dry wafer 600 in a wafer drying apparatus; and In step S800, the wafer 600 dried in the wafer drying device is transferred to the interface device 100 by the loading robot 400.

[0081] As an example, in step S500, the front-side inspection device 320 disposed above the first stage 330 is used to inspect the front-side defects of the wafer 600, and the back-side inspection device 310 disposed below the first stage 330 is used to inspect the back-side defects of the wafer 600, which can be done using the method disclosed in CN120741510A (CN120741510B).

[0082] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0083] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A wafer inspection device, characterized in that, include: An interface device for placing a wafer to be inspected; A rotary positioning device is provided for performing the alignment operation of the wafer, and a wafer drying device is provided for drying the wafer; A wafer inspection device includes a first stage, a front inspection device, and a back inspection device. The first stage is used to fix a wafer. The front inspection device is disposed above the first stage and is used to detect front defects of the wafer on the first stage. The back inspection device is disposed below the first stage and is used to detect back defects of the wafer. A loading robot is used to transfer wafers from the interface device to the rotary positioning device, to the wafers from the rotary positioning device to the wafer inspection device, and to the wafers from the wafer drying device to the interface device. as well as The unloading robot arm, which is independently configured with the loading robot arm, is used to transfer the wafers in the wafer inspection equipment to the wafer drying device.

2. The wafer inspection apparatus according to claim 1, characterized in that, The wafer drying apparatus includes: The base is provided with a drying chamber; A stage assembly includes a second stage rotatably disposed on the base, the second stage being used to support a wafer and having a microporous structure for adsorbing moisture on the back side of the wafer; The clamping mechanism includes clamping components and a clamping drive mechanism. The number of clamping components is at least two and they are movably disposed outside the second stage assembly. The clamping drive mechanism is disposed on the base and is used to drive each of the clamping components to move closer to each other to clamp the wafer. A lifting mechanism, disposed on the base, is used to receive the wafer and lower it to place the wafer on the second stage; and A rotating mechanism is disposed on the base and connected to the second platform, for driving the second platform to rotate; The wafer drying apparatus includes a drying mechanism disposed in the drying chamber of the base, for drying the back side of the wafer located in the drying chamber.

3. The wafer inspection apparatus according to claim 2, characterized in that, The drying chamber is equipped with several vacuum suction cups, which are used to support and adsorb the wafers so that the wafers are fixed inside the drying chamber.

4. The wafer inspection apparatus according to claim 3, characterized in that, The air drying mechanism includes an air knife slidably disposed in the air drying chamber and an air knife driving mechanism disposed on the base. The air knife driving mechanism is connected to the air knife and is used to drive the air knife to move so that the air outlet path of the air knife covers the back side of the wafer.

5. The wafer inspection apparatus according to claim 4, characterized in that, The clamping drive mechanism includes a synchronous pulley, a synchronous belt, and a clamping cylinder. There are at least two synchronous pulleys, which are rotatably mounted on the base. The synchronous belt is connected to each synchronous pulley and forms two parallel connecting sections. The two connecting sections are respectively connected to two clamping components. The clamping cylinder is mounted on the base and connected to the clamping components, and is used to drive the clamping components to move along the extension direction of the connecting sections.

6. The wafer inspection apparatus according to claim 5, characterized in that, The clamping mechanism further includes a roller rotatably disposed on the clamping member. The clamping member has a recess on the side near the second stage. The shape of the recess is adapted to the shape of the wafer or the wafer carrier. The roller is located at the edge of the recess.

7. The wafer inspection apparatus according to claim 6, characterized in that, The lifting mechanism includes a lifting drive mechanism, a connecting ring, a push rod, and a linear guide rail assembly. The connecting ring is movably connected to the base via the linear guide rail assembly. The push rod is located on top of the connecting ring and is used to support the wafer. The lifting drive mechanism is connected to the connecting ring and is used to drive the connecting ring to move up and down.

8. The wafer inspection apparatus according to claim 2, characterized in that, A position detection device is provided between the second platform and the base, and the position detection device is used to detect the rotational position of the second platform.

9. A wafer inspection method, characterized in that, Using the wafer inspection apparatus according to any one of claims 1 to 8, comprising: Place the wafer to be tested into the interface device; The wafer is transferred from the interface device to the rotary positioning device by a loading robot; The wafer alignment operation is performed in the rotary positioning device; The loading robot transfers the wafer from the rotary positioning device to the first stage of the wafer inspection equipment. The front defects of the wafer are detected using a front inspection device positioned above the first stage, and the back defects of the wafer are detected using a back inspection device positioned below the first stage. The wafer is transferred from the wafer inspection equipment to the wafer drying device by a feeding robot; Drying the wafer in the wafer drying apparatus; and The loading robot transfers the dried wafer in the wafer drying device to the interface device.

10. The wafer inspection method according to claim 9, characterized in that, The alignment operation of the wafer performed in the rotary positioning device includes: After the lifting mechanism receives the wafer, it descends and places the wafer on the second stage, so that the back side of the wafer comes into contact with the microporous structure of the second stage, and the moisture on the back side of the wafer is adsorbed through the microporous structure. The wafer angle is determined; if the wafer angle differs from a preset angle, a rotating mechanism drives a second stage to rotate until the two angles are equal. The clamping mechanism drives each clamping component to clamp the wafer through the clamping drive mechanism to fix the wafer position.

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