Linear array spectral integration assembly and method of making same

Abstract

The present application relates to the technical field of spectral detection equipment, and provides a linear array spectrum integrated assembly and a preparation method thereof, which comprises: a microlens array layer, a linear gradient filter layer, a detector layer, a signal processing layer and a frame arranged in sequence along incident light; the signal processing layer is fixed to the frame, and the microlens array layer is arranged on the side of the linear gradient filter layer away from the detector layer; the microlens array layer is used for converging incident light; the linear gradient filter layer is used for linearly splitting the converged incident light in the 900nm-1700nm band; the detector layer is used for converting the split light signal into an electrical signal; the signal processing layer is used for receiving the electrical signal and real-time preprocessing spectral data; and the frame is used for supporting and mounting the signal processing layer, the detector layer, the linear gradient filter layer and the microlens array layer, so as to realize an integrated packaging structure. The present application realizes miniaturization and high stability of 900nm-1700nm band spectral detection.

Description

Technical Field

[0001] This invention relates to the field of spectral detection equipment technology, and in particular to an integrated linear array spectral component and its preparation method. Background Technology

[0002] Linear graded filters (LVFs), as spectroscopic elements whose spectra change linearly with position, have become key components for acquiring spectral information in the field of multispectral imaging due to their inherent characteristics of being lightweight and having continuous spectral distribution. In recent years, with the expansion of short-wave infrared (900nm~1700nm) spectral detection technology in agriculture, environment, and industry, the market has placed clear and urgent demands on the performance of spectral imaging equipment in this band: on the one hand, it needs to meet the stringent limitations on the size and weight of mobile platforms (such as drones and handheld detection devices); on the other hand, it needs to ensure spectral stability under complex environments (such as temperature fluctuations and vibrations), while also possessing high spectral resolution and high signal-to-noise ratio to achieve precise detection tasks. However, current LVF spectroscopic imaging technology for the 900nm~1700nm band still faces several technical bottlenecks, making it difficult to adapt to the above application requirements. The specific existing technical solutions and their limitations are as follows;

[0003] Current LVF spectroscopic imaging technology used in the 900nm~1700nm band mainly falls into two categories: traditional discrete and preliminary integrated approaches.

[0004] The core design of traditional split-spectrum spectrometers involves separating the LVF (Low-Level Flask) and the linear array detector (typically an InGaAs linear array detector, matched to short-wave infrared response characteristics). A complex optical system composed of lenses and mirrors is used to couple the optical path between the LVF and the detector, thus converting the split optical signal into an electrical signal. However, this split-spectrum design results in long optical paths, large component sizes, and a weight typically exceeding 100g, making it unsuitable for mobile platforms such as drones and handheld devices.

[0005] To address the issues of bulky size and complex optical path coupling in traditional discrete solutions, a preliminary integration scheme between the LVF and the detector is proposed. The core approach is to directly attach the LVF to the photosensitive surface of the InGaAs linear array detector, aiming to simplify the optical system and reduce the size of the device.

[0006] However, this preliminary integration scheme failed to overcome key technical bottlenecks and still has insurmountable defects: on the one hand, the substrates of LVF and InGaAs detectors have significant material heterogeneity, and their thermal expansion coefficients differ greatly. Under temperature change conditions, interfacial stress is easily generated, causing LVF spectral curve drift and further aggravating the wavelength instability problem; on the other hand, the scheme lacks a pixel-level precise coupling design between the LVF spectral gradient period and the detector pixels, which cannot achieve a one-to-one correspondence between the spectroscopic spectrum and the detector pixels. This results in the inability to leverage the high-speed advantage of snapshot imaging, creating an inherent contradiction between spectral resolution and imaging speed, making it difficult to meet the requirements of high-resolution spectral acquisition and rapid detection.

[0007] Therefore, the current LVF spectrophotometry technology in the 900nm~1700nm band is no longer suitable for application scenarios of mobile platforms such as drones and handheld devices, and it also cannot meet the high requirements of stability, resolution and signal-to-noise ratio for fine detection. Summary of the Invention

[0008] To address the shortcomings of the existing technologies, this invention proposes an integrated linear array spectral component to solve the problems of poor stability, low resolution, and poor spectral detection performance of existing integrated linear array spectral components.

[0009] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0010] This invention provides an integrated linear array spectral component, comprising: a microlens array layer, a linear graded filter layer, a detector layer, a signal processing layer, and a frame arranged sequentially along the incident direction of incident light; the signal processing layer is fixed to the frame, the detector layer is spaced apart from both the signal processing layer and the linear graded filter layer, and the microlens array layer is disposed on the side of the linear graded filter layer away from the detector layer;

[0011] The microlens array layer is used to converge the incident light;

[0012] The linear gradient filter layer is used to linearly split the converged incident light into 900nm~1700nm to obtain an optical signal;

[0013] The detector layer is used to convert the split optical signal into an electrical signal;

[0014] The signal processing layer is used to receive the electrical signal and preprocess the spectral data in real time.

[0015] The frame is used to support and mount the signal processing layer, the detector layer, the linear gradient filter layer, and the microlens array layer, and to achieve an integrated packaging structure.

[0016] Preferably, the integrated linear array spectral component further includes a data interface, which is connected to the signal processing layer and is used for data transmission.

[0017] Preferably, the linear gradient filter layer includes a glass substrate, a plurality of first refractive index layers and a plurality of second refractive index layers sequentially stacked on the glass substrate; the side of the glass substrate away from the first refractive index layer is spaced apart from the detector layer, and the side of the second refractive index layer away from the glass substrate is spaced apart from the microlens array layer; the first refractive index layer and the second refractive index layer are alternately deposited on the glass substrate; wherein, the refractive index of the first refractive index layer is less than the refractive index of the second refractive index layer.

[0018] Preferably, the first refractive index layer is made of silicon dioxide and the second refractive index layer is made of silicon.

[0019] Preferably, the first refractive index layer and the second refractive index layer are deposited alternately in a 34-layer gradient, with the film thickness ranging from 200 nm at the thin end to 2 μm at the thick end, the center wavelength variation rate being 1 nm, and the half-width dimension being 2 nm.

[0020] Preferably, the deposition method is high-energy physical vapor deposition, and the deposition rate is 0.1 nm / s to 0.3 nm / s.

[0021] Preferably, the detector layer is made of indium gallium arsenide.

[0022] Preferably, the detector layer includes an integrated readout integrated circuit and a semiconductor cooler; the readout integrated circuit is used to convert optical signals into digital signals, and the semiconductor cooler is used to cool the readout integrated circuit; the semiconductor cooler is bonded to the frame with thermally conductive silicone grease and fixedly connected with stainless steel screws, and the readout integrated circuit is bonded to the signal processing layer with bonding wires.

[0023] Preferably, the frame is made of Invar steel.

[0024] Secondly, embodiments of the present invention also provide a method for fabricating the integrated linear array spectral component as described above, the method comprising the following steps:

[0025] Provide a framework;

[0026] The signal processing layer is mounted on the frame;

[0027] The detector layer is integrated into the indium gallium arsenide chip using flip-chip bonding, and the detector layer is connected to the frame via bonding wires;

[0028] Silicon and silicon dioxide layers were alternately deposited on a glass substrate using high-energy vapor deposition (HEV) at a deposition vacuum level of 1×10⁻⁶. -5 Pa~5×10 -5 Pa, the temperature of the glass substrate is 250℃~300℃, the deposition rate is controlled at 0.1nm / s~0.3nm / s, the film thickness is monitored in real time by a quartz crystal film thickness monitor to obtain a linear gradient filter layer, and the linear gradient filter layer is installed on the side of the frame away from the detector layer.

[0029] The microlens array layer is fabricated using silicon-based photolithography and etching processes, and the microlens array layer is subjected to distillation antireflection coating treatment. The microlens array layer is then mounted on the side of the frame away from the linear gradient filter layer.

[0030] The signal processing layer, the detector layer, the linear gradient filter layer, and the microlens array layer are aligned and solidified using a laser interferometer, and the signal processing layer is then encapsulated to obtain an integrated linear array spectral component.

[0031] Compared with related technologies, in the embodiments of the present invention, the signal processing layer is fixed to the frame, the detector layer is spaced apart from the signal processing layer and the linear graded filter layer, and the microlens array layer is disposed on the side of the linear graded filter layer away from the detector layer; the microlens array layer is used to converge the incident light; the linear graded filter layer is used to linearly split the converged incident light into 900nm~1700nm to obtain an optical signal; the detector layer is used to convert the split optical signal into an electrical signal; the signal processing layer is used to receive the electrical signal and preprocess the spectral data in real time; the frame is used to support the installation of the signal processing layer, the detector layer, the linear graded filter layer and the microlens array layer. The invention features an integrated packaging structure, enabling miniaturization and high integration of the linear array spectral unit. A combination of a microlens array layer and a linear gradient filter layer achieves a significant leap in spectral performance. The integrated packaging, supported by a frame, ensures strong environmental adaptability. Detection and optical signal processing are performed through a detector layer and a signal processing layer, resulting in high detection efficiency. Furthermore, the invention employs a "multi-layer functional integration + integrated packaging + synchronous control" technical solution. Through three-dimensional heterogeneous hybrid integration technology, the microlens array layer, linear gradient filter layer, detector layer, and signal processing layer are sequentially integrated. Combined with low-expansion packaging and collaborative control logic, this achieves miniaturization and high stability for spectral detection in the 900nm~1700nm band. Attached Figure Description

[0032] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and more readily understood through the detailed description following the accompanying drawings. In the drawings:

[0033] Figure 1 A three-dimensional structural schematic diagram of an integrated linear array spectral component provided in an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of the structure of a linear gradient filter layer of a linear array spectral integrated component provided in an embodiment of the present invention;

[0035] Figure 3 This is a structural block diagram of the detector layer of a linear array spectral integrated component provided in an embodiment of the present invention;

[0036] Figure 4 A schematic diagram of the gradient film layer of a linear gradient filter layer of an integrated linear array spectral component provided in an embodiment of the present invention;

[0037] Figure 5 This is a flowchart illustrating a method for fabricating an integrated linear array spectral component, as provided in an embodiment of the present invention.

[0038] Among them, 100 is the integrated linear array spectral component, 1 is the frame, 2 is the signal processing layer, 3 is the detector layer, 31 is the readout integrated circuit, 32 is the semiconductor cooler, 4 is the linear gradient filter layer, 41 is the glass substrate, 42 is the first refractive index layer, 43 is the second refractive index layer, 5 is the microlens array layer, 6 is the bonding wire, and 7 is the data interface. Detailed Implementation

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1

[0043] Please see Figures 1-4 As shown, this embodiment of the invention provides a linear array spectral integrated component 100, which includes: a microlens array layer 5, a linear gradient filter layer 4, a detector layer 3, a signal processing layer 2, and a frame 1 arranged sequentially along the incident direction of incident light; the signal processing layer 2 is fixed to the frame 1, the detector layer 3 is spaced apart from the signal processing layer 2 and the linear gradient filter layer 4, and the microlens array layer 5 is disposed on the side of the linear gradient filter layer 4 away from the detector layer 3.

[0044] The microlens array layer 5 is used to converge the incident light. The linear gradient filter layer 4 is used to linearly split the converged incident light into 900nm~1700nm wavelengths to obtain an optical signal. The detector layer 3 is used to convert the split optical signal into an electrical signal. The signal processing layer 2 is used to receive the electrical signal and preprocess the spectral data in real time. The frame 1 is used to support and mount the signal processing layer 2, the detector layer 3, the linear gradient filter layer 4, and the microlens array layer 5, and to realize an integrated packaging structure. The linear beam splitting mentioned above specifically refers to the beam splitting characteristics of the linear gradient filter layer 4 (LVF layer); its wavelength changes linearly with the position of the filter plane, that is, the center wavelength at any position on the filter = the starting wavelength (900nm) + the rate of change of the center wavelength × the distance between that position and the starting end, ensuring uniform coverage of the 900nm~1700nm wavelength band.

[0045] Specifically, incident light is focused by the microlens array layer 5, and then linearly split by the linearly graded filter layer 4. The split optical signal is converted into an electrical signal by the detector layer 3. The signal processing layer 2 receives the electrical signal and preprocesses the spectral data in real time before outputting the spectral data to an external device for display, such as a display screen. This synchronous control circuit coordinates the operation of the microlens array layer 5, the linearly graded filter layer 4, and the detector layer 3, enabling 1024-channel acquisition in a single exposure of 50-500 μs. The adaptive exposure algorithm dynamically adjusts parameters, achieving the spectral detection requirements of "miniaturization, high stability, high resolution, and high-speed detection" in the 900nm-1700nm wavelength range.

[0046] Specifically, the various layers are integrated and packaged in one frame, which enables the device to be miniaturized and highly integrated; the three-dimensional integration reduces the optical distance by 60%, the volume is reduced by more than 50% compared with the traditional structure, the weight is ≤30g, and it can be directly adapted to mobile platforms.

[0047] A leap in spectral performance is achieved by combining a microlens array layer 5 with a linearly graded filter layer 4. Specifically, a pixel-level alignment (±2μm) + antireflection coating design is adopted, achieving a signal-to-noise ratio of 300:1 at a wavelength of 1550nm and an incident light intensity of 10μW / cm². Compared with the traditional split structure, its transmittance is improved by 25% in the average transmittance of the 900nm~1700nm band, with a peak transmittance ≥85%. The data processing speed is ≤20ms for a single frame of 1024-channel spectral data.

[0048] The integrated packaging, supported by Frame 1, ensures strong environmental adaptability. Specifically, through Invar encapsulation and optimized structure, temperature drift is ±1nm and vibration drift is ≤0.5nm, making it suitable for complex scenarios such as field and industrial environments.

[0049] Detection and optical signal processing are performed through detector layer 3 and signal processing layer 2, resulting in high detection efficiency. A single exposure completes full-band acquisition, with a data processing speed of 20ms / frame, which is 3 times more efficient than scanning methods.

[0050] The integrated component design offers superior overall cost-effectiveness. It can reduce optical components by 60%, eliminate the need for optical path debugging, and lower mass production costs by 40%; the standard packaging ensures compatibility with existing platforms and shortens the development cycle.

[0051] In this embodiment, the integrated linear array spectral component 100 further includes a data interface 7, which is signal-connected to the signal processing layer 2 and used for data transmission. Optionally, the data interface 7 can be a Sub-LVDS interface, which is an improved version of Low-Voltage Differential Signaling (LVDS). It achieves high-speed, low-power, and interference-resistant signal transmission through lower voltage swing, and is mainly used in high-resolution image / video data transmission scenarios, such as signal output from displays, image sensors, and detectors.

[0052] Specifically, signal processing layer 2 uses a CMOS process application-specific integrated circuit, integrating a dual-channel Sub-LVDS interface and an embedded neural network inference unit, with a data transmission rate of 1.2Gbps. It is connected to detector layer 3 via bonding wire 6, and the output extends to the outside of the package. It can preprocess spectral data in real time (noise reduction, analog-to-digital optimization) to adapt to high-speed detection.

[0053] In this embodiment, the linear gradient filter layer 4 includes a glass substrate 41, a plurality of first refractive index layers 42 and a plurality of second refractive index layers 43 sequentially stacked on the glass substrate 41; the side of the glass substrate 41 away from the first refractive index layer 42 is spaced apart from the detector layer 3, and the side of the second refractive index layer 43 away from the glass substrate 41 is spaced apart from the microlens array layer 5; the first refractive index layer 42 and the second refractive index layer 43 are alternately deposited on the glass substrate 41; wherein, the refractive index of the first refractive index layer 42 is less than the refractive index of the second refractive index layer 43.

[0054] In this embodiment, the first refractive index layer 42 is made of silicon dioxide (SiO2) material, and the second refractive index layer 43 is made of silicon (Si) material.

[0055] In this embodiment, the first refractive index layer 42 and the second refractive index layer 43 are deposited alternately in a 34-layer gradient, with the film thickness ranging from 200 nm at the thin end to 2 μm at the thick end, a center wavelength variation rate of 1 nm, and a half-width of 2 nm. The compatibility of the layer gradient from the thin end (left) to the thick end (right) with wavelength tuning is typically achieved through a gradual change in the thickness of each layer. This layer gradient helps maintain reflectivity stability (avoiding a sudden drop in reflectivity due to wavelength changes). The gradient from the thin end to the thick end is a gradual change that does not conflict with wavelength tuning, resulting in good stability.

[0056] Preferably, the first refractive index layer 42 and the second refractive index layer 43 are deposited alternately in a 34-layer gradient, with the film thickness ranging from 200nm at the thin end to 2μm at the thick end, the center wavelength variation rate being 1nm, and the half-width dimension being 2nm.

[0057] In this embodiment, the deposition method is high-energy physical vapor deposition, and the deposition rate is 0.1 nm / s to 0.3 nm / s. Preferably, the deposition rate is 0.1 nm / s, which results in good deposition effect.

[0058] Specifically, 34 alternating Si / SiO2 layers are deposited on a glass substrate 41, with a gradient thickness ranging from 200 nm at the thin end to 2 μm at the thick end. The center wavelength variation rate is 1 nm, and the half-width at half-maximum (WWHM) is 2 nm. The deposition is achieved using high-energy physical vapor deposition (PVD) at a deposition rate of 0.1 nm / s, with real-time thickness monitoring. An edge-stepped positioning structure is fixed to the packaging frame 1, positioned between the microlens array and the detector. This allows for linear spectral splitting from 900 nm to 1700 nm, with a peak transmittance ≥85%.

[0059] In this embodiment, the detector layer 3 is made of indium gallium arsenide (InGaAs). In optical technology, the detector layer 3 made of InGaAs is a core device for detecting near-infrared to short-wave infrared (typically 0.9~2.6μm) optical signals. Its essential function is to efficiently convert the optical signals in this band into electrical signals, supporting various technical applications that rely on infrared light characteristics.

[0060] In this embodiment, the detector layer 3 includes an integrated readout integrated circuit 31 (ROIC) and a thermoelectric cooler 32 (TEC). The readout integrated circuit 31 is used to convert the optical signal into a digital signal, and the thermoelectric cooler 32 is used to cool the readout integrated circuit 31. The thermoelectric cooler 32 is bonded to the frame 1 with thermally conductive silicone grease and fixedly connected with stainless steel screws. The readout integrated circuit 31 is bonded to the signal processing layer 2 via bonding wires 6. Alternatively, the thermoelectric cooler 32 and the frame 1 can be fixed by copper foil welding, which provides a good fixation effect.

[0061] In the linear array detector, the readout integrated circuit 31 and the semiconductor cooler 32 are core components ensuring detector performance, and their functions directly determine signal conversion efficiency, noise level, and operational stability. Optionally, the ROIC acts as a "bridge" between the detector layer 3 array and the back-end signal processing, responsible for efficiently and with low noise converting and outputting the photoelectric signals generated by the pixel array. The TEC is an active cooling device based on the thermoelectric effect, which reduces dark current interference in the detector through temperature control, ensuring detection accuracy and stability. The ROIC is a signal processor responsible for efficiently converting optical signals into usable digital signals; the TEC is an environmental stabilizer, ensuring the detector operates in a low-noise, high-performance state through temperature control. Together, they support the high-precision application of the linear array detector in scenarios such as spectroscopic detection and spectral analysis.

[0062] Specifically, detector layer 3 has a 1024×1 pixel size, with 12.5μm×12.5μm pixels and a built-in 12-bit analog-to-digital converter (ADC); quantum efficiency at 1550nm is ≥75%, and the maximum line frequency is 71.9kHz. The fabrication process uses gold-tin solder flip-chip integrated circuit (ROIC), with bonding wire 6 (25μm diameter) for electrical connection; the TEC cooling power is ≥1.5W, with temperature control at -10℃±2℃. It is connected to signal processing layer 2 via bonding wire 6, and the TEC is thermally coupled to the packaging frame 1. This converts the split optical signal into an electrical signal, and low-temperature control reduces dark current interference.

[0063] In this embodiment, the frame 1 is made of Invar. The frame 1, made of Invar (also known as Invar alloy, mainly composed of 64% iron + 36% nickel) with a low coefficient of expansion, has overall dimensions of 57.4mm × 18.9mm × 8mm and a weight of ≤30g. During encapsulation, fluororubber sealing rings are embedded at the interfaces between the frame and each layer, followed by sealing with UV-cured sealant. Finally, an IP65 protection rating airtightness test is performed (test pressure: 50kPa, pressure holding time: 30s, leakage ≤1×10⁻⁶). -5 Pa (m³ / s). The structure was optimized through finite element analysis, and each layer was fixed by precision screws and UV-curing adhesive. The thermal deformation at -40℃ to +50℃ is ≤1μm, and the spectral drift at 10~2000Hz vibration is ≤0.5nm.

[0064] Example 2

[0065] Please see Figure 5 As shown, this embodiment of the invention also provides a method for fabricating the above-described integrated linear array spectral component, the method comprising the following steps:

[0066] S1. Provide a framework 1.

[0067] S2. Install the signal processing layer 2 onto the frame 1.

[0068] S3. The detector layer 3 is integrated by flip-chip bonding of an indium gallium arsenide (IGaAs) chip, and the detector layer 3 is connected to the frame 1 via bonding wires 6. The IGaAs chip in the detector layer 3 is used to convert the split optical signal into an electrical signal; the readout integrated circuit 31 is used to convert the electrical signal into a digital signal, and the semiconductor cooler 32 is used to cool the readout integrated circuit 31 and the IGaAs chip.

[0069] S4. Alternating silicon (Si) and silicon dioxide (SiO2) layers are deposited on the glass substrate 41 by high-energy physical vapor deposition (PVD) at a deposition vacuum of 1×10⁻⁶. -5 Pa~5×10 -5 Pa, the glass substrate temperature is 250℃~300℃, the deposition rate is controlled at 0.1nm / s~0.3nm / s, and the film thickness is monitored in real time using a quartz crystal film thickness monitor to obtain the linear gradient filter layer 4. The linear gradient filter layer 4 is installed on the side of the frame 1 away from the detector layer 3. The film thickness is the thickness of the film layer with alternating deposition of silicon (Si) and silicon dioxide (SiO2) layers. The core of the quartz crystal film thickness monitor is to utilize the physical properties of quartz crystals to convert changes in film thickness into detectable electrical signals, thereby achieving precise control of the film thickness.

[0070] S5. A microlens array layer 5 is fabricated using silicon-based photolithography and etching processes. The microlens array layer 5 is then treated with a distilled antireflective coating. The microlens array layer 5 is mounted on the side of the frame 1 away from the linear gradient filter layer 4. The microlens array layer 5 is a 1024-channel array made of silicon-based material, with each lens having a diameter of 12.5 μm and a spacing of 12.5 μm. The surface is coated with a MgF2 antireflective coating (reflectivity ≤1% in the 1000nm~1700nm wavelength range). The pattern is defined by photolithography and formed by reactive ion etching. Through precise alignment and coupling with the linear gradient filter layer 4, the error is within ±2 μm; incident light can be accurately focused to the corresponding channel of the LVF, improving the light collection efficiency to over 85%.

[0071] S6. The signal processing layer 2, the detector layer 3, the linear gradient filter layer 4, and the microlens array layer 5 are aligned using a laser interferometer and then cured. The signal processing layer 2 is then encapsulated to obtain the integrated linear array spectral component 100. Specifically, the Invar frame 1 is assembled with each layer sequentially, aligned using a laser interferometer (deviation ≤ 2 μm), cured and fixed, and then the signal processing layer 2 is encapsulated and subjected to an airtightness test.

[0072] S7. Perform performance calibration on the integrated linear array spectral component 100.

[0073] Specifically, spectral characteristics were tested using a monochromator, and environmental stability was verified using a temperature chamber and vibration table. Temperature chamber test (-40℃~+50℃): center wavelength drift ≤ ±1nm; Vibration table test (10~2000Hz, acceleration 10m / s²): center wavelength drift ≤ ±0.5nm; Air tightness test (IP65): pressure held at 50kPa for 30s, leakage ≤ 1×10⁻⁶. -5 Pa m³ / s. The core objective of monochromator testing is to quantitatively obtain the spectral response characteristics of the device in the target wavelength band (e.g., 900nm~1700nm shortwave infrared), clarifying key indicators such as transmittance, center wavelength, and half-width, providing data support for subsequent application scenario matching. The core objective of environmental stability testing is to verify the changes in the spectral performance of the device under temperature fluctuations, mechanical vibration, and combined temperature-vibration environments. Typical temperature environments such as high-low temperature cycling and constant temperature zones are simulated using a temperature chamber to monitor the changes in the spectral characteristics of the device at different temperatures, evaluating the impact of temperature on center wavelength, transmittance, and responsivity. Mechanical vibrations during transportation and use (such as drone flight vibration and handheld device drop impact) are simulated using a vibration table to monitor the stability of the device's spectral performance and mechanical structure, evaluating the impact of vibration on optical path alignment and signal transmission.

[0074] It should be noted that the various embodiments described above with reference to the accompanying drawings are merely illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be included within the scope of the present invention. Furthermore, unless the context otherwise requires, words appearing in the singular include those in the plural, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A linear array spectral integrated component, characterized in that, The integrated linear array spectral component includes: a microlens array layer, a linear gradient filter layer, a detector layer, a signal processing layer, and a frame arranged sequentially along the incident direction of the incident light; the signal processing layer is fixed to the frame, the detector layer is spaced apart from the signal processing layer and the linear gradient filter layer respectively, and the microlens array layer is disposed on the side of the linear gradient filter layer away from the detector layer. The microlens array layer is used to converge the incident light; The linear gradient filter layer is used to linearly split the converged incident light into 900nm~1700nm to obtain an optical signal; The detector layer is used to convert the split optical signal into an electrical signal; The signal processing layer is used to receive the electrical signal and preprocess the spectral data in real time. The frame is used to support and mount the signal processing layer, the detector layer, the linear gradient filter layer, and the microlens array layer, and to achieve an integrated packaging structure; the frame is made of Invar steel. The linear gradient filter layer includes a glass substrate, a plurality of first refractive index layers and a plurality of second refractive index layers sequentially stacked on the glass substrate; the side of the glass substrate away from the first refractive index layer is spaced apart from the detector layer, and the side of the second refractive index layer away from the glass substrate is spaced apart from the microlens array layer; the first refractive index layer and the second refractive index layer are alternately deposited on the glass substrate; wherein, the refractive index of the first refractive index layer is less than the refractive index of the second refractive index layer; In the alternating deposition of the first and second refractive index layers, there are 34 layers with a gradual change in thickness, ranging from 200 nm at the thin end to 2 μm at the thick end. The center wavelength changes by 1 nm, and the half-width is 2 nm.

2. The integrated linear array spectral component according to claim 1, characterized in that, The integrated linear array spectral component also includes a data interface, which is connected to the signal processing layer and is used for data transmission.

3. The integrated linear array spectral component according to claim 1, characterized in that, The first refractive index layer is made of silicon dioxide, and the second refractive index layer is made of silicon.

4. The integrated linear array spectral component according to claim 1, characterized in that, The deposition method is high-energy physical vapor deposition, with a deposition rate of 0.1 nm / s to 0.3 nm / s.

5. The integrated linear array spectral component according to claim 1, characterized in that, The detector layer is made of indium gallium arsenide.

6. The integrated linear array spectral component according to claim 1, characterized in that, The detector layer includes an integrated readout integrated circuit and a semiconductor cooler; the readout integrated circuit is used to convert optical signals into digital signals, and the semiconductor cooler is used to cool the readout integrated circuit; the semiconductor cooler is bonded to the frame with thermal grease and fixedly connected with stainless steel screws, and the readout integrated circuit is bonded to the signal processing layer with bonding wires.

7. A method for fabricating an integrated linear array spectral component as described in any one of claims 1-6, characterized in that, The preparation method includes the following steps: Provide a framework; The signal processing layer is mounted on the frame; The detector layer is integrated into the indium gallium arsenide chip using flip-chip bonding, and the detector layer is connected to the frame via bonding wires; Silicon and silicon dioxide layers were alternately deposited on a glass substrate using high-energy vapor deposition (HEV) at a deposition vacuum level of 1×10⁻⁶. - 5 Pa~5×10 -5 Pa, the temperature of the glass substrate is 250℃~300℃, the deposition rate is controlled at 0.1nm / s~0.3nm / s, the film thickness is monitored in real time by a quartz crystal film thickness monitor to obtain a linear gradient filter layer, and the linear gradient filter layer is installed on the side of the frame away from the detector layer. The microlens array layer is fabricated using silicon-based photolithography and etching processes, and the microlens array layer is subjected to distillation antireflection film treatment. The microlens array layer is then mounted on the side of the frame away from the linear gradient filter layer. The signal processing layer, the detector layer, the linear gradient filter layer, and the microlens array layer are aligned and solidified using a laser interferometer, and the signal processing layer is then encapsulated to obtain an integrated linear array spectral component.

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