Panel with acoustic black holes
By using acoustic black hole plates and multilayer dampers in integrated power electronics modules, noise and vibration problems in hybrid and electric vehicles are solved, resulting in reduced mass and noise, and avoiding corrosion risks.
Patent Information
- Application Number
- CN202411394657.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-23
- Filing Date
- 2024-10-08
- Publication Date
- 2026-03-03
AI Technical Summary
Existing technologies are insufficient to effectively reduce noise and vibration in hybrid and electric vehicles. Traditional damping solutions may increase mass and cost, and are also subject to corrosion problems.
The acoustic black hole panel is used, which forms a thinned acoustic black hole region on the panel through machining or stamping, and is combined with multi-layer dampers to capture and attenuate vibration energy, reduce panel mass and increase damping effect.
It significantly improves noise, vibration and acoustic roughness performance, reduces the mass of the inverter cover and the amount of damping material used, reduces noise radiation and resonance problems, and avoids corrosion risks.
Smart Images

Figure CN121600894A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to an integrated power electronics (IPE) module, and more specifically, to an integrated power electronics (IPE) module having an acoustic black hole plate with an acoustic black hole. Background Technology
[0002] Hybrid and electric vehicles are increasingly utilizing integrated power electronics (IPE) modules, which typically include power inverter modules integrated (i.e. packaged) with one or more components, such as inverters, electric motors, generators, pumps, clutches, and other components.
[0003] While existing methods and systems attempt to minimize and prevent noise and vibration within vehicles and can achieve their specific objectives, a new and improved solution for noise and vibration reduction is still needed. Therefore, an improved IPE module is required. Summary of the Invention
[0004] According to several aspects of this disclosure, an integrated power electronics (IPE) module is provided. The IPE module includes an IPE housing comprising at least one panel and a power inverter module (PIM) housing carrying the IPE housing. The IPE housing defines an internal cavity, and the PIM is housed within the internal cavity. At least one panel includes an acoustic black hole plate having an acoustic black hole region comprising at least one acoustic black hole. Each acoustic black hole targets a resonant hot spot of the panel and improves noise, vibration, and harshness (NVH) performance. Each acoustic black hole includes a geometric center and a damper. The acoustic black hole plate has a decreasing acoustic black hole plate thickness from its outer edge to the geometric center, the decreasing acoustic black hole plate thickness trapping vibrational energy and resulting in efficiency degradation. The damper is coupled to the acoustic black hole plate and located at the geometric center.
[0005] According to another aspect of this disclosure, the IPE module includes an aluminum panel.
[0006] According to another aspect of this disclosure, the IPE module includes at least one acoustic black hole, which is at least one of circular or elliptical shapes.
[0007] According to another aspect of this disclosure, the IPE module includes at least one acoustic black hole, which is a machined acoustic black hole.
[0008] According to another aspect of this disclosure, the IPE module includes at least one acoustic black hole, which is a ram acoustic black hole.
[0009] According to another aspect of this disclosure, the IPE module includes an acoustic black hole region comprising a 2×2 acoustic black hole array.
[0010] According to another aspect of this disclosure, the IPE module includes a reduced acoustic black hole plate thickness having a power-law conical profile.
[0011] According to another aspect of this disclosure, the IPE module includes a reduced acoustic black hole plate thickness extending from a first surface of the acoustic black hole plate to a second surface.
[0012] According to another aspect of this disclosure, the IPE module includes a damper formed of a single material.
[0013] According to another aspect of this disclosure, the IPE module includes a multilayer damper.
[0014] According to several aspects of this disclosure, an acoustic black hole plate for use with an integrated power electronics (IPE) module is provided. The acoustic black hole plate includes at least one acoustic black hole for targeting panel resonant hotspots and improving noise, vibration, and harshness (NVH) performance. Each acoustic black hole includes a geometric center and a damper located at the geometric center. The acoustic black hole plate has a decreasing thickness from the outer edge of the acoustic black hole to the geometric center. The decreasing acoustic black hole plate thickness traps vibrational energy, resulting in efficiency degradation.
[0015] According to another aspect of this disclosure, the acoustic black hole plate includes at least one acoustic black hole, which is at least one of circular or elliptical shapes.
[0016] According to another aspect of this disclosure, the acoustic black hole plate includes at least one acoustic black hole, which is a machined acoustic black hole.
[0017] According to another aspect of this disclosure, the acoustic black hole plate includes at least one acoustic black hole, which is a stamped acoustic black hole.
[0018] According to another aspect of this disclosure, the acoustic black hole plate includes a 2×2 acoustic black hole array.
[0019] According to another aspect of this disclosure, the acoustic black hole plate includes a reduced acoustic black hole plate thickness having a power-law conical profile.
[0020] According to another aspect of this disclosure, the acoustic black hole plate includes a reduced acoustic black hole plate thickness extending from a first surface of the acoustic black hole plate to a second surface.
[0021] According to another aspect of this disclosure, the acoustic black hole plate includes a damper formed of a single material.
[0022] According to another aspect of this disclosure, the acoustic black hole plate includes a damper, which is a multilayer damper.
[0023] According to several aspects of this disclosure, an integrated power electronics (IPE) module is provided. The IPE module includes an IPE housing comprising at least one panel and a power inverter module (PIM) housing carrying the IPE housing. The IPE housing defines an internal cavity, and the PIM is housed within the internal cavity. The at least one panel includes an acoustic black hole plate formed of aluminum, and the acoustic black hole plate has an acoustic black hole region comprising a 2×2 acoustic black hole array. Each acoustic black hole targets the panel's resonant hot spot and improves noise, vibration, and acoustic roughness (NVH) performance. Each acoustic black hole includes a geometric center and a multilayer damper located at the geometric center. The acoustic black hole plate includes a reduced acoustic black hole plate thickness having a power-law conical profile, and the reduced acoustic black hole plate thickness extends from the outer edge of the acoustic black hole to the geometric center. The reduced acoustic black hole plate thickness traps vibrational energy, resulting in efficiency degradation. The multilayer damper includes at least a first layer of aluminum and another layer of rubber.
[0024] Other areas of application of this disclosure will become apparent from the detailed description provided below. It should be understood that the detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of this disclosure.
[0025] The above-described features and advantages, as well as other features and advantages, of the currently disclosed systems and methods will become apparent when considered in conjunction with the accompanying drawings and the detailed description including the claims and examples. Attached Figure Description
[0026] This disclosure will be more fully understood through detailed description and accompanying drawings, in which:
[0027] Figure 1 This is a perspective view showing an example of a vehicle with an integrated power electronics (IPE) or inverter module according to the present disclosure, the integrated power electronics or inverter module having a damping panel configured to improve noise, vibration, and acoustic roughness (NVH) performance.
[0028] Figure 2 It is shown Figure 1 The diagram shows an example of an integrated power electronics (IPE) module or inverter module according to the present disclosure, wherein the IPE module or inverter module includes an integrated acoustic black hole plate having multiple acoustic black holes.
[0029] Figure 3 It is shown Figure 2 The image shown is a cross-sectional side view of a portion of an acoustic black hole plate according to the present disclosure, wherein the acoustic black hole plate has a machined acoustic black hole and a damper.
[0030] Figure 4 This is a perspective view showing an acoustic black hole plate with a stamped acoustic black hole array according to the present disclosure.
[0031] Figure 5 It is shown Figure 2 The image shown is a cross-sectional side view of a portion of an acoustic black hole plate according to the present disclosure, wherein the acoustic black hole plate has a stamped acoustic black hole and a damper molded in the concave side of the acoustic black hole.
[0032] Figure 6 It is shown Figures 3 to 5 The diagram shown is a perspective view of a damper according to the present disclosure, wherein the damper is a multilayer damper. Detailed Implementation
[0033] Reference will now be made in detail to several examples of this disclosure illustrated in the accompanying drawings. Wherever possible, the same or similar reference numerals are used in the drawings and description to refer to the same or similar parts or steps. The following description is merely exemplary in nature and is not intended to limit this disclosure, its application, or its uses.
[0034] In many electric vehicles, inverter and IPE resonance can be the dominant factors contributing to noise in the electric drive unit. Power inverter modules and vehicle components (such as motors, generators, pumps, and clutches) are known to cause noise and / or vibration, which is undesirable for operators of vehicles with IPE modules. Some damping patch solutions may be effective in controlling resonance and reducing noise radiation, but the additional packaging can increase weight and cost. Furthermore, aluminum housings with steel dampers can lead to severe corrosion. Damping treatments of IPE modules (such as patching with steel plates) can cause galvanic corrosion problems over time and pose safety risks.
[0035] This paper discloses a highly damped and lightweight panel that utilizes acoustic black holes (ABHs) for inverter and integrated power electronics (IPE) applications. Multiple three-dimensional (3D) ABH functions target the panel's resonant hotspots and improve noise, vibration, and acoustic roughness (NVH) performance. Each ABH region contains at least one acoustic black hole, where material is removed from the panel through machining or extrusion by stamping or incremental forming to provide a panel thickness that decreases toward its geometric center (e.g., exponential decay). This continuous reduction in structural stiffness concentrates vibrational energy at the geometric center of the ABH, where a small amount of damping material is placed to effectively absorb vibrational energy. Furthermore, the integrated power electronics (IPE) module and damped panel described herein reduce the amount of damping material required (up to 90%) and the overall mass of the inverter cover (up to 20%).
[0036] refer to Figure 1This diagram shows a perspective view of a vehicle 10 having a battery pack 12 according to the present disclosure. The battery pack 12 is shown together with the exemplary vehicle 10. The vehicle 10 is an electric vehicle or a hybrid vehicle having wheels 14 driven by at least one electric motor / inverter 13. The electric motor / inverter receives power from the battery pack 12. Although the vehicle 10 is shown as a passenger road vehicle, it should be understood that the battery pack 12 can be used with a variety of other types of vehicles. For example, the battery pack 12 can be applied to marine vehicles such as boats or air vehicles such as drones or passenger planes. Furthermore, the battery pack 12 can be used as a stationary power source separate from and independent of the vehicle. The battery pack 12 includes a housing 16 for supporting a plurality of battery cells 18. In one example, the battery pack 12 may have fifty or more battery cells 18. Additionally, at least one integrated power electronics (IPE) module 20 or inverter module is electrically and / or mechanically coupled to at least one electric motor 13.
[0037] Figure 2 It shows Figure 1 This is a perspective view of an integrated power electronics (IPE) module 20 (or inverter module 20). The IPE module 20 is a dedicated component in electronics designed to regulate and control current within a system (e.g., the electrical system in vehicle 10). The inverter module 20 is a power electronic device that converts direct current (DC) to alternating current (AC). The IPE module 20 includes an IPE housing 22 and a power inverter module (PIM) (not shown). The IPE housing 22 is configured to enclose and / or house the interior of the IPE module 20, protecting it from contaminants and their environment. The IPE housing 22 includes at least one panel 24, which includes an acoustic black hole plate 26. The acoustic black hole plate 26 may be at least one of the panels 24 and is integrally formed with the housing 22. At least one panel 24 may be formed from a variety of materials suitable for providing structural strength and environmental protection for the components within the IPE housing 22. In one example, the IPE housing 22 and the acoustic black hole plate 26 are formed of aluminum.
[0038] like Figure 2 As shown, the acoustic black hole plate 26 is part of and integrally formed with the IPE housing 22. The acoustic black hole plate 26 has an acoustic black hole region 28, which also includes at least one acoustic black hole (ABH) 30. Figure 2 The acoustic black hole region 28 shown comprises a 2×2 array of acoustic black holes 30; however, it should be understood that the acoustic black hole region 28 may include an array of acoustic black holes 30 with different numbers, sizes, and configurations. Each acoustic black hole 30 is configured to target the hotspots of panel resonance and improve noise, vibration, and acoustic roughness (NVH). In the example, each acoustic black hole 30 may have a circular configuration, an elliptical configuration, other configurations, and / or combinations thereof. Figure 2In the example shown, each acoustic black hole 30 in the acoustic black hole region 28 has a circular configuration. In Figure 2 the example shown, each acoustic black hole 30 has the same size, and they have different sizes and positions according to the hot spot positions on the acoustic black hole panel 26.
[0039] Figure 3 A cross-sectional view of the acoustic black hole 30 is shown. In an acoustic black hole, phonons (i.e., sound perturbations, sound waves) are confined within a fluid region where the flow velocity is faster than the local speed of sound. Each acoustic black hole 30 is used for passive vibration and control of phonons in the IPE module 20. The flexural sound waves in the IPE housing 22 and / or the acoustic black hole plate 26 have a propagation speed c, which is a function of the elastic modulus E, thickness h, density ρ, Poisson's ratio v, and frequency ω, as shown in the following equation.
[0040]
[0041] Each acoustic black hole (ABH) 30 has an acoustic black hole plate thickness h that decreases from the outer edge 32 of the acoustic black hole 30 to the geometric center 34 of the acoustic black hole 30. The decreasing damping plate thickness h results in a continuously decreasing flexural stiffness, which further results in a decrease in the propagation vibration speed (c2 < c1) and an increase in the vibration amplitude (A2 > A1). Therefore, the decrease in the acoustic black hole plate thickness captures vibration energy, resulting in efficiency decay.
[0042] The decreasing acoustic black hole plate thickness h can be optimized by various shapes with power-law conical profiles having different m values, where m is the exponent of the power-law profile. The exponent m can be controlled by the radius L of the acoustic black hole 30 Figure 3 , Figure 3 , as shown in the following equation, where h(x) is the thickness of the acoustic black hole plate 26, x is the distance from the tip of the power-law curve to the residual thickness, and h1 is the residual thickness.
[0043]
[0044] In the example, the power-law exponents can include 2, 3, 4, etc., resulting in various decay rates of the decreasing acoustic black hole plate thickness h from the outer edge 32 to the geometric center 34. To achieve the decrease in thickness, material can be removed or formed from either one or both sides of the acoustic black hole plate 26. In Figure 3 the example shown, material is removed from the top surface of the acoustic black hole plate 26 to form the acoustic black hole 30. <00….In the example shown, one side of the acoustic black hole plate 26 (e.g., the unprocessed surface) is planar. As described above, the removed portion of the acoustic black hole plate 26 has a reduced acoustic black hole plate thickness h within the acoustic black hole 30.
[0046] Figure 4 This is a perspective view showing an acoustic black hole plate 26 with an acoustic black hole region 28 having a plurality of acoustic black holes 30 in a stamped configuration. In this example, the acoustic black hole region 28 comprises a 5×5 array of acoustic black holes 30. Figure 5 In the ABH array, acoustic black holes 30 of the same size are uniformly distributed. In other examples, the acoustic black hole 30 array can have a non-uniform distribution and different sizes, thereby targeting hotspots with high vibrational energy.
[0047] Figure 5 yes Figure 4 A cross-sectional view of an acoustic black hole 30 in a stamped configuration of the acoustic black hole plate 26 is shown. The metal stamping (or forming) of each acoustic black hole 30 includes a cold forming process, which uses a die and a press to bend and form each acoustic black hole 30 in the acoustic black hole plate 26. In this stamped configuration, the acoustic black hole 30 has an acoustic black hole plate thickness h that decreases exponentially from the outer edge 32 of the acoustic black hole 30 to the geometric center 34, as determined using the equations described above. In the stamped configuration, and within the acoustic black hole 30, the first surface 36 and the second surface 38 of the acoustic black hole plate 26 are not parallel, as... Figure 5 As shown. In other examples, the reduction in panel thickness h is not exponential.
[0048] refer to Figure 3 and Figure 5 Each acoustic black hole 30 includes a damper 40 coupled to the acoustic black hole plate 26 and located at its geometric center 34. At the bottom of each acoustic black hole 30, i.e., at the geometric center 34 where the acoustic black hole plate 26 has the minimum thickness, the maximum vibrational energy is captured and can be effectively attenuated by the damper 40 by converting the vibrational energy into heat. Each damper 40 may be coupled to the damper 40 using an adhesive (e.g., a cold-pressed adhesive) or using a molding process. The damper 40 may include a constrained layer damper (e.g., a single material) or a multilayer damper.
[0049] exist Figure 3 and Figure 5In the examples, damper 40 is depicted as a single-layer or single-material damper 40 formed of a material suitable for damping sound, isolating vibrations, and absorbing shocks. Some examples of suitable materials include synthetic viscoelastic polyurethane polymers, stainless steel, aluminum, cotton, acoustic foam, open-cell insulation materials, rubber, etc. In one specific example, damper 40 includes nitrile rubber. In another specific example, damper 40 includes aluminum. It should be understood that single-layer or single-material damper 40 may include other suitable materials not listed herein.
[0050] Figure 6 A multilayer damper 40 is shown, similarly formed of a material suitable for damping sound, isolating vibrations, and absorbing shocks. The multilayer damper 40 can be used in… Figure 3 and Figure 5 The acoustic black hole 30 example shown, as well as other configurations of acoustic black holes, employs a multilayer design using materials with varying impedances. Vibrational energy is reflected back to the high-damping layers through the high-impedance layers, thereby enhancing vibrational energy absorption. Some examples of suitable materials include synthetic viscoelastic polyurethane polymers, stainless steel, aluminum, cotton, acoustic foam, open-cell insulation materials, rubber, etc. In a specific example, the multilayer damper 40 includes a first layer 42 of aluminum, a second layer 44 of a viscoelastic bonded material, a third layer 46 of aluminum, a fourth layer 48 of nitrile rubber, and a fifth layer 50 of adhesive. It should be understood that the multilayer damper 40 may include other materials and numbers of layers.
[0051] The acoustic black hole plate 26 and IPE module 20 disclosed herein are superior to existing solutions. The IPE module, including the acoustic black hole region 28 and at least one acoustic black hole 30, reduces the mass of the IPE module and the acoustic black hole plate 26, which also improves NVH performance. Furthermore, the acoustic black hole 30, with a continuously decreasing damper panel thickness h, is used to capture vibrational energy, utilizing a smaller effective attenuation than a normal damper 40. The location, size, and shape of the acoustic black hole 30 can be optimized for panel resonances designed for different inverters and IPE modules. Machining, stamping, incremental forming, or combination can be used to remove material from each acoustic black hole 30. Such a process reduces, rather than increases, the mass of the baseline acoustic black hole plate 26, where additional damping patches are attached to the baseline panel, compared to conventional damping strategies. Additionally, the damper 40 used herein may include a constrained layer damper or a multilayer damper 40.
[0052] This description is merely illustrative in nature and is in no way intended to limit this disclosure, its application, or its use. The broad teachings of this disclosure can be implemented in many forms. Therefore, while this disclosure includes specific examples, its true scope should not be so limited, as other modifications will become apparent upon examination of the drawings, description, and appended claims.
Claims
1. An integrated power electronics (IPE) module for a vehicle, the IPE module comprising: IPE enclosure, including at least one panel; Power inverter module (PIM) carries the IPE housing, the IPE housing defining an internal cavity, wherein the PIM is housed within the internal cavity; and The at least one panel includes an acoustic black hole plate having an acoustic black hole region comprising at least one acoustic black hole, wherein each of the acoustic black holes targets a panel resonant hotspot and improves noise, vibration, and acoustic roughness (NVH) performance, wherein each of the acoustic black holes comprises: A geometric center, wherein the acoustic black hole plate has a decreasing thickness from the outer edge of the acoustic black hole to the geometric center, wherein the decreasing acoustic black hole plate thickness traps vibrational energy, resulting in efficiency degradation; and A damper, coupled to the acoustic black hole plate and located at the geometric center.
2. The integrated power electronics (IPE) module according to claim 1, wherein, The panel is made of aluminum.
3. The integrated power electronics (IPE) module according to claim 1, wherein, At least one acoustic black hole is either circular or elliptical.
4. The integrated power electronics (IPE) module according to claim 1, wherein, At least one acoustic black hole is a mechanically processed acoustic black hole.
5. The integrated power electronics (IPE) module according to claim 1, wherein at least one acoustic black hole is a stamped acoustic black hole.
6. The integrated power electronics (IPE) module according to claim 1, wherein, The acoustic black hole region comprises a 2×2 acoustic black hole array.
7. The integrated power electronics (IPE) module according to claim 1, wherein, The reduced acoustic black hole plate thickness has a power-law conical profile.
8. The integrated power electronics (IPE) module according to claim 1, wherein, The reduced thickness of the acoustic black hole extends from the first surface of the acoustic black hole to the second surface.
9. The integrated power electronics (IPE) module according to claim 1, wherein, The damper is made of a single material.
10. The integrated power electronics (IPE) module according to claim 1, wherein, The damper is a multilayer damper.