Method for forming metal coil of circuit substrate

Abstract

The invention discloses a method for forming a metal coil on a circuit substrate, which comprises the following steps of: providing the circuit substrate, and forming a preset pattern of the metal coil on the surface of the circuit substrate by using an electron beam machine; performing ion etching on the preset pattern by using an ion etching machine to form a concave pattern, wherein mixed gas of CF4 and O2 in a preset proportion is adopted in the ion etching; and plating a metal wire on the concave pattern by using a film plating machine to form a metal coil. The method is simple and easy to control, and has the advantages of high efficiency, low cost, high precision, flexibility and adjustability.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and more particularly to a method for forming a metal coil on a circuit board. Background Technology

[0002] With the development of the electronics industry, the processing of circuit boards is crucial, and the formation of metal coils on them is an essential step in the process. Currently, common methods for forming circuit board coils include wire winding, printed circuit board (PCB) manufacturing, magnetic material bonding, and varistor stacking. However, these methods cannot simultaneously guarantee speed, low cost, high precision, and flexible adjustability.

[0003] Therefore, there is an urgent need to provide an improved method for forming metal coils on circuit boards to overcome the above-mentioned defects. Summary of the Invention

[0004] The purpose of this invention is to provide a method for forming a metal coil on a circuit board. This method is simple and easy to control, and can simultaneously achieve the advantages of high efficiency, low cost, high precision and flexible adjustability.

[0005] To achieve the above objectives, the method for forming a metal coil on a circuit board according to the present invention includes the following steps:

[0006] A circuit board is provided, and a predetermined pattern of metal coils is formed on the surface of the circuit board using an electron beam machine;

[0007] A recessed pattern is formed by ion etching of the predetermined pattern using an ion etching machine, wherein the ion etching employs a mixed gas of CF4 and O2 in a predetermined ratio; and

[0008] Metal wires are deposited onto the recessed pattern using a coating machine to form a metal coil.

[0009] Compared with existing technologies, the method for forming a metal coil on a circuit board according to the present invention first uses an electron beam machine to form a predetermined pattern of the metal coil on the surface of the circuit board, then uses an ion etching machine to ion etch the predetermined pattern to form a recessed pattern, and finally uses a coating machine to deposit metal wires on the recessed pattern to form a metal coil. Because the equipment required for ion etching technology is simple and highly efficient, the cost of manufacturing the coil is greatly reduced. Moreover, ion etching technology can achieve high-precision coil manufacturing, meeting the application requirements of high-precision electronic products. During manufacturing, the design can be customized according to actual needs to meet the requirements of circuit board coils of different sizes and shapes, achieving flexibility and adjustability.

[0010] As an example, the ratio of the CF4 and O2 mixed gas in the ion etching is 4:1 to 6:1.

[0011] As an example, the flow rate of the mixed gas is 1600-1800 sccm.

[0012] As an example, the chamber pressure of the ion etching is 75-100 mtorr and the chamber temperature is 20-30°C.

[0013] As an example, the source power of the ion etching is 2000-3000W, and the bias power is 200-330W.

[0014] As an example, the metal wire is a gold wire.

[0015] As one embodiment, the circuit board is a copper plate. Detailed Implementation

[0016] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific implementation methods of this application are described in detail below with reference to some embodiments. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0017] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0018] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0019] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0020] The method for forming a metal coil on a circuit board according to the present invention will be further described below with reference to embodiments, but this does not limit the present invention. The method of the present invention aims to provide a method for forming a metal coil on a circuit board that is simple and easy to control, and can simultaneously achieve the advantages of high efficiency, low cost, high precision and flexible adjustability.

[0021] An embodiment of the method for forming a metal coil on a circuit board according to the present invention includes the following steps:

[0022] A circuit board is provided, and a predetermined pattern of metal coils is formed on the surface of the circuit board using an electron beam machine;

[0023] A recessed pattern is formed by ion etching of the predetermined pattern using an ion etching machine, wherein the ion etching employs a mixed gas of CF4 and O2 in a predetermined ratio; and

[0024] Metal wires are deposited onto the recessed pattern using a coating machine to form a metal coil.

[0025] In the method for forming a metal coil on a circuit board according to the present invention, a predetermined pattern of the metal coil is first formed on the surface of the circuit board using an electron beam machine. Then, an ion etching machine is used to ion-etch the predetermined pattern to form a recessed pattern. Finally, a metal wire is deposited onto the recessed pattern using a coating machine to form the metal coil. Because the equipment required for ion etching technology is simple and highly efficient, the cost of manufacturing the coil is greatly reduced. Moreover, ion etching technology can achieve high-precision coil manufacturing, meeting the application requirements of high-precision electronic products. During manufacturing, the design can be customized according to actual needs to meet the requirements of circuit board coils of different sizes and shapes, achieving flexibility and adjustability.

[0026] Specifically, the circuit board in this embodiment is a copper plate. In one embodiment, firstly, a copper plate is prepared and a predetermined coil pattern is formed on its surface using an electron beam machine. Next, an ion etching step is performed. Specifically, the copper plate is placed in an ion etching machine for ion etching to form a recessed pattern. It is important to note that a mask is prepared in advance to cover the parts of the copper plate that do not need to be etched, exposing only the predetermined pattern of the metal coil. This predetermined pattern is then exposed to the etching machine for etching. Specifically, the gas used in the chamber is a mixture of CF4 and O2. The ratio of CF4 to O2 is 4:1-6:1, preferably 5:1. The flow rate of the mixed gas is 1600-1800 sccm. Optionally, CF4 and O2 can be introduced simultaneously or separately, or mixed first and then introduced together. To achieve the best etching effect, the chamber temperature for ion etching is controlled at 20-30 degrees Celsius, and the chamber pressure is controlled at 75-100 mtorr. Simultaneously, the source power within the control chamber is 2000-3000W, and the bias power is 200-330W. Under these conditions, ion etching can be performed efficiently to obtain the desired recessed pattern. Finally, the copper plate is placed in a coating machine for coating treatment, thereby depositing metal lines on the recessed pattern. Preferably, the metal is gold to enhance conductivity.

[0027] This invention employs ion etching technology to form metal coils, offering the following advantages compared to traditional manufacturing methods: High efficiency and low cost: Ion etching technology requires simple equipment and is highly efficient, significantly reducing coil manufacturing costs; High coil precision: Ion etching technology enables high-precision coil manufacturing, meeting the application requirements of high-precision electronic products; Flexible and adjustable: Manufacturing can be customized according to actual needs, satisfying the requirements of circuit board coils of different sizes and shapes. Therefore, the method of this invention has significant advantages and broad application prospects.

[0028] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A method for forming a metal coil on a circuit board, characterized in that, Includes the following steps: A circuit board is provided, and a predetermined pattern of metal coils is formed on the surface of the circuit board using an electron beam machine; A recessed pattern is formed by ion etching of the predetermined pattern using an ion etching machine, wherein the ion etching employs a mixed gas of CF4 and O2 in a predetermined ratio; and Metal wires are deposited onto the recessed pattern using a coating machine to form a metal coil.

2. The method for forming a metal coil on a circuit board as described in claim 1, characterized in that, The ratio of the CF4 and O2 mixed gas used in the ion etching is 4:1 to 6:

1.

3. The method for forming a metal coil on a circuit board as described in claim 1, characterized in that, The flow rate of the mixed gas is 1600-1800 sccm.

4. The method for forming a metal coil on a circuit board as described in claim 1, characterized in that, The chamber pressure for the ion etching is 75-100 mtorr.

5. The method for forming a metal coil on a circuit board as described in claim 1, characterized in that, The temperature for the ion etching is 20-30℃.

6. The method for forming a metal coil on a circuit board as described in claim 1, characterized in that, The source power of the ion etching is 2000-3000W, and the bias power is 200-330W.

7. The method for forming a metal coil on a circuit board as described in claim 1, characterized in that, The metal wire is gold wire.

8. The method for forming a metal coil on a circuit board as described in claim 1, characterized in that, The circuit board is a copper plate.