Wire guide plate riveting machine

Abstract

The invention provides a wire guide plate riveting machine which is applied to the technical field of motor equipment machining and comprises a machine table, the top face of the machine table is a machining face, and a wire guide plate is machined and carried on the machining face. The wire guide plate carrying assembly is a movable mechanical arm, and the movable mechanical arm is arranged on the machining face. The hot air cold riveting assembly is arranged on the machining face, and the hot air cold riveting assembly conducts hot air cold riveting machining on the wire guide plate; local heating and softening of a cylinder are achieved through an integrated hot air heating system, a standard mushroom head structure is formed through a cold press forming technology, riveting point height detection is conducted in cooperation with a high-precision displacement sensor, and real-time photographing and defect recognition are conducted on the riveting appearance through a CCD visual system. And chippings and dust generated in the riveting process are removed in time through an air blowing and dust collecting device, so that the consistency and reliability of the riveting process and the overall quality of products are effectively improved, and the requirements of the modern industry for efficient automatic production and strict quality control of precise connecting pieces are met.

Description

Technical Field

[0001] This application relates to the field of motor processing technology, and in particular to a wire guide plate riveting machine. Background Technology

[0002] The main reason for the development of wire guide plate riveting machines is the increasing demand of modern manufacturing for high-precision, high-efficiency automated assembly and connection processes. Especially in industries such as electronics, communications, automotive parts, and precision machinery, wire guide plates are key components for connection and guidance. The columnar connection points in their structure often need to be riveted to form a reliable mushroom head structure to ensure the stability and durability of the connection. Traditional riveting methods mostly rely on manual operation or simple mechanical equipment, which has problems such as unstable riveting quality, poor dimensional consistency, and low production efficiency. Summary of the Invention

[0003] This application aims to solve the technical problems of unstable riveting quality, poor dimensional consistency, and low production efficiency, and provides a wire guide plate riveting machine.

[0004] This application employs the following technical means to solve the technical problem: A wire guide plate riveting machine, comprising: The machine tool has a top surface that serves as a processing surface, and the wire guide plate is processed and transported on this processing surface. A wire guide plate handling assembly, wherein the wire guide plate handling assembly is a mobile robot arm, and the mobile robot arm is disposed on the processing surface; A hot air cold riveting assembly is disposed on the processing surface, and the hot air cold riveting assembly performs hot air cold riveting processing on the wire guide plate; A height detection component is disposed on the processing surface and located on one side of the hot air cold riveting component, and the height detection component detects the height of the wire guide plate; A feeding assembly is disposed on the processing surface, and the feeding assembly feeds the processed and inspected wire guide plate.

[0005] Furthermore, the height detection component includes a linear module, a material carrier, a height detection element, and a CCD detection element; The linear module is disposed on the processing surface, the material carrier is disposed on the linear module, and the height detection component and the CCD detection component are respectively disposed on one side of the linear module.

[0006] Furthermore, it also includes an air blowing and dust suction assembly, which is disposed on the processing surface and located on one side of the height detection assembly.

[0007] This application provides a wire guide plate riveting machine, which has the following advantages: by integrating a hot air heating system to locally heat and soften the column and using a cold pressing process to form a standard mushroom head structure, and then using a high-precision displacement sensor to detect the riveting point height, using a CCD vision system to take real-time pictures of the riveting appearance and identify defects, and using air blowing and dust suction devices to promptly remove debris and dust generated during the riveting process, thereby effectively improving the consistency, reliability and overall product quality of the riveting process, and meeting the requirements of modern industry for efficient and automated production and strict quality control of precision connectors. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the wire guide plate riveting machine of this application; Figure 2 This is a top view of the overall structure of an embodiment of the wire guide plate riveting machine of this application; Figure 3 This is a schematic diagram of the hot air cold riveting assembly structure of one embodiment of the wire guide plate riveting machine of this application; Figure 4 This is a schematic diagram of the height detection component structure of an embodiment of the wire guide plate riveting machine of this application; Figure 5 This is a schematic diagram of the CCD detection component structure of an embodiment of the wire guide plate riveting machine of this application.

[0009] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0010] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0011] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0012] It should be noted that the terms "comprising," "including," and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this application, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses. Terms such as "first" and "second" in the claims, specification, and accompanying drawings of this application, as well as relational terms, are used merely to distinguish one entity / operation / object from another entity / operation / object, and do not necessarily require or imply any such actual relationship or order between these entities / operations / objects.

[0013] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0014] Reference Appendix Figures 1-5 This is a schematic diagram of the overall structure of the wire guide plate riveting machine in one embodiment of this application; Example 1 A wire guide plate riveting machine, comprising: Machine base 1, the top surface of which is a processing surface, and the wire guide plate is processed and transported on the processing surface; A wire guide plate handling assembly, wherein the wire guide plate handling assembly is a mobile robot 3, and the mobile robot 3 is disposed on the processing surface; Hot air cold riveting assembly 4 is disposed on the processing surface and performs hot air cold riveting processing on the wire guide plate. A height detection component is disposed on the processing surface and located on one side of the hot air cold riveting component 4. The height detection component detects the height of the wire guide plate. A feeding assembly is disposed on the processing surface, and the feeding assembly feeds the processed and inspected wire guide plate.

[0015] In this embodiment, the height detection component includes a linear module 8, a material carrier 9, a height detection element 5, and a CCD detection element 6; The linear module 8 is disposed on the processing surface, the material carrier 9 is disposed on the linear module 8, and the height detection element 5 and the CCD detection element 6 are respectively disposed on one side of the linear module 8.

[0016] In this embodiment, a blowing and dust-collecting component 7 is also included. The blowing and dust-collecting component 7 is disposed on the processing surface and located on one side of the height detection component.

[0017] Specifically, First, the wire guide plate is transported by the previous equipment to the loading position 2 on the processing surface. The mobile robot 3 picks up the wire guide plate from the loading position 2 and places it on the hot air cold riveting assembly 4. The pillars on the wire guide plate are hot-melted into a mushroom head shape. Then, the hot air cold riveted wire guide plate is picked up by the mobile robot 3 and placed into the material carrier 9 on the linear module 8. The material carrier 9 moves with the linear module 8 to the height detection component 5 to detect the height of the riveting points on the wire guide plate. Then, the linear module 8 moves to the CCD detection component 6 to detect the appearance of the wire guide plate. The material carrier 9 is then moved out by the linear module 8. The mobile robot 3 picks up the wire guide plate from the material carrier 9 and places it on the air blowing and dust suction assembly 7 for cleaning. Finally, the mobile robot 3 picks up the wire guide plate and unloads it to the loading position 2 of the next equipment.

[0018] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0019] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0020] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1The function specified in one or more boxes.

[0021] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0022] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wire guide riveter characterized by, The utility model relates to a kind of line guide plate processing device, including: Machine table, the top surface of machine table is processing surface, line guide plate is processed and is handled on the processing surface; Line guide plate handling assembly, the line guide plate handling assembly is mobile manipulator, the mobile manipulator is located on the processing surface; Hot air cold riveting assembly, the hot air cold riveting assembly is located on the processing surface, and the hot air cold riveting assembly is processed to the line guide plate with hot air cold riveting; Height detection assembly, the height detection assembly is located on the processing surface, and is located at one side of the hot air cold riveting assembly, and the height detection assembly is detected to the line guide plate with height; Blanking assembly, the blanking assembly is located on the processing surface, and the blanking assembly is discharged to the line guide plate after processing and detection.

2. The wire guide riveter of claim 1, wherein, The height detection assembly includes linear module, material carrier, height detection piece and CCD detection piece; The linear module is located on the processing surface, the material carrier is located on linear module, and the height detection piece and the CCD detection piece are respectively located at one side of the linear module.

3. The wire guide riveter of claim 1, wherein, It also includes air blowing and dust collecting assembly, and the air blowing and dust collecting assembly is located on the processing surface and at one side of the height detection assembly.

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