Fitting film taking device

Abstract

The invention relates to the technical field of non-standard automation, in particular to a laminated film taking device which comprises a rack, a feeding mechanism, a bearing table, a taking transfer mechanism, a laminating transfer mechanism and a discharging mechanism, the feeding mechanism is used for feeding a film to the bearing table, and the bearing table is a vacuum bearing table and is used for flatly adsorbing the film; when the material taking platform carries out material taking, the bearing platform reversely blows air through the micropores to enable the film to be smoothly blown towards the material taking platform, and meanwhile, the material taking platform generates vacuum through the micropores to smoothly adsorb the film; the laminating transfer mechanism is provided with a transfer carrying table, the transfer carrying table is a vacuum carrying table, and when the material taking carrying table is used for discharging materials, the thin film is flatly blown towards the transfer carrying table through reverse blowing of the micropores. The industrial problems that in the automatic taking, placing and attaching process, the film is prone to wrinkling and damage, and positioning is not accurate are solved.

Description

Technical Field

[0001] This invention relates to the field of non-standard automation technology, and in particular to a film lamination and feeding device. Background Technology

[0002] With the rapid development of modern manufacturing, especially in consumer electronics, optical devices, flexible displays, and new energy, the application of various functional films (such as protective films, optical films, conductive films, and adhesive films) is becoming increasingly widespread. In the production and assembly process of these products, it is often necessary to bond the films to substrates, glass, or other components with high precision and without damage. Traditional manual or semi-automatic bonding methods are not only inefficient and labor-intensive, but also prone to problems such as wrinkles, scratches, contamination, or misalignment of the films due to improper operation, seriously affecting product yield and performance stability.

[0003] To improve automation levels, the industry has developed various automated material handling and lamination equipment. Common solutions typically use vacuum suction cups or mechanical grippers to directly grasp the film and transfer and laminate it to the target location. However, these solutions still face several technical bottlenecks in practical applications: First, films, especially ultra-thin, easily deformable, or sticky films, are prone to localized wrinkles, stretching, or even tearing when peeled or picked up from the feeding platform due to electrostatic adsorption, vacuum residue, or mechanical pulling. Second, during the transfer process, the film may deform or shift due to changes in ambient temperature, mechanical vibration, or improper posture adjustment, affecting the final lamination accuracy. Third, existing transfer mechanisms often use rigid connections, making them susceptible to microscopic damage to the film from impacts during material handling. Furthermore, the entire process often suffers from poor coordination between processes such as feeding, peeling, static elimination, material handling, angle adjustment, lamination, and unloading, or exhibits low modularity and poor synergy, limiting further improvements in overall production efficiency and automation.

[0004] Therefore, designing a device that can achieve fully automated, high-speed, high-precision, and non-destructive film picking and bonding, and effectively solve the problems of maintaining the flatness of the film, accurately adjusting its posture, eliminating stress, and achieving efficient coordination between various processes during the film transfer process, has become a technical challenge that urgently needs to be overcome in this field. Summary of the Invention

[0005] To address the aforementioned problems, this invention solves industry challenges such as wrinkling, damage, and inaccurate positioning of films during automated loading and lamination processes. It represents a significant technological advancement and practical value in improving product quality, production efficiency, and automation levels.

[0006] The technical solution adopted in this invention is: a film laminating and feeding device, comprising a frame, a feeding mechanism, a support platform, a feeding and transferring mechanism, a laminating and transferring mechanism, and a feeding mechanism. The feeding mechanism is used to feed the film to the support platform, which is a vacuum platform used to flatten and adsorb the film. The feeding and transferring mechanism includes a feeding transverse module, a feeding lifting module, a feeding rotation module, a feeding buffer module, and a feeding platform. The feeding transverse module is mounted on the frame via a gantry frame, the feeding lifting module is mounted on the feeding transverse module, and the feeding rotation module is mounted on the feeding lifting module. In the assembly, the material picking buffer module is located at the drive end of the material picking rotation module, and the material picking platform is located on the material picking buffer module. The material picking platform is a vacuum platform. When the material picking platform picks up material, the support platform blows air in reverse through micropores to make the film flat and blow it towards the material picking platform. At the same time, the material picking platform generates a vacuum through micropores to flatten and adsorb the film. The bonding and transfer mechanism is provided with a transfer platform, which is a vacuum platform. When the material picking platform releases material, it blows air in reverse through micropores to make the film flat and blow it towards the transfer platform. When the material is placed in, a vacuum is generated through micropores on the transfer platform to flatten and adsorb the film.

[0007] A further improvement to the above scheme is that the feeding mechanism includes a feeding assembly, a peeling assembly, an antistatic assembly, and a feeding moving assembly. The feeding assembly is used to stack multiple films. The feeding moving assembly is used to grab the film on the feeding assembly and pass it sequentially through the peeling assembly and the antistatic assembly. The peeling assembly is used to peel off the peeling layer on the surface of the film. The antistatic assembly is used to remove static electricity from the film. The feeding moving assembly is used to pick up the film and place it onto the support platform.

[0008] A further improvement to the above solution is that the feeding assembly is equipped with a feeding lifting module for feeding multiple stacked films; the peeling assembly includes a peeling drive cylinder and a peeling blade; the peeling drive cylinder is used to drive the peeling blade to move in the direction of film movement, thereby scooping the film and separating it from the peeling layer; the peeling assembly also includes a peeling picking module for adsorbing the peeling layer and continuously picking up and separating the peeling layer when the feeding moving assembly picks up the film body.

[0009] A further improvement to the above solution is that the static elimination component includes a static elimination frame and ion air bars. Two sets of ion air bars are arranged opposite each other on the upper and lower sides of the static elimination frame. Two peeling drive cylinders are arranged on the left and right sides of the static elimination frame, respectively. When the film passes through the static elimination frame, the static electricity of the film is eliminated by the ion air bars.

[0010] A further improvement to the above solution is that the feeding moving component includes a linear moving module and a moving clamping module. The linear moving module is used to drive the moving clamping module to move between the peeling component, the antistatic component, and the carrier platform. The moving clamping module is provided with a clamping plate for clamping the film and transferring the film to the carrier platform under the action of the linear moving module.

[0011] A further improvement to the above scheme is that the material-picking rotation module is used to drive the material-picking buffer module to rotate the material-picking platform, so as to adjust the direction of the film after picking up the material; the material-picking buffer module is provided with multiple buffer shafts connected to the material-picking platform.

[0012] A further improvement to the above scheme is that the material handling platform is equipped with a heating plate, and the heating plate is equipped with multiple heating tubes for heating the plate, so as to maintain a constant temperature during material handling and transfer.

[0013] A further improvement to the above solution is that the bonding and transfer mechanism includes a linear motor module, the transfer platform is mounted on the linear motor module, and the linear motor module is used to drive the transfer platform to reciprocate between the material handling and transfer mechanism and the unloading mechanism.

[0014] A further improvement to the above scheme is that a flattening module is provided between the bonding and transfer mechanism and the unloading mechanism, and the flattening module is provided with a flattening roller for rolling the film on the transfer platform.

[0015] A further improvement to the above solution is that the unloading mechanism is provided with an unloading lifting module, an unloading gripping platform, and an unloading placement platform. The unloading gripping platform is set on the unloading lifting module and grips the film from the transfer platform by vacuum adsorption. The unloading placement platform is used to place the film placed on the unloading gripping platform.

[0016] The beneficial effects of this invention are: Compared to existing film pick-up and transfer methods, this invention uses a vacuum-adsorbed support platform to initially flatten and fix the film after feeding. Secondly, during pick-up, the support platform uses micro-holes to blow air in reverse, causing the film to slightly bulge and move towards the pick-up platform. Simultaneously, the pick-up platform uses vacuum adsorption. This combined "blowing-suction" action effectively eliminates electrostatic adsorption or localized vacuum residue between the film and the platform, ensuring the film is flat and wrinkle-free from the start of the transfer. Finally, the pick-up buffer module provides flexible cushioning at the moment the pick-up platform contacts the film, preventing scratches or deformation caused by mechanical impact. This eliminates film wrinkles, stretching, or breakage from the source. The pick-up and transfer mechanism integrates pick-up lateral movement, lifting, rotation, and independent bonding and transfer functions, forming a highly integrated automated workstation. The pick-up and transfer mechanism can move freely in three-dimensional space and can precisely adjust the film angle through the pick-up rotation module to match the directional requirements of the bonding station. The bonding and transfer mechanism is specifically responsible for the final bonding action, with clear division of labor and a compact cycle. This allows the entire process, from material feeding and picking to angle correction and final bonding, to be completed continuously and automatically, greatly reducing manual intervention, improving production efficiency and operational consistency, and making it particularly suitable for large-scale continuous production scenarios.

[0017] The same "blow-up then adsorption" precision transfer method is used when transferring the film from the pick-up stage to the transfer stage. This strategy cleverly utilizes airflow control. First, air is blown through micropores to break the adsorption state between the film and the original stage, allowing them to separate smoothly and form a tiny air cushion layer. Then, the film is captured by vacuum adsorption on the target stage. This avoids the stress concentration and potential damage to the film caused by traditional purely mechanical tearing or peeling. Especially for ultra-thin, fragile, or sticky functional films, it enables near-zero stress and gentle transfer, greatly reducing material loss.

[0018] The film feeding device of the present invention effectively solves industry problems such as wrinkling, damage and inaccurate positioning of films during automated feeding and bonding processes by using a pneumatic transfer method and multi-module collaborative operation. It has outstanding technological progress and practical value in improving product quality, production efficiency and automation level. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the film feeding device of the present invention; Figure 2 for Figure 1 A three-dimensional schematic diagram of the film feeding device from another perspective; Figure 3 for Figure 1 Top view schematic diagram of the film feeding device for bonding; Figure 4 for Figure 1 A three-dimensional schematic diagram of the feeding mechanism of the medium-lamination film feeding device; Figure 5 for Figure 1 A three-dimensional schematic diagram of the material handling and transfer mechanism of the intermediate bonding film handling device; Figure 6 for Figure 1 A three-dimensional schematic diagram of the bonding and transfer mechanism of the bonding film feeding device.

[0020] Explanation of reference numerals in the attached drawings: Frame 1, Feeding mechanism 2, Unloading assembly 21, Unloading lifting module 211, Peeling assembly 22, Peeling drive cylinder 221, Peeling blade 222, Peeling picking module 223, Static eliminator assembly 23, Static eliminator frame 231, Ionizing air bar 232, Feeding moving assembly 24, Linear moving module 241, Moving clamping module 242, Support platform 3, Picking and transferring mechanism 4, Picking lateral moving module 41, Picking lifting module 42, Picking rotating module 43, Picking buffer module 44, Buffer shaft 441, Picking platform 45, Heating plate 451, Heating tube 452, Bonding and transferring mechanism 5, Transfer platform 51, Linear motor module 52, Flattening module 53, Flattening roller 531, Unloading mechanism 6, Unloading lifting module 61, Unloading gripping platform 62, Unloading placement platform 63. Detailed Implementation

[0021] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0022] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0024] like Figures 1-6As shown, in one embodiment of the present invention, a film loading and unloading device is provided, including a frame 1, a feeding mechanism 2, a support platform 3, a loading and transfer mechanism 4, a bonding and transfer mechanism 5, and a unloading mechanism 6. The feeding mechanism 2 is used to feed the film to the support platform 3, which is a vacuum platform used to flatten and adsorb the film. The loading and transfer mechanism 4 includes a loading transverse module 41, a loading lifting module 42, a loading rotation module 43, a loading buffer module 44, and a loading platform 45. The loading transverse module 41 is mounted on the frame 1 via a gantry frame, the loading lifting module 42 is mounted on the loading transverse module 41, and the loading rotation module 43 is mounted on the loading lifting module 44. On the lowering module 42, the material picking buffer module 44 is located at the drive end of the material picking rotation module 43, and the material picking platform 45 is located on the material picking buffer module 44. The material picking platform 45 is a vacuum platform. When the material picking platform 45 picks up material, the support platform 3 blows air in reverse through micropores to make the film flat and blown towards the material picking platform 45. At the same time, the material picking platform 45 generates a vacuum through micropores to flatten and adsorb the film. The bonding and transfer mechanism 5 is provided with a transfer platform 51, which is a vacuum platform. When the material picking platform 45 releases material, it blows air in reverse through micropores to make the film flatten and blown towards the transfer platform 51. When it is placed in, a vacuum is generated through the micropores on the transfer platform 51 to flatten and adsorb the film. In this embodiment, the film after feeding is initially flattened and fixed by the vacuum adsorption support platform 3. Secondly, during material handling, the carrier platform 3 uses micro-holes to blow air in reverse, causing the film to slightly bulge and move towards the material handling platform 45. Simultaneously, the material handling platform 45 uses vacuum adsorption. This combined "blowing-suction" action effectively eliminates electrostatic adsorption or localized vacuum residue between the film and the platform, ensuring the film is flat and wrinkle-free from the start of the transfer process. Finally, the material handling buffer module 44 provides flexible cushioning when the material handling platform 45 contacts the film, preventing scratches or deformation caused by mechanical impact. This eliminates film wrinkles, stretching, or breakage at the source. The material handling and transfer mechanism 4 integrates material handling lateral movement, lifting, rotation, and independent bonding and transfer functions, forming a highly integrated automated workstation. The material handling and transfer mechanism 4 can move freely in three-dimensional space and can precisely adjust the film angle through the material handling rotation module 43 to match the directional requirements of the bonding station. The bonding and transfer mechanism 5 is specifically responsible for the final bonding action, with clear division of labor and a compact cycle. This allows the entire process, from material feeding and picking to angle correction and final bonding, to be completed continuously and automatically, greatly reducing manual intervention, improving production efficiency and operational consistency, and making it particularly suitable for large-scale continuous production scenarios.

[0025] In this embodiment, the same "blow-up then adsorption" precision transfer method is used when transferring the material from the pick-up stage 45 to the transfer stage 51. This strategy cleverly utilizes airflow control, first breaking the adsorption state between the film and the original stage by blowing air through micropores, allowing them to separate smoothly and form a tiny air cushion layer, and then capturing it through vacuum adsorption on the target stage. This avoids the stress concentration and potential damage to the film caused by traditional purely mechanical tearing or peeling, especially for ultra-thin, fragile, or sticky functional films, enabling near-zero stress gentle transfer and greatly reducing material loss.

[0026] The film feeding device of this embodiment effectively solves industry problems such as wrinkles, damage, and inaccurate positioning of films during automated feeding and bonding processes by using a pneumatic transfer method and multi-module collaborative operation. It has outstanding technological progress and practical value in improving product quality, production efficiency and automation level.

[0027] See Figure 4 As shown, the feeding mechanism 2 includes a feeding assembly 21, a peeling assembly 22, an antistatic assembly 23, and a feeding moving assembly 24. The feeding assembly 21 is used to stack multiple films. The feeding moving assembly 24 is used to grip the film on the feeding assembly 21 and pass it sequentially through the peeling assembly 22 and the antistatic assembly 23. The peeling assembly 22 is used to peel off the release layer on the surface of the film. The antistatic assembly 23 is used to remove static electricity from the film. The feeding moving assembly 24 is used to pick up the film and place it onto the support platform 3. This embodiment constructs a complete film pretreatment and feeding production line. By setting up the feeding assembly 21, peeling assembly 22, antistatic assembly 23, and feeding moving assembly 24, the entire process from batch storage, automatic peeling of the protective layer, elimination of electrostatic interference to precise feeding is automated. Among them, the peeling component 22 can remove the peeling layer on the surface of the film, avoiding the pollution, wrinkles or damage that may be caused by manual peeling; the antistatic component 23 effectively eliminates the static charge generated by friction during the separation and transfer of the film, preventing the static electricity from attracting dust or causing the film to stick or drift unexpectedly, thus ensuring the cleanliness and stability of subsequent material handling and bonding operations from the source.

[0028] The feeding assembly 21 is equipped with a feeding lifting module 211 for feeding multiple stacked films. The peeling assembly 22 includes a peeling drive cylinder 221 and a peeling blade 222. The peeling drive cylinder 221 drives the peeling blade 222 to move in the direction of film movement, scooping the film to separate it from the peeling layer. The peeling assembly 22 also includes a peeling picking module 223 for adsorbing the peeling layer and continuously picking up and separating the peeling layer when the feeding moving assembly 24 picks up the film body. This embodiment improves the continuity of feeding, the reliability of peeling operations, and the level of automation. The feeding lifting module 211 allows the stacked film piles to be automatically and continuously lifted and replenished, eliminating the need for frequent machine stops and manual feeding, ensuring the material supply needs for long-term continuous production. The peeling assembly 22 uses a mechanical scooping method where the peeling drive cylinder 221 drives the peeling blade 222, combined with an independent peeling picking module 223. The peeling blade 222 can gently insert between the film and the peeling layer and initially separate them, while the peeling and picking module 223 can actively adsorb and grab the peeling layer. While the feeding moving component 24 takes away the film body, it continuously pulls the peeling layer in the opposite direction to ensure that the two are completely and cleanly separated. This effectively avoids feeding failure or film contamination caused by peeling layer residue or back adhesion. The peeling process is stable and controllable and does not damage the film itself.

[0029] The static eliminator 23 includes a static eliminator frame 231 and ion bars 232. Two sets of ion bars 232 are arranged opposite each other on the upper and lower sides of the static eliminator frame 231. Two peeling drive cylinders 221 are arranged on the left and right sides of the static eliminator frame 231, respectively. When the film passes through the static eliminator frame 231, static electricity is eliminated from the film by the ion bars 232. This embodiment achieves efficient and uniform static elimination on both sides of the film and optimizes the spatial layout. By setting two sets of ion bars 232 opposite each other, positive and negative ion streams can be emitted simultaneously to the upper and lower surfaces of the film to neutralize its surface charge. This results in fast and thorough static elimination, avoiding the problems of charge imbalance or incomplete elimination that may occur with single-sided static elimination. Two stripping drive cylinders 221 are respectively positioned on the left and right sides of the static elimination frame 231, so that the stripping action and the static elimination process are closely connected in space and the process is smooth. Moreover, it avoids interference between mechanical parts such as cylinders and ion air bars 232 in the working area, ensuring the uniformity and stability of the ion air field. This allows the film to achieve a good static elimination effect in a short time after passing through the static elimination frame 231, creating an ideal static-free environment for subsequent flat adsorption and precise transfer.

[0030] The feeding moving assembly 24 includes a linear moving module 241 and a moving clamping module 242. The linear moving module 241 drives the moving clamping module 242 to move between the peeling assembly 22, the antistatic assembly 23, and the support platform 3. The moving clamping module 242 is equipped with a clamping plate for clamping the film and transferring it to the support platform 3 under the action of the linear moving module 241. In this embodiment, by using the linear moving module 241 to drive the moving clamping module 242, the clamping module can achieve linear reciprocating motion between the peeling station, the antistatic station, and the support platform 3, which is beneficial to improving transfer efficiency and repeatability. The clamping plate equipped with the moving clamping module 242 can mechanically grip the edge of the film, ensuring a firm grip and preventing indentation or damage to the main body of the film. The entire assembly has a compact structure, with clear separation of the driving and execution units, facilitating integrated installation and maintenance, and ensuring the reliability and rhythm of material flow from pretreatment to feeding.

[0031] The material-picking rotation module 43 drives the material-picking buffer module 44 to rotate the material-picking platform 45, thereby adjusting the orientation of the film after picking up the material. The material-picking buffer module 44 is equipped with multiple buffer shafts 441 connected to the material-picking platform 45. This embodiment achieves flexible adjustment of the film orientation after picking up the material and flexible protection during the contact process. The material-picking rotation module 43 can drive the material-picking buffer module 44 and the material-picking platform 45 to rotate as a whole, allowing the device to precisely adjust the placement angle of the film during transfer according to the orientation requirements of the subsequent bonding station after picking up the material from the support platform 3, thus enhancing the adaptability of the equipment to different product process layouts. At the same time, the material-picking buffer module 44 is connected to the material-picking platform 45 through multiple buffer shafts 441, forming a multi-dimensional flexible connection mechanism. When the material-picking platform 45 contacts the film surface, it can effectively absorb and offset mechanical impact and vibration.

[0032] The material handling platform 45 is equipped with a heating plate 451, on which multiple heating tubes 452 are mounted for heating, thus maintaining a constant temperature during material handling and transfer. In this embodiment, by equipping the material handling platform 45 with a heating plate 451 containing multiple heating tubes 452, the working surface of the platform can be uniformly and controllably heated. During material handling and transfer, the film is adsorbed onto the temperature-controlled material handling platform 45, and its temperature can be maintained or changed slowly, avoiding film shrinkage, warping, changes in viscosity, or alterations in internal stress caused by ambient temperature fluctuations or contact with a cold platform.

[0033] The bonding and transfer mechanism 5 includes a linear motor module 52, and the transfer platform 51 is mounted on the linear motor module 52. The linear motor module 52 drives the transfer platform 51 to reciprocate between the material picking and transfer mechanism 4 and the unloading mechanism 6. This embodiment uses a linear motor module 52 to drive the transfer platform 51, compared to traditional ball screw or belt drives. This allows the transfer platform 51 to achieve extremely fast and precise reciprocating motion between the material picking station and the unloading station (or bonding station), greatly shortening the air transport time of the film from material picking to bonding or unloading, and improving the overall production cycle time.

[0034] A flattening module 53 is provided between the bonding and transfer mechanism 5 and the unloading mechanism 6. The flattening module 53 is equipped with a flattening roller 531 for rolling the film on the transfer platform 51. In this embodiment, the film transferred to the platform is processed to ensure that it reaches its optimal pre-bonding state. The flattening roller 531 of the flattening module 53 can roll the surface of the film placed on the transfer platform 51. This can effectively eliminate microscopic wrinkles, localized warping, or bubbles that may be difficult to detect with the naked eye after multiple transfers, ensuring that the film is in an absolutely flat and tightly bonded state to the platform surface before bonding.

[0035] The unloading mechanism 6 is equipped with an unloading lifting module 61, an unloading gripping platform 62, and an unloading placement platform 63. The unloading gripping platform 62 is mounted on the unloading lifting module 61 and grips the film from the transfer platform 51 using vacuum adsorption. The unloading placement platform 63 is used to place the film placed on the unloading gripping platform 62. In this embodiment, the unloading lifting module 61 drives the unloading gripping platform 62 to move up and down, allowing it to accurately approach or leave the film on the transfer platform 51. The unloading gripping platform 62 uses vacuum adsorption to grip the film, with uniformly distributed gripping force, preventing marks or mechanical damage to the film surface. This allows the film to be smoothly "picked up" from the transfer platform 51. The unloading placement platform 63 provides a temporary and orderly storage location for the gripped film, facilitating subsequent batch removal by manual labor or a robotic arm.

[0036] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A conformable film takeoff apparatus characterized by: The application relates to a thin film automatic feeding device, which comprises a rack, a feeding mechanism, a bearing table, a material taking and transferring mechanism, a laminating and transferring mechanism and a discharging mechanism, the feeding mechanism is used for feeding thin films to the bearing table, the bearing table is a vacuum table and is used for flatly adsorbing the thin films; the material taking and transferring mechanism comprises a material taking horizontal moving module, a material taking lifting module, a material taking rotating module, a material taking buffering module and a material taking table, the material taking horizontal moving module is arranged on the rack through a portal frame, the material taking lifting module is arranged on the material taking horizontal moving module, the material taking rotating module is arranged on the material taking lifting module, the material taking buffering module is arranged at the driving end of the material taking rotating module, the material taking table is arranged on the material taking buffering module, and the material taking table is a vacuum table; when the material taking table takes the thin films, the bearing table blows the thin films flatly towards the material taking table through reverse blowing of micropores, and meanwhile the material taking table adsorbs the thin films flatly through vacuum generated by the micropores; the laminating and transferring mechanism is provided with a transferring table, the transferring table is a vacuum table, and when the material taking table discharges the thin films, the thin films are blown flatly towards the transferring table through reverse blowing of micropores, and the thin films are adsorbed flatly through vacuum generated by the micropores on the transferring table.

2. The conformable film pick-up device of claim 1, wherein: The feeding mechanism comprises a discharging assembly, a stripping assembly, an electrostatic elimination assembly and a feeding moving assembly, the discharging assembly is used for stacking multiple thin films, the feeding moving assembly is used for grabbing the thin films on the discharging assembly and sequentially passing through the stripping assembly and the electrostatic elimination assembly, the stripping assembly is used for stripping the stripping layer on the surface of the thin films, the electrostatic elimination assembly is used for eliminating electrostatic of the thin films, and the feeding moving assembly is used for taking the thin films to the bearing table.

3. The conformable film pick-up device of claim 2, wherein: The discharging assembly is provided with a discharging lifting module and is used for feeding the stacked multiple thin films, the stripping assembly comprises a stripping driving cylinder and a stripping cutter plate, the stripping driving cylinder is used for driving the stripping cutter plate to move towards the moving direction of the thin films, shoveling the thin films to separate the thin films from the stripping layer, and the stripping assembly further comprises a stripping taking module, which is used for adsorbing the stripping layer and continuously grabbing and separating the stripping layer when the feeding moving assembly grabs the thin film body.

4. The conformable film pick-up device of claim 3, wherein: The electrostatic elimination assembly comprises an electrostatic elimination frame and ion wind rods, the ion wind rods are provided with two groups and are oppositely arranged on the upper and lower sides of the electrostatic elimination frame, and the stripping driving cylinders are provided with two groups and are respectively arranged on the left and right sides of the electrostatic elimination frame; when the thin films pass through the electrostatic elimination frame, the ion wind rods eliminate electrostatic of the thin films.

5. The conformable film pick-up device of claim 4, wherein: The feeding moving assembly comprises a linear moving module and a moving clamping module, the linear moving module is used for driving the moving clamping module to move on the stripping assembly, the electrostatic elimination assembly and the bearing table, the moving clamping module is provided with a clamping plate and is used for clamping the thin films, and the linear moving module is used for transferring the thin films to the bearing table.

6. The conformable film pick-up device of claim 1, wherein: The material taking rotating module is used for driving the material taking buffering module to drive the material taking table to rotate, so as to adjust the direction of the thin films after taking the thin films; the material taking buffering module is provided with multiple buffering shafts and is connected with the material taking table.

7. The conformable film pick-up device of claim 1, wherein: The material taking table is provided with a heating plate, the heating plate is provided with multiple heating pipes, and the heating plate is heated to play a constant temperature role during the material taking and transferring.

8. The conformable film pick-up device of claim 1, wherein: The fitting transfer mechanism comprises a linear motor module, the transfer platform is arranged on the linear motor module, and the linear motor module is used for driving the transfer platform to reciprocate between the material taking transfer mechanism and the discharging mechanism.

9. The conformable film pick-up device of claim 1, wherein: The fitting transfer mechanism and the discharging mechanism are provided with a flattening module, the flattening module is provided with a flattening roller, and the flattening roller is used for rolling the film on the transfer platform.

10. The conformable film pick-up device of claim 1, wherein: The discharging mechanism is provided with a discharging lifting module, a discharging grabbing platform and a discharging placing platform, the discharging grabbing platform is arranged on the discharging lifting module, the film is grabbed from the transfer platform by vacuum adsorption, and the discharging placing platform is used for placing the film placed by the discharging grabbing platform.

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