Heat source heat dissipation assembly and electronic equipment

Abstract

The invention discloses a heat source heat dissipation assembly and electronic equipment, and the heat source heat dissipation assembly comprises a heating element which is provided with a heating area; the heat pipe element is provided with a heat absorption area, and at least a local position of the heat absorption area and the heating area form heat transfer; the sealing shell covers the peripheries of the heating area and the heat absorption area and isolates the heat absorption area and the heating area from the outside to form a closed space; the heat dissipation area integrally extends from the heat absorption area and penetrates through the sealing shell to the outside of the closed space; and the closed space is filled with the heat transfer medium. The heat source heat dissipation assembly can effectively improve the heat dissipation performance.

Description

Technical Field

[0001] This application relates to a heat source heat dissipation component and an electronic device. Background Technology

[0002] With the continuous development of technology, the integration of chips in current electronic devices is becoming increasingly higher, their computing power is increasing, and their size is becoming smaller. Consequently, the heat generated by these chips is also increasing. How to efficiently dissipate heat from chips has been a long-standing problem for the industry. Current technologies typically use heat pipes. Specifically, the heat-absorbing end of the heat pipe is attached to the chip, rapidly transferring the heat generated by the chip to the heat pipe. From one end (heat-absorbing / evaporating end), the heat is quickly transferred to the other end (heat-dissipating / condensing end). Simultaneously, active cooling components such as fans rapidly dissipate the heat transferred through the heat pipe, thus achieving the purpose of heat dissipation.

[0003] However, in existing technologies, the contact thermal resistance between the chip and the heat pipe affects heat transfer efficiency. In actual production, a perfect fit between the chip and the heat pipe is not always achievable. Therefore, a soft thermal paste (also known as thermal grease) is often sandwiched between the chip and the heat pipe's contact surfaces to reduce contact thermal resistance and improve heat transfer efficiency. Even so, the thermal paste may still dry out under prolonged use or specific conditions, leading to a decrease in thermal conductivity. Furthermore, as chips become smaller, the effective contact area between the chip and the heat pipe also decreases, which itself affects heat transfer efficiency.

[0004] Therefore, it is necessary to design a new heat source heat dissipation component and electronic device to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a new heat source heat dissipation component and electronic device that can effectively improve heat dissipation performance.

[0006] To achieve the aforementioned objective, this application provides the following technical solution: A heat source heat dissipation component includes: a heat-generating element having a heat-generating area; A heat pipe element having a heat-absorbing region, wherein at least a portion of the heat-absorbing region exchanges heat with the heat-generating region; A sealing shell is placed around the heating area and the heat absorption area to isolate the heat absorption area and the heating area from the outside and form a sealed space; The heat dissipation zone extends integrally from the heat absorption zone and passes through the sealing shell to the outside of the enclosed space; A heat transfer medium is filled within the sealed space.

[0007] Furthermore, the heat transfer medium is: liquid metal; or a composite thermal conductive paste containing liquid metal; or a thermal conductive material that is in paste / gel form at room temperature but whose fluidity increases with increasing temperature; or a thermal conductive material that is solid at room temperature and can change into a liquid state with increasing temperature; or a thermally conductive nanofluid material.

[0008] Furthermore, the heating area has a first functional surface, and the heat-absorbing area has a second functional surface, with the first functional surface and the second functional surface in direct contact.

[0009] Furthermore, a fitting gap is formed between the heat absorption area of ​​the heat pipe element and the heat generation area of ​​the heating element, and the heat transfer medium includes a portion filled within the fitting gap.

[0010] Furthermore, the maximum clearance between the parts shall not exceed 1 mm.

[0011] Furthermore, along the stacking direction between the heat-absorbing area of ​​the heat pipe element and the heat-generating area of ​​the heating element, a reserved gap is formed between the heat-absorbing area of ​​the heat pipe element and the inner wall surface of the sealing shell, and the heat transfer medium includes a portion filled in the reserved gap.

[0012] Furthermore, an injection port is formed through the sealing shell. After the heat transfer medium is injected into the sealed space through the injection port, the injection port is sealed.

[0013] Furthermore, a perforation is formed through the side wall of the sealing shell, and the heat dissipation area extends integrally from the heat absorption area and passes through the perforation of the sealing shell to the outside of the sealed space; the junction of the heat pipe element and the perforation is sealed.

[0014] Furthermore, the sealing shell includes a top plate and an annular wall extending downward from the edge of the top plate. Along a transverse direction perpendicular to the top plate, two opposing first and second through holes are formed through the annular wall. One end of the heat absorption zone extends integrally through the first perforation to the outside of the sealed space and forms the heat dissipation zone; The other end of the heat-absorbing zone extends integrally through the second perforation to the outside of the sealed space and forms an extended tail. The junction between the heat pipe element and the first and second perforations is sealed.

[0015] Furthermore, the heating area is a portion formed on the surface of the heating element, the sealing shell is fastened to the surface of the heating element and covers the periphery of the heating area, and the joint between the sealing shell and the surface of the heating element is sealed.

[0016] Furthermore, it also includes: a substrate element, wherein the heating element has a plurality of metal contacts, and the heating element is electrically connected to the substrate element through the metal contacts; An insulating sealing portion prevents the metal contact portion of the heating element and the portion electrically connected to the substrate element from contacting the heat transfer medium; The sealing shell is fastened to the surface of the substrate element and covers the periphery of the heating element, and the joint between the sealing shell and the surface of the substrate element is sealed.

[0017] Furthermore, it also includes: a substrate element, wherein the heating element is fixed on the substrate element; A retaining member straddles the sealing shell, with both ends of the retaining member fixed to the substrate element. The retaining member maintains a binding pressure on the sealing shell towards the substrate element at all times.

[0018] Furthermore, the sealing treatment method is to apply sealant; or, the sealing treatment method is to weld; or, the joint requiring sealing treatment is filled with a sealing ring.

[0019] Furthermore, it also includes: heat dissipation fin assembly, which is attached to the heat dissipation area of ​​the heat pipe element to form a heat transfer; The fan assembly has an air outlet aligned with the heat sink assembly.

[0020] To achieve the aforementioned objective, this application also provides the following technical solution: An electronic device comprising a heat source heat dissipation component as described in any of the above claims.

[0021] Compared with the prior art, the beneficial effect of this application is that it can effectively improve heat dissipation performance. Attached Figure Description

[0022] Figure 1 This is a three-dimensional schematic diagram of the heat dissipation component of the heat source in this application.

[0023] Figure 2 This is a partial three-dimensional schematic diagram of the heat dissipation component of the heat source in this application, specifically showing a three-dimensional schematic diagram when the sealed shell is separated.

[0024] Figure 3 yes Figure 2 A further exploded 3D view of the heat dissipation components of the central heat source.

[0025] Figure 4 yes Figure 1 Side view of the heat dissipation component of the central heat source.

[0026] Figure 5 yes Figure 1 Top view of the heat dissipation components of the central heat source.

[0027] Figure 6 It is self Figure 5 A cross-sectional view of line AA in the middle, showing that the sealed space of the sealed shell is not filled with heat transfer medium.

[0028] Figure 7 yes Figure 6 The enlarged view of the structure within the dashed box further demonstrates that the sealed space of the enclosure is filled with a heat transfer medium.

[0029] Figure 8 yes Figure 7 The second embodiment of the structure shown.

[0030] Figure 9 yes Figure 7 The third embodiment of the structure shown.

[0031] Figure 10 yes Figure 7 The fourth embodiment of the structure shown. Detailed Implementation

[0032] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are expressly listed, but may include other steps or units that are not expressly listed or that are inherent to such process, method, product, or device.

[0034] Please refer to Figures 1 to 7The image shows a first embodiment of the heat dissipation assembly of this application. The heat dissipation assembly includes a heat-generating element 1, a heat pipe element 2, a sealing shell 3, a heat transfer medium 4, a substrate element 5, a heat dissipation fin assembly 6, and a fan assembly 7, all of which cooperate with each other. The heat-generating element 1 can be, for example, a CPU (Central Processing Unit) or GPU (Graphics Processing Unit) inside an electronic device. The heat pipe element 2 can specifically consist of a sealed copper pipe, a wick structure implanted inside the copper pipe, and a small amount of working fluid (usually pure water, acetone, or ammonia, etc., which are volatile liquids). The copper pipe is sealed at both ends and the inside is evacuated. In this embodiment, the heat pipe element 2 is defined with a heat absorption region 21 and a heat dissipation region 22. The heat absorption region 21 and the heat dissipation region 22 are actually two different locations along the length of the heat pipe element 2, typically the two ends of the heat pipe element 2. The heat pipe element 2 is a heat transfer element with extremely high thermal conductivity. It uses the phase change principle (liquid becomes gas, and gas becomes liquid again) and internal capillary structure to quickly transfer heat from one end (heat absorption zone 21) to the other end (heat dissipation zone 22).

[0035] The heat dissipation fin assembly 6 is attached to the heat dissipation area 22 of the heat pipe element 2. In this application, the heat dissipation fin assembly 6 is a series of thin and dense metal sheets (typically formed by stacking copper sheets at intervals, with airflow channels formed between adjacent copper sheets). The core function of the heat dissipation fin assembly 6 is to maximize the surface area in contact with the air, thereby efficiently dissipating the heat conducted through the heat pipe element 2 to the surrounding environment through convection and radiation. The fan assembly 7 can be an axial fan or a centrifugal fan. The fan assembly 7 has an air outlet, which is directed towards the heat dissipation fin assembly 6 to enhance the airflow around the heat dissipation fin assembly 6, thereby improving the heat dissipation capacity of the heat dissipation fin assembly 6.

[0036] Please refer to Figures 1 to 7 As shown, the heating element 1 can be a CPU (Central Processing Unit), GPU (Graphics Processing Unit), or other chips or heating components. The substrate element 5 can be a circuit board or motherboard inside an electronic device. The heating element 1 is mounted on the substrate element 5. Specifically, the heating element 1 has a plurality of metal contact portions (not shown), and the heating element 1 is electrically connected to metal contact points (gold fingers, not shown) on the substrate element 5 through the metal contact portions. The heating element 1 has a heating area 11, which is typically defined on the surface of the heating element 1 facing away from the substrate element 5. In a preferred embodiment, at least a partial location of the heat absorption area 21 of the heat pipe element 2 is attached to the heating area 11 of the heating element 1 to form a heat transfer.

[0037] Specifically, the sealing shell 3 is placed around the heating zone 11 and the heat absorption zone 21 to isolate the heat absorption zone 21 and the heating zone 11 from the outside and form a sealed space 30. Figures 1 to 7 In the illustrated embodiment, the sealing shell 3 is fastened to the surface of the substrate element 5 and covers the periphery of the heating element 1. The joint between the sealing shell 3 and the surface of the substrate element 5 is sealed. The sealing method can be applying sealant; alternatively, it can be welding; or, a sealing ring can be filled into the joint requiring sealing. The sealing shell 3 can be fastened to the substrate element 5 using fasteners such as nuts; or it can be directly fixed to the substrate element 5 by adhesive or welding. Of course, in other embodiments, the heat source heat dissipation assembly may also include a retaining member (not shown), which straddles the sealing shell, and both ends of the retaining member are fixed to the substrate element 5 (e.g., by fastening with nuts). The retaining member maintains a binding pressure on the sealing shell 3 towards the substrate element 5, further ensuring an effective seal at the joint between the sealing shell 3 and the surface of the substrate element 5.

[0038] In particular, the heat absorption zone 21 mentioned in this application may refer to the entire section of the heat pipe element 2 located inside the sealing shell 3, and does not specifically refer to the part of the surface of the heat pipe element 2 that is in contact with the heating element 1.

[0039] Please refer to the reference. Figure 6 and Figure 7 As shown, the sealed space 30 of the sealing shell 3 is filled with a heat transfer medium 4, which improves the efficiency of heat transfer from the heating element 1 to the heat absorption zone 21 of the heat pipe element 2. In a preferred embodiment, the sealed space 30 is completely filled with the heat transfer medium 4 without any gaps. In a more preferred embodiment, an injection port 303 is formed through the sealing shell 3. After the heat transfer medium 4 is injected into the sealed space 30 through the injection port 303, the injection port 303 is sealed. This can be achieved by filling with sealant, installing a sealing plug, or sealing the injection port 303 by welding.

[0040] In this embodiment, the portion of the metal contact of the heating element 1 that is electrically connected to the substrate element 5 is separated from the heat transfer medium 4 by an insulating seal (not shown). For example, the insulating seal can directly cover the location where the metal contact of the heating element 1 is electrically connected to the substrate element 5. Alternatively, an insulating seal can be placed around the perimeter of the metal contact of the heating element 1 where it mates with the substrate element 5. This design prevents the heat transfer medium 4 poured into the sealing shell 3 from affecting signal transmission between the heating element 1 and the substrate element 5 (e.g., causing short circuits or corrosion).

[0041] In this application, the heat transfer medium 4 is preferably a liquid high thermal conductivity material, which can include at least the following types: it can be a thermal conductivity material that is liquid at room temperature, such as liquid metals; it can also be a thermal conductivity material that is paste-like or gel-like at room temperature, and whose viscosity decreases as the temperature rises, becoming softer and thinner, and its fluidity increases, such as thermally conductive silicone grease or thermally conductive gel; of course, it can also be a thermal conductivity material that is solid at room temperature, and changes phase to a liquid with good fluidity when heated to a high temperature (for example, usually 45-60°C) (phase change material), such as a mixture whose main components are hydrocarbon compounds such as paraffin and high thermal conductivity fillers. It can even be a more cutting-edge nanofluid, which refers to a suspension formed by stably dispersing nanoscale metal, oxide, carbon materials and other particles in a base liquid (water, ethylene glycol, oil, etc.).

[0042] The heat transfer medium 4 is preferably a liquid metal composite thermal paste, mainly based on low-melting-point metals such as gallium-indium (GaIn), gallium-indium-tin (GaIn), or lead-bismuth eutectic alloy (Pb-Bi), combined with polymers or carbon-based materials, graphene, carbon nanotubes (CNTs), etc. Its thermal conductivity can reach 15-30 W / (m·K) or even higher, and its thermal resistance can be as low as 0.02°C·cm² / W. This type of material combines the high thermal conductivity of metals with the interfacial adaptability of fluids. It also features a low melting point (below 30°C), a high boiling point (over 1000°C), a wide liquid temperature range, and excellent thermal conductivity.

[0043] Of course, the heat transfer medium 4 can also preferably be a liquid metal, such as a low-melting-point metal directly composed of gallium-indium alloy (GaIn), gallium-indium-tin alloy (Galinstan), or lead-bismuth eutectic alloy (Pb-Bi). For example, a liquid metal alloy (gallium-indium-tin alloy) has a melting point of about -19°C and remains liquid at room temperature.

[0044] Of course, the heat transfer medium 4 can also preferably be an insulating liquid metal thermal paste, with boron nitride nanosheets being the best choice as its core composite. Alumina, zinc oxide, etc., can also be used. The "insulating armor" mechanism involves coating the surface of the liquid metal droplets with a layer of boron nitride nanosheets. Boron nitride is an excellent thermal conductor (~30-50 W / (m·K)) and also a perfect electrical insulator. In this way, each liquid metal unit is insulated, and the entire paste is no longer conductive. Heat can then be efficiently conducted through the internal liquid metal.

[0045] Please refer to the reference. Figures 1 to 7As shown in this embodiment, the sealing shell 3 includes a top plate 31 and an annular wall 32 extending downward from the edge of the top plate 31. The material of the sealing shell 3 is not limited, but is preferably metal. Along a transverse direction perpendicular to the top plate 31, two opposing first perforations 3021 and second perforations 3022 are formed through the annular wall 32. One end of the heat-absorbing region 21 extends integrally through the first perforation 3021 to the outside of the sealed space 30 and forms the heat-dissipating region 22. The other end of the heat-absorbing region 21 extends integrally through the second perforation 3022 to the outside of the sealed space 30 and forms an extended tail 23. The junction between the heat pipe element 2 and the first perforation 3021 and the second perforation 3022 is sealed. In typical designs, the extended tail 23 is the ineffective end of the heat pipe; however, in other embodiments, the extended tail 23 can also be designed as a structure similar to the heat dissipation area 22, so that the heat absorption area 21 is formed in the middle of the heat pipe element 2, and the heat dissipation areas 22 are formed at both ends of the heat pipe element 2.

[0046] Furthermore, in this embodiment, the two ends of the heat absorption area 21 of the heat pipe element 2 are respectively inserted into the first perforation 3021 and the second perforation 3022, which enables the sealing shell 3 to fix the heat pipe element 2, and makes the positional matching between the heat absorption area 21 and the heating area 11 of the heating element 1 controllable and stable.

[0047] Please combine Figures 1 to 7 In the first embodiment shown, along the stacking direction between the heat-absorbing region 21 of the heat pipe element 2 and the heat-generating region 11 of the heating element 1, a reserved gap 301 is formed between the heat-absorbing region 21 of the heat pipe element 2 and the inner wall surface of the sealing shell 3. The heat transfer medium 4 includes a portion filled within the fitting gap 20. The heating region 11 has a first functional surface (not labeled), and the heat-absorbing region 21 has a second functional surface (not labeled). The first functional surface and the second functional surface are in direct contact.

[0048] In other embodiments, such as Figure 8 As shown, along the stacking direction between the heat absorption area 21 of the heat pipe element 2 and the heat generation area 11 of the heating element 1, a reserved gap 301 is formed between the heat absorption area 21 of the heat pipe element 2 and the inner wall surface of the sealing shell 3, and a mating gap 20 is formed between the heat absorption area 21 of the heat pipe element 2 and the heat generation area 11 of the heating element 1. The heat transfer medium 4 includes a portion filled in the mating gap 20 and a portion filled in the reserved gap 301.

[0049] In other embodiments, such as Figure 9As shown, along the stacking direction between the heat-absorbing region 21 of the heat pipe element 2 and the heat-generating region 11 of the heating element 1, the surface of the heat-absorbing region 21 of the heat pipe element 2 away from the heating element 1 is in contact with the inner wall surface of the sealing shell 3, and a fitting gap 20 is formed between the heat-absorbing region 21 of the heat pipe element 2 and the heat-generating region 11 of the heating element 1, and the heat transfer medium 4 includes a portion filled in the fitting gap 20.

[0050] Theoretically, the smaller the fitting gap 20, the better. That is to say, the best solution is for the heat absorption area 21 of the heat pipe element 2 and the heat generation area 11 of the heating element 1 to fit perfectly (minimum contact thermal resistance and highest heat transfer efficiency). However, this is difficult to achieve in reality. Therefore, in the preferred embodiment, the maximum value of the fitting gap 20 is controlled to be no more than 1 mm.

[0051] In actual products, the heat-generating element 1 can vary. For example, consider GPUs (Graphics Processing Units) and CPUs (Central Processing Units): GPU: Many Simple Cores: A GPU has tens of thousands of stream processors (cores), but each core is very simple, responsible only for the most basic arithmetic and logic operations. Its design goal is to perform the same operation on thousands of data points simultaneously (Single Instruction Multiple Data, SIMD). Therefore, the heat dissipation pattern is as follows: When the GPU is working (e.g., running a AAA game), these tens of thousands of cores are activated on a large scale, with almost all computing units working simultaneously. Although the heat generated by each core is not large, the total power consumption and heat generation are enormous due to the massive number of cores working simultaneously. The heat is generated evenly from all parts of the chip, with a relatively low heat density compared to a CPU, but the absolute value of the total heat is usually high. In this case, the heat-generating area 11 can be any location on the surface of the heat-generating element 1; preferably, the heat-absorbing area 21 of the heat pipe element 2 is directly attached to the surface of the heat-generating element 1 to form heat transfer.

[0052] CPU: Few but Powerful Cores: Modern consumer-grade CPUs typically have 4 to 32 high-performance cores, while server-grade CPUs can even exceed 100 cores. Each core is designed to be highly complex, with a large amount of cache and a sophisticated control unit, adept at handling sequential tasks, logical judgments, and complex calculations. Therefore, the heat dissipation pattern is as follows: during operation, only one or two cores may be running at full load (e.g., when playing games), or all cores may be running at high load intermittently (e.g., during video rendering). Regardless, heat is generated in these few independent core areas. This results in extremely high heat density (heat generated per unit area), and the heat is highly concentrated. As schematically illustrated in the accompanying drawings, the high-heat areas are generally concentrated only in a portion of the CPU surface. In this case, the heat-generating area 11 specifically refers to the high-heat area on the surface of the heat-generating element 1. Preferably, the heat-absorbing area 21 of the heat pipe element 2 is directly attached to the surface of the heat-generating area 11 (the high-heat area) of the heat-generating element 1 to form a heat transfer. In this embodiment, the fit between the sealing shell 3 and the heat-generating element 1 can be designed as follows: Figure 10 As shown, the sealing shell 3 is directly fastened to the surface of the heating element 1 and covers the periphery of the heating area 11, and the joint between the sealing shell 3 and the surface of the heating element 1 is sealed.

[0053] This application's solution improves the heat transfer efficiency between the heating element 1 and the heat pipe element 2, mitigating the problem of reduced heat transfer efficiency caused by contact thermal resistance. It also overcomes the stringent requirement of traditional methods where the heating element 1 and heat pipe element 2 must be in close contact for heat transfer. More importantly, it fully utilizes the non-contact surfaces of the heating element 1 and heat pipe element 2, achieving efficient heat transfer through the heat transfer medium 4. Furthermore, this heat source cooling component can be used in various electronic devices, such as laptops, communication devices, and electric vehicles.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this design, and not to limit it. Although the design has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this design.

[0055] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat source heat dissipating assembly, characterized by, The heat source heat dissipation assembly comprises: a heating element (1) formed with a heating area (11); a heat pipe element (2) formed with a heat absorbing area (21), at least a part of which is in heat transfer with the heating area (11); a sealing shell (3) covering the periphery of the heating area (11) and the heat absorbing area (21), separating the heat absorbing area (21) and the heating area (11) from the outside and forming a closed space (30); a heat dissipation area (22) integrally extended from the heat absorbing area (21) and passing through the sealing shell (3) to the outside of the closed space (30); a heat transfer medium (4) filled in the closed space (30).

2. A heat source heat dissipating assembly according to claim 1, wherein The heat transfer medium (4) is: a liquid metal; or a composite heat conductive paste containing a liquid metal; or a heat conductive material in paste / gel state at room temperature, but with improved fluidity as the temperature rises; or a heat conductive material in solid state at room temperature, which can be transformed into liquid state as the temperature rises; or a nanofluid material capable of conducting heat.

3. The heat source heat dissipation assembly according to claim 1, wherein: the heating area (11) is formed with a first functional surface, and the heat absorbing area (21) is formed with a second functional surface, and the first functional surface directly contacts the second functional surface.

4. The heat source heat dissipation assembly of claim 1, wherein: The heat absorbing area (21) of the heat pipe element (2) and the heating area (11) of the heating element (1) form a fitting gap (20), and the heat transfer medium (4) includes a part filled in the fitting gap (20).

5. A heat source heat dissipating assembly according to claim 4, wherein: The fitting gap (20) is not more than 1mm.

6. The heat source heat dissipation assembly of claim 1, wherein: Along the stacking direction between the heat absorbing area (21) of the heat pipe element (2) and the heating area (11) of the heating element (1), a reserved gap (301) is formed between the heat absorbing area (21) of the heat pipe element (2) and the inner wall surface of the sealing shell (3), and the heat transfer medium (4) includes a part filled in the reserved gap (301).

7. The heat source heat dissipation assembly of claim 1, wherein: The sealing shell (3) is also formed with an injection port (303), and after the heat transfer medium (4) is injected into the closed space (30) through the injection port (303), the injection port (303) is closed.

8. The heat source heat dissipation assembly according to claim 1, wherein: a through hole (302) is formed in the side wall of the sealing shell (3), the heat dissipation area (22) is integrally extended from the heat absorbing area (21) and passes through the through hole (302) of the sealing shell (3) to the outside of the closed space (30), and the heat pipe element (2) is sealed at the joint with the through hole (302).

9. The heat source heat dissipation assembly according to claim 1, wherein: the sealing shell (3) comprises a top plate (31) and a ring wall (32) extended downward from the edge of the top plate (31), and two oppositely arranged first through holes (3021) and second through holes (3022) are formed in the ring wall (32) in the transverse direction perpendicular to the top plate (31). The heat absorbing area (21) is integrally extended to the outside of the closed space (30) through the first perforation (3021) to form the heat dissipating area (22); The other end of the heat absorbing area (21) is integrally extended to the outside of the closed space (30) through the second perforation (3022) to form the extended tail (23); The combination of the heat pipe element (2) and the first perforation (3021) and the second perforation (3022) is sealed.

10. The heat source heat dissipation assembly of claim 1, wherein: The heat generating area (11) is formed on one part of the surface of the heat generating element (1), the sealing shell (3) is buckled on the surface of the heat generating element (1) and covers the periphery of the heat generating area (11), and the combination between the sealing shell (3) and the surface of the heat generating element (1) is sealed.

11. The heat source heat dissipation assembly of claim 1, wherein, Further comprising: The heat generating element (1) is formed with a plurality of metal contact parts, and the heat generating element (1) is electrically connected to the substrate element (5) through the metal contact parts; The insulating sealing part blocks the part of the metal contact part of the heat generating element (1) and the substrate element (5) electrically connected and contacts the heat transfer medium (4); The sealing shell (3) is buckled on the surface of the substrate element (5) and covers the periphery of the heat generating element (1), and the combination between the sealing shell (3) and the surface of the substrate element (5) is sealed.

12. The heat source heat dissipation assembly according to any one of claims 1 to 11, wherein, Further comprising: The heat generating element (1) is fixed on the substrate element (5); The confinement part is straddled above the sealing shell (3), the two ends of the confinement part are fixed with the substrate element (5), and the confinement part always maintains a binding pressure of the sealing shell (3) towards the substrate element (5).

13. A heat source heat dissipating assembly according to claim 8 or 9 or 10 or 11, wherein: The sealing method is to apply sealing glue, or the sealing method is welding, or a sealing glue ring is filled in the combination needing sealing.

14. The heat source heat dissipation assembly according to any one of claims 1 to 11, wherein Further comprising: The heat dissipation fin assembly (6) is attached to the heat dissipating area (22) of the heat pipe element (2) and forms heat transfer; The fan assembly (7) is formed with an air outlet aligned with the heat dissipation fin assembly (6).

15. An electronic device, comprising: The heat source heat dissipation assembly comprises the heat source heat dissipation assembly according to any one of claims 1 to 12.

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