Speed regulation method, device and electronic equipment

Abstract

The application provides a rotating speed adjusting method and device and electronic equipment, and relates to the field of device control. The method comprises the following steps: identifying the type of a machine frame; the machine frame comprises a plurality of fans for cooling one or more single boards installed in the machine frame; based on the type of the machine frame and a first mapping relationship, an association relationship between each temperature control area of each single board and at least one group of target fans is obtained; the first mapping relationship represents the corresponding relationship between each temperature control area of each single board and at least one group of target fans under the type of the machine frame, and each single board comprises one or more temperature control areas; and based on the association relationship and the temperature of each temperature control area of each single board, the rotating speed of at least one target fan in at least one group of target fans corresponding to each single board is adjusted. In this way, unnecessary fan operation can be reduced under the premise of meeting local heat dissipation requirements, more precise and efficient rotating speed adjustment is realized, and good cooling effects of single boards in the machine frame can be achieved for various types of machine frames.

Description

Technical Field

[0001] This application relates to the field of equipment control technology, and in particular to a speed regulation method, device and electronic equipment. Background Technology

[0002] Against the backdrop of communication and testing equipment evolving towards high performance, high density, and multi-functionality, the heat generated by core components during equipment operation continues to rise. Effective heat dissipation has become a key factor restricting stable operation, performance, and lifespan of the equipment. With the rapid increase in power density per unit volume, if heat cannot be dissipated in time, it will lead to excessively high internal temperatures, causing a series of problems such as signal interference, performance degradation, and accelerated component aging. In severe cases, it may even cause equipment shutdown. Therefore, efficient and reliable heat dissipation solutions have become one of the core requirements in equipment design and maintenance. Summary of the Invention

[0003] This application provides a speed regulation method, apparatus, and electronic device for dynamically identifying different chassis to implement a dynamic speed regulation strategy based on the chassis type, thereby achieving better heat dissipation.

[0004] The first aspect of this application provides a speed adjustment method, the method comprising: identifying the chassis type of the chassis; wherein the chassis includes a plurality of fans, the plurality of fans being used to cool one or more boards mounted on the chassis; obtaining the association relationship between each temperature control area of ​​each board and at least one set of target fans based on the chassis type and a first mapping relationship; the first mapping relationship characterizing the correspondence between each temperature control area of ​​each board and at least one set of target fans under the chassis type, wherein the plurality of fans includes at least one set of target fans, the set of target fans includes at least one target fan, and each board includes one or more temperature control areas; when cooling the same temperature control area of ​​the same board from the same temperature at the same speed within a unit time, the cooling amplitude of each target fan in the at least one set of target fans corresponding to the temperature control area is greater than the cooling amplitude of any fan other than the at least one set of target fans corresponding to the temperature control area; and adjusting the speed of at least one target fan in the at least one set of target fans corresponding to each board based on the association relationship and the temperature of each temperature control area of ​​each board.

[0005] As can be seen from the speed adjustment method provided in the first aspect above, by identifying the chassis type and determining the association between the temperature control area of ​​each board and the target fan based on a preset first mapping relationship, the target fan with the greater cooling effect is prioritized when cooling any temperature control area, rather than controlling all fans uniformly. This approach allows for precise response to specific areas when adjusting the speed of fans in different types of chassis, thereby reducing unnecessary fan operation while meeting local heat dissipation needs. This achieves more refined and efficient speed adjustment, enabling good cooling of the boards within the chassis for various chassis types.

[0006] In one possible implementation, for any single board within the chassis, each temperature control zone on the single board includes one or more temperature sensors; before adjusting the speed of at least one target fan from at least one set of target fans corresponding to each single board based on the correlation and the temperature of each temperature control zone on each single board, the method further includes: for any single board within the chassis, determining the temperature of each temperature sensor in each temperature control zone on the single board; for any temperature control zone on any single board within the chassis, determining the temperature of the temperature control zone based on the temperature of each temperature sensor in the temperature control zone.

[0007] As can be seen from the above implementation method, configuring one or more temperature sensors in each temperature control zone and comprehensively determining the temperature of that zone based on the readings of these sensors makes the temperature input used for fan control more reflective of the actual temperature state of that zone. This improves the reliability of temperature sensing and provides a more accurate basis for subsequent fan speed adjustment based on zone temperature.

[0008] In one possible implementation, each board includes one or more processors, with each processor on the board corresponding to a temperature control zone, and each processor located in its corresponding temperature control zone.

[0009] Based on the above implementation method, it can be seen that by corresponding the processors on the single board with the temperature control areas one by one and placing the processors in their corresponding temperature control areas, the heat source of each temperature control area can be clearly defined and concentrated, and the temperature change of the area is mainly caused by the load of the corresponding processor. This makes the control logic of adjusting the fan speed based on the temperature of the area clearly targeted.

[0010] In one possible implementation, for any one of one or more single boards within the chassis, one of the N equally divided regions on that single board is a temperature control zone, where N is determined based on the number of fans that can directly act on that single board.

[0011] Based on the above implementation method, it can be seen that by dividing the single board into N equally divided temperature control zones according to the number N fans that can directly act on the single board, each temperature control zone roughly corresponds to the effective airflow coverage of one fan. This ensures that the division of temperature control zones matches the actual cooling capacity, facilitates the establishment of a reasonable mapping relationship between fans and temperature control zones, and improves the rationality of fan speed adjustment.

[0012] In one possible implementation, for any temperature control area on any single board within the chassis, when the temperature control area includes multiple temperature sensors, the temperature of the temperature control area is determined based on the temperature of each temperature sensor in the temperature control area, including any of the following: determining the average temperature of the multiple temperature sensors in the temperature control area as the temperature of the temperature control area; determining the highest temperature among the multiple temperature sensors in the temperature control area as the temperature of the temperature control area; determining the weighted average temperature of the multiple temperature sensors in the temperature control area as the temperature of the temperature control area, wherein, for any temperature sensor, the weight of the temperature of the temperature sensor is negatively correlated with the processor distance, where the processor distance represents the distance between the temperature sensor and the processor of the temperature control area to which it belongs.

[0013] Based on the above implementation, it can be seen that when the temperature control area contains multiple temperature sensors, the area temperature can be determined by taking the average value, the highest value, or a weighted value based on the distance between the sensor and the processor. This allows temperature assessment to take into account the overall thermal level, high-temperature risk, or proximity of critical heat sources. This approach provides multiple temperature determination methods to meet the needs of different heat dissipation strategies, enhancing the flexibility of temperature judgment without increasing hardware complexity.

[0014] In one possible implementation, for any temperature control area on any single board within the chassis, when the temperature control area includes a temperature sensor, the temperature of the temperature control area is determined based on the temperature of each temperature sensor in the temperature control area, including any of the following: determining the average temperature of the temperature sensor in the temperature control area over a preset time period as the temperature of the temperature control area; determining the highest temperature reached by the temperature sensor in the temperature control area over the preset time period as the temperature of the temperature control area; determining the weighted average temperature of the temperature sensor in the temperature control area over the preset time period as the temperature of the temperature control area, wherein, for the temperature of the temperature sensor at any time within the preset time period, the weight of the temperature at that time period is negatively correlated with the absolute value of the time difference between that time period and the last time period within the preset time period.

[0015] Based on the above implementation method, it can be seen that when there is only one temperature sensor in the temperature control area, the area temperature is determined based on temperature data within a preset time window, such as the average value, maximum value, or time-weighted value. This allows for a temperature estimate with a certain dynamic response capability even under single-point temperature measurement conditions. This enables reliable fan speed adjustment decisions even when sensor resources are limited.

[0016] In one possible implementation, adjusting the speed of at least one target fan in at least one set of target fans corresponding to each single board, based on the correlation and the temperature of each temperature control zone of each single board, includes: determining control parameters of at least one target fan in at least one set of target fans corresponding to each temperature control zone of each single board based on the correlation and the temperature of each temperature control zone of each single board; and adjusting the speed of at least one target fan in at least one set of target fans corresponding to each temperature control zone of each single board based on the control parameters of at least one target fan in at least one set of target fans corresponding to each temperature control zone of each single board.

[0017] Based on the above implementation method, it can be seen that by first determining the control parameters of the target fan based on the correlation and the temperature of the controlled area, and then adjusting its speed according to the control parameters, the control decision and the execution action are separated. This approach allows for a clear intermediate control variable in the speed adjustment process, facilitating the introduction of different control algorithms or strategies.

[0018] In one possible implementation, the control parameters include any of the following: pulse width modulation (PWM) signal, pulse frequency signal, and digital level signal.

[0019] As can be seen from the above implementation method, specifying the control parameters as PWM signals, pulse frequency signals, or digital level signals covers the control methods of current mainstream fan drive interfaces. This approach allows the speed adjustment commands to be adapted to different types of fan hardware, improving the compatibility and feasibility of the solution in actual equipment.

[0020] In one possible implementation, identifying the frame type of the machine frame includes: identifying the frame type of the machine frame when preset conditions are met; the preset conditions include powering on the speed regulation device.

[0021] As can be seen from the above implementation method, triggering the frame type identification under preset conditions such as power-on of the speed regulation device helps reduce frequent or unnecessary identification operations during operation. This ensures the correct loading of the corresponding mapping relationship during system initialization while reducing unnecessary identification overhead, thus improving system startup efficiency and operational stability.

[0022] In one possible implementation, the first mapping relationship is determined based on the simulation results of a thermodynamic model; wherein, for any temperature control area of ​​any one of the one or more single boards operating within the chassis, the simulation of the thermodynamic model is used to determine the temperature reduction range of the temperature control area when each fan in the chassis cools the temperature control area from the same temperature per unit time; the thermodynamic model is established based on the single board position of one or more single boards within the chassis and the installation position of each fan within the chassis.

[0023] Based on the above implementation method, it can be seen that the first mapping relationship is determined by a thermodynamic simulation model that considers the position of the single board and the installation position of the fan, and the simulation quantifies the cooling effect of each fan on each temperature control area. This approach establishes the relationship between the fan and the temperature control area based on physical heat dissipation performance data, rather than empirical assumptions. This helps the target fan to have a stronger cooling capacity for the corresponding area per unit time, improving the scientific validity and effectiveness of the mapping relationship.

[0024] Secondly, embodiments of this application also provide a speed adjustment method, the method comprising: obtaining the installation position of each fan in a plurality of fans in a chassis within the chassis, wherein the chassis includes a plurality of fans, the plurality of fans being used to cool one or more single boards installed in the chassis; determining the association relationship between each temperature control zone of each single board and at least one set of target fans based on the single board position of the one or more single boards and the installation position of each fan in the chassis, wherein the plurality of fans includes at least one set of target fans, the set of target fans includes at least one target fan, and each single board includes one or more temperature control zones; when cooling the same temperature control zone of the same single board from the same temperature at the same speed within a unit time, the cooling amplitude of each target fan in the at least one set of target fans corresponding to the temperature control zone is greater than the cooling amplitude of any fan other than the at least one set of target fans corresponding to the temperature control zone; and adjusting the speed of at least one target fan in the at least one set of target fans corresponding to each single board based on the association relationship and the temperature of each temperature control zone of each single board.

[0025] As can be seen from the speed adjustment method provided in the second aspect above, even without identifying the chassis type, the association between the temperature control area and the target fan is determined by acquiring the position of the circuit board and the fan. This allows for priority adjustment of the target fan with the greater cooling effect when cooling any temperature control area, rather than uniformly controlling all fans. This enables precise response to specific areas when adjusting the speed of fans in different types of chassis, thereby reducing unnecessary fan operation while meeting local heat dissipation needs and achieving more refined and efficient speed adjustment.

[0026] In one possible implementation, for any single board within the chassis, each temperature control zone on the single board includes one or more temperature sensors; before adjusting the speed of at least one target fan from at least one set of target fans corresponding to each single board based on the correlation and the temperature of each temperature control zone on each single board, the method further includes: for any single board within the chassis, determining the temperature of each temperature sensor in each temperature control zone on the single board; for any temperature control zone on any single board within the chassis, determining the temperature of the temperature control zone based on the temperature of each temperature sensor in the temperature control zone.

[0027] As can be seen from the above implementation method, configuring one or more temperature sensors in each temperature control zone and comprehensively determining the temperature of that zone based on the readings of these sensors makes the temperature input used for fan control more reflective of the actual temperature state of that zone. This improves the reliability of temperature sensing and provides a more accurate basis for subsequent fan speed adjustment based on zone temperature.

[0028] In one possible implementation, each board includes one or more processors, with each processor on the board corresponding to a temperature control zone, and each processor located in its corresponding temperature control zone.

[0029] Based on the above implementation method, it can be seen that by corresponding the processors on the single board with the temperature control areas one by one and placing the processors in their corresponding temperature control areas, the heat source of each temperature control area is clear and concentrated, and the temperature change of the area is mainly caused by the load of the corresponding processor. This makes the control logic of adjusting the fan speed based on the temperature of the area clear and targeted.

[0030] In one possible implementation, for any one of one or more single boards within the chassis, one of the N equally divided regions on that single board is a temperature control zone, where N is determined based on the number of fans that can directly act on that single board.

[0031] Based on the above implementation method, it can be seen that by dividing the single board into N equally divided temperature control zones according to the number N fans that can directly act on the single board, each temperature control zone roughly corresponds to the effective airflow coverage of one fan. This ensures that the division of temperature control zones matches the actual cooling capacity, facilitates the establishment of a reasonable mapping relationship between fans and temperature control zones, and improves the rationality of fan speed adjustment.

[0032] In one possible implementation, for any temperature control area on any single board within the chassis, when the temperature control area includes multiple temperature sensors, the temperature of the temperature control area is determined based on the temperature of each temperature sensor in the temperature control area, including any one of the following:

[0033] The average temperature of the multiple temperature sensors in the temperature control area is determined as the temperature of the temperature control area; the highest temperature among the multiple temperature sensors in the temperature control area is determined as the temperature of the temperature control area; the weighted average temperature of the multiple temperature sensors in the temperature control area is determined as the temperature of the temperature control area, wherein, for any temperature sensor, the weight of the temperature sensor's temperature is negatively correlated with the processor distance, where the processor distance represents the distance between the temperature sensor and the processor of the temperature control area to which it belongs.

[0034] Based on the above implementation, it can be seen that when the temperature control area contains multiple temperature sensors, the area temperature can be determined by taking the average value, the highest value, or a weighted value based on the distance between the sensor and the processor. This allows temperature assessment to take into account the overall thermal level, high-temperature risk, or proximity of critical heat sources. This approach provides multiple temperature determination methods to meet the needs of different heat dissipation strategies, enhancing the flexibility of temperature judgment without increasing hardware complexity.

[0035] In one possible implementation, for any temperature control area on any single board within the chassis, when the temperature control area includes a temperature sensor, the temperature of the temperature control area is determined based on the temperature of each temperature sensor in the temperature control area, including any one of the following:

[0036] The average temperature of a single temperature sensor within a preset time period is determined as the temperature of the temperature control area; the highest temperature reached by a single temperature sensor within a preset time period is determined as the temperature of the temperature control area; the weighted average temperature of a single temperature sensor within a preset time period is determined as the temperature of the temperature control area, wherein, for the temperature of the temperature sensor at any time within the preset time period, the weight of the temperature at that time is negatively correlated with the absolute value of the time difference between that time and the last time point within the preset time period.

[0037] Based on the above implementation method, it can be seen that when there is only one temperature sensor in the temperature control area, the area temperature is determined based on temperature data within a preset time window, such as the average value, maximum value, or time-weighted value. This allows for a temperature estimate with a certain dynamic response capability even under single-point temperature measurement conditions. This enables reliable fan speed adjustment decisions even when sensor resources are limited.

[0038] In one possible implementation, adjusting the speed of at least one target fan in at least one set of target fans corresponding to each single board, based on the correlation and the temperature of each temperature control zone of each single board, includes: determining control parameters of at least one target fan in at least one set of target fans corresponding to each temperature control zone of each single board based on the correlation and the temperature of each temperature control zone of each single board; and adjusting the speed of at least one target fan in at least one set of target fans corresponding to each temperature control zone of each single board based on the control parameters of at least one target fan in at least one set of target fans corresponding to each temperature control zone of each single board.

[0039] Based on the above implementation method, it can be seen that by first determining the control parameters of the target fan based on the correlation and the temperature of the controlled area, and then adjusting its speed according to the control parameters, the control decision and the execution action are separated. This approach allows for a clear intermediate control variable in the speed adjustment process, facilitating the introduction of different control algorithms or strategies.

[0040] In one possible implementation, the control parameters include any of the following: a pulse width modulation (PWM) signal, a pulse frequency signal, and a digital level signal.

[0041] As can be seen from the above implementation method, specifying the control parameters as PWM signals, pulse frequency signals, or digital level signals covers the control methods of current mainstream fan drive interfaces. This approach allows the speed adjustment commands to be adapted to different types of fan hardware, improving the compatibility and feasibility of the solution in actual equipment.

[0042] In one possible implementation, identifying the frame type of the machine frame includes: identifying the frame type of the machine frame when preset conditions are met; the preset conditions include powering on the speed regulation device.

[0043] As can be seen from the above implementation method, triggering the frame type identification under preset conditions such as power-on of the speed regulation device helps reduce frequent or unnecessary identification operations during operation. This ensures the correct loading of the corresponding mapping relationship during system initialization while reducing unnecessary identification overhead, thus improving system startup efficiency and operational stability.

[0044] In one possible implementation, the first mapping relationship is determined based on the simulation results of a thermodynamic model; wherein, for any temperature control area of ​​any one of the one or more single boards operating within the chassis, the simulation of the thermodynamic model is used to determine the temperature reduction range of the temperature control area when each fan in the chassis cools the temperature control area from the same temperature per unit time; the thermodynamic model is established based on the single board position of one or more single boards within the chassis and the installation position of each fan within the chassis.

[0045] Based on the above implementation method, it can be seen that the first mapping relationship is determined by a thermodynamic simulation model that considers the position of the single board and the installation position of the fan, and the simulation quantifies the cooling effect of each fan on each temperature control area. This approach establishes the relationship between the fan and the temperature control area based on physical heat dissipation performance data, rather than empirical assumptions. This helps the target fan to have a stronger cooling capacity for the corresponding area per unit time, improving the scientific validity and effectiveness of the mapping relationship.

[0046] Thirdly, embodiments of this application also provide a speed regulating device, which includes:

[0047] An identification module is used to identify the chassis type of the chassis; wherein the chassis includes multiple fans, which are used to cool one or more boards mounted on the chassis; a processing module is used to obtain the association relationship between each temperature control area of ​​each board and at least one set of target fans based on the chassis type and a first mapping relationship; the first mapping relationship characterizes the correspondence between each temperature control area of ​​each board and at least one set of target fans under the chassis type, wherein the multiple fans include at least one set of target fans, the set of target fans includes at least one target fan, and each board includes one or more temperature control areas; when cooling the same temperature control area of ​​the same board from the same temperature at the same speed within a unit time, the cooling amplitude of each target fan in the at least one set of target fans corresponding to the temperature control area is greater than the cooling amplitude of any fan other than the at least one set of target fans corresponding to the temperature control area; an adjustment module is used to adjust the speed of at least one target fan in the at least one set of target fans corresponding to each board based on the association relationship and the temperature of each temperature control area of ​​each board.

[0048] Fourthly, embodiments of this application also provide a speed regulating device, which includes: a memory storing processor-executable instructions; and a processor configured to, when executing the instructions, cause the speed regulating device to implement the method as described in the first or second aspect.

[0049] Fifthly, embodiments of this application also provide an electronic device, which includes: a frame; a plurality of fans; and a speed regulating device as described in the third or fourth aspect, wherein the speed regulating device is connected to each fan.

[0050] As can be seen from the electronic device provided in the fifth aspect above, the architecture of the electronic device includes the speed regulation device in the third or fourth aspect above. Therefore, regardless of the frame type, the speed regulation device can identify the frame type and determine the corresponding mapping relationship of the frame type to control multiple fans, thus having high adaptability.

[0051] In one possible implementation, the electronic device also includes a power supply connected to each fan and speed regulator. Thus, the electronic device has its own power supply, does not rely on an external power source, and can operate as a standalone device.

[0052] In one possible implementation, one or more single boards deployed within the chassis are arranged in a multi-row layout, with each row corresponding to one single board; multiple fans are arranged in a matrix within the chassis, with each row of fans corresponding to at least one row of single boards.

[0053] Based on the structure described above, the arrangement of multiple rows of single-board units and matrix fans allows the cooling airflow formed by the fans to be precisely matched with a single row, reducing air resistance during heat dissipation and resulting in better heat dissipation. Furthermore, this arrangement is easy to adjust and highly tolerant of errors; if some fans are missing or malfunction, the missing airflow can be compensated for by other fans.

[0054] In one possible implementation, for any fan within the chassis and any single board within the chassis, the extended plane of the largest surface area on the fan is parallel to the extended plane of the largest surface area on the single board.

[0055] Based on the structure in the above implementation, the largest area of ​​the single board is its core heat dissipation surface, while the largest area of ​​the fan is its main air intake / exhaust surface. This means that the main air path of the fan is completely parallel to the heat dissipation surface of the single board. The cold air will flow in a purely parallel laminar flow along the heat dissipation surface of the single board, reducing eddies and turbulence caused by the cross-section of the air path and the heat dissipation surface, reducing air volume loss and heat exchange efficiency reduction caused by cross-section wind resistance, allowing the cold air to fully cover the entire heat dissipation surface of the single board, and the hot air can also be efficiently extracted by the fan.

[0056] The technical effects of any of the implementation methods in the third to fourth aspects can be found in the technical effects of different implementation methods in the first or second aspects, and will not be repeated here. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0058] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0059] Figure 2 A schematic diagram of the structure of a frame provided in an embodiment of this application;

[0060] Figure 3 This is a schematic diagram of another frame structure provided in an embodiment of this application;

[0061] Figure 4 This is a schematic diagram of another frame structure provided in an embodiment of this application;

[0062] Figure 5 This is a schematic diagram of the structure of a speed regulating device provided in an embodiment of this application;

[0063] Figure 6 A schematic flowchart illustrating a speed regulation method provided in an embodiment of this application;

[0064] Figure 7 This is a schematic diagram of a speed regulation system provided in an embodiment of this application;

[0065] Figure 8 A schematic flowchart illustrating another speed regulation method provided in this application embodiment;

[0066] Figure 9 A schematic flowchart illustrating another speed regulation method provided in this application embodiment;

[0067] Figure 10 This is a schematic diagram of another speed regulation device provided in the embodiments of this application.

[0068] Explanation of reference numerals in the attached figures

[0069] 100 - Electronic devices;

[0070] 110 - Frame; 111 - Fan; 112 - Fan; 113 - Fan; 114 - Speed ​​regulation device; 115 - Power supply; 116 - Frame management module;

[0071] 1140 - Temperature sensor; 1141 - Memory; 1142 - Processor; 1143 - Bus; 1144 - Communication interface;

[0072] 400-frame;

[0073] 410 - Single board; 420 - Single board; 430 - Fan; 440 - Fan; 450 - Fan;

[0074] 600-speed regulation system;

[0075] 610 - Computer;

[0076] 1001 - Identification module; 1002 - Processing module; 1003 - Adjustment module. Detailed Implementation

[0077] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0078] The terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," or "third," etc., may explicitly or implicitly include one or more of that feature. Furthermore, in the embodiments of this application, the words "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of "exemplary" or "for example," etc., is intended to present the relevant concepts in a concrete manner for ease of understanding.

[0079] Among related technologies, air cooling remains the preferred heat dissipation method due to its advantages such as simple structure, controllable cost, and convenient maintenance. Its core principle is to use a fan to drive airflow, achieving heat exchange between the inside and outside of the equipment, thereby maintaining the equipment's operating temperature within a safe range. In air cooling systems, fan speed control technology, as the core means of regulating heat dissipation capacity, directly determines heat dissipation efficiency, energy consumption, and operating noise. Its performance is closely related to the overall reliability of the equipment and the user experience.

[0080] Analysis revealed that traditional fan speed control technologies generally employ fixed speeds or simple zoned temperature control strategies, lacking the ability to proactively identify and dynamically adapt to the hardware differences of various boards and chassis. Specifically, in traditional methods, each chassis is pre-configured with a dedicated speed adjustment device, which cannot be reused in other chassis types, leading to high development and maintenance costs. This application addresses equipment control scenarios, particularly fan speed adjustment in electronic devices. The aim is to identify the chassis type of electronic devices to determine the correlation between the temperature control area on the board and the fan in the chassis, and then adjust the fan speed within the chassis based on the temperature of each control area and the correlation, thereby adapting to the fan speed adjustment needs of various chassis types and achieving precise fan speed control.

[0081] Traditional fan speed control technologies generally employ fixed speeds or simple zoned temperature control strategies, lacking the ability to proactively identify and dynamically adapt to hardware differences across various boards and chassis. Consequently, the control devices on the chassis are only suitable for adjusting the fan speed of the current chassis type and cannot be adapted to other chassis types for speed regulation.

[0082] In view of this, the present application provides a speed adjustment method, which first identifies the frame type of the chassis, then determines the correlation between the temperature control area on the single board deployed in the chassis and the target fan according to the frame type, and then precisely adjusts the fan according to the temperature of each temperature control area and the correlation, thereby achieving the adaptation of fan speed adjustment for multiple chassis types.

[0083] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device can be a server, data center, control cabinet, or other similar equipment. This application does not limit the specific form of the electronic device; any device using fan-cooled heat dissipation is included in the electronic device referred to in this application. Figure 1 As shown, the electronic device 100 includes: a frame 110, a fan 111, a fan 112, a fan 113, and a speed regulating device 114 connected to each fan.

[0084] Thus, the architecture of the electronic device 100 includes a chassis 110, fans 111, 112, 113, and a speed regulating device 114 connected to each fan. Therefore, regardless of the chassis type, the speed regulating device 114 can identify the chassis type based on the speed regulating method described later, and then determine the corresponding mapping relationship of the chassis type to control multiple fans, thus having high adaptability.

[0085] It should be understood that there is no limit to the number of fans and power supplies; this is for ease of explanation. Figure 1 This example uses only three fans and one power supply. For instance, the electronic device 100 may also include a power supply 115 and / or a chassis management module 116.

[0086] For example, the frame 110, as the main structure of the frame, is used to house other components in the electronic device 100.

[0087] For example, fans 111, 112, and 113 are used to cool down the boards in electronic devices.

[0088] For example, the speed regulation device 114, used to control the speeds of fans 111, 112, and 113, is the main implementer of the method of this application. It is used to obtain chassis information from the chassis management module and send control parameters to fans 111, 112, and 113. The speed regulation device can be implemented using a central processing unit (CPU), graphics processing unit (GPU), application-specific integrated circuit (ASIC), or field-programmable gate array (FPGA). The speed regulation device 114 can be part of electronic device 100 or a device independent of electronic device 100 (such as a desktop computer or server).

[0089] For example, power supply 115 is used to power fans 111, 112, 113, and speed regulator 114. When installing single-board units in electronic devices, it can also be used to power those single-board units. A single-board unit typically refers to a pluggable printed circuit board used in a device, such as a service board, main control board, or network card. It is a relatively independent hardware unit with specific hardware circuitry and software logic, capable of being inserted into the backplane or chassis of an electronic device to work in conjunction with other single-board units to complete the overall system function. It should be noted that speed regulator 114 can also be a single-board unit. For example, power supply 115 is connected to each of the fans (illustratively, each of fans 111, 112, and 113) and speed regulator 114. Thus, electronic device 100, equipped with power supply 115, does not rely on external power and can operate as an independent device.

[0090] For example, the frame management module 116 is used to store the frame information of the electronic device 100. The speed regulation device 114 can identify the frame type by reading the frame information in the frame management module 116. The frame management module 116 can be a hardware storage device, which is a component in the electronic device 100 that is bound to the frame body 110.

[0091] In one possible implementation, the electronic device 100 may also include a controller, which may be deployed in each fan to control each fan individually, or it may be deployed in the chassis to control all fans simultaneously. The controller may be implemented by a control chip or a control board. This application does not limit the specific form of the controller.

[0092] This application does not limit the arrangement of components within the frame; in practical applications, the arrangement can be determined according to requirements. For example, Figure 2 , Figure 3 , Figure 4 These are schematic diagrams of the three types of chassis provided in the embodiments of this application.

[0093] In one possible implementation, with Figure 2 For example, one or more single boards (illustratively, boards 410 and 420) deployed within the chassis 400 are arranged in multiple rows, with each row corresponding to one single board; multiple fans (illustratively, fans 430, 440, and 450) are arranged in a matrix within the chassis 400, with each row of fans corresponding to at least one row of single boards. For example, fans 430, 440, and 450 constitute a row of fans, corresponding to boards 410 and 420. Fans 430, 440, and 450 can be a single fan or multiple fans stacked together. Taking fan 430 as an example, if fan 430 is multiple fans stacked together, then the speed of each stacked fan can be adjusted individually.

[0094] Thus, based on the structure described above, the arrangement of multiple rows of single boards and matrix fans allows the cooling airflow formed by the fans to be precisely matched with a single row, reducing air resistance during heat dissipation and resulting in better heat dissipation. Furthermore, this arrangement is easy to adjust and highly tolerant of errors; if some fans are missing or malfunction, the missing airflow can be compensated for by other fans.

[0095] In one possible implementation, for any fan and any single board within the chassis 110, the extended plane of the largest surface area on the fan is parallel to the extended plane of the largest surface area on the single board. Still using... Figure 2 For example, the surface with the largest area of ​​fan 440 is the fan blade surface currently visible, and the surface with the largest area of ​​board 410 is the rectangular surface currently visible. The extended plane of the surface with the largest area of ​​fan 440 is parallel to the extended plane of the surface with the largest area of ​​board 410. In one possible implementation, the extended plane of the surface with the largest area of ​​fan within the frame can also be set to be non-parallel to the extended plane of the surface with the largest area of ​​any board. The specific tilt angle of the fan can be set according to actual needs, and this application does not limit it.

[0096] Thus, based on the structure in the above implementation, the largest area of ​​the single board is its core heat dissipation surface, while the largest area of ​​the fan is its main air intake / exhaust surface. This means that the main airflow path of the fan is completely parallel to the heat dissipation surface of the single board. The cold air will flow in a purely parallel laminar flow along the heat dissipation surface of the single board, reducing eddies and turbulence caused by the cross-section of the airflow path and the heat dissipation surface, reducing airflow loss and heat exchange efficiency reduction caused by cross-section wind resistance, allowing the cold air to fully cover the entire heat dissipation surface of the single board, and the hot air can also be efficiently extracted by the fan.

[0097] Figure 3 and Figure 4 The arrangement and function of the central fan, single board, power supply and speed regulation device are the same as those of the other components. Figure 2 The description is consistent with that in the text, so I will not repeat it here. Figure 2 The difference in the chassis shown is the addition of fans and the number of single boards that can be accommodated. Different types of fans have different rated speeds and operating parameters. The speed of different types of fans can be adjusted according to the actual situation.

[0098] Figure 5 This is a schematic diagram of a speed regulating device provided in an embodiment of this application. The speed regulating device 114 includes:

[0099] Temperature sensor 1140 is used to detect the temperature of speed regulating device 114; the number of temperature sensors 1140 can be one or more.

[0100] Memory 1141 stores processor-executable instructions.

[0101] When the processor 1142 is configured to execute instructions, it causes the speed regulation device to implement any of the methods provided in the embodiments of this application.

[0102] Bus 1143 may include a path for transmitting information between the aforementioned components.

[0103] Communication interface 1144 uses any transceiver-like device for communicating with other devices or communication networks, such as Ethernet, radio access network (RAN), wireless local area network (WLAN), etc.

[0104] In some embodiments, memory 1141 may be used to store executable instructions applied to speed regulating device 114, and processor 1142 may execute the instructions stored in memory 1141 to implement any method performed by speed regulating device 114 in the embodiments of this application.

[0105] In some embodiments, the speed regulating device 114 may also include a cache module, which may be a hardware memory (e.g., memory 1141) disposed in the speed regulating device 114, for caching the computational data of the processor 1142 and other contents.

[0106] The aforementioned processor 1142 can be implemented using a CPU, a digital signal processor (DSP), an MCU, or an FPGA, etc. The memory in an electronic device can be volatile memory or non-volatile memory, or both. Non-volatile memory can be read-only memory (ROM) or programmable read-only memory (ROM). Erasable programmable read-only memory (PROM) Electrically erasable programmable read-only memory (EPROM) Read-only memory (EEPROM), magnetic random access memory (FRAM), flash memory, magnetic surface memory, optical disc, or compact disc read-only memory. Only memory, CD ROM; magnetic surface memory can be disk memory or magnetic tape memory. The memory described in the embodiments of this application is intended to include, but is not limited to, these and any other suitable types of memory.

[0107] Figure 6 This is a flowchart illustrating a speed regulation method provided in an embodiment of this application, as shown below. Figure 6 The speed adjustment method includes S101, S102 and S103.

[0108] S101. Identify the frame type of the chassis.

[0109] The chassis includes multiple fans for cooling one or more boards mounted on it. When a speed control device is deployed within the chassis and preset conditions are met, the speed control device automatically identifies the chassis type. These preset conditions include, but are not limited to: the control device being powered on, and the speed control device receiving a chassis identification command from an external device.

[0110] In one implementation, the speed regulation device is equipped with speed regulation programs for various chassis types. The device reads chassis information from the chassis management module on the chassis body, matches it with locally stored chassis information to identify the chassis type, and then uses the speed regulation program corresponding to the identified chassis type to adjust the fan speed. The chassis information includes, but is not limited to, chassis model, chassis layout, and air duct structure. The chassis layout includes the arrangement of the fans and circuit boards within the chassis, as shown above. Figures 2-4 The positions of the fan and the board within the chassis shown in the diagram constitute the fan and board layout. The fan is used to cool one or more boards installed in the chassis by means of air cooling. Specifically, the position of the board relative to the fan is defined as inside the chassis. The fan can blow air inward or exhaust air outward.

[0111] S102. Based on the chassis type and the first mapping relationship, obtain the association relationship between each temperature control zone of each board and at least one set of target fans.

[0112] In order to identify the fan that needs to be adjusted when adjusting the fan speed later, it is necessary to first determine the relationship between the temperature control zone on each board and the target fan.

[0113] In one implementation, the first mapping relationship is determined based on the simulation results of a thermodynamic model. That is, the temperature-controlled area is mapped to the target fan that achieves the best cooling effect. When cooling of the temperature-controlled area is required, the target fan with the mapped relationship is adjusted. The thermodynamic model is established based on the positions of one or more boards within the chassis and the installation position of each fan within the chassis. The simulation results of the thermodynamic model are obtained by pre-modeling the mechanism within the chassis on a computer or server, thereby simulating the cooling effect of the fans on the boards within the chassis. Specifically, for any temperature-controlled area of ​​any board among one or more operating boards within the chassis, the simulation of the thermodynamic model is used to determine the temperature reduction range of the temperature-controlled area when each fan within the chassis cools the area from the same temperature per unit time. The temperature reduction range can be represented by a specific numerical value of the temperature drop. For specific simulation processes, refer to the simulation methods in related technologies.

[0114] The first mapping relationship is stored in the speed regulation device in the form of a configuration file. The configuration file may also include a second mapping relationship, which represents the correspondence between the frame type and the fan position, that is, the fan arrangement position for different frame types. Specifically, Table 1 shows one form of the first and second mapping relationships in the configuration file.

[0115] Table 1

[0116]

[0117] The temperature control zone refers to a region on a single board, and the temperature control zone can be divided in any of the following ways:

[0118] In Method 1, the temperature control area is divided based on the distribution of processors on the single board. Specifically, a single board may include one or more processors. When there is only one processor on the single board, the entire single board can be regarded as a single temperature control area. When there are multiple processors on the single board, the single board can be divided into multiple temperature control areas, each containing only one processor. The size and shape of each temperature control area can be the same or different.

[0119] In method two, the temperature control zones on the single board are divided according to the area directly affected by the fan's airflow. Combined with... Figure 2 Explain the given structure. Figure 2 When the fans 430, 440, and 450 are working, the airflow generated can directly act on the single boards 410 and 420. Therefore, based on the number of fans whose airflow can directly act on the single boards, single boards 410 and 420 can be divided into three temperature control zones. Specifically, they can be divided into three equal temperature control zones, or they can be divided into three temperature control zones in other ways.

[0120] It should be noted that, regardless of which method is used to divide the temperature control area on the single board, the speed adjustment device is configured with the pre-divided temperature control area. For different types of single boards, the speed adjustment device can synchronously or asynchronously read the type of single board when identifying the frame type and match it with the local configuration of different types of single board temperature control area division.

[0121] Still combined Figure 2 The given structure illustrates that a "set of fans" can refer to fans including fans 430, 440, and 450, multiple fans stacked on fan 430, or any single fan on fan 430. The first mapping relationship represents the correspondence between each temperature control zone of each board and at least one set of target fans under this chassis type. Specifically, multiple fans in the chassis include at least one set of target fans, and a set of target fans includes at least one target fan.

[0122] Specifically, a group of fans associated with any temperature-controlled area on a single board has the following characteristics: When cooling the same temperature-controlled area of ​​the same single board from the same temperature at the same rotation speed within a unit of time, the temperature reduction amplitude of each target fan in this group for that temperature-controlled area is greater than the temperature reduction amplitude of any single fan among the multiple fans in the chassis excluding the target fans in this group. In other words, a group of target fans has the best cooling effect on its associated temperature-controlled area.

[0123] S103. Based on the correlation and the temperature of each temperature control zone of each board, adjust the speed of at least one target fan in at least one set of target fans corresponding to each board.

[0124] After establishing the relationship between the temperature control zones and target fans on the board, the target fan that needs adjustment when cooling any temperature control zone is clearly defined. At this point, after obtaining the temperature of each temperature control zone, it's necessary to determine whether the corresponding target fan needs adjustment based on the current temperature of that zone and the preset temperature range. For example, if the preset temperature range for a certain temperature control zone is set to 30℃-80℃, when the temperature of that zone is below 30℃, the target fan for that zone does not need adjustment; if it is above 80℃, the target fan needs to be adjusted to its rated maximum speed. Another example: if the temperature of the temperature control zone continuously rises within the preset temperature range per unit time, the speed of the corresponding target fan is increased until the target fan reaches its maximum rated speed or the temperature of the temperature control zone stops rising, preventing the temperature of the temperature control zone from becoming too high; if the temperature of the temperature control zone continuously decreases within the preset temperature range per unit time, the speed of the corresponding target fan is decreased until the target fan reaches its minimum rated speed or the temperature of the temperature control zone stops decreasing, extending the fan's lifespan and reducing resource consumption.

[0125] In one implementation, each temperature control zone on each board includes one or more temperature sensors, and the temperature of any temperature control zone can be achieved through S1031-S1032 (i.e., the implementation of S103):

[0126] S1031. For any single board within the chassis, determine the temperature of each temperature sensor in each temperature control zone on that single board.

[0127] For example, the temperature obtained from the temperature sensor can be in the form shown in Table 2 below.

[0128] Table 2

[0129]

[0130] Referring to Table 2, the temperature control area ID1 in single board ID1 includes 2 temperature sensors, while other temperature control areas include 1 temperature sensor.

[0131] S1032. For any temperature control area on any single board within the chassis, determine the temperature of the temperature control area based on the temperature of each temperature sensor in the temperature control area.

[0132] For example, based on the contents of Table 2 above, the temperature of temperature control zone ID1 is determined jointly by the temperatures of temperature sensor ID1 and temperature sensor ID2; while the temperatures of temperature control zone ID2 and temperature control zone ID3 are determined based on the temperatures of temperature sensor ID3 and temperature sensor ID4, respectively.

[0133] Specifically, for cases where the temperature control area includes multiple sensors, the temperature of the temperature control area can be achieved in any of the following ways. The following methods one to three are explained in conjunction with the content given in Table 2.

[0134] In Method 1, the average temperature of multiple temperature sensors in the temperature control area is determined to be the temperature of the temperature control area; the temperature of temperature control area ID1 can be calculated as (73℃+71℃) / 2=72℃, that is, the final temperature of temperature control area ID1 is determined to be 72℃.

[0135] In Method 2, the highest temperature among the multiple temperature sensors in the temperature control area is determined as the temperature of the temperature control area; if the temperature of temperature sensor ID1 (73℃) is greater than the temperature of temperature sensor ID2 (71℃), then the temperature of temperature control area ID1 is determined to be 73℃.

[0136] In Method 3, the weighted average of the temperatures of multiple temperature sensors in the temperature control area is determined as the temperature of the temperature control area. For any temperature sensor, the weight of the temperature of the temperature sensor is negatively correlated with the processor distance, which represents the distance between the temperature sensor and the processor of the temperature control area to which it belongs.

[0137] The distribution of multiple temperature sensors in the temperature control area varies, and these differences can be used as a reference to determine the importance of the temperature values ​​they detect, which can then be used as weights to calculate the temperature of the temperature control area.

[0138] In one implementation, the distances between multiple temperature sensors and the processor in the temperature control area can be pre-configured. For example, temperature sensor ID1 is 5mm away from the processor, and temperature sensor ID2 is 10mm away. It can be understood that the closer the temperature sensor is to the processor, the closer its detected temperature is to the processor's actual temperature. The weight of temperature sensor ID1 can be calculated as 1 - [5 / (5+10)] = 0.67, and the weight of temperature sensor ID2 is 1 - [10 / (5+10)] = 0.33. In another implementation, the weight of each temperature sensor can also be directly configured by technicians and adjusted according to actual needs. For example, if a temperature sensor is damaged, its weight can be set to 0.

[0139] Specifically, for cases where the temperature control area includes a sensor, the temperature of the temperature control area can be achieved in any of the following ways. Methods four through six are explained in conjunction with the information provided in Tables 2 and 3:

[0140] Table 3

[0141]

[0142] In Method 4, the average temperature of the temperature sensor within a preset time period is determined as the temperature of the temperature control area. The temperature of the temperature control area is not always stable; it fluctuates due to changes in processor load. Calculating the average temperature within the preset time period reflects the approximate temperature level of the temperature control area over a certain period. For example, the preset time period is taken as three moments: moment 1, moment 2, and moment 3. The average temperature of these three moments is calculated as the temperature of the temperature control area ID2: (78℃ + 81℃ + 85℃) / 3 = 81.3℃.

[0143] In Method 5, the highest temperature reached by the temperature sensor within a preset time in the temperature control area is determined as the temperature of the temperature control area. To reduce the occurrence of processor performance degradation or even damage due to excessively high temperature, the highest temperature within the preset time can also be taken as the temperature of the temperature control area, that is, the temperature of the temperature control area ID2 is the temperature of time 3, 85℃.

[0144] In method six, the weighted value of the temperature of the temperature sensor within a preset time period in the temperature control area is determined as the temperature of the temperature control area. Specifically, for the temperature of the temperature sensor at any time within the preset time period, the weight of the temperature at that time is negatively correlated with the absolute value of the time difference between that time and the last time in the preset time period.

[0145] It can be assumed that later moments within a preset timeframe are closer to the current moment. However, to simultaneously consider temperature changes within the controlled area over a period, a corresponding weight is assigned to the temperature at each moment. This ensures both the accuracy of the most recent temperature and the approximate temperature level of the controlled area over a given period. For example, the weight of each moment can be set by a technician or by the speed control device itself. In one implementation, the weight of moment 1 is 0.2, the weight of moment 2 is 0.3, and the weight of moment 3 is 0.5, then the temperature of controlled area ID2 is calculated to be 0.2. 78℃ +0.3 81℃ +0.5 85℃ = 82.4℃.

[0146] In one implementation, the fan speed inside the chassis can be automatically adjusted by a speed regulating device, or it can be adjusted by a technician using external equipment. Figure 7This is a schematic diagram of a speed regulation system provided in an embodiment of this application, as shown below. Figure 7 The speed regulation system 600 shown includes an electronic device 100 and a computer 610. Technicians can operate the system through the interface displayed on the computer 610, sending control commands to adjust the fan speed of the electronic fan. The interface can also display temperature data reported by the electronic device. One form of the interface is shown in Table 4 below. Taking fan ID1 as an example, a status of "in place" for fan ID1 indicates that the fan corresponding to fan ID1 is in its designated position. If the status is "absent," it indicates that the corresponding fan is not in its designated position. A speed ratio of 20% for fan ID1 indicates that the current speed of the fan corresponding to fan ID1 is 20% of its rated maximum speed. A speed regulation status of "automatic" for fan ID1 indicates that the fan corresponding to fan ID1 is controlling its speed according to the speed regulation method of this application. If the speed regulation status is "manual," it indicates that the corresponding fan is not controlling its speed according to the speed regulation method of this application, but rather using the manually set speed.

[0147] Table 4

[0148]

[0149] When the regulating device automatically adjusts the fan based on the temperature obtained in step S102 above, the fan can be adjusted directly or through the fan controller, according to the correspondence given in Table 1. Specifically, the fan is controlled by controlling the control parameters of the fan being adjusted. For example, the control parameters include any of the following: pulse width modulation (PWM) signal, pulse frequency signal, and digital level signal. Taking a pulse width modulation (PWM) signal as an example, when the speed of fan ID1 is adjusted from 1979 as shown in Table 4 to 5000, the duty cycle of the PWM signal output to fan ID1 is increased from 20% to 50%, thus achieving stepless adjustment of the fan speed by adjusting the duty cycle.

[0150] When the speed regulation device is not configured with a program corresponding to the frame type of the currently deployed frame, this application embodiment also provides a speed regulation method. Figure 8 A flowchart illustrating another speed regulation method provided in this application embodiment is shown below. Figure 8 The method shown includes S201-S203:

[0151] S201. Obtain the installation position of each fan in the chassis among the multiple fans.

[0152] The chassis includes multiple fans for cooling one or more boards mounted within the chassis.

[0153] When the speed control device is not configured with the program corresponding to the chassis type of the currently deployed chassis, the speed control device needs to configure the association between the temperature control area of ​​the fan and the board itself. First, it needs to obtain the position of the fan and the position of the board in the chassis.

[0154] The speed regulation device obtains the installation position of each fan in the frame and the position where a single board can be installed from the frame management module installed in the frame.

[0155] S202. Based on the position of one or more single boards and the installation position of each fan in the chassis, determine the association between each temperature control zone of each single board and at least one set of target fans.

[0156] The plurality of fans include at least one set of target fans, and each set of target fans includes at least one target fan. Each board includes one or more temperature control zones. When cooling the same temperature control zone of the same board from the same temperature at the same rotation speed within a unit of time, the cooling amplitude of each target fan in the at least one set of target fans corresponding to the temperature control zone is greater than the cooling amplitude of any fan other than the at least one set of target fans corresponding to the temperature control zone.

[0157] In one implementation, the thermodynamic model can be established as follows: First, an ideal simulation scenario needs to be set, in which the heat generation power of the single board is stable, and the heat generation power fluctuation caused by the single board power fluctuation is ignored; the air in the frame is an ideal gas, and the heat exchange process is steady-state convection heat exchange, without considering transient heating and cooling processes; the air in the air duct flows in a single direction, without considering eddies or backflow, the fan is the only airflow driving force, and the fan speed is uniform; heat transfer only considers air convection heat exchange, ignoring radiation heat exchange and heat conduction between the single board and the frame; the single board is the core heat exchange area, and only the temperature of this area and the surface of the single board is analyzed.

[0158] Having clarified the modeling scenario and prerequisites, it is necessary to define the key parameters required for modeling. These parameters can be obtained through measurement or querying, such as the heating power of a single board, the constant air volume of a fan, air density, specific heat capacity of air, the location of one or more single boards, and the installation position of each fan within the chassis.

[0159] After completing the above preparations, a thermodynamic model is built. The core of the model follows the law of conservation of energy: the heat generated by the single panel = the heat carried away by the fan-driven air + the convective heat transfer between the single panel and the air. Specifically, it is divided into two parts: the calculation of air temperature rise and the calculation of single panel surface temperature.

[0160] The significance of air temperature rise calculation lies in calculating the amount of heat that the fan can remove per unit time. The more heat removed, the better the cooling effect. When the fan speed increases, the air temperature rise decreases. Single board surface temperature calculation is mainly used to determine the level that the single board surface temperature can reach under air cooling. If the single board surface temperature exceeds the standard, it means that the current fan cooling effect is insufficient and the speed needs to be increased.

[0161] After completing the above modeling, the fan with the best cooling effect for a single temperature control area on the board can be determined by controlling the number and position of the fans. That is, the fan that can reduce the temperature of the temperature control area on the board the most at the same speed per unit time is the fan corresponding to that temperature control area.

[0162] In one implementation, the relationship between the temperature control zone and the target fan can be configured by a technician; in another implementation, it can also be configured by the regulating device itself, for example, by assigning a correspondence between every three fans and every two boards. Referring to Table 1, for example, the boards at position ID1 and position ID2 correspond to fans ID1, ID2, and ID3; and so on, the boards at position ID3 and position ID4 correspond to fans ID4, ID5, and ID6, and so on.

[0163] Furthermore, for any single board, the method for dividing its temperature control zone can refer to the method given in the above embodiments. After determining the correspondence between the single board and the fan, it is also necessary to determine the correspondence between each temperature control zone on the single board and the fan. For any temperature control zone on the single board, it is possible to statistically determine which fan has the best cooling effect on the temperature control zone among the multiple fans corresponding to that single board at the same speed. This fan can then be determined as the target fan corresponding to that temperature control zone, and the two are correlated. Specifically, each fan can be set to run for the same amount of time at the same speed, and the temperature drop of the single board from the same starting temperature can be calculated. The greater the temperature drop, the greater the cooling effect.

[0164] S203. Based on the correlation and the temperature of each temperature control zone of each board, adjust the speed of at least one target fan in at least one set of target fans corresponding to each board.

[0165] This step can be referred to in the implementation of S103 above, and will not be repeated here.

[0166] The speed adjustment method of this application embodiment is described below with reference to a specific example. The specific implementation process of this method is as follows: Figure 9 As shown, the method includes S301-S306.

[0167] S301, Read chassis information.

[0168] The speed regulation device reads the frame information from the frame management module and identifies the frame type. For details, please refer to the implementation method of S101 above.

[0169] S302, Matching speed regulation program.

[0170] After identifying the frame type, the speed regulation device matches the corresponding speed regulation program locally.

[0171] S303, Polling for the in-place status.

[0172] The speed regulation device queries the deployment of single boards within the machine frame to determine which locations within the machine frame have single boards deployed and which locations do not.

[0173] S304, Read the temperature sensor on the deployed board.

[0174] The temperature sensor can report the detected temperature at regular intervals, or it can be retrieved periodically by the speed control device.

[0175] S305, Calculate the fan speed.

[0176] The speed regulation device determines the speed of the target fan for cooling the temperature control area corresponding to the temperature sensor based on the temperature obtained from the temperature sensor.

[0177] S306, Set the target fan speed.

[0178] The speed regulation device directly or through the fan controller converts the fan speed into fan control parameters and sends them to the target fan to control the target fan speed.

[0179] As can be seen, the above mainly describes the solutions provided by the embodiments of this application from a methodological perspective. To achieve the above functions, the embodiments of this application provide corresponding hardware structures and / or software modules for executing each function. Those skilled in the art should readily recognize that, in conjunction with the modules and algorithm steps of the various examples described in the embodiments disclosed herein, the embodiments of this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this invention.

[0180] This application embodiment can divide the speed regulating device into functional modules according to the above method example. For example, each function can be divided into its own functional module, or two or more functions can be integrated into one processing module. The integrated module can be implemented in hardware or as a software functional module. Optionally, the module division in this application embodiment is illustrative and only represents one logical functional division; other division methods may be used in actual implementation.

[0181] This application also provides a speed regulating device. The speed regulating device may include one or more functional modules for implementing the speed regulating method of the above method embodiments. Figure 10 This is a schematic diagram of a speed regulating device provided in an embodiment of this application.

[0182] like Figure 10 As shown, the speed regulation device 114 includes an identification module 1001, a processing module 1002, and an adjustment module 1003.

[0183] The identification module 1001 is used to identify the chassis type of the chassis; wherein the chassis includes multiple fans for cooling one or more boards mounted on the chassis.

[0184] The processing module 1002 is used to obtain the association relationship between each temperature control area of ​​each board and at least one set of target fans based on the chassis type and the first mapping relationship; the first mapping relationship represents the correspondence between each temperature control area of ​​each board and at least one set of target fans under the chassis type, wherein multiple fans include at least one set of target fans, a set of target fans includes at least one target fan, and each board includes one or more temperature control areas; when cooling the same temperature control area of ​​the same board from the same temperature at the same rotation speed within a unit time, the cooling amplitude of each target fan in the at least one set of target fans corresponding to the temperature control area is greater than the cooling amplitude of any fan other than the at least one set of target fans corresponding to the temperature control area.

[0185] The adjustment module 1003 is used to adjust the speed of at least one target fan in at least one set of target fans corresponding to each single board based on the correlation and the temperature of each temperature control zone of each single board.

[0186] In one implementation, the processing module 1002 is further configured to determine the temperature of each temperature sensor in each temperature control area on any single board within the chassis; and to determine the temperature of any temperature control area on any single board within the chassis based on the temperature of each temperature sensor in that temperature control area.

[0187] In one implementation, each board includes one or more processors, and each processor on the board corresponds one-to-one with a temperature control area, with each processor located in its corresponding temperature control area.

[0188] In one implementation, for any one of one or more single boards in the chassis, one of the N equally divided regions on the single board is a temperature control zone, where N is determined based on the number of fans that can directly act on the single board by airflow.

[0189] In one implementation, the processing module 1002 is further configured to determine the average temperature of multiple temperature sensors in the temperature control area as the temperature of the temperature control area; determine the highest temperature among the multiple temperature sensors in the temperature control area as the temperature of the temperature control area; and determine the weighted average temperature of multiple temperature sensors in the temperature control area as the temperature of the temperature control area, wherein, for any temperature sensor, the weight of the temperature of the temperature sensor is negatively correlated with the processor distance, and the processor distance represents the distance between the temperature sensor and the processor of the temperature control area to which it belongs.

[0190] In one implementation, the processing module 1002 is further configured to determine the average temperature of the temperature sensor within a preset time period in the temperature control area as the temperature of the temperature control area; determine the highest temperature reached by the temperature sensor within the preset time period in the temperature control area as the temperature of the temperature control area; and determine the weighted average temperature of the temperature sensor within the preset time period in the temperature control area as the temperature of the temperature control area, wherein, for the temperature of the temperature sensor at any time within the preset time period, the weight of the temperature at that time period is negatively correlated with the time difference between that time period and the last time period within the preset time period.

[0191] In one implementation, the adjustment module 1003 is further configured to: determine, based on the correlation and the temperature of each temperature-controlled area on each board, control parameters for at least one target fan from at least one set of target fans corresponding to each temperature-controlled area on each board; and adjust the speed of at least one target fan from at least one set of target fans corresponding to each temperature-controlled area on each board based on the control parameters. The control parameters include any one of the following: a pulse width modulation (PWM) signal, a pulse frequency signal, or a digital level signal.

[0192] In one implementation, the identification module 1001 is further used to identify the frame type of the chassis when preset conditions are met; the preset conditions include the main control device being powered on.

[0193] Through the above description of the implementation methods, those skilled in the art can clearly understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the service calling device can be divided into different functional modules to complete all or part of the functions described above.

[0194] Each of the above modules or units can be implemented through software, hardware, or a combination of both. For example, Figure 5 As shown, when the processor 1142 of the speed regulation device 114 is a CPU, the above-mentioned identification module 1001, processing module 1002 and regulation module 1003 can all be implemented based on software.

[0195] In this application, "implemented through software" means that the processor reads and executes program instructions stored in memory to implement the functions corresponding to the above-mentioned modules or units. Here, "processor" refers to a processing circuit capable of executing program instructions, including but not limited to at least one of the following: CPU, microprocessor, digital signal processor (DSP), microcontroller unit (MCU), or artificial intelligence processor, etc., and other processing circuits capable of running program instructions. In other embodiments, the processor may also include circuits with other processing functions (such as hardware circuits for hardware acceleration, bus and interface circuits, etc.). The processor can be presented as an integrated chip, for example, as an integrated chip whose processing function only includes executing software instructions, or it can also be presented as a SoC (system on a chip), that is, on a single chip, in addition to the processing circuit capable of running program instructions (usually referred to as the "core"), it also includes other hardware circuits for implementing specific functions (of course, these hardware circuits can also be implemented separately based on ASIC or FPGA). Correspondingly, the processing functions, in addition to executing software instructions, may also include various hardware acceleration functions (such as AI calculation, encoding / decoding, compression / decompression, etc.).

[0196] In this application, "implemented in hardware" means that the functions of the above-mentioned modules or units are implemented through hardware processing circuits that do not have program instruction processing capabilities. These hardware processing circuits can be composed of discrete hardware components or integrated circuits. To reduce power consumption and size, integrated circuits are typically used. The hardware processing circuits can include ASICs or PLDs (programmable logic devices); PLDs can include FPGAs, CPLDs (complex programmable logic devices), etc. These hardware processing circuits can be a single packaged semiconductor chip (e.g., packaged as an ASIC); or they can be integrated with other circuits (e.g., CPUs, DSPs) and packaged into a single semiconductor chip. For example, multiple hardware circuits and a CPU can be formed on a silicon substrate and packaged into a single chip, also known as a SoC. Alternatively, circuits for implementing FPGA functions and a CPU can be formed on a silicon substrate and packaged into a single chip, also known as a SoPC (system on a programmable chip).

[0197] It should be noted that when this application is implemented through software, hardware, or a combination of both, different software or hardware can be used, and it is not limited to using only one type of software or hardware. For example, one module or unit can be implemented using a CPU, while another module or unit can be implemented using a DSP. Similarly, when implemented using hardware, one module or unit can be implemented using an ASIC, while another module or unit can be implemented using an FPGA. Of course, it is not limited to using the same software (e.g., all through a CPU) or the same hardware (e.g., all through an ASIC) to implement some or all modules or units. Furthermore, those skilled in the art will understand that software is generally more flexible but less performant than hardware, while hardware is the opposite. Therefore, those skilled in the art can choose software, hardware, or a combination of both based on actual needs.

[0198] This application also provides a computer-readable storage medium. All or part of the processes in the above method embodiments can be executed by computer instructions instructing related hardware. The program can be stored in the aforementioned computer-readable storage medium, and when executed, it can include the processes of the above method embodiments. The computer-readable storage medium can be any of the foregoing embodiments or memory. The aforementioned computer-readable storage medium can also be an external storage device for the aforementioned speed adjustment device, such as a plug-in hard drive, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the aforementioned speed adjustment device. Further, the aforementioned computer-readable storage medium can include both the internal storage unit of the aforementioned service invocation device and external storage devices. The aforementioned computer-readable storage medium is used to store the aforementioned computer program and other programs and data required by the aforementioned service invocation device. The aforementioned computer-readable storage medium can also be used to temporarily store data that has been output or will be output.

[0199] This application also provides a computer program product comprising a computer program that, when run on a computer, causes the computer to perform the methods provided in the above embodiments.

[0200] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A speed regulation method, executed by a speed regulation device, characterized in that, The method includes: The read chassis information is matched with locally stored chassis information to identify the chassis type; wherein, the chassis includes multiple fans, which are used to cool one or more boards installed in the chassis; Based on the aforementioned chassis type and the first mapping relationship, the association between each temperature control area of ​​each single board and at least one set of target fans is obtained; the first mapping relationship characterizes the correspondence between each temperature control area of ​​each single board and at least one set of target fans under the aforementioned chassis type, and the first mapping relationship is determined based on the simulation results of the thermodynamic model; wherein, for any temperature control area of ​​any single board among one or more single boards operating within the chassis, the simulation of the thermodynamic model is used to determine the temperature reduction range of the temperature control area when each fan in the chassis reduces the temperature of the temperature control area from the same temperature per unit time; the thermodynamic model is based on the aforementioned association between each temperature control area of ​​one or more single boards operating within the chassis and at least one set of target fans. The positions of one or more single boards and the installation positions of each fan within the frame are established; wherein, the multiple fans include the at least one set of target fans, the set of target fans includes multiple target fans, and the multiple target fans are stacked to form the set of target fans; each single board includes one or more temperature control zones; when cooling the same temperature control zone of the same single board from the same temperature at the same rotation speed within a unit time, the cooling amplitude of each target fan in the at least one set of target fans corresponding to the temperature control zone is greater than the cooling amplitude of any fan among the multiple fans other than the at least one set of target fans corresponding to the temperature control zone; Based on the aforementioned correlation and the temperature of each temperature control zone of each board, the speed of at least one target fan in at least one set of target fans corresponding to each board is adjusted.

2. The method according to claim 1, characterized in that, For any single board within the chassis, each temperature control zone on the single board includes one or more temperature sensors; before adjusting the speed of at least one target fan in at least one set of target fans corresponding to each single board based on the correlation and the temperature of each temperature control zone of each single board, the method further includes: For any single board within the frame, determine the temperature of each temperature sensor in each temperature control zone on that single board. For any temperature control area on any single board within the frame, the temperature of that temperature control area is determined based on the temperature of each temperature sensor in that temperature control area.

3. The method according to claim 2, characterized in that, Each board includes one or more processors, and each processor on the board corresponds one-to-one with a temperature control area. Each processor is located in its corresponding temperature control area.

4. The method according to claim 1 or 2, characterized in that, For any one of the one or more single boards in the frame, one of the N equally divided regions on the single board is a temperature control zone, where N is determined based on the number of fans that can directly act on the single board.

5. The method according to claim 3, characterized in that, For any temperature control area on any single board within the chassis, when the temperature control area includes multiple temperature sensors, determining the temperature of the temperature control area based on the temperature of each temperature sensor in the temperature control area includes any one of the following: The average temperature of the multiple temperature sensors within the temperature-controlled area is determined to be the temperature of the temperature-controlled area. The highest temperature among the multiple temperature sensors within the temperature control zone is determined as the temperature of the temperature control zone. In the temperature control zone, the weighted sum of the temperatures of the multiple temperature sensors is determined as the temperature of the temperature control zone. For any temperature sensor, the weight of the temperature of the temperature sensor is negatively correlated with the processor distance, where the processor distance represents the distance between the temperature sensor and the processor of the temperature control zone to which it belongs.

6. The method according to claim 3, characterized in that, For any temperature control area on any single board within the chassis, when the temperature control area includes a temperature sensor, determining the temperature of the temperature control area based on the temperature of each temperature sensor in the temperature control area includes any one of the following: The average temperature of a temperature sensor within a preset time period is determined as the temperature of the temperature control zone. The highest temperature reached by a temperature sensor within the preset time period in the temperature-controlled area is determined to be the temperature of the temperature-controlled area. Within the temperature control zone, the weighted value of the temperature of a single temperature sensor within a preset time period is determined as the temperature of the temperature control zone. For any given moment within the preset time period, the weight of the temperature at that moment is negatively correlated with the absolute value of the time difference between that moment and the last moment within the preset time period.

7. The method according to claim 5 or 6, characterized in that, The step of adjusting the speed of at least one target fan in at least one set of target fans corresponding to each single board, based on the aforementioned correlation and the temperature of each temperature control zone of each single board, includes: Based on the aforementioned correlation and the temperature of each temperature control zone on each board, determine the control parameters of at least one target fan from at least one set of target fans corresponding to each temperature control zone on each board. Based on the control parameters of at least one target fan in at least one set of target fans corresponding to each temperature control zone on each board, the speed of at least one target fan in at least one set of target fans corresponding to each temperature control zone on each board is adjusted.

8. The method according to claim 7, characterized in that, The control parameters include any one of the following: pulse width modulation (PWM) signal, pulse frequency signal, and digital level signal.

9. The method according to any one of claims 1-3, characterized in that, The frame types of the identification frame include: Under preset conditions, the frame type of the frame is identified; the preset conditions include powering on the speed regulation device.

10. A speed regulating device, characterized in that, The speed regulating device includes: The identification module is used to match the read chassis information with the locally stored chassis information to identify the chassis type; wherein, the chassis includes multiple fans, and the multiple fans are used to cool one or more boards installed in the chassis; The processing module is used to obtain the association relationship between each temperature control area of ​​each board and at least one set of target fans based on the chassis type and the first mapping relationship; the first mapping relationship characterizes the correspondence between each temperature control area of ​​each board and at least one set of target fans under the chassis type, and the first mapping relationship is determined based on the simulation results of the thermodynamic model; wherein, for any temperature control area of ​​any board among one or more boards operating within the chassis, the simulation of the thermodynamic model is used to determine the temperature reduction range of the temperature control area when each fan in the chassis cools the temperature control area from the same temperature per unit time; the thermodynamic model is based on the chassis type. The single-board positions of one or more single boards and the installation positions of each fan within the frame are established; wherein, the plurality of fans include the at least one set of target fans, the set of target fans includes a plurality of target fans, and the plurality of target fans are stacked to form the set of target fans; each single board includes one or more temperature control zones; when cooling the same temperature control zone of the same single board from the same temperature at the same rotation speed within a unit time, the cooling amplitude of each target fan in the at least one set of target fans corresponding to the temperature control zone is greater than the cooling amplitude of any fan other than the at least one set of target fans corresponding to the temperature control zone; The adjustment module is used to adjust the speed of at least one target fan in at least one set of target fans corresponding to each single board based on the correlation and the temperature of each temperature control zone of each single board.

11. A speed regulating device, characterized in that, The speed regulating device includes: A memory that stores processor-executable instructions; A processor configured to, when executing the instructions, cause the speed regulating device to perform the method as described in any one of claims 1-9.

12. An electronic device, characterized in that, include: Machine frame; Multiple fans; The speed regulating device as described in claim 11 is connected to each fan.

13. The electronic device according to claim 12, characterized in that, The single boards deployed inside the frame are arranged in multiple rows, with each row corresponding to one single board. The multiple fans are arranged in a matrix within the frame, with each row of fans corresponding to at least one row of boards.

14. The electronic device according to claim 13, characterized in that, For any fan and any single board within the frame, the extended plane of the largest surface area on the fan is parallel to the extended plane of the largest surface area on the single board.

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