Preparation method of lightweight anti-seismic support and hanger key component

Abstract

The invention discloses a preparation method of a lightweight anti-seismic support and hanger key component, and relates to the technical field of support and hanger preparation and machining.The preparation method comprises the steps that a stamping equipment body obtains initial preparation parameters and target lightweight indexes of a to-be-formed component and real-time material parameters of a current formed component; the actual corrected stamping pressure is obtained on the basis of fluctuation of a temperature sensor on the real-time environment temperature and in combination with a dynamic pressure correction model, the initial thickness is corrected through a thickness quantification control model, the actual stamped thickness after component forming is obtained, the basic stamping pressure of next-round forming is corrected through a strength closed-loop feedback model, and the actual stamped thickness after component forming is obtained. According to the method, through temperature-pressure coupling, pressure-thickness quantification and thickness-strength closed loop, collaborative preparation optimization of light weight and shock resistance is finally achieved.

Description

Technical Field

[0001] This invention relates to the field of support and hanger manufacturing technology, specifically a method for manufacturing key components of a lightweight seismic-resistant support and hanger. Background Technology

[0002] Lightweight seismic bracing is a key load-bearing component in fields such as construction, rail transit, and nuclear power. It needs to meet the dual requirements of lightweighting and seismic resistance. The preparation of key components of lightweight seismic bracing relies on metal stamping forming process. The metal stamping forming process needs to achieve lightweighting by controlling the material thickness and at the same time ensure that the strength after forming meets the seismic code.

[0003] Currently, most existing technologies use fixed stamping pressure without considering the impact of temperature fluctuations on material plasticity. Consequently, it is difficult to convert ambient temperature fluctuations into pressure correction amounts, leading to a mismatch between pressure and material plasticity. Secondly, existing technologies often adjust pressure through a "trial and error" method (such as gradually increasing pressure until the thickness meets the standard), without establishing a quantitative relationship between pressure and thickness reduction. If pressure adjustment lacks quantitative basis, phenomena such as "over-pressure thinning" or "under-pressure failure to form" are likely to occur. Furthermore, the matching of lightweighting and seismic strength in existing technologies relies on "post-process testing" (such as tensile tests after forming), making it difficult to provide real-time feedback and correction. Summary of the Invention

[0004] The purpose of this invention is to provide a method for preparing key components of lightweight seismic bracing, which solves the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution, including:

[0006] The main body of the stamping equipment acquires the initial preparation parameters and target lightweight index of the component to be formed, as well as the real-time material parameters of the component currently being formed. The initial preparation parameters include the basic stamping pressure, thickness variation coefficient and ambient temperature sensitivity coefficient. The target lightweight index includes the standard forming temperature, target thickness, material yield strength and thickness deviation. The real-time material parameters include real-time temperature and initial thickness.

[0007] Based on the real-time ambient temperature fluctuations detected by the temperature sensor, and combined with the dynamic pressure correction model, the basic stamping pressure is corrected to obtain the actual corrected stamping pressure.

[0008] Based on the actual stamping pressure and the thickness variation coefficient, and by correcting the initial thickness using a thickness quantification control model, the actual stamped thickness of the component after forming is obtained.

[0009] The thickness and yield strength of the fusion material are preserved, and the basic stamping pressure of the next forming is corrected through the strength closed-loop feedback model until the preset iterative correction rule is reached. The corrected basic pressure is obtained and transmitted to the hydraulic cylinder for control correction of the stamping pressure.

[0010] The initial thickness is obtained using a laser thickness gauge.

[0011] Optionally, the temperature sensor and the laser thickness gauge are respectively fixedly installed at the stamping inlet and stamping outlet of the stamping equipment body. A control panel is fixedly installed on one side surface of the stamping equipment body, and the control panel is electrically connected to the hydraulic cylinder, the temperature sensor and the laser thickness gauge respectively.

[0012] Optionally, the process of obtaining the actual corrected stamping pressure by combining it with the dynamic pressure correction model includes:

[0013] The temperature sensor acquires the real-time temperature of the molding environment of the molded component, as well as the standard molding temperature of the molding environment of the component to be molded.

[0014] The temperature fluctuation is obtained based on the difference between the real-time temperature and the standard molding temperature.

[0015] Based on the ratio between the temperature fluctuation and the standard molding temperature, the temperature fluctuation is converted into a temperature influence factor.

[0016] Based on the temperature influence factor and the ambient temperature sensitivity coefficient, the base stamping pressure is corrected to obtain the actual corrected stamping pressure.

[0017] Optionally, the process of obtaining the ambient temperature sensitivity coefficient includes:

[0018] Within a pre-defined temperature range, at least one set of temperature-pressure experiments were conducted using the controlled variable method, and optimal stamping pressure data at different temperatures were collected.

[0019] Based on the correlation between temperature fluctuations and pressure correction in the dynamic pressure correction model, the correlation coefficient is normalized to obtain the environmental temperature sensitivity coefficient.

[0020] Optionally, the process of obtaining the actual stamped thickness through a thickness quantization control model includes:

[0021] The thickness variation coefficient is obtained by fitting historical stamping data using a linear regression algorithm.

[0022] The thickness reduction amount is obtained by multiplying the actual corrected stamping pressure and the thickness variation coefficient.

[0023] The actual stamped thickness is obtained based on the difference between the initial thickness and the thickness reduction.

[0024] Optionally, the process of obtaining the corrected base pressure through a strength closed-loop feedback model includes:

[0025] Based on the ratio between the actual stamped thickness and the initial thickness, the thickness retention rate is obtained;

[0026] The strength retention factor is obtained by multiplying the material's yield reference strength and the thickness retention rate.

[0027] Based on the proportional relationship between the strength retention factor and the material yield benchmark strength, the strength notch ratio value is obtained;

[0028] Based on the correction of the foundation stamping pressure according to the strength notch ratio, the corrected foundation pressure is obtained;

[0029] Wherein, if the strength retention factor is greater than or equal to the material yield reference strength, the correction of the basic stamping pressure is stopped;

[0030] If the strength retention factor is less than the material yield reference strength, the basic stamping pressure is corrected.

[0031] Optionally, the iterative correction rule includes:

[0032] If both the thickness and strength requirements are met, the corrected base pressure is directly transmitted to the hydraulic cylinder.

[0033] If either the thickness or strength requirement is not met, the basic stamping pressure, the initial thickness, and the basic stamping pressure for the next forming round will be continuously adjusted.

[0034] The thickness compliance condition is that the difference between the actual stamped thickness and the target thickness is less than or equal to the thickness reference deviation.

[0035] The strength compliance condition is that the strength retention factor is greater than or equal to the material yield reference strength.

[0036] Optionally, the process of obtaining the thickness variation coefficient includes:

[0037] Obtain the thickness reduction amount corresponding to at least one set of different stamping pressures;

[0038] The linear regression model is fitted using the least squares method, and a significance test is performed until the test is passed and the thickness variation coefficient is output.

[0039] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0040] This invention first transforms temperature fluctuations into dynamic stamping pressure through "dimensionless conversion → sensitivity coefficient coupling → pressure factor correction" to ensure real-time matching between pressure and material plasticity, thereby avoiding "over-pressure thinning - weight loss control" or "under-pressure incomplete forming - strength redundancy" caused by temperature. Then, the actual corrected stamping pressure is converted into thickness reduction amount through the thickness change coefficient, thereby directly linking "pressure input" and "weight reduction output", thus avoiding "insufficient weight reduction" or "excessive strength" caused by trial and error. In addition, the degree of weight reduction is quantified by the thickness retention rate and coupled with the strength retention factor to correct the base pressure of the next round of stamping, thus forming a closed-loop control of weight reduction under strength constraints. Attached Figure Description

[0041] Figure 1 This is a flowchart illustrating the method for preparing key components of this support bracket;

[0042] Figure 2 This is a front view of the device structure used in the present invention for preparing key components of supports and hangers.

[0043] In the diagram: 1-Stamping equipment body, 2-Control panel, 3-Hydraulic cylinder, 4-Temperature sensor, 5-Laser thickness gauge. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] For examples, please refer to Figures 1 to 2 This embodiment provides a method for manufacturing key components of a lightweight seismic bracing system, including:

[0046] Step 1: The main body of the stamping equipment 1 obtains the initial preparation parameters and target lightweight index of the component to be formed, as well as the real-time material parameters of the component currently being formed. The initial preparation parameters include the basic stamping pressure, thickness variation coefficient and ambient temperature sensitivity coefficient. The target lightweight index includes the standard forming temperature, target thickness, material yield strength and thickness deviation. The real-time material parameters include the real-time temperature and initial thickness.

[0047] Step 2: Based on the real-time ambient temperature fluctuations detected by temperature sensor 4, and combined with the dynamic pressure correction model, the basic stamping pressure is corrected to obtain the actual corrected stamping pressure.

[0048] Step 3: Based on the actual stamping pressure and thickness variation coefficient, and by correcting the initial thickness through a thickness quantification control model, the actual stamped thickness of the component after forming is obtained.

[0049] Step 4: Combine the thickness of the material with the degree of retention of yield strength, and correct the basic stamping pressure of the next forming through the strength closed-loop feedback model until the preset iterative correction rule is reached. Obtain the corrected basic pressure and transmit it to the hydraulic cylinder 3 for control correction of the stamping pressure.

[0050] The following detailed explanation of each step, in conjunction with the accompanying drawings, is provided.

[0051] Step 1: The main body of the stamping equipment 1 obtains the initial preparation parameters and target lightweight index of the component to be formed, as well as the real-time material parameters of the component currently being formed. The initial preparation parameters include the basic stamping pressure, thickness variation coefficient and ambient temperature sensitivity coefficient. The target lightweight index includes the standard forming temperature, target thickness, material yield strength and thickness deviation. The real-time material parameters include the real-time temperature and initial thickness.

[0052] In an exemplary embodiment, the temperature sensor 4 and the laser thickness gauge 5 are respectively fixedly installed at the stamping inlet and stamping outlet of the stamping equipment body 1. A control panel 2 is fixedly installed on one side surface of the stamping equipment body 1, and the control panel 2 is electrically connected to the hydraulic cylinder 3, the temperature sensor 4 and the laser thickness gauge 5 respectively. The initial thickness is obtained by the laser thickness gauge 5.

[0053] When the component to be formed enters the stamping inlet, the temperature sensor 4 collects the ambient temperature, the laser thickness gauge 5 collects the initial thickness, and the data is sent to the control panel 2 simultaneously. The control panel 2 calculates the pressure-related control commands based on the temperature fluctuation and the initial thickness through the algorithm model and sends them to the hydraulic cylinder 3. The hydraulic cylinder 3 executes the stamping according to the commands.

[0054] Therefore, through the above process, each piece of equipment forms a complete chain control of "ambient temperature - initial thickness - stamping pressure - forming thickness - strength retention", ensuring that the seismic strength requirements are met while achieving lightweight design.

[0055] Step 2: Based on the real-time ambient temperature fluctuations monitored by temperature sensor 4, and combined with the dynamic pressure correction model, the basic stamping pressure is corrected to obtain the actual corrected stamping pressure.

[0056] In an exemplary embodiment, this embodiment provides a process for obtaining the actual corrected stamping pressure by combining it with a dynamic pressure correction model, including:

[0057] Temperature sensor 4 acquires the real-time temperature of the molding environment of the molding component, as well as the standard molding temperature of the molding environment of the component to be molded.

[0058] The temperature fluctuation is obtained based on the difference between the real-time temperature and the standard molding temperature.

[0059] Based on the proportional relationship between temperature fluctuation and standard molding temperature, the temperature fluctuation is converted into a temperature influence factor.

[0060] Based on the temperature influence factor and the ambient temperature sensitivity coefficient, the basic stamping pressure is corrected to obtain the actual corrected stamping pressure.

[0061] By dynamically coupling temperature and pressure, real-time matching between pressure and material plasticity is ensured, avoiding lightweight loss or seismic performance defects caused by environmental interference. Specifically, the absolute temperature fluctuations of temperature fluctuations and standard molding temperatures are converted into relative proportions, thereby eliminating unit differences and standardizing the scale of temperature influence under different working conditions, making pressure correction universally applicable. Then, the impact of temperature on pressure is quantified using an environmental temperature sensitivity coefficient to achieve precise adjustment of "temperature increase → pressure decrease" and "temperature decrease → pressure increase," avoiding:

[0062] Overpressure thinning: At high temperatures, the plasticity of materials increases. If the pressure is not reduced, the thickness deviation will be negative, and the weight reduction will be excessive.

[0063] Under-pressure molding: The material hardens at low temperatures. If the pressure is not increased, the deviation of the mounting hole size will become larger.

[0064] Specifically, the calculation formula for the dynamic pressure correction model is as follows:

[0065] ;

[0066] In the formula: P is the actual corrected stamping pressure, P base The base stamping pressure, CX is the ambient temperature sensitivity coefficient, ΔW is the temperature deviation, and W base This is the standard molding temperature.

[0067] It should be understood that The obtained temperature influence factor can quantify the degree of influence of temperature fluctuations on material plasticity (e.g., material softens when temperature rises and hardens when temperature falls), providing a comparable "temperature sensitivity coefficient" for pressure correction. This avoids mismatch between molding pressure and material plasticity due to temperature changes (e.g., insufficient pressure at high temperatures leads to incomplete molding, while excessive pressure at low temperatures leads to material brittleness), ensuring the molding accuracy of lightweight components. By using an experimentally calibrated environmental temperature sensitivity coefficient CX, the sensitivity of different materials to temperature is quantified. This ensures that the pressure correction amount matches the material properties, avoiding a "one-size-fits-all" approach to pressure adjustments that could lead to defects such as wrinkles and cracks in lightweight components, thus affecting the structural integrity during earthquakes. By using the "1 + correction ratio" method, the pressure correction is always positive (avoiding negative pressure), while also intuitively reflecting the relative change in pressure (e.g., 1.01 indicates an increase of 1% on the base pressure). This provides a coefficient that can be directly multiplied for subsequent actual pressure calculations, ensuring the controllability of pressure adjustment (avoiding overcorrection that could lead to sudden increases or decreases in pressure), and ensuring the forming stability of lightweight components under dynamic pressure (e.g., thickness uniformity). The final actual corrected stamping pressure P is the core parameter for achieving "pressure-thickness" linkage control, directly serving the synergy between lightweighting (controlling the amount of thinning through pressure) and seismic resistance (ensuring forming quality through pressure).

[0068] Step 3: Based on the actual stamping pressure and thickness variation coefficient, and by correcting the initial thickness through a thickness quantification control model, the actual stamped thickness of the component after forming is obtained.

[0069] In one exemplary embodiment, this embodiment provides a process for obtaining the actual stamped thickness by correcting it using a thickness quantization control model, including:

[0070] The thickness variation coefficient was obtained by fitting historical stamping data using a linear regression algorithm.

[0071] The thickness reduction is obtained by multiplying the actual corrected stamping pressure and the thickness variation coefficient.

[0072] The actual thickness after stamping is obtained based on the difference between the initial thickness and the thickness reduction.

[0073] By establishing a linear mapping relationship between "pressure" and "thickness", precise quantitative control of the lightweight target can be achieved, avoiding the inefficiency and insufficient accuracy of traditional trial and error methods. Specifically, the abstract "pressure input" is transformed into a directly calculable "thickness reduction amount" through the experimentally calibrated thickness variation coefficient.

[0074] Furthermore, the calculation formula for the thickness quantization control model is as follows:

[0075] ;

[0076] In the formula: h is the actual thickness after stamping, h0 is the initial thickness, and H is the thickness variation coefficient.

[0077] It should be understood that The "lightweighting target" is transformed into a measurable value for thickness reduction, avoiding the blindness of traditional processes that rely on "experience-based weight reduction" (such as excessive thinning leading to insufficient strength). At the same time, a linear relationship is used to ensure that the amount of thinning is proportional to the pressure (the greater the pressure, the more thinning), providing a "thickness benchmark" for subsequent strength feedback. Based on this, the final actual stamped thickness h is used as a "feedback parameter," directly linking the degree of lightweighting (thickness reduction) to seismic performance (thickness determines the cross-sectional area, which in turn affects strength, serving as a bridge between "pressure control" and "strength constraints," ensuring that lightweighting does not sacrifice structural thickness).

[0078] Step 4: Combine the thickness of the material with the degree of retention of yield strength, and correct the basic stamping pressure of the next forming through the strength closed-loop feedback model until the preset iterative correction rule is reached. Obtain the corrected basic pressure and transmit it to the hydraulic cylinder 3 for control correction of the stamping pressure.

[0079] In an exemplary embodiment, this embodiment provides a process for obtaining the corrected base pressure through a strength closed-loop feedback model, including:

[0080] The thickness retention rate is obtained based on the ratio between the actual thickness after stamping and the initial thickness.

[0081] The strength retention factor is obtained by multiplying the material's yield benchmark strength and thickness retention rate.

[0082] Based on the proportional relationship between the strength retention factor and the material yield benchmark strength, the strength notch ratio value is obtained;

[0083] The corrected base pressure is obtained by correcting the base stamping pressure based on the strength notch ratio.

[0084] If the strength retention factor is greater than or equal to the material yield reference strength, then the basic stamping pressure is corrected.

[0085] If the strength retention factor is less than the material yield reference strength, the basic stamping pressure is corrected.

[0086] By setting the material yield benchmark strength, pressure correction is triggered only when the strength retention factor is less than the material yield benchmark strength, forming a "strength-first" hard constraint. Specifically, without the material yield benchmark strength, the structure may excessively reduce its thickness in pursuit of lightweighting, causing the strength to drop below the seismic design requirements. This could lead to plastic deformation or fracture of the component under seismic loads. However, with the material yield benchmark strength introduced, pressure is not corrected when the strength retention factor is greater than or equal to the material yield benchmark strength, ensuring that the strength always meets the seismic performance requirements and reducing the risk of failure. Subsequently, through dynamic proportional correction, the foundation pressure is adjusted according to the actual strength gap ratio (rather than a fixed value), achieving adaptive control where "the larger the gap, the larger the correction magnitude." The calculation formula for the strength closed-loop feedback model is given below:

[0087] ;

[0088] HB = h / h0;

[0089] QB=σ yield ×HB;

[0090] In the formula: P base-new The corrected base pressure is given by QB, where QB is the strength retention factor and σ is the base pressure. yield HB represents the material's yield reference strength, and h / h represents the thickness retention rate. The abstract "lightweight effect" is transformed into a proportional coefficient that can be coupled with strength indicators, reflecting the "contribution ratio" of the material's strength after thinning (the lower the thickness retention rate, the smaller the strength contribution), providing a "strength constraint basis" for pressure correction.

[0091] This reduces ineffective corrections by using "threshold triggering," adjusts pressure only when necessary, and precisely controls the correction range through "dynamic scaling," avoiding material scrap caused by repeated pressure testing.

[0092] The iterative correction rules that should be understood include:

[0093] If both the thickness and strength requirements are met, the corrected base pressure is directly transmitted to hydraulic cylinder 3.

[0094] If either the thickness or strength requirement is not met, the base stamping pressure, initial thickness, and base stamping pressure for the next forming round will be continuously adjusted.

[0095] Among them, the thickness compliance condition is |hh target |≤Δh0;

[0096] The strength requirement is QB ≥ σ yield ;

[0097] Where Δh0 is the thickness reference deviation, h target The target thickness.

[0098] Through multiple iterations (the maximum number of iterations can be preset), the basic pressure is gradually adjusted until both the thickness and strength meet the requirements. Specifically, if only a single correction is made, the phenomenon of "thickness meets the requirements but strength is insufficient" or "strength meets the requirements but thickness exceeds the tolerance" may occur. This solves the problems of "incomplete single correction" and "deviation caused by interference factors". It is the "execution means" to achieve accurate compliance with dual objectives (thickness + strength). The two work together to form a closed-loop control of "judgment-correction-feedback-recorrection", which ultimately achieves the optimal balance between lightweight and seismic performance, and significantly improves product reliability and process stability.

[0099] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a key component of a lightweight anti-seismic support hanger, characterized in that, The method comprises the following steps: The stamping equipment body (1) obtains the initial preparation parameters of the to-be-formed component, the target lightweight index, and the real-time material parameters of the current formed component. The initial preparation parameters include the basic stamping pressure, the thickness change coefficient, and the environmental temperature sensitivity coefficient. The target lightweight index includes the standard forming temperature, the target thickness, the material yield reference strength, and the thickness reference deviation. The real-time material parameters include the real-time temperature and the initial thickness. Based on the fluctuation of the real-time environmental temperature detected by the temperature sensor (4), and combined with the dynamic pressure correction model, the basic stamping pressure is corrected to obtain the actual corrected stamping pressure. Based on the actual corrected stamping pressure and the thickness change coefficient, and through the thickness quantification control model, the initial thickness is corrected to obtain the actual post-stamping thickness of the formed component. The retention degree of the thickness and yield strength of the material is fused, and the basic stamping pressure for the next forming is corrected through the strength closed-loop feedback model until the preset iterative correction rule is reached to obtain the corrected basic pressure which is transmitted to the hydraulic cylinder (3) for control correction of the stamping pressure. The initial thickness is obtained by the laser thickness gauge (5).

2. The method according to claim 1, wherein The temperature sensor (4) and the laser thickness gauge (5) are respectively fixedly installed at the stamping inlet and the stamping outlet of the stamping equipment body (1). A control panel (2) is fixedly installed on one side surface of the stamping equipment body (1), and the control panel (2) is electrically connected with the hydraulic cylinder (3), the temperature sensor (4), and the laser thickness gauge (5).

3. The preparation method of a key component of a lightweight anti-seismic support and hanger according to claim 1, characterized in that: The process of correcting the actual corrected stamping pressure by combining the dynamic pressure correction model includes: The temperature sensor (4) obtains the real-time temperature of the forming environment of the formed component and the standard forming temperature of the to-be-formed environment of the to-be-formed component. Based on the difference between the real-time temperature and the standard forming temperature, the temperature fluctuation is obtained. Based on the proportional relationship between the temperature fluctuation and the standard forming temperature, the temperature fluctuation is converted into a temperature influence factor. Based on the temperature influence factor and the environmental temperature sensitivity coefficient, the basic stamping pressure is corrected to obtain the actual corrected stamping pressure.

4. The preparation method of a key component of a lightweight anti-seismic support and hanger according to claim 3, characterized in that: The process of obtaining the environmental temperature sensitivity coefficient includes: At least 5 groups of temperature-pressure experiments are conducted in a pre-set temperature range by the control variable method, and optimal stamping pressure data at different temperatures are collected. Based on the correlation between temperature fluctuation and pressure correction in the dynamic pressure correction model, the correlation coefficient is normalized to obtain the environmental temperature sensitivity coefficient.

5. The preparation method of a key component of a lightweight anti-seismic support and hanger according to claim 1, characterized in that: The process of correcting the actual post-stamping thickness by the thickness quantification control model includes: The thickness change coefficient is obtained by fitting the historical stamping data through a linear regression algorithm. Based on the product of the actual corrected stamping pressure and the thickness change coefficient, the thickness reduction amount is obtained. Based on the difference between the initial thickness and the thickness reduction amount, the actual post-stamping thickness is obtained.

6. The preparation method of a key component of a lightweight anti-seismic support and hanger according to claim 4, characterized in that: The process of obtaining the modified basic pressure through the strength closed-loop feedback model comprises: obtaining a thickness retention rate based on the proportional relationship between the actual thickness after stamping and the initial thickness; obtaining a strength retention factor based on the product of the material yield reference strength and the thickness retention rate; obtaining a strength gap proportion value based on the proportional relationship between the strength retention factor and the material yield reference strength; obtaining a modified basic pressure based on the modification of the basic stamping pressure according to the strength gap proportion value; wherein, if the strength retention factor is greater than and equal to the material yield reference strength, the modification of the basic stamping pressure is stopped; if the strength retention factor is less than the material yield reference strength, the basic stamping pressure is modified.

7. The preparation method of a key component of a lightweight anti-seismic support and hanger according to claim 6, characterized in that: The iterative modification rule comprises: if the thickness standard condition and the strength standard condition are met at the same time, the modified basic pressure is directly transmitted to the hydraulic cylinder (3); if any one of the thickness standard condition and the strength standard condition is not met, the basic stamping pressure, the initial thickness and the basic stamping pressure of the next forming are continuously modified; wherein, the thickness standard condition is that the difference between the actual thickness after stamping and the target thickness is less than or equal to the thickness reference deviation; the strength standard condition is that the strength retention factor is greater than and equal to the material yield reference strength.

8. The preparation method of a key component of a lightweight anti-seismic support and hanger according to claim 5, characterized in that: The process of obtaining the thickness change coefficient comprises: obtaining at least 10 groups of thickness thinning amounts corresponding to different stamping pressures; performing significance test through a least square method fitting linear regression model until the test is passed and the thickness change coefficient is output.

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