Chip temperature measuring device and temperature measuring method thereof

Abstract

The invention provides a chip temperature measuring device and a temperature measuring method thereof.The chip temperature measuring device comprises a circuit board, a testing seat and a temperature measuring probe, the circuit board is provided with a first surface and a second surface in the thickness direction, the testing seat is connected to the first surface, and the side, away from the circuit board, of the testing seat is provided with a chip containing groove used for containing a chip; a temperature measuring hole is formed in the bottom of the chip placing groove; wherein the circuit board is provided with a through hole communicated with the temperature measuring hole, one end of the temperature measuring probe penetrates through the through hole and extends into the temperature measuring hole, and the temperature measuring probe is used for being in contact with a solder ball of the chip in the chip placing groove so as to measure the temperature of the solder ball of the chip. According to the chip temperature measuring device provided by the invention, the technical problem that the junction temperature of the chip is difficult to control to the target temperature quickly and reliably in the prior art is solved.

Description

Technical Field

[0001] This application belongs to the field of chip testing technology, and more specifically, relates to a chip temperature measuring device and its temperature measuring method. Background Technology

[0002] In temperature testing of BGA (Ball Grid Array) packaged chips, to ensure test accuracy, the chip junction temperature typically needs to be precisely controlled within the target value. Ideally, this would involve real-time monitoring of the junction temperature using a built-in sensor; however, many chips lack built-in junction temperature detection capabilities or their built-in sensors are not accurate enough.

[0003] To address this issue, indirect temperature control methods are commonly used. One approach is to determine the ambient temperature that will allow the junction temperature to reach the target value before testing. Another approach is to monitor the case temperature during testing, and once it reaches the set value, extend the holding time to allow the junction temperature to stabilize.

[0004] However, the former is prone to inaccurate junction temperature control due to changes in environmental conditions during actual testing; the latter requires time for heat to transfer from the casing to the chip interior, which requires additional waiting time, resulting in longer testing time and reduced efficiency. Summary of the Invention

[0005] The purpose of this application is to provide a chip temperature measuring device and its temperature measuring method to solve the technical problem in the prior art that it is difficult to quickly and reliably control the chip junction temperature to the target temperature.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: a chip temperature measuring device is provided, including a circuit board, a test socket, and a temperature measuring probe. The circuit board has a first surface and a second surface along its thickness direction. The test socket is connected to the first surface. A chip placement slot for accommodating a chip is provided on the side of the test socket away from the circuit board. A temperature measuring hole is provided at the bottom of the chip placement slot. The circuit board has a through hole communicating with the temperature measuring hole. One end of the temperature measuring probe passes through the through hole and extends into the temperature measuring hole. The temperature measuring probe is used to contact the solder balls of the chip in the chip placement slot to measure the temperature of the solder balls of the chip.

[0007] In one alternative embodiment, the temperature probe includes an insulating tube and a thermocouple wire. One end of the insulating tube passes through a through hole and extends into the temperature sensing hole. The thermocouple wire passes through the insulating tube and extends out of the insulating tube to form a temperature sensing contact surface in the temperature sensing hole for contacting the solder ball.

[0008] In one alternative embodiment, the temperature-sensing contact surface is spherical.

[0009] In an optional embodiment, the chip temperature measuring device further includes a mounting base, which is fixedly connected to the second surface, and the other end of the temperature measuring probe is connected to the mounting base.

[0010] In an optional embodiment, the chip temperature measuring device further includes an elastic element disposed between the temperature measuring probe and the fixed base for driving the temperature measuring probe toward the test base.

[0011] In one optional embodiment, the fixing base includes a limiting shell and a connecting block. The limiting shell is fixedly connected to the second surface and has a receiving cavity formed inside. The connecting block is disposed in the receiving cavity and is movably disposed along the thickness direction of the circuit board. One end of the temperature measuring probe is fixed to the connecting block, and the other end of the temperature measuring probe passes through a through hole. An elastic element is connected between the connecting block and the limiting shell to drive the connecting block to move toward the test base.

[0012] In an optional embodiment, the mounting base further includes a guide shell, which is fixedly connected to the second surface, and a limiting shell is fixedly connected to the side of the guide shell opposite to the circuit board; the guide shell has a guide hole along the thickness direction of the circuit board, and the temperature probe slides through the guide hole.

[0013] In one optional embodiment, the bottom of the chip placement slot is also provided with multiple test holes, and the temperature measuring holes and multiple test holes are evenly spaced at the bottom of the chip placement slot; the test socket is also provided with multiple test probes, each test probe is correspondingly located in the test hole, and the top of the temperature measuring probe and the top of the test probe are located on the same plane so as to synchronously contact the solder balls of the chip during chip installation.

[0014] In one optional embodiment, multiple test sockets are provided, and the multiple test sockets are spaced apart on the first surface; the circuit board is provided with multiple through holes, and each through hole corresponds to the temperature measuring hole of the corresponding test socket; multiple temperature measuring probes are provided, and each temperature measuring probe passes through the corresponding through hole and temperature measuring hole in sequence.

[0015] Another objective of this application is to provide a temperature measurement method for the chip temperature measurement device as described above, comprising: placing the chip in the chip placement slot of the test socket, so that the solder balls of the chip are in contact with the temperature probe; acquiring the temperature signal of the chip in real time through the temperature probe; and triggering a test signal to start chip testing when the temperature value corresponding to the temperature signal reaches a preset threshold.

[0016] The beneficial effects of the chip temperature measuring device and method provided in this application are as follows: Compared with the prior art, the chip temperature measuring device of this application sets a temperature measuring hole in the test socket and opens a through hole at the corresponding position on the circuit board, so that the temperature measuring probe can extend into the temperature measuring hole from the through hole and directly contact the solder ball of the chip installed in the chip placement slot. Since the solder ball is close to the chip substrate, the deviation between the solder ball temperature and the chip junction temperature is extremely small. By measuring the solder ball temperature, the internal junction temperature of the chip can be quickly reflected, which can significantly improve the temperature measuring efficiency and shorten the test cycle of a single chip. Moreover, as the structure closest to the substrate, the solder ball has a short thermal path. Directly contacting the temperature measuring probe with the chip solder ball improves the temperature measuring accuracy and greatly improves the accuracy and reliability of temperature control. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the overall structure of the chip temperature measuring device provided in the embodiments of this application. Figure 1 ; Figure 2 A schematic diagram of the overall structure of the chip temperature measuring device provided in the embodiments of this application. Figure 2 ; Figure 3 This is a cross-sectional view of the chip temperature measuring device provided in an embodiment of this application; Figure 4 for Figure 3 An enlarged view of point A in the diagram; Figure 5 This is an exploded structural diagram of the chip temperature measuring device provided in the embodiments of this application; Figure 6 This is a schematic diagram of the mating structure between the mounting base and the temperature probe provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of the test socket provided in the embodiments of this application; Figure 8 for Figure 7 Enlarged diagram of point B in the diagram; Figure 9 A cross-sectional view of the test fixture provided in an embodiment of this application; Figure 10 This is a cross-sectional view of the test holder and temperature probe mating structure provided in an embodiment of this application.

[0019] The following are the labeling elements in the figure: 100-Chip temperature measuring device; 10-Circuit board; 11-First surface; 12-Second surface; 13-Through hole; 20-Test holder; 21-Chip placement slot; 22-Temperature measuring hole; 23-Test hole; 24-Test probe; 30-Fixing base; 31-Limiting shell; 311-Accommodation cavity; 312-Guide groove; 32-Connecting block; 33-Guide shell; 331-Guide hole; 40-Temperature measuring probe; 40A-Temperature measuring contact surface; 41-Insulating tube; 42-Thermocouple wire; 50-Elastic element. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] In temperature testing of BGA (Ball Grid Array) packaged chips, to ensure test accuracy, the chip junction temperature typically needs to be precisely controlled within the target value. Ideally, this would involve real-time monitoring of the junction temperature using a built-in sensor; however, many chips lack built-in junction temperature detection capabilities or their built-in sensors are not accurate enough.

[0025] To address this issue, indirect temperature control methods are commonly used. One approach is to determine the ambient temperature that will allow the junction temperature to reach the target value before testing. Another approach is to monitor the case temperature during testing, and once it reaches the set value, extend the holding time to allow the junction temperature to stabilize.

[0026] However, the former is prone to inaccurate junction temperature control due to changes in environmental conditions during actual testing; the latter requires time for heat to transfer from the casing to the chip interior, which requires additional waiting time, resulting in longer testing time and reduced efficiency.

[0027] Please refer to the following: Figures 1 to 10 The chip temperature measuring device 100 provided in this application embodiment will now be described. The chip temperature measuring device 100 includes a circuit board 10, a test socket 20, and a temperature measuring probe 40. The circuit board 10 has a first surface 11 and a second surface 12 along its thickness direction. The test socket 20 is connected to the first surface 11. The side of the test socket 20 away from the circuit board 10 is provided with a chip placement groove 21 for accommodating a chip. A temperature measuring hole 22 is opened at the bottom of the chip placement groove 21. The circuit board 10 has a through hole 13 communicating with the temperature measuring hole 22. One end of the temperature measuring probe 40 passes through the through hole 13 and extends into the temperature measuring hole 22. The temperature measuring probe 40 is used to contact the solder balls of the chip in the chip placement groove 21 to measure the temperature of the chip solder balls.

[0028] The circuit board 10 can specifically be an LB board (Load Board), that is, a multilayer circuit board 10. The circuit board 10 is used to establish an electrical connection between the test machine and the chip under test. At the same time, the circuit board 10 is also used to provide mechanical support. The circuit board 10 has a plate-like structure, and therefore has a first surface 11 and a second surface 12 along the thickness direction.

[0029] The test socket 20 is a reusable fixture used to temporarily hold the chip (using a BGA chip as an example in this application) and to achieve reliable electrical contact between the chip solder balls and the circuit board 10. The test socket 20 typically contains spring pins that correspond one-to-one with the solder balls of the BGA chip.

[0030] The test socket 20 can be mounted on the first surface 11 of the circuit board 10 by screws, clips, or pressing. The electrical contacts (spring pins) at the bottom of the test socket 20 are aligned with and pressed against the pads on the circuit board 10 to form an electrical path.

[0031] The chip placement slot 21 on the surface of the test socket 20 is used to accommodate BGA chips, ensuring accurate chip positioning and uniform force distribution. The bottom of the chip placement slot 21 has contact structures (such as probe holes or spring pins) corresponding to the positions of the chip solder balls.

[0032] Temperature sensing hole 22 is a specially made hole at the bottom of chip placement slot 21, used to allow temperature sensing probe 40 to pass through and directly contact the solder balls of the chip. Temperature sensing hole 22 can be made by reusing the original probe hole on test socket 20 (for example, selecting a redundant solder ball position that is not used for signal transmission) and setting it as temperature sensing hole 22; or a new hole can be made to avoid the electrical path for temperature measurement.

[0033] The temperature sensing hole 22 can be a circular through hole 13 to facilitate the insertion of the temperature sensing probe 40 and the solder ball; it can also be a tapered through hole 13, etc., to guide the insertion of the temperature sensing probe 40. The diameter of the temperature sensing hole 22 can be slightly larger than the diameter of the temperature sensing probe 40 so that the temperature sensing probe 40 can extend into it.

[0034] The temperature probe 40 is a miniature temperature sensor. It can be directly connected to the circuit board 10; alternatively, a bracket or connector can be used to connect it to the circuit board 10. One end of the temperature probe 40 extends into the temperature sensing hole 22, allowing direct contact with the chip solder balls to measure their temperature. The temperature probe 40 can be a thermocouple probe, a thermistor probe, or something similar.

[0035] The through hole 13 is a hole on the circuit board 10 that extends from the first surface 11 to the second surface 12, allowing the temperature probe 40 to pass through the circuit board 10 and reach the temperature measuring hole 22 (above) of the test socket 20. The through hole 13 is correspondingly set with the temperature measuring hole 22.

[0036] One end of the temperature probe 40 extends upward from the temperature sensing hole 22 and holds a solder ball at the bottom of the BGA chip. The solder ball can be a solder ball near its center area, whose temperature is closer to the chip junction temperature.

[0037] In BGA-packaged chips, the chip is connected to solder balls via a substrate, resulting in a short thermal path. Therefore, the correlation between solder ball temperature and junction temperature is strong, and the deviation between the solder ball temperature and the actual chip junction temperature is minimal. By directly measuring the solder balls near the heat source, high-precision temperature control can be achieved, improving temperature control reliability. In some embodiments, the measured solder ball temperature and chip junction temperature at the same time differ by within ±1 degree Celsius. This achieves high-precision temperature measurement near the junction temperature level without requiring a built-in sensor on the chip.

[0038] Furthermore, the solder balls are in close contact with the chip substrate, resulting in a short thermal response time. Therefore, there is no need to wait for a long time, and precise temperature control can be achieved quickly, significantly shortening the testing time and improving testing efficiency.

[0039] The chip temperature measuring device 100 makes full use of the mechanical structure of the circuit board 10 and the test socket 20, sets through holes 13 and temperature measuring holes 22 at specific positions, and integrates temperature measuring probes 40. It does not interfere with the original layout of electrical test probes 24. The structure is reasonably designed, easy to implement, low in cost, and easy to maintain.

[0040] In some embodiments, firstly, a ground pin (or any unconnected pin connected to the chip) is selected on the test socket 20, and a through hole 13 is opened on the circuit board 10 at the position corresponding to the pin. The diameter of the through hole 13 is slightly larger than the diameter of the chip solder ball and slightly larger than the diameter of the temperature probe 40. Then, the test probe 24 corresponding to the ground pin of the test socket 20 is removed to form a temperature measuring hole 22. The temperature probe 40 is then passed through the through hole 13 of the circuit board 10 and the temperature measuring hole 22 of the test socket 20 in sequence, so that the end of the temperature probe 40 is exposed in the temperature measuring hole 22, so that when the chip is installed in the chip mounting slot, it can contact the chip solder ball to perform temperature measurement.

[0041] During testing, the temperature signal of the temperature probe 40 is read to obtain the solder ball temperature. Based on the real-time solder ball temperature, the temperature is dynamically adjusted to quickly reach the target value, effectively improving the accuracy of temperature detection and testing efficiency.

[0042] Compared with the prior art, the chip temperature measuring device 100 provided in this application provides a temperature measuring hole 22 in the test socket 20 and a through hole 13 in the corresponding position of the circuit board 10, so that the temperature measuring probe 40 can extend into the temperature measuring hole 22 through the through hole 13 and directly contact the solder balls of the chip installed in the chip placement slot 21. Since the solder balls are close to the chip substrate, the deviation between the solder ball temperature and the chip junction temperature is extremely small. By measuring the solder ball temperature, the internal junction temperature of the chip can be quickly reflected, which can significantly improve the temperature measuring efficiency and shorten the test cycle of a single chip. Moreover, as the structure closest to the substrate, the solder ball has a short thermal path. Directly contacting the temperature measuring probe 40 with the chip solder ball improves the temperature measuring accuracy and greatly improves the accuracy and reliability of temperature control.

[0043] Please refer to some embodiments of this application as well. Figure 4 and Figure 8 The temperature probe 40 includes an insulating tube 41 and a thermocouple wire 42. One end of the insulating tube 41 passes through the through hole 13 and extends into the temperature measuring hole 22. The thermocouple wire 42 passes through the insulating tube 41 and extends out of the insulating tube 41 to form a temperature measuring contact surface 40A in the temperature measuring hole 22 for contacting the solder ball.

[0044] The insulating tube 41 is a hollow thin tube with electrical insulation and high temperature resistance. The insulating tube 41 is used to wrap and protect the thermocouple wire 42, which can isolate the thermocouple wire 42 from the external structure to prevent short circuits, etc., while providing mechanical support and guidance to guide it to the temperature measurement position.

[0045] The insulating tube 41 can be directly connected to the circuit board 10; alternatively, a bracket or connector can be provided to connect it to the circuit board 10.

[0046] The insulating tube 41 can be made of polyetheretherketone (PEEK), which has excellent high temperature resistance, high insulation, low thermal conductivity and good mechanical strength; it can also be made of materials such as ceramics and glass fiber.

[0047] Thermocouple wire 42 enters from one end of insulating tube 41 and runs through the entire tube cavity. At the temperature-measuring end, it can be locally fixed using methods such as adhesive application or a fixing head. The thermocouple wire 42 extends a certain length from the end of insulating tube 41, forming a temperature-measuring contact surface 40A for direct contact with the solder ball to measure temperature. The temperature-measuring contact surface 40A can be spherical or planar. The other end of the thermocouple wire 42 is used to connect to a signal processing terminal.

[0048] By incorporating an insulating tube 41 and a thermocouple wire 42, the measurement is accurate, durable, and stable, easy to install, and has a compact structure.

[0049] Please refer to some embodiments of this application as well. Figure 8 The temperature measuring contact surface 40A is spherical.

[0050] The chip solder balls (such as the solder balls in BGA packaged chips) are approximately hemispherical. When the temperature sensing contact surface 40A of the temperature sensing probe 40 is also designed as a spherical surface (i.e., the end of the thermocouple wire 42 is fused into a small sphere), the two form a spherical contact. Under slight pressure (such as spring loading or component clamping), the two curved surfaces achieve point contact or micro-surface contact in a small area, ensuring stable contact position.

[0051] When spherical surfaces come into contact, even with slight positional deviations or angular tilts, a stable contact point can be automatically found, improving positioning accuracy. Furthermore, the spherical contact pressure distribution is more uniform, reducing contact stress, preventing damage to the solder balls, and protecting the integrity of the chip package. In addition, the spherical contact point is small in size and has low heat capacity, allowing it to quickly follow temperature changes in the solder balls.

[0052] Please refer to some embodiments of this application as well. Figures 2 to 6 The chip temperature measuring device 100 also includes a fixing base 30, which is fixedly connected to the second surface 12, and the other end of the temperature measuring probe 40 is connected to the fixing base 30.

[0053] One end of the temperature probe 40 extends into the temperature measuring hole 22, and the other end can be connected to the circuit board 10 through the fixing base 30.

[0054] The mounting base 30 is a support structure mounted on the second surface 12 of the circuit board 10. It is used to fix the tail end of the temperature probe 40 and provide mechanical stability. The mounting base 30 can be a metal bracket or base, or it can be a temperature control base with heat dissipation or heating elements to facilitate active temperature control.

[0055] In some embodiments of this application, the chip temperature measuring device 100 further includes an elastic element 50, which is disposed between the temperature measuring probe 40 and the fixed base 30 to drive the temperature measuring probe 40 toward the test base 20.

[0056] The elastic element 50 can be a spring or a sheet, etc. The elastic element 50 is connected between the temperature probe 40 and the fixed base 30. By setting the elastic element 50, continuous pressure can be provided to make the end of the temperature probe 40 fit tightly against the surface of the chip solder ball, forming a good heat conduction path, thereby quickly and accurately obtaining the solder ball temperature.

[0057] Furthermore, the elastic element 50 acts as a buffer, preventing rigid impacts and protecting the temperature probe 40 and the chip from damage. In addition, the elastic element 50 can automatically compensate for tolerances and wear, and can automatically adapt to dimensional changes within a certain range, simplifying structural design and reducing assembly requirements.

[0058] In some embodiments, firstly, a ground pin of the packaged chip, or any unconnected pin connected to the chip but not used for signal transmission, is selected; a through hole 13 is made on the circuit board 10 at the position corresponding to the pin. The diameter of the through hole 13 is slightly larger than the diameter of the chip solder ball, and at the same time meets the requirement of being larger than the outer diameter of the temperature probe 40, to ensure a reliable contact space between the temperature probe 40 and the solder ball; then, the test probe 24 corresponding to the pin in the test socket 20 is removed, so that the hole position forms a temperature measuring hole 22; the temperature probe 40 is then placed at the through hole 13. The probe passes through the through-hole 13 and the temperature measuring hole 22, and the tip of the temperature measuring probe 40 (the end closer to the first surface 11) is on the same plane as the tips of the other test probes 24 in the test socket 20, so that they can synchronously contact the corresponding solder balls during chip installation. The fixing seat 30 is fixed to the second surface 12 of the circuit board 10. The elastic element 50 is a spring, which is fixed between the tail end of the temperature measuring probe 40 (the end away from the first surface 11) and the fixing seat 30 to ensure the contact stability and signal reliability of the temperature measuring probe 40 and the chip solder balls during temperature measurement.

[0059] Please refer to some embodiments of this application as well. Figure 4 and Figure 6 The fixing base 30 includes a limiting shell 31 and a connecting block 32. The limiting shell 31 is fixedly connected to the second surface 12, and a receiving cavity 311 is formed inside the limiting shell 31. The connecting block 32 is disposed in the receiving cavity 311 and is movably disposed along the thickness direction of the circuit board 10. One end of the temperature probe 40 is fixed to the connecting block 32, and the other end of the temperature probe 40 passes through the through hole 13. An elastic member 50 is connected between the connecting block 32 and the limiting shell 31 to drive the connecting block 32 to move toward the test base 20.

[0060] The limiting shell 31 is fixedly connected to the second surface 12 of the circuit board 10, providing installation space for the connecting block 32 and the elastic element 50. The limiting shell 31 can be made of materials such as fiberglass or metal, possessing rigidity and wear resistance.

[0061] The connecting block 32 is a movable internal component, which is disposed in the accommodating cavity 311 of the limiting shell 31 and can move along the thickness direction of the circuit board 10.

[0062] One end of the connecting block 32 is used to fix the temperature probe 40. The fixing method can be adhesive, crimping, snap-fit ​​or potting. The other end of the connecting block 32 is connected to the limiting shell 31 through the elastic element 50. Under the action of the elastic element 50, the connecting block 32 can be pushed upward (towards the test seat 20) so that the top of the temperature probe 40 is always pressed against the chip solder ball.

[0063] By setting a limiting shell 31 and a connecting block 32, the tiny temperature probe 40 is fixed on the connecting block 32, which facilitates the installation of an elastic element 50 between the connecting block 32 and the limiting shell 31. The connecting block 32 serves as an intermediate carrier, enabling the elastic element 50 to stably apply preload, ensuring that the tip of the temperature probe 40 always has good contact with the chip solder ball, while avoiding direct force on the temperature probe 40 and thus improving assembly convenience, contact reliability, and temperature measurement repeatability.

[0064] In some embodiments, such as Figure 4 and Figure 6 The limiting shell 31 has a guide groove 312, and the elastic element 50 is placed in the guide groove 312. This can effectively prevent the elastic element 50 from shifting, ensure that the elastic force is stably output along the predetermined axis, and improve the reliability and service life of the temperature probe 40 contact.

[0065] Please refer to some embodiments of this application as well. Figure 4 and Figure 5 The fixed base 30 also includes a guide shell 33, which is fixedly connected to the second surface 12, and a limiting shell 31 is fixedly connected to the side of the guide shell 33 away from the circuit board 10. The guide shell 33 has a guide hole 331 along the thickness direction of the circuit board 10, and the temperature probe 40 slides through the guide hole 331.

[0066] The guide housing 33 is located between the limiting housing 31 and the circuit board 10, and is used to provide precise guidance for the temperature probe 40. The guide housing 33 can be a boss structure, or a bracket or base structure, etc. The guide housing 33 can be provided with a threaded interface or a snap-fit ​​structure to facilitate assembly with the limiting housing 31 or the circuit board 10.

[0067] A guide hole 331 is provided on the guide shell 33 so that the temperature probe 40 can slide through it. The guide hole 331 can be a circular hole, which is simple to process and has good guiding properties; it can also be a round hole with chamfers, which facilitates the insertion of the temperature probe 40; or it can be a micro-conical hole, which has guiding and centering functions.

[0068] By setting the guide shell 33 and the guide hole 331, the temperature probe 40 moves linearly along the thickness direction of the circuit board 10, preventing swaying, tilting, or shaking, and ensuring that its tip always makes vertical contact with the chip solder ball, thus improving the movement accuracy of the temperature probe 40. It also enhances contact consistency, ensuring the repeatability and reliability of temperature measurements.

[0069] Please refer to some embodiments of this application as well. Figures 7 to 10 The bottom of the chip placement slot 21 is also provided with multiple test holes 23. Temperature measuring holes 22 and multiple test holes 23 are evenly spaced at the bottom of the chip placement slot 21. The test holder 20 is also provided with multiple test probes 24. Each test probe 24 is correspondingly located in the test hole 23. The top of the temperature measuring probe 40 and the top of the test probe 24 are located on the same plane.

[0070] Test holes 23 are through holes 13 formed at the bottom of the chip placement slot 21, and their positions correspond one-to-one with the solder balls on the bottom of the chip. Test probes 24 are spring-loaded pins installed in the test holes 23. When the chip is pressed into the chip placement slot 21, the tip of the test probe 24 contacts the chip solder ball to establish a reliable electrical connection, so as to transmit electrical signals and realize the testing of the chip.

[0071] The temperature measuring hole 22 can be one of the original test holes 23 in the test socket 20. The temperature measuring hole 22 and the test hole 23 are evenly spaced at the bottom of the chip placement slot 21 to facilitate correspondence with the chip solder balls.

[0072] The tops of the temperature probe 40 and the test probe 24 are designed on the same horizontal plane. When the chip is pressed into the placement slot, it ensures that all solder balls contact the corresponding temperature probe 40 and test probe 24 at the same time. This avoids some test probes 24 not contacting or overpressure damaging the solder balls due to inconsistent heights, thereby improving test repeatability and accuracy.

[0073] Please refer to some embodiments of this application as well. Figure 1-3 and Figure 4 Multiple test seats 20 are provided, and multiple test seats 20 are spaced apart on the first surface 11; multiple through holes 13 are provided on the circuit board 10, and each through hole 13 corresponds to the temperature measuring hole 22 of the corresponding test seat 20; multiple temperature measuring probes 40 are provided, and each temperature measuring probe 40 passes through the corresponding through hole 13 and temperature measuring hole 22 in sequence.

[0074] The first surface 11 and the second surface 12 of the circuit board 10 are respectively provided with multiple test seats 20. Each test seat 20 has a temperature measuring hole 22. The circuit board 10 has through holes 13 at corresponding positions so that the temperature measuring probe 40 can pass through the through hole 13 and the temperature measuring hole 22 in sequence and finally contact the chip solder ball, so as to realize independent or synchronous temperature detection of each test station.

[0075] By setting up multiple test sockets 20, each temperature probe 40 can stably contact the solder balls of the corresponding chip. This layout structure not only realizes multi-station parallel testing, greatly improving production efficiency, but also ensures that the temperature signal and electrical performance test of each chip are synchronized and accurate; at the same time, each test unit (test socket 20 and probe) can be replaced independently, the modular design facilitates maintenance and expansion, and the layout is compact and has high positioning accuracy.

[0076] In addition, in some embodiments, multiple fixing bases 30 may be provided, with multiple fixing bases 30 spaced apart on the second surface 12 and corresponding one-to-one with multiple test bases 20. Each temperature probe 40 is connected to the corresponding fixing base 30 and passes through the corresponding through hole 13 and temperature measuring hole 22 in sequence. Each fixing base 30 contains a temperature probe 40, allowing the temperature probe 40 to pass through the through hole 13 and temperature measuring hole 22 in sequence from the fixing base 30. By correspondingly setting multiple fixing bases 30, the connection stability of the temperature probe 40 is improved.

[0077] This application provides a temperature measurement method for the chip temperature measuring device 100 as described above, including: placing the chip in the chip placement slot 21 of the test socket 20, so that the solder balls of the chip are in contact with the temperature measuring probe 40; acquiring the temperature signal of the chip in real time through the temperature measuring probe 40; and triggering a test signal to start chip testing when the temperature value corresponding to the temperature signal reaches a preset threshold.

[0078] The chip under test is placed into the chip placement slot 21 at the top of the test socket 20. The solder balls (such as BGA solder balls) at the bottom of the chip will naturally press down. Alternatively, a mechanism can be set to assist in pressing the chip down, so that it contacts the tip of the temperature probe 40 extending from the bottom of the test socket 20. The test socket 20 is equipped with a test probe 24. After the chip is placed, both the electrical connection and the temperature detection path are established.

[0079] Temperature probe 40 (such as a thermocouple or thermistor structure) continuously collects the temperature at the chip solder ball and transmits the temperature signal to the control system.

[0080] The system is pre-set with a target temperature threshold (e.g., 120℃). When the measured actual temperature is reached, the system automatically triggers a test signal to start the electrical performance test of the chip.

[0081] The deviation between the solder ball temperature and the chip junction temperature is extremely small. Therefore, this chip temperature measurement method can quickly and accurately reflect the internal junction temperature of the chip, improving the accuracy and reliability of temperature control, and effectively enhancing the accuracy of temperature detection and testing efficiency.

[0082] In some embodiments of this application, after triggering a test signal and completing chip testing, the current chip is removed, and the temperature measurement method is repeated to test the next chip.

[0083] After completing chip testing, the system automatically removes the currently tested chip from the test socket 20, for example, by having it picked up by a sorting machine and transported to the next workstation or receiving area. Then, the next chip to be tested is placed into the test socket 20, and the aforementioned temperature measurement and testing process is repeated. This process is repeated continuously to achieve continuous and automated batch chip testing.

[0084] In some embodiments: First, the sorting machine transfers the chip under test to the chip placement slot 21 of the test socket 20; then, the cooling block is driven to move downward and press against the upper surface of the chip. At this time, the BGA solder balls at the bottom of the chip come into contact with the temperature probe 40 located in the test socket 20. Under the pressure of the cooling block, the spring-loaded temperature probe 40 is compressed, and its tip forms a stable and reliable thermal contact with the BGA solder balls; the host computer then collects the chip temperature in real time through the temperature probe 40 and continuously monitors it until the measured temperature reaches a preset threshold (e.g., -60°C). At this time, the host computer automatically sends a trigger signal to start the electrical performance test of the chip; after the test is completed, the cooling block is lifted up and removed from the chip, the sorting machine removes the chip that has completed the test, and places the next chip under test into the chip test socket 20, repeating the above temperature measurement and testing process.

[0085] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A chip temperature measuring device, characterized in that, include: A circuit board having a first surface and a second surface along its thickness direction; A test socket, connected to the first surface, has a chip placement slot on the side of the test socket facing away from the circuit board for accommodating a chip, and a temperature measuring hole is provided at the bottom of the chip placement slot; and, Temperature probe; The circuit board has a through hole that communicates with the temperature measuring hole. One end of the temperature measuring probe passes through the through hole and extends into the temperature measuring hole. The temperature measuring probe is used to contact the solder balls of the chip in the chip placement slot to measure the temperature of the solder balls of the chip.

2. The chip temperature measuring device as described in claim 1, characterized in that, The temperature probe includes an insulating tube and a thermocouple wire. One end of the insulating tube passes through the through hole and extends into the temperature measuring hole. The thermocouple wire passes through the insulating tube and extends out of the insulating tube to form a temperature measuring contact surface in the temperature measuring hole for contacting the solder ball.

3. The chip temperature measuring device as described in claim 2, characterized in that, The temperature measuring contact surface is spherical.

4. The chip temperature measuring device as described in claim 1, characterized in that, The chip temperature measuring device also includes a fixing base, which is fixedly connected to the second surface, and the other end of the temperature measuring probe is connected to the fixing base.

5. The chip temperature measuring device as described in claim 4, characterized in that, The chip temperature measuring device also includes an elastic element disposed between the temperature measuring probe and the fixed base, for driving the temperature measuring probe toward the test base.

6. The chip temperature measuring device as described in claim 5, characterized in that, The fixing base includes a limiting shell and a connecting block. The limiting shell is fixedly connected to the second surface, and an accommodating cavity is formed inside the limiting shell. The connecting block is disposed within the accommodating cavity and is movably disposed along the thickness direction of the circuit board. One end of the temperature measuring probe is fixed to the connecting block, and the other end of the temperature measuring probe passes through the through hole. The elastic element is connected between the connecting block and the limiting shell to drive the connecting block toward the test seat.

7. The chip temperature measuring device as described in claim 6, characterized in that, The fixing base also includes a guide shell, which is fixedly connected to the second surface, and a limiting shell is fixedly connected to the side of the guide shell opposite to the circuit board. The guide shell has a guide hole along the thickness direction of the circuit board, and the temperature probe slides through the guide hole.

8. The chip temperature measuring device according to any one of claims 1 to 7, characterized in that, The bottom of the chip placement slot is also provided with multiple test holes, and the temperature measuring holes and the multiple test holes are evenly spaced at the bottom of the chip placement slot; The test socket is also provided with multiple test probes, each of which is correspondingly located in the test hole. The tip of the temperature measuring probe and the tip of the test probe are located on the same plane so as to synchronously contact the solder balls of the chip during chip installation.

9. The chip temperature measuring device according to any one of claims 1 to 7, characterized in that, The test seats are provided in multiple locations, and the multiple test seats are spaced apart on the first surface; The circuit board has multiple through holes, and each through hole corresponds one-to-one with the temperature measuring hole of the corresponding test socket; The temperature measuring probe is provided in multiple ways, and each temperature measuring probe passes through the corresponding through hole and the temperature measuring hole in sequence.

10. A temperature measurement method for a chip temperature measuring device as described in any one of claims 1 to 9, characterized in that, include: Place the chip in the chip placement slot of the test socket so that the chip's solder balls contact the temperature probe; The temperature signal of the chip is acquired in real time through the temperature probe. When the temperature value corresponding to the temperature signal reaches the preset threshold, the test signal is triggered to start the chip test.

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