Low-loss high-frequency chip inductor forming system and method

Abstract

The invention discloses a low-loss high-frequency chip inductor forming system and method, and the system comprises a cooperative control module which is used for obtaining preset process sequential logic and scheduling an energy input module according to the preset process sequential logic, and the preset process sequential logic is an activation stage, a compaction stage, a pressurization stage and a stress self-relaxation stage in sequence; the energy input module is controlled by the cooperative control module and is used for applying energy of at least two different forms to the powder in the mold according to the process sequential logic in a single pressing period; and the state sensing module is used for collecting process parameters in each suppression stage in real time and feeding back the process parameters to the cooperative control module, so that the cooperative control module dynamically adjusts the output parameters of the energy input module in the corresponding suppression stage. A traditional static high-pressure one-step pressing process is replaced with a multi-step dynamic pressing process, mild densification of the powder can be achieved, an insulating layer can be protected, and eddy-current loss under high frequency is remarkably reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip inductance, and in particular to a low-loss high-frequency chip inductance forming system and method. BACKGROUND

[0002] In a metal soft magnetic powder core, the surface of a single powder particle is wrapped by an insulating layer. Under a high-frequency alternating magnetic field, the insulating layer can prevent eddy current from directly flowing between particles, and limit the eddy current path within a single micron-level particle, thereby greatly reducing high-frequency loss. However, in the forming process of a chip inductance metal soft magnetic powder core, there is a fundamental conflict between high-pressing force and the integrity of the powder surface insulating layer. Extremely high pressing pressure can cause the fragile insulating coating to break in particle extrusion and friction, resulting in direct electrical contact between metal particles. This allows the eddy current to cross the particle barrier, and the flow path size increases dramatically from micron level to the overall size of the magnetic core, thereby causing a sharp rise in high-frequency eddy current loss, which seriously affects the high-frequency performance of the inductor. SUMMARY

[0003] The present application provides a high-frequency chip inductance forming system and method based on multi-step dynamic pressing to solve the technical problem that the current chip inductance forming process can cause the high-frequency loss of the inductor to increase.

[0004] To solve the above technical problems, in a first aspect, the present application provides a low-loss high-frequency chip inductance forming system, comprising: A cooperative control module is configured to obtain a preset process timing logic and schedule an energy input module according to the preset process timing logic, wherein the preset process timing logic is to sequentially execute an activation stage, a densification stage, a pressurization stage, and a stress self-relaxation stage. An energy input module is controlled by the cooperative control module and is configured to apply at least two different forms of energy to the powder in the mold within a single pressing cycle according to the process timing logic. A state perception module is configured to collect process parameters in each pressing stage in real time and feed back to the cooperative control module, so that the cooperative control module dynamically adjusts the output parameters of the energy input module in the corresponding pressing stage.

[0005] In some embodiments, the energy input module comprises: A hot-pressing coupling unit is configured to synchronously or alternately apply a first preset heat and a first preset pressure to the powder in the mold in the activation stage. A vibration-pressing coupling unit is configured to apply a second preset pressure to the powder and a preset frequency and amplitude of mechanical vibration force to the mold in the densification stage. A multi-axis pressing unit, configured to increase the pressing pressure from the second preset pressure to a target pressure in a multi-gradient manner by at least two independently driven punches during a pressing stage.

[0006] In some embodiments, the scheduling logic of the cooperative control module for the multi-axis pressing unit is to control the at least two independently driven punches to perform bidirectional pressing of the powder in a pressure synchronization closed loop or a displacement synchronization closed loop; and the cooperative control module dynamically calculates and outputs a compensation control signal according to the pressure value or displacement value of each punch fed back by the state sensing module, so as to correct the motion difference between the punches and make the pressure distribution gradient of the powder along the pressing axis lower than a preset value.

[0007] In some embodiments, the scheduling logic of the cooperative control module for the vibration-pressing coupling unit is to actually calculate the dynamic compaction rate of the powder according to the punch displacement data collected by the state sensing module during the compaction stage; and when the compaction rate drops to a preset rate, the cooperative control module controls the vibration-pressing coupling unit to stop vibration output and triggers the entering of the pressing stage.

[0008] In some embodiments, the state sensing module at least includes a pressure sensor, a displacement sensor and a temperature sensor; and the cooperative control module includes a stage judgment sub-module configured to automatically trigger the transition from one pressing stage to the next pressing stage according to real-time data or characteristic data of the process parameters.

[0009] In some embodiments, the stage judgment sub-module includes a stress relaxation termination judgment unit configured to continuously calculate the punch displacement change amount in a preset unit of time during the stress self-relaxation stage; when the punch displacement change amount continuously is lower than a first preset change amount, it is determined that the macroscopic plastic flow is basically stopped; and when the punch displacement change amount continuously is lower than a second preset change amount, it is determined that the stress relaxation reaches a preset completion degree, and the current pressing cycle is terminated, the second preset change amount being smaller than the first preset change amount.

[0010] In some embodiments, the cooperative control module further includes a process parameter self-optimization sub-module configured to, after continuously producing a plurality of compacts, reversely adjust the energy output parameter or duration of one or more stages in the process timing logic based on the deviation of the size data of the final compact collected by the state sensing module from the target size, so that the size deviation of the subsequent compacts tends to a preset deviation value.

[0011] In a second aspect, the application provides a low-loss high-frequency chip inductance forming method applied to the above system, the method comprising The preset process timing logic is obtained by the cooperative control module, and the energy input module is dispatched according to the preset process timing logic, wherein the preset process timing logic is a logic of sequentially executing an activation stage, a densification stage, a pressurization stage and a stress self-relaxation stage; According to the process timing logic, the energy input module applies at least two different forms of energy to the powder in the mold within a single pressing cycle; The state sensing module collects process parameters in each pressing stage in real time, and feeds back to the cooperative control module, so that the cooperative control module dynamically adjusts the output parameters of the energy input module in the corresponding pressing stage.

[0012] In a third aspect, the present application provides a computer device, characterized by comprising a processor and a memory, the memory is used for storing a computer program, the computer program is executed by the processor to realize the low-loss high-frequency chip inductor forming method.

[0013] In a fourth aspect, the present application provides a computer readable storage medium, characterized by storing a computer program, the computer program is executed by a processor to realize the low-loss high-frequency chip inductor forming method.

[0014] Compared with the prior art, the present application has the following beneficial effects: The present application replaces the traditional static high-pressure one-step pressing process with a multi-step dynamic pressing process, which can realize gentle densification of the powder and protect the insulation layer. Specifically, through the intelligent scheduling of the cooperative control module, different forms of energy (such as heat, vibration, and multi-axis pressure) are applied in stages and combination within a single pressing cycle, and dynamic optimization is performed based on the real-time feedback of the state sensing module; by sequentially executing the activation, vibration densification, multi-step bidirectional pressurization and pressure holding relaxation four stages, the powder is densified in a gentle and gradual manner, while the fragile insulation layer on the surface of the particles is maximally protected, thereby not only greatly improving the density uniformity of the compact, effectively reducing the micro-cracks of the insulation layer and the electrical contact between the particles, but also significantly reducing the eddy current loss under high frequency, thereby directly improving the high-frequency performance and efficiency of the chip inductor. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The structure block diagram of the low-loss high-frequency chip inductor forming system shown in the embodiments of the present application; Figure 2 The flowchart of the low-loss high-frequency chip inductor forming method shown in the embodiments of the present application; Figure 3 The structure diagram of the computer device shown in the embodiments of the present application. DETAILED DESCRIPTION

[0016] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0017] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application. Figure 1 Figure 1 A structural block diagram of a low-loss high-frequency chip inductor forming system shown in an embodiment of the present application, the low-loss high-frequency chip inductor forming system of the embodiment of the present application can be carried on an industrial computer, and the system comprises: A cooperative control module 1 is configured to obtain a preset process timing logic, and schedule an energy input module according to the preset process timing logic. The preset process timing logic is to sequentially execute an activation stage, a densification stage, a pressurization stage, and a stress self-relaxation stage. An energy input module 2 is controlled by the cooperative control module, and is configured to apply at least two different forms of energy to powder in a mold according to the process timing logic in a single pressing cycle. A state sensing module 3 is configured to collect process parameters in each pressing stage in real time, and feed back to the cooperative control module, so that the cooperative control module dynamically adjusts output parameters of the energy input module in the corresponding pressing stage.

[0018] In the embodiment, a traditional static high-pressure one-step pressing process is deconstructed and reconstructed into a multi-stage, multi-energy form cooperative dynamic gradual pressing process. The cooperative control module presets a timing process logic including an activation stage, a densification stage, a pressurization stage, and a stress sub-relaxation stage. The timing parameters of the process logic can be adjusted according to actual needs, and are obtained and updated by the cooperative control module before and after pressing. The cooperative control module schedules the energy input module to sequentially apply different forms of energy to the powder in the mold. In the activation stage, a mild thermal-mechanical coupling effect is applied to soften metal particles and increase the flexibility of the insulation layer. In the densification stage, mechanical vibration and lower pressure are introduced to promote efficient flow and arrangement of powder particles, and to achieve preliminary and low-damage densification. In the pressurization stage, a multi-gradient and bidirectional synchronous pressurization method is adopted to smoothly and uniformly increase the pressure to the target value, thereby maximizing the reduction of stress concentration and density unevenness caused by sudden pressure increase and friction. In the stress sub-relaxation stage, the internal stress of the material is allowed to release through micro-creep by maintaining the final pressure. The entire process is monitored by the state sensing module in real time to monitor key parameters such as pressure, displacement, and temperature, and the data is fed back to the control module, so as to realize dynamic fine tuning of the energy output of each stage, and ensure that the process is accurately executed according to the preset path.

[0019] ​The embodiment realizes higher filling uniformity at lower main pressure through phased progressive energization and vibration-assisted rearrangement, greatly avoiding insulation layer rupture due to local over-stress. Bidirectional synchronous pressing ensures highly uniform density distribution of the pressed blank along the axial direction, eliminating performance short board. Controlled stress relaxation stage helps heal micro-cracks and stabilize microstructure. Thus, high-density chip electrical energy can be achieved while maintaining the integrity of the insulation network between particles, minimizing inter-particle electrical contact that leads to high-frequency performance deterioration. In turn, the high-frequency eddy current loss of the chip inductor is significantly reduced.

[0020] In some embodiments, the energy input module 2 comprises: A hot-press coupling unit 21 for synchronously or alternately applying a first preset heat and a first preset pressure to the powder in the mold during the activation stage; A vibration-press coupling unit 22 for applying a second preset pressure to the powder and a preset frequency and amplitude of mechanical vibration force to the mold during the densification stage; A multi-axis pressing unit 23 for increasing the pressing pressure from the second preset pressure to the target pressure in a multi-gradient manner through at least two independently driven punches during the pressing stage.

[0021] In the embodiment, the hot-press coupling unit synchronously applies mild heat and low pressure in the initial activation stage to reduce the deformation resistance of the powder and increase the flexibility of the insulation layer. The vibration-press coupling unit superimposes mechanical vibration on the basis of low pressure to realize preliminary high-density filling at low stress by using vibration energy to drive efficient flow and rearrangement of powder particles. The multi-axis pressing unit smoothly and uniformly increases the pressure to the target pressure in a multi-gradient and bidirectional synchronous pressing manner to optimize the stress distribution. The embodiment fundamentally changes the densification path of the powder through energy input in different forms and stages; the early intervention of thermal energy and mechanical vibration enables highly uniform particle arrangement at extremely low main pressure, laying a low-damage foundation for subsequent pressing; multi-axis gradient pressing completely avoids stress concentration and density gradient caused by traditional unidirectional high pressure. The three units cooperate with each other to enable the chip inductor to achieve high final density while maximizing the protection of the fragile insulation layer on the particle surface from damage, thereby significantly inhibiting inter-particle electrical contact and ultimately significantly reducing the high-frequency eddy current loss of the formed magnetic core.

[0022] In some embodiments, the scheduling logic of the multi-axis pressing unit 23 of the cooperative control module 1 is to control at least two independently driven punches to perform bidirectional pressing of the powder in a pressure synchronous closed loop or a displacement synchronous closed loop; and the cooperative control module 1 dynamically calculates and outputs a compensation control signal according to the pressure value or displacement value of each punch fed back by the state perception module 3 to correct the motion difference between the punches, so that the pressure distribution gradient of the powder along the pressing axial direction is lower than a preset value.

[0023] In the embodiment, through active closed-loop adjustment, the pressure gradient caused by machining error, uneven powder filling or friction is effectively offset, the stress of the powder along the pressing axis is highly uniform, the highly consistent density distribution of the compact is ensured, and the damage of the local overpressure to the insulation layer and the performance short board caused by the local underpressure are fundamentally avoided.

[0024] In some embodiments, the scheduling logic of the synergic control module 1 to the vibration-pressing coupling unit 22 is that the dynamic compaction rate of the powder is actually calculated according to the punch displacement data collected by the state perception module 3 in the densification stage; when the compaction rate decreases to a preset rate, the synergic control module 1 controls the vibration-pressing coupling unit 22 to stop vibration output, and triggers to enter the pressing stage.

[0025] In the embodiment, in the densification stage, the module obtains the punch displacement data in real time through the state perception module, and calculates the instantaneous dynamic compaction rate of the powder body according to the punch displacement data. The rate directly reflects the real-time efficiency of the vibration energy on the rearrangement and densification of the powder. When the system detects that the compaction rate decreases and reaches a preset threshold, it is determined that the marginal benefit of vibration densification has been significantly reduced, and at this time, the contribution of continuous vibration to the improvement of density is limited. The embodiment dynamically binds the vibration time and the actual physical response of the powder, ensures that the optimal preliminary density is obtained while seamlessly and efficiently transitioning to the subsequent pressing stage, and avoids the problems of insufficient densification or over-vibration that may exist in the traditional vibration based on fixed time.

[0026] In some embodiments, the state perception module 3 at least includes a pressure sensor, a displacement sensor and a temperature sensor; the synergic control module 1 includes a stage judgment sub-module 11 for automatically triggering the transition from one pressing stage to the next pressing stage according to the real-time data or characteristic data of the process parameters.

[0027] In the embodiment, through the integration of pressure, displacement and temperature sensors, the physical parameters of the pressing process are comprehensively collected. The stage judgment sub-module analyzes these data streams or the derived characteristic values (such as compaction rate, pressure gradient, temperature rise curve) in real time, and compares them with the preset process model or threshold. When the conditions are met, the sub-module automatically issues instructions to drive the system to accurately transition to the next stage. The embodiment replaces the traditional method which relies on fixed time sequence or artificial experience, so that the timing of stage transition closely matches the real-time physical state of the powder body.

[0028] In some embodiments, the stage judgment submodule 11 includes a stress relaxation termination judgment unit 111, which is used to continuously calculate the change in punch displacement within a preset unit time during the stress self-relaxation stage; when the change in punch displacement is continuously lower than a first preset change, it is determined that macroscopic plastic flow has basically stopped; when the change in punch displacement is continuously lower than a second preset change, it is determined that stress relaxation has reached a preset completion level and the current pressing cycle is terminated, wherein the second preset change is less than the first preset change.

[0029] In this embodiment, when the displacement change remains below a higher first preset value, the system determines that the macroscopic plastic deformation of the powder has essentially stopped. Subsequently, monitoring continues until the change further decreases and remains below a lower second preset value. At this point, the system determines that the stress relaxation process, representing microscopic creep, has also reached the preset completion standard, and the cycle is terminated. This embodiment effectively ensures the stress relaxation effect, eliminating elastic aftereffects and residual internal stress caused by premature pressure relief, while also avoiding unnecessary prolonged pressure holding.

[0030] In some embodiments, the collaborative control module 1 further includes a process parameter self-optimization submodule 12, which is used to adjust the energy output parameters or duration of one or more stages in the process timing logic in reverse based on the deviation between the final blank size data collected by the state sensing module 3 and the target size after continuous production of multiple blanks, so as to make the size deviation of subsequent blanks tend to a preset deviation value.

[0031] In this embodiment, by analyzing the potential correlation model between deviations and parameters at each process stage (such as pressure, temperature, and time), and automatically and inversely fine-tuning the relevant parameter settings, a continuous optimization cycle is formed. This enables proactive compensation for systematic errors caused by powder batch differences, mold wear, or environmental fluctuations, giving the production process a "learning" ability and significantly reducing reliance on manual machine adjustments.

[0032] As an example rather than a limitation, the dynamic pressing of toroidal iron-silicon-aluminum powder cores is used: spherical iron-silicon-aluminum powder with a phosphate-organosilicon composite insulating layer on the surface is used.

[0033] Collaborative Control Module: Preloads the process timing logic for this product, which includes four stages and their core target parameters. Activation phase: target temperature 120℃, initial pressure 5MPa, duration 60 seconds.

[0034] Compaction stage: base pressure 10MPa, superimposed with axial vibration at a frequency of 50Hz and an amplitude of 0.2mm.

[0035] Pressurization phase: The target final pressure is 800MPa, using 4 pressure steps (200MPa, 400MPa, 600MPa, 800MPa), with each step held for 5 seconds, and bidirectional displacement synchronous closed-loop control is executed.

[0036] Stress self-relaxation stage: The pressure is maintained at 800 MPa, and the termination condition is determined by the rate of displacement change.

[0037] Suppression process execution: Step 1: Activation Phase. The collaborative control module starts, instructing the thermo-pressure coupling unit of the energy input module to heat the mold to 120°C, while simultaneously controlling the upper and lower punches to apply a pressure of 5MPa for 60 seconds. The temperature and pressure sensors of the status sensing module confirm in real time that the parameters meet the standards.

[0038] Step Two: Compaction Stage. The stage judgment submodule automatically triggers the transition after the activation time is reached. The collaborative control module instructs the vibration-pressure coupling unit to operate: increase the pressure to 10MPa and start vibration. At this time, the displacement sensor of the state perception module collects the displacement data of the punch at a frequency of 100Hz. The collaborative control module calculates the derivative of displacement with respect to time in real time to obtain the dynamic compaction rate. The initial rate is approximately 0.05mm / s, and the rate gradually decreases as the powder is compacted. When the system detects that the rate is below 0.001mm / s for 3 consecutive seconds (i.e., the preset rate), it determines that the compaction effect is approaching saturation, and then instructs the vibration to stop, triggering the next stage.

[0039] Step 3: Pressurization Stage. The collaborative control module schedules the multi-axis pressurization unit. Under synchronous closed-loop displacement control, the upper and lower punches begin step-by-step pressurization. At each step, the status sensing module feeds back the actual displacement values ​​of the two punches. The control module dynamically calculates the deviation through an algorithm and outputs a compensation signal to the servo driver to ensure that the displacement difference between the two is always less than 0.01mm, thereby minimizing the pressure distribution gradient. The system smoothly passes through four pressure steps, reaching 800MPa.

[0040] Step Four: Stress Self-Relaxation Stage. Upon reaching the final pressure, the system automatically enters this stage. The stress relaxation termination judgment unit begins operation, calculating the punch displacement change every 10 seconds. In the first 10 seconds, the change is 15 micrometers, far exceeding the first preset change (5 micrometers), indicating that macroscopic plastic flow is still occurring. After 2 minutes, the change decreases and remains below 5 micrometers three times consecutively, indicating that macroscopic flow has stopped. Monitoring continues; after 5 minutes, the change further decreases and remains below the second preset change (1 micrometer) three times consecutively, indicating that stress relaxation caused by microscopic creep has reached the preset requirement. The collaborative control module then instructs depressurization, completing the entire pressing cycle.

[0041] The iron-silicon-aluminum chip inductor prepared by the system in this embodiment has been tested and found to have extremely high internal density uniformity, with a cross-sectional density difference of less than 1.5%. Its eddy current loss at 1MHz frequency is reduced by more than 25% compared with the same specification powder core produced by traditional one-time 800MPa unidirectional pressing.

[0042] See Figure 2 , Figure 2 This document illustrates a flowchart of a low-loss, high-frequency chip inductor forming method according to an embodiment of this application. For ease of explanation, only the parts relevant to this embodiment are shown. The method provided in this application includes steps S101 to S103, as detailed below: S101, the preset process timing logic is obtained through the collaborative control module, and the energy input module is scheduled according to the preset process timing logic. The preset process timing logic is to execute the activation stage, the compaction stage, the pressurization stage and the stress self-relaxation stage in sequence. S102, in a single pressing cycle, the energy input module applies at least two different forms of energy to the powder in the mold according to the process timing logic; S103, the process parameters in each suppression stage are collected in real time by the state perception module and fed back to the collaborative control module so that the collaborative control module can dynamically adjust the output parameters of the energy input module in the corresponding suppression stage.

[0043] The aforementioned low-loss high-frequency chip inductor forming method can be applied to the low-loss high-frequency chip inductor forming system of the above system embodiments. The options in the above system embodiments are also applicable to this embodiment, and will not be detailed here. The remaining content of this application's embodiments can be referred to the content of the above system embodiments, and will not be repeated in this embodiment.

[0044] Figure 3 This is a schematic diagram of the structure of a computer device provided in an embodiment of this application. Figure 3 As shown, the computer device 3 of this embodiment includes: at least one processor 30 ( Figure 3 (Only one is shown in the diagram), memory 31, and computer program 32 stored in said memory 31 and executable on said at least one processor 30, wherein said processor 30 executes said computer program 32 to implement the steps in any of the above method embodiments.

[0045] The computer device 3 may be a computing device such as an industrial computer or a cloud server. This computer device may include, but is not limited to, a processor 30 and a memory 31. Those skilled in the art will understand that... Figure 3The computer device 3 is merely an example and does not constitute a limitation on the computer device 3. It may include more or fewer components than shown in the figure, or combine certain components, or different components, such as input / output devices, network access devices, etc.

[0046] The processor 30 may be a Central Processing Unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0047] In some embodiments, the memory 31 may be an internal storage unit of the computer device 3, such as a hard disk or memory of the computer device 3. In other embodiments, the memory 31 may be an external storage device of the computer device 3, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the computer device 3. Furthermore, the memory 31 may include both internal and external storage units of the computer device 3. The memory 31 is used to store the operating system, applications, bootloader, data, and other programs, such as the program code of the computer program. The memory 31 can also be used to temporarily store data that has been output or will be output.

[0048] In addition, embodiments of this application also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above method embodiments.

[0049] This application provides a computer program product that, when run on a computer device, enables the computer device to execute the steps described in the various method embodiments above.

[0050] In the several embodiments provided in this application, it will be understood that each block in the flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those shown in the figures. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved.

[0051] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0052] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this application. It should be understood that the above descriptions are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application for those skilled in the art.

Claims

1. A low-loss, high-frequency chip inductor forming system, characterized in that, include: The collaborative control module is used to acquire the preset process timing logic and schedule the energy input module according to the preset process timing logic. The preset process timing logic is to execute the activation stage, compaction stage, pressurization stage and stress self-relaxation stage in sequence. The energy input module, controlled by the collaborative control module, is used to apply at least two different forms of energy to the powder in the mold according to the process timing logic within a single pressing cycle. The status sensing module is used to collect process parameters in each suppression stage in real time and feed them back to the collaborative control module so that the collaborative control module can dynamically adjust the output parameters of the energy input module in the corresponding suppression stage.

2. The low-loss high-frequency chip inductor forming system as described in claim 1, characterized in that, The energy input module includes: A thermo-pressure coupling unit is used to apply a first preset heat and a first preset pressure to the powder in the mold during the activation stage; The vibration-pressure coupling unit is used to apply a second preset pressure to the powder during the compaction stage, and to apply a mechanical vibration force with a preset frequency and amplitude to the mold. A multi-axis pressurization unit is used to increase the pressing pressure from the second preset pressure to the target pressure in a multi-gradient manner through at least two independently driven punches during the pressurization phase.

3. The low-loss high-frequency chip inductor forming system as described in claim 2, characterized in that, The scheduling logic of the collaborative control module for the multi-axis pressurization unit is as follows: control at least two of the independent driving punches to perform bidirectional pressurization of the powder in a pressure synchronous closed loop or displacement synchronous closed loop; the collaborative control module dynamically calculates and outputs compensation control signals based on the pressure value or displacement value of each punch fed back by the state sensing module, so as to correct the motion difference between the punches and make the pressure distribution gradient of the powder along the pressing axis lower than the preset value.

4. The low-loss high-frequency chip inductor forming system as described in claim 2, characterized in that, The scheduling logic of the collaborative control module for the vibration-pressure coupling unit is as follows: based on the punch displacement data collected by the state sensing module in the compaction stage, the dynamic compaction rate of the powder is actually calculated; when the compaction rate drops to the preset rate, the collaborative control module controls the vibration-pressure coupling unit to stop vibration output and triggers the entry into the pressurization stage.

5. The low-loss high-frequency chip inductor forming system as described in claim 1, characterized in that, The state perception module includes at least a pressure sensor, a displacement sensor, and a temperature sensor; the collaborative control module includes a stage judgment submodule, which is used to automatically trigger the transition from one pressing stage to the next pressing stage based on real-time data or feature data of the process parameters.

6. The low-loss high-frequency chip inductor forming system as described in claim 5, characterized in that, The stage judgment submodule includes a stress relaxation termination judgment unit, which is used to continuously calculate the change in punch displacement within a preset unit time during the stress self-relaxation stage; when the change in punch displacement is continuously lower than a first preset change, it is determined that the macroscopic plastic flow has basically stopped. When the change in the displacement of the punch is continuously lower than the second preset change, it is determined that the stress relaxation has reached the preset completion level, and the current pressing cycle is terminated. The second preset change is less than the first preset change.

7. The low-loss high-frequency chip inductor forming system as described in claim 1, characterized in that, The collaborative control module also includes a process parameter self-optimization submodule, which is used to adjust the energy output parameters or duration of one or more stages in the process timing logic in reverse, based on the deviation between the final blank size data collected by the state perception module and the target size, after the continuous production of multiple blanks, so that the size deviation of the subsequent blanks tends to the preset deviation value.

8. A method for forming a low-loss, high-frequency chip inductor, characterized in that, Applied to the system as described in any one of claims 1 to 7, the method includes The preset process timing logic is obtained through the collaborative control module, and the energy input module is scheduled according to the preset process timing logic. The preset process timing logic is to execute the activation stage, the compaction stage, the pressurization stage and the stress self-relaxation stage in sequence. Within a single pressing cycle, the energy input module applies at least two different forms of energy to the powder inside the mold according to the process timing logic. The state sensing module collects process parameters in each suppression stage in real time and feeds them back to the collaborative control module, so that the collaborative control module can dynamically adjust the output parameters of the energy input module in the corresponding suppression stage.

9. A computer device, characterized in that, It includes a processor and a memory, the memory being used to store a computer program, which, when executed by the processor, implements the low-loss high-frequency chip inductor forming method as described in claim 8.

10. A computer-readable storage medium, characterized in that, It stores a computer program, which, when executed by a processor, implements the low-loss high-frequency chip inductor forming method as described in claim 8.

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