Device for selecting cutting position of special-shaped sample and use method

Abstract

The invention discloses a device for selecting the cutting position of a sample in a special shape and a using method, and relates to the technical field of sample cutting of a laser cutting machine in a laboratory, the device comprises a support frame, a light source, a light-transmitting bearing layer and a selection table board, the light source is mounted on the support frame; the light-transmitting bearing layer is arranged on the supporting frame, located on the light emitting path of the light source and used for bearing a sample model. The selected table board is positioned below the light-transmitting bearing layer and is used for placing a to-be-processed plate; the profile of the sample model placed on the light-transmitting bearing layer can be projected to the surface of the plate placed on the selected table board through the light of the light source, the structure is simple, use is convenient, rapid measurement of the size of the plate and accurate selection of the cutting position of the sample in a special shape can be effectively achieved, manual operation links are remarkably reduced, and the working efficiency is improved. The labor cost is reduced, errors caused by repeated measurement and drawing are avoided, the experiment accuracy is improved, and the overall experiment time is shortened.

Description

Technical Field

[0001] This invention relates to the field of laboratory laser cutting machine for cutting specimens, and in particular to a device and method for selecting the cutting position of specimens with special shapes. Background Technology

[0002] In the process of laser cutting special-shaped specimens in the laboratory, the proper arrangement of these specimens is a key step to avoid material waste. In existing technologies, when processing special experimental specimens, researchers need to repeatedly measure and draw on the surface of the specimen to determine the final cutting position in order to avoid material waste. This process is not only time-consuming and labor-intensive with high labor costs, but repeated measurement and drawing can also easily introduce errors, affecting the accuracy of the experiment and prolonging the overall experimental time.

[0003] Therefore, there is an urgent need for a technical solution that can quickly and accurately measure the size of the plate and select special sample positions to solve the problems of time-consuming and labor-intensive, high labor costs and poor experimental accuracy in the existing technology. Summary of the Invention

[0004] The purpose of this invention is to provide a device and method for selecting the cutting position of special-shaped samples, so as to solve the problems existing in the prior art. It has a simple structure and is easy to use. It can effectively realize the rapid measurement of plate size and the accurate selection of the cutting position of special-shaped samples, thereby significantly reducing manual operation links, reducing labor costs, avoiding errors caused by repeated measurement and drawing, improving experimental accuracy, and shortening the overall experimental time.

[0005] To achieve the above objectives, the present invention provides the following solution:

[0006] This invention provides a sample cutting position selection device, comprising: a support frame, a light source, a light-transmitting support layer, and a selection platform. The light source is mounted on the support frame; the light-transmitting support layer is disposed on the support frame and located in the light emission path of the light source, and is used to support a sample model; the selection platform is located below the light-transmitting support layer and is used to place the plate to be processed; and the outline of the sample model placed on the light-transmitting support layer can be projected onto the surface of the plate placed on the selection platform by the light from the light source.

[0007] Preferably, the support frame is a movable structure.

[0008] Preferably, the bottom of the movable structure is provided with pulleys.

[0009] Preferably, the light source is an LED lamp.

[0010] Preferably, it also includes a light source adjustment switch electrically connected to the LED lamp.

[0011] Preferably, the selected countertop has a dark matte surface.

[0012] Preferably, the sample model is a solid model with the same shape and size as the sample to be processed.

[0013] Preferably, the sample model is made of an opaque material.

[0014] This invention provides a method for selecting a sample cutting position, employing the sample cutting position selection device as described in any of the preceding claims, comprising the following steps:

[0015] Place the material to be processed on the selected table surface;

[0016] Place the sample model corresponding to the sample to be processed on the light-transmitting bearing layer;

[0017] Turn on the light source so that the outline of the sample model is projected onto the surface of the plate.

[0018] Based on the projection profile of the plate surface, determine the cutting position of one or more specimens.

[0019] The present invention achieves the following technical effects compared to the prior art:

[0020] This invention provides a device and method for selecting the cutting position of special-shaped specimens. By using a light source, the outline of the specimen model on the light-transmitting support layer is projected onto the surface of the plate to be processed on the selected platform below. Experimenters can intuitively and quickly determine the cutting position of one or more specimens based on the projected outline without repeated measurement and drawing. This effectively solves the problems of time-consuming, labor-intensive, high labor costs, and poor experimental accuracy in the prior art, and significantly improves the efficiency and accuracy of selecting the cutting position of special-shaped specimens. At the same time, the structure is simple and easy to operate, and it has strong practicality and promotion value. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the device for selecting the cutting position of a special-shaped sample provided by the present invention;

[0023] In the figure: 1. Support frame; 2. Light source; 3. Transparent load-bearing layer; 4. Selected platform; 5. Pulley; 6. Sample model. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] The purpose of this invention is to provide a device and method for selecting the cutting position of special-shaped samples, so as to solve the problems existing in the prior art. It has a simple structure and is easy to use. It can effectively realize the rapid measurement of plate size and the accurate selection of the cutting position of special-shaped samples, thereby significantly reducing manual operation links, reducing labor costs, avoiding errors caused by repeated measurement and drawing, improving experimental accuracy, and shortening the overall experimental time.

[0026] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] Example 1

[0028] This invention provides a sample cutting position selection device, such as... Figure 1 As shown, the device includes: a support frame 1, a light source 2, a light-transmitting support layer 3, and a selection platform 4. The light source 2 is mounted on the support frame 1; the light-transmitting support layer 3 is located on the support frame 1 and in the light emission path of the light source 2, used to support the sample model 6; the selection platform 4 is located below the light-transmitting support layer 3 and is used to place the material to be processed; the outline of the sample model 6 placed on the light-transmitting support layer 3 can be projected onto the surface of the material placed on the selection platform 4 by the light from the light source 2. This basic structural design clearly defines the function and positional relationship of each part of the device. The support frame 1 supports the light source 2 and the light-transmitting support layer 3, ensuring their stability; the light source 2 provides light, allowing the outline of the sample model 6 to be projected onto the surface of the material; the light-transmitting support layer 3 supports the sample model 6, allowing light to pass through for projection; the selection platform 4 provides a platform for placing the material to be processed. The overall structure is simple and efficient, laying the foundation for quickly selecting the sample cutting position.

[0029] In a preferred embodiment, the support frame 1 is a movable structure. The movable support frame 1 increases the flexibility of the device, and the position of the device can be changed according to actual needs. This facilitates the selection of the cutting position on the plate to be processed in different venues or locations, adapts to various working scenarios, and improves the applicability of the device.

[0030] In a preferred embodiment, the bottom of the movable structure is provided with pulleys 5. The pulleys 5 further optimize the mobility of the support frame 1, enabling operators to easily push the device to move, reducing the labor cost required to move the device, improving the convenience of operation, and allowing the device to reach the designated position for work more quickly.

[0031] In a preferred embodiment, the light source 2 is an LED lamp, which has advantages such as high luminous efficiency, long lifespan, and fast response speed. As a light source 2, it can provide stable and bright light, ensuring that the outline of the sample model 6 is clearly projected onto the surface of the plate, improving the quality of the projection effect, and long-term use does not require frequent replacement of the light source 2, reducing maintenance costs.

[0032] In a preferred embodiment, the light source 2 adjustment switch, electrically connected to the LED lamp, is further included. The light source 2 adjustment switch can flexibly adjust the brightness of the LED lamp according to different working environments and material characteristics. For example, the brightness can be increased in brighter environments and appropriately reduced in darker environments to ensure that the outline of the projected sample model 6 is always clearly visible, thereby improving the accuracy of the cutting position selection.

[0033] In a preferred embodiment, the table surface 4 is selected as a dark matte surface. The dark matte surface can form a sharp contrast with the outline of the projected sample model 6, making it easier for the operator to clearly identify the outline shape, avoiding visual interference caused by light reflection, further improving the accuracy of the cutting position selection and reducing errors.

[0034] In a preferred embodiment, the sample model 6 is a solid model with the same shape and size as the sample to be processed. A solid model with the same shape and size as the sample to be processed can realistically reflect the actual space and shape occupied by the sample on the plate, allowing the operator to directly observe the cutting position through projection without complicated conversion or measurement, thus achieving quick and accurate selection of the cutting position and improving work efficiency.

[0035] In a preferred embodiment, the sample model 6 is made of an opaque material. The opaque material of the sample model 6 ensures that light only passes through the edge of the model, thereby forming a clear and sharp outline projection on the surface of the board, avoiding blurring or distortion of the projection caused by light transmission of the model, and ensuring the accuracy and reliability of the selection of the cutting position.

[0036] Example 2

[0037] This embodiment also provides a method for using the sample cutting position selection device, including the following steps:

[0038] Equipment preparation

[0039] Install the sample model 6: Place the sample model 6, made of opaque material and with the same shape and size as the sample to be processed, stably on the light-transmitting support layer 3. Ensure that the sample model 6 is fixed in position on the light-transmitting support layer 3 and will not move during subsequent operations to guarantee the accuracy of the projected profile.

[0040] Connect and check light source 2: Confirm that the LED light is correctly installed on the support frame 1 and electrically connected to the adjustment switch of light source 2. After turning on the power, check whether the LED light lights up normally. If there are any problems, troubleshoot them promptly.

[0041] Adjust the position of support frame 1: Since support frame 1 is a movable structure and has pulleys 5 at the bottom, support frame 1 can be easily pushed according to the placement position of the plate to be processed, so that the light-transmitting bearing layer 3 is located directly above the plate to be processed, ensuring that the outline of the sample model 6 projected by the light source 2 can be completely projected onto the surface of the plate.

[0042] Light source 2 brightness adjustment: Adjust the brightness of the LED light by operating the light source 2 adjustment switch according to the lighting conditions of the working environment and the surface characteristics of the material to be processed. For example, if the working environment is bright, appropriately brighten the LED light to enhance the intensity of the projected light and make the outline of the sample model 6 clearer on the surface of the material; if the working environment is dark or the surface of the material is smooth and reflective, appropriately dim the LED light to avoid excessively bright light causing reflection interference and ensure that the projected outline can be clearly distinguished.

[0043] Place the sample to be processed: Place the sample to be processed on the selected platform 4. The selected platform 4 has a dark matte surface, which helps to create a sharp contrast with the outline of the projected sample model 6, making it easy to observe. When placing the sample, ensure that the surface of the sample is flat and parallel to the light-transmitting carrier layer 3 to ensure that the projected outline is not distorted.

[0044] Cutting Position Selection: The LED light is turned on, and its light shines through the light-transmitting support layer 3 onto the sample model 6, clearly projecting the model's outline onto the surface of the workpiece placed on the selected platform 4. The operator directly determines the cutting position based on the projected outline of the sample model 6 onto the workpiece surface. If multiple samples of different shapes need to be arranged, different sample models 6 can be placed sequentially on the light-transmitting support layer 3. The position and angle of the sample models 6 can be adjusted by translation, rotation, etc., and the arrangement of the different sample model outlines can be observed on the workpiece surface to ensure a reasonable arrangement, fully utilizing the workpiece space and avoiding waste.

[0045] Operation Completion and Cleanup: After selecting the cutting position, turn off the LED light power. If it is necessary to move the device to another location to operate on another piece of material, the support frame 1 can be moved again. After the operation is completed, properly store the sample model 6 and other components for future use.

[0046] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A specimen cut location selection apparatus, characterized by, The application relates to a light source device for cutting plate materials, comprising: a support frame; a light source installed on the support frame; a light-transmitting bearing layer arranged on the support frame and located on a light ray emitting path of the light source, used for bearing a sample model; a selected table located below the light-transmitting bearing layer, used for placing a plate material to be processed; and the contour of the sample model placed on the light-transmitting bearing layer can be projected to the surface of the plate material placed on the selected table through the light ray of the light source.

2. The specimen cut location selection apparatus of claim 1, wherein, The support frame is a movable structure.

3. The specimen cut location selection apparatus of claim 2, wherein, The bottom of the movable structure is provided with a pulley.

4. The specimen cut location selection apparatus of claim 1, wherein The light source is an LED lamp.

5. The specimen cut location selection apparatus of claim 4, wherein, The light source device further comprises a light source adjusting switch electrically connected with the LED lamp.

6. The specimen cut location selection apparatus of claim 1, wherein The selected table is a dark matte surface.

7. The specimen cut location selection apparatus of claim 1, wherein The sample model is a solid model consistent with the shape and size of a sample to be processed.

8. The specimen cutting location selection apparatus of claim 1, wherein The sample model is made of a light-proof material.

9. A sample cutting site selection method using the apparatus according to any one of claims 1 to 8, characterized by, The application further comprises the following steps: placing a plate material to be processed on the selected table; placing a sample model corresponding to a sample to be processed on the light-transmitting bearing layer; turning on the light source to project the contour of the sample model to the surface of the plate material; determining one or more cutting positions of the sample according to the projected contour of the surface of the plate material.

Images