A chassis and electronic device

Abstract

The application discloses a case and electronic equipment, which is applied to case technology and comprises a case frame, a sliding support and a first component module or a second component module. The first component module comprises a first mainboard assembly and at least one layer of first component assemblies; the second component module comprises a second mainboard assembly and a second component assembly which are connected through a component cable; the sliding support is arranged on the inner cavity side wall of the case frame and extends along the front-rear direction of the case frame to form a plurality of containing spaces arranged along the height direction in the case frame; the first component assemblies are placed in the containing spaces; the second mainboard assembly and the second component assembly are located in the lower containing space, and the component cable is located in the upper containing space. The case provided by the application has a wide application range, is convenient to disassemble and assemble, has high space utilization, and can be compatible with the first component module and the second component module.

Description

Technical Field

[0001] This invention relates to chassis technology, and more particularly to a chassis and electronic equipment. Background Technology

[0002] As the power density of AI (Artificial Intelligence) computing clusters increases exponentially, high-density AI servers have become the main direction of system architecture evolution. In related technologies, the layout design of OAM GPU component modules and ASIC GPU component modules involves stacking the CPU motherboard and OAM UBB vertically, each occupying 1U of height. The cooling plate's pipes and fan modules occupy significant lateral space within the chassis, resulting in a large footprint. This prevents OAM GPU component module servers from exceeding 4 GPUs / OU, falling far short of the 8 GPU / OU target. Furthermore, the server architecture based on ASIC GPU component modules differs greatly from that based on OAM GPU component modules, making them incompatible and limiting the flexibility of the server architecture, leading to increased costs.

[0003] Therefore, how to improve the applicability of the chassis is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a chassis and electronic equipment that can improve the chassis's compatibility, reduce costs, and facilitate assembly.

[0005] To achieve the above objectives, the present invention provides the following technical solution.

[0006] A chassis includes: a chassis frame for selectively mounting a first type of component module or a second type of component module; the first type of component module includes a first motherboard assembly and at least one layer of first component assemblies, the first component assemblies and the first motherboard assembly being arranged along the front-rear direction of the chassis frame; the second type of component module includes a second motherboard assembly and a second component assembly connected by component cables, the second motherboard assembly and the second component assembly being arranged along the front-rear direction of the chassis frame; a sliding support member is disposed on the inner cavity sidewall of the chassis frame and extends along the front-rear direction of the chassis frame to form a plurality of receiving spaces arranged along the height direction within the chassis frame; one of the first component assemblies is selectively placed in the receiving space; the second motherboard assembly and the second component assembly are located in the lower receiving space, and the component cables are located in the upper receiving space.

[0007] The present invention also provides an electronic device comprising a chassis according to any one of the above.

[0008] The chassis provided by this invention has the following advantages: The chassis frame allows for the installation of first-type component modules. Since the first motherboard assembly includes a first motherboard assembly and several first-type component assemblies, to reduce the overall length of the first-type component module in the chassis frame along the front-to-back direction, the several first-type component assemblies are arranged in layers. These layered first-type component assemblies are then arranged front-to-back with the first motherboard assembly. This avoids the problem in related technologies where the first-type component assemblies are laid flat, resulting in a large chassis lateral dimension. Such designs not only fail to achieve miniaturization but also make the chassis frame used for the first-type component module unsuitable for installing other component modules. The chassis provided by this application… The chassis, by stratifying the first component components, effectively reduces the length of the chassis frame in the front-to-back direction, resulting in a more rational size design that facilitates the installation of other component modules and enhances compatibility. Furthermore, to complement the stratified arrangement of the first component modules, a sliding support is added. This sliding support divides the inner cavity of the chassis frame into upper and lower parts, allowing the first component components to be selectively mounted on the sliding support or on the bottom plate of the chassis frame. The second motherboard assembly and the second component assembly are located in the lower receiving space, while the component cables are located in the upper receiving space. This fully utilizes the overall space within the chassis frame, thereby achieving compatibility between the first and second component modules.

[0009] The chassis provided by this invention has a wide range of applications, is easy to assemble and disassemble, and has a high space utilization rate. Under the limited overall space constraints, it can integrate more electrical components, and significantly improve computing power density.

[0010] In one embodiment, the signal connector is plate-shaped, perpendicular to the bottom plate of the chassis frame, and extends along the left-right direction of the chassis frame. A first motherboard assembly and a first component assembly are respectively disposed on the front and rear sides of the signal connector. This configuration, by using a plate-shaped signal connector that extends along the left-right and height directions of the chassis frame, effectively reduces the horizontal space occupied by the signal connector within the chassis frame. Simultaneously, the first motherboard assembly and the first component assembly are respectively disposed on the front and rear sides of the signal connector, and are connected via the signal connector, facilitating operation. During actual use, the connection between the first motherboard assembly and the signal connector remains unchanged. When maintenance of the first component assembly is required, it can be easily separated from the signal connector. When installing the first component assembly, it is pushed into the inner cavity of the chassis frame from the front window, and the first component assembly automatically connects with the front signal connector of the signal connector.

[0011] In one embodiment, the water manifold is arranged perpendicular to the base plate, and the first main board assembly and the first element assembly are respectively arranged on the front and rear sides of the water manifold. The front and rear sides of the water manifold are respectively provided with a front water inlet / outlet and a main water inlet / outlet. The front water inlet / outlet is a blind-plug water inlet / outlet for communicating with the first element assembly, and the main water inlet / outlet is for communicating with an external cooling device. The above configuration, with the manifold perpendicular to the bottom plate of the chassis frame (i.e., extending along the height of the chassis frame), effectively reduces the horizontal space occupied by the manifold within the chassis frame. Simultaneously, the first motherboard assembly and the first component assembly are respectively positioned on the front and rear sides of the manifold. The first component assembly connects to external cooling equipment via the manifold. Furthermore, the front inlet and outlet are blind-plug inlet and outlet ports. During actual use, the connection between the manifold and the external cooling equipment remains unchanged. When maintenance of the first component assembly is required, it is pulled out from the front window of the chassis frame, automatically disconnecting from the front inlet and outlet ports of the manifold for easy operation. When installing the first component assembly, it is pushed into the inner cavity of the chassis frame from the front window, automatically connecting to the front inlet and outlet ports of the manifold.

[0012] In one embodiment, an input / output tray is also included. The input / output tray is mounted on the upper part of the first front window panel of the chassis frame, so that the input / output tray and each layer of first component assemblies are arranged sequentially along the height direction. The input / output tray is used to install hard drives, network cards, and / or input / output cards. This arrangement, by placing each layer of first component assemblies and the input / output tray and its components on the front window, facilitates access and maintenance. When maintenance of the first component assembly is required, the integrated first component assembly can be pulled out from the front side of the chassis frame. The input / output tray, mounted on the upper part of the first front window panel of the chassis frame, does not affect the installation and removal of the first component assemblies, does not occupy too much space within the chassis frame, and also facilitates the connection of hard drives, network cards, and / or input / output cards on the input / output tray, making operation convenient.

[0013] In one embodiment, a first type of component module is also included. The first component assembly includes a first cold plate tray, a first component, and a first component substrate. The first component is located between the first cold plate tray and the first component substrate, and the first component and the first component substrate are electrically connected. The first cold plate tray is selectively placed on a sliding support or the bottom plate of the chassis frame. In the above configuration, the first type of component module can be an OAM GPU component module. By placing the first component and the first component substrate on the first cold plate tray, the first cold plate tray can not only function as a cold plate but also as a tray. The first component substrate generally has multiple first components connected to it, and the first components are the heat sources that need to be cooled. By dissipating heat from multiple first components on the entire first component substrate through a single integrated first cold plate tray, the troublesome pipe connections in the cold plate design of related technologies are eliminated, and a large number of fluid connectors and pipes are saved. The height layout can achieve the most optimized and compact design.

[0014] In one embodiment, the chassis frame is also used to mount a second type of component module, which includes a second motherboard assembly and a second component assembly. The second motherboard assembly and the second component assembly are arranged along the front-rear direction of the chassis frame, and the second motherboard assembly is located on the front side of the inner cavity of the chassis frame. The second component assembly includes a second cold plate and a second component. The second component is placed on the second cold plate, and the second component is connected to the second motherboard assembly via component cables. With the above configuration, the chassis frame can not only install the first type of component module, but also the second type of component module, which can be an ASIC GPU component module. The second cold plate and the second component in the second type of component module are stacked, with the second component mounted on the second cold plate. The second cold plate and the second component are located on the rear side of the chassis frame's inner cavity. The second motherboard assembly is located on the front side of the chassis frame's inner cavity. The second motherboard assembly includes a second motherboard, a second CPU component, and a second CPU cold plate. The second CPU component is mounted on the second motherboard. By placing the second motherboard assembly on the front side of the chassis frame's inner cavity, the second motherboard assembly can be pulled out or pushed in from the front of the chassis frame, facilitating maintenance of the second motherboard assembly. Furthermore, the front-to-back arrangement of the second motherboard assembly and the second component assembly fully utilizes the space in the lower part of the chassis frame's inner cavity, providing ample space for component cables. This allows for the adaptation of two different component modules, increasing applicability and reducing mold costs.

[0015] The electronic device provided by the present invention is equipped with the aforementioned chassis. Since the chassis has the aforementioned technical effects, the electronic device equipped with the chassis should also have the corresponding technical effects. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a specific embodiment of the chassis provided by the present invention.

[0018] Figure 2 This is a structural schematic diagram of another specific embodiment of the chassis provided by the present invention.

[0019] Figure 3 for Figure 1 The diagram shows the system topology of the first type of component module in the chassis shown.

[0020] Figure 4 for Figure 2 The diagram shows the system topology of the second type of component module in the chassis.

[0021] Figure 5 for Figure 1 The diagram shows the structural diagram of the chassis frame in the chassis shown.

[0022] Figure 6 for Figure 1 The diagram shows the structure of the first front window panel in the chassis.

[0023] Figure 7 for Figure 1 The diagram shows the structure of the input / output tray, hard drive, network card, and input / output card in the chassis.

[0024] Figure 8 for Figure 1 The diagram shows the structure of the input / output tray in the chassis.

[0025] Figure 9 for Figure 1 The diagram shows the structure of the first cold plate tray of the first type of component module in the chassis.

[0026] Figure 10-1 for Figure 9 The diagram shows a cross-sectional view (AA) of the first cold plate tray, the first component, and the substrate of the first component.

[0027] Figure 10-2 for Figure 9 The diagram shows a BB cross-sectional view of the first cold plate tray, the first component, and the substrate of the first component.

[0028] Figure 11-1 for Figure 5The isometric view of the water distribution unit in the chassis shown.

[0029] Figure 11-2 for Figure 5 Another isometric view of the water distribution unit in the chassis shown.

[0030] Figure 12-1 for Figure 5 The isometric view of the water distribution unit in the chassis shown.

[0031] Figure 12-2 for Figure 5 Another isometric view of the water distribution unit in the chassis shown.

[0032] Figure 13 for Figure 1 A schematic diagram of the structure of the first substrate of the first type of component module in the chassis shown.

[0033] Figure 14 for Figure 13 The diagram shows the structure of the network interface board in the first substrate.

[0034] Figure 15 for Figure 13 The diagram shows the connection structure between the first substrate and the signal connector.

[0035] Figure 16 for Figure 1 The diagram shows the connection structure between the first cold plate tray and the water manifold in the first type of component module.

[0036] Reference numerals: 100-First type of component module; 101-First motherboard assembly; 1011-First motherboard; 1012-First CPU cold plate; 102-First component assembly; 103-First cold plate tray; 1031-Limiting groove; 1032-Shielding edge; 1033-Microchannel; 1034-Microchannel chamber; 1035-Main pipeline; 1036-Microchannel spade; 1037-Blind-mating fluid connector; 104-First component; 105-First component substrate; 106-Network interface board; 1061-Network interface component; 1062-Network interface body; 107-Switching component; 108-Substrate blind-mating connector; 200-Second type of component module; 201-Second motherboard assembly; 202-Second component assembly; 2021-Second cold plate; 2022-Second component; 2023-Element Cables; 301-Hard drive; 3011-Hard drive backplate; 302-Network card; 303-Input / output card; 400-Fan module; 1-Chassis frame; 11-First front window panel; 111-Network interface window; 112-Front window mounting holes; 113-Network card slot window; 114-Hard drive slot window; 115-Input / output interface window; 116-Front window mounting side ear; 12-Second front window panel; 2-Sliding support; 21-Sliding connection edge; 22-Sliding support edge; 3-Signal connector; 31-Front signal connector; 32-Rear signal connector; 4-Manifold; 41-Front inlet / outlet; 42-Main inlet / outlet; 43-Rear inlet / outlet; 5-Fan frame; 6-Input / output tray; 61-Hard drive partition; 62-Network card partition; 63-Tray connection edge; 64-Tray support edge. Detailed Implementation

[0037] The core of this invention is to provide a chassis and electronic equipment that can achieve a high-density chassis design and improve computing power.

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0039] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0040] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0041] In the layout design of the OAM GPU (Open Accelerator Module Central Processing Unit) component module and the ASIC GPU (Application-Specific Integrated Circuit Central Processing Unit) component module, the CPU motherboard of the OAM GPU component module and the OAM UBB (Universal Baseboard, a core component in AI servers used to support the OAM (Open Accelerator Module) module) are stacked vertically, each occupying 1U of height. The cooling plate pipes and fan modules occupy the lateral space inside the chassis, which takes up a large amount of space. As a result, the OAM GPU component module server cannot exceed 4GPU / OU, which is far from the target of 8GPU / OU. Here, OU refers to the server height measurement unit defined by OCP (Open Compute Project), 1OU=48.00mm, which is used to standardize the rack deployment space of OCP-compatible servers.

[0042] In this implementation, please refer to Figure 1 , Figure 3 and Figure 5 The chassis includes a chassis frame 1 and a sliding support 2.

[0043] The chassis frame 1 is used to selectively install either a first type of component module 100 or a second type of component module 200. The first type of component module 100 includes a first motherboard assembly 101 and at least one layer of first component assembly 102. The first component assembly 102 and the first motherboard assembly 101 are arranged sequentially from front to back along the front-back direction of the chassis frame 1. That is, the first motherboard assembly 101 is located on the rear side of the inner cavity of the chassis frame 1, and the first component assembly 102 is located on the front side of the inner cavity of the chassis frame 1. The second type of component module 200 includes a second motherboard assembly 201 and a second component assembly 202 connected by component cables 2023. The second motherboard assembly 201 and the second component assembly 202 are arranged along the front-back direction of the chassis frame 1.

[0044] The sliding support 2 is disposed on the inner cavity side wall of the chassis frame 1 and extends along the front-back direction of the chassis frame 1 to form a plurality of accommodating spaces arranged along the height direction within the chassis frame 1; the first component assembly 102 is selected to be placed in one of the accommodating spaces, that is, the first component assembly 102 is selected to be placed on the sliding support 2 or on the bottom plate of the chassis frame 1; the second motherboard assembly 201 and the second component assembly 202 are located in the lower accommodating space, and the component cable 2023 is located in the upper accommodating space.

[0045] Furthermore, the chassis frame 1 includes a chassis base, a front window panel, and a rear window panel. The front window panel is detachably connected to the chassis base. After all the component modules inside the chassis frame 1 are assembled, the front window panel is installed last, serving a protective and electromagnetic isolation function. The chassis frame 1 can accommodate either a first type of component module 100 or a second type of component module 200. The first type of component module 100 is an OAM GPU component module, and the second type of component module 200 is an ASIC GPU component module. In the OAM GPU module, the OAM GPU component, i.e., the first component 104, is mounted on the first substrate via a snap-fit ​​connector. In the ASIC GPU module, the ASIC GPU component, i.e., the second component 2022, is connected to the second motherboard assembly 201 via a component cable 2023, without the need for a second substrate. Furthermore, when the first type of component module 100 is installed inside the chassis frame 1, the chassis frame 1 shall be equipped with a first front window panel 11; when the second type of component module 200 is installed inside the chassis frame 1, the chassis frame 1 shall be equipped with a second front window panel 12.

[0046] The chassis provided by this invention, through the chassis frame 1, can accommodate a first type of component module 100. Since the first motherboard assembly 101 includes a first motherboard assembly 101 and several first component assemblies 102, to reduce the length of the entire first type of component module 100 in the front-to-back direction of the chassis frame 1, the several first component assemblies 102 are arranged in layers, and the layered first component assemblies 102 and the first motherboard assembly 101 are arranged in a front-to-back manner. This avoids the problem of a large lateral dimension of the chassis caused by laying the first component assemblies 102 flat in related technologies, which not only fails to achieve miniaturization. The design of the chassis frame 1 used for the first type of component module 100 is not suitable for the installation of other component modules. The chassis provided in this application can effectively reduce the length of the chassis frame 1 in the front-to-back direction by arranging each first component assembly 102 in layers. The size design is more reasonable, which can facilitate the installation of other component modules and has higher adaptability. In addition, in order to cooperate with the layered arrangement of the first type of component module 100, a sliding support 2 is added. The sliding support 2 divides the inner cavity of the chassis frame 1 into upper and lower parts. The first component assembly 102 can be selectively installed on the sliding support 2 or on the bottom plate of the chassis frame 1.

[0047] In some embodiments, it also includes a signal connector 3 for connecting the first component assembly 102 and the first motherboard assembly 101, the signal connector 3 being detachably disposed within the chassis frame 1.

[0048] In some embodiments, it also includes: a manifold 4 for connecting the first element assembly 102 of each layer with an external cooling device, the manifold 4 being detachably installed inside the chassis frame 1.

[0049] The above configuration allows the signal connector 3 and the manifold 4 to be detachably connected to the chassis frame 1, enabling them to be adapted to different component modules. For example, when adapting to the first type of component module 100, the signal connector 3 and the manifold 4 are installed inside the chassis frame 1. When adapting to the second type of component module 200, the signal connector 3 and the manifold 4 are detached from the chassis frame 1 to avoid interference.

[0050] Specifically, the signal connector 3 enables communication between the first component assembly 102 and the first motherboard assembly 101. Both the signal connector and the manifold 4 are positioned between the first component assembly 102 and the first motherboard assembly 101. For ease of layout, the signal connector and the manifold 4 can be located on the left and right sides of the inner cavity of the chassis frame 1, respectively. Furthermore, both the signal connector 3 and the manifold 4 are detachably mounted within the chassis frame 1. The signal connector 3 and the manifold 4 are only required to be mounted within the chassis frame when the chassis frame 1 is used to install the first type of component module 100. Within 1, when the chassis frame 1 is used to install other component modules, the signal connector 3 and the manifold 4 can be removed from the chassis frame 1, which can meet the needs of different component ecosystems; furthermore, by arranging the first component assembly 102 and the first motherboard assembly 101 sequentially from front to back along the front-back direction of the chassis frame 1, that is, the first component assembly 102 is located on the front side of the inner cavity of the chassis frame 1 and the first motherboard assembly 101 is located on the rear side of the inner cavity of the chassis frame 1, this arrangement can facilitate the insertion and removal of the first component assembly 102 from the front window position of the chassis frame 1, which is convenient for maintenance.

[0051] This chassis has a wide range of applications, is easy to assemble and disassemble, and has a high space utilization rate. Under the limited overall space constraints, it can integrate more electrical components, significantly improving computing power density.

[0052] In some embodiments, the sliding support 2 is disposed on the inner cavity sidewall of the chassis frame 1 along the left-right direction, and the sliding support 2 extends along the front-back direction; the first component assembly 102 is slidably connected to the sliding support 2 or the base plate. Further, since the function of the sliding support 2 is to support the first component assembly 102, the sliding support 2 is disposed on the inner front side of the chassis frame 1, and the length of the sliding support 2 along the front-back direction is the same as the length of the first component assembly 102 along the front-back direction. Specifically, the sliding support 2 is strip-shaped and located in the middle of the chassis frame 1 along the height direction, which can divide the front part of the chassis frame 1 into upper and lower spaces. The first component assembly 102 is slidably connected to the sliding support 2 or the base plate, that is, one first component assembly 102 is placed in one space, achieving vertical arrangement.

[0053] In some embodiments, the chassis frame 1 has multiple sliding support members 2 on both inner cavity sidewalls along the left and right directions, and the sliding support members 2 are arranged at intervals along the height direction of the chassis frame 1; and the sliding support members 2 on the two inner cavity sidewalls correspond one to one. Specifically, each sliding support member 2 is evenly distributed along the height direction of the chassis frame 1, and the first component assembly 102 is selectively placed on any sliding support member 2 or on the bottom plate of the chassis frame 1. By setting multiple sliding support members 2, the front part of the chassis frame 1 can be divided into more spaces, which can meet the needs of higher configuration component modules.

[0054] In some embodiments, the sliding support 2 is plate-shaped with a small thickness and small space occupation. The sliding support 2 is provided with a sliding connecting edge 21 and a sliding support edge 22. For example, the sliding support 2 is L-shaped with the sliding support edge 22 perpendicular to the sliding connecting edge 21. The sliding connecting edge 21 is fixed to the chassis frame 1, and the sliding support edge 22 extends toward the inner cavity of the chassis frame 1. The sliding support edge 22 is used to support the first component assembly 102. The above configuration, by setting up a plate-shaped signal connector 3 that extends along the left-right and height directions of the chassis frame 1, effectively reduces the horizontal space occupied by the signal connector 3 within the chassis frame 1. Simultaneously, the first motherboard assembly 101 and the first component assembly 102 are respectively positioned on the front and rear sides of the signal connector 3, and are connected via the signal connector 3, facilitating operation. In actual use, the connection between the first motherboard assembly 101 and the signal connector 3 remains unchanged. When maintenance of the first component assembly 102 is required, it is only necessary to separate the first component assembly 102 from the signal connector 3, simplifying operation. When installing the first component assembly 102, it is pushed from the front window of the chassis frame 1 into the inner cavity of the chassis frame 1, and the first component assembly 102 automatically connects with the front signal connector 31 of the signal connector 3.

[0055] In some embodiments, the signal connector 3 is plate-shaped, which is the middle back plate. The signal connector 3 is perpendicular to the bottom plate of the chassis frame 1 and extends along the left and right direction of the chassis frame 1 to reduce space occupation. The first motherboard assembly 101 and the first component assembly 102 are respectively disposed on the front and rear sides of the signal connector 3, and the first motherboard assembly 101 and the first component assembly 102 communicate with each other through the signal connector 3.

[0056] In some implementation methods, please refer to Figure 12-1 and Figure 12-2The signal connector 3 is provided with a front signal connector 31 and a rear signal connector 32 on its front and rear sides, respectively. The front signal connector 31 has multiple layers and is arranged along the height direction of the signal connector 3. It is used to connect to the first component assembly 102 one by one. The rear signal connector 32 is used to connect to the first motherboard assembly 101. This facilitates signal connection, and the first component assemblies 102 of different layers can be connected to the first motherboard assembly 101 at the same time.

[0057] In some embodiments, the front signal connector 31 is a blind-mating signal connector, which can improve assembly efficiency and facilitate maintenance by blindly mating with the first component substrate 105 in the first component assembly 102. The rear signal connector 32 is a manual-mating signal connector, which is connected to the first motherboard assembly 101 via a motherboard cable. The rear signal connector 32 is manually connected to the first motherboard assembly 101, which is convenient for operation and makes the setting position of the first motherboard assembly 101 more flexible.

[0058] In some implementation methods, please refer to Figure 11-1 The manifold 4 is perpendicular to the base plate. The first mainboard assembly 101 and the first component assembly 102 are respectively located on the front and rear sides of the manifold 4. The front and rear sides of the manifold 4 are respectively provided with a front inlet / outlet 41 and a main inlet / outlet 42. The front inlet / outlet 41 is a blind-plug inlet / outlet for connecting to the first component assembly 102, and the main inlet / outlet 42 is for connecting to external cooling equipment. With this configuration, the manifold 4 is perpendicular to the base plate of the chassis frame 1, meaning it extends along the height of the chassis frame 1. This effectively reduces the horizontal space occupied by the manifold 4 within the chassis frame 1. Simultaneously, the first mainboard assembly 101 and the first component assembly 102 are respectively located on the front and rear sides of the manifold 4. The first component assembly 102 connects to the external cooling equipment through the manifold 4. Furthermore, the front inlet / outlet 41 is a blind-plug inlet / outlet, ensuring efficient water flow during actual use. The connection between the device 4 and the external cooling equipment remains unchanged. When the first component assembly 102 needs to be maintained, the first component assembly 102 is pulled out from the front window of the chassis frame 1, and the first component assembly 102 is automatically disconnected from the front inlet and outlet 41 of the water distributor 4 for easy operation. When the first component assembly 102 is installed, the first component assembly 102 is pushed into the inner cavity of the chassis frame 1 from the front window of the chassis frame 1, and the first component assembly 102 is automatically connected to the front inlet and outlet 41 of the water distributor 4.

[0059] In some embodiments, the front inlet / outlet 41 has multiple layers arranged along the height of the water distributor 4, each for corresponding communication with the first element assembly 102; for details, please refer to Figure 10-2 and Figure 16The first cold plate tray 103 is also provided with a blind-plug fluid connector 1037. The blind-plug fluid connector 1037 can be blindly connected to the front inlet and outlet 41 of the water distributor 4. The front inlet and outlet 41 includes several sets of inlet and outlet, each set of inlet and outlet is arranged along the height direction and corresponds to the position of the first cold plate tray 103. Each set of inlet and outlet includes an inlet and an outlet, allowing the cooling medium to flow into or out of the first cold plate tray 103, so as to realize the circulation of the cooling medium.

[0060] In some implementation methods, please refer to Figure 11-2 The manifold 4 is also provided with a rear inlet / outlet 43, which is used to connect to the first motherboard assembly 101. Specifically, the first motherboard assembly 101 includes a first motherboard 1011, a first CPU element and a first CPU cold plate 1012. The rear inlet / outlet 43 is connected to the first CPU cold plate 1012. Through the manifold 4, the liquid supply needs of the first CPU cold plate 1012 and each layer of the first cold plate tray 103 can be met at the same time.

[0061] In some embodiments, a plurality of fan frames 5 are also included. The fan frames 5 are disposed on the rear side of the inner cavity of the chassis frame 1. Each fan frame 5 is arranged along the left and right direction of the chassis frame 1. The fan frames 5 are used to install the fan module 400, so as to achieve the purpose of air cooling while liquid cooling. Furthermore, a water and electricity blind plug interface is provided on the rear window of the chassis frame 1. The water and electricity blind plug interface is used to connect to external cooling equipment and external power supply equipment, so as to facilitate the supply of power to the components inside the chassis frame 1.

[0062] In some implementation methods, please refer to Figure 7 and Figure 8 It also includes an input / output tray 6, which is mounted on the upper part of the first front window panel 11 of the chassis frame 1, so that the input / output tray 6 and the first component assemblies 102 of each layer are arranged sequentially along the height direction. The input / output tray 6 is used to install the hard drive 301, network card 302 and / or input / output card 303. The input / output tray 6 can be an I / O tray. Furthermore, the input / output tray 6 is also provided with a hard drive backplane 3011, and the hard drive 301 is connected to the hard drive backplane 3011 to facilitate data transmission. For details, please refer to [link / reference]. Figure 6The first front window panel 11 is also provided with a network card slot window 113, a hard disk slot window 114, and an input / output interface window 115. The hard disk 301, network card 302, and input / output card 303 are connected to external devices through the hard disk slot window 114, the network card slot window 113, and the input / output interface window 115, respectively. Furthermore, the side of the first front window panel 11 is also provided with a front window fixing ear 116. The first front window panel 11 is installed on the side plate of the chassis frame 1 through the front window fixing ear 116. The bottom of the first front window panel 11 is also provided with a bent edge. The bent edge extends horizontally and is provided with a front window fixing hole 112. The bent edge is fixed to the bottom plate of the chassis frame 1 through the front window fixing hole 112. The above configuration places the first component assembly 102 of each layer and the input / output tray 6 and all the components on it in the front window, making them easy to access and maintain. When maintenance is required on the first component assembly 102, the integrated first component assembly 102 can be pulled out from the front side of the chassis frame 1. The input / output tray 6 is installed on the upper part of the first front window panel 11 of the chassis frame 1, which will not affect the disassembly and assembly of the first component assembly 102, nor will it occupy too much space in the chassis frame 1. At the same time, it can also facilitate the connection of the hard drive 301, network card 302 and / or input / output card 303 on the input / output tray 6, making operation convenient.

[0063] In some embodiments, the input / output tray 6 is provided with a plurality of hard disk partitions 61 and / or a plurality of network card partitions 62. The hard disk partitions 61 and the network card partitions 62 are arranged along the left and right direction of the chassis frame 1. Hard disks 301 are installed between adjacent hard disk partitions 61, and network cards 302 are installed between adjacent network card partitions 62. By setting the hard disk partitions 61 and network card partitions 62, the hard disks 301 and network cards 302 can be better limited, ensuring their stability.

[0064] In some embodiments, the input / output tray 6 includes a tray connecting edge 63 and a tray supporting edge 64. The tray connecting edge 63 and the tray supporting edge 64 can be an integral structure, formed by bending a plate, resulting in high strength. The tray connecting edge 63 is used for fixed connection with the first front window panel 11 of the chassis frame 1, fixing the position of the input / output tray 6 without affecting the sliding maintenance of other structural components. The hard disk partition 61 and the network card partition 62 are both set on the tray supporting edge 64. Specifically, the tray connecting edge 63 of the input / output tray 6 has corresponding holes, corresponding to the positions of the hard disk slot window 114, the network card slot window 113, and the input / output interface window 115, respectively, facilitating the connection of the hard disk 301, network card 302, and input / output card 303 with external devices.

[0065] In some implementation methods, please refer to Figure 9 , Figure 10-1 and Figure 10-2It also includes a first type of component module 100 having a first motherboard assembly 101 and at least one first component assembly 102. The first component assembly 102 includes a first cold plate tray 103, and the first cold plate tray 103 is selectively placed within the receiving space. Further, the first component assembly 102 also includes a first component 104 and a first component substrate 105. The first component 104 is located between the first cold plate tray 103 and the first component substrate 105. The first component 104 can be an OAM GPU component, and the first component substrate 105 can be an OAM substrate. The first component 104 and the first component substrate 105 are electrically connected, and the first component 104 and the first component substrate 105 are arranged in a front-to-back direction. The first cold plate tray 103 is selectively placed on the sliding support 2 or the bottom plate of the chassis frame 1. For details, please refer to... Figure 15 The first component substrate 105 is provided with a substrate blind-mating connector 108, which is blind-mating connected to the front signal connector 31 of the signal connector 3. With the above configuration, the first type of component module 100 can be an OAM GPU component module. By setting the first component 104 and the first component substrate 105 on the first cold plate tray 103, the first cold plate tray 103 can not only serve as a cold plate, but also as a tray. The first component substrate 105 is generally connected with multiple first components 104, which are the heat sources that need to be cooled. By using an integrated first cold plate tray 103 to dissipate heat from multiple first components 104 on the entire first component substrate 105, the trouble of pipe connection in the cold plate design in related technologies is eliminated, and a large number of fluid connectors and pipes are also saved. The height layout can achieve the most optimized and compact design.

[0066] In one embodiment, a microfluidic chamber 1034 is provided inside the first cold plate tray 103 on the side near the first element 104. The microfluidic chamber 1034 is connected to the first element 104 in a one-to-one correspondence to conduct the heat of the first element 104 to the cooling medium in the microfluidic chamber 1034. The first cold plate tray 103 is provided with microfluidic channels 1033 and a main pipe 1035. The cooling medium flows into the interior of the first cold plate tray 103 through the main pipe 1035. The microfluidic channels 1033 can connect each microfluidic chamber 1034. Microfluidic shovel teeth 1036 can also be provided inside the first cold plate tray 103 to improve the heat exchange efficiency between the first cold plate tray 103 and the first element 104.

[0067] In some embodiments, the bottom left and right sides of the first cold plate tray 103 are provided with limiting grooves 1031, which are connected to the sliding support member 2. Specifically, by setting the limiting grooves 1031, the sliding support member 2 can be placed into the limiting grooves 1031, reducing the installation height of the first cold plate tray 103 located on the upper layer, thereby reducing the overall height. Furthermore, the first cold plate tray 103 can be designed by embedding copper pipes into an aluminum base, which facilitates the realization of a connected fluid domain. The inlet and outlet of the first cold plate tray 103 are both realized through blind-plug fluid connectors 1037. The limiting grooves 1031 on both sides of the bottom surface of the first cold plate tray 103 form a matching structure with the L-shaped sliding support member 2 in the chassis frame 1. Compared with the first cold plate tray 103 with a flat bottom surface, the design of adding limiting grooves 1031 can include the height of the L-shaped sliding support member 2 within the first cold plate tray 103, saving the overall height space of the system, which is an important part of the high-density system design.

[0068] In some embodiments, the first cold plate tray 103 is further provided with shielding edges 1032 on both the left and right sides. The first element 104 and the first element substrate 105 are located between the two shielding edges 1032, and the width of the first element substrate 105 in the left and right direction is adapted to the distance between the two shielding edges 1032 to position the first element substrate 105. Specifically, the shielding edges 1032 can be formed by extending and bending from both sides of the first cold plate tray 103. The setting of the shielding edges 1032 can limit the position of the first element substrate 105. When the first element substrate 105 is installed, the shielding edges 1032 can restrict its position in the left and right direction. At the same time, the shielding edges 1032 can also improve the bending stiffness of the first cold plate tray 103.

[0069] In some implementation methods, please refer to Figure 13 and Figure 14The first type of component module 100 also includes a network interface board 106, which can be a 4NIC board, that is, the network interface board 106 is provided with 4 NIC components. The network interface board 106 is located on the front side of the first cold plate tray 103. The network interface board 106 is provided with a plurality of network interface components 1061 and network interface bodies 1062. The network interface board 106 is located on the front side of the inner cavity of the chassis frame 1, and the network interface components 1061 are used to communicate with the first component 104, and the network interface bodies 1062 are used to communicate with external network devices. Furthermore, the first front window panel 11 is also provided with a network interface window 111, which corresponds to the position of the network interface body 1062. The first element 104 in the first type of component module 100 is connected to the network interface element 1061 through the switching element 107. The switching element 107 can be an SW (Switch) element, and the network interface element 1061 can be a NIC (Network Interface Card) element. The network interface element 1061 is then connected to external network devices through the network interface body 1062. Through integrated design, the height is reduced.

[0070] In some implementation methods, please refer to Figure 2 and Figure 4 The chassis frame 1 is also used to install a second type of component module 200. The second type of component module 200 includes a second motherboard assembly 201 and a second component assembly 202. The second motherboard assembly 201 and the second component assembly 202 are arranged along the front and rear direction of the chassis frame 1, and the second motherboard assembly 201 is located on the front side of the inner cavity of the chassis frame 1, so that the second motherboard assembly 201 can be pushed into the inner cavity of the chassis frame 1 through the front window of the chassis frame 1, which facilitates the installation and removal of the second motherboard assembly 201.

[0071] In some embodiments, a second type of component module 200 is further included, comprising a second motherboard assembly 201 and a second component assembly 202. The second component assembly 202 includes a second cold plate 2021 and a second component 2022, the second component 2022 being placed on the second cold plate 2021 and connected to the second motherboard assembly 201 via a component cable 2023. With this configuration, the chassis frame 1 can not only install the first type of component module 100 but also the second type of component module 200, which can be an ASIC. In the GPU component module, the second cold plate 2021 and the second component 2022 in the second type of component module 200 are stacked. The second component 2022 is set on the second cold plate 2021. The second cold plate 2021 and the second component 2022 are located on the rear side of the inner cavity of the chassis frame 1. The second motherboard assembly 201 is located on the front side of the inner cavity of the chassis frame 1. The second motherboard assembly 201 includes a second motherboard, a second CPU component, and a second CPU cold plate. The second CPU component is set on the second motherboard. By setting the second motherboard assembly 201 on the front side of the inner cavity of the chassis frame 1, the second motherboard assembly 201 can be pulled out or pushed in from the front side of the chassis frame 1, which facilitates the maintenance of the second motherboard assembly 201. Furthermore, the second motherboard assembly 201 and the second component assembly 202 are arranged in a front-to-back direction, which can make full use of the space in the lower part of the inner cavity of the chassis frame 1 and leave sufficient space for the component cables 2023, thereby realizing the adaptation of two different component modules, improving the applicability and reducing the mold opening cost.

[0072] The chassis provided by this invention is a heterogeneous server architecture with a computing power density of up to 8 GPUs / OU, supporting the OAM standard and compatible with ASIC flexible expansion. It reduces R&D costs through compatibility design and solves the triple challenges of computing power density bottlenecks, heat dissipation, and ecosystem compatibility. While inheriting the OCP standard rack interface (i.e., blind-plug power / liquid power supply), it overcomes the limitations of 2OU high server node architecture design, enabling support for 16 GPUs and 2 CPUs within a 2OU height (95mm), 21-inch width, and 974mm depth. The same chassis structure is compatible with OAM GPU component modules and custom ASIC GPU component modules of varying sizes, solving the layout difficulties of ASIC GPU component module cable management height >1U.

[0073] Specifically, in one embodiment, the chassis, without modifying standard components, can accommodate either a 16-OAM GPU module or a 16-ASIC GPU module configuration. ASIC GPU modules generally have dedicated application scenarios and do not have requirements for cluster size; therefore, only the PCIe interconnect between the CPU and GPU and the power supply connection between the GPU and the motherboard need to be addressed. ASICs are not interconnected with each other. Therefore, the main challenge in configuring ASIC GPU modules is the large number of cables and the significant space required for them. This solution's OAM configuration provides more interconnect expansion capabilities to the system topology. Referring to the OCP industry standard, eight OAM GPU module cards are mounted on the OAM board, enabling full interconnection of all eight cards within the board. The OAM board also integrates two PCIe switch (SW) components. The SW components interconnect upstream to the CPU, and each SW component connects to four OAM and four NIC components. Therefore, each GPU can access a large-scale Ethernet cluster via the NIC components.

[0074] Furthermore, the chassis dimensions are 2OU in height, 21 inches in width, and 974mm in depth, ensuring compatibility with OCP V3 racks. Under the same configuration target (16 GPUs + 2 CPUs), height and depth are difficult to control; this solution represents the optimal layout architecture for current device specifications. An L-shaped sliding support 2 is provided on the side wall of the chassis to support the sliding assembly of the first cold plate tray 103. A fan frame 5 is located on the rear side of the chassis. In the OAM configuration, the chassis has reserved mounting positions for signal connectors 3 and manifolds 4 in the middle. Cooling medium flows from the main pipe 1035 into each microchannel chamber 1034, where heat is carried away by the microchannel teeth 1036, finally converging back into the main pipe 1035 and returning to the manifold 4 via blind-fit fluid connectors 1037. The surface of the microchannel 1033 chambers is attached to the OAM GPU components for direct heat transfer. The internal pipes of the water manifold 4 connect the two first cold plate trays 103, the first CPU cold plate 1012, and the main inlet / outlet. The two first CPU cold plates 1012 can share a single inlet / outlet pipe. In the inlet direction, the fluid from the main inlet is distributed to the two first cold plate trays 103 and the first CPU cold plate 1012. In the outlet direction, the three streams of fluid are combined and sent out of the chassis. The signal connector 3 is a high-speed signal backplane with two high-density blind-mating connectors integrated on the front. The OAM board can be blind-mated. The back panel integrates four hand-plug connectors, which are interconnected with the motherboard's MC input / output (Mini Cool Edge I / O) connectors via motherboard cables; the first component substrate 105 mainly integrates eight OAM GPU components, and two 4NIC boards are mounted on the front; a high-density blind-mating connector is provided on the rear edge, which blind-mating with the signal connector 3; the network interface board 106 integrates four NIC components and four network interfaces, which are generally OSFP / QSFP, for OAM network expansion.

[0075] Furthermore, the high-density configuration of the 16 OAM GPU component module requires blind-plugging of the manifold 4 and signal connector 3, forming a compact 3-layer structure with the input / output tray 6 and the two first cold plate trays 103. The first cold plate trays 103 are plugged in and out from the front window, thus achieving maintainability; maintenance of any component in the entire system does not require additional disassembly of other modules. In the configuration of the 16 ASIC GPU component module, due to the smaller size of the GPU components, they can be laid flat with the second motherboard. Moreover, after the ASIC GPU components are connected to the component cables 2023, the overall height is relatively high, and the flat layout also frees up the height space above the ASIC GPU components for the placement of the component cables 2023; the I / O tray is still located above the second front window panel 12, and the two configurations share the structure of the I / O tray.

[0076] The reusable hardware in this chassis includes: chassis frame 1, front panel, I / O tray, CPU cooler, fan module 400, motherboard and other onboard components, I / O cards, hard drive 301, network card 302, and hard drive backplate 3011. In the ASIC GPU component module configuration, a second cooler 2021 is required. In the OAM GPU component module configuration, only the second cooler 2021 needs to be replaced, using the first cooler tray 103, manifold 4 and its piping, signal connector backplate 3, OAM board, and 4NIC board.

[0077] The chassis has the following beneficial effects.

[0078] 1. Improved Space Efficiency: In this architecture, all devices on the OAM substrate are cooled by an integrated first cold plate tray 103. The blind-mating fluid connector 1037, the integrated design of the cold plate and tray, and the limiting grooves 1031 on both sides achieve convenient maintenance and sufficient support rigidity of the OAM substrate within a minimized thickness. In addition to accommodating two layers of OAM substrates, the front window panel can also support other components on the input / output trays. The entire system integrates 16 OAM GPUs + 2 CPUs within a 2OU space, achieving a computing density of 8 GPUs / OU, which is 100% higher than traditional solutions.

[0079] 2. Architecture compatibility: Under the premise that key hardware (structural and electronic) is compatible and reusable, it can switch between OAM and ASIC configuration forms, achieving one development cost, one development process, and supporting multiple component ecosystems.

[0080] 3. Convenient Maintainability: In this architecture, the rear window only has fan and rack-level water and electricity blind-plug interfaces. All maintainable components and I / O interfaces are located in the front window and are easily accessible. In the OAM configuration, when maintaining the OAM, the integrated first cold plate tray 103 can be pulled out from the front window. The liquid cooling fluid is automatically disconnected as the interface is removed, and the blind-plug connector 108 on the OAM substrate also automatically disconnects. Conversely, after inserting the first cold plate tray 103, the signal and fluid are automatically connected. In the ASIC configuration, the ASIC GPU components are arranged flat with the second motherboard, allowing direct maintenance of the ASIC GPU or CPU without interference.

[0081] In addition to the aforementioned chassis, the present invention also provides an electronic device including the aforementioned chassis. For the structure of other parts of the electronic device, please refer to the relevant technology, which will not be described in detail here.

[0082] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0083] The chassis and electronic equipment provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A chassis, characterized in that, include: A chassis frame (1) is used to selectively mount either a first type of component module (100) or a second type of component module (200); the first type of component module (100) includes a first motherboard assembly (101) and at least one layer of first component assembly (102), the first component assembly (102) and the first motherboard assembly (101) being arranged along the front-back direction of the chassis frame (1); the second type of component module (200) includes a second motherboard assembly (201) and a second component assembly (202) connected by component cables (2023), the second motherboard assembly (201) and the second component assembly (202) being arranged along the front-back direction of the chassis frame (1); A sliding support (2) is disposed on the inner cavity sidewall of the chassis frame (1) and extends along the front-rear direction of the chassis frame (1) to form a plurality of accommodating spaces arranged in the height direction within the chassis frame (1); one of the first component assemblies (102) is placed in the accommodating space; the second motherboard assembly (201) and the second component assembly (202) are located in the lower accommodating space, and the component cable (2023) is located in the upper accommodating space.

2. The chassis according to claim 1, characterized in that, Also includes: A signal connector (3) is used to connect the first component assembly (102) and the first motherboard assembly (101). The signal connector (3) is detachably disposed within the chassis frame (1). The water distribution manifold (4) is used to connect the first element assembly (102) of each layer with the external cooling equipment. The water distribution manifold (4) is detachably installed inside the chassis frame (1).

3. The chassis according to claim 1, characterized in that, The sliding support (2) is disposed on the inner cavity sidewall of the chassis frame (1) in the left-right direction, and the sliding support (2) extends in the front-back direction; the first element assembly (102) is slidably connected to the sliding support (2) or the bottom plate of the chassis frame (1).

4. The chassis according to claim 3, characterized in that, The chassis frame (1) is provided with multiple sliding support members (2) on the two inner cavity sidewalls along the left and right directions. Each sliding support member (2) is arranged at intervals along the height direction of the chassis frame (1). The sliding support members (2) on the two inner cavity sidewalls correspond one to one.

5. The chassis according to claim 3, characterized in that, The sliding support (2) is plate-shaped. The sliding support (2) is provided with a sliding connecting edge (21) and a sliding support edge (22). The sliding support edge (22) is perpendicular to the sliding connecting edge (21). The sliding connecting edge (21) is fixed on the chassis frame (1). The sliding support edge (22) is used to support the first component assembly (102).

6. The chassis according to claim 2, characterized in that, The signal connector (3) is plate-shaped, perpendicular to the bottom plate of the chassis frame (1), and extends along the left and right directions of the chassis frame (1); the first motherboard assembly (101) and the first component assembly (102) are respectively disposed on the front and rear sides of the signal connector (3); the front and rear sides of the signal connector (3) are respectively provided with a front signal connector (31) and a rear signal connector (32), the front signal connector (31) has multiple layers, arranged along the height direction of the signal connector (3), and is used to connect one-to-one with the first component assembly (102), and the rear signal connector (32) is used to connect with the first motherboard assembly (101).

7. The chassis according to claim 2, characterized in that, The water distribution manifold (4) is set perpendicular to the bottom plate of the chassis frame (1). The first motherboard assembly (101) and the first component assembly (102) are respectively set on the front and rear sides of the water distribution manifold (4). The front and rear sides of the water distribution manifold (4) are respectively provided with a front water inlet / outlet (41) and a main water inlet / outlet (42); and / or, the front water inlet / outlet (41) is a blind-plug water inlet / outlet for communicating with the first component assembly (102), and the main water inlet / outlet (42) is for communicating with the external cooling equipment.

8. The chassis according to claim 7, characterized in that, The front inlet and outlet (41) has multiple layers, arranged along the height direction of the water distributor (4), and is used to communicate with the first element assembly (102) one by one. And / or, the rear side of the water distribution manifold (4) is also provided with a rear inlet / outlet (43), which is used to connect to the first main board assembly (101).

9. The chassis according to claim 1, characterized in that, It also includes several fan frames (5), which are located on the rear side of the inner cavity of the chassis frame (1). Each fan frame (5) is arranged along the left and right direction of the chassis frame (1). The fan frames (5) are used to install fan modules (400).

10. The chassis according to claim 1, characterized in that, It also includes an input / output tray (6), which is mounted on the upper part of the first front window panel (11) of the chassis frame (1) so that the input / output tray (6) and the first element assembly (102) of each layer are arranged sequentially in the height direction.

11. The chassis according to claim 10, characterized in that, The input / output tray (6) is provided with a plurality of hard disk partitions (61) and / or a plurality of network card partitions (62). The hard disk partitions (61) and the network card partitions (62) are arranged along the left and right directions of the chassis frame (1). Hard disks (301) are installed between adjacent hard disk partitions (61), and network cards (302) are installed between adjacent network card partitions (62).

12. The chassis according to claim 11, characterized in that, The input / output tray (6) includes a tray connecting edge (63) and a tray bearing edge (64). The tray connecting edge (63) is used to be fixedly connected to the first front window panel (11) of the chassis frame (1). The hard disk partition (61) and the network card partition (62) are both disposed on the tray bearing edge (64).

13. The chassis according to any one of claims 1 to 12, characterized in that, It also includes a first type of component module (100) having the first motherboard assembly (101) and at least one layer of the first component assembly (102), the first component assembly (102) including a first cold plate tray (103), and the first cold plate tray (103) is selectively placed in the accommodating space.

14. The chassis according to claim 13, characterized in that, The first component assembly (102) further includes a first component (104) and a first component substrate (105). The first component (104) is located between the first cold plate tray (103) and the first component substrate (105). The first component (104) is in communication with the first component substrate (105), and the first component (104) and the first component substrate (105) are arranged in the front-back direction.

15. The chassis according to claim 14, characterized in that, The bottom left and right sides of the first cold plate tray (103) are provided with limiting grooves (1031), and the limiting grooves (1031) are connected to the sliding support (2).

16. The chassis according to claim 14, characterized in that, The first cold plate tray (103) is provided with shielding edges (1032) on the left and right sides. The first element (104) and the first element substrate (105) are located between the two shielding edges (1032), and the width of the first element substrate (105) in the left and right direction is adapted to the distance between the two shielding edges (1032) to position the first element substrate (105).

17. The chassis according to claim 14, characterized in that, The first type of component module (100) also includes a network interface board (106), which is disposed on the front side of the first cold plate tray (103). The network interface board (106) is provided with a plurality of network interface elements (1061) and a network interface body (1062). The network interface board (106) is located on the front side of the inner cavity of the chassis frame (1), and the network interface elements (1061) are used to communicate with the first component (104), and the network interface body (1062) is used to communicate with external network devices.

18. The chassis according to any one of claims 1 to 12, characterized in that, It also includes a second type of component module (200), wherein the second motherboard assembly (201) is located on the front side of the inner cavity of the chassis frame (1) so that the second motherboard assembly (201) is pushed into the inner cavity of the chassis frame (1) through the front window of the chassis frame (1).

19. The chassis according to claim 18, characterized in that, The second component assembly (202) includes a second cold plate (2021) and a second component (2022), the second component (2022) is placed on the second cold plate (2021), and the second component (2022) is connected to the second motherboard assembly (201) via the component cable (2023).

20. An electronic device, comprising a chassis, characterized in that, The chassis is the chassis as described in any one of claims 1 to 19.

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