A dynamic electrical connection mechanism, electroplating apparatus and method

Abstract

The application discloses a dynamic electric connection mechanism, an electroplating device and a method. The dynamic electric connection mechanism comprises a fixed base assembly, a moving slide assembly driven by a cam driving assembly to move linearly back and forth, and a dynamic conductive path composed of conductive slides, the conductive slides keep sliding contact with static power supply terminals on the fixed base assembly in the whole moving process, thereby establishing a continuous and stable electric connection between the moving component and the power supply. The moving slide assembly is provided with the conductive slides on opposite sides respectively, forming parallel redundant current paths, which greatly improve the reliability and fault tolerance of the connection. The mechanism is applied to the electroplating device, drives the carrier hanger serving as a cathode to move back and forth and synchronously supplies power, and in combination with symmetrical spraying, can effectively remove bubbles in the holes of workpieces, ensure uniform current distribution, and significantly improve the uniformity and quality of the plating layer of semiconductor TGV deep hole electroplating.

Description

Technical Field

[0001] This invention relates to the field of electrical connection devices and mechatronics equipment, specifically to a dynamic electrical connection mechanism, electroplating device and method. Background Technology

[0002] In many industrial production and experimental processes, it is often necessary to continuously supply power or transmit signals to objects in motion. For example, in fields such as precision electroplating, electrolytic machining, automated testing, and dynamic electric heating, working parts need to maintain a reliable electrical connection with a fixed power source or controller while performing linear reciprocating, rotational, or other complex movements.

[0003] Currently, common solutions for electrical connection of moving parts have many shortcomings: when using drag chain cables, repeated bending of the cables can easily lead to fatigue fracture, resulting in limited lifespan and additional resistance; conductive slip rings are mainly suitable for rotary motion and cannot be directly applied to high-frequency linear reciprocating scenarios; while segmented power supply may cause momentary disconnection of the connection, which cannot meet the requirements of precision processes (such as electroplating) that require continuous and stable current.

[0004] Especially in the TGV deep-hole plating process in semiconductor manufacturing, the substrate requires high-frequency, small-amplitude reciprocating oscillation to optimize plating solution exchange and bubble removal. Traditional equipment typically separates the drive mechanism from the conductive mechanism, causing the electrical connection points at the moving joints to experience fluctuations in contact resistance or even momentary disconnection due to vibration. This results in unstable plating current, severely affecting the uniformity of the plating layer and the filling quality within the holes. Therefore, developing a mechanism that organically integrates high-precision reciprocating linear drive with continuous and stable electrical connection is of great significance for improving the quality and reliability of processes such as precision electroplating. Summary of the Invention

[0005] The primary objective of this invention is to provide a dynamic electrical connection mechanism to solve the problems of easy interruption of electrical connection and unstable resistance of moving parts during reciprocating linear motion in the prior art.

[0006] Another object of the present invention is to provide an electroplating apparatus including the above-described dynamic electrical connection mechanism, which can significantly improve the stability of the current and the uniformity of the workpiece surface treatment in the electroplating process.

[0007] Another object of the present invention is to provide an electroplating method using the above-described electroplating apparatus.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0009] According to a first aspect of the present invention, a dynamic electrical connection mechanism is provided, comprising a fixed base assembly, a moving carriage assembly, a cam drive assembly, and an electrical connection system.

[0010] The motion carriage assembly is mounted on the fixed base assembly in a reciprocating linear motion.

[0011] The cam drive assembly is mounted on the fixed base assembly, and its power output end is connected to the motion carriage assembly for driving the motion carriage assembly to perform smooth reciprocating linear motion.

[0012] The electrical connection system includes an integrated electrical connection interface disposed on the motion carriage assembly, a static power supply terminal fixedly mounted on the fixed base assembly, and a dynamic conductive path disposed on the motion carriage assembly. One end of the dynamic conductive path is electrically connected to the integrated electrical connection interface, and the other end maintains sliding contact with the static power supply terminal throughout the entire reciprocating motion stroke of the motion carriage assembly, thereby establishing a continuous and stable electrical connection from the external power source to the external load during the motion process.

[0013] Preferably, the fixed base assembly includes at least two parallel sliding seats, each sliding seat having a sliding guide portion; both ends of the motion carriage assembly are slidably engaged with the sliding guide portions.

[0014] Preferably, the cam drive assembly includes a drive motor, a cam driven by the drive motor, and a driven connector disposed on the motion carriage assembly. The cam cooperates with the driven connector to convert rotational motion into linear reciprocating motion.

[0015] Preferably, the dynamic conductive path includes a conductive slide plate fixedly installed on the motion slide assembly, and the static power supply terminal is an electrical connection part that slides in contact with the conductive slide plate.

[0016] More preferably, the conductive slide pieces are fixedly provided on opposite sides of the motion carriage assembly; each conductive slide piece is electrically connected to the integrated electrical connection interface and slides in contact with the corresponding static power supply terminal.

[0017] More preferably, the conductive slider has an electrical connection groove, and part of the structure of the static power supply terminal is housed in the electrical connection groove.

[0018] Furthermore, the static power supply terminal is electrically connected to the conductive slider via a sliding contact, and the sliding contact can be one or more of the following: elastic pressing, slip ring brush structure, or track slider structure.

[0019] Preferably, the integrated electrical connection interface is a snap-fit ​​structure or plug-in structure disposed on the motion carriage assembly for detachable installation of the material hanger.

[0020] According to a second aspect of the present invention, an electroplating apparatus is provided, comprising an electroplating tank, a dynamic electrical connection mechanism as described in any one of the preceding claims, a spray system, and an anode assembly. The dynamic electrical connection mechanism is mounted above the electroplating tank, and a material carrier serving as a cathode is mounted on its integrated electrical connection interface; the spray system is used to spray electroplating solution onto the workpiece; and the anode assembly is disposed within the electroplating tank.

[0021] Preferably, the spraying system includes a first spraying unit and a second spraying unit symmetrically arranged on opposite sides of the electroplating tank, and the dynamic electrical connection mechanism drives the material carrier to reciprocate in the area between the first spraying unit and the second spraying unit.

[0022] According to a third aspect of the present invention, an electroplating method is provided, using the above-described electroplating apparatus, comprising: mounting a workpiece on a material carrier; activating a dynamic electrical connection mechanism to drive the workpiece to reciprocate; activating a spray system and connecting a power source, and performing electroplating while the workpiece is in continuous motion.

[0023] Compared with the prior art, the technical solution provided by the present invention has the following significant advantages:

[0024] 1. Achieved highly reliable dynamic electrical connection: By integrating a dynamic conductive path into the moving carriage assembly and maintaining continuous sliding contact with the static power supply terminal, the core problem of easy interruption of electrical connection and resistance fluctuation in reciprocating motion of moving parts is fundamentally solved, ensuring the physical continuity and electrical stability of current transmission.

[0025] 2. Redundant design significantly improves fault tolerance and current sharing: The conductive sliders on both sides form parallel redundant current paths. This design not only ensures circuit continuity even when a momentary malfunction occurs at one contact point, greatly improving system reliability, but also helps to distribute current more evenly to the load, which is especially important for precision electroplating processes that require highly uniform current.

[0026] 3. Optimized structure and reliable contact: The electrical connection groove on the conductive slider forms an enclosing fit with the static power supply terminal, enhancing contact stability and alignment tolerance. Furthermore, the sliding contact method can be selected from mature elastic pressing, slip ring brush, or track slider structures, flexibly adapting to the application scenario, all ensuring low resistance and long lifespan sliding electrical contact.

[0027] 4. Significantly Optimizes Precision Electroplating Processes: Applying this mechanism to electroplating equipment allows the workpiece to oscillate at high frequency while receiving a continuous and stable cathode current. Combined with symmetrical spraying, it efficiently removes air bubbles from deep holes, greatly improving the electroplating solution exchange efficiency, thereby significantly enhancing the uniformity, consistency, and fill rate of the plating layer on deep-hole structures such as semiconductor TGV.

[0028] 5. High integration and versatility: This mechanism deeply integrates precision driving and stable conductivity functions, resulting in a compact structure. As a basic electromechanical unit, it is not only specifically designed for the electroplating field but can also be widely used in any industrial application requiring reliable power or signal transmission in linear reciprocating motion. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the electroplating apparatus in one embodiment of the present invention.

[0030] Figure 2 for Figure 1 A partial top view of the embodiment shown.

[0031] Figure 3 for Figure 1 The illustrated embodiment is shown as a partial cross-sectional view along the central axis.

[0032] Figure 4 This is a partial three-dimensional exploded view of the electroplating tank assembly in an electroplating apparatus.

[0033] Figure 5 This is a schematic diagram illustrating the piping layout of a sprinkler system.

[0034] Figure 6 This is a detailed three-dimensional structural diagram of the spray pipe and nozzle parts in the spray assembly.

[0035] Figure 7 This is a three-dimensional structural diagram of the core of this invention—the dynamic electrical connection mechanism.

[0036] Figure 8 This is a three-dimensional structural diagram of the dynamic electrical connection mechanism from another angle.

[0037] Figure 9 This is a three-dimensional structural diagram of the stirring device used in the temperature control system of an electroplating apparatus.

[0038] Figure label:

[0039] 1: Electroplating tank assembly; 11: Upper electroplating tank; 12: Lower return tank; 13: Return pipeline; 14: Return pump; 15: Filter screen; 16: Cleaning hole; 17: Cleaning valve; 18: Mounting bracket;

[0040] 2: First spray system; 3: Second spray system; 21: Liquid supply tank; 22: Liquid supply pump; 23: Spray assembly; 24: Main liquid supply pipe; 25: Sub-liquid supply pipe; 26: Spray pipe; 27: Nozzle;

[0041] 4: Temperature-controlled circulation system; 41: Temperature-controlled tank; 42: Temperature-controlled delivery pump; 43: Temperature-controlled liquid supply pipeline; 44: Overflow port; 45: Stirring device; 46: Stirring motor; 47: Stirring section; 48: Stirring sleeve; 49: Drain hole;

[0042] 5: Dynamic electrical connection mechanism; 51: Material carrier; 52: Cam drive assembly; 53: Sliding seat; 54: Motion carriage assembly; 55: Drive motor; 56: Cam; 57: Driven connector; 58: Sliding guide; 59: Conductive slide; 60: Electrical connection groove;

[0043] 6: Flow equalization plate; 7: Anode plate; 8: Heating device; 9: Water level detection device; 10: Temperature detection device. Detailed Implementation

[0044] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0045] Example 1: Dynamic Electrical Connection Mechanism

[0046] Please see Figure 7 and Figure 8 This embodiment describes in detail the core of the present invention—the dynamic electrical connection mechanism 5.

[0047] The fixed base assembly mainly includes two parallel and fixedly installed elongated sliding seats 53. Each sliding seat 53 is provided with a precision sliding guide 58, such as a linear guide or a precision V-groove.

[0048] The motion carriage assembly 54 is a frame structure with sufficient rigidity. Its two ends are slidably engaged with the sliding guide part 58 on the sliding seat 53 through sliders or guide wheels, thereby constraining it to only be able to perform high-precision linear reciprocating motion in the horizontal direction.

[0049] The cam drive assembly includes a drive motor 55 and a cam 56. The drive motor 55 is fixedly mounted, and its output shaft drives the cam 56 to rotate. A driven connector 57 is fixedly mounted on the motion carriage assembly 54, and the outer edge of the cam 56 mates with the driven connector 57. When the drive motor 55 drives the cam 56 to rotate, its eccentric action pushes the motion carriage assembly 54 to reciprocate. The profile curve of the cam 56 is designed to achieve smooth, shock-free reciprocating motion, making it particularly suitable for high-frequency, short-stroke applications.

[0050] The electrical connection system is key to achieving stable power supply under dynamic conditions.

[0051] Integrated electrical connection interface: Located in the middle of the motion carriage assembly 54, the diagram shows a snap-fit ​​structure for quick installation and locking of the load hanger 51. This interface is connected to the dynamic conductive path via a conductor inside the motion carriage assembly 54 or directly through the conductive frame material.

[0052] Static power supply terminal: This is a long, strip-shaped conductor, such as a copper busbar (not shown separately in the figure; its function is to mate with the electrical connection groove 60). It is fixed parallel to the inside or above the sliding seat 53 by an insulating support, and its position is parallel to the movement trajectory of the moving carriage assembly 54. The static power supply terminal is connected to an external power source (such as the negative terminal of an electroplating rectifier).

[0053] The dynamic conductive path consists of conductive sliders 59 fixed on both sides of the motion carriage assembly 54. The conductive sliders 59 are made of wear-resistant conductive material (such as phosphor bronze or gold-plated copper). Preferably, the conductive sliders 59 have elongated electrical connection grooves 60, into which the conductive strip of the static power supply terminal can be embedded, forming an enclosed sliding contact pair, which helps maintain the alignment and stability of the contact. The conductive sliders 59 on both sides are electrically connected in parallel through the metal frame or internal wires of the motion carriage assembly 54, and are jointly connected to the integrated electrical connection interface.

[0054] The sliding contact between the static power supply terminal and the conductive slider 59 can be achieved using various reliable methods known in the art. For example, an elastic pressing method can be used, where a spring component is provided on the static power supply terminal or the conductive slider 59 to ensure constant contact pressure; alternatively, the principle of slip ring brushes can be adopted, using multiple independent elastic brushes as contact points; or the simplest track slider structure can be used, where the conductive slider 59 slides directly on the surface of the static power supply terminal, which serves as a track. All these methods can achieve low-resistance, long-life sliding electrical contact.

[0055] This establishes a dynamic current path with redundancy: external power supply negative terminal → static power supply terminals on both sides → sliding contact points on both sides → conductive sliders 59 on both sides → moving carriage assembly 54 → integrated electrical connection interface → material carrier 51 → workpiece. This design ensures that good contact on either side maintains circuit continuity, achieving extremely high connection reliability, fault tolerance, and uniform current distribution.

[0056] Example 2: Electroplating apparatus with dynamic electrical connection mechanism

[0057] Please see Figures 1 to 6 and Figure 9 In this embodiment, the dynamic electrical connection mechanism 5 described above is applied to a high-performance semiconductor electroplating device.

[0058] The device as a whole includes: an electroplating tank assembly 1, a dynamic electrical connection mechanism 5, a spray system, an anode system, and a temperature control circulation system 4.

[0059] The electroplating tank assembly 1 includes an upper electroplating tank 11 and a lower reflux tank 12, which are separated by an inclined filter screen 15 to facilitate the separation of settled solid impurities. The lower reflux tank 12 is connected to the supply tank 21 of the spray system through a reflux pipe 13 and a reflux pump 14 to form a spray circulation of the electroplating solution.

[0060] The dynamic electrical connection mechanism 5 spans and is securely mounted across the top opening of the upper electroplating tank 11. The material carrier 51 connected to the lower part of its motion carriage assembly 54 is vertically immersed in the electroplating solution of the upper electroplating tank 11 for loading semiconductor wafers or TGV glass substrates, etc.

[0061] The spray system consists of a first spray unit 2 and a second spray unit 3 symmetrically arranged on both sides of the electroplating tank along its length. Each unit includes a liquid supply tank 21, a liquid supply pump 22, and a spray assembly 23. The spray assembly 23 consists of a main liquid supply pipe 24, multiple branch liquid supply pipes 25, and densely arranged spray pipes 26, each equipped with multiple nozzles 27. The nozzles 27 of the two units spray towards each other, completely covering the area where the material carrier 51 and the workpiece on it are located.

[0062] The anode system includes two anode plates 7 (such as titanium baskets or inert anodes), which are adjustablely mounted on the inner walls of the upper electroplating tank 11 on both sides via mounting brackets 18, located outside the spray assembly 23. Between the anode plates 7 and the spray assembly 23, a flow equalization plate 6 with uniformly spaced small holes is also provided to uniformly distribute the electric field and liquid flow.

[0063] The temperature-controlled circulation system 4 is a closed-loop system independent of the spray circulation. It includes a temperature-controlled tank 41, a temperature-controlled delivery pump 42, and a temperature-controlled liquid supply pipeline 43. The temperature-controlled tank 41 is equipped with a heating device 8, a temperature detection device 10, and a water level detection device 9. The temperature-controlled delivery pump 42 pumps the electroplating solution, which has been conditioned in the temperature-controlled tank 41, into the bottom of the upper electroplating tank 11, causing the liquid in the tank to rise gently and flow back to the temperature-controlled tank 41 from the overflow port 44. This circulation ensures that the liquid temperature in the entire tank is uniform and constant. This design isolates the heater from the main process tank, making it safer. Optionally, a stirring device 45 can also be installed in the temperature-controlled tank 41 for rapid mixing when adding chemical raw materials. Its specially designed stirring sleeve 48 and drain hole 49 can form local vortices, improving mixing efficiency.

[0064] Example 3, Electroplating method:

[0065] Based on the apparatus of Embodiment 2, this embodiment provides an optimized electroplating method, particularly suitable for deep hole electroplating of semiconductor TGV:

[0066] S1: Pretreatment and clamping: Perform standard pretreatments such as cleaning, activation, and micro-etching on the TGV glass substrate. Then reliably mount it on the carrier hanger 51.

[0067] S2: System preheating and start-up: Turn on the temperature control circulation system 4 to heat the electroplating solution to the process set temperature (e.g., 50℃±0.5℃) and keep it stable. Start the drive motor 55 of the dynamic electrical connection mechanism 5 so that the material carrier 51 can drive the substrate in an unloaded state at the process set frequency (e.g., 1 Hz) and stroke (e.g., ±30 mm) to confirm smooth movement.

[0068] S3: Immersion and Process Start-up: Smoothly immerse the material carrier 51, which is in a reciprocating oscillating state, into the electroplating solution that has been kept at a constant temperature. Start the first spray unit 2, the second spray unit 3, and the reflux pump 14 sequentially to establish a stable spray flow field. After the flow field stabilizes, connect the electroplating power supply, apply cathode current to the static power supply terminal of the dynamic electrical connection mechanism 5, and apply anodic current to the anode plate 7 to formally begin electroplating.

[0069] S4: Dynamic Electroplating Process: Throughout the entire electroplating cycle, the substrate is maintained in a reciprocating oscillation, with symmetrical spraying on both sides and a constant current or constant voltage electroplating mode. The dynamic electrical connection mechanism 5 ensures that the cathode current is continuously, stably, and without fluctuations transmitted to the workpiece throughout the entire process.

[0070] S5: Post-treatment: After the predetermined electroplating time or target plating thickness is reached, first disconnect the electroplating power supply, then stop the spray system, and finally stop the drive of the dynamic electrical connection mechanism 5 and lift the material carrier 51 out of the liquid surface. Perform post-treatments such as water washing and drying on the electroplated workpiece.

[0071] This invention creatively combines smooth mechanical motion with absolutely stable electrical energy transmission through the aforementioned dynamic electrical connection mechanism, electroplating apparatus including the mechanism, and corresponding electroplating method, providing an effective solution for precision electroplating with high uniformity and high plating depth.

[0072] The above description is only a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. Any equivalent modifications or changes made by those skilled in the art based on the content disclosed in the present invention should be included within the scope of protection set forth in the claims.

Claims

1. A dynamic electrical connection mechanism, comprising: The fixed base assembly is characterized in that it further includes: The motion carriage assembly (54) is reciprocally and linearly mounted on the fixed base assembly; A cam drive assembly is mounted on the fixed base assembly, and its power output end is connected to the motion carriage assembly (54) for driving the motion carriage assembly (54) to perform reciprocating linear motion. An integrated electrical connection interface is provided on the motion carriage assembly (54) for the detachable installation of the loading hanger (51) using a snap-fit ​​structure or a plug-in structure. A static power supply terminal is fixedly installed on the fixed base assembly and is used to connect to an external power source; The motion carriage assembly (54) is provided with a dynamic conductive path. One end of the dynamic conductive path is electrically connected to the integrated electrical connection interface, and the other end is always in sliding contact with the static power supply terminal during the entire reciprocating motion stroke of the motion carriage assembly (54) so ​​as to establish a continuous electrical connection from the external power supply to the external load during the motion process. The fixed base assembly includes at least two parallel sliding seats (53), each sliding seat (53) is provided with a sliding guide (58); the two ends of the motion carriage assembly (54) are respectively slidably engaged with the sliding guide (58); the cam drive assembly includes a drive motor (55), a cam (56) driven by the drive motor (55), and a driven connector (57) provided on the motion carriage assembly (54), the cam (56) and the driven connector (57) cooperate to convert the rotational motion into linear reciprocating motion; The dynamic conductive path includes conductive slides (59) fixedly installed on the motion carriage assembly (54), and conductive slides (59) are fixedly provided on opposite sides of the motion carriage assembly (54); each of the conductive slides (59) is electrically connected to the integrated electrical connection interface and slides in contact with the corresponding static power supply terminal; An electrical connection groove (60) is provided on the conductive slider (59), and part of the structure of the static power supply terminal is housed in the electrical connection groove.

2. The dynamic electrical connection mechanism according to claim 1, characterized in that: The static power supply terminal is an electrical connection part that slides in contact with the conductive slider (59).

3. The dynamic electrical connection mechanism according to claim 2, characterized in that: The static power supply terminal is electrically connected to the conductive slider (59) through a sliding contact, wherein the sliding contact is one or more of the following: elastic pressing, slip ring brush structure, or track slider structure.

4. An electroplating apparatus, characterized in that, include: Electroplating tank; The dynamic electrical connection mechanism as described in any one of claims 1 to 3 has a fixed base assembly installed above the electroplating tank, and a material carrier (51) serving as a cathode is installed on its integrated electrical connection interface. A spraying system is installed inside the electroplating tank and is used to spray electroplating liquid onto the workpiece on the material carrier (51). The anode assembly is located inside the electroplating tank.

5. The electroplating apparatus according to claim 4, characterized in that: The spraying system includes a first spraying unit and a second spraying unit symmetrically arranged on opposite sides of the electroplating tank. The dynamic electrical connection mechanism drives the material carrier (51) to reciprocate in the area between the first spraying unit and the second spraying unit.

6. An electroplating method, using the electroplating apparatus as described in claim 4 or 5, characterized in that, Includes the following steps: The workpiece to be electroplated is mounted on the material carrier (51); The cam drive assembly of the dynamic electrical connection mechanism is activated to drive the material carrier (51) and the workpiece to reciprocate in the electroplating solution; Start the spray system, connect the negative terminal of the static power supply to the dynamic electrical connection mechanism, and connect the positive terminal of the power supply to the anode assembly to begin electroplating; During the electroplating process, the workpiece is kept in reciprocating motion.

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