Temperature sensor, circuit board assembly and electrical equipment

Abstract

The invention discloses a temperature sensor, a circuit board assembly and electrical equipment, the temperature sensor comprises a sensor main body and a pin, one end of the sensor main body in a first direction is an acquisition end for acquiring temperature, and the pin is exposed out of the other end of the sensor main body in the first direction; the first direction is the distribution direction of the sensor main body and the pins; at least part of at least one of the sensor main body and the pins in the first direction is an elastic assembly, and the elastic assembly deforms along the first direction. In the temperature sensor, an acquisition end of a sensor main body can acquire the temperature of a to-be-detected piece, the temperature acquired by the sensor main body is output outwards through a pin, the temperature of the to-be-detected piece is obtained, and temperature detection of an electronic component is realized; the distance between the acquisition end and the pin in the first direction is adjusted through the shape of the elastic assembly in the first direction, so that the temperature sensor can adapt to the change of the distance between the to-be-tested piece and the circuit board in the first direction, and the universality of the temperature sensor is improved.

Description

Technical Field

[0001] This application relates to the field of temperature sensor mounting technology, and more specifically, to a temperature sensor, circuit board assembly, and electrical device. Background Technology

[0002] In electrical equipment, some electronic components generate a lot of heat during operation, so temperature monitoring is required for thermal management.

[0003] Temperature sensors are typically used to detect the temperature of electronic components. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a temperature sensor, circuit board assembly, and electrical device for realizing temperature detection of electronic components.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A temperature sensor includes a sensor body and pins. One end of the sensor body in a first direction is a temperature acquisition end, and the pins are exposed at the other end of the sensor body in the first direction. The first direction is the distribution direction of the sensor body and the pins.

[0007] At least one of the sensor body and the pin is at least partially an elastic component in the first direction, and the elastic component deforms along the first direction.

[0008] In some possible embodiments, the sensor body includes a first body portion and a second body portion, the second body portion and the first body portion are distributed and connected along the first direction, the pins are exposed at the end of the first body portion away from the second body portion along the first direction, and the end of the second body portion away from the first body portion along the first direction is the acquisition end;

[0009] The elastic component includes at least one of a first elastic element, a second elastic element, and a third elastic element;

[0010] The first elastic element is at least a portion of the first main body portion in the first direction;

[0011] The second elastic element is at least a portion of the second main body portion in the first direction;

[0012] Along the first direction, the third elastic element is located between the second main body portion and the first main body portion, and the second main body portion and the first main body portion are connected and exchange heat through the third elastic element.

[0013] In some possible embodiments, the first main body portion or the second main body portion is provided with a receiving groove, and a portion of the third elastic member is disposed within the receiving groove;

[0014] Alternatively, both the first main body portion and the second main body portion are provided with receiving grooves, and at least a portion of the third elastic member is disposed within the receiving grooves.

[0015] In some possible embodiments, the third elastic element and the receiving groove are interference-fitted;

[0016] Alternatively, a buckle is provided in the receiving groove, and the buckle is engaged with the third elastic element;

[0017] Alternatively, the third elastic element can be bonded to the receiving groove with thermally conductive adhesive;

[0018] Alternatively, the third elastic element may be welded into the receiving groove.

[0019] In some possible embodiments, the buckle is disposed on the side wall of the receiving groove, and the end of the buckle near the bottom wall of the receiving groove along the first direction has a snap-fit ​​surface, the snap-fit ​​surface presses a portion of the third elastic member against the bottom wall of the groove, the buckle has a first side surface, the first side surface is away from the side wall of the groove along a second direction, the first side surface and the third elastic member abut against each other along the second direction, the second direction being a direction perpendicular to the first direction.

[0020] In some possible embodiments, the buckle has a connecting surface, the connecting surface and the snap-fit ​​surface are distributed along the first direction, the end face where the opening of the receiving groove is located is connected to the connecting surface, and the connecting surface and the first side face are connected by a transition surface.

[0021] In some possible embodiments, the third elastic element is a spring, an elastic block, an elastic column, or a bent sheet.

[0022] In some possible embodiments, the second main body portion is provided with a first mounting groove, and a portion of the first main body portion is disposed within the first mounting groove;

[0023] Alternatively, the first main body portion may be provided with a second mounting groove, and a portion of the second main body portion may be disposed within the second mounting groove.

[0024] In some possible embodiments, the first main body portion and the first mounting groove are interference-fitted, or the first main body portion and the first mounting groove are snap-fitted, or the first main body portion is bonded to the first mounting groove with thermally conductive adhesive, or the first main body portion is welded to the first mounting groove.

[0025] In some possible embodiments, the second main body portion and the second mounting groove are interference-fitted, the second main body portion and the second mounting groove are snap-fitted, the second main body portion is bonded to the second mounting groove with thermally conductive adhesive, or the second main body portion is welded to the second mounting groove.

[0026] In some possible embodiments, the first elastic element is a thermally conductive silicone element or a thermally conductive rubber element.

[0027] In some possible embodiments, the second elastic element is a thermally conductive silicone element, a thermally conductive rubber element, or a thermally conductive and bendable spring sheet.

[0028] In some possible embodiments, the second main body includes a first part and a second part connected to the first part, the second part and the first part being distributed along a first direction, the projection of the second part along the first direction being greater than the projection of the first part along the first direction, and the second part and the first part being connected and exchanging heat.

[0029] In some possible embodiments, the second main body portion and the first main body portion are either separate structures or integrated structures.

[0030] In some possible embodiments, the first main body portion includes a first housing, in which a temperature sensing element and potting compound are disposed, a first end of the pin is located inside the first housing and electrically connected to the temperature sensing element, the potting compound seals and covers the first end of the pin and the temperature sensing element, and a second end of the pin is exposed at the end of the first housing away from the second main body portion along the first direction;

[0031] The second main body and the first housing are heat exchanged, and the first housing and the temperature sensing element are heat exchanged.

[0032] In some possible embodiments, the first main body portion includes a first housing, the second main body portion includes a second housing, the first housing and the second housing are sealed together to form a cavity, a temperature sensing element and potting compound are disposed in the cavity, a first end of the pin is located in the cavity and is electrically connected to the temperature sensing element, the potting compound seals and covers the first end of the pin and the temperature sensing element, and a second end of the pin is exposed at the end of the first housing away from the second housing along the first direction;

[0033] The second housing and the temperature sensing element are configured for heat exchange;

[0034] The elastic component includes a second elastic element, which is at least a portion of the second housing in the first direction.

[0035] In some possible embodiments, the pin includes a resilient pin capable of deforming in a first direction, the resilient pin being a bent structure, and the resilient component including the resilient pin.

[0036] Based on the temperature sensor provided above, this application also provides a circuit board assembly, which includes: a circuit board, a device under test (DUT), and the temperature sensor described above, wherein the acquisition end of the temperature sensor is in contact with the DUT for heat exchange, and the pins of the temperature sensor are electrically connected to the circuit board.

[0037] In some possible embodiments, the test piece is provided with a third mounting slot, and the acquisition end is disposed in the third mounting slot; or, the test piece has a planar mounting surface, and the acquisition end is disposed on the mounting surface;

[0038] And / or, the acquisition end is bonded to the test piece for heat exchange via thermally conductive adhesive.

[0039] In some possible embodiments, the acquisition end and the third mounting slot are engaged in a second direction, which is perpendicular to the first direction; or, the acquisition end is fixed in the third mounting slot.

[0040] Based on the circuit board assembly provided above, this application also provides an electrical device, which includes the circuit board assembly described above.

[0041] In the temperature sensor provided in this application, the sensor body's acquisition end can acquire the temperature of the device under test, and the temperature acquired by the sensor body is output to the outside through the pin to obtain the temperature of the device under test, thereby realizing temperature detection of electronic components. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of a first structure of a temperature sensor in an embodiment of this application, in which the elastic component includes a third elastic element;

[0044] Figure 2 for Figure 1 The diagram shows a first possible connection between the temperature sensor, circuit board, and device under test.

[0045] Figure 3 for Figure 1The diagram shows a second connection scheme for the temperature sensor, circuit board, and device under test.

[0046] Figure 4 for Figure 1 A schematic diagram of an assembly of the second main body and the first main body of the temperature sensor shown;

[0047] Figure 5 This is a schematic diagram of a temperature sensor with a snap-fit ​​mechanism installed in the receiving groove, as provided in an embodiment of this application.

[0048] Figure 6 for Figure 5 The front view of the structure shown;

[0049] Figure 7 for Figure 5 Another front view of the structure shown;

[0050] Figure 8 for Figure 5 An assembly diagram of the structure shown, the third elastic element, and the first main body.

[0051] Figure 9 This is a schematic diagram of a temperature sensor provided in an embodiment of the present application, showing that the second main body is provided with a receiving groove.

[0052] Figure 10 This is a schematic diagram of a temperature sensor provided in an embodiment of the present application, showing that the first main body of the sensor has a receiving groove.

[0053] Figure 11 This is a schematic diagram of the structure of a temperature sensor in an embodiment of this application, where the third elastic element is an elastic block;

[0054] Figure 12 for Figure 11 A top view of the elastic block shown;

[0055] Figure 13 This is a top view of the elastic column in the temperature sensor provided in an embodiment of this application;

[0056] Figure 14 This is a schematic diagram of the structure of a bent spring sheet as the third elastic element in the temperature sensor provided in the embodiments of this application;

[0057] Figure 15 A schematic diagram of the elastic component in the temperature sensor provided in this application embodiment, including a first elastic element and a third elastic element;

[0058] Figure 16 A schematic diagram of the elastic component in the temperature sensor provided in this application embodiment, including a second elastic element and a third elastic element;

[0059] Figure 17A schematic diagram of the elastic component in the temperature sensor provided in this application embodiment, including a first elastic element, a second elastic element, and a third elastic element;

[0060] Figure 18 This is a schematic diagram of the structure of the elastic component in the temperature sensor provided in the embodiments of this application, including a first elastic element;

[0061] Figure 19 This is a schematic diagram of the structure of the elastic component in the temperature sensor provided in the embodiments of this application, including a second elastic element;

[0062] Figure 20 A schematic diagram of the elastic component in the temperature sensor provided in this application embodiment, including a first elastic element and a second elastic element;

[0063] Figure 21 This is a schematic diagram of a temperature sensor provided in an embodiment of the present application, in which a second mounting groove is provided in the first main body portion.

[0064] Figure 22 This is a schematic diagram of the structure of a temperature sensor whose main body is an integral structure, as provided in the embodiments of this application.

[0065] Figure 23 This is a schematic diagram of a first structure of a temperature sensor with flexible pins provided in an embodiment of this application;

[0066] Figure 24 This is a schematic diagram of a second structure of a temperature sensor with flexible pins provided in an embodiment of this application;

[0067] Figure 25 A schematic diagram of a temperature sensor provided in this application embodiment, in which both the pins and the sensor body are elastic components;

[0068] Figure 26 This is a schematic diagram showing the distribution of temperature sensing elements in a temperature sensor provided in an embodiment of this application;

[0069] Figure 27 This is a schematic diagram showing another distribution of the temperature sensing element in the temperature sensor provided in an embodiment of this application.

[0070] Explanation of reference numerals in the attached figures:

[0071] 1-Temperature sensor;

[0072] 11-Sensor body, 11a Housing, 111-First main body part, 111a-First housing, 1111-First end, 1112-Second end, 1113-Second mounting slot, 112-Second main body part, 112c-Second housing, 1121-Collection end, 1122-Connection end, 11221-End face, 1123-First mounting slot, 112a-First part, 112b-Second part, 113-Receiving slot, 1131-Slot sidewall, 1132-Slot bottom wall, 114-Snap fastener, 1141-Snap-fit ​​surface, 1142-First side surface, 1143-Transition surface, 1144-Connection surface, 1145-Second side surface;

[0073] 12-pin, 12a-flexible pin;

[0074] 13-Elastic component, 131-First elastic element, 132-Second elastic element, 133-Third elastic element, 133a-Spring, 133b-Elastic block, 133c-Elastic column, 133d-Bent spring sheet;

[0075] 14-Temperature sensing element;

[0076] 15-Cavity;

[0077] 16 - Potting compound;

[0078] 2-Circuit board;

[0079] 3-Test piece, 31-Mounting surface, 32-Third mounting slot. Detailed Implementation

[0080] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0081] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the embodiments of this application, “one or more” means one, two, or more; “and / or” describes the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0082] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0083] The "multiple" mentioned in the embodiments of this application refers to two or more. It should be noted that in the description of the embodiments of this application, terms such as "first" and "second" are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.

[0084] The terms "parallel" and "perpendicular" used in this application refer to "basically parallel" and "basically perpendicular" in practical operation. "Basically parallel" can be understood as parallelism with a certain degree of error, and similarly, "basically perpendicular" can be understood as perpendicularity with a certain degree of error.

[0085] In related technologies, some electronic components of electrical equipment generate a significant amount of heat during operation, requiring heat dissipation and temperature monitoring. Typically, heat sinks are used to dissipate heat from these components, while temperature sensors are employed to collect the temperature of the components under test. The pins of the temperature sensors are electrically connected to the circuit board.

[0086] The pins and circuit board are easy to connect, which facilitates the connection between the temperature sensor and the circuit board.

[0087] The distance between different devices under test and circuit boards may vary, and the temperature sensors mentioned above are found to be difficult to adapt to these differences.

[0088] To address the aforementioned issues, this application provides a temperature sensor that can adapt to changes in the distance between the device under test and the circuit board, thereby improving the versatility of the temperature sensor.

[0089] like Figure 1 As shown, the temperature sensor 1 provided in this embodiment includes: a sensor body 11 and pins 12.

[0090] One end of the sensor body 11 in the first direction is the acquisition end 1121, which is used to acquire temperature. The first direction is the distribution direction of the sensor body 11 and the pins 12, and can also be understood as the distribution direction of the acquisition end 1121 and the pins 12.

[0091] like Figure 2 As shown, the acquisition end 1121 is used to contact the test piece 3 for heat exchange in order to acquire the temperature of the test piece 3. The acquisition end 1121 and the test piece 3 can be directly contacted for heat exchange or indirectly contacted for heat exchange.

[0092] The device under test 3 can be a heat sink, which can be a water-cooled plate or a finned heat sink. The heat sink is used to dissipate heat from the electronic components, thus indirectly detecting the temperature of the electronic components. The electronic components can be battery modules, power conversion modules, or other modules, and this application embodiment does not limit this.

[0093] Of course, the component under test 3 can also be a heat sink, thermal pad, or thermal adhesive layer disposed on a heat sink. The thermal pad can be a ceramic pad or other pads, thus indirectly detecting the temperature of the electronic component; or, the component under test 3 can also be an electronic component, thus indirectly detecting the temperature of the electronic component. The specific type of the component under test 3 is not limited in the embodiments of this application. Continue to refer to Figure 1 Pin 12 is exposed at the other end of the sensor body 11 in the first direction, which can be understood as: pin 12 passes through the other end of the sensor body 11 in the first direction. For example... Figure 2 As shown, pin 12 is used for electrical connection with circuit board 2. The first direction can also be understood as the distribution direction of the device under test 3 and circuit board 2, which is perpendicular to circuit board 2.

[0094] Circuit board 2 can be a PCB (Printed Circuit Board). Of course, circuit board 2 can also be a PCBA (Printed Circuit Board Assembly) or other types, and this application embodiment does not limit this.

[0095] Pin 12 and circuit board 2 can be electrically connected via soldering, screw fastening, plugging, or lap jointing, eliminating the need for wires and improving the integration of temperature sensor 1 and circuit board 2. To enhance the reliability of the electrical connection, pin 12 and circuit board 2 can be connected via soldering. To simplify the connection, pin 12 and circuit board 2 can be connected via plugging or lap jointing.

[0096] For example, pin 12 can be a through-hole pin, which is a pin that is mounted vertically to the circuit board and is typically made of plastic or metal. The through-hole pin and the circuit board 2 can be electrically connected by plugging in, which facilitates installation and removal.

[0097] For example, pin 12 can be a surface-mount pin, which is a planar pin that is mounted parallel to the circuit board. This type of pin does not require holes to be made on the circuit board 2, and the pin 12 and the circuit board 2 can be electrically connected by soldering.

[0098] Since temperature sensor 1 includes pin 12, which can be electrically connected to circuit board 2, temperature sensor 1 can be directly electrically connected to circuit board 2. Compared with temperature sensor 1 being electrically connected to circuit board 2 through wires and plugs, this simplifies the installation process of temperature sensor 1 being electrically connected to circuit board 2 and improves the installation efficiency of temperature sensor 1.

[0099] The electrical connection between pin 12 of temperature sensor 1 and circuit board 2 eliminates the need for wires, avoiding messy wiring and facilitating the installation and maintenance of temperature sensor 1. Pin 12 can be directly connected to circuit board 2, shortening the heat conduction path and improving the accuracy of temperature acquisition. The electrical connection between pin 12 and circuit board 2 can be completed by mechanical equipment, enabling automation, reducing the connection cost between temperature sensor 1 and circuit board 2, and also helping to reduce the defect rate. There is no need to reserve space for plug placement on circuit board 2, saving space on circuit board 2, which helps to maintain the size of circuit board 2, and may even reduce the size of circuit board 2.

[0100] Pin 12 and sensor body 11 can be an integral or separate structure. To simplify assembly, pin 12 and sensor body 11 are an integral structure.

[0101] In the temperature sensor 1 provided in this application embodiment, the acquisition end 1121 of the sensor body 11 can acquire the temperature of the device under test 3. The temperature acquired by the sensor body 11 is output to the outside through the pin 12 to obtain the temperature of the device under test 3, thereby realizing temperature detection of electronic components.

[0102] In the temperature sensor 1 provided in this application embodiment, at least one of the sensor body 11 and the pin 12 is at least part of an elastic component 13 in a first direction, and the elastic component 13 deforms along the first direction.

[0103] For example, such as Figure 1 As shown, at least a portion of the sensor body 11 in the first direction is an elastic component 13; or, as... Figure 23 and Figure 24 As shown, at least a portion of pin 12 in the first direction is a resilient component 13; or, as... Figure 25 As shown, at least a portion of the sensor body 11 in the first direction is an elastic component 13, and at least a portion of the pin 12 in the first direction is an elastic component 13.

[0104] In temperature sensor 1, the elastic component 13 can change shape in the first direction, which can adjust the distance between the acquisition end 1121 and the pin 12 in the first direction. This allows temperature sensor 1 to adapt to changes in the distance between the test piece 3 and the circuit board 2 in the first direction. For example, temperature sensor 1 can adapt to different distances between the test piece 3 and the circuit board 2 in the first direction, which improves the versatility of temperature sensor 1 and expands its application range.

[0105] There are multiple temperature sensors in electrical equipment. After using the temperature sensor 1 mentioned above in the electrical equipment, since the temperature sensor 1 can adapt to the change in distance between the test piece 3 and the circuit board 2 in the first direction, the types of temperature sensors 1 in the electrical equipment can be reduced, which is conducive to reducing the cost of all temperature sensors 1. It can also save the time spent distinguishing different types of temperature sensors 1 during the installation process, which is conducive to improving the installation efficiency of electrical equipment.

[0106] As can be seen from the above, the pin 12 of the temperature sensor 1 is electrically connected to the circuit board 2, which realizes the transmission of signals to the circuit board 2, eliminating the need for wire connections, and is also compatible with different distances between the circuit board 2 and the device under test 3.

[0107] With pin 12 and circuit board 2 electrically connected, elastic component 13 can be in a compressed state, an extended state, or its original length (a state without deformation). When elastic component 13 is in a compressed state, the restoring force of elastic component 13 can improve the reliability of the electrical connection between pin 12 and circuit board 2, thereby improving the reliability of temperature acquisition.

[0108] Please refer to Figure 1The sensor body 11 includes a first body portion 111 and a second body portion 112, which are distributed and connected along a first direction. Pins 12 are exposed at the end of the first body portion 111 away from the second body portion 112 along the first direction, and the end of the second body portion 112 away from the first body portion 111 along the first direction is the acquisition end 1121.

[0109] For example, the first body portion 111 has a first end 1111 and a second end 1112 in a first direction, wherein the first end 1111 is closer to the second body portion 112 and the second end 1112 is farther away from the second body portion 112 in the first direction. A pin 12 is disposed at the second end 1112 of the first body portion 111.

[0110] The second main body 112 has a data acquisition end 1121 and a connection end 1122 in a first direction. In the first direction, the connection end 1122 is close to the first main body 111, and the data acquisition end 1121 is far away from the first main body 111. The connection end 1122 of the second main body 112 is connected to the first end 1111 of the first main body 111.

[0111] It should be noted that the second main body 112 is a heat-conducting component to ensure that the temperature collected by the second main body 112 is transferred to the temperature sensing element inside the temperature sensor 1 (not shown in the figure).

[0112] The second main body 112 can be made of thermally conductive metal, thermally conductive rubber, thermally conductive silicone, thermally conductive plastic, thermally conductive ceramic, or thermally conductive sponge, etc. The material of the second main body 112 is not limited in this embodiment.

[0113] In this embodiment of the application, the elastic component 13 includes at least one of a first elastic element 131, a second elastic element 132, and a third elastic element 133.

[0114] In some embodiments, such as Figure 1 As shown, the elastic component 13 includes a third elastic element 133. Along the first direction, the third elastic element 133 is located between the second main body portion 112 and the first main body portion 111, and the second main body portion 112 and the first main body portion 111 are connected by the third elastic element 133. It should be noted that the third elastic element 133 is a heat-conducting element, and the second main body portion 112 and the first main body portion 111 are connected and exchange heat through the third elastic element 133. In this way, the sensing end 1121 of the second main body portion 112 collects the temperature of the component 3 to be measured, and the second main body portion 112 transmits this temperature to the first main body portion 111 through the third elastic element 133 to achieve temperature detection.

[0115] In the above embodiments, the distance between the acquisition end 1121 and the pin 12 in the first direction can be adjusted by the deformation of the third elastic element 133, so that the temperature sensor 1 can adapt to the change in the distance between the test piece 3 and the circuit board 2 in the first direction, thereby improving the versatility of the temperature sensor 1 and expanding the application range of the temperature sensor 1.

[0116] In the above embodiments, it is not necessary to change the second main body part 112 and the first main body part 111. Only the third elastic element 133 needs to be added. The overall modification of the temperature sensor 1 is small, which is convenient for promotion and application.

[0117] like Figure 2 As shown, to facilitate the installation of the third elastic member 133, both the first main body portion 111 and the second main body portion 112 are provided with receiving grooves 113, and at least a portion of the third elastic member 133 is disposed within the receiving grooves 113. It can be understood that the depth direction of the receiving grooves 113 is the first direction.

[0118] For example, refer to Figure 2 Along the first direction, there is a gap between the first main body portion 111 and the second main body portion 112. The third elastic member 133 has a first portion, a second portion, and a third portion in the first direction. The first portion of the third elastic member 133 is located within the receiving groove 113 of the first main body portion 111, the third portion of the third elastic member 133 is located within the receiving groove 113 of the second main body portion 112, and the second portion of the third elastic member 133 is located in the gap between the first main body portion 111 and the second main body portion 112. It can be understood that a portion of the third elastic member 133 is located within the receiving groove 113.

[0119] For example, such as Figure 4 As shown, the first end 1111 of the first main body portion 111 and the connecting end 1122 of the second main body portion 112 can be directly fitted together. In this case, the first main body portion 111 and the second main body portion 112 overlap, causing the receiving grooves 113 of the first main body portion 111 and the second main body portion 112 to align and form a receiving cavity. The entire third elastic member 133 is located within the receiving cavity, or it can be understood that the entire third elastic member 133 is located within the receiving groove 113. It should be noted that the first main body portion 111 and the second main body portion 112 are also indirectly fitted together through the third elastic member 133.

[0120] In the above structure, the receiving groove 113 plays a limiting role for the third elastic member 133, which facilitates the connection between the third elastic member 133 and the second main body part 112, and also facilitates the connection between the third elastic member 133 and the first main body part 111.

[0121] In the above structure, the third elastic element 133 and the wall of the receiving groove 113 can fit together for heat exchange. For example, as shown... Figure 2 As shown, the bottom wall 1132 of the receiving groove 113 can be in contact with the third elastic element 133 for heat exchange. Alternatively, the side wall 1131 of the receiving groove 113 can also be in contact with the third elastic element 133 for heat exchange, or both the bottom wall 1132 and the side wall 1131 of the receiving groove 113 can be in contact with the third elastic element 133 for heat exchange. In this case, having both the bottom wall 1132 and the side wall 1131 of the receiving groove 113 in contact with the third elastic element 133 for heat exchange increases the area of ​​heat exchange between the third elastic element 133 and the second main body portion 112, as well as the area of ​​heat exchange between the third elastic element 133 and the first main body portion 111. This improves the heat transfer efficiency of the third elastic element 133 and the second main body portion 112, and the heat transfer efficiency of the third elastic element 133 and the first main body portion 111, thus enhancing the detection performance of the temperature sensor 1.

[0122] In practice, the first main body 111 or the second main body 112 is provided with a receiving groove 113, and part of the third elastic member 133 is disposed in the receiving groove 113.

[0123] For example, such as Figure 10 As shown, the first main body portion 111 is provided with a receiving groove 113, the second main body portion 112 is not provided with a receiving groove 113, and the end of the third elastic member 133 away from the second main body portion 112 is located within the receiving groove 113; or, as Figure 9 As shown, the second main body portion 112 is provided with a receiving groove 113, while the first main body portion 111 is not provided with a receiving groove 113. The end of the third elastic member 133 away from the first main body portion 111 is located within the receiving groove 113. This facilitates the installation of the third elastic member 133 and also helps to improve the detection performance of the temperature sensor 1.

[0124] In this embodiment, the third elastic member 133 and the receiving groove 113 can be interference-fitted, which simplifies the connection between the components (at least one of the first main body part 111 and the second main body part 112) where the third elastic member 133 and the receiving groove 113 are located, and also enables the bottom wall and side wall of the receiving groove 113 to be in contact with the third elastic member 133 for heat exchange.

[0125] The third elastic element 133 and the receiving groove 113 can also be snapped together. For example Figure 5 , Figure 6 and Figure 8 As shown, a snap fastener 114 is provided in the receiving groove 113, and the snap fastener 114 and the third elastic member 133 are engaged. This facilitates the connection and disassembly of the third elastic member 133 and the component containing the receiving groove 113 (at least one of the first main body part 111 and the second main body part 112), and makes maintenance easier.

[0126] Please refer to Figure 5 and Figure 6 In some embodiments, the latch 114 is disposed on the sidewall 1131 of the receiving groove 113, and the end of the latch 114 near the bottom wall 1132 of the receiving groove 113 along a first direction has a snap-fit ​​surface 1141; the latch 114 has a first side surface 1142, which is located away from the sidewall 1131 along a second direction. Please refer to... Figure 8 The snap-fit ​​surface 1141 and the third elastic member 133 abut against each other along the first direction and restrict the third elastic member 133 from disengaging from the receiving groove 113. The first side surface 1142 and the third elastic member 133 abut against each other along the second direction, which is perpendicular to the first direction.

[0127] It should be noted that the second direction may include one direction perpendicular to the first direction, or it may include two or more directions perpendicular to the first direction.

[0128] In the above structure, by deforming the third elastic member 133 along the second direction, the third elastic member 133 can move from the position of the buckle 114 toward the bottom wall 1132 of the groove. By deforming the third elastic member 133 along the second direction, the first side 1142 and the third elastic member 133 abut against each other along the second direction.

[0129] In the above structure, the snap-fit ​​between the buckle 114 and the third elastic member 133 is achieved through the cooperation between the first side surface 1142 and the snap-fit ​​surface 1141, and by making full use of the elasticity of the third elastic member 133.

[0130] To facilitate the installation of the third elastic element 133, such as Figure 4 As shown, the buckle 114 has a connecting surface 1144, and the connecting surface 1144 and the snap-fit ​​surface 1141 are distributed along a first direction. The end face 11221 where the slot of the receiving groove 113 is located is connected to the connecting surface 1144, and the connecting surface 1144 and the first side surface 1142 are transitionally connected through a transition surface 1143. In this way, the connecting surface 1144, the transition surface 1143 and the first side surface 1142 can form a chamfered structure, thereby facilitating the entry of the third elastic member 133 into the receiving groove 113.

[0131] The end face 11221 where the slot of the receiving groove 113 is located and the connecting face 1144 can be set flush or staggered in the first direction. This application embodiment does not limit this.

[0132] like Figure 6 As shown, the latch 114 has a second side 1145 distributed opposite to the first side 1142; the second side 1145 and the groove sidewall 1131 are fitted together. Alternatively, as... Figure 7As shown, the portion of the second side surface 1145 near the connecting surface 1144 is in contact with the groove sidewall 1131, and the portion of the second side surface 1145 near the snap-fit ​​surface 1141 is spaced apart from the groove sidewall 1131.

[0133] To improve the engagement effect between the latch 114 and the third elastic member 133, there can be two or more latches 114, and the receiving grooves 113 are circumferentially distributed. For example, there can be two latches 114, and the receiving grooves 113 are evenly distributed circumferentially. Of course, there can also be three, four, or five or more latches 114, and this application embodiment does not limit this.

[0134] In practice, the buckle 114 can also be other structures and is not limited to the above embodiments.

[0135] The third elastic element 133 can also be bonded to the receiving groove 113 by thermally conductive adhesive, which helps to improve the connection reliability between the third elastic element 133 and the component (at least one of the first main body part 111 and the second main body part 112) where the receiving groove 113 is located, and can also achieve heat exchange by the bottom wall and side wall of the receiving groove 113 being in contact with the third elastic element 133.

[0136] The third elastic element 133 can also be welded into the receiving groove 113. In this case, both the third elastic element 133 and the receiving groove 113 can be metal parts or other materials that allow welding. This also helps to improve the connection reliability of the components (at least one of the first main body part 111 and the second main body part 112) where the third elastic element 133 and the receiving groove 113 are located, and also enables the bottom wall and side wall of the receiving groove 113 to be in close contact with the third elastic element 133 for heat exchange.

[0137] In practice, the third elastic element 133 can also be disposed in the receiving groove 113 in other ways, and is not limited to the above embodiment.

[0138] In the embodiments of this application, such as Figure 1 As shown, the third elastic element 133 can be a spring 133a; or, as... Figure 11 and Figure 12 As shown, the third elastic element 133 can be an elastic block 133b; or, as... Figure 13 As shown, the third elastic element 133 can be an elastic column 133c; or, as... Figure 14 As shown, the third elastic element 133 can be a bent spring sheet 133d. The bent spring sheet 133d can be Z-shaped or other shapes, which are not limited in this embodiment.

[0139] For example, for ease of material sourcing, the third elastic element 133 can be a spring 133a.

[0140] For example, in order to increase the thermal conductivity of the third elastic element 133, the third elastic element 133 can be a bent sheet 133d.

[0141] For example, in order to improve the stability of temperature sensor 1, the third elastic element 133 can be an elastic block 133b or an elastic column 133c.

[0142] When the third elastic element 133 is a spring 133a or a bent sheet 133d, the third elastic element 133 can be a metal part, a plastic part or a part made of other materials.

[0143] When the third elastic element 133 is an elastic block 133b or an elastic column 133c, the third elastic element 133 can be a thermally conductive silicone part or a thermally conductive rubber part, etc.

[0144] In some embodiments, such as Figure 18 As shown, the elastic component includes a first elastic element 131, which is a first main body portion 111. Of course, the first elastic element 131 can be a portion of the first main body portion 111 in a first direction. As mentioned above, the sensor body 11 includes a housing (not shown in the figure) and a temperature-sensing element (not shown in the figure) located within the housing. The housing and the temperature-sensing element are in contact for heat exchange. The first main body portion 111 includes the aforementioned housing and temperature-sensing element. The first elastic element 131 being at least a portion of the first main body portion 111 in a first direction means that the first elastic element 131 is at least a portion of the housing of the first main body portion 111 in a first direction.

[0145] In the above embodiments, by adjusting at least a portion of the first main body 111 in the first direction to a first elastic element 131, the first main body 111 itself becomes elastic. Through the deformation of the first elastic element 131, the distance between the acquisition end 1121 and the pin 12 in the first direction can be adjusted, so that the temperature sensor 1 can adapt to the change in the distance between the test piece 3 and the circuit board 2 in the first direction, thereby improving the versatility of the temperature sensor 1 and expanding its application range. It can also simplify the structure of the temperature sensor 1 without adding other components and reduce the impact on the cost of the temperature sensor.

[0146] The first elastic element 131 can be a thermally conductive silicone or thermally conductive rubber element, which facilitates the first elastic element 131 surrounding the temperature sensing element and other devices. Of course, the first elastic element 131 can also be other thermally conductive elastic materials, and this application embodiment does not limit it.

[0147] In some embodiments, such as Figure 19 As shown, the elastic component includes a second elastic element 132, which is a second main body portion 112. Alternatively, the second elastic element 132 can also be a portion of the second main body portion 112 in the first direction.

[0148] In the above embodiments, by adjusting at least a portion of the second main body portion 112 in the first direction to a second elastic element 132, the second main body portion 112 itself becomes elastic. Through the deformation of the second elastic element 132, the distance between the acquisition end 1121 and the pin 12 in the first direction can be adjusted, so that the temperature sensor 1 can adapt to the change in the distance between the test piece 3 and the circuit board 2 in the first direction, thereby improving the versatility of the temperature sensor 1 and expanding its application range. It can also simplify the structure of the temperature sensor 1 without adding other components and reduce the impact on the cost of the temperature sensor.

[0149] The second elastic element 132 can be a thermally conductive silicone element, a thermally conductive rubber element, a thermally conductive and bendable spring sheet, or other thermally conductive elastic structural elements. The thermally conductive and bendable spring sheet can be Z-shaped or other shapes.

[0150] For example, in order to improve the stability of temperature sensor 1, the second elastic element 132 can be a thermally conductive silicone element or a thermally conductive rubber element.

[0151] For example, in order to improve thermal conductivity, the second elastic element 132 can be a thermally conductive and bent sheet, such as a metal sheet.

[0152] In some embodiments, such as Figure 20 As shown, the elastic component includes a first elastic element 131 and a second elastic element 132, wherein the first elastic element 131 is the first main body portion 111, and the second elastic element 132 is the second main body portion 112. Of course, the first elastic element 131 can be a portion of the first main body portion 111 in the first direction, and the second elastic element 132 can also be a portion of the second main body portion 112 in the first direction. For a description of the first elastic element 131 and the second elastic element 132, please refer to the preceding text; it will not be repeated here.

[0153] In the above embodiments, by providing the first elastic element 131 and the second elastic element 132, the amount of deformation that the entire temperature sensor 1 can undergo in the first direction can be increased, thereby improving the compatibility of the temperature sensor 1 with the distance between the circuit board 2 and the device under test 3 in the first direction; no other components need to be added, the structure of the temperature sensor 1 can be simplified, and the impact on the cost of the temperature sensor can be reduced.

[0154] In practice, such as Figure 15 As shown, the elastic component may further include a first elastic element 131 and a third elastic element 133; or, as... Figure 16 As shown, the elastic component may further include a second elastic element 132 and a third elastic element 133; or, as... Figure 17As shown, the elastic component can also include a first elastic element 131, a second elastic element 132, and a third elastic element 133. This can increase the amount of deformation that the entire temperature sensor 1 can undergo in the first direction, thereby improving the compatibility of the temperature sensor 1 with the distance between the circuit board 2 and the device under test 3 in the first direction.

[0155] In the sensor body 11, such as Figure 1 As shown, the second main body part 112 and the first main body part 111 can be a separate structure. This allows the second main body part 112 and the first main body part 111 to be manufactured separately, facilitating the fulfillment of their respective requirements. For example... Figure 22 As shown, the second main body 112 and the first main body 111 can be an integral structure, which can reduce the number of parts of the temperature sensor 1 and simplify the assembly of the temperature sensor 1.

[0156] When the elastic component 13 includes a third elastic element 133, a second main body portion 112, and a first main body portion 111 connected by the third elastic element 133, the second main body portion 112 and the first main body portion 111 can be separate structures, the third elastic element 133 and the second main body portion 112 can be separate structures, and the third elastic element 133 and the first main body portion 111 can be separate structures. Of course, the second main body portion 112, the first main body portion 111, and the third elastic element 133 can also be an integral structure.

[0157] When the elastic component 13 does not include the third elastic element 133, but includes at least one of the first elastic element 131 and the second elastic element 132, the second main body portion 112 and the first main body portion 111 can be an integral structure or a separate structure.

[0158] In the case where the elastic component 13 does not include the third elastic element 133, but includes at least one of the first elastic element 131 and the second elastic element 132, such as Figure 18 As shown, to facilitate the connection between the second main body portion 112 and the first main body portion 111, the second main body portion 112 is provided with a first mounting groove 1123, and a portion of the first main body portion 111 is disposed within the first mounting groove 1123. In other words, the first end 1111 of the first main body portion 111 is disposed within the first mounting groove 1123. Thus, the first mounting groove 1123 can limit the movement of the first main body portion 111, facilitating its installation.

[0159] In the above structure, the bottom wall of the first mounting groove 1123 can be in contact with the first main body 111 for heat exchange, or both the bottom wall and the side wall of the first mounting groove 1123 can be in contact with the first main body 111 for heat exchange. The fact that both the bottom wall and the side wall of the first mounting groove 1123 are in contact with the first main body 111 for heat exchange increases the contact area between the first main body 111 and the second main body 112, thereby improving the performance of the temperature sensor 1.

[0160] When the elastic component 13 includes a first elastic member 131, the first elastic member 131 may be located inside the first mounting groove 1123, or the first elastic member 131 may be located outside the first mounting groove 1123, or a portion of the first elastic member 131 may be located inside the first mounting groove 1123 and a portion of the first elastic member 131 may be located outside the first mounting groove 1123.

[0161] In this embodiment of the application, the first main body portion 111 and the first mounting groove 1123 can be interference-fitted. In this case, at least a portion of the first elastic member 131 is located in the first mounting groove 1123, which facilitates the interference fit between the first main body portion 111 and the first mounting groove 1123. It can also achieve heat exchange by having the bottom wall and side wall of the first mounting groove 1123 in contact with the first main body portion 111.

[0162] The first main body 111 and the first mounting slot 1123 can also be snapped together, and the snap-fit ​​structure can be referred to above. This facilitates the connection and disassembly of the first main body 111 and the second main body 112.

[0163] The first main body 111 can also be bonded to the first mounting groove 1123 with thermally conductive adhesive, which can improve the connection stability of the first main body 111 and the second main body 112, and can also achieve heat exchange by the bottom wall and side wall of the first mounting groove 1123 being in contact with the first main body 111.

[0164] The first main body 111 can also be welded into the first mounting groove 1123, which can improve the connection stability of the first main body 111 and the second main body 112, and can also achieve heat exchange by having the bottom wall and side wall of the first mounting groove 1123 in close contact with the first main body 111.

[0165] In practice, the first main body 111 can also be disposed in the first mounting slot 1123 in other ways, and is not limited to the above embodiment.

[0166] like Figure 21As shown, to facilitate the connection between the second main body portion 112 and the first main body portion 111, the first main body portion 111 may be provided with a second mounting groove 1113. A portion of the second main body portion 112 is disposed within the second mounting groove 1113. It can be understood that the connecting end 1122 of the second main body portion 112 is disposed within the second mounting groove 1113. In this way, the second mounting groove 1113 can limit the movement of the second main body portion 112, facilitating the connection between the second main body portion 112 and the first main body portion 111.

[0167] In the above structure, the bottom wall of the second mounting groove 1113 can be in contact with the second main body 112 for heat exchange, or both the bottom wall and side wall of the second mounting groove 1113 can be in contact with the second main body 112 for heat exchange. Where both the bottom wall and side wall of the second mounting groove 1113 are in contact with the second main body 112 for heat exchange, this increases the contact area between the first main body 111 and the second main body 112, thereby improving the performance of the temperature sensor 1.

[0168] When the elastic component 13 includes a second elastic member 132, the second elastic member 132 may be located inside the second mounting groove 1113, or the second elastic member 132 may be located outside the second mounting groove 1113, or a portion of the second elastic member 132 may be located inside the second mounting groove 1113 and a portion of the second elastic member 132 may be located outside the second mounting groove 1113.

[0169] In this embodiment of the application, the second main body portion 112 and the second mounting groove 1113 can be interference-fitted. In this case, at least a portion of the second elastic member 132 is located in the second mounting groove 1113, which facilitates the interference fit between the second main body portion 112 and the second mounting groove 1113; it can also achieve heat exchange by having the bottom wall and side wall of the second mounting groove 1113 in contact with the second main body portion 112.

[0170] The second main body 112 and the second mounting slot 1113 can also be snapped together; the snap-fit ​​structure can be referred to above. This facilitates the connection and disassembly of the first main body 111 and the second main body 112.

[0171] The second main body 112 can also be bonded to the second mounting groove 1113 with thermally conductive adhesive, which can improve the connection stability of the first main body 111 and the second main body 112, and can also achieve heat exchange by the bottom wall and side wall of the second mounting groove 1113 being in close contact with the second main body 112.

[0172] The second main body 112 can also be welded into the second mounting groove 1113, which can improve the connection stability of the first main body 111 and the second main body 112, and can also achieve heat exchange by having the bottom wall and side wall of the second mounting groove 1113 in close contact with the second main body 112.

[0173] In practice, the second main body 112 can also be disposed in the second mounting slot 1113 in other ways, and is not limited to the above embodiment.

[0174] In this embodiment, the shapes of the first main body portion 111 and the second main body portion 112 are selected according to the actual situation. For example, the first main body portion 111 is columnar, and the second main body portion 112 can also be columnar, with the cross-section of the columnar portion being circular or quadrilateral, etc.

[0175] In some embodiments, such as Figure 21 As shown, the second main body portion 112 includes a first portion 112a and a second portion 112b connected to the first portion 112a. The second portion 112b and the first portion 112a are distributed along a first direction. The projection of the second portion 112b along the first direction is larger than the projection of the first and second main body portions 112a along the first direction, and the second portion 112b and the first main body portion 111 are in contact for heat exchange. In this way, the contact area between the second portion 112b and the first main body portion 111 for heat exchange can be increased, thereby improving the heat conduction efficiency and improving the performance of the temperature sensor 1.

[0176] It should be noted that, in the above embodiments, when the second main body portion 112 and the first main body portion 111 are connected by the third elastic member 133, the second portion 112b can increase the heat exchange area between the second portion 112b and the third elastic member 133 by bonding with the first main body portion 111 through the third elastic member 133, thereby indirectly increasing the heat exchange area between the second portion 112b and the first main body portion 111.

[0177] For example, both the second part 112b and the first part 112a are cylindrical, making the second main body part 112 a cylindrical structure of unequal diameter. Of course, the second main body part 112 can also be a cylindrical structure of equal diameter.

[0178] The preceding text described an embodiment in which at least a portion of the sensor body 11 in a first direction is an elastic component 13. The following text describes an embodiment in which at least a portion of the pin 12 in a first direction is an elastic component 13.

[0179] For example Figure 23 and Figure 24As shown, pin 12 includes an elastic pin 12a capable of deforming in a first direction. The elastic pin 12a has a bent structure, and the elastic component 13 includes the elastic pin 12a. Thus, by deforming the elastic pin 12a in the first direction, the distance between the acquisition end 1121 and pin 12 (the end where pin 12 connects to circuit board 2) in the first direction can be adjusted. This allows the temperature sensor 1 to adapt to changes in the distance between the measured component 3 and circuit board 2 in the first direction. For example, the temperature sensor 1 can adapt to different distances between the measured component 3 and circuit board 2 in the first direction, improving the versatility of the temperature sensor 1 and expanding its application range.

[0180] For example, such as Figure 23 As shown, the flexible pin 12a can be zigzag-shaped; as Figure 24 As shown, the elastic pin 12a can be S-shaped. Of course, the elastic pin 12a can also be other shapes. This application embodiment does not limit the specific structure of the bending structure, as long as the elastic pin 12a can deform in the first direction.

[0181] It should be noted that the flexible pin 12a can also be used. Figures 1-22 The technical solution shown.

[0182] In practice, the entire pin 12 is a flexible pin 12a, or a portion of pin 12 is a flexible pin 12a. Besides being a bent structure, the flexible pin 12a can also be other structures, such as a Pogo Pin (spring pin), which is capable of deformation in the first direction.

[0183] It should be noted that, as Figure 23 and Figure 24 As shown, pin 12 includes an embodiment with a flexible pin 12a, which can be implemented independently; as... Figure 25 As shown, the embodiment of pin 12 including elastic pin 12a can also be combined with the embodiment described above (at least a portion of the sensor body 11 in the first direction is an elastic component 13). Of course, the embodiment described above (at least a portion of the sensor body 11 in the first direction is an elastic component 13) can also be implemented alone.

[0184] In this embodiment, the temperature sensor has a temperature-sensing element located within the sensor body 11. The temperature-sensing element 14 can be a thermistor or other components.

[0185] As mentioned above, the sensor body 11 includes a first main body portion 111 and a second main body portion 112, such as Figure 26 As shown, the temperature sensing element 14 can be located within the first main body portion 111; or, as... Figure 27As shown, the temperature sensing element 14 can be located within the first main body portion 111 and the second main body portion 112; of course, the temperature sensing element 14 can also be located within the second main body portion 112.

[0186] The structure of the temperature sensing element 14 located within the first main body portion 111 is described in detail below.

[0187] Please refer to Figure 26 The first main body 111 includes a first housing 111a, in which a temperature sensing element 14 and potting compound 16 are disposed. The first end of the pin 12 is located inside the first housing 111a and is electrically connected to the temperature sensing element 14. The potting compound 16 seals and covers the first end of the pin 12 and the temperature sensing element 14. The second end of the pin 12 is exposed at the end of the first housing 111a away from the second main body (not shown in the figure) along a first direction. The second main body 112 and the first housing 111a are heat-exchangingly configured, and the first housing 111a and the temperature sensing element 14 are heat-exchangingly configured.

[0188] It should be noted that the first housing 111a and the temperature sensing element 14 can be directly bonded for heat exchange; or the first housing 111a and the temperature sensing element 14 can be indirectly bonded for heat exchange through potting compound 16; or, a portion of the first housing 111a and the temperature sensing element 14 can be directly bonded for heat exchange, while a portion of the first housing 111a and the temperature sensing element 14 can be indirectly bonded for heat exchange through potting compound 16. The first housing 111a (first main body portion 111) may or may not have a receiving groove 113.

[0189] The above structure can be applied to embodiments in which at least one of the sensor body 11 and the pin 12 has at least a portion of an elastic component 13 in the first direction. Furthermore, the above structure can be applied to embodiments in which the elastic component 13 includes at least one of a first elastic element 131, a second elastic element 132, and a third elastic element 133.

[0190] It should be noted that when the elastic component 13 includes a first elastic element 131, the first elastic element 131 is at least a portion of the first housing 111a in the first direction.

[0191] The above structure allows for various forms of the elastic component 13, facilitating the selection of the form of the elastic component 13 according to actual conditions and improving design flexibility.

[0192] The structure of the temperature sensing element 14, at least a portion of which is located within the second main body portion 112, is described in detail below.

[0193] Please refer to Figure 27The first main body 111 includes a first housing 111a, and the second main body 112 includes a second housing 112c. The first housing 111a and the second housing 112c are sealed together to form a cavity 15. A temperature sensing element 14 and potting compound 16 are disposed inside the cavity 15. The first end of the pin 12 is located inside the cavity 15 and is electrically connected to the temperature sensing element 14. The potting compound 16 seals and covers the first end of the pin 12 and the temperature sensing element 14. The second end of the pin 12 is exposed at the end of the first housing 111a away from the second housing 112c along a first direction. The second housing 112c and the temperature sensing element 14 are heat exchanged.

[0194] It should be noted that the second housing 112c and the temperature sensing element 14 can be directly bonded for heat exchange; or the second housing 112c and the temperature sensing element 14 can be indirectly bonded for heat exchange through potting compound 16; or, a portion of the second housing 112c and the temperature sensing element 14 can be directly bonded for heat exchange, while a portion of the second housing 112c and the temperature sensing element 14 can be indirectly bonded for heat exchange through potting compound 16.

[0195] The above structure can be applied to embodiments where at least one of the sensor body 11 and the pin 12 has at least a portion of an elastic component 13 in the first direction. Furthermore, the above structure can be applied to embodiments where the elastic component 13 includes a second elastic element 132.

[0196] It should be noted that when the elastic component 13 includes a second elastic element 132, the second elastic element 132 is at least a portion of the second housing 112c in the first direction.

[0197] In the above structure, by adjusting the material of the second housing 112c, one form of the elastic component 13 can be obtained, which facilitates implementation and promotion, and also simplifies the structure of the temperature sensor 1.

[0198] In the above structure, the first housing 111a can be sleeve-shaped, and the first housing 111a is sleeved over the second housing 112c. Of course, the second housing 112c can also be sleeved over the first housing 111a. The first housing 111a and the second housing 112c can be sealed together by threaded connection, welding or other means.

[0199] In the above structure, the temperature sensing element 14 can be located inside the first housing 111a and the second housing 112c. Alternatively, the size of the second housing 112c in the first direction can be increased, and the first housing 111a and the second housing 112c can be joined together in the first direction, thereby realizing that the temperature sensing element 14 is located inside the second housing 112c and outside the first housing 111a.

[0200] Based on the temperature sensor 1 provided in the above embodiments, this application also provides a circuit board assembly. For example... Figure 2As shown, the circuit board assembly includes: a circuit board 2, a device under test 3, and a temperature sensor 1 as described in the above embodiment; wherein, the acquisition end 1121 of the temperature sensor 1 is in contact with the device under test 3 for heat exchange, and the pin 12 of the temperature sensor 1 is electrically connected to the circuit board 2.

[0201] Since the temperature sensor 1 provided in the above embodiments has the above-mentioned technical effects, and the circuit board assembly provided in this application embodiment includes the temperature sensor 1, the circuit board assembly provided in this application embodiment also has the corresponding technical effects, which will not be repeated here.

[0202] like Figure 2 As shown, the test piece 3 has a planar mounting surface 31, and the acquisition end 1121 of the temperature sensor 1 is disposed on the mounting surface 31. In this way, the acquisition end 1121 and the mounting surface 31 are directly attached, which simplifies the structure of the test piece 3. It can also be understood that the temperature sensor 1 can be directly applied to the existing test piece 3 without processing the test piece 3, thus improving the application performance of the temperature sensor 1.

[0203] like Figure 3 and Figure 4 As shown, the test piece 3 can be provided with a third mounting slot 32, and the acquisition end 1121 of the temperature sensor 1 is located in the third mounting slot 32. This facilitates the installation of the temperature sensor 1.

[0204] To further enhance the function of the third mounting slot 32, the acquisition end 1121 and the third mounting slot 32 are fitted together in a second direction, which is perpendicular to the first direction; alternatively, the acquisition end 1121 is fixed inside the third mounting slot 32. This reduces the likelihood of the temperature sensor 1 shaking and improves the reliability of temperature acquisition by the second main body 112.

[0205] It should be noted that the second direction may include a direction perpendicular to the first direction, or the second direction may include at least two directions perpendicular to the first direction.

[0206] To facilitate the upper limit fit between the acquisition end 1121 and the third mounting slot 32 in the second direction, the acquisition end 1121 and the third mounting slot 32 can be interference-fitted. Of course, the acquisition end 1121 and the third mounting slot 32 can also be transition-fitted.

[0207] When the acquisition end 1121 is fixed in the third mounting groove 32, the acquisition end 1121 can be fixed in the third mounting groove 32 by bonding, welding or other means, and this application embodiment does not limit this.

[0208] The shape of the third mounting slot 32 is selected according to the actual situation, and the shape of the acquisition end 1121 is adapted to the third mounting slot 32.

[0209] In this embodiment, the acquisition end 1121 can be bonded to the test device 3 for heat exchange via thermally conductive adhesive. This facilitates heat exchange between the acquisition end 1121 and the test device 3, which is beneficial to improving the reliability of temperature acquisition. Moreover, the thermally conductive adhesive can deform in the first direction. The deformation of the thermally conductive adhesive in the first direction can also accommodate changes in the distance between the test device 3 and the circuit board 2 in the first direction due to tolerances and deviations.

[0210] When the test piece 3 has a third mounting groove 32, the thermally conductive adhesive can be filled into the third mounting groove 32. When the test piece 3 has a mounting surface 31, the thermally conductive adhesive can be applied to the mounting surface 31.

[0211] The thermally conductive adhesive mentioned above can also be replaced by thermally conductive pads or other thermally conductive components.

[0212] Based on the circuit board assembly provided in the above embodiments, this application also provides an electrical device that includes the circuit board assembly described above.

[0213] Since the circuit board assembly provided in the above embodiments has the above-mentioned technical effects, the electrical equipment provided in the embodiments of this application also has the corresponding technical effects, which will not be repeated here.

[0214] The electrical equipment may be an energy storage device, a power conversion device, or others. This application does not limit the type of electrical equipment.

[0215] The technical features mentioned above, as well as those shown individually in the accompanying drawings, can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are those explicitly described herein. Any one of the multiple technical features contained in the same statement can be applied independently, without necessarily being applied together with other technical features.

[0216] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A temperature sensor, characterized in that, The sensor includes a sensor body (11) and pins (12). One end of the sensor body (11) in a first direction is a temperature acquisition end (1121), and the pins (12) are exposed at the other end of the sensor body (11) in the first direction. The first direction is the distribution direction of the sensor body (11) and the pins (12). At least one of the sensor body (11) and the pin (12) is at least part of an elastic component (13) in the first direction, and the elastic component (13) deforms along the first direction.

2. The temperature sensor according to claim 1, characterized in that, The sensor body (11) includes a first main body part (111) and a second main body part (112). The second main body part (112) and the first main body part (111) are distributed and connected along the first direction. The pin (12) is exposed at one end of the first main body part (111) away from the second main body part (112) along the first direction. The end of the second main body part (112) away from the first main body part (111) along the first direction is the acquisition end (1121). The elastic component (13) includes at least one of a first elastic element (131), a second elastic element (132), and a third elastic element (133); The first elastic element (131) is at least a portion of the first main body portion (111) in the first direction; The second elastic element (132) is at least a portion of the second main body portion (112) in the first direction; Along the first direction, the third elastic element (133) is located between the second main body portion (112) and the first main body portion (111), and the second main body portion (112) and the first main body portion (111) are connected and exchange heat through the third elastic element (133).

3. The temperature sensor according to claim 2, characterized in that, The first main body part (111) or the second main body part (112) is provided with a receiving groove (113), and a portion of the third elastic member (133) is disposed in the receiving groove (113); Alternatively, both the first main body portion (111) and the second main body portion (112) are provided with receiving grooves (113), and at least a portion of the third elastic member (133) is disposed within the receiving grooves (113).

4. The temperature sensor according to claim 3, characterized in that, The third elastic element (133) and the receiving groove (113) are interference-fitted; Alternatively, a buckle (114) is provided in the receiving groove (113), and the buckle (114) and the third elastic member (133) are engaged in a snap-fit ​​relationship; Alternatively, the third elastic element (133) is bonded to the receiving groove (113) by thermally conductive adhesive; Alternatively, the third elastic element (133) is welded into the receiving groove (113).

5. The temperature sensor according to claim 4, characterized in that, The buckle (114) is disposed on the groove sidewall (1131) of the receiving groove (113). The buckle (114) has a snap-fit ​​surface (1141) at one end near the bottom wall (1132) of the receiving groove (113) along the first direction. The snap-fit ​​surface (1141) and a portion of the third elastic member (133) abut against each other along the first direction and restrict the third elastic member (133) from disengaging from the receiving groove (113). The buckle (114) has a first side surface (1142). The first side surface (1142) is away from the groove sidewall (1131) along the second direction. The first side surface (1142) and the third elastic member (133) abut against each other along the second direction, which is a direction perpendicular to the first direction.

6. The temperature sensor according to claim 5, characterized in that, The buckle (114) has a connecting surface (1144), the connecting surface (1144) and the snap-fit ​​surface (1141) are distributed along the first direction, the end face (11221) where the slot of the receiving groove (113) is located is connected to the connecting surface (1144), and the connecting surface (1144) and the first side surface (1142) are connected by a transition surface (1143).

7. The temperature sensor according to claim 2, characterized in that, The third elastic element (133) is a spring (133a), an elastic block (133b), an elastic column (133c), or a bent sheet (133d).

8. The temperature sensor according to claim 2, characterized in that, The second main body part (112) is provided with a first mounting groove (1123), and a portion of the first main body part (111) is disposed in the first mounting groove (1123); Alternatively, the first main body part (111) is provided with a second mounting groove (1113), and a portion of the second main body part (112) is disposed within the second mounting groove (1113).

9. The temperature sensor according to claim 8, characterized in that, The first main body (111) and the first mounting groove (1123) are press-fitted, or the first main body (111) and the first mounting groove (1123) are snap-fitted, or the first main body (111) is bonded to the first mounting groove (1123) with thermally conductive adhesive, or the first main body (111) is welded to the first mounting groove (1123).

10. The temperature sensor according to claim 8, characterized in that, The second main body (112) and the second mounting groove (1113) are interference fit, the second main body (112) and the second mounting groove (1113) are snap fit, or the second main body (112) is bonded to the second mounting groove (1113) by thermally conductive adhesive, or the second main body (112) is welded to the second mounting groove (1113).

11. The temperature sensor according to claim 2, characterized in that, The first elastic element (131) is a thermally conductive silicone element or a thermally conductive rubber element.

12. The temperature sensor according to claim 2, characterized in that, The second elastic element (132) is a thermally conductive silicone element, a thermally conductive rubber element, or a thermally conductive and bendable spring sheet.

13. The temperature sensor according to claim 2, characterized in that, The second main body part (112) includes a first part (112a) and a second part (112b) connected to the first part (112a). The second part (112b) and the first part (112a) are distributed along a first direction. The projection of the second part (112b) along the first direction is greater than the projection of the first part (112a) along the first direction. The second part (112b) and the first main body part (111) are connected and exchange heat.

14. The temperature sensor according to claim 2, characterized in that, The second main body part (112) and the first main body part (111) are either separate structures or integrated structures.

15. The temperature sensor according to claim 2, characterized in that, The first main body (111) includes a first housing (111a), in which a temperature sensing element (14) and potting compound (16) are disposed. The first end of the pin (12) is located inside the first housing (111a) and is electrically connected to the temperature sensing element (14). The potting compound (16) seals and covers the first end of the pin (12) and the temperature sensing element (14). The second end of the pin (12) is exposed at one end of the first housing (111a) away from the second main body (112) along the first direction. The second main body (112) and the first housing (111a) are heat exchanged, and the first housing (111a) and the temperature sensing element (14) are heat exchanged.

16. The temperature sensor according to claim 2, characterized in that, The first main body (111) includes a first housing (111a), and the second main body (112) includes a second housing (112c). The first housing (111a) and the second housing (112c) are sealed together to form a cavity (15). A temperature sensing element (14) and potting compound (16) are disposed in the cavity (15). The first end of the pin (12) is located in the cavity (15) and is electrically connected to the temperature sensing element (14). The potting compound (16) seals and covers the first end of the pin (12) and the temperature sensing element (14). The second end of the pin (12) is exposed at the end of the first housing (111a) away from the second housing (112c) along the first direction. The second housing (112c) and the temperature sensing element (14) are heat exchanged. The elastic component (13) includes a second elastic element (132), which is at least a portion of the second housing (112c) in the first direction.

17. The temperature sensor according to any one of claims 1-16, characterized in that, The pin (12) includes an elastic pin (12a) capable of deforming in a first direction, the elastic pin (12a) being a bent structure, and the elastic component (13) including the elastic pin (12a).

18. A circuit board assembly, characterized in that, include: The circuit board (2), the device under test (3), and the temperature sensor (1) as described in any one of claims 1-17, wherein the acquisition end (1121) of the temperature sensor (1) and the device under test (3) are in contact for heat exchange, and the pin (12) of the temperature sensor (1) is electrically connected to the circuit board (2).

19. The circuit board assembly according to claim 18, characterized in that, The test piece (3) is provided with a third mounting groove (32), and the acquisition end (1121) is disposed in the third mounting groove (32); or, the test piece (3) has a mounting surface (31) with a planar structure, and the acquisition end (1121) is disposed on the mounting surface (31). And / or, the acquisition end (1121) is bonded to the test piece (3) for heat exchange via thermally conductive adhesive.

20. The circuit board assembly according to claim 19, characterized in that, The acquisition end (1121) and the third mounting slot (32) are engaged in a second direction, which is perpendicular to the first direction; or, the acquisition end (1121) is fixed in the third mounting slot (32).

21. An electrical device, characterized in that, include: The circuit board assembly as described in any one of claims 18-20.

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