A semiconductor device, a microwave remote plasma reaction chamber and apparatus

Abstract

This invention discloses a semiconductor device, a microwave remote plasma reaction chamber, and an apparatus. The microwave remote plasma reaction chamber includes: a reaction chamber with an inlet and an outlet; a liquid-cooled protective cover located on the outer wall of the reaction chamber, the interior of which has multiple series-connected liquid-cooling channels, and an inlet and outlet communicating with the liquid-cooling channels; a microwave discharge assembly located outside the reaction chamber for receiving microwave energy to ionize the process gas within the reaction chamber; and a first coaxial interface, the output of which is electrically connected to the microwave discharge assembly, and the input of which is electrically connected to an external microwave generating module via a coaxial cable. This invention provides a semiconductor device, a microwave remote plasma reaction chamber, and an apparatus that are easy to install, have low manufacturing costs, and can improve the cooling effect of the reaction chamber.

Description

Technical Field

[0001] This invention relates to the field of plasma technology, and in particular to a semiconductor device, a microwave remote plasma reaction chamber and apparatus. Background Technology

[0002] Waveguide-type microwave remote plasma devices are a technology that uses structures such as rectangular waveguides to transmit microwave energy and generate plasma far from the processing area. Because they can effectively isolate ion bombardment and avoid electrode contamination, they are widely used in semiconductor cleaning, thin film deposition, and other applications.

[0003] Existing waveguide-type microwave remote plasma devices include a microwave generating module, a waveguide impedance matching device, and a reaction chamber. The reaction chamber is also equipped with a waveguide structure and a mechanical connection between the waveguide impedance matching device and the reaction chamber. The connection method is complex and the manufacturing cost is high.

[0004] Furthermore, if the temperature of the reaction chamber becomes too high during plasma generation and is not cooled in time, it will affect the plasma generation efficiency. Summary of the Invention

[0005] This invention provides a semiconductor device, a microwave remote plasma reaction chamber and apparatus, which is easy to install and has low manufacturing cost, and can also improve the cooling effect of the reaction chamber.

[0006] According to one aspect of the present invention, a microwave remote plasma reaction chamber is provided, the microwave remote plasma reaction chamber comprising:

[0007] The reaction chamber includes an air inlet and an air outlet;

[0008] A liquid-cooled protective cover is located on the outer wall of the reaction chamber. The liquid-cooled protective cover has multiple series-connected liquid-cooling channels inside. The liquid-cooled protective cover has an inlet and an outlet that communicate with the liquid-cooling channels.

[0009] A microwave discharge assembly, located outside the reaction chamber, is used to receive microwave energy to ionize the process gas inside the reaction chamber.

[0010] The first coaxial interface has its output terminal electrically connected to the microwave discharge assembly, and its input terminal electrically connected to an external microwave generator module via a coaxial cable.

[0011] Optionally, the liquid-cooled protective shield includes:

[0012] The inner wall contour of the protective cover body is adapted to the shape of the outer wall of the reaction chamber;

[0013] Multiple liquid cooling channels formed inside the protective cover body;

[0014] The protective cover body has multiple first grooves and multiple second grooves on its outer surface. The first grooves are spaced apart, and the second grooves are spaced apart. The first grooves and the second grooves are spaced apart by a set distance in the axial direction of the protective cover body. The first grooves and the second grooves are directly connected to the two liquid cooling channels, and adjacent first grooves and second grooves are directly connected through one of the liquid cooling channels.

[0015] The liquid cooling channel closest to the liquid inlet among the plurality of liquid cooling channels is connected to the liquid inlet, and the liquid cooling channel closest to the liquid outlet among the plurality of liquid cooling channels is connected to the liquid outlet.

[0016] Optionally, each of the first grooves is located on the side wall near the top of the protective cover body; each of the second grooves is located on the bottom of the protective cover body;

[0017] The liquid-cooled protective cover also includes a first cover plate with the same number of first grooves and a second cover plate with the same number of second grooves;

[0018] The first cover plate is used to seal the first groove;

[0019] The second cover plate is used to seal the second groove.

[0020] Optionally, the reaction chamber is in the shape of a hollow cylindrical barrel;

[0021] The microwave discharge assembly is located on the outside of the bottom of the hollow cylindrical barrel;

[0022] The microwave discharge assembly includes a fixed probe and a microwave resonant probe threadedly connected to the fixed probe.

[0023] The fixed probe is electrically connected to the first coaxial interface;

[0024] The length of the vertical projection of the microwave resonant probe onto the bottom of the hollow cylindrical barrel is mechanically adjustable.

[0025] Optionally, the microwave remote plasma reaction chamber provided in this embodiment also includes a ceramic cover;

[0026] The ceramic cover is located on the outside of the bottom of the hollow cylindrical barrel;

[0027] The microwave resonant probe is located inside the ceramic cover.

[0028] Optionally, the microwave remote plasma reaction chamber provided in this embodiment also includes a metal base;

[0029] The first coaxial interface is located on the side of the metal base;

[0030] The metal base is connected to the liquid-cooled protective cover;

[0031] The ceramic cover is located inside the metal base.

[0032] Optionally, the microwave remote plasma reaction chamber provided in this embodiment also includes an insulating pad;

[0033] The insulating pad is located between the ceramic cover and the reaction chamber.

[0034] Optionally, the diameter of the air inlet is smaller than the diameter of the air outlet;

[0035] The diameter of the air outlet is equal to the inner diameter of the reaction chamber.

[0036] According to another aspect of the present invention, a microwave remote plasma device is provided, the microwave remote plasma device comprising a microwave generating module, a coaxial cable, and a microwave remote plasma reaction chamber provided in any embodiment of the present invention;

[0037] The microwave generating module includes a second coaxial interface;

[0038] The input end of the coaxial cable is electrically connected to the second coaxial interface, and the output end of the coaxial cable is electrically connected to the first coaxial interface.

[0039] According to another aspect of the present invention, a semiconductor device is provided, which includes the microwave remote plasma device provided in any embodiment of the present invention.

[0040] This invention provides a microwave remote plasma reaction chamber. The reaction chamber is externally protected by a liquid-cooled protective cover, and the cover contains series-connected liquid-cooling channels. These channels allow cooling medium to flow through each channel, improving the cooling effect of the protective cover on the reaction chamber. A microwave discharge assembly within the chamber is electrically connected to a first coaxial interface, which is in turn electrically connected to a microwave generator module via a coaxial cable. This embodiment uses a coaxial cable connection to receive microwave energy instead of a waveguide structure, simplifying installation and reducing manufacturing costs. Furthermore, by placing the microwave discharge assembly on the outside of the reaction chamber, this invention prevents corrosion from process gases and plasma, and also avoids material detachment from the assembly from contaminating the plasma. In summary, the microwave remote plasma reaction chamber provided by this invention is easy to install, has low manufacturing costs, and improves the cooling effect of the reaction chamber.

[0041] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the structure of a microwave remote plasma reaction chamber according to an embodiment of the present invention;

[0044] Figure 2 This is a schematic cross-sectional view of a microwave remote plasma reaction chamber according to an embodiment of the present invention.

[0045] Figure 3 This is a schematic diagram of the structure of a reaction chamber according to an embodiment of the present invention;

[0046] Figure 4 This is a schematic diagram of the structure of a liquid-cooled protective cover according to an embodiment of the present invention;

[0047] Figure 5 It is along Figure 1 A schematic diagram of a liquid-cooled protective cover obtained by cutting with section lines A1A2 in the figure;

[0048] Figure 6 It is along Figure 1 A schematic diagram of a liquid-cooled protective cover obtained by cutting through section line B1B2 in the diagram;

[0049] Figure 7 This is a schematic diagram of a structure obtained by cutting along the axial direction of the liquid-cooled protective cover;

[0050] Figure 8 This is a schematic diagram of the structure of another microwave remote plasma reaction chamber provided in an embodiment of the present invention;

[0051] Figure 9 This is a schematic diagram of the structure of another microwave remote plasma reaction chamber provided in an embodiment of the present invention;

[0052] Figure 10 This is a schematic diagram of the structure of a microwave remote plasma device according to an embodiment of the present invention. Detailed Implementation

[0053] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0054] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0055] Figure 1 This is a schematic diagram of the structure of a microwave remote plasma reaction chamber according to an embodiment of the present invention. Figure 2 This is a schematic cross-sectional view of a microwave remote plasma reaction chamber according to an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of a reaction chamber according to an embodiment of the present invention. Figure 4 This is a schematic diagram of the structure of a liquid-cooled protective cover according to an embodiment of the present invention. Figure 5 It is along Figure 1 A schematic diagram of a liquid-cooled protective shield obtained by cutting with section lines A1A2 in the figure, for reference. Figures 1-5 The microwave remote plasma reaction chamber provided in this embodiment includes: a reaction chamber 110, a liquid-cooled protective cover 120, a microwave discharge assembly 130, and a first coaxial interface 140; the microwave discharge assembly 130 is located outside the reaction chamber 110 and is used to receive microwave energy to ionize the process gas inside the reaction chamber 110; the output end of the first coaxial interface 140 is electrically connected to the microwave discharge assembly 130, and the input end of the first coaxial interface 140 is electrically connected to an external microwave generating module via a coaxial cable; the reaction chamber 110 includes an inlet 111 and an outlet 112 (see reference). Figure 3 The liquid-cooled protective cover 120 is located on the outer wall of the reaction chamber 110, and the interior of the liquid-cooled protective cover 120 is provided with multiple series-connected liquid-cooled channels 121 (see reference). Figure 5The liquid cooling protective cover 120 is provided with an inlet 123 and an outlet 124 that are connected to the liquid cooling channel 121.

[0056] Specifically, there is one outlet 112. There can be one or more inlets 111; for example, there can be two, three, four, or five inlets 111. Having multiple inlets 111 can improve the uniformity of process gas distribution within the reaction chamber 110. The reaction chamber 110 can be made of ceramic or quartz.

[0057] Process gas enters the reaction chamber 110 through inlet 111, and the generated plasma is transmitted to the external channel through outlet 112. The reaction chamber 110 can contain process gas, which can be at least one of the following: argon, helium, oxygen, nitrogen, hydrogen, CF4, SF6, NF3, ammonia, methane, acetylene, carbon monoxide, carbon dioxide, water vapor, chlorine, fluorine, xenon, krypton, etc. In this embodiment, the microwave discharge assembly 130 is located outside the reaction chamber 110, which prevents the process gas and plasma inside the reaction chamber 110 from corroding the microwave discharge assembly 130, thereby improving its service life.

[0058] The microwave energy output from the microwave generating module is transmitted via a coaxial cable to the first coaxial interface 140, and then through the first coaxial interface 140 to the microwave discharge assembly 130. The microwave discharge assembly 130 releases microwave energy to ionize the process gas within the reaction chamber 110, thereby generating plasma. The microwave discharge assembly 130 can be made of metal and can be cylindrical in shape. The first coaxial interface 140 can be connected to the coaxial cable via a threaded connection. Therefore, the microwave remote plasma reaction chamber provided in this embodiment is electrically connected to the microwave generating module via a coaxial connection, rather than through a waveguide structure, which reduces manufacturing costs and improves installation efficiency.

[0059] The liquid cooling protective cover 120 also includes an air inlet 127 (see reference). Figure 5 The air inlet 127 is connected to the air inlet 111 in the reaction chamber 110. The liquid inlet 123, liquid outlet 124, and air inlet 127 are all located on the side wall of the liquid-cooled protective cover 120. The liquid inlet 123 and liquid outlet 124 are arranged adjacent to each other, and the air inlet 127 is located below the line connecting the liquid inlet 123 and liquid outlet 124. (Continue to refer to...) Figure 1The microwave remote plasma reaction chamber provided in this embodiment further includes a liquid inlet connection unit 151, a liquid outlet connection unit 152, and a gas inlet connection unit 153. The liquid inlet connection unit 151 and the liquid outlet connection unit 152 are used to connect to an external liquid supply device, and the gas inlet connection unit 153 is used to connect to an external gas supply device. The liquid inlet 123 is connected to the liquid inlet connection unit 151, the liquid outlet 124 is connected to the liquid outlet connection unit 152, and the gas inlet 127 is connected to the gas inlet connection unit 153.

[0060] The liquid-cooled protective cover 120 can be made of metal. It serves to protect the reaction chamber 110 from impacts by external hard objects and contamination by external substances, and also cools the reaction chamber 110, mitigating the problem of reduced plasma generation efficiency due to excessively high temperatures. The liquid-cooled protective cover 120 has multiple liquid-cooling channels 121 internally, which are connected in series. (See reference...) Figure 4 The cooling medium enters through the inlet 123 and is then unidirectionally output along the liquid cooling channel 121. Figure 4 The dashed line with arrows indicates the flow direction of the cooling medium in the liquid-cooled protective cover 120. The cooling medium circulates unidirectionally in the liquid-cooled channel 121. Compared to parallel liquid-cooled channels, the series-connected liquid-cooled channels 121 in this embodiment avoid the problem of cooling medium remaining in other liquid-cooled channels and causing stagnation. Therefore, the series-connected liquid-cooled channels 121 in this embodiment can improve the cooling effect of the reaction chamber 110, thereby improving the plasma generation efficiency. The cooling medium can be water, oil, or a gas with cooling function.

[0061] This embodiment provides a microwave remote plasma reaction chamber. The reaction chamber is externally equipped with a liquid-cooled protective cover, and the cover contains series-connected liquid-cooling channels. These channels allow the cooling medium to flow through each channel, improving the cooling effect of the protective cover on the reaction chamber. The microwave discharge assembly in the reaction chamber is electrically connected to a first coaxial interface, which is in turn electrically connected to a microwave generating module via a coaxial cable. This embodiment receives microwave energy via a coaxial cable connection instead of a waveguide structure, simplifying installation and reducing manufacturing costs. Furthermore, by placing the microwave discharge assembly on the outside of the reaction chamber, this embodiment prevents corrosion from process gases and plasma, and also avoids material detachment from the assembly from contaminating the plasma. In summary, the microwave remote plasma reaction chamber provided in this embodiment is easy to install, has low manufacturing costs, and improves the cooling effect of the reaction chamber.

[0062] Optional, continue to refer to Figure 2 and Figure 3The reaction chamber 110 is shaped like a hollow cylindrical barrel; the microwave discharge assembly 130 is located on the outer side of the bottom of the hollow cylindrical barrel; the microwave discharge assembly 130 includes a fixed probe 131 and a microwave resonant probe 132 threadedly connected to the fixed probe 131; the fixed probe 131 is electrically connected to the first coaxial interface 140; the length of the vertical projection of the microwave resonant probe 132 on the bottom of the hollow cylindrical barrel is mechanically adjustable.

[0063] Specifically, the reaction chamber 110 can be understood as a cup-shaped structure. In this embodiment, the microwave discharge assembly 130 is located at the bottom of the hollow cylindrical barrel, rather than on the side wall, which can improve the uniformity of process gas ionization within the reaction chamber 110. The relative position of the fixed probe 131 and the first coaxial interface 140 can remain unchanged. In this embodiment, the microwave resonant probe 132 is connected to the fixed probe 131 by a thread, and the length of the vertical projection of the microwave resonant probe 132 on the bottom of the hollow cylindrical barrel can be adjusted by rotation.

[0064] It should be noted that during the rotation of the thread, the microwave resonant probe 132 and the fixed probe 131 remain connected, but a portion of the thread will be exposed.

[0065] When the length of the vertical projection of the microwave resonant probe 132 on the bottom of the hollow cylindrical barrel is different, the impedance of the microwave discharge component 130 will be different. Therefore, the impedance of the microwave generating module can be adjusted to match the impedance of the microwave remote plasma reaction chamber by adjusting the vertical projection of the microwave resonant probe 132 on the bottom of the hollow cylindrical barrel, thereby further improving the utilization rate of microwave energy.

[0066] Optional, Figure 6 It is along Figure 1 A schematic diagram of a liquid-cooled protective shield obtained by cutting with section lines B1B2. Figure 7 This is a schematic diagram of a structure obtained by cutting along the axial direction of the liquid-cooled protective cover. (Refer to...) Figure 4 , Figure 6 and Figure 7The liquid-cooled protective cover 120 provided in this embodiment includes: a protective cover body 122, multiple liquid-cooled channels 121 formed inside the protective cover body 122, and multiple first grooves 125 and multiple second grooves 126 located on the outer surface of the protective cover body 122; the inner wall contour of the protective cover body 122 is adapted to the outer wall shape of the reaction chamber 110; each first groove 125 is spaced apart, each second groove 126 is spaced apart, and the first grooves 125 and second grooves 126 are spaced apart by a set distance in the axial direction of the protective cover body 122; each first groove 125 and second groove 126 is directly connected to two liquid-cooled channels 121, and adjacent first grooves 125 and second grooves 126 are directly connected through a liquid-cooled channel 121; the liquid-cooled channel 121 closest to the liquid inlet 123 among the multiple liquid-cooled channels 121 is connected to the liquid inlet 123, and the liquid-cooled channel 121 closest to the liquid outlet 124 among the multiple liquid-cooled channels 121 is connected to the liquid outlet 124.

[0067] Specifically, the distance between the first groove 125 and the second groove 126 in the axial direction of the protective cover body 122 is the length of the liquid cooling channel 121 (see reference). Figure 7 The set distance is greater than 0 and less than or equal to the total height of the protective cover body 122. The cross-section of the liquid cooling channel 121 can be circular, and the liquid cooling channel 121 can be understood as a hollow cylindrical through hole distributed in the protective cover body 122.

[0068] The center line connecting all the first grooves 125 can be an arc, and the center line connecting all the second grooves 126 can also be an arc. The vertical projection of all the first grooves 125 onto the protective cover body 122 can partially or fully surround the vertical projection of the reaction chamber 110 onto the protective cover body 122, and the vertical projection of all the second grooves 126 onto the protective cover body 122 can also partially or fully surround the vertical projection of the reaction chamber 110 onto the protective cover body 122. The number of first grooves 125 can be four, and the number of second grooves 126 can be greater than the number of first grooves 125.

[0069] The protective cover body 122 can be a hollow cylinder, and the reaction chamber 110 can be a cylinder. The inner wall contour of the protective cover body 122 is designed to match the outer wall shape of the reaction chamber 110, allowing the inner wall of the protective cover body 122 to directly contact the outer wall of the reaction chamber 110. For example, the protective cover body 122 can completely surround the outer wall of the reaction chamber 110, thus improving the cooling effect of the reaction chamber 110.

[0070] The vertical projection of the first groove 125 on the bottom of the protective cover body 122 and the vertical projection of the second groove 126 on the bottom of the protective cover body 122 are staggered and overlap, and the overlapping area can be the area of ​​the vertical projection of a liquid cooling channel 121 on the bottom of the protective cover body 122.

[0071] The cooling medium can flow as follows: the cooling medium enters through the inlet 123, then flows through a liquid cooling channel 121 into the second groove 126. Since the second groove 126 is connected to both liquid cooling channels 121, and the first groove 125 is connected to the second groove 126 through a liquid cooling channel 121, the cooling medium entering the second groove 126 flows through another liquid cooling channel 121 to the first groove 125, then from the first groove 125 to another liquid cooling channel 121 connected to the first groove 125, and finally to the second groove 126, thus completing the flow. The connection method between the first groove 125, the second groove 126, and the liquid cooling channel 121 in this embodiment allows the cooling medium to flow in a serpentine shape inside the protective cover body 122, further improving the cooling area and cooling effect of the reaction chamber 110.

[0072] It should be noted that, Figure 1 The shapes of section lines A1A2 and B1B2 can be circular. Figure 5 The cross-sectional view in the image has the structure above section line A1A2 removed. Figure 6 The cross-sectional view in the image removes the structure above section line B1B2.

[0073] Optional, continue to refer to Figure 1 , Figure 4 , Figure 6 and Figure 7 Each first groove 125 is located on the side wall near the top of the protective cover body 122; each second groove 126 is located on the bottom of the protective cover body 122; the liquid-cooled protective cover 120 also includes a first cover plate 161 equal in number to the first grooves 125 and a second cover plate 162 equal in number to the second grooves 126; the first cover plate 161 is used to seal the first grooves 125; the second cover plate 162 is used to seal the second grooves 126.

[0074] Specifically, the dimensions of the first cover plate 161 are adapted to the dimensions of the first groove 125, and the dimensions of the second cover plate 162 are adapted to the dimensions of the second groove 126. The arrangement of the first cover plate 161 and the second cover plate 162 can prevent leakage of the cooling medium when it flows through the first groove 125 and the second groove 126.

[0075] By setting the first groove 125 on the side wall near the top of the protective cover body 122 and setting the second groove 126 on the bottom of the protective cover body 122, the distance between the first groove 125 and the second groove 126 can be increased, that is, the length of the liquid cooling channel 121 can be increased, thereby further improving the cooling area and cooling effect of the reaction chamber 110.

[0076] The second groove 126 is located at the bottom of the protective cover body 122, which facilitates the fabrication of the liquid cooling channel 121. For example, the first groove 125 and the second groove 126 can be chiseled out on the outer surface of the protective cover body 122 first, and then the liquid cooling channel 121 communicating with the second groove 126 can be chiseled out starting from the second groove 126. The liquid cooling channel 121 is a through hole inside the protective cover body 122. In order to further improve the service life of the liquid cooling protective cover 120, nickel can be plated on the inner wall of the liquid cooling channel 121.

[0077] Optional, Figure 8 This is a schematic diagram of the structure of another microwave remote plasma reaction chamber provided according to an embodiment of the present invention, with reference to... Figure 8 The microwave remote plasma reaction chamber provided in this embodiment also includes a ceramic cover 180; the ceramic cover 180 is located on the outside of the bottom of the hollow cylindrical barrel; at least part of the microwave resonant probe 132 is located inside the ceramic cover 180.

[0078] Specifically, the ceramic cover 180 can be a hollow cylinder, and its diameter can be the same as that of the reaction chamber 110. By placing at least a portion of the microwave resonant probe 132 within the ceramic cover 180, the impedance of the microwave generating module can be better matched to the impedance of the microwave remote plasma reaction chamber, further improving the utilization rate of microwave energy.

[0079] Optional, Figure 9 This is a schematic diagram of the structure of another microwave remote plasma reaction chamber provided according to an embodiment of the present invention, with reference to... Figure 9 The microwave remote plasma reaction chamber provided in this embodiment also includes a metal base 190; a first coaxial interface 140 is located on the side of the metal base 190; the metal base 190 is connected to the liquid-cooled protective cover 120; and a ceramic cover 180 is located inside the metal base 190.

[0080] Specifically, the metal base 190 can be detachably connected to the liquid-cooled protective cover 120. The metal base 190 facilitates the installation of the microwave remote plasma reaction chamber provided in this embodiment.

[0081] Optional, continue to refer to Figure 1 and Figure 2 The microwave remote plasma reaction chamber provided in this embodiment also includes an insulating pad 170; the insulating pad 170 is located between the ceramic cover and the reaction chamber 110.

[0082] Specifically, the insulating pad 170 is a solid cylinder, and its diameter can be the same as that of the reaction chamber 110. The insulating pad 170 improves the impedance matching between the microwave generating module and the microwave remote plasma reaction chamber, thereby increasing the efficiency of microwave energy utilization.

[0083] Optionally, the diameter of the air inlet is smaller than the diameter of the air outlet; the diameter of the air outlet is equal to the inner diameter of the reaction chamber.

[0084] Specifically, both the inlet and outlet can be circular, with the inlet being a pinhole. Setting the outlet diameter to be equal to the inner diameter of the reaction chamber can improve the plasma output efficiency.

[0085] Figure 10 This is a schematic diagram of the structure of a microwave remote plasma device according to an embodiment of the present invention, with reference to... Figure 10 The microwave remote plasma device provided in this embodiment includes a microwave generating module 200, a coaxial line 300, and a microwave remote plasma reaction chamber 100 provided in any embodiment of the present invention; the microwave generating module 200 includes a second coaxial interface; the input end of the coaxial line 300 is electrically connected to the second coaxial interface, and the output end of the coaxial line 300 is electrically connected to the first coaxial interface.

[0086] Specifically, the microwave generator module 200 is either a solid-state microwave source or a magnetron; both can generate microwaves. Solid-state microwave sources offer advantages such as long lifespan and stable operating frequency. Magnetrons offer advantages such as low cost and high output power. The output power range of the microwave generator module 200 is 0W to 1500W. The output power of the microwave generator module 200 can be 500W, 600W, 700W, 800W, or 900W, etc.

[0087] This embodiment provides a microwave remote plasma device. The microwave generating module, coaxial cable, and microwave remote plasma reaction chamber are sequentially electrically connected, resulting in a simple structure and convenient installation, improving installation efficiency and reducing manufacturing costs. Furthermore, an impedance matching module is unnecessary between the microwave generating module and the microwave remote plasma reaction chamber; impedance matching is achieved by adjusting the output power of the microwave generating module, further reducing costs. In summary, the microwave remote plasma device provided in this embodiment is simple in structure, easy to use, and improves installation efficiency while reducing manufacturing costs.

[0088] This embodiment also provides a semiconductor device, which includes the microwave remote plasma device provided in any embodiment of the present invention.

[0089] Specifically, the semiconductor device provided in this embodiment includes a plasma etching device or a plasma coating device. Since the semiconductor device provided in this embodiment includes the microwave remote plasma device provided in any embodiment of the present invention, the semiconductor device provided in this embodiment also includes the technical features and corresponding beneficial effects of the microwave remote plasma device.

[0090] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A microwave remote plasma reaction chamber, characterized in that, include: The reaction chamber includes an air inlet and an air outlet; A liquid-cooled protective cover is located on the outer wall of the reaction chamber. The liquid-cooled protective cover has multiple series-connected liquid-cooling channels inside. The liquid-cooled protective cover has an inlet and an outlet that communicate with the liquid-cooling channels. A microwave discharge assembly, located outside the reaction chamber, is used to receive microwave energy to ionize the process gas inside the reaction chamber. The first coaxial interface has its output terminal electrically connected to the microwave discharge assembly, and its input terminal electrically connected to an external microwave generator module via a coaxial cable. The reaction chamber is shaped like a hollow cylindrical barrel; The microwave discharge assembly is located on the outside of the bottom of the hollow cylindrical barrel; The microwave discharge assembly includes a fixed probe and a microwave resonant probe threadedly connected to the fixed probe. The fixed probe is electrically connected to the first coaxial interface; The length of the vertical projection of the microwave resonant probe onto the bottom of the hollow cylindrical barrel is mechanically adjustable.

2. The microwave remote plasma reaction chamber according to claim 1, characterized in that, The liquid-cooled protective shield includes: The inner wall contour of the protective cover body is adapted to the shape of the outer wall of the reaction chamber; Multiple liquid cooling channels formed inside the protective cover body; The protective cover body has multiple first grooves and multiple second grooves on its outer surface. The first grooves are spaced apart, and the second grooves are spaced apart. The first grooves and the second grooves are spaced apart by a set distance in the axial direction of the protective cover body. The first grooves and the second grooves are directly connected to the two liquid cooling channels, and adjacent first grooves and second grooves are directly connected through one of the liquid cooling channels. The liquid cooling channel closest to the liquid inlet among the plurality of liquid cooling channels is connected to the liquid inlet, and the liquid cooling channel closest to the liquid outlet among the plurality of liquid cooling channels is connected to the liquid outlet.

3. The microwave remote plasma reaction chamber according to claim 2, characterized in that, Each of the first grooves is located on the side wall near the top of the protective cover body; each of the second grooves is located on the bottom of the protective cover body; The liquid-cooled protective cover also includes a first cover plate with the same number of first grooves and a second cover plate with the same number of second grooves; The first cover plate is used to seal the first groove; The second cover plate is used to seal the second groove.

4. The microwave remote plasma reaction chamber according to claim 1, characterized in that, It also includes a ceramic cover; The ceramic cover is located on the outside of the bottom of the hollow cylindrical barrel; The microwave resonant probe is located inside the ceramic cover.

5. The microwave remote plasma reaction chamber according to claim 4, characterized in that, It also includes a metal base; The first coaxial interface is located on the side of the metal base; The metal base is connected to the liquid-cooled protective cover; The ceramic cover is located inside the metal base.

6. The microwave remote plasma reaction chamber according to claim 4, characterized in that, It also includes insulating pads; The insulating pad is located between the ceramic cover and the reaction chamber.

7. The microwave remote plasma reaction chamber according to claim 1, characterized in that, The diameter of the air inlet is smaller than the diameter of the air outlet; The diameter of the air outlet is equal to the inner diameter of the reaction chamber.

8. A microwave remote plasma device, characterized in that, Includes a microwave generating module, a coaxial cable, and a microwave remote plasma reaction chamber as described in any one of claims 1-7; The microwave generating module includes a second coaxial interface; The input end of the coaxial cable is electrically connected to the second coaxial interface, and the output end of the coaxial cable is electrically connected to the first coaxial interface.

9. A semiconductor device, characterized in that, Includes the microwave remote plasma device as described in claim 8.

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